Abstract: A stacked integrated circuit package-in-package system is provided forming a first integrated circuit package having a first peripheral contact, forming a second integrated circuit package having a second peripheral contact, stacking the second integrated circuit package on the first integrated circuit package in an offset configuration with the first peripheral contact exposed, the offset configuration provides a second package overhang with the second integrated circuit package above the first integrated circuit package, electrically connecting the first peripheral contact and a package substrate top contact, and electrically connecting the second peripheral contact and the package substrate top contact.

Abstract: A chip-on-film package may include a tape wiring substrate, a semiconductor chip mounted on the tape wiring substrate, and a molding compound provided between the semiconductor chip and the tape wiring substrate. The tape wiring substrate may include a film having upper and lower surfaces. Vias may penetrate the film. An upper metal layer may be provided on the upper surface of the film and include input terminal patterns and/or output terminal patterns. The input terminal patterns may include ground terminal patterns and/or power terminal patterns. A lower metal layer may be provided on the lower surface of the film and include a ground layer and/or a power layer. The ground layer and the power layer may cover at least a chip mounting area.

Abstract: A heat conductivity and brightness enhancing structure for light-emitting diode, including a bracket having a cathode leg support. A bowl structure is formed on upper end of the cathode leg support for resting a light-emitting chip therein. At least one depression is formed on a bottommost section of the bowl for receiving an adhesive therein. The depression has a diameter or area smaller than the bottom face of the chip. The adhesive is filled into the depression for adhering one or more chip. The other portions of the bottom face of the bowl, which contact with the chip is free from the adhesive and can achieve good heat conduction and radiation effect. At least one column hole is formed in the cathode leg support from a hollow section of the bottom of the bracket to the depression of the bowl. During manufacturing procedure, the adhesive can be heated, molten and exhausted from the column hole. The column hole serves as a passage for air convection, whereby the heat generated by the chip can be dissipated.

Abstract: A method of forming an electronic component package includes: forming electrically conductive traces for connecting first selected bond pads of a plurality of bond pads on a first surface of an electronic component to corresponding bonding locations formed on a second surface of the electronic component; coupling the first surface of the electronic component to a first surface of a lower dielectric strip; coupling the second surface of the electronic component to a first surface of an upper dielectric strip; forming lower via apertures through the lower dielectric strip to expose second selected bond pads of the plurality of bond pads on the first surface of the electronic component; forming upper via apertures through the upper dielectric strip to expose the bonding locations on the second surface of the electronic component; filling the lower and upper via apertures with an electrically conductive material to form lower and upper vias electrically coupled to the first and second selected bond pads of the pl

Abstract: A method and apparatus provide an integrated circuit package with improved heat dissipation and easier fabrication. The integrated circuit package includes a thinned semiconductor die attached to a heat spreader using a thermally conductive material. The thinned die reduces the thermal resistance of the die/heat spreader combination to improve heat extraction from the die as well as eliminating processing steps in fabrication. Additionally, the thinned die becomes more compliant as it takes on the thermal/mechanical properties of the heat spreader to reduce stress-induced cracking of the die.

Abstract: A method for forming a redistribution layer in a wafer structure, including (a) providing a wafer having a plurality of conductive structures and a first passivation layer thereon, wherein the first passivation layer covers the wafer except the conductive surfaces of the conductive structures; (b) forming a second passivation layer over the first passivation layer; (c) selectively removing part of the second passivation layer to form a plurality of grooves corresponding to a predetermined circuit; (d) forming a redistribution layer in the grooves; and (e) forming a third passivation layer over the second passivation layer and the redistribution layer. As a result, the redistribution layer is “embedded” in the second passivation layer so as to avoid the delamination of the redistribution layer.

Abstract: Copper diffusion barrier films having a boron-doped silicon carbide layer with at least 25% boron by atomic weight of the layer composition have advantages for semiconductor device integration schemes. The films have an integration worthy etch selectivity to carbon doped oxide of at least 10 to 1, can adhere to copper with an adhesion energy of at least 20 J/m2, and can maintain an effective dielectric constant of less than 4.5 in the presence of atmospheric moisture. The films are suitable for use in a wide range of VLSI and ULSI structures and devices.

Abstract: The present invention adds one or more thick layers of polymer dielectric and one or more layers of thick, wide metal lines on top of a finished semiconductor wafer, post-passivation. The thick, wide metal lines may be used for long signal paths and can also be used for power buses or power planes, clock distribution networks, critical signal, and re-distribution of I/O pads for flip chip applications. Photoresist defined electroplating, sputter/etch, or dual and triple damascene techniques are used for forming the metal lines and via fill.

Abstract: The present disclosure provides a method and system for heat dissipation in semiconductor devices. In one example, an integrated circuit semiconductor device includes a semiconductor substrate; one or more metallurgy layers connected to the semiconductor substrate, and each of the one or more metallurgy layers includes: one or more conductive lines; and one or more dummy structures between the one or more conductive lines and at least two of the one or more dummy structures are connected; and one or more dielectric layers between the one or more metallurgy layers.

Abstract: The present invention provides a semiconductor device capable of preventing occurrence of cracking and the like, taking a large area, where wiring and the like that function as elemental devices can be arranged, within a plurality of interlayer insulation films, and reducing production cost. The semiconductor device according to the present invention has a low dielectric constant film having a dielectric constant of not less than 2.7. In the low dielectric constant film and the like, materials (e.g., a first dummy pattern, a second dummy pattern) with a larger hardness than that of the low dielectric constant film are formed at a part under a pad part.

Abstract: An insulating film used for an interlayer insulating film of a semiconductor device and having a low dielectric constant. The insulating film comprises a carbon containing silicon oxide (SiOCH) film which has Si—CH2 bond therein. The proportion of Si—CH2 bond (1360 cm?1) to Si—CH3 bond (1270 cm?1) in the insulating film is preferably in a range from 0.03 to 0.05 measured as a peak height ratio of FTIR spectrum. The insulating film according to the present invention has higher ashing tolerance and improved adhesion to SiO2 film, when compared with the conventional SiOCH film which only has CH3 group.

Abstract: An improved under bump structure for use in semiconductor devices is described. The under bump structure includes a passivation layer having a plurality of vias. The vias are positioned such that a plurality of vias are associated with (i.e., located over) each contact pad. A metal layer fills the vias and forms a metallization pad that is suitable for supporting a solder bump. Preferably the metal layer extends over at least portions of the passivation layer to form a unified under bump metallization pad over the associated contact pad. Each metallization pad is electrically connected to the contact pad through a plurality of the vias. The described under bump structures can be formed at the wafer level.

Abstract: A stacked chip semiconductor device whose size is substantially reduced by high density packaging of two or more semiconductor chips. In the semiconductor device, four semiconductor chips are stacked over a printed wiring board. The bottom semiconductor chip has an interface circuit which includes a buffer and an electrostatic discharge protection circuit. All signals that these semiconductor chips receive and send are inputted or outputted through the interface circuit of the bottom semiconductor chip. Since the other semiconductor chips require no interface circuit, the semiconductor device is compact.

Abstract: In a connection structure of the present invention, the wiring board including a solder resist covering part which covers the wiring pattern with solder resist, the solder resist covering part having a solder resist opening or solder resist openings which expose(s) the wiring board connection terminals therethrough, and the solder resist opening or the solder resist openings surrounding at least one part of the solder resist covering part. Therefore, the wiring patterns are not unnecessarily exposed. That is, without disadvantageous contact between each wiring pattern and the semiconductor element, the semiconductor element can be mounted on the wiring board, and thus, the semiconductor device is reliable.

Abstract: A semiconductor device includes: a plurality of power MOS cells on a semiconductor substrate; a plurality of lead wires connecting to a source and a drain of each power MOS cell through a contact hole; a plurality of collecting electrodes connecting in parallel with the lead wires through a via hole; an interlayer protection film on the collecting electrode; a thick film electrode connecting to the collecting electrode through the opening; and a terminal protection film having an opening for bonding connection.

Abstract: A semiconductor device includes a semiconductor chip formed with connection terminals, an elastic structure interposed between a main surface of the chip and a wiring substrate formed with wirings connected at first ends thereof to the connection terminals, and bump electrodes connected to the other ends of the wirings. The connection terminals may be at a center part or in peripheral part(s) of the chip main surface and both the elastic structure and wiring substrate are not provided at locations of connection terminals. A resin body seals at least the connection terminals and the exposed first ends of wirings (leads). In a scheme in which the connection terminals are located in a peripheral part of the chip main surface, the wiring substrate protrudes beyond the chip boundary where the connection terminals are arranged, and the resin body shape is restricted by the protruding part of the wiring substrate.

Abstract: A semiconductor device comprising: a semiconductor element having a plurality of electrodes; a passivation film formed on the semiconductor element in a region avoiding at least a part of each of the electrodes; a conductive foil provided at a given spacing from the surface on which the passivation film is formed; an external electrodes formed on the conductive foil; intermediate layer formed between the passivation film and the conductive foil to support the conductive foil; and wires electrically connecting the electrodes to the conductive foil; wherein a depression tapered in a direction from the conductive foil to the passivation film if formed under a part of the conductive foil that includes the connection with the external electrodes.

Abstract: Techniques are described for reducing inductance in ball grid array (BGA) packages for integrated circuits (ICs). The BGA package comprises a set of contacts disposed near an outer edge of the BGA package that receives signal lines and isolated power and ground lines. One area of excess parasitic inductance within the BGA package is in the wire bonds that couple the set of contacts to the IC. The techniques described herein shorten the wire bonds in order to reduce the amount of parasitic inductance. The techniques include extending traces from a subset of the contacts inward into the BGA package toward the IC mounted. The wire bonds then couple the traces to the IC, thereby electrically coupling the subset of contacts to the IC. The presence of the traces substantially reduces lengths of the wire bonds relative to wire bonds that directly couple the set of contacts to the IC.

Abstract: Converters and method for intermittent forces energy conversion into electric power and damping excessive forces are presented. The converters employ various exemplified electromagnetic controllable transducers comprising multi-magnets inductors and multi-teeth armature, transforming sea wave's and wind's motion into electricity; base, impelling, and control means. The transducers are combinable with means translating the motion into linear, revolving, swinging movements. Transducer's cooling subsystems are exemplified. The base means are described, including fixed, floatable, and containing virtual vessels of variable parameters and expandable extensions. The impellers include floatable, fixed, adjustable. The control means include sensors measuring wave's and converter's parameters; control units adaptively regulating electric power production, and absorbing the excessively powerful waves' energy, depending on their changing parameters.

Abstract: Control features for a wind turbine that control the turbine over a range of wind speeds and under triggering conditions with reduced noise, cost, and reliability issues associated with other such controls. Control is accomplished via control electronics, which adjust the torque produced by the electrical output generation device (e.g., alternator) within the wind turbine. During normal operation, torque is adjusted for optimum aerodynamic performance and maximum output of power. In winds above rated power, the control circuit regulates torque to lower aerodynamic performance, as necessary to maintain desired power level output. In triggering conditions, such as during simultaneous control circuit failure and loss of some portion of the electrical output generation device in extreme winds, wind turbine control is accomplished by increasing torque (e.g., via a separate controller) from the electrical output generation device via shorting of windings, so as to cause retardation of blade rotation.

Abstract: A method for calculating a high-altitude power curve for a wind turbine is provided, the method including the steps of determining a cp-? curve for a predetermined blade pitch angle of said wind turbine; calculating a first power curve without power limit based on the cp-? curve; and calculating the high-altitude power curve with power limit from said first power curve, thereby using a site air density.

Abstract: An apparatus to correct the driving power of an actuator in a vehicle includes a comparator that compares a battery voltage of the vehicle with a predetermined reference voltage. A controller adjusts and outputs a duty ratio of a Pulse Width Modulation (PWM) signal according to the compared result of the battery voltage and reference voltage. A switching element is switched on and off by the PWM signal and outputs the battery voltage after a transformation. An actuator operates by receiving the transformed battery voltage through the switching element. The actuator operates at a constant speed regardless of the variation of the battery voltage.

Abstract: A security apparatus is installed in a vehicle including a door-lock control device for performing a door lock control on the basis of a signal transmitted from a portable transmitter, which a legitimate driver should take along. The security apparatus prevents a theft of the vehicle. The security apparatus includes a receiving circuit, an antenna, and a control circuit. The receiving circuit can receive the signal transmitted from the portable transmitter. The control circuit has a function of switching a security mode on the basis of a reception state of the receiving circuit and a member relating to the door lock control such as a door lock motor.

Abstract: A vehicle power bus control system including a control module having a communication interface and a device having a communication interface for communicating with the control module wherein the control module is adapted to transfer at least one electrical limit value to the device, and wherein the device is adapted to act in response to the electrical limit value to self-regulate an electrical quantity associated with the device.

Abstract: Electrical appliance energy consumption control methods and electrical energy consumption systems are described. In one aspect, an electrical appliance energy consumption control method includes providing an electrical appliance coupled with a power distribution system, receiving electrical energy within the appliance from the power distribution system, consuming the received electrical energy using a plurality of loads of the appliance, monitoring electrical energy of the power distribution system, and adjusting an amount of consumption of the received electrical energy via one of the loads of the appliance from an initial level of consumption to an other level of consumption different than the initial level of consumption responsive to the monitoring.

Abstract: A power switching module provides power to a line amplifier in a broadband telecommunications network. The switch includes a first input port for connection to a first power source, a second input port for connection to a second power source, an input/output port for connection to a cable connecting the line amplifier with a remote amplifier, and an output port for connection to the line amplifier. A controller controls selection of the power source and provides power to the line amplifier from one the input ports and can provide power to, or receive power from, a power supply associated with the remote amplifier via the input/output port. A switch allows selection of a primary mode of operation or a secondary mode of operation. Another switch allows selection of a first operating voltage range or a second voltage operating range. A monitoring circuit communicates status information about the switching module to a remote location.

Abstract: The present invention provides a power unit for conveyance, having a main power source and a standby power source. The power unit has a thermal battery provided as the standby power source. The conveyance is provided with an electronic control system and the power unit for conveyance of the present invention, and electric power for operating the electronic control system is supplied to the electronic control system from the power unit for conveyances. By employing such a thermal battery as the standby power source, the standby power source does not require to be charged, thereby ensuring a long-term reliability of the standby power source.

Abstract: A control circuit for a power supply circuit that selects an appropriate power source to continuously supply power. The control circuit includes a power synthesizing circuit for generating synthesized power by synthesizing a first power supplied from a regulator and a second power supplied from a regulator, or battery power and bus power, so that each circuit of the control circuit is operated by the synthesized power. Operation of the control circuit is enabled even if the supply of one power is stopped. The first switch device and the second switch device are controlled to select the appropriate power source in accordance with the currently supplied power so that power is continuously supplied.

Abstract: The present invention relates to combination control systems employing at least one intermediate module between different control modules and, in one embodiment, relates to a system for isolating a load from multiple power sources. The system includes a first power isolation system capable of receiving a first power from a first input port and determining whether the first power is communicated to a first output port, and a second power isolation system capable of receiving a second power from a second input port and determining whether the second power is communicated to a second output port. The system further includes an intermediate module connected with the first and second power isolation systems, where the intermediate module allows for at least one intermediate control signal to be provided to both of the power isolation systems.

Abstract: A high precision z-theta stage having a horizontal translation axis (z-axis) and a rotary axis (theta-axis) parallel with the translation axis comprises parallel spaced apart linear translation stages, a carriage supported between the parallel translation stages, and a rotation stage carried by the carriage between the parallel translation stages. Each brushless linear motor is connected to the carriage to apply translation forces in a horizontal plane intersecting the vertical center of gravity.

Abstract: A stage system for a lithographic apparatus is presented and includes a movable stage, and a stationary motor coil assembly including coils to interact with a magnet of the movable stage to thereby form a moving magnet motor to drive the stage. The stage system also includes a position measurement system to measure a position of the stage in a working area, the position measurement system to transfer a measurement beam along a measurement beam path which extends over a part of the motor coil assembly towards the stage. The coil assembly includes a coil assembly path between the motor coils to drive the motor, the coil assembly path extending below the measurement beam path. The stage may include a substrate stage or a reticle stage.

Abstract: A voice coil motor of the movable coil type comprising a stator including a permanent magnet. The stator produces a magnetic field. A movable element made of an armature coil is provided. The armature coil is formed into a coil-shape having a cavity portion. A reinforcing beam made of non-magnetic and highly rigid material is formed at a substantial center of the cavity portion.

Abstract: The subject invention provides a wheel assembly (20) having a spindle (26) for attachment to a vehicle along a rotational axis (R). An electric motor (22) is disposed radially about the spindle (26) and includes a stationary stator (34) and a rotor (36) rotatable about the rotational axis (R) relative to the stator (34). A rotor support (40) is disposed about the spindle (26) and includes a collar (42) rotatably supported by at least one rotor support bearing (46) on the spindle (26). The rotor support (40) includes a flange (44) disposed within a predetermined axial distance (D) and extending radially outward from the collar (42) to support the rotor (36). A planetary gear system (62) interconnects the rotor support (40) and a wheel drive (52) for reducing rotational speed of the rotor (36) and increasing the torque of the wheel assembly (20).

Abstract: An electric motor includes a motor enclosure, a motor-bearing assembly, a motor control unit, a mid shield, and a bearing. The motor-bearing assembly is configured for placement within the motor enclosure and has a shaft extending therefrom. A portion of the motor control unit is configured for placement within the motor enclosure. The mid shield is configured for placement within the motor enclosure between the motor control unit and the motor-bearing assembly and further configured to engage the shaft. The bearing is configured to seat within the mid shield and provide at least a portion of the engagement between the shaft and the mid shield.

Abstract: A motor includes a bearing receiving the shaft end of a rotor. a bearing holder provided with a through hole into which the bearing is inserted, a spring member which is disposed on one end side of the bearing holder and provided with a plate spring part which urges the bearing in the through hole toward the shaft end of the rotor shaft, four engaging recessed parts formed at four portions on an outer peripheral side face of the bearing holder, and four engaging pawl parts formed in the spring member. The spring member is mounted on the bearing holder such that the four engaging pawl parts engage with the four engaging recessed parts through the outer peripheral side face of the bearing holder.

Abstract: Bearing unit furnished with a bearing retaining part, the bearing retaining part formed from a single, seamless component and furnished with a cylindrical section disposed on the outer periphery of a sleeve of the bearing unit, and with a bottom section closing over the sleeve and the cylindrical section along their undersides. An attracting magnet is disposed on the bottom-section side of the bearing retainer, for magnetically attracting axis-wise the lower-end portion of a shaft of the bearing unit. A magnet holder, formed from a magnetic material, is disposed on the underside of the attracting magnet, with the magnet holder being attached to the bearing retainer.

Abstract: A mounting frame for an electric motor includes tabs projecting laterally from the mounting frame for mounting a stator of the electric motor to a mounting surface. Between the tabs, the mounting frame includes stop areas that define the position of the stator with respect to the mounting surface. In an electric motor having such a mounting frame, the frame is connected directly to the core stack of the stator of the electric motor.

Abstract: A brushless DC motor prevents disconnection of a magnetic flux and to minimize leakage of the magnetic flux, thereby reducing torque ripple. A plurality of magnetic flux-disconnection preventing holes are arranged in an outer periphery of a rotor core between installing holes into which magnets are fitted. The plurality of magnetic flux-disconnection preventing holes are symmetrical at both sides about a first line connecting a center of the rotor core to a center between the adjacent installing holes, and an angle between the first line and a second line connecting the center of the rotor core to an outermost end of the plurality of magnetic flux-disconnection preventing holes is about 15˜20°. A length between an outer periphery of the rotor core and an outer periphery of the plurality of magnetic flux-disconnection preventing holes is smaller than a gap between the rotor core and the stator.

Abstract: The invention relates to a brushless DC motor having an at least two-pole permanent magnet rotor and an at least two-pole stator whose poles carry an at least single-strand stator winding which can be energized with a current according to the rotor position by means of an electronic commutation device, there being a substantially uniform cylindrical air gap between the rotor and the stator. The rotor is characterized in that at least one stator pole, or a specially provided auxiliary pole having an auxiliary winding, is provided which is energized with a current to start up the motor. In accordance with a preferred embodiment of the invention, the auxiliary winding can additionally be used as a sensor winding to determine the position of the rotor.

Abstract: A two-phase switched reluctance motor in an embodiment includes a plurality of salient rotor poles that each have asymmetric reluctances about a central radial axis of the respective rotor pole. Each of the rotor poles has the same width, and the rotor poles are operable to provide preferential torque generation in one direction of rotation for all rotor positions. Such preferential torque generation occurs under the influence of an electromagnetic flux, which is provided by a plurality of salient stator poles having substantially the same width as the rotor poles.

Abstract: In a spindle motor in which teeth portions of a stator core formed by laminating magnetic plates are bent in order to increase the number of turns of the stator windings, a gap in the teeth portions between the magnetic plates is avoided and a precise attractive force adjustment becomes possible. The stator core is bent such that its teeth portions faces a surface of a rotor magnet at right angles, and the teeth portions and salient pole arm portions around which windings are wound are substantially parallel to each other. The salient pole arm portions locate approximately halfway between a lower surface of a hub and an upper surface of a base. Further, a thickness of a magnetic plate is set to be 0.5 to 0.9 times that of other portions.

Abstract: Of two bearings supporting a rotor of a circuit-integrated type core-equipped brushless motor, a part of an outer periphery of the bearing, which is disposed at a position near a stator core, is allowed to directly abut on an inner periphery of a hole formed in a center of the stator core, and therefore, reduction in thickness, reduction in diameter, space-saving and enhancement in output power can be realized. The stator core is fixed to the casing by causing projected parts provided at the housing to bite into second notched parts formed inside first notched parts formed at the stator core and crimping them, whereby the problem of a decrease in a winding space accompanying reduction in a diameter of the stator core is solved, and reduction in thickness, reduction in diameter, space-saving and enhancement in output power are achieved.

Abstract: A brush device for an electric machine having at least one brush and at least one element such as a helical, scroll, or plunger spring for pressing each brush against a rotating contact element, for example a commutator. In at least one further element for example a spring tab, counteracts a lifting of each brush away from the contact element. To this end, the spring tab is inclined at an angle, as a result of which it exerts a weaker action when the brush moves in the direction toward the contact element than it does counter to this direction. As a result, the brush can be repositioned, but is prevented from lifting away from the contact element. This also reduces the danger of vibrations.

Abstract: Provided is a rotating electrical machine including an armature core on which an armature winding is wound; a rotor core which is supported by a rotation axis at a predetermined air gap in an inner diameter side of the armature core, and includes claw-shaped magnetic pole portions in which adjacent magnetic poles have different poles and a cylindrical portion having a field winding; and a permanent magnet which is provided in a magnetic circuit of the rotor core and supplies magnetic flux to the armature core with the field winding, wherein a magnetic short-circuiting mechanism for demagnetizing the magnetic flux of the permanent magnet by deforming a portion of the magnetic short-circuiting mechanism by a centrifugal force and short-circuiting between the magnetic pole portions of the rotor core is provided in the rotor core.

Abstract: A tandem type rotary generator has a rotary shaft, and two power generating sections disposed adjacent to each other along an axial direction. Each power generating section has a Lundell type rotor core fixed to the rotary shaft, a field coil wound on the rotor core, a stator core disposed on an outside of the rotor core opposite to the rotary shaft in a radial direction, and a stator coil wound on the stator core. A center of the field coil of each power generating section is positioned away from a center of the stator core of the power generating section in the axial direction toward the other power generating section. Two cooling fans cooling the power generating sections are disposed on both sides of the pair of rotor cores in the axial direction.

Abstract: An alternating-current dynamoelectric machine according to the present invention includes: a stator including: a stator core in which slots that extend in an axial direction are formed on an inner side; and a stator winding that is mounted to the stator core by winding conducting wires into the slots; and a rotatable rotor including: a field winding that is disposed inside the stator; a rotor core constituted by a first pole core and a second pole core that each have claw-shaped magnetic poles that are disposed so as to cover the field winding and that alternately intermesh with each other; and first and second permanent magnets that are respectively disposed on two facing side surfaces of adjacent claw-shaped magnetic poles and that have magnetic fields that are oriented so as to reduce leakage of magnetic flux between the claw-shaped magnetic poles, and a magnetic body is disposed between a pair of the first and second permanent magnets.

Abstract: An actuator having a rotation central axis includes: an insulative frame; movable comb electrodes having first electrode teeth; a movable portion between the movable comb electrodes; supporting portions on the frame supporting the movable comb electrodes and the movable portion; fixed comb electrodes on the frame corresponding to the movable comb electrodes and provided with second electrode teeth; first elastic connecting portions connecting the movable comb electrodes to the supporting portions so each movable comb electrode can rotate around the rotation central axis; and second elastic connecting portions connecting the movable portion to the movable comb electrodes so that the movable portion can rotate around the rotation central axis. Each movable comb electrode is driven by an alternating voltage between each fixed comb electrode and movable comb electrode. Part of the first electrode teeth overlaps part of the second electrode teeth when no alternating voltage is applied.

Abstract: An actuator unit suitable for actuating a fuel injection valve of an injection system for internal combustion engines is comprised of a piezoelectric actuator and a hollow body embodied in the form of a spring. Embodying the hollow body according to the present invention can extend the service life of the actuator unit.

Abstract: Microelectromechanical systems with structures having piezoelectric actuators are described. The structures each have a body that supports piezoelectric islands. The piezoelectric islands have a first surface and a second opposite surface. The piezoelectric islands can be formed, in part, by forming cuts into a thick layer of piezoelectric material, attaching the cut piezoelectric layer to a body having etched features and grinding the piezoelectric layer to a thickness that is less than the depths of the cuts. Conductive material can be formed on the piezoelectric layer to form electrodes.

Abstract: A microelectromechanical system (MEMS) device comprises a substrate; an anchored end connected to the substrate; a free end comprising an end effector opposite to the anchored end; a spring attached to the end effector; multiple actuation beams; multiple connection beams adapted to connect the multiple actuation beams to one another; and an actuator/sensor comprising a first electrode; a piezoelectric layer over the first electrode; and a set of second electrodes over the piezoelectric layer, wherein the set of second electrodes being defined by a transverse gap therebetween. Each of the multiple actuation beams comprises two sets of the second electrodes. The set of second electrodes comprise an extensional electrode and a contraction electrode. One of the sets of second electrodes is actuated asymmetrically with respect to a first plane resulting in a piezoelectrically induced bending moment arm in a lateral direction that lies in a second plane.