Patents Issued in September 25, 2008
  • Publication number: 20080230919
    Abstract: A dual damascene structure with improved profiles and reduced defects and method of forming the same, the method including forming a first dielectric over a conductive area; forming a first dielectric insulator over the first dielectric; forming a first opening in the first dielectric insulator; lining the opening with a second dielectric; forming a second dielectric insulator over the first dielectric insulator; forming a second opening in the second dielectric insulator overlying and communicating with the first opening; and, filling the first and second openings with a conductive material to electrically communicate with the conductive area.
    Type: Application
    Filed: May 27, 2008
    Publication date: September 25, 2008
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Uway Tseng, Alex Huang, Kun-Szu Liu
  • Publication number: 20080230920
    Abstract: A semiconductor component comprising a semiconductor chip (2) made of a doped silicon substrate, which chip is doped into a semiconductor device and structured, and comprises an inner connection metallization (7) in a contact window, and said inner connection metallization of said semiconductor chip is connected to the respective outer connection metallization by a wire bond connection (9), characterized in that the inner connection metallization comprises a reinforcing system (8) having an open grid structure on the doped silicon substrate.
    Type: Application
    Filed: December 1, 2004
    Publication date: September 25, 2008
    Inventor: Jorg Behrens
  • Publication number: 20080230921
    Abstract: A semiconductor device includes a first semiconductor chip; a multilayer wiring which is formed on the first semiconductor chip and which is connected to the first semiconductor chip; a second semiconductor chip connected to the first semiconductor chip by way of the multilayer wiring; a sealing material which seals the second semiconductor chip; and projecting plugs which are connected to the multilayer wiring and whose extremities become exposed on the sealing material.
    Type: Application
    Filed: October 2, 2007
    Publication date: September 25, 2008
    Inventor: Takaharu Yamano
  • Publication number: 20080230922
    Abstract: A technique for mounting a plurality of electronic parts on one surface of a wiring substrate is provided.
    Type: Application
    Filed: February 15, 2008
    Publication date: September 25, 2008
    Inventors: Chihiro Mochizuki, Hiroshi Kikuchi
  • Publication number: 20080230923
    Abstract: A chip stack package includes a substrate, a plurality of chips, a plurality of adhesive layers and a plug. The substrate has a wiring pattern and a seed layer formed on the wiring pattern. Each of the chips has an electrode pad and a first through-hole that penetrates the electrode pad. The chips are stacked such that the first through-holes are aligned on the seed layer of the substrate. The adhesive layers are interposed between the substrate and one of the chips, as well as between the chips. Each of the adhesive layers has a second through-hole connected to the first through-hole. The plug fills up the first through-holes and the second through-holes and electrically connects the electrode pads to the wiring pattern of the substrate. A cross-sectional area of the plug in the second through-holes may be larger than that of the plug in the first through-holes.
    Type: Application
    Filed: March 19, 2008
    Publication date: September 25, 2008
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Cha-Jea JO, Myung-Kee CHUNG, Nam-Seog KIM, In-Young LEE, Seok-Ho KIM, Ho-Jin LEE, Ju-Il CHOI, Chang-Woo SHIN
  • Publication number: 20080230924
    Abstract: A semiconductor package includes a substrate for mounting and fixing a semiconductor chip thereon and a connecting pattern. The substrate is provided with an elongate opening formed therein. The semiconductor chip is fixed with its surface being mounted on the substrate and with its electrode being aligned within the elongate opening. The electrode of the semiconductor chip is electrically connected to the connecting pattern via wires through the elongate opening. The elongate opening and the wires are sealed with resin.
    Type: Application
    Filed: March 28, 2008
    Publication date: September 25, 2008
    Applicant: OKI ELECTRIC INDUSTRY CO., LTD.
    Inventor: Takaaki Sasaki
  • Publication number: 20080230925
    Abstract: A method for solder bumping provides a substrate and forms a film on the substrate. The film has openings therethrough. A stencil is aligned on the film. The stencil has openings therethrough over the openings through the film. Solder paste is printed onto the substrate and into the openings through the stencil and the openings through the film. The solder paste is reflowed to form solder balls therefrom. The stencil and the film are then removed.
    Type: Application
    Filed: June 4, 2008
    Publication date: September 25, 2008
    Inventors: Byung Tai Do, Romeo Emmanuel P. Alvarez, Yaojian Lin
  • Publication number: 20080230926
    Abstract: An inorganic solder mask (48) for use as a surface treatment in masking a connection conductor (32) of a semi-conductor chip package (10) against solder wetting when mounting the chip package (10) to a printed wiring board (50) or other substrate. The connection conductor (32) is partially covered by a metallization contact (42) formed from a distinct metal. The inorganic solder mask (46) is applied to an exposed portion (44) of the connection conductor (32) not covered by the metallization contact (42). The metallization contact (42) is not coated by the inorganic solder mask (46). The presence of the inorganic solder mask (46) significantly reduces or prevents wetting of the exposed portion (44) when molten solder is present on the connection conductor (32) without affecting the solidified solder layer (48) formed on the metallization contact (42). As a result, an extraneous mass of solder does not solidify on the exposed portion (44) of the connection conductor (32).
    Type: Application
    Filed: November 3, 2006
    Publication date: September 25, 2008
    Applicant: NXP B.V.
    Inventors: Paul Dijkstra, Hans Van Rijckevorsel, Roelf Groenhuis
  • Publication number: 20080230927
    Abstract: Methods and apparatus for producing fully tested unsingulated integrated circuits without probe scrub damage to bond pads includes forming a wafer/wafer translator pair removably attached to each other wherein the wafer translator includes contact structures formed from a soft crushable electrically conductive material and these contact structures are brought into contact with the bond pads in the presence of an inert gas; and subsequently a vacuum is drawn between the wafer and the wafer translator. In one aspect of the present invention, the unsingulated integrated circuits are exercised by a plurality of test systems wherein the bond pads are never physically touched by the test system and electrical access to the wafer is only provided through the inquiry-side of the wafer translator. In a further aspect of the present invention, known good die having bond pads without probe scrub marks are provided for incorporation into products.
    Type: Application
    Filed: March 24, 2008
    Publication date: September 25, 2008
    Inventors: Morgan T. Johnson, Raymond J. Werner
  • Publication number: 20080230928
    Abstract: A module includes a semiconductor chip having at least a first terminal contact surface and a second terminal contact surface. A first bond element made of a material on the basis of Cu is attached to the first terminal contact surface, and a second bond element is attached to the second terminal contact surface. The second bond element is made of a material different from the material of the first bond element or is made of a type of bond element different from the type of the first bond element.
    Type: Application
    Filed: March 20, 2007
    Publication date: September 25, 2008
    Inventors: Ralf Otremba, Xaver Schloegel, Khai Huat Jeffrey Low, Chee Soon Law
  • Publication number: 20080230929
    Abstract: Provided are an overlay mark of a semiconductor device and a semiconductor device including the overlay mark. The overlay mark includes: reference marks formed in rectangular shapes comprising sides in which fine patterns are formed; and comparison marks formed as rectangular shapes which are smaller than the rectangular shapes of the reference marks and formed of fine patterns, wherein the number of comparison marks is equal to the number of reference marks, wherein the reference marks and the comparison marks are formed on different thin films formed on a semiconductor substrate to be used to inspect alignment states of the different thin films, and the overlay mark reflects an effect of aberration of patterns of memory cells through the fine patterns during a calculation of MR (mis-registration).
    Type: Application
    Filed: March 5, 2008
    Publication date: September 25, 2008
    Inventors: Jang-ho Shin, Chan-hoon Park, Jung-Hyeon Lee, Suk-joo Lee, Hyun-tae Kang, Jeong-hee Cho, Young-hoon Song
  • Publication number: 20080230930
    Abstract: An intake air amount controlling apparatus of an engine is provided. The apparatus comprises an intake manifold that is branched from an intake manifold collecting portion of the engine. The intake manifold communicates with an intake port of a cylinder head of a corresponding cylinder. The apparatus further comprises a throttle valve in the intake manifold of the cylinder and a throttle bore provided in the intake manifold. The throttle bore has a curved surface. The throttle valve rotates such that one half of the throttle valve contacts with the curved surface of the throttle bore until the throttle valve reaches a predetermined opening degree. Thus, an air flow via the one half of the throttle valve is prevented from entering the intake port. An air flow via the other half of the throttle valve is allowed to enter the intake port.
    Type: Application
    Filed: March 21, 2008
    Publication date: September 25, 2008
    Applicant: Honda Motor Co., Ltd.
    Inventors: Shusuke AKAZAKI, Yuji YAMAMOTO
  • Publication number: 20080230931
    Abstract: The object of the invention is a process for molding an optical element such as a lens (2). According to the invention, the element is obtained by a reaction injection molding process comprising the steps of mixing at least two polymerizing reactants and forcing the obtained reacting mixture by an injection duct (5) for filling under pressure a scaled mold cavity (4) having an entry side (43) provided with a casting opening (42) and an evacuation side (44) and providing a laminated flow of mixture in a spout (6) having a progressive enlarging transversal section between the outlet opening (52) of the injection duct (5) and the casting opening (42) of the mold cavity (4), for avoiding any turbulent area in said laminated flow, said evacuation side (44) being provided with means (45) for evacuating air contained in the mixture during mold filling. The invention also covers the molding installation adapted for using such a process.
    Type: Application
    Filed: February 25, 2005
    Publication date: September 25, 2008
    Applicant: INSTITUT NATIONAL DES SCIENCES APPLIQUEES (INSA)
    Inventors: Noemie Lesartre, Jerome Dupuy, Abderrahim Maazouz, Jean-Pierre Pascault
  • Publication number: 20080230932
    Abstract: There is provided a molding apparatus and a molding method for optical elements, which are capable of conveying respective molds to respective correct positions. In a molding apparatus for optical elements, comprising a heating section, a press-molding section and a cooling section on a conveying path, a plurality of successive molds being simultaneously slid and conveyed on the conveying path in a conveying direction, and comprising conveying arms for pushing rear sides of the respective molds in the conveying direction to move the molds forward, the conveying arms pushing the rear sides of the respective molds at front sides thereof to transfer the respective molds by a distance; each of the conveying arms has a positioning recessed portion formed at a rear part thereof, whereby each of the conveying arms is moved backward to correct the position of the mold therebehind after having transferred the molds by such a distance.
    Type: Application
    Filed: May 29, 2008
    Publication date: September 25, 2008
    Applicant: ASAHI GLASS COMPANY LIMITED
    Inventor: Shinji TANAKA
  • Publication number: 20080230933
    Abstract: The present invention provides an optical element capable of improving the adhesive property between a refractive index anisotropic layer and an alignment property providing layer for. providing alignment property to the refractive index anisotropic layer and further improving the endurance of each of the layers. An optical element 10 has an alignment property providing layer 12 laminated on a transparent base material 11 and a refractive index anisotropic layer 13 laminated on the layer 12. The layer 12 is an alignment layer having alignment limiting force for providing alignment property to the layer 13, and is made of an alignment layer composition capable of expressing the alignment limiting force. The layer 13 is a liquid crystal layer formed by curing (polymerizing) a liquid crystal composition comprising a polymerizable liquid crystal material. A monomer or oligomer having one or more functional groups, together with a polymer, is incorporated into the alignment layer composition.
    Type: Application
    Filed: April 28, 2008
    Publication date: September 25, 2008
    Inventors: Keiko TAZAKI, Runa NAKAMURA
  • Publication number: 20080230934
    Abstract: A method for manufacturing a wafer scale package including at least one substrate having replicated optical elements. The method uses two substrates, at least one of which is pre-shaped and has at least one recess in its front surface. Optical elements are replicated on a first substrate by causing a replication tool to abut the first substrate. The second substrate is then attached to the first substrate in an abutting relationship in such a way that the optical element is contained in a cavity formed by the recess in one of the substrates in combination with the other substrate. Thereby, a well defined axial distance between the optical elements and the second substrate is achieved. Consequently, well defined axial distance between the optical elements and any other objects attached to the second substrate, e.g. further optical elements, image capturing devices, light sources, is also established.
    Type: Application
    Filed: March 23, 2007
    Publication date: September 25, 2008
    Applicant: HEPTAGON OY
    Inventors: Hartmut Rudmann, Stephan Heimgartner, Markus Rossi
  • Publication number: 20080230935
    Abstract: Methods to produce a pitch foam from a hydrocarbon carbonaceous precursor material. A gaseous blowing material is dissolved in the carbonaceous precursor material, and the resultant solution is pressurized in a vessel. As the solution is exhausted from the vessel, the gaseous blowing agent and the hydrocarbons of the carbonaceous precursor material evaporate from the pressurized solution to form a foam-like solution. The pitch foam is formed from the foam-like solution by directing the foam-like solution onto a surface, whereupon, the foam-like solution solidifies into the pitch foam.
    Type: Application
    Filed: August 1, 2007
    Publication date: September 25, 2008
    Inventors: Elliot B. Kennel, Alfred H. Stiller, Joseph Stoffa, Mark E. Heavner
  • Publication number: 20080230936
    Abstract: Disclosed herein is a membrane electrode assembly with a superior power generating efficiency and a method of manufacturing the same. Also disclosed is a manufacturing apparatus thereof wherein a gasket with an optimum thickness can be easily applied to the membrane electrode assembly without preparing various types of gaskets. A method of manufacturing the membrane electrode assembly with catalytic layers and gas diffusion layers on surfaces of the electrolyte membrane comprises controlling a molding thickness according to thicknesses of the catalytic layers and the gas diffusion layers and integrally molding the gasket portions formed with resin materials on at least one surface of the electrolyte membrane.
    Type: Application
    Filed: March 13, 2008
    Publication date: September 25, 2008
    Applicant: NISSAN MOTOR CO., LTD.
    Inventor: Kazuyoshi Takada
  • Publication number: 20080230937
    Abstract: A method for controlling the injection moulding process of an injection moulding machine with an injection moulding tool that forms at least one cavity for a moulded part to be produced, wherein a melt is introduced into the cavity by an incision. The temporal progression of the temperature of the mould wall is determined and controlled in the course of the injection moulding process.
    Type: Application
    Filed: June 2, 2006
    Publication date: September 25, 2008
    Applicant: PRIAMUS SYSTEM TECHNOLOGIES AG
    Inventor: Chistopherus Bader
  • Publication number: 20080230938
    Abstract: The invention relates to moldings, comprising a composite layered sheet or composite layered film, reverse-coated with a backing layer of plastic applied by an injection-molding, foaming, casting, or compression-molding method, where the composite layered sheet or composite layered film comprises (1) a substrate layer comprising, based on the total of the amounts of components A and B, and, if appropriate, C and/or D, which give 100% by weight in total, a from 1 to 99% by weight of an elastomeric graft copolymer as component A, b from 1 to 99% by weight of one or more hard copolymers containing units which derive from vinylaromatic monomers, as component B, c from 0 to 80% by weight of polycarbonates, as component C, and d from 0 to 50% by weight of fibrous or particulate fillers, or a mixture of these, as component D, and (3) a top layer composed of aliphatic thermoplastic polyurethane.
    Type: Application
    Filed: January 27, 2005
    Publication date: September 25, 2008
    Applicant: BASF Aktiengesellschaft
    Inventors: Achim Grefenstein, Steffen Funkhauser, Herbert Fisch, Norbert Effen
  • Publication number: 20080230939
    Abstract: A method of making a composite support structure and sander includes the steps of providing a rigid plate adjacent a mold such that a polyfoam layer can be formed to a front surface thereof which includes a wall defining a contained surface, the plate having a back surface for connection to a handle and introducing into the mold fluid components which react to form a polyfoam which is reaction bonded to the front surface of the rigid plate such that a back surface of the polyfoam layer forms within the contained surface and about the wall in a complementary manner thereto and a front surface of the polyfoam layer extends outward from the front surface of the rigid plate and is formed to have a relatively planar surface thereby rendering the composite support structure for removably connecting sandpaper to the relatively planar surface of the polyfoam layer.
    Type: Application
    Filed: June 4, 2008
    Publication date: September 25, 2008
    Inventors: Terry Ali, Christopher Ali
  • Publication number: 20080230940
    Abstract: The production of moulded bodies from hard-metal powders by pressing and simultaneous or subsequent heat treatment is known. The mixture of hard material powders and aluminium powders for producing dry-pressed moulded bodies is an example thereof. As a result of the risk of demixing and the loss of homogeneity, the upper limit, for example according to prior art, for the proportion of hard material particles added to the aluminium powder is approximately 20 vol. %. The aim of the invention is to increase the proportion of hard material particles it the mixture. To this end, the inventive method for producing metal ceramic composite materials is characterised by dry-pressing powders with base compositions of between 25 and 79 vol. % of at least one metallic phase, preferably aluminium and the alloys thereof, and between 75 and 21 vol. % of at least one non-metallic inorganic constitnent, as ceramic materials, preferably silicon carbides, aluminium oxides, titanium oxides, carbon and silicates.
    Type: Application
    Filed: May 12, 2005
    Publication date: September 25, 2008
    Applicant: CERAMTEC AG INNOVATIVE CERAMIC ENGINEERING
    Inventors: Gerd Meier, Ilka Lenke
  • Publication number: 20080230941
    Abstract: A process for printing an image on a surface of a resin member includes (a) providing a transfer medium with an image on one side of the transfer medium, (b) providing a liquid resin, (c) placing the one side of the transfer medium with the image and the liquid resin in contact with each other, and (d) partially curing the liquid resin to form the resin member while maintaining the image of the transfer medium in contact with an image side of the resin member. The process may include placing the liquid resin and/or the transfer medium in a mold for shaping the resin member during curing.
    Type: Application
    Filed: March 21, 2007
    Publication date: September 25, 2008
    Inventors: Kirk D. Williamson, Doug E. Thompson
  • Publication number: 20080230942
    Abstract: Provided are, among other things, systems, methods and techniques for manufacturing sheet material. In one representative embodiment, a sheet of fabric material is positioned across a patterning template that has a number of openings; and the sheet of fabric material and the patterning template are fed through an extrusion device in which extrusion material coats the fabric material and forces the fabric material into the openings in the patterning template, thereby producing a composite sheet material.
    Type: Application
    Filed: March 18, 2008
    Publication date: September 25, 2008
    Inventor: John C. S. Koo
  • Publication number: 20080230943
    Abstract: A method and associated apparatus for melt extruding a nonwoven web includes providing a plurality of fibers from an extrusion device. The fibers are conveyed through a diverging profile portion of a fiber drawing unit (FDU) that causes the fibers to spread and expand in the machine direction within the FDU. The fibers are then conveyed through a diverging diffusion chamber spaced from the outlet of the FDU to reduce the velocity of the fibers and further spread the fibers in the machine direction. The fibers may be subjected to an applied electrostatic charge in either the diffusion chamber or the FDU. From the outlet of the diffusion chamber, the fibers are laid onto a forming surface as a nonwoven web.
    Type: Application
    Filed: March 19, 2007
    Publication date: September 25, 2008
    Inventors: John H. Conrad, Eric E. Lennon, Douglas J. Hulslander, Joerg Hendrix, Detlef Frey
  • Publication number: 20080230944
    Abstract: A dope is cast onto a drum. A casting film is cooled and solidified by the drum. The casting film is peeled as a film containing a solvent. The peeled film is guided to a tenter. In the tenter, in a first drying step, the film is dried by dry air from an air duct while being stretched in the width direction in a state that side edge portions of the film are held by pins. Thereafter, in a second drying step, the film is dried while tension is applied to the film in the width direction. A first ratio calculated by (a moving speed of the pins)/(a rotation speed of the drum), a second ratio calculated by L2/L1, and a third ratio calculated by L3/L2 satisfy 0.94?(the first ratio)/{(the second ratio)·(the third ratio)}?0.97.
    Type: Application
    Filed: March 18, 2008
    Publication date: September 25, 2008
    Applicant: FUJIFILM Corporation
    Inventors: Toshinao ARAI, Hiroaki SATA, Takahiro MOTO, Akihiro IKEYAMA
  • Publication number: 20080230945
    Abstract: A casting die includes lip plates and inner deckle plates, each of which has a contact face. The contact faces form an outlet of the casing die. A distance between a ridge of the lip plate and that of the inner deckle plate is at most 9 ?m. Further, nozzles are disposed so as to be close to the outlet. A periphery of a support runs at more than 50 m/min. A casting dope is discharged from the outlet to the support, so as to form a dope bead between the outlet and the periphery. A decompression chamber decompresses in a rear face side from the dope bead.
    Type: Application
    Filed: March 19, 2008
    Publication date: September 25, 2008
    Applicant: FUJIFILM CORPORATION
    Inventors: Daisaku ABIRU, Ryou TAKEDA
  • Publication number: 20080230946
    Abstract: A primary dope containing a polymer, a solvent and an additive is fed to a filtration device in a filtrating unit. The filtration device includes a filter on which a deposit layer of a filtration aid is formed, and impurities in the primary dope are adsorbed to the deposit layer. After the filtration, a residue containing the impurities and the filtration aid on the filter, and the filtration device is filled a cleaning liquid. Then a stirrer in the filtration device is stirred so as to disperse the residue to the cleaning liquid. Thus a slurry liquid is obtained and fed to a separation device. In the separation device, the slurry liquid is fed into a strainer to separate the slurry liquid to the residue and the liquid material. The residue is dried in a drying device and the solvent vapor is recovered.
    Type: Application
    Filed: March 22, 2008
    Publication date: September 25, 2008
    Applicant: FUJIFILM CORPORATION
    Inventors: Takuro NISHIMURA, Takashi SASAKI, Ryutaro KEMMOTSU, Hidekazu YAMAZAKI
  • Publication number: 20080230947
    Abstract: In accordance with the invention, an article comprising a nanoscale surface pattern, such as a grating, is provided with a nanoscale patterns of reduced edge and/or sidewall roughness. Smooth featured articles, can be fabricated by nanoimprint lithography using a mold having sloped profile molding features. Another approach uses a mold especially fabricated to provide smooth sidewalls of reduced roughness, and a third approach adds a post-imprint smoothing step. These approaches can be utilized individually or in various combinations to make the novel articles.
    Type: Application
    Filed: February 20, 2008
    Publication date: September 25, 2008
    Applicant: PRINCETON UNIVERSITY
    Inventors: Stephen Y. Chou, Zhaoning Yu, Wei Wu
  • Publication number: 20080230948
    Abstract: A heat staking method and apparatus is provided for use in deforming a heat-stake so that it becomes mechanically coupled to an encapsulate. The deformed portion of the heat-stake contacts a retention component that provides additional composition strength and fastening surface to the encapsulate.
    Type: Application
    Filed: December 26, 2007
    Publication date: September 25, 2008
    Inventors: Christopher Salvador, Oscar Caraan, Brock Stull, Takuji Ohara, Stewart Rich
  • Publication number: 20080230949
    Abstract: A method for molding color-coated plastic parts is disclosed. The method includes a technique for applying a color layer to the surface of sections of a mold when the mold is closed, and distributing a substrate into a cavity defined by the mold sections whereby the last point of fill for the substrate is located at an entry location of a color material.
    Type: Application
    Filed: March 23, 2007
    Publication date: September 25, 2008
    Inventors: Paul Razgunas, Alan Maddaford
  • Publication number: 20080230950
    Abstract: A resin sealing method includes the steps of providing an intermediate mold between an upper mold and a lower mold, the intermediate mold having a cavity forming part where a resin sealed part is received; and introducing sealing resin into the cavity forming part of the intermediate mold and another main surface of the intermediate mold via a runner, the runner being provided in a vicinity of the cavity forming part of the intermediate mold and piercing the intermediate mold in a thickness direction.
    Type: Application
    Filed: March 17, 2008
    Publication date: September 25, 2008
    Applicant: FUJITSU LIMITED
    Inventors: Takao NISHIMURA, Kazunari KOSAKAI
  • Publication number: 20080230951
    Abstract: Described herein are methods for making microfluidic devices comprising glass or glass-containing materials, wherein the methods have decreased cost and/or improved dimensional properties over similar formed glass articles produced using current techniques.
    Type: Application
    Filed: February 28, 2008
    Publication date: September 25, 2008
    Inventors: Thierry Luc Alain Dannoux, Paulo Gaspar Jorge Marques, Robert Michael Morena, Cameron Wayne Tanner
  • Publication number: 20080230952
    Abstract: An apparatus for molding a proppant is disclosed. The apparatus comprises a first member comprising a manifold for channeling a plastic fluid to a cavity block, with the cavity block containing a plurality of semi-spherical cavities. The apparatus further includes a second member that comprises a movable plate for engaging with the first member, with the movable plate having an opening therein, and a core block positioned within the opening, with the core block containing a plurality of reciprocal semi-spherical cavities configured to engage the semi-spherical cavities of the cavity block so that a plurality of spheres are formed, with the core block further containing a plurality of arm cavities that link the plurality of spheres so that a star cluster (which links the proppants) is formed. A method of manufacturing proppants and a method of using the proppants is also disclosed.
    Type: Application
    Filed: March 23, 2007
    Publication date: September 25, 2008
    Inventor: Kent Byron
  • Publication number: 20080230953
    Abstract: A modeling compound stamping tool is disclosed including a stamping element having multiple images, and a gear assembly with a handle mechanically coupled for selection of an image of the stamping element to assist in the creation of art forms, artistic designs or impressions. The described methods of stamping the modeling compounds in a toy provide the stamping element with the multiple images, and selecting an image for applying to a quantity of modeling compound. A dial or a handle is disclosed for rotating between images of the stamping element to position various different images in downwardly facing positions for pressing the stamping element against the quantity of modeling compound to produce the desired image.
    Type: Application
    Filed: March 23, 2007
    Publication date: September 25, 2008
    Inventors: Thomas P. Hamilton, Thomas Mangiaratti, Grady Feren Hayes
  • Publication number: 20080230954
    Abstract: An injection stretch blow molding process for making containers from a polylactic acid resin. In one aspect the process comprises molding the polylactic acid resin into a perform, applying heat to the perform, stretching and blowing the perform in axial and radial dimensions in order to form a preliminary molded container, conditioning the molded container pursuant to a first conditioning method, conditioning the molded container pursuant to a second conditioning method, and stretching and blowing the molded container in order to form a final molded container. Relatively rigid bottles constructed in accordance with one or more processes disclosed herein are also contemplated.
    Type: Application
    Filed: March 18, 2008
    Publication date: September 25, 2008
    Applicant: GREEN HARVEST TECHNOLOGIES, LLC
    Inventors: Pat Gruber, Greg Roda, James Lunt
  • Publication number: 20080230955
    Abstract: A boundary lubricant film 1 is formed on a stamper 22 contact portion of a stationary mirror 21 and/or a stationary mirror 21 contact portion of the stamper 22. The boundary lubricant film 1 contains one of kinds of phosphate esters. A material is injected into a cavity 14. As a result, a disc substrate for an optical disc is molded.
    Type: Application
    Filed: May 30, 2008
    Publication date: September 25, 2008
    Applicant: SONY CORPORATION
    Inventors: Takeshi Gouko, Kenji Echizen, Mikio Sato, Akio Koshita
  • Publication number: 20080230956
    Abstract: A process for producing foam moldings from prefoamed foam particles which have a polymer coating in a mold under pressure, wherein the prefoamed foam particles comprise from 10 to 70% by weight, based on the foam particles, of a filler, and also foam moldings produced therefrom and their use.
    Type: Application
    Filed: August 9, 2006
    Publication date: September 25, 2008
    Applicant: BASF SE
    Inventors: Markus Allmendinger, Klaus Hahn, Bernhard Schmied, Michael Riethues
  • Publication number: 20080230957
    Abstract: A device for transforming thermoplastic matrix composite materials or thermosetting materials, includes two mold casings that are mobile relative to each other, electrically conductive, and include a molding zone designed to be in contact with the material to be transformed. The faces of one of the two mold casings are situated so as to be facing magnetic field generator, except for the molding zones, and are coated with a shielding layer made of a non-magnetic material preventing the magnetic field from penetrating into the mold casings. The mold casings are electrically insulated from each other during the molding phase so that the faces of the two mold casings demarcate an air gap wherein flows the magnetic field that induces currents at the surface of the molding zones thus localizing the heating at the interface between the molding zone and the material to be transformed.
    Type: Application
    Filed: July 7, 2006
    Publication date: September 25, 2008
    Applicant: ROCTOOL
    Inventors: Jose Feigenblum, Alexandre Guichard
  • Publication number: 20080230958
    Abstract: An in-mould coating method and a coating device for the same, wherein the inserts in the mould of the coating device are made of transparent material and are each coated with reflective material. In each insert are installed light generators, light sensors, cameras, etc. The coating method comprises the steps of: closing the mould after placing a semi-finished product formed by injection molding or other processes in the mould; injecting liquid lacquer or other liquid coating material, and using the cameras to monitor filling; and after finishing filling, starting the light generators and utilizing the light sensors to monitor the amount of light irradiated on the injected liquid lacquer or other liquid coating materials in such a manner that the injected liquid lacquer or other liquid coating materials is hardened to form a coating film on the surface of the semi-finished product.
    Type: Application
    Filed: March 15, 2008
    Publication date: September 25, 2008
    Inventor: Yu-Syuan JIN
  • Publication number: 20080230959
    Abstract: The present invention provides a composition and a method of using the same to form a pattern on a substrate using imprint lithography employing dark-field polymerization. To that end, the composition includes a bis vinyl ether component, and an initiator component that produces an acid in response to radiation. The bis vinyl ether component is reactive to the acid and polymerizes in response thereto.
    Type: Application
    Filed: April 18, 2008
    Publication date: September 25, 2008
    Applicant: Board of Regents, University of Texas System
    Inventors: C. Grant Willson, Nicholas A. Stacey
  • Publication number: 20080230960
    Abstract: An information recording medium manufacturing method is provided in which a resin material can be reliably cured even when a light-transmitting stamper is used repeatedly. A resin mask forming method and a transferring apparatus and a light-transmitting stamper used in these methods are also provided. In the above methods, a visible light curable resin material is spread over a workpiece. Then, a light-transmitting stamper including a transferring portion having a predetermined concavo-convex pattern formed therein is brought into contact with the resin material to transfer the concavo-convex pattern to the resin material, and light including visible light is projected onto the resin material through the light-transmitting stamper to cure the resin material.
    Type: Application
    Filed: March 18, 2008
    Publication date: September 25, 2008
    Applicant: TDK CORPORATION
    Inventors: Narutoshi Fukuzawa, Daisuke Yoshitoku, Minoru Fujita, Tsuyoshi Komaki
  • Publication number: 20080230961
    Abstract: A method for producing a multi-chamber syringe with a by-pass channel from a plastic material comprises the steps of producing a tubular preform from a thermoplastic material; providing a die designed to enclose the preform from the outside in an area of the by-pass channel to be formed, the at least one by-pass channel being preformed as a recess on an inner surface of the die; heating-up the preform to a temperature above the softening range of the plastic material, and positioning the preform in a predefined axial position inside the die; subjecting the preform to a differential pressure until the at least one by-pass channel is plastically formed; and cooling down the syringe body so formed to room temperature.
    Type: Application
    Filed: March 14, 2008
    Publication date: September 25, 2008
    Inventors: Thomas Moesli, Raffael Dudler, Peter Wolbring
  • Publication number: 20080230962
    Abstract: A method for producing expanded honeycomb materials with cementitious reinforcement, in a composite structure having significant structural rigidity and strength, reduction in overall weight and ease of installation comprising the steps of: placing an expanded thermoformable honeycomb in a mold or suitable mold; partially or completely filling either or both sides of the honeycomb with cementitious material; vibrating the cementitious material within the structure to eliminate any air pockets or voids; leveling the cementitious material and allowing it to cure at room or elevated temperature; removing the composite structures from the mold.
    Type: Application
    Filed: June 15, 2006
    Publication date: September 25, 2008
    Inventors: Thomas St. Denis, Gabriel M. Karamanis
  • Publication number: 20080230963
    Abstract: There is provided a method of manufacturing an LTCC substrate, capable of enhancing coatability of an external electrode pad, yield of the LTCC substrate as a package and product reliability and ensuring compactness of a product utilizing the LTCC substrate package. The method includes: forming a cavity on external electrode pad forming layers, respectively and filling the cavity with an external electrode pad material; depositing the external electrode pad forming layers on a ceramic stack with a printed circuit pattern formed therein; and sintering the ceramic stack having the external electrode pad forming layers deposited thereon at a low temperature.
    Type: Application
    Filed: March 20, 2008
    Publication date: September 25, 2008
    Inventor: Je Hong Sung
  • Publication number: 20080230964
    Abstract: The present invention relates to a process for the production of sintered three-dimensional strips of shaped bodies and for the production of the shaped bodies from a pulverulent, inorganic material, to sintered three-dimensional shaped bodies and to the use of the sintered, three-dimensional shaped bodies as shot pellets, munitions, angling weights, for balancing tires, as oscillating weight in clocks, for radiation screening, as a balancing weight in drive motors and engines, for the production of sports equipment or as a catalyst support.
    Type: Application
    Filed: August 29, 2006
    Publication date: September 25, 2008
    Applicant: BASF SE
    Inventors: Hans Wohlfromm, Johan Herman Hendrik ter Maat, Martin Blomacher
  • Publication number: 20080230965
    Abstract: A handling device for elements of tapping runners on a shaft furnace, in particular for runner covers, the device including a support base arranged on the cast house floor of a blast furnace, laterally of the tapping runner and a frame (14) which is supported by the support base and connected thereto by means of a bearing defining a first axis of rotation, which is essentially vertical and about which the frame can rotate relative to the support base. The device further includes a lifting arm having a first end portion and a second end portion, the first end portion being connected to the frame by means of at least a first rotational joint defining a second axis of rotation, which is essentially horizontal, about which the lifting arm can pivot in order to lower or lift its second end portion.
    Type: Application
    Filed: August 16, 2006
    Publication date: September 25, 2008
    Applicant: TMT - TAPPING MEASURING TECHNOLOGY SARL
    Inventors: Robert Gorza, Hans-Otto Kreuz, Ralf Taugerbeck
  • Publication number: 20080230966
    Abstract: A device for submerging scrap metal includes: (a) a drive source, (b) a drive shaft having a first end and a second end, the first end being connected to the drive source, and (d) an impeller connected to the second end of the drive shaft, the impeller preferably having two or more outwardly-extending blades. Preferably, each of the blades has a portion that directs molten metal at least partially downward. The impeller design leads to lower operating speeds, lower vibration, longer component life and less maintenance. Additionally, the impeller preferably has a connective portion. The connective portion is used to connect the impeller to the shaft and preferably comprises a nonthreaded, tapered bore extending through the impeller.
    Type: Application
    Filed: April 29, 2008
    Publication date: September 25, 2008
    Inventor: Paul V. Cooper
  • Publication number: 20080230967
    Abstract: A spring having telescoping capabilities is provided. The spring includes a spring body having an inner diameter and a first spring end that defines a first spring opening. The spring further includes a first elongated member having first and second ends. The first elongated member is slidably received within the spring body such that the first end of the first elongated member is retained within the spring body and the second end of the first elongated member protrudes from the first spring opening.
    Type: Application
    Filed: March 21, 2007
    Publication date: September 25, 2008
    Applicant: PACCAR INC
    Inventor: Peter Richard Smullen
  • Publication number: 20080230968
    Abstract: A vibration isolating device includes an insulator for isolating the transmission of an inputted vibration by an elastic deformation. A principal vibration input portion is provided in a central area of a concave curved wall portion formed in the insulator. A thin wall portion and a thick wall portion are formed by relatively varying a thickness of the insulator around the vibration input portion, wherein the concave curved wall portion of the insulator is formed in a substantially circular shape when viewed in a principal vibration inputted direction. The thick wall portion is formed substantially in the shape of a belt of a predetermined width and extends across the concave curved wall portion in the diametrical direction thereof while passing the vibration input portion. A rigid body covering portion for covering a surface of a metallic member of the vibration input portion is provided in the central area of the thick wall portion. A thickness of the rigid body covering portion is at least 1.7 mm.
    Type: Application
    Filed: March 18, 2008
    Publication date: September 25, 2008
    Applicants: HONDA MOTOR CO., LTD., YAMASHITA RUBBER KABUSHIKI KAISHA
    Inventors: Nobuo Kubo, Hiroshi Yanagase, Jun Saito