Abstract: A circuit board assembly includes a circuit board, an electronic component and a structure coupling the electronic component to the circuit board. The structure retains the electronic component relative to the circuit board at a selected one of a plurality of positions in both directions along an axis perpendicular to the circuit board. The structure is movably coupled to one of the electronic component and the circuit board in a direction perpendicular to the axis at least prior to being coupled to the other of the electronic component and the circuit board.

Abstract: In a memory module, reference potential connecting patterns are disposed on high frequency signal lines and/or on the extension lines extending from the terminal ends of the signal lines as well as a shield cover for covering semiconductor memory chips is disposed on the substrate, and the reference potential connecting patterns are connected to the shield cover through metal cover contact parts.

Abstract: A switching type converter including an input stage and an output stage, the input stage including an input inductor to which an input DC voltage to be regulated is applied, switching component for directing the current passing through the input inductor either to the ground or to the output stage, and a capacitor mounted in parallel between the output from the switching component and the ground, the output stage including an output inductor mounted in series, an output capacitor mounted in parallel, the terminals of which carry the output voltage from the regulator, and an additional inductor connecting the output of the switching component to the output stage and magnetically coupled to the input inductor.

Abstract: A switching power supply is disclosed for improving the no-load power drain of low-power mains operated supplies. The power converter utilizes a cascoded switch arrangement with a conventional high voltage power MOSFET and a low voltage, low gate charge MOSFET. Driving only the small low voltage device reduces the power required for gate drive. The disclosed configuration is also capable of generating a non-isolated auxiliary rail for powering its control circuitry utilizing the parasitic capacitance of the high voltage power devices as an element in a charge pump. The resulting power supply requires significantly fewer components.

Abstract: System and method for protecting a power converter. The system includes a compensation system configured to receive an input signal and generate a control signal, a cycle threshold generator configured to receive the control signal and generate a cycle threshold, and a comparator configured to receive the cycle threshold and a feedback signal and generate a comparison signal. Additionally, the system includes a pulse-width-modulation generator configured to receive the comparison signal and generate a modulation signal in response to the comparison signal, and a switch configured to receive the modulation signal and control an input current for a power converter. The input current is associated with an output power for the power converter. The cycle threshold corresponds to a threshold power level for the output power. The threshold power level is constant, decreases, or increases with respect to the input signal.

Abstract: In one embodiment, a power supply controller generates a PWM control signal that is subsequently used to control a portion of current flow in a primary side of a power supply system. THE PWM control signal is coupled to a secondary of the power supply system and used to control a synchronous rectifier that is coupled within the secondary side.

Abstract: Ternary content-addressable memory (TCAM) entries are disclosed for use in performing error-protected lookup operations by allowing an error budget of u deviations in values stored in each entry. Each TCAM entry is configured to identify a hit condition (else a miss condition) with an input lookup word if its stored value matches each bit of the lookup word with the exception of zero to u of its cells not matching. This determination may be made, for example, using discrete logic or based a voltage level of one or more match lines. Furthermore, it is possible to store at least 2u+1 copies of a data value desired to be protected in a such a TCAM entry among its said t TCAM cells.

Abstract: Provided are a complementary nonvolatile memory device, methods of operating and manufacturing the same, a logic device and semiconductor device having the same, and a reading circuit for the same. The complementary nonvolatile memory device includes a first nonvolatile memory and a second nonvolatile memory which are sequentially stacked and have a complementary relationship. The first and second nonvolatile memories are arranged so that upper surfaces thereof are contiguous.

Abstract: A memory includes a volume of phase change material, a first transistor coupled to the volume of phase change material for accessing a first storage location within the volume of phase change material, and a second transistor coupled to the volume of phase change material for accessing a second storage location within the volume of phase change material.

Abstract: A memory system having a memory controller and a memory. The memory controller is coupled to a processor and to the memory. The memory comprises one or more daisy chains of memory chips. An address/command word is chained through a daisy chain of memory chips and is handled by one of the memory chips in the daisy chain of memory chips. Data to be written to a memory chip is sent as part of the address/command word, or is transferred on an outgoing data bus chain. Data read from a memory chip is transferred on an incoming data bus chain. A daisy chain of memory chips can include memory chips on multiple carriers, or the daisy chain of memory chips can all be attached to a single carrier.

Abstract: A computer system having a memory system, the memory system having a memory controller and a memory. The memory comprises one or more daisy chains of self timed memory chips. An address/command word is chained through a daisy chain of memory chips and is handled by one of the memory chips in the daisy chain of memory chips. Data to be written to a memory chip is sent as part of the address/command word, or is transferred on an outgoing data bus chain. Data read from a memory chip is transferred on an incoming data bus chain. Access timing on each memory chip is determined by a self time block on each memory chip.

Abstract: An optoelectronic device is disclosed with a light source, a wave guide and a first signal line, wherein a cell is formed at the intersection between the wave guide and the first signal line. The cell includes a light activated switch and an output device. The optoelectronic device may be an optoelectronic memory wherein the output device is a storage unit. Alternatively the optoelectronic device may be an optoelectronic display device wherein the output device is a light emitting device or a liquid crystal device.

Abstract: A nonvolatile semiconductor memory device having a storage element which is programmed with information by breaking an insulating film of the storage element, includes a cell array including a plurality of storage cells arranged in matrix, each of the storage cells having the storage element and a selection switch connected in series to the storage element, and a row selection control circuit which activates a row selection line connected to a given number of storage cells. The device further includes a write control circuit which controls a voltage of each of data lines bit by bit in accordance with write data, the data lines being connected to a given number of storage cells connected to the row selection line activated by the row selection control circuit.

Abstract: A method for programming an electronically programmable semiconductor fuse applies a programming current to a fuse link as a series of multiple pulses. The fuse link has a nominal maximum programming current and corresponding combinations of a programming voltage and a gate voltage associated with the nominal maximum programming current. A first programming current pulse is generated to provide a programming current less than the maximum programming current. The first programming current pulse causes electromigration to increase the resistance of the fuse link. A subsequent programming current pulse is applied using a combination of gate voltage and programming voltages which if applied to the fuse link absent any electromigration would result in a programming current greater than the nominal maximum programming current. However, the resistance created by the first programming pulse reduces the programming current of the subsequent programming pulse to a level below the maximum programming current.

Abstract: A memory device includes a plurality of memory cells and a comparison circuit that compares a set of selected memory cells with at least one reference cell having a threshold voltage. The comparison circuit includes a bias circuit that applies a biasing voltage having a substantially monotone time pattern to the selected memory cells and to the at least one reference cell, sense amplifiers that detect the reaching of a comparison current by a cell current of each selected memory cell and by a reference current of each reference cell, a logic unit that determines a condition of each selected memory cell according to a temporal relation of the reaching of the comparison current by the corresponding cell current and by the at least one reference current, and a time shift structure that time shifts at least one of said detections according to at least one predefined interval to emulate the comparison with at least one further reference cell having a further threshold voltage.

Abstract: In a method for reading the memory cell in a passive matrix-addressable ferroelectric or electret memory array with memory cells in the form of ferroelectric or electret capacitors, sensing means connected to the bit line of memory cell is activated in order to initiate a charge measurement and a first charge value is registered, whereafter a switching voltage is applied to the memory cell and a second charge value is registered. A readout value is obtained by subtracting the first charge value from the second charge value. A sensing device for performing an embodiment of the method comprises a first amplifier stage with an integrator circuit and connected with a second amplifier stage (A2) following the first amplifier stage and with an integrator circuit, and a sampling capacitor connected between an output of the first amplifier stage and an input of the second amplifier stage.

Abstract: A non-volatile memory cell includes a switch able resistor memory element in series with a switch device. An array of such cells may be programmed using only positive voltages. A method for programming such cells also supports a direct write of both 0 and 1 data states without requirement of a block erase operation, and is scaleable for use with relatively low voltage power supplies. A method for reading such cells reduces read disturb of a selected memory cell by impressing a read bias voltage having a polarity opposite that of a set voltage employed to change the switch able resistor memory element to a low resistance state. Such programming and read methods are well suited for use in a three-dimensional memory array formed on multiple levels above a substrate, particularly those having extremely compact array line drivers on very tight layout pitch.

Abstract: The present invention is to provide a memory device including: a plurality of memory cells that each include a memory element having a memory layer and first and second electrodes that sandwich the memory layer, the plurality of memory cells being divided into memory blocks of m columns by n rows (m and n are each an integer of not less than 1, m+n?3), the memory elements in the same memory block having the first electrode that is formed of a single layer in common to the memory elements; and a voltage application unit that applies any voltage to the first electrode of the memory block.

Abstract: An SRAM memory cell that has a relatively small power consumption when writing a write value of ‘0’ to the memory cell includes cross-coupled first and second inverters, at least one read access transistor for selectively coupling a respective read bit line to a common connection node of a respective one of the first and second inverters, a switching transistor for selectively coupling the second inverter to a ground terminal, and a write access transistor for selectively coupling the common connection node of the second inverter to a write bit line.

Abstract: The invention provides a semiconductor device capable of reducing wasteful power consumption. The semiconductor device of the invention does not require a refresh operation, and includes memory circuits for storing data, arranged in a matrix form, first signal lines for reading data from the memory circuits, second signal lines for transferring a signal that controls connection between the memory circuits and the first signal lines, a sense amplifier circuit for reading and determining data by detecting a potential change or a current change in the first signal lines, and a mitigating means for mitigating the potential change or the current change in the first signal lines during a period in which the sense amplifier circuit is being activated.

Abstract: A random access memory cell is described which is capable of storing multiple information states in a single physical bit. The basic structure combines a conventional MTJ with a reference stack that is magnetostatically coupled to the MTJ. The MTJ is read in the usual way but data is written and stored in the reference stack. Through use of two bit lines, the direction of magnetization of the free layer can be changed in small increments each unique direction representing a different information state.

Abstract: A method and system for providing a magnetic memory is described. The method and system include providing magnetic memory cells, local and global word lines, bit lines, and source lines. Each magnetic memory cell includes a magnetic element and a selection device connected with the magnetic element. The magnetic element is programmed by first and second write currents driven through the magnetic element in first and second directions. The local word lines are connected with the selection device of and have a first resistivity. Each global word line corresponds to a portion of the local word lines and has a resistivity lower than the first resistivity. The bit lines are connected with the magnetic element. The source lines are connected with the selection device. Each source line corresponds to a more than one of the magnetic memory cells and carries the first and second write currents.

Abstract: A semiconductor memory device, comprising: a memory cell array of a plurality of memory cell units, each memory cell unit including a plurality of serially connected memory cells formed on the same well region, each memory cell having a floating gate and a control gate stacked, said serially connected memory cells having one end serially connected to a first selection gate transistor, said serially connected memory cells having the other end connected to a common source line via a second selection gate transistor; a sense amp connected to one end of said first selection gate transistor via a bit line and operative to read data out of said memory cell array; and wherein a voltage applied to said well region and said source line varies to cancel a change of threshold of said memory cells depending on the temperature.

Abstract: A method, device, and system are disclosed. In one embodiment, the device comprises an array of flash memory blocks to store information in a multiple bit per cell mode, one or more flash memory blocks external to the array to store information in a single bit per cell mode, and a memory controller capable of allowing access to the array and the one or more flash memory blocks external to the array.

Abstract: An EPROM cell includes a semiconductor substrate, having source and drain regions, a floating gate, including a semiconductive polysilicon layer electrically interconnected with a first metal layer, and a control gate, including a second metal layer. The floating gate is disposed adjacent to the source and drain regions and separated from the semiconductor substrate by a first dielectric layer, and the second metal layer of the control gate is capacitively coupled to the first metal layer with a second dielectric layer therebetween.

Abstract: A method and apparatus are provided for high performance, high voltage memory operations on selected memory cells (200) of a semiconductor memory device (100). A high voltage generator (106) during program or erase operations provides a continuous high voltage level (702) on selected word lines (502) and maintains a continuous high voltage level supply to a bit line decoder (120) which sequentially provides the high voltage level (706) to a first portion of bit lines (504) and discharges (708) those bit lines (504) before providing the high voltage level to a second portion (710).

Abstract: A non-volatile memory package includes a non-volatile memory array having a plurality of transistors that are electrically coupled in series, each of the transistors having an input terminal and an output terminal such that the output terminal of one of the transistors is coupled to the input terminal of a next transistor in a downstream direction. A read voltage supply supplies a voltage to the input terminal of a selected transistor of the plurality of transistors, to induce a cell current between the input terminal and the output terminal of the selected transistor. A bit sensor receives and evaluates a read current from the output terminal of the selected transistor. A shielding voltage applicator applies a voltage to the input terminal or the output terminal of a downstream transistor of the plurality of transistors, the downstream transistor being in the downstream direction from the selected transistor.

Abstract: Non-volatile memory devices for providing selective compaction verification and/or selective compaction to facilitate a tightening of the distribution of threshold voltages in memory devices utilizing a NAND architecture. By providing for compaction verification and/or compaction on less than all word lines of a NAND string, increased tightening of the distribution may be achieved over prior methods performed concurrently on all word lines of a NAND string.

Abstract: A semiconductor device includes a memory cell array including a plurality of cores, each of said cores including one block or a plurality of blocks. The semiconductor device further includes a first power supply line which is provided commonly for said plurality of cores and which provides a data reading power supply potential; a second power supply line which is provided commonly for said plurality of cores and which provides a data writing or erasing power supply potential; and a power supply line switching circuit which is provided for each of said plurality of cores and which selectively connects a corresponding one of said plurality of cores to said first power supply line or said second power supply line in accordance with whether said corresponding one of said plurality of cores is in a data read mode or a data write or erase mode.

Abstract: A memory cell with a charge trapping structure is read by measuring current between the substrate region of the memory cell and one of the source region of the memory cell and the drain region of the memory cell. The read operation decreases the coupling between different parts of the charge trapping structure when other parts of the charge trapping structure store data that are not of interest. The sensing window of the memory cell can be greatly improved by this read operation.

Abstract: Aspects for programming a nonvolatile electronic device include performing an initial verify step of a programming algorithm with an initial type of reference voltage value, and performing one or more subsequent verify steps in the programming algorithm with a second type of reference voltage value. Further included is utilizing a read reference voltage for the initial verify step, wherein desired programming is ensured for a cell that falls out of ideal distribution.

Abstract: The location of a cell to be erase verified is determined. The erase verification threshold voltage is then set. The threshold voltage is changed in response to the cell's location with respect to array ground. A cell in the middle of a row of cells between array grounds is verified to a lower voltage than a cell that is closer to an array ground.

Abstract: A wordline voltage generation circuit generates an incremental step pulse voltage and includes a first circuit unit connected to a program voltage, a second circuit unit connected between the first circuit unit and a divided voltage and controlled by a program step code, and a third circuit unit connected between the divided voltage and a ground voltage. An increment of the program voltage is set according to a resistance of the third circuit unit without a change in the program step code. The first circuit unit is symmetrical in structure to the third circuit unit, and an increment of the program voltage is set by controlling a relationship between a resistance of the first circuit unit and a resistance of the third circuit unit, while maintaining a start program voltage or a target program voltage at a fixed value without a change in the program step code.

Abstract: A target memory cell of a memory device is programmed by applying a programming voltage to a word line that includes the target memory cell, determining whether the target memory cell is programmed, and increasing the programming voltage by a step voltage if it is determined that the target memory cell is not programmed. An initial programming voltage and the step voltage are each selectable after fabrication of the memory device.

Abstract: Erasure methods for a nonvolatile memory cell that includes a gate electrode on a substrate, source and drain regions in the substrate at respective sides of the gate electrode, and a charge storage layer interposed between the gate electrode and the substrate. A nonzero first voltage is applied to the source region starting at a first time. While continuing to apply the first nonzero voltage to the source region, a second voltage having an opposite polarity to the first voltage is applied to the gate electrode starting at a second time later than the first time. The second voltage may increase in magnitude, e.g., stepwise, linearly and/or along a curve, after the second time.

Abstract: A flash memory system including a flash memory device and a controller, operable according to an advanced data transfer mode is disclosed. The flash memory device is operable both in a “legacy” mode, in which read data is presented by the memory synchronously with each cycle of a read data strobe from the controller, and in which input data is latched by the memory synchronously with each cycle of a write data strobe from the controller. In the advanced mode, which can be initiated by the controller forwarding an initiation command to the memory, the flash memory itself sources the read data strobe, and presents data synchronously with both the falling and rising edges of that read data strobe. In the advanced mode, the input data is presented by the controller synchronously with both edges of the write data strobe. The voltage swing of the data and control signals is reduced from conventional standards, to reduce power consumption.

Abstract: A semiconductor integrated circuit device includes a plurality of sense amplifier line pairs, a plurality of sense amplifier latch circuits respectively connected to the sense amplifier line pairs, and a sense amplifier driver circuit which supplies a sense amplifier activation signal to the sense amplifier latch circuits. The sense amplifier driver circuit is provided for each of the plurality of sense amplifier latch circuits and supplies the sense amplifier activation signal to each of the plurality of sense amplifier latch circuits.

Abstract: A non-volatile memory device includes the ability to recover data in event of a program failure without having to maintain a copy of the data until the write is completed. As the integrity of the data can thus be maintained with having to save a copy, buffers can be freed up for other data or even eliminated, reducing the amount of controller space that needs to devoted data buffering. In exemplary embodiments, the data is recovered by logically combining the verify data for the (failed) write process maintained in data latches with the results of one or more read operations to reconstitute the data. The exemplary embodiments are for memory cells storing multi-state data, both in the format of independent upper page, lower page form, as well as in 2-bit form. This can be accomplished by a state machine and data latches in the sense amp area on the memory, without use of the controller.

Abstract: A semiconductor memory device formed on a semiconductor chip includes first memory arrays, a plurality of second memory arrays, a first voltage generator, and first bonding pads. The semiconductor chip is divided into first, second and third rectangle regions and the third rectangle region is arranged between the first rectangle region and the second rectangle region. The first memory arrays are formed in the first rectangle region. The second memory arrays are formed in the second rectangle region. The voltage generator and first bonding pads are arranged in the third rectangle region. The first bonding pads are arranged between the first rectangle region and the voltage generator and no bonding pads are arranged between the voltage generator and the second memory arrays.

Abstract: A write circuit of a semiconductor memory device includes a global data input/output (I/O) line; an amplifying block for receiving and amplifying write data and transmitting the amplified write data as global data onto the global data I/O line; and a control block for comparing the write data with the global data to thereby disable the amplifying block when the write data and the global data have substantially the same data value.

Abstract: A method and circuit for controlling an output reference voltage generated by a reference voltage generator disposed on a memory device are provided. A signal for enabling a clocked standby mode of the memory device is received. If the signal indicates that the memory device is in the clocked standby mode, a first reference voltage is generated as the output reference voltage of the reference voltage generator using a first voltage. If the signal indicates that the memory device is not in the clocked standby mode, a second reference voltage is generated as the output reference voltage of the reference voltage generator using a second voltage.

Abstract: A voltage generator circuit is described for providing a regulated voltage, such as a negative word line voltage in a semiconductor memory. The generator uses a source transistor to couple a substrate voltage, Vbb, to an output voltage node. The transistor is selectively activated by a current mirror circuit and using reference voltages. The reference voltages can be provided using a resistor divider circuit. Hysteresis is provided to maintain the output voltage in a predetermined voltage range.

Abstract: A circuit generates a qualified data read strobe signal from a start burst signal and a bidirectional data strobe signal in a DDR memory control module. The circuit includes a delay module that receives the start burst signal and that generates a delayed start burst signal. An enable signal generator receives the delayed start burst signal and generates an enable signal. A first circuit generates the qualified data read strobe signal based on the enable signal and the bidirectional data strobe signal.

Abstract: Maximized multi-state compaction and more tolerance in memory state behavior is achieved through a flexible, self-consistent and self-adapting mode of detection, covering a wide dynamic range. For high density multi-state encoding, this approach borders on full analog treatment, dictating analog techniques including A to D type conversion to reconstruct and process the data. In accordance with the teachings of this invention, the memory array is read with high fidelity, not to provide actual final digital data, but rather to provide raw data accurately reflecting the analog storage state, which information is sent to a memory controller for analysis and detection of the actual final digital data.

Abstract: A semiconductor wafer includes a plurality of semiconductor chip regions including ferroelectric memory devices, a test chip region, and a wiring that connects each of the plurality of semiconductor chip regions with the test chip region.

Abstract: A data storage circuit having a plurality of memory cells (S1), a plurality of bit lines (BL, /BL) and a precharge circuit further comprises a discharge circuit. In an operating mode of the data storage circuit, the bit lines (BL, /BL) are precharged by the precharge circuit under the control on the basis of a chip enable signal (CE) before write or read of data into/from the memory cells (S1) and in a standby state, the bit lines (BL, /BL) are discharged by the discharge circuit. Further, also in a sleep mode, the bit lines (BL, /BL) are discharged by the discharge circuit. With this circuit configuration and operation, it is possible to provide the data storage circuit which allows reduction in standby power consumption by suppressing standby currents in the standby state.

Abstract: A system and method for sensing a data state stored by a memory cell that includes coupling a first digit line and a second digit line to a precharge voltage and further coupling a memory cell to the first digit line. At least one digit line other than the first and second digit lines is driven to a reference voltage level and the at least one digit line is coupled to the second digit line to establish a reference voltage in the second digit line. A voltage differential is sensed between the first digit line and the second digit line, and a data state based on the voltage differential is latched in response.

Abstract: A sense amplifier capable of performing high-speed data sense operation with lower power consumption using a minuscule signal from a memory cell even in a case where a memory array voltage is reduced. A plurality of drive switches for over-driving are distributively arranged in a sense amplifier area, and a plurality of drive switches for restore operation are concentratively disposed at one end of a row of the sense amplifiers. A potential for over-driving is supplied using a meshed power line circuit. Through the use of the drive switches for over-driving, initial sense operation can be performed on data line pairs with a voltage having an amplitude larger than a data-line amplitude, allowing implementation of high-speed sense operation. The distributed arrangement of the drive switched for over-driving makes it possible to dispersively supply current in sense operation, thereby reducing a difference in sense voltage with respect to far and near positions of the sense amplifiers.

Abstract: A sense amplifier includes a pair of sense bit lines and first and second MOS sense amplifiers. The first MOS sense amplifier has a first pair of MOS transistors of first conductivity type therein, which are electrically coupled across the pair of sense bit lines. This electrically coupling is provided so that each of the first pair of MOS transistors has a first source/drain terminal electrically connected to a corresponding one of the pair of sense bit lines and the second source/drain terminals of the first pair of MOS transistors are electrically connected together. The first pair of MOS transistors of first conductivity type are configured to have different threshold voltages or support different threshold voltage biasing. The second MOS sense amplifier has a first pair of MOS transistors of second conductivity type therein, which are electrically coupled across the pair of sense bit lines.

Abstract: Methods and circuit configurations for refreshing data in a semiconductor memory device in which refresh operations are performed for a limited number of rows. The limited number of rows may include only those rows that contain valid data, for example, as determined by monitored write operations.