Abstract: A ground wire connection nut (14A) and a cover-fixing nut (14B) are molded in a case (12) at positions shifted in an axial direction thereof. Caps (17) are mounted on each nut (14A, 14B). First and second receiving surfaces (33A, 33B) are formed on each cap (17) at positions shifted in the axial direction. First and second positioning portions (30A, 30B) are formed in a die (36) and contact the first and second receiving surfaces (33A, 33B) respectively. An axial length of each positioning portion (30) is set according to the specified position of each nut (14A, 14B). The same kind of the caps (17) can be used commonly for the nuts (14A, 14B) to reduce the manufacturing cost.

Abstract: A solenoid (30) has one end connected to the ground G and the other end connected to an N-MOS transistor (33) which applies current from a battery (31) to the solenoid (30). On the other hand, regenerative current generated when the N-MOS transistor turns off flows from a diode (34) whose anode is connected to the ground, via a resistor (32) to the solenoid (30). Accordingly, without connecting the anode of the diode (34) to the solenoid (30) using a lead line, the solenoid (30) can be driven by current. Moreover, since the current flowing from the battery (31) to the solenoid (30) does not flow to the resistor (32), heating is reduced and a solenoid drive apparatus can be made in an IC.

Abstract: A charge eliminating mechanism of the invention includes a mechanical switching mechanism (e.g., a POGO pin), and a wiring line so connected as to be able to be electrically connected to the POGO pin. The wiring line can include a resistor. A block holds the POGO pin. The POGO pin comes into contact with a charge eliminating plate provided on a stage, so that the static electricity of the stage is discharged to ground.

Abstract: An electric discharge weapon includes a high voltage circuit, a control circuit, and a light source. The high voltage circuit includes a spark gap having a breakdown voltage affected by light. A magnitude of an electric discharge of the weapon is related to the breakdown voltage of the spark gap. Under control of the control circuit, the light source emits light to illuminate the spark gap prior to conduction so that the magnitude of the electric discharge is within a desired range.

Abstract: A single-path electrical device generates a conductive channel through the air to alternatively convey charge to a target and remove charge from the target. The single-path electrical device uses either a grounding sphere or grounding torroid to store and at least partially dissipate opposite charge. In this way, neither the target nor the single-path electrical device is required to be grounded. The single-path electrical device may operate at a low frequency to help overcome any surface effects of the target.

Abstract: An apparatus includes a switch comprising microelectromechanical elements, the microelectromechanical elements including a sealed chamber containing a dielectric element, and conductors in the sealed chamber. The conductors are arranged such that application of greater than a predetermined voltage to at least one of the conductors causes ionization breakdown of the dielectric element to provide an electrically conductive path between the conductors. In another implementation, a switch includes a nanotube electron emitter or a radioactive isotope electron emitter.

Abstract: A capacitor includes a ceramic capacitor body having opposite ends and comprised of a plurality of electrode layers and dielectric layers and first and second external terminals attached to the ceramic capacitor body. The internal active electrodes within the ceramic capacitor body are configured in an alternating manner. Internal electrode shields within the ceramic capacitor body are used to assist in providing resistance to arc-over. The shields can include a top internal electrode shield and an opposite bottom internal electrode shield wherein the top internal electrode shield and the opposite bottom internal electrode shield are on opposite sides of the plurality of internal active electrodes and each internal electrode shield extends inwardly to or beyond a corresponding external terminal to thereby provide shielding. Side shields are used. The capacitor provides improved resistance to arc-over, high voltage breakdown in air, and allows for small case size.

Abstract: The invention relates to a dielectric ceramic composition, which can be sintered at a low temperature as well as achieve a high dielectric constant with excellent thermal stability, and a multilayer ceramic capacitor using the same. The dielectric ceramic composition comprises a main component of (Ba1?xCax)mTiO3; and sub-components including MgCO3, RE2O3, MO, MnO, V2O5, Cr2O3 and a sintering additive of SiO2. RE2O3 is at least one selected from the rare earth oxide group consisting of Y2O3, Dy2O3 and Ho2O3, and MO is one of Ba and Ca. The dielectric ceramic composition is expressed by a following formula: a(Ba1?xCax)mTiO3-bMgCO3-cRE2O3-dMO-eMnO-fSiO2-gV2O5-hCr2O3. Here, a, b, c, d, e, f, g, and h satisfy following relationships: in mole fraction, a=100, 0.1?b?3.0, 0.1?c?3.0, 0.1?d?3.0, 0.05?e?1.0, 0.2?f?3.0, 0.01?g?1.0, and 0.01?h?1.0, and x and m satisfy following relationships: 0.005?x?0.15, and 0.995?m?1.03.

Abstract: A heat sink is for an integrally fused low-voltage power air circuit breaker including a line terminal and electrical bus work coupled to a current limiter. The line terminal, electrical bus work, and current limiter contribute to the formation of a thermal dam. The heat sink includes a heat exchanger structured to be coupled to the line terminal at or about the current limiter in order to expel heat from the thermal dam. The heat exchanger comprises at least one conductive member having a first end, a second end, and a plurality of bends therebetween. The heat exchanger includes heat reduction features, such as, for example, two conductive members having a number of air gaps therebetween to facilitate heat convection, a dark coating to expel heat, materials having a high thermal conductivity, and surface-enlarging mechanisms such as fins, flanges and apertures.

Abstract: A monitor apparatus includes a monitor main body displaying a picture; a base member supporting the monitor main body; a connecting member combined to the base member, and supporting the monitor main body to be pivoted; a first guide plate having a first side pivotably combined to the connecting member, and a second side to be slidably combined to the monitor main body; a sliding unit provided between the first guide plate and the monitor main body and supporting the first guide plate to be slidable on the monitor main body; and a link unit having a first side combined to a rear side of the monitor main body and a second side combined with the connecting member, the monitor main body moves up and down with respect to the base member by sliding on the first guide plate when the first guide plate pivots with respect to the connecting member.

Abstract: A monitor adjusting apparatus include a monitor (10), a base (20) and an adjusting device (30). The adjusting device includes a first pivot assembly (40) connected with the monitor, a second pivot assembly (50) connected with the base, and a connecting assembly (70) mounted between the first pivot assembly and the second pivot assembly. The first pivot assembly generates a friction moment. The monitor generates a first gravity moment opposite to the friction moment. The second pivot assembly generates a twist moment. The monitor and the connecting assembly generate a second gravity moment opposite to the twist moment. The monitor stays at any obliquity under a balance of the friction moment and the first gravity moment, and stays at any height under a balance of the twist moment and the second gravity moment.

Abstract: A computer system includes a computer having a computer main body and a display main body. The computer main body is formed with a keyboard accommodating part that detachably accommodates a keyboard therein. The display main body has a screen that displays an image thereon and is foldable against the computer main body. A supporting unit is detachably coupled to the keyboard accommodating part and supports the computer on an installation surface in a position that the display main body of the computer is folded onto the computer main body and exposes the screen to the outside.

Abstract: An information processing apparatus includes a housing with a top surface and a rear surface, a CPU (central processing unit) provided in the housing, a keyboard placed on the top surface of the housing and including a plurality of keys which input key data to the CPU, a display unit attached to the housing rotatably between a closed position in which the display unit covers the keyboard and an open position in which the keyboard is exposed, and at least one switch provided on the rear surface of the housing and configured to input key data to the CPU.

Abstract: A mounting apparatus includes a storage bracket (30), an operating member (60), a locking member (50) and a pair of springs (70). The operating member has at least one slant portion (647). The locking member is restrained from moving along with the operating member. The locking member has at least one inserting pin (54) and at least one sliding tab (56). The springs press on the locking member to urge the inserting pin to extend into the storage bracket. The inserting pin of the locking member is lifted out of the storage bracket by the slant portion of the operating member edging the sliding tab of the locking member out, when the operating member is pushed.

Abstract: An external casing includes a housing housed with a data storage device and formed with an opening. An interface module is disposed in the housing, and is connected electrically to the data storage device disposed in the housing. An external electrical connector is connected electrically to the interface module. A foldable cover member includes a fixing portion secured to a first housing part of the housing, an engaging portion opposite to the fixing portion, and an intermediate covering portion interconnecting the fixing portion and the engaging portion and covering over the external electrical connector. A lock unit is provided on a second housing part of the housing and the engaging portion of the cover member for selectively anchoring the engaging portion of the cover member to the second housing part of the housing.

Abstract: A chassis having a pivotable bracket is disclosed. The bracket pivots between an up position to permit an internal cable to be coupled to the bracket and pivots to a down position to form a hood for the passage of heated air into the interior of the computer system. When a component is inserted in the computer system, the component contacts the bracket and forces the bracket to move from the up position to the down position.

Abstract: In one embodiment, a printed circuit board assembly comprises a heat sink having an electrically conductive mounting support and a printed circuit board including detection circuitry to detect an electrical connection between the electrically conductive mounting support and an electrically conductive receiver on the printed circuit board.

Abstract: A synthetic jet array in a computing device, such as a mobile computing device, to dissipate heat generated by a heat generating component of the mobile computer is described. In one embodiment, a microscale synthetic jet array is integrated within a heat generating component, either on the backside of the heat generating component itself or on a heat spreader coupled to the heat generating component. A method of fabricating a synthetic jet array as an integrated part of a computing device or as a heat spreader is described, as well as a method of use of the synthetic jet array, are described.

Abstract: Embodiments of a cold plate and a manifold plate are disclosed. The cold plate may be coupled with an integrated circuit die, and the cold plate may also include a flow path to receive a liquid coolant. Coolant moving through the flow path can remove heat generated by the die. The cold plate may include one or more piercing elements that are coupled with the flow path. The manifold plate may hold a volume of a liquid coolant, and one or more breakable seals on the manifold plate contain the liquid coolant within the manifold plate (and perhaps other components of a fluid cooling system). The piercing element (or elements) on the cold plate may be inserted into the breakable seal (or seals) on the manifold plate to open the breakable seals and establish fluid communication between the cold and manifold plates. The use of a manifold plate including the breakable seals may enable the shipment and storage of a fluid cooling system precharged with a working fluid. Other embodiments are described and claimed.

Abstract: It is an exemplified object of the present invention to provide a radiator mechanism and electronic apparatus having the radiator mechanism that can prevent destruction, deterioration, and malfunction due to heat of exoergic components or other electronic components, thermal deformation of a housing thereof, and low-temperature burn, without preventing the electronic apparatus including a printed board from miniaturization. The radiator mechanism is comprised of a cooling fan and a through hole provided in a motherboard, thereby thermally protecting a variety of circuit components mounted on the motherboard to provide a stable operation.

Abstract: A waterproof thermal management module for a portable electronic device that including a housing and a heat source is disclosed. The waterproof thermal management module includes a separated chamber, a heat absorber, a radiator, a heat pipe and a fan. The separated chamber is set inside the housing and has a first air channel and a second air channel, wherein the first and second air channels communicate with the outside of the housing. The heat absorber is set inside the housing for contacting the heat source. The radiator is set inside the separated chamber. The heat pipe extends from inside the housing through the wall of the separated chamber into the separated chamber and connects the heat absorber and the radiator. The cooling fan is set in the separated chamber.

Abstract: Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural processors. A power system couples to and is disposed vertically above the PCB. A thermal dissipation device is disposed between the power system and the PCB for dissipating heat, via a direct heat exchange, from both the power system and the plural processors.

Abstract: A heat dissipation device for electrical components includes an outer surface and an inner surface. The outer surface is configured for mounting the electrical components thereon, wherein the components are mounted to the outer surface to allow the transfer of heat from the electrical components to the heat dissipation device and ambient air. The inner surface defines a cavity within the heat dissipation device that also enables housing of the electrical components.

Abstract: A heat dissipating apparatus (10) for dissipating heat from a heat-generating electronic component includes a heat sink (14), a resilient clipping member (162), and an operating member (164). The heat sink contacts with the heat-generating electronic component, and includes a fin assembly (144) which defines a channel (146) therein. The resilient clipping member is received in the channel of the heat sink for mounting the heat sink on the heat-generating electronic component. The operating member is pivotally mounted to the clipping member. At least one portion of the operating member is mounted between the fin assembly and the clipping member. The at least one portion can move from an unlock position to a lock position to support the clipping member away from the heat-generating electronic component.

Abstract: Apparatus which is capable of providing efficient cooling of rack mounted electronic modules while accommodating relatively large tolerances in the mounting of the modules. A plurality of thermally conductive sliding wedge blocks are interposed between the lower surface of each module and the upper surface of the cold plate base of the rack. The mechanism for clamping a module to the rack also pulls the wedge blocks together to fill in the gap between the lower surface of the module and the upper surface of the cold plate so as to provide a complete thermal path therebetween.

Abstract: A liquid crystal display (LCD) is fixed to an upper housing half by an LCD fixing frame made of a material having a high thermal conductivity. The LCD fixing frame is attached to the upper housing half in contact with a lower surface of the LCD on the opposite side of a display panel which defines an image display plane. A substrate mounted with high heat generating parts such as a CPU is attached to the LCD fixing frame such that the high heat generating parts face the lower surface of the LCD fixing frame. A thermally conductive member is disposed between the high heat generating parts and the LCD fixing frame in contact with the high heat generating parts and LCD fixing frame.

Abstract: Where power components are fixed on a heat sink 1 inclusive of a heat sink base 1b and cooling fins 1a provided on the heat sink base 1b, one 1c of the cooling fins, which is made thicker, is arranged upright on the heat sink base 1b. And a high heat-generating power component 3 is fixed to the heat sink base 1b and middle heat-generating power components 5, 6 are fixed to the cooling fin 1c.

Abstract: A fixing structure for computer mainboard is provided. The mainboard is clamped between a guard board and a back board. Through the appropriate arrangement of a snap pillar of the guard board and a gourd-shaped hole of the back board, after the snap pillar penetrates the mainboard and the gourd-shaped hole, the mainboard, the guard board and the back board are snapped by moving the back board properly. Furthermore, in the snap state, a fixing pillar penetrates the mainboard and the back board, so as to fasten the two boards. Thus, the step of locking by screws in the conventional art is simplified, and the assembly or disassembly can be fulfilled without any assembling/disassembling tools.

Abstract: An electronics housing for placement on a support rail includes a base part and an upper part. The base part and the upper part can be detachably connected to one another, and the base part can be snapped to the support rail. Two housing side walls having fasteners are disposed opposite to each other and are disposed parallel to each other. The housing side walls are also disposed perpendicular to the support rail. A circuit board is disposed parallel to the support rail using the fasteners. At least two connection terminals or plug-in connectors are provided for connecting the electrical conductors. The connection terminals are electrically connectable to the circuit board.

Abstract: The present invention, roughly described, pertains to a small memory card that includes features which allow the memory card to be more easily handled by a user. In various embodiments, the memory card can include a chamfer and/or a raised portion that allows the memory card to be more easily grabbed by a human hand (or mechanical device) and also provides additional room to store passive devices such as capacitors and/or resistors. Because different electronic devices use different types of memory cards, an adaptor is provided that allows the memory cards disclosed herein to be used in ports or connectors on electronic devices that are meant for other types of memory cards.

Abstract: An object of the present invention is to provide a flexible printed wiring board which relaxes stress concentration in the flexible printed wiring board during production steps, thereby preventing wire breakage in inner lead portions and cracking in solder resist which would otherwise be caused during mounting of devices such as IC chips and LSI chips. The flexible printed wiring board of the present invention includes an insulating layer; a wiring pattern formed of a plurality of wirings being juxtaposed, which wiring pattern is formed through patterning a conductor layer stacked on at least one surface of the insulating layer and on which wiring pattern a semiconductor chip is to be mounted; and grid-like dummy patterns formed in a blank area where the wiring pattern is not provided, wherein the dummy patterns are formed in a width direction generally symmetrically with respect to the longitudinal direction of the flexible printed wiring board.

Abstract: A demonstration tool for a programmable logic device is provided. The demonstration tool includes a circuit board partially disposed within a transparent block. A collar having an opening defined therein is disposed between the transparent clock and a base of the demonstration tool. The base is designed to enable access to a bottom portion of the circuit board that extends outside of the transparent block and the collar. The bottom portion of the circuit board includes connection ports to power and configure the programmable logic device. A method for embedding a printed circuit board into a housing is also provided.

Abstract: The invention provides a wiring board with built-in capacitors, that has a multilayer wiring structure and capable of mounting an IC chip thereon. The wiring board with built-in capacitors includes: a first capacitor that is built into the multilayer wiring structure and formed so that an overlapping area between a first lower electrode and a first upper electrode provided on respective surfaces of a first dielectric layer is a predetermined area; and a second capacitor that is built into the multilayer wiring structure along the same plane as the first dielectric layer and formed so that an overlapping area between a second lower electrode and a second upper electrode provided on respective surfaces of a second dielectric layer with the same thickness as the first dielectric layer is different from the predetermined area.

Abstract: A high-speed router backplane is disclosed. The router backplane uses differential signal pairs on multiple signal layers, each sandwiched between a pair of digital ground layers. To reduce routing complexity, at least some of the differential signal pairs route through a via pair, somewhere along their path, to a different signal layer. Specific via designs reduce differential signal distortion due to the via pair, allowing the backplane to operate reliably at differential signal rates in excess of 3 Gigabits per second. In particular, each via passes through nonfunctional conductive pads on selected digital ground plane layers, the pads separated from the remainder of its ground plane layer by a clearance, thereby modifying the impedance of the via and reducing reflections from the stubs created by the via.

Abstract: A fastening mechanism for an electronic device for connecting upper and lower casings of an electronic device, includes: a side frame member including an exposed surface, a first surface and an opposing second surface; a wedging portion formed on the first surface, for being coupled with a protruding edge formed on the upper casing; a stopping portion formed on the second surface, for abutting against an edge of the lower casing; and at least one locking portion formed on the side frame member, and extended toward a direction opposed to the exposed surface so as to further fasten the upper casing, the side frame member and the lower casing by means of a locking element, making the upper casing, the exposed surface of the side frame member and the lower casing form a case of the electronic device.

Abstract: The present invention relates a cover which changes the aesthetic appearance of a computer component by providing an area to display an image, graphic, logo or text. Attachment shall be of a simple, easily attachable/detachable type requiring little or no modification to the computer component.

Abstract: A method according to one embodiment may include providing circuit board having a faceplate. The method of this embodiment may also include providing a label surface capable of moving between a deployed position and a stowed position. When the label surface is in a deployed position at least a portion of the label surface extends outwardly from the faceplate relative to the circuit board. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract: A power supply includes a transformer, a second output line, a second output line, a controller, and a current bypass circuit. The transformer has a primary side and a secondary side. The first output line derived from a first point on the secondary side. The first output line outputs a first voltage. The second output line is derived from a second point on the secondary side. The second output line outputs a second voltage lower than the first voltage. The controller controls an amount of current flowing in the primary side based on the second voltage so that the second voltage is maintained at a prescribed voltage. The current bypass circuit controls current flowing in the first output line to flow in the first output line when a potential difference between the second voltage and the second voltage exceeds a prescribed value.

Abstract: A switching power source apparatus has a switching element Q1. Between terminals of the switching element Q1, there is parasitic capacitance (C1, C2). A voltage V4 of parasitic oscillation appears at a gate of the switching element Q1 after a flyback period. A voltage detector detects a drop in the voltage V4 and outputs a detection signal V6. The detection signal V6 is delayed by a timer, which outputs an ON start signal synchronized with timing T at which the voltage V4 reaches a bottom level. In response to the ON start signal from the timer, a controller outputs an ON control signal to turn on the switching element Q1. In response to the ON control signal from the controller, a driver applies a drive signal to the gate of the switching element Q1, thereby driving the switching element Q1.

Abstract: A rectifier includes a switching circuit and a controller. The switching circuit is coupled between positive and negative buses and a plurality of input voltage sources. The switching circuit includes a plurality of pairs of switching devices. Each pair is associated with one of the input voltage sources. The controller includes first and second control loops operable to generate control signals for operating the pairs of switching devices to generate a potential across the positive and negative buses. The controller is further operable to estimate a line inductance seen by the rectifier based on at least one of the control signals and generate an inductance compensation gain factor for applying to the control loops based on the estimated line inductance.

Abstract: A power system for increasing a load start-up capability of a DC/AC converter includes a DC/AC converter, a processor coupled to the DC/AC converter and a memory subsystem coupled to the processor. The memory subsystem stores code that when executed by the processor instructs the processor to perform a number of steps. When an actual link voltage of a DC/AC converter falls below a predetermined link voltage level, when a commanded link voltage is set for a nominal link voltage level, the commanded link voltage is increased to link voltage level that is greater than the nominal link voltage level. The DC/AC converter is then restarted.

Abstract: A method and apparatus for controlling a power supply. The system includes a power supply and a controller for outputting a command signal to regulate the operation of the power supply. The controller determines the command signal based on at least one error signal which is selected from a plurality of error signals based on a selection criterion.

Abstract: A welding power supply includes an input rectifier that receives sinusoidal or alternating line voltage and provides a rectified voltage. A pre-regulator provides a dc bus and a convertor, such as a boost convertor, provides a welding output. The pre-regulator is an SVT (slow voltage transition) and an SCT (slow current transition) switched convertor. It may include a snubber circuit having a diode that is SVT switched. Also, the boost convertor may be SVT and SCT switched. The pre-regulator preferably includes a power factor correction circuit. The power source includes, in one embodiment, an inverter having a snubber circuit having a first switch in anti-parallel with a first diode, and a second switch in anti-parallel with a second diode. The first switch and first diode are connected in series with the second switch and the second diode, and the first and second switches are connected in opposing directions, to form a switched snubber.

Abstract: A method of compensating output voltage distortion of a half-bridge inverter and a device based on the method discloses that the method includes the steps of measuring the voltage of the capacitor of the half-bridge inverter and then detecting the output voltage of the same; comparing the capacitor voltage and the output voltage to identify how much degree the distortion is resulted from the capacitor voltage unbalance, wherein if the degree of the distortion matches a predetermined condition, proceed to the next step; and charging the capacitor through a compensating circuit to compensate the capacitor for the insufficient electric energy to enable the capacitor to provide the load with the sufficient electric energy. Thus, the drawback that the waveform of the output voltage can be improved to enable the device and the method to have advantages of simple circuit, easy control, reduced capacitance, and being applicable to any output frequency.

Abstract: An electrical power control apparatus and method for power factor correction in a conventional 60 hertz or other conventional frequency electrical AC power supply communicated to an inductive load. A plurality of interruptions of current in the line on both sides of an AC current oscillation, are created to control the power factor in a circuit energizing an inductive load. Additional power factor control and correction is provided by grounding of the line during each interruption. A controller controls the length and duration of each interruption based on preprogramming or input regarding current phase read or calculated in the line.

Abstract: A method for manipulating a quantum system comprises at least one mobile charge carrier with a magnetic moment. The method comprises the steps or acts of applying magnetic field to the charge carrier. The magnetic is spatially non-homogeneous. The method also comprises bringing the charge carrier into an oscillatory movement along a path. The magnetic field depends on the position of the charge carrier on said path. The oscillatory movement may be caused by electrostatic interaction with gate electrodes. Due to this approach, thus, in a magnetic moment resonance process the conventional oscillating magnetic field is replaced by an oscillating electric field which is locally transformed into a magnetic field by the Coulomb interaction that displaces the charge carrier wave function within an inhomogeneous magnetic field or in and out of a magnetic field.

Abstract: A Unified Memory may store multiple types of content such as data or fast code or slow code. The data or code may be stored in separate arrays or in a common array. In an array, a tag bit may indicate the type of content such as data or fast code or slow code or single level or multilevel content. Tag bit may indicate communication interface or IO driver type. Sense amplifiers may be configurable based on the type of data being read. A Flash Security Measure is used to protect a protected memory area. A Flash Security Key is used for authentication and authorization a particular memory area. A XCAM (e.g., CAM) array is included in the Unified Memory. Unified Memory Concurrency is included.

Abstract: A priority encoder can be used for a Content-Addressable Memory (CAM) device that typically has an array of CAM cells arranged in columns and rows with each row having a match signal indicative that compare data has matched data within the respective row. A priority encoder is operatively connected to the array of CAM cells and determines a highest priority matching address for data within the array of CAM cells. The priority encoder includes match lines associated with respective rows and precharged bus lines connected into respective match lines that are discharged whenever there is a match signal such that the highest precharged bus line discharged results in an encoded address.

Abstract: A memory device includes a memory cell array block including memory cells, a word line driver block adjacent the memory cell array block disposed in a direction in which word lines of the memory cells are arranged, a sense amplifier block adjacent the memory cell array block disposed in a direction in which bit lines of the memory cells are arranged, a conjunction block disposed at an intersection of the word line driver block and the sense amplifier block, an equalizer for equalizing a pair of local data lines, the equalizer disposed in the conjunction block, and a local data line sense amplifier configured to sense and amplify signals on a pair of local data lines, and having transistors of a first type disposed in the conjunction block and transistors of a second type disposed in the sense amplifier block.

Abstract: A data processor includes an authentication function for judging access right. The data processor further includes a nonvolatile memory cell array formed on an insulator film or a chip, and a conductor layer provided between a logic circuit for the authentication and the nonvolatile memory. The nonvolatile memory can store at least part of authentication information or an authentication program.