Abstract: A stacked BGA package and a method for manufacturing the stacked BGA package, with reduced size and/or height of a unit package, which may also reduce an electrical connection length. The stacked BGA package may include a base BGA package having at least one semiconductor chip, and a plurality of BGA packages which are stacked on the base BGA package. A plurality of solder balls may electrically connect the base BGA package and the plurality of BGA packages and may then be sealed to reduce the likelihood of damage.

Abstract: In one exemplary embodiment, a multi-chip semiconductor connector is utilized for forming a semiconductor package having a plurality of semiconductor die. The multi-chip semiconductor connector is utilized to mechanically attach the plurality of semiconductor die together and to provide electrical connection to the plurality of semiconductor die.

Abstract: A semiconductor device includes a substrate having first and second surfaces, the substrate having an opening; a first adhesive layer provided on the first surface; a second adhesive layer provided under the second surface; a third adhesive layer provided around the opening; a semiconductor chip arranging a plurality of chip bonding pads in a central portion of the semiconductor chip and adhered on the third adhesive layer; substrate bonding pads adhered under the second adhesive layer; bonding wires connecting the chip bonding pads to the substrate bonding pads; and an encapsulating resin provided around the semiconductor chip.

Abstract: A family of package substrates adapted to receive a family of integrated circuits having different sizes and provide electrical connections between the integrated circuits and a circuit board. Each package substrate in the family includes a package substrate having a die side and a circuit board side. The package substrate has a size that is consistent for all of the package substrates in the family of package substrates. The die side has integrated circuit contacts disposed in a pattern designed to make electrical connections to a given integrated circuit in the family of integrated circuits for which the package substrate is designed, as defined by locations of contacts on the given integrated circuit. The circuit board side has circuit board contacts disposed in a pattern and with functional assignments that are consistent for all of the package substrates in the family of package substrates.

Abstract: A stacked integrated circuit package-in-package system is provided forming a first integrated circuit spacer package including a mold compound with a recess provided therein, stacking the first integrated circuit spacer package on an integrated circuit die on a substrate with the recess positioned therebetween, and attaching a first electrical interconnect extending from the recess and connected between the integrated circuit die and the substrate.

Abstract: An integrated circuit package system including a leadframe having an aperture provided therein and an integrated circuit package mounted to the leadframe over or under the aperture. A die is mounted within the aperture to the integrated circuit package and the die includes a plurality of the die.

Abstract: In order to provide a low-cost and high heat-radiating electronic circuit device featuring high compactness, little warpage, high air tightness, high moldability, high mass productivity, high reliability against thermal shocks, and high oil-proof reliability, a module structure made by packing a whole multi-layer circuit board which connects a semiconductor operating element, semiconductor memory elements, and passive elements thereon and part of a supporting material on which said multi-layer circuit board is placed into a single package by transfer-molding; wherein said multi-layer circuit board and said supporting material are bonded together with a compound metallic material made up from copper oxide and at least one metal selected from a set of gold, silver, and copper.

Abstract: Wire bonding methods and apparatuses are described herein. In one aspect of the invention, an exemplary apparatus includes a plurality of electrically conductive contacts disposed on a surface of the IC device, the plurality of electrically conductive contacts being disposed in at least two rows, a plurality of first return paths formed through some of the plurality of electrically conductive contacts, a plurality of signal paths formed through some of the plurality of electrically conductive contacts, and wherein at least one of the plurality of first return paths are placed between every predetermined number of the plurality of the signal-paths. Other methods and apparatuses are also described.

Abstract: A semiconductor device includes a semiconductor substrate in which an integrated circuit is formed and which includes interconnects and electrodes, the interconnects electrically connected with the semiconductor substrate, and the electrodes being formed on the interconnects; a resin layer formed on the semiconductor substrate; redistribution interconnects electrically connected with the electrodes; a plurality of external terminals which are formed on the redistribution interconnects and supported by the resin layer; and a plurality of dummy terminals supported by the resin layer without being electrically connected with the electrodes.

Abstract: A semiconductor device having a wiring substrate, a semiconductor element mounted on the wiring substrate via a heat sink, a wire electrically connecting the wiring substrate and the semiconductor element, the wiring substrate having through holes each connected to the wire or the heat sink, and external electrodes formed on a back surface of the wiring substrate and connected to the through holes. An insulating layer is formed between the heat sink and the semiconductor element, and the heat sink is divided into at least two sections. Hence, the back surface of the semiconductor element maintains an electrically disconnected state irrespective of the potential of the heat sink, and the heat dissipation design is allowed greater flexibility. Thus, the external electrodes connected to the heat sink via the through holes are connected to the mounting substrate wirings having satisfactory heat dissipation efficiency, allowing the heat of the semiconductor element to escape efficiently.

Abstract: An electronic device. The electronic device includes a circuit board, a heat dissipation module, and a light-emitting diode. The circuit board includes a heating element thereon. The heat dissipation module is disposed on the circuit board and the heating element. The light-emitting diode is disposed on the heat dissipation module. The heat dissipation module is connected to the heating element and the light-emitting diode.

Abstract: A first semiconductor element and second semiconductor element are bonded via die-bonding material. A first electrode of the first semiconductor element and a third electrode are joined, by means of flip-chip bonding, to a semiconductor carrier that has the third electrode on the one face of the semiconductor carrier and a fourth electrode on the perimeter of the other face of the semiconductor carrier. The bonding pad of the second semiconductor element and the fourth electrode of the semiconductor carrier are connected via fine metal wire by means of wire bonding. The periphery of the first semiconductor element and the wiring portion of the fine metal wire are filled with insulating sealing resin between the semiconductor carrier and second semiconductor element and the sealing fill region for the sealing resin is formed substantially the same as the external dimensions of the second semiconductor element.

Abstract: A semiconductor package for power transistors and the like has a heat sink flange with at least one die mounted thereon, a non-ceramic based window frame mounted thereon adjacent the die, and a plurality of leads mounted on the window frame and electrically coupled to the die by wire bonds. The non-ceramic based window frame is thermally matched to copper or other highly conductive material typically used for the flange, to facilitate assembly of the semiconductor package at high temperatures. The non-ceramic based window frame is flexible and is thermally matched to the highly conductive flange so as to expand and contract at a rate similar to the flange to prevent failure during assembly of the semiconductor package. The non-ceramic based material of the window frame includes a matrix of principally organic material, such as polytetrafluoroethylene, filled with fibers which may be glass fibers or ceramic fibers.

Abstract: An electronic circuit device includes at least a first substrate and a second substrate, a spacer substrate interposed between the first substrate and the second substrate, an electronic component interposed between the first substrate and the second substrate, and at least one through-hole formed on the second circuit substrate opposing the first circuit substrate. The spacer substrate mutually connects the first substrate and the second substrate. The electronic component is connected to the first circuit substrate with the active surface of the electronic component. The through-hole penetrates from a first surface of the second circuit substrate opposing the first substrate to a second surface of the second circuit substrate. The first circuit substrate is connected to the electronic component.

Abstract: A submount that enables the reliable mounting of a semiconductor light-emitting device on it, and a semiconductor unit incorporating the submount. A submount 3 comprises (a) a substrate 4; and (b) a solder layer 8 formed on the top surface 4f of the substrate 4. The solder layer 8 before melting has a surface roughness, Ra, of at most 0.18 ?m. It is more desirable that the solder layer 8 before melting have a surface roughness, Ra, of at most 0.15 ?m, yet more desirably at most 0.10 ?m. A semiconductor unit 1 comprises the submount 3 and a laser diode 2 mounted on the solder layer 8 of the submount 3.

Abstract: A semiconductor device is disclosed that includes an interposer and a semiconductor chip. The interposer includes a Si substrate; multiple through vias provided through an insulating material in corresponding through holes passing through the Si substrate; a thin film capacitor provided on a first main surface of the Si substrate so as to be electrically connected to the through vias; and multiple external connection terminals provided on a second main surface of the Si substrate so as to be electrically connected to the through vias. The second main surface faces away from the first main surface. The semiconductor chip is provided on one of the first main surface and the second main surface so as to be electrically connected to the through vias. The Si substrate has a thickness less than the diameter of the through holes.

Abstract: In a semiconductor element, if a crack is generated inside a bonding pad, the crack does not propagate inside the semiconductor element. The semiconductor element has an electrode on a surface thereof. A wiring layer is formed inside the semiconductor element. A conductive layer is formed separate from the wiring layer so as to form a surface of the electrode. A plurality of pole-like members are formed of a conductive material and extending between the wiring layer and the conductive layer and arranged adjacent to each other. The insulating layer is formed of an insulating material filled between the plurality of pole-like members. A frame member extends between the wiring layer and the conductive layer so as to surround the plurality of pole-like members and the insulating layer together.

Abstract: A micro chip-scale-package system including providing a metal pattern on an adhesion material, attaching an integrated circuit die to the metal pattern, and molding an encapsulant over the integrated circuit die and the metal pattern.

Abstract: A power system is designed to provide reliable electrical power to a facility, in particular to a telecommunications facility. The system includes a number of proton exchange membranes (PEMs) adapted to provide DC power. The system is configured so that the PEMs receive fuel from a header that is supplied by a number of hydrogen generators. Storage tanks are also included to provide hydrogen to the header if the hydrogen generators fail. The hydrogen generators receive electricity initially from an array of photovoltaic panels. If the photovoltaic panels fail then AC power from a commercial utility is provided to the hydrogen generators. Finally, the system includes a number of super capacitors that are operable to maintain power during the time required to change between power sources.

Abstract: A wave energy conversion system converts wave energy within a wave medium into electrical energy. The wave energy conversion system includes a base substantially connected to a wave-medium floor, a tidal platform connected to the base and a tidal float connected to the tidal platform. An axle is connected to the tidal platform with an inductive coil positioned within the axle, such that an axis of the inductive coil is parallel to the axle. A magnetic sleeve includes a magnetic sleeve opening, such that the axle passes through the magnetic sleeve opening. A float member is connected to the magnetic sleeve. A wave moving through the wave causes displacement of the float member, causing the magnetic sleeve to move relative to the inductive coil and generate electrical energy within the inductive coil.

Abstract: A wind turbine having a nacelle, a generator and a high voltage transformer which are connected to each other and are located inside the nacelle. The wind turbine is provided with a low voltage power supply source which is located remotely from the high voltage transformer and includes a low voltage transformer connected between the high voltage transformer and a power grid. The low voltage transformer is connected to the nacelle and provides it with low voltage power.

Abstract: A turbine integrated within a hydrofoil extracts energy from a free-flowing motive fluid. In the preferred embodiment, the turbine is of the crossflow variety with runner blades coaxial to the width of the hydrofoil. The foremost edge of the hydrofoil comprises a slot covered by a continuously adjustable gate for controlling the overall drag imposed by the turbine. The hydrofoil mounts to a sailing vessel by means of a gimbal on a structure affixed to the hull, enabling the turbine to optimally respond to changes in direction of the free-flowing motive fluid and facilitating guidance and stability of the vessel. Both axes of the gimbal have a combination of auxiliary generator and motor with a locking mechanism. Engaging the motor and locking mechanism controls the guidance and stability of the overall vessel, and the pitch of the hydrofoil.

Abstract: A safety system for an electrical distribution system that insures voltage sufficient to power user devices interfaced to the distribution system is only provided when the distribution system is fully functional and not damaged. The safety system comprises the power distribution system, a power control box, and a circuit activator signal generator in electrical communication with the power distribution system. The power control box is electrically coupled to the power distribution system and is operable to generate a first signal of a first voltage and a second signal of a higher second voltage. The power control box communicates the first signal to the circuit activator signal generator. Upon receipt of the first signal, the circuit activator signal generator generates a third signal having a third voltage that is lower than the second voltage and communicates the third signal to the power control box.

Abstract: A remote control engine starting device includes an immobilizer and a remote engine starter for staring an engine when an engine start command is given from a remote location. The immobilizer further includes an interrogating signal outputting section, which outputs an interrogating signal when a signal related to engine starting is received, and an engine start permitting section, which gives engine start permission when a remote engine starter code that the remote engine starter outputs in response to the interrogating signal matches a remote engine starter verifying code preregistered in the immobilizer. The remote engine starter further includes an engine start signal outputting section, which outputs a signal related to engine starting, and a code outputting section, which in response to the interrogating signal, outputs the remote engine starter code preregistered in the remote engine starter.

Abstract: A system and method of operating a wind farm, having multiple wind turbine generators, at high wind speeds is provided. Wind speeds at individual wind turbine generators are monitored and a signal is transmitted from the wind turbine generators to a wind farm control system based on the monitored wind speeds. Rate of change of collective power output of the wind farm is temporally monitored and is controlled by coordinating of operational states of the wind turbine generators based upon the signals transmitted by the one or more wind turbine generators, operating conditions of the wind turbine generators and the monitored rate of change of power output of the wind farm.

Abstract: The operational frequency of existing magnetoelectric materials having metallic or ceramic magnetostrictive materials and ceramic piezoelectric materials may be limited to a few kilohertz due to the presence of eddy-current losses in the metallic magnetostrictive phase. Further, these materials may be difficult to machine and fabricate due to their brittleness. Additionally, it may be difficult to tailor and optimize the properties (i.e., magnetoelectric voltage coefficient ?E, etc.) of the devices. This invention provides a magnetoelectric element including at least one set of alternating piezoelectric layers and magnetostrictive composite layers. The magnetostrictive composite layer includes at least one magnetostrictive material dispersed in first concentrated zones within a first polymer matrix, wherein all of the concentrated zones are orientated along a first direction. It is found that the conversion efficiency (i.e., ?E) varies in accordance with applied magnetic control field Hcontrol.

Abstract: A motor driving unit includes an electric motor and a motor drive control circuit board that is disposed in a position facing the electric motor at a predetermined distance from the electric motor. A pseudo condenser is formed by providing a conductor pattern at a position facing the electric motor, in the motor drive control circuit board.

Abstract: A brush holder is installed to a motor main body and has a connector arrangement, which is directly connectable with an external connector to receive electric power. The brush holder holds a plurality of power supply brushes. A control circuit member is installed in a gear housing through an installation opening of the gear housing. The control circuit member controls rotation of the motor main body and is electrically connected to the connector arrangement and the power supply brushes.

Abstract: Plurality of discs shaped permanent magnet polefaces are disposed on a armature shaft, plurality of discs shape armatures are also disposed on said armature shaft. Each armature is situated between two polefaces with endframes supporting each end of said shaft, elongated support strut are fixedly attached between both endframes and also secured each poleface. The shaft and its armatures rotate on bearing in each endframe.

Abstract: A motor capable of reducing cogging torque depending on teeth of a stator, and a motor manufacturing apparatus for manufacturing this motor. The angles of rolling directions of cores stacked are set so that the phase difference between the phases of cogging torques produced on the cores is 180° so that the cogging torques produced on the cores cancel each other to reduce the total cogging torque in the motor. The motor comprises a laminated core formed by stacking a plurality of cores made from a rolled electromagnetic sheet steel. The cores forming the laminated core have rolling directions different from each other by a specified machine angle determined depending on the number of slots and/or the number of poles, where the specified machine angle is an angle which produces a phase difference of 180° between the phases of cogging torques produced due to magnetic anisotropy of the cores and the arrangement of teeth depending on the number of slots and/or poles of the motor.

Abstract: A brush assembly 22 for an electric motor 10 has brush holder 24 supporting a brush 26 and a brush spring. The brush holder 24 has a strip of brass having a central portion and two end portions 28, 40. The central portion has two pins 30 extending in a parallel fashion away from the central portion. A brush 26 has two grooves 64 which mate with and accommodate the pins 30 whereby the pins 30 support the brush 26 and prevent movement of the brush 26 except in the direction along the pins 20. The brush spring is a coil spring mounted on a post 54 formed at one end of the strip by a transverse slot 52 and bears on the back side of the brush 26 to urge it to slide along the pins away from the brush holder 24.

Abstract: A drive apparatus for a piezoelectric actuator prevents locking drive frequency in a state of resonance due to harmonics. There is no need to provide external components to filter, and circuitry can easily be reduced in size. The drive apparatus has a phase difference-DC conversion circuit to detect vibrating state of the vibrating body, a comparison circuit, a harmonics detection circuit to detect that the vibrating body is resonating due to harmonics and outputting a harmonics detection signal, an integration circuit to control the frequency of the drive signal supplied to the piezoelectric element of the vibrating body, a variable frequency oscillation circuit, and a drive circuit.

Abstract: A packaging system for piezoelectric devices is provided that substantially reduces and avoids the deleterious effects of environmental vibrations and shocks with gas or fluid-filled chambers that drastically improve the resonator's ability to withstand unwanted disturbances and decrease or eliminate the attendant frequency shifts. The damped piezoelectric resonator packaging system combines a resonator package, a membrane and gas/fluid-filled chambers that dampen dynamic amplification of the resonator and firmly restrain the resonator within the packaging system. The selection of gas or fluid for the chamber depends upon variables such as the type of waves being propagated and interaction with the piezoelectric substrate.

Abstract: The invention concerns an actuator that includes an active piston, an inner sliding cylinder and an outer cylinder in which the said sliding cylinder is pre-stressed, where one of the cylinders is in a material with a negative thermal expansion coefficient or one that is close to zero, with the other cylinder having a positive thermal expansion coefficient, in which the material of the cylinder with negative expansion coefficient or one close to zero is one of the following materials: ?-ZrMo2O8 in cubic structure, Zr2W P2O12, a silicious faujasite, Lu2 (WO4)3, ZrW2O8 in cubic phase, with nanograins whose size is approximately between 10 nm and 75 nm, or any possible combination of these materials.

Abstract: A crystal unit has a crystal blank provided with a pair of excitation electrodes and a pair of extension electrodes extended from the excitation electrodes, and a casing having a recess. A pair of connection terminals is formed on the bottom face of the recess. An inclined surface is formed at one end of a first principal surface of the crystal blank and the second principal surface of the crystal blank is flat-shaped. A conductive material is disposed between the connection terminals and the extension electrodes so that the extension electrodes are extended toward the end at which the inclined surface is formed and the second principal surface faces the mounting member, and the crystal blank is thereby held by the mounting member at the position of the end at which the extension electrodes are extended and electrically connected to the connection terminals.

Abstract: A spark plug for an internal combustion engine is provided which has a center electrode made up of an oxidation resistant alloy-made portion and a thermal conductive metal-made portion. The oxidation resistant alloy-made portion occupies at least a top portion of the center electrode exposed outside a porcelain insulator. The thermal conductive metal-made portion is exposed to a portion of an outer periphery of the center electrode which faces a insulator mount portion of a spark-mounting shell through the porcelain insulator in a direction perpendicular to an axial direction of the center electrode, thereby facilitating transfer or dispersal of heat from the center electrode to the mounting shell through the porcelain insulator to ensure a desired heat range.

Abstract: In a discharge lamp having a discharge vessel and external electrodes, at least one electrode similar to a conductor track is an integral part of a laminate (5) which is adhesively bonded to the outer side of the discharge vessel and includes a carrier film made of electric insulating material.

Abstract: An improved transparent support substrate in an organic light emitting diode (OLED) device comprises an organic polymer support film and a composite layer on the support film which is disposed intermediate the support film and the diodes of the OLED; the composite layer has first and second discrete coating layers bonded together in opposed facing relationship; the layers are of material impermeable to oxygen and water vapor but contain inadvertent discontinuities which result in discontinuity-controlled permeation of oxygen and water vapor.

Abstract: In a fluorescent display tube, a metal spacer is used as a height sustaining member and a fixing member of linear member so that the fixing strength of the linear member in the lengthwise direction is increased. In the fluorescent display tube, both ends of filament and Al wires are bonded onto a cathode electrode formed on a substrate by ultrasonic bonding. The ends of the filament are embedded in a part in the Al wires in the shape of being bent into a letter Z or an inverted letter Z to form fixing portion.

Abstract: An image forming device includes a rear plate having a conductor set to a low voltage, an electron emitter disposed on the rear plate, the electron emitter including the conductor, and a face plate having an electrode set to a high voltage and facing the rear plate. An image forming source is provided on the face plate and includes the electrode. A spacer is electrically connected to the conductor and the electrode and includes an insulating substrate having a first end surface facing the rear plate, a second end surface facing the electrode, and side surfaces connecting the first end surface and the second end surface. A first high-resistance film covers the side surfaces of the insulating substrate, and a second high-resistance film covers at least one of the first end surface and the second end surface of the insulating substrate and has a sheet resistance greater than or equal to a sheet resistance of the first high-resistance film.

Abstract: The present invention relates to a discharge electrode (1) for use in an electrostatic precipitator in combination with one or more collecting electrodes, wherein the discharge electrode (1) has the form of a tubular element (2). The discharge electrode (1) includes electrode elements (3) that consist of tongues (4) bent out from the wall (5) of said tubular element, said tongues also be bent upwards. The invention also relates to a method of producing the discharge electrode.

Abstract: A bezel-less display is disclosed that includes an electronic display device and a cover. The electronic display device has an image-displaying portion and another portion adjacent the image-displaying portion along at least one side. The cover is positioned adjacent the electronic display device and includes a first portion positioned adjacent the image-displaying portion of the display device and a second portion positioned adjacent the other portion of the display device. The optical properties of the first and second portions of the cover are selected to present an appearance of a uniform cover without a bezel when the display device is not displaying an image. The optical properties of the first portion are also selected to transmit images displayed on the image-displaying portion. Preferably, the optical properties of the second portion are selected to mask the other portion of the display device.

Abstract: A device for generating ultraviolet radiation by an excimer discharge is equipped with an at least partly UV-transparent discharge vessel whose discharge space is filled with a gas filling. The device includes electrodes for triggering and maintaining the excimer discharge in the discharge space. The device further has a coating that contains a phosphor including a host lattice and neodymium(III) as an activator.

Abstract: A self-luminous base lamp material for use in construction of a flat flexible fluorescent lamp is disclosed. A layer of fluorescent particles is carried between a rear electrode and front conductor electrode arranged in a parallel plate or split-electrode operative configuration. The fluorescent particles emit light upon excitation by an ultraviolet light source carried between the electrodes in response to energy applied to the electrodes. Inert gas carried in a glass microsphere functions as the ultraviolet source in one embodiment.

Abstract: A precursor to an electron source, having a capability for extending the life of an image display device by substantially preventing 1) a degradation in a degree of vacuum provided in an image display apparatus, 2) short-circuiting between adjacent wire electrodes via a getter, and 3) a degradation in performance characteristics of the electron source, even when used for a long time period. The electron source is for coupling to an image display member to form an image display apparatus, and the image display member is for displaying an image in response to being irradiated by electrons. The precursor preferably comprises a substrate, and an antistatic film provided on a surface of the substrate at a region where electron emitting devices are to be disposed on the precursor to form the electron source, but not on a region of that surface to be coupled to the image display member.

Abstract: A flat type display device is provided which is capable of accurately and easily assembling a spacer when arranging the spacer while reducing the danger of damaging the metal back. In the display device, a plurality of fine holes each having a fluorescent materials are formed on a light transparency substrate and a metal sheet is arranged by a black oxide film formed on the surface of the light transparency substrate side so as to obtain a light absorbing layer. A plurality of concave portions are provided on a surface of the metal sheet of the rear substrate side. A metal back having an openings corresponding to predetermined areas containing each of the concave portions is superimposed on the metal sheet, thereby constituting an acceleration electrode of two-layer structure. The spacer is inserted into the concave portion on the metal sheet exposed in the opening of the metal back.

Abstract: A display apparatus is disclosed with a vacuum seal member which has a shell structure. The display apparatus includes an anode substrate, a planar cathode substrate forming an electron emitting chamber vacuously sealed between the cathode substrate and the anode substrate, electron sources formed on the cathode substrate, phosphors formed on the anode substrate, and a vacuum seal member forming a pressure balancing chamber on the back of the electron emitting chamber side of the cathode substrate. The vacuum seal member is placed covering the back of the electron emitting chamber side, and has a shell structure for receiving the atmospheric pressure.

Abstract: The present invention relates to an organic electroluminescent display device in which luminance and emission efficiency may be improved by forming light emitting elements of the organic electroluminescent display device in a projecting structure and provides an organic electroluminescent display device comprising a projecting structure layer formed on an insulating substrate; first electrode formed in a projecting structure on the substrate including the projecting structure layer; an organic layer formed on the first electrode; and second electrode formed on the insulating substrate, wherein the second electrode may be formed in a projected shape by the projecting structure layer so that the second electrode surrounds the organic layer.

Abstract: There is provided an organic electroluminescence device employing a multi-layered pixel electrode and a method of fabricating the same. The organic electroluminescence device comprises a substrate, a first pixel electrode located in a predetermined area on the substrate, and a second pixel electrode located on the first pixel electrode and entirely covering the first pixel electrode. Thus, the film breakdown due to the galvanic phenomenon is precluded.

Abstract: Methods and displays utilize row and column drivers with ZnO channels that control pixel transistors with ZnO channels, which in turn address OLEDs of an array to produce images of a display screen. A display backplane including the ZnO row and column drivers and the OLEDs may be constructed by utilizing aperture masking or a combination of photolithography and aperture masking. Monolithic integration of the ZnO row and column drivers together with the ZnO pixel transistors is thereby achieved.