Abstract: Apparatus and systems that use phase-change memory devices are provided. The phase-change memory devices may include multiple phase-change memory cells and a reset pulse generation circuit configured to output multiple sequential reset pulses. Each sequential reset pulse is output to a corresponding one of multiple reset lines. Multiple write driver circuits are coupled to corresponding phase change memory cells and to a corresponding one of the reset lines of the reset pulse generation circuit.

Abstract: A phase-change memory for employing chalcogenide as a recording medium is disclosed, which prevents the read disturbance from being generated, and reads data at high speed. In a phase-change memory cell array including a selection transistor and chalcogenide, a substrate potential of the selection transistor is isolated in a direction perpendicular to the word lines. During the data recording, a forward current signal flows between the substrate and the source line connected to chalcogenide, and the selection transistor is not used. During the data reading, a desired cell is selected by the selection transistor. Therefore, a recording voltage is greatly higher than the reading voltage, such that the occurrence of read disturbance is prevented, and a high-speed operation is implemented.

Abstract: A memory device includes a bit line, a first word line, a bit line contact, an electrode, a second word line and a contact tip. The bit line may extend along a first direction. The first word line is formed over the bit line and extends in a second direction. The bit line contact is formed between adjacent first word lines. The bit line contact may have an upper face substantially higher than the first word lines. The electrode contacting with the bit line contact may include an elastic material bending by an electric field among the electrode, the first word line and the second word line. The second word line is disposed over the electrode and corresponds to at least one of the first word lines. The contact tip formed at a lateral portion of the electrode may protrude toward the first and the second word lines.

Abstract: The present invention provides a current injection-type magnetic domain wall-motion device which requires no external magnetic field for reversing the magnetization direction of a ferromagnetic body and which has low power consumption. The current injection-type magnetic domain wall-motion device includes a microjunction structure including two magnetic bodies (a first magnetic body 1 and a second magnetic body 2) having magnetization directions antiparallel to each other and a third magnetic body 3 sandwiched therebetween. The magnetization direction of the device is controlled in such a manner that a pulse current (a current density of 104-107 A/cm2) is applied across junction interfaces present in the microjunction structure such that a magnetic domain wall is moved by the interaction between the magnetic domain wall and the current in the same direction as that of the current or in the direction opposite to that of the current.

Abstract: Example embodiments may provide magnetic domain information storage devices with trenches and a method of manufacturing the information storage device. Example embodiment information storage devices may include a magnetic layer on a substrate having a plurality of magnetic domains and a power unit for moving magnetic domain walls. Magnetic layers may be parallel to the substrate, and a plurality of trenches in the magnetic layer may be perpendicular to the substrate. Portions of a lower surface of the magnetic layer corresponding to trenches may protrude downward.

Abstract: A method for operating memory used for enabling the memory device to have a first threshold voltage or a second threshold voltage is provided. The method includes the following procedures. First, an operating voltage is applied to a gate of the memory device for a first time period, such that the memory device has the first threshold voltage. Next, the same operating voltage is applied to the gate of the memory for a second time period, such that the memory device has a second threshold voltage. The duration of the first time period is different from the duration of the second time period.

Abstract: An electrically erasable/programmable CMOS logic memory cell for RFID applications and other mobile applications includes a tunneling capacitor, a control capacitor, and a CMOS inverter that share a single floating gate. A two-phase program/erase operation performs an initial Fowler-Nordheim (F-N) injection phase using the capacitors, and then a Band-to-Band Tunneling (BBT) phase using the CMOS inverter. Both the F-N injection and BBT phases are performed using low currents and low voltages (i.e., 5V or less). The tunneling and control capacitors are fabricated in isolated P-wells (IPWs) including both N+ and a P+ regions to enable the use of both positive and negative programming voltages during the F-N and BBT programming/erasing operations.

Abstract: A semiconductor memory device including a memory cell array with NAND cell units arranged therein, the NAND cell unit having a plurality of electrically rewritable and non-volatile memory cells connected in series, first and second select gate transistors disposed for coupling the both ends of the NAND cell unit to a bit line and a source line, respectively, and a dummy cell disposed adjacent to at least one of the first and second select gate transistors, wherein after erasing the memory cells in an erase unit, the memory cells excepting the dummy cell are subject to soft-program.

Abstract: A non-volatile memory system including an array of cells, each having an access transistor and a capacitor sharing a floating gate. The access transistors in each row are fabricated in separate well regions, which are independently biased. Within each row, the source of each access transistor is coupled to a corresponding virtual ground line, and each capacitor structure is coupled to a corresponding word line. Alternately, the source of each access transistor in a column is coupled to a corresponding virtual ground line. Within each column, the drain of each access transistor is coupled to a corresponding bit line. Select memory cells in each row are programmed by band-to-band tunneling. Bit line biasing prevents programming of non-selected cells of the row. Programming is prevented in non-selected rows by controlling the well region voltages of these rows. Sector erase operations are implemented by Fowler-Nordheim tunneling.

Abstract: A system is disclosed for reducing or removing a form of read disturb in a non-volatile storage device. One embodiment seeks to prevent read disturb by eliminating or minimizing boosting of the channel of the memory elements. For example, one implementation prevents or reduces boosting of the source side of the NAND string channel during a read process. Because the source side of the NAND string channel is not boosted, at least one form of read disturb is minimized or does not occur.

Abstract: Cells of a flash memory are read by determining respective adaptive reference voltages for the cells and comparing the cells' threshold voltages to their respective reference voltages. The adaptive reference voltages are determined either from analog measurements of the threshold voltages of the cells' neighbors or from preliminary estimates of the cells' threshold voltages based on comparisons of the cells' threshold voltages with integral or fractional reference voltages common to all the cells. Cells of a flash memory also are read by comparing the cells' threshold voltages to integral reference voltages, comparing the threshold voltages of cells that share a common bit pattern to a fractional reference voltage, and adjusting the reference voltages in accordance with the comparisons.

Abstract: A multi-level cell (MLC) memory device may include: a MLC memory cell; an outer encoder that encodes data using a first encoding scheme to generate an outer encoded bit stream; and a TCM modulator that applies a program pulse to the MLC memory cell to write the data in the MLC memory cell. The program pulse may be generated by TCM modulating the outer encoded bit stream. A method of storing data in a MLC memory device, reading data from the MLC memory device, or storing data in and reading data from the MLC memory device may include: encoding data using a first encoding scheme to generate an outer encoded bit stream; and applying a program pulse to a MLC memory cell of the MLC memory device to write the data in the MLC memory cell. The program pulse may be generated by TCM modulating the outer encoded bit stream.

Abstract: A Multi-Level Cell (MLC) memory device and method thereof are provided. The example MLC memory device may be configured to perform data operations, and may include an MLC memory cell, a first coding device performing a first coding function, the first coding function being one of an encoding function and a decoding function, a second coding device performing a second coding function, the second coding function being one of an encoding function and a decoding function and a signal module configured to perform at least one of instructing the MLC memory cell to store data output by the second coding device if the first and second coding functions are encoding functions, and generating a demapped bit stream based on data retrieved from the MLC memory cell if the first and second coding functions are decoding functions.

Abstract: A method for programming a flash memory device including a plurality of memory cells, each storing multi-bit data, includes reading data from selected memory cells. An error of the read data is detected and corrected. Input program data is programmed into the selected memory cells based upon the error-corrected read data.

Abstract: A method of programming a flash memory device may include dividing a plurality of memory cells into a plurality of groups according to a threshold voltage state, the memory cells configured to store multi bit data. The plurality of memory cells may be programmed with a program data. The memory cells of the divided groups may be respectively selected and programmed by divided group during the programming of the plurality of memory cells.

Abstract: A semiconductor device having a multi-bit nonvolatile memory cell is provided. The semiconductor device comprises a multi-bit nonvolatile memory unit cell sharing a source and a drain region and having a plurality of transistors. The plurality of transistors each comprise at least one control gate and at least one charge storage region. The charge storage regions are for accumulating charges within each of the plurality of transistors of the memory unit cell. Each of the control gatesare connected to at least one control voltage to shift a threshold voltage in each of the plurality of transistors for storing multi-bit per unit cell.

Abstract: A memory cell with a charge trapping structure is read by measuring current between the substrate region of the memory cell and one of the source region of the memory cell and the drain region of the memory cell. The read operation decreases the coupling between different parts of the charge trapping structure when other parts of the charge trapping structure store data that are not of interest. The sensing window of the memory cell can be greatly improved by this read operation.

Abstract: A memory has defective locations in its user portion replaceable by redundant locations in a redundant portion. Data latches in column circuits of user and redundant portions allow data sensed from or to be written to a memory to be exchanged with a data bus. A remote redundancy scheme has the redundant data available from a central buffer accessible by any number of column circuits. Redundant data buffer circuits enable bus exchange with data from the user data latches except for defective locations when data are taken from the central buffer. In this way only addressing for the user portion is used for bus exchange. Also, accessibility to the redundant data will not be restricted by the locations of the column circuits relative to the redundant data latches and the buffered redundant data can be accessed at a finer granularity than that imposed by the column circuits.

Abstract: A flash memory device is programmed by loading first data into a page buffer of a first mat. Second data is loaded into a page buffer of a second mat while programming the first data in a first memory block of the first mat.

Abstract: In a pattern layout which includes a first device pattern having a uniformly repeated pattern group having first lines and first spaces formed parallel to one anther and uniformly arranged with constant width at a constant pitch and a non-uniformly repeated pattern group having first lines and first spaces non-uniformly arranged, and a second device pattern arranged adjacent to the end portion of the non-uniformly repeated pattern group in an arrangement direction thereof and having second lines and second spaces whose widths are larger than the widths of the first lines and first spaces of the non-uniformly repeated pattern group, at least part of the widths of the first lines and the first spaces of the non-uniformly repeated pattern group is made larger than the width of the first line or the width of the first space of the uniformly repeated pattern group.

Abstract: A semiconductor memory device comprises a memory cell array of NAND cell units. The NAND cell unit includes a plurality of electrically erasable programmable nonvolatile memory cells connected serially, and a first and a second selection transistor provided to connect both ends of the memory cells to a bit line and a source line, respectively. The semiconductor memory device also comprises dummy cells inserted in the NAND cell unit adjacent to the first and second selection transistors, respectively. The dummy cells in the NAND cell unit are erased simultaneously with the memory cells under a weaker erase potential condition than that for the memory cells and set in a higher threshold distribution than an erased state of the memory cells.

Abstract: A system is disclosed for reducing or removing a form of read disturb in a non-volatile storage device. One embodiment seeks to prevent read disturb by eliminating or minimizing boosting of the channel of the memory elements. For example, one implementation prevents or reduces boosting of the source side of the NAND string channel during a read process. Because the source side of the NAND string channel is not boosted, at least one form of read disturb is minimized or does not occur.

Abstract: A system is disclosed for reducing or removing a form of read disturb in a non-volatile storage device. One embodiment seeks to prevent read disturb by eliminating or minimizing boosting of the channel of the memory elements. For example, one implementation prevents or reduces boosting of the source side of the NAND string channel during a read process. Because the source side of the NAND string channel is not boosted, at least one form of read disturb is minimized or does not occur.

Abstract: Program disturb is reduced in non-volatile storage by boosting unselected NAND strings in an array so that a source side channel, on a source side of a selected word line, is boosted before a drain side channel, on a drain side of the selected word line. In one approach, a first boost mode is used when the selected word line is a lower or intermediate word line. In the first boost mode, boosting of the source and drain side channels is initiated concurrently. A second boost mode is used when the selected word line is a higher word line. In the second boost mode, boosting of the source side channel occurs early relative to the boosting of the drain side channel. Either boost mode include an isolation voltage which tends to isolate the source and drain side channels from one another.

Abstract: Non-volatile storage with reduced program disturb is provided by boosting unselected NAND strings in an array so that a source side channel, on a source side of a selected word line, is boosted before a drain side channel, on a drain side of the selected word line. In one approach, a first boost mode is used when the selected word line is a lower or intermediate word line. In the first boost mode, boosting of the source and drain side channels is initiated concurrently. A second boost mode is used when the selected word line is a higher word line. In the second boost mode, boosting of the source side channel occurs early relative to the boosting of the drain side channel. Either boost mode include an isolation voltage which tends to isolate the source and drain side channels from one another.

Abstract: An embodiment of the present invention involves a method of programming a memory cell. The memory cell is in a first state having a maximum initial threshold voltage. The memory cell is to be programmed to one of a plurality of states having a higher target threshold voltage relative to the maximum initial threshold voltage. There is a cue voltage between the maximum initial threshold voltage and the target threshold voltage. The memory cell has a drain region. The method includes applying a drain voltage to the cell by a programming pulse having a first width, determining whether the cell has reached the cue threshold voltage, and if the cell has reached the cue threshold voltage, changing the programming pulse width from the first pulse width to a second pulse width. The second pulse width is smaller than the first pulse width.

Abstract: A power supply circuit outputs different set potentials in response to control signals, wherein a voltage detecting circuit changes levels of a first reference potential and a second reference potential in response to inputs of control signals, and a clock generating circuit increases a frequency of the frequency divided clock signal when the levels of the first reference potential and the second reference potential are greatly changed in response to the inputs of the control signals.

Abstract: A delay from the release of a low power consumption mode of nonvolatile memory to the restart of read operation is reduced. Nonvolatile memory which can electrically rewrite stored information has in well regions plural nonvolatile memory cell transistors having drain electrodes and source electrodes respectively coupled to bit lines and source lines and gate electrodes coupled to word lines and storing information based on a difference between threshold voltages to a word line select level in read operation, and the nonvolatile memory has a low power consumption mode. In the low power consumption mode, a second voltage lower than a circuit ground voltage and higher than a first negative voltage necessary for read operation is supplied to the well regions and word lines. When boost forming a rewriting negative voltage therein, a circuit node at a negative voltage is not the circuit ground voltage in the low power consumption mode.

Abstract: The invention relates to a circuit for reading a cell of a bit line, including first and second transistors for controlling the bit line and a reference line, respectively, a reference transistor connected to the second control transistor and a write transistor of the reference current connected to the first control transistor, for comparing the current of the bit line and the reference current, characterized in that a first intermediate transistor is connected to the write transistor parallel to the first control transistor, and in that a second intermediate transistor is connected between the gate and the drain of the reference transistor parallel to the second control transistor, and polarization transistors are connected in series, respectively, to the intermediate transistors so as to superimpose a current over the reference current.

Abstract: A system is disclosed for programming non-volatile storage that improves performance by setting the starting programming voltage to a first level for fresh parts and adjusting the starting programming voltage as the memory is cycled. For example, the system programs a set of non-volatile storage elements during a first period using an increasing program signal with a first initial value and subsequently programs the set of non-volatile storage elements during a second period using an increasing program signal with a second initial value, where the second period is subsequent to the first period and the second initial value is different than the first initial value.

Abstract: In a non-volatile memory system, the programming time period allocated for the program pulse is adjusted as a function of the voltage level of the pump pulse required so that the total number of pump pulses required to program the charge storage element to the required threshold voltage is reduced. For example, programming time period may be increased with an increase in the voltage level of the pump pulse required. This allows the programming time period of the program pulse to be increased to a value that compensates for the increased charge-up time that is required for the higher amplitude program pulses to reach the desired programming voltage.

Abstract: A method and apparatus for trimming a reference cell in a semiconductor memory device are provided. The method includes generating an internal bias current capable of being trimmed, and trimming the reference cell based on the internal bias current. The semiconductor memory device includes a reference cell in which a reference cell current flows between a drain and a source based on a bias voltage, an internal bias current generator configured to generate an internal bias current capable of being trimmed, and a trimming circuit configured to trim the reference cell based on the internal bias current.

Abstract: A semiconductor memory device which is highly reliable, is operable at a low voltage and a high speed, and is produced at a high production yield is provided. A nonvolatile semiconductor memory device capable of reading and erasing data and holding the data even while no voltage is supplied comprises a plurality of memory cells each including a plurality of local charge portions each capable of storing a static charge corresponding to the data. Either two of the local charge portions store the charges in a complementary state.

Abstract: Nonvolatile memory devices support programming and verify operations that improve threshold-voltage distribution within programmed memory cells. This improvement is achieved by reducing a magnitude of the programming voltage steps and increasing a duration of the verify operations once at least one of the plurality of memory cells undergoing programming has been verified as a “passed” memory cell. The nonvolatile memory device includes an array of nonvolatile memory cells and a control circuit, which is electrically coupled to the array of nonvolatile memory cells. The control circuit is configured to perform a plurality of memory programming operations (P) by driving a selected word line in the array with a first stair step sequence of program voltages having first step height (e.g.

Abstract: A method for programming a flash memory cell comprises providing input data to the flash cell and providing a segmented programming pulse to the flash memory cell. The segmented programming pulse includes programming segments, each successive programming segment including a programming potential higher than the programming potential used in a previous programming segment, each programming segment followed by a zero-potential compare segment. The output of the flash memory cell is compared with the input data during the compare segment after each programming segment. The segmented programming pulse is terminated if the output of the flash memory cell matches the input data. The programming potential in each programming segment is increased during the programming segment. The programming potential in successive segments is either is increased or stepped up to the final value of the previous programming segment.

Abstract: A non-volatile memory system including an array of cells, each having an access transistor and a capacitor sharing a floating gate. The access transistors in each row are fabricated in separate well regions, which are independently biased. Within each row, the source of each access transistor is coupled to a corresponding virtual ground line, and each capacitor structure is coupled to a corresponding word line. Alternately, the source of each access transistor in a column is coupled to a corresponding virtual ground line. Within each column, the drain of each access transistor is coupled to a corresponding bit line. Select memory cells in each row are programmed by band-to-band tunneling. Bit line biasing prevents programming of non-selected cells of the row. Programming is prevented in non-selected rows by controlling the well region voltages of these rows. Sector erase operations are implemented by Fowler-Nordheim tunneling.

Abstract: A non-volatile memory system including an array of cells, each having an access transistor and a capacitor sharing a floating gate. The access transistors in each row are fabricated in separate well regions, which are independently biased. Within each row, the source of each access transistor is coupled to a corresponding virtual ground line, and each capacitor structure is coupled to a corresponding word line. Alternately, the source of each access transistor in a column is coupled to a corresponding virtual ground line. Within each column, the drain of each access transistor is coupled to a corresponding bit line. Select memory cells in each row are programmed by band-to-band tunneling. Bit line biasing prevents programming of non-selected cells of the row. Programming is prevented in non-selected rows by controlling the well region voltages of these rows. Sector erase operations are implemented by Fowler-Nordheim tunneling.

Abstract: Embodiments of the present invention relate to configurable inputs and/or outputs for memory and memory stacking applications. More specifically, embodiments of the present invention include memory devices that include a die having a circuit configured for enablement by a particular signal, an input pin configured to receive the particular signal, and a path selector configured to selectively designate a signal path to the circuit from the input pin.

Abstract: This invention discloses a dual port static random access memory (SRAM) cell, which comprises at least one inverter coupled between a positive supply voltage (Vcc) and a complementary low supply voltage (Vss) and having an input and an output terminals, at least one PMOS transistor with its gate, source and drain connected to the output terminal, Vcc and input terminal, respectively, a write port connected to the input terminal and having a write-word-line, a write-enable and a write-bit-line, and a read port connected to either the input or output terminal and having a read-word-line and a read-bit-line.

Abstract: According to an image processing apparatus, if image data designated to be stored in a storage unit within the image processing apparatus is stored in a storage device outside the image processing apparatus, a memory remaining amount or the like of the image processing apparatus is calculated as if the image data is stored in a storage area within the image processing apparatus, although the image data is not moved to the storage area within the image processing apparatus.

Abstract: A data read circuit for a memory without a complex pre-charge circuit is provided. A diode is coupled between a pair of bit lines to replace the pre-charge circuit. A voltage drop caused by the diode is substantially half the operating voltage of the memory.

Abstract: A nonvolatile semiconductor memory device is provided which includes a memory array, a page buffer, and a row decoder. The memory array includes a plurality of nonvolatile memory cells, a bit line, and a word line, and the row decoder driven to control the word line of the memory array. The page buffer is electrically connected to the bit line and includes a main data latch and a sub-data latch. The page buffer, which is configured such that flipping of the man data latch is inhibited according to a logic state of the sub-data latch, further includes a main latch block, a sub-latch block, and a latch control block. The main latch block drives the main data latch and maps a logic state of the main data latch to a threshold voltage of a corresponding memory cell through the bit line. The sub-latch block drives the sub-data latch, where the sub-data latch is flipped depending on the voltage level of the bit line.

Abstract: One embodiment of the present invention includes a system for managing power of a memory array. The system comprises a comparator configured to compare a first voltage with a reference voltage. The first voltage can correspond to an operating voltage of at least one of a peripheral circuit associated with the memory array and a logic circuit configured to communicate with the peripheral circuit. The reference voltage can correspond to a minimum threshold voltage for read/write operations of the memory array. The system also comprises an output circuit configured to provide an output voltage to the memory array in response to an output of the comparator. The output voltage can be the greater of the operating voltage of the at least one of the peripheral circuit and the logic circuit and the minimum threshold voltage.

Abstract: An apparatus for generating a DBI signal in a semiconductor integrated circuit includes a full adder that includes data input terminals and a carry terminal, each of which receives data, performs an operation on the received data, and outputs a sum and a carry. A DBI determining unit determines a logic value of each of the data on the basis of the sum and the carry that are transmitted from the full adder, and generates a DBI signal.

Abstract: A semiconductor integrated circuit is disclosed, which includes a plurality of memory circuits in which defective columns are relievable, mounted on one chip, each of the memory circuits having a multi-bit structure, a plurality of comparison circuit which are connected to output sides of the respective memory circuits, and compare multi-bit memory data items output from the associated memory circuits with multi-bit expected data, a logic circuit which consolidates multi-bit comparison results output from the comparison circuits, a replacement analysis circuit which is shared between the memory circuits, performs replacement analysis by processing multi-bit data output from the logic circuit, and generates relief information to relief the memory circuits, and a nonvolatile storage circuit which stores the relief information, and performs relief for the memory circuits by using the relief information.

Abstract: A write circuit of a semiconductor memory device includes a global data input/output (I/O) line; an amplifying block for receiving and amplifying write data and transmitting the amplified write data as global data onto the global data I/O line; and a control block for comparing the write data with the global data to thereby disable the amplifying block when the write data and the global data have substantially the same data value.

Abstract: In one embodiment, an integrated circuit comprises at least one logic circuit supplied by a first supply voltage and at least one memory circuit coupled to the logic circuit and supplied by a second supply voltage. The memory circuit is configured to be read and written responsive to the logic circuit even if the first supply voltage is less than the second supply voltage during use. In another embodiment, a method comprises a logic circuit reading a memory cell, the logic circuit supplied by a first supply voltage; and the memory cell responding to the read using signals that are referenced to the first supply voltage, wherein the memory cell is supplied with a second supply voltage that is greater than the first supply voltage during use.

Abstract: A writing dynamic power control circuit is disclosed, which comprises a BL and its complementary BLB, at least one memory cell coupled to both the BL and BLB, a first NMOS transistor having a source, a drain and a gate coupled to the BL, the Vss and a first data signal, respectively, a second NMOS transistor having a source, a drain and a gate coupled to the BLB, the Vss and a second data signal, respectively, wherein the second data signal is complementary to the first data signal, a first PMOS transistor having a source, a drain and a gate coupled to a high voltage power supply (CVDD) node, the BLB and the BL, respectively, and a second PMOS transistor having a source, a drain and a gate coupled to the CVDD node, the BL and the BLB, respectively.

Abstract: A mechanism for reducing the amount of power or energy consumed by an SRAM array when the SRAM array is being accessed are provided. Logic is provided for determining the polarity of an incoming row being written to the SRAM cell array. Logic is further provided for storing a polarity value into an additional SRAM cell per row of the SRAM cell array. Logic is also provided for reading an inverted value of the SRAM cells of a row in the SRAM cell array if the row contains more 0's than 1's, as determined based on the polarity value stored in the additional SRAM cell per row. Logic is further provided for signaling to downstream logic whether the data read from the SRAM cells in the row represents the true data values or their complement, as determined based on the polarity value stored in the additional SRAM cell per row.

Abstract: Methods and apparatus provide for controlling an SRAM memory, the SRAM memory including a plurality of memory cells arranged in an array of rows (word lines) and columns (bit lines), comprising: inverting a state of data for input to one or more columns of the array; and storing the inverted data in one or more memory cells of the one or more columns.