Abstract: A semiconductor device includes a support body, a first substrate provided on a surface at one side of the support body, a second substrate provided on a surface at the other side of the support body, and a semiconductor chip provided on the first substrate exposed to an opening part piercing the support body and the second substrate. The first substrate includes a first dielectric layer and a wiring layer, a plurality of first electrodes connected to the semiconductor chip which first electrodes are provided on a first surface of the first substrate exposed to an inside of the opening part, and the second substrate includes a second dielectric layer made of a material substantially the same as the first dielectric layer.

Abstract: An apparatus includes a first component and a second component. The apparatus includes one or more cavities within one or more of the first and the second components. The apparatus includes one or more channels within one or more of the first and the second components. The channels are fluidically interconnectable with the cavities. Upon pressing the first component against the second component to bond the first component to the second component, gas trapped between the first and the second components is forced into the cavities via the channels.

Abstract: A heat sink and method for fabricating the same are disclosed. The heat sink includes a lower substrate having a concave portion, a supporting column formed on the concave portion of the lower substrate, and an upper substrate opposed to the lower substrate and tightly fixed to the lower substrate so as to form a cooled liquid receiving space therebetween, wherein the upper substrate has a concave portion formed at a position corresponding to the supporting column of the lower substrate so as to engage with the supporting column.

Abstract: A memory module which includes a memory board having two major surfaces, one of the major surfaces with a plurality of chips thereon, wherein at least one of the chips operates at a higher power than at least one other of the chips; and a thermal management system in thermal contact with one or more of the chips which operate at a higher power than at least one other of the chips, wherein the thermal management system spreads heat generated by the one or more of the chips which operate at a higher power than at least one other of the chips with which the thermal management system is in contact.

Abstract: The specification discloses an apparatus comprising an alignment plate having a plurality of depressions therein, each depression being sized to receive a packaging cap therein and to prevent its movement, and a force applicator to apply a force to press the packaging caps and a substrate firmly together. Also disclosed is a process comprising inserting a plurality of packaging caps in a plurality of depressions on an alignment plate, each depression being sized to receive a packaging cap and prevent its movement, aligning the plurality of packaging caps with individual devices on a substrate, placing the substrate in contact with the packaging caps, and applying a force to press the caps against the substrate. Other embodiments are disclosed and claimed.

Abstract: A chip package includes a first wiring layer, chips, a second wiring layer, dielectric layers, first conductive vias, and second conductive vias. The first wiring layer has contacts near a side of the first wiring layer. The chips are stacked over the first wiring layer. The second wiring layer is stacked over the first wiring layer. The dielectric layers are disposed between the first wiring layer, the chips, and the second wiring layer. The first conductive vias are inside at least one of the dielectric layer for electrically connecting the chip to the second wiring layer. The second conductive vias are inside at least one of the dielectric layers for electrically connecting the second wiring layer to the first wiring layer.

Abstract: There is provided a process for forming bumps wherein a plurality of fine bumps are uniformly formed with high productivity. In this process, a resin (13) comprising solder powder and a convection additive (12) is supplied onto a substrate (10) having a plurality of electrodes (11) thereon. And subsequently the substrate (10) is heated to a temperature that enables the solder powder to melt while keeping a flat plate (14) in contact with a surface of the supplied resin (13). During this heating step, the molten solder powder is allowed to self-assemble onto the electrodes (11) so that a plurality of solder balls resulting from the grown molten solder powder are concurrently formed on the electrodes (11) in self-alignment manner. Finally, by moving the flat plate (14) away from the surface of the supplied resin (13), followed by removing such resin (13), there is provided the substrate (10) wherein the bumps (16) are formed on the plurality of the electrodes.

Abstract: A semiconductor device includes a semiconductor chip, wiring that is included in the semiconductor chip and has a coupling part between parts with different widths, a pad being formed above the wiring and in a position overlapping the coupling part, a bump being formed on the pad, a buffer layer being formed in a position between the coupling part and the pad so as to cover the entire coupling part, and inorganic insulating layers being formed between the wiring and the buffer layer and between the buffer layer and the pad, respectively.

Abstract: The present inventors have observed that in some applications of reactive composite joining there is escape of a portion of the molten joining material through the edges of the joining regions. Such escape is not only a waste of expensive material (e.g. gold or indium) but also a reduction from the optimal thickness of the joining regions. In some applications, such escape also presents risk of short circuits or even fire. In this invention, two approaches are taken toward preventing damage to surroundings by the escape of molten joining material. First, escape may be prevented by trapping or containing the molten material near the joint, using barriers, dams, or similar means. Second, escape may be reduced by adjusting parameters within the joint, such as solder composition, joining pressure, or RCM thickness.

Abstract: A packaged semiconductor chip comprising an integrated circuit chip including a low-k dielectric layer and a chip substrate, wherein an edge of the integrated circuit chip has a first edge portion and a second edge portion. At least part of the first edge portion being across a same level as the low-k dielectric layer, and the first edge portion having been laser ablated to have a series of rounded recesses formed therein. The second edge portion being across a same level as at least part of the chip substrate, and the second edge portion having a different surface texture than that of the first edge portion. The packaged semiconductor chip also comprises a packaging substrate having the integrated circuit chip attached and a plurality of solder bumps electrically connecting between the packaging substrate and the integrated circuit chip.

Abstract: A method for producing a semiconductor-device having an electrical interconnect. The method produces having an improved barrier layer between the interconnect conductor and the dielectric material in which the interconnect recess is formed. A dielectric layer is formed on top of a wafer substrate having at least one contact region. An interconnect for servicing the contact region is fabricated by forming an interconnect recess and then depositing a primary barrier layer of tantalum nitride and subjecting it to a re-sputtering operation. A film layer of tantalum is then deposited and re-sputtered. Following this operation, a seed layer is formed, and then a conductor is used to fill the interconnect recess. Planerizing the surface of the wafer so that further fabrication may be performed may complete the process.

Abstract: A portion of a conductive layer (310, 910) provides a capacitor electrode (310.0, 910.0). Dielectric trenches (410, 414, 510) are formed in the conductive layer to insulate the capacitor electrode from those portions of the conductive layer which are used for conductive paths passing through the electrode but insulated from the electrode. Capacitor dielectric (320) can be formed by anodizing tantalum while a nickel layer (314) protects an underlying copper (310) from the anodizing solution. This protection allows the tantalum layer to be made thin to obtain large capacitance. Chemical mechanical polishing of a layer (610) is made faster, and hence possibly less expensive, by first patterning the layer photolithographically to form, and/or increase in height, upward protrusions of this layer.

Abstract: A plurality of metal interconnects incorporating dielectric spacers and a method to form such dielectric spacers are described. In one embodiment, the dielectric spacers adjacent to neighboring metal interconnects are discontiguous from one another. In another embodiment, the dielectric spacers may provide a region upon which un-landed vias may effectively land.

Abstract: An integrated circuit structure having improved resistivity and a method for forming the same are provided. The integrated circuit structure includes a dielectric layer, an opening in the dielectric layer, an oxide-based barrier layer directly on sidewalls of the opening, and conductive materials filling the remaining portion of the opening.

Abstract: A multilayer electrode structure has a conductive layer including aluminum, an oxide layer formed on the conductive layer, and an oxygen diffusion barrier layer. The oxide layer includes zirconium oxide and/or titanium oxide. The oxygen diffusion barrier layer is formed at an interface between the conductive layer and the oxide layer by re-oxidizing the oxide layer. The oxygen diffusion barrier layer includes aluminum oxide.

Abstract: A multilayer interconnection structure of a semiconductor device includes a first guard ring extending continuously along a periphery of a substrate and a second guard ring extending continuously in the multilayer interconnection structure along the periphery so as to be encircled by the first guard ring and so as to encircle an interconnection pattern inside the multilayer interconnection structure, wherein the first and second guard rings are connected with each other mechanically and continuously by a bridging conductor pattern extending continuously in a band form along a region including the first and second guard rings when viewed in the direction perpendicular to the substrate.

Abstract: A cleaning process is performed on the surface of a nickel silicide film serving as an underlayer. Then, a Ti film is formed to have a film thickness of not less than 2 nm but less than 10 nm by CVD using a Ti compound gas. Then, the Ti film is nitrided. Then, a TiN film is formed on the Ti film thus nitrided, by CVD using a Ti compound gas and a gas containing N and H.

Abstract: Methods for forming blind wafer interconnects (BWIs) from the back side surface of a substrate structure to the underside of a bond pad on the opposing surface includes the formation of a blind hole from the back side surface, forming a passivating layer therein, removing passivation material from the blind hole bottom, depositing at least one conductive layer within the blind hole, and filling the blind hole with solder or other conductive material or a dielectric material.

Abstract: To prevent short-circuit due to contact of bonding wires each other and to make a semiconductor device compact. A semiconductor chip with a rectangular main surface may comprise: a first side composing the main surface; a second side opposed to the first side; a main electrode pad group composed of a plurality of main electrode pads, which plurality of main electrode pads is arranged on the main surface along the first side; a first electrode pad group composed of a plurality of first electrode pads, which plurality of first electrode pads is arranged between the first side and the main electrode pad group; a second electrode pad group composed of a plurality of second electrode pads, which plurality of second electrode pads is arranged on the main surface along the second side; a first interconnection connecting the main electrode pad with the first electrode pad; and a second interconnection connecting the main electrode pad with the second electrode pad.

Abstract: An electronic package. The electronic package includes an electronic component having a heat producing device, an attachment piece, and at least two attachment units. Each unit includes an attachment pillar having a mating surface, a solder layer formed on the mating surface, and an attachment pad located on the attachment piece. The pillar of each unit is attached to its unit attachment pad via its unit solder layer and is otherwise attached to the electronic component. One pillar at least partially covers the heat producing device. Prior to attachment of pillars to their associated unit pads, the unit solder layer of the pillar at least partially covering the heat producing device is patterned to cover less than its mating surface, and the pillar at least partially covering the heat producing device is thermally connected to the heat producing device and to its unit attachment pad via its unit solder layer.

Abstract: A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.

Abstract: A package structure including a first carrier, a second carrier, at least a first electronic component and at least a second electronic component is provided. The second carrier is electrically connected to the first carrier. The first electronic component is disposed on the first carrier and electrically connected to the first carrier. The second electronic component is disposed on the second carrier and electrically connected to the second carrier.

Abstract: A method is disclosed for increasing adsorption of gas into water which is gassed at least in a gassing chamber in the form of a gas/water mixture and after leaving the gassing chamber, is guided through at least one gassing device located downstream from the gassing chamber, in which the gas/water mixture is being thoroughly mixed. In a device of a gassing chamber (48) and at least one inline gassing device (26) for thoroughly mixing a gas/water mixture, gassed water is fed through the inline gassing device which is connected downstream to the gassing chamber (48) wherein the gas/water mixture is thoroughly mixed.

Abstract: A carburetor 9 for feeding separate lean and rich channels 12, 13 of an engine intake duct 14 comprises a body 20 having a mixing passage 22 with an air intake side 24 and an engine outlet side 26. A throttle shutter 16 is rotatable about an axis transverse the mixing passage, and a partition 10 is located within the mixing passage upstream of the throttle shutter. The downstream edge of the partition 10 is adjacent the throttle shutter axis 16A whereby in use of the carburetor the partition defines an extension of the lean and rich channels upstream of the throttle shutter, the partition thus providing substantial isolation between the lean and rich channels for all rotational positions of the throttle shutter. In a preferred embodiment a choke shutter 17 is located upstream of the throttle shutter and is rotatable about a further axis 17 A transverse the mixing passage, the upstream edge of the partition being adjacent to the axis of the choke shutter.

Abstract: A device for carbonating a liquid (L) in a container (10) with a pressurized gas (G) comprises a receiving flask (20) for the container (10) and a filling head (30) which has means (31) for adding gas into said liquid in the container (10). The receiving flask (20) and the filling head (30) are movable in relation to each other between an insertion position (I) and a carbonating position (C). In the insertion position (I) the filling head (30) is spaced from the receiving flask (20). In the carbonating position, the receiving flask (20) and the filling head (30) are in contact with each other such as to form a substantially closed cavity (19). An interlocking connection directly connects the receiving flask (20) to the filling head (30).

Abstract: A cavitation-like generating system includes a venturi tube, a pump for pumping water through the venturi tube, an air compressor for providing a compressed gas into the venturi tube to mix with water being pumped into the venturi tube, an accumulation tank for buffering the flow of air-water mixture coming out of the pump for output through a water outlet pipe, and a reduction valve for reducing the pressure of the output flow of air-water mixture through the water outlet pipe.

Abstract: An aeration device or diffuser is disclosed. The diffuser preferably includes a porous hose adapted to allow gas to escape therefrom, a rigid element disposed within the hose, the rigid element being constructed of material denser than water and a fitting suitable for attaching the hose to an air supply, the fitting disposed within the hose at one end of the hose. Methods of use of the diffuser and of assembling the diffuser are also disclosed.

Abstract: A personal humidifier includes a main body having a centrally apertured front wall and an open back. A rear cover closes the open back and a sponge-retaining cavity is formed by the main body and the rear cover. Ambient air enters into the cavity through air inlets formed in the rear cover and flows through a water-retaining sponge. A fan is mounted on an output shaft of a DC motor and pulls humidified and cooled air out of the cavity after the air has passed through the water-retaining sponge. Guide vanes direct the humidified and cooled air towards a user's face when the personal humidifier is attached to a neck strap and positioned in overlying relation to the user's chest.

Abstract: An external gas humidifier for fuel cell transfers recycled high-temperature waste heat produced by the fuel cell to a reactant gas, such as hydrogen or air, which is guided into the external gas humidifier. The heated reactant gas is treated in the external gas humidifier to effectively increase the moisture content of the reactant gas within a shortened time. When the humidified reactant gas enters into the fuel cell, it enables a polymeric membrane in the fuel cell to be well humidified to thereby enhance the power generation efficiency and service life of the fuel cell.

Abstract: A carbonic water production apparatus equipped with a carbonic acid gas dissolving apparatus 3 and a circulation pump 1 wherein water in a bath 11 is circulated by the circulation pump 1, and a carbonic acid gas is fed into the carbonic acid gas dissolving apparatus 3 to dissolve the carbonic acid gas in the water, and wherein the circulation pump 1 is a positive-displacement metering pump having a self-priming ability; a carbonic water production method using this apparatus; a carbonic water production method comprising an early step for producing a carbonic water and a concentration maintaining step for the carbonic water; a carbonic water production apparatus equipped with a control for controlling the feeding pressure of carbonic water gas so that give an intended concentration of carbonic acid gas; a carbonic water production apparatus which automatically discharges out a drain; and a carbonic water production apparatus combined with a portable foot bath.

Abstract: A steam humidifier provided by the present invention has a tank having a reservoir section and a cover removably and sealingly secured thereto. The tank contains water during a humidifying operation in which the humidifier humidifies an indoor environment. The cover has a heating element mounted thereon and extending therefrom into the reservoir section and a steam outlet assembly mounted thereon and extending therethrough into the tank. The heating element evaporates at least a portion of the water during the humidifying operation into steam output through the steam outlet assembly to humidify the indoor environment.

Abstract: This invention includes methods and systems for processing biomedical devices, such as ophthalmic lenses, formed with a prepolymer reactin mixture and packaged within a mold part used to fashion the device.

Abstract: Provided is an aerosol method, and accompanying apparatus, for preparing powdered products of a variety of materials involving the use of an ultrasonic aerosol generator (106) including a plurality of ultrasonic transducers (120) underlying and ultrasonically energizing a reservoir of liquid feed (102) which forms droplets of the aerosol. Carrier gas (104) is delivered to different portions of the reservoir by a plurality of gas delivery ports (136) delivering gas from a gas delivery system. The aerosol is pyrolyzed to form particles, which are then cooled and collected. The invention also provides powders made by the method and devices made using the powders.

Abstract: An imprint mask for defining a structure on a substrate is provided with a probe which generates a signal as a function of the displacement of the probe by a force with a lateral component. The imprint mask is aligned relative to a substrate with an alignment mark based upon an interaction of the probe and the alignment mark.

Abstract: The invention describes a method for production of a three-dimensional structured surface with haptically and/or optically detectable microstructures, in which the microstructures are fixed as a dataset, with the steps: a) preparation of at least a virtual or real elastic film; b) determination of the elongations and compressions produced in the elastic film in the shaping process of the structured surface; c) modification of the datasets so that the elongations and compressions are at least partially compensated; d) checking of an elastic film structured with the modified dataset for distortions in the microstructures; e) if necessary, repetition of steps b) to d), until a final dataset is obtained; and f) structuring of the elastic film, so that at least a structure-supporting surface is produced on the film.

Abstract: Method for manufacturing light articles of conglomerate material in the form of slabs (10) or blocks, comprising a first step involving preparation of a mix composed of a granulate (12), a filler (14) and a hardening resin, a second step involving distribution of the mix thus formed inside a mould or formwork, a third step involving vacuum vibrocompression of the mix contained inside the mould or formwork and a fourth step involving hardening by means of catalysis of the hardening resin. The method also envisages the manufacture of composite panel (20) by combining light slab of conglomerate material (10) with a linibg sheet (22).

Abstract: Concrete making apparatus for mounting on a vehicle for manufacturing concrete on-site, the apparatus comprising a plurality of separate containers (203, 205, 207) for storage of components of the concrete; weighing means for determining weight of at least one of the components; a mixer (211) for mixing the components together and dispatching mixed concrete; and delivery means (209, 210) for dispensing components from their respective containers (203, 205, 207) and conveying components to the mixer. The rate of delivery of components by the delivery means (209, 210) is dependent on the weight of the at least one component determined by the weighing means and the particular supply of mixed concrete required from the mixer (211).

Abstract: A manufacturing method of an artificial strip for imitated rattan furniture is completed by steps of: inputting polyester plastic material with one color or two colors into at least one plastic extruder; thermal-melting the polyester plastic material to pour into a shaping molds, extruding the melted polyester plastic material in form of a continuous geometry strip so that the strip has at least one color on its surface; cooling the strip; twisting the strip to perform spiral wavy surface to enhance vivid appearance. Lastly, the strip is reeled up to achieve an annular bundle. Thereby, the artificial strip has a verisimilitude texture approximately like the natural willow or rattan strips to make the manufactured imitated rattan/willow furniture have excellent appearance. A device system carries out the manufacturing method is also disclosed in this invention.

Abstract: In one embodiment, a feeder for agglomerating particles comprises an enclosure that has an inlet and an outlet and that is adapted to receive a predetermined amount of the agglomerating particles. An inlet valve controls entry into the enclosure, while an outlet valve controls discharge from the enclosure. A transportation system such as an auger system carries the agglomerating particles from the outlet valve to the inner portion of a drum, and, in order to prevent a clogging of the transportation system, the speed of the transportation system is coordinated with the opening rate of the outlet valve. The drum is adapted to spread out the agglomerating particles through perforations in the drum wall, so to cause the agglomerating particles to be delivered from the inner portion of the drum to a conveyor system outside the drum at a substantially uniform rate.

Abstract: Various methods are provided for forming tissue holding devices having predetermined shapes suitable for use in surgical applications, and devices formed in accordance with such methods are also provided. These methods include press forming methods, and press forming methods in combination with profile punching. Tissue holding devices formed in accordance with such methods include various configurations for a core and a plurality of tissue holding elements extending outwardly from the core.

Abstract: A novel method of forming a nanostructure device is provided. A master having a nanostructure layer is used to make an intermediate replica. The intermediate replica includes a pattern layer and a buffer layer, both made from viscous material. The depth of the buffer layer is at least ten times greater than the depth of the pattern layer such that the buffer layer absorbs any dust particles that may be present. The intermediate replica, rather than the master, is then used to make the final nanostructure device.

Abstract: The Invention relates to a device for the production of a component from at least one first layer (1) and a second layer (2) with clamping frame elements (21,22), moving relatively towards each other to fix the layers in a given manner during the forming process outside the form range of the tool and a cutting device (300) arranged on the first clamping frame element, for cutting a projection of the second layer extending between the first and the second tool piece and method for carrying out the cutting process.

Abstract: An insert molded article is disclosed wherein the article comprises a laminated appliqué having as one layer of the laminate an electronic component. In one embodiment, the laminated appliqué includes a first substrate and an electronic component bonded to the first substrate. A second substrate is applied over the electronic component and is bonded to the first substrate. The resulting laminated appliqué may be flat or trimmed and formed into a three-dimensional shape which conforms to the shape of the molded article. The appliqué may then be placed in a mold and molten resin may be injected into the mold cavity over the appliqué to produce a one-piece, permanently bonded article containing the electronic component. Additional layers may be added to the appliqué, such as graphic layers, thermally activated adhesive layers and protective layers. A method of fabricating the insert molded article is also disclosed.

Abstract: An apparatus and method for forming one or more grooves in a hose is disclosed. The groove forming device is comprised of a circular guide tube through which the hose is driven. The guide tube is rotated by a drive. The groove forming device is mounted at the exit end of the guide tube are rotated about the hose as the grooves are formed in the hose cover. The grooves of the hose are formed by at least one roller mounted on a chuck.

Abstract: A tool is described for generating a microstructured surface, comprising: a flexible matrix with a negative of the microstructure to be generated a pressure roller driveable over a surface, for pressing the matrix onto the surface, in which the pressure roller and matrix are arranged so that when the roller passes over the surface the matrix executes a rolling movement between the roller and layer, so that the negative of the matrix faces towards the surface, and a device for accelerating the curing of a curable material is arranged so that when the pressure roller passes over the surface it accompanies its movement and acts on a part of the surface.

Abstract: The object of the present invention are to provide a resin composition suitable for use in a flat panel display fixing frame having a snap fit structure, which comprises a filler and has stiffness and flame retardancy and a flat panel display fixing frame. There are provided the resin composition comprising (i) an aromatic polycarbonate resin (component A), (ii) at least one lamellar silicate mineral (component B) selected from the group consisting of talc having an average particle diameter of 0.5 to 9 ?m (component B-1) and muscovite mica having an average particle diameter of 0.5 to 50 ?m (component B-2), (iii) a fluorine-containing dripping preventing agent (component C), and (iv) an organic sulfonic acid alkali (earth) metal salt (component D) in a specific ratio, and is used in a flat panel display fixing frame having at least one snap-fit projection, hole or groove, and a flat panel display fixing frame comprising the composition in the present invention.

Abstract: The present invention relates to a flexible laminate of films of thermoplastic polymer material mainly for applications in which relatively high yield strength and ultimate tensile strength is required, and a method and apparatus for its manufacture. The laminate comprises a monofilm formed or multifilm-formed ply (A) and another monofilm-formed or multifilm formed ply (B) both mainly consisting of orientable thermoplastic polymer material, in which A has a fluted configuration and B on a first side is adhesively bonded in bonding zones to the crests on a first side of A, in which B also has a fluted configuration, the flute direction of B forming an angle from generally about 30° up to and including 90° to the flute direction of A and the said bonding zones being on the crests of the first side of B to produce spot bonding with the crests on the first side of A, the wavelengths of the flutes in A and/or B are no longer than 5 mm, and the wavelengths of the flutes in both A and B are less than 10 mm.

Abstract: A method of making a plastic container, comprises injection molding a container preform having a finish portion and a body portion, engaging the container preform with a transfer arm with the finish portion located in a predetermined orientation with respect to the transfer arm, contacting the container preform with a first brake adapted to substantially prevent rotation of the container preform with respect to the transfer arm, transferring the container preform from the transfer arm to a blow molding wheel with the finish portion in a predetermined orientation with respect to the blow molding wheel, enclosing the container preform within a blow mold cavity, and blow molding the container preform into a plastic container. A blow molding apparatus for making a plastic container is also disclosed.

Abstract: Disclosed is a polyester conjugated yarn, including two types of polymers having a large intrinsic viscosity difference subjected to bi-component spinning so as to be longitudinally arranged in a side-by-side sectional structure, in which the twp types of polymers are polyethyleneterephthalate having intrinsic viscosity of 0.45-0.65 as a first polymer and polytrimethyleneterephthalate having intrinsic viscosity of 0.90-1.10 as a second polymer. The polyester conjugated yarn is advantageous in terms of superior spinnability and high uniformity index. In addition, the polyester conjugated yarn can exhibit high self-crimping properties through relaxation-heat treatment of the dyeing and finishing process, and as well, can be applied to manufacture woven/knit fabrics having softness to the touch, beautiful colors, and high drapery and bulk properties, due to inherent characteristics of polytrimentyleneterephthalate.

Abstract: A method and a device for expanding a body (10, 22) under overpressure, in which the body (10, 22) which is formed of a material (12, 24) with a considerable portion of cavities, and which is compressed when being placed in an area of overpressure, is expanded by the cavities filling with fluid.