Patents Issued in October 21, 2008
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Patent number: 7440240Abstract: Embodiments of the invention provide a spin-valve type magnetic head that satisfies the requirements of both high read output and stability with narrow tracks. In one embodiment, a domain control film is formed on a magnetoresistive layered film in the same track width. A double closed flux path structure that uses three magnetic layers is employed with magnetic coupled structure in both ends of the track. The three magnetic layers are a soft magnetic free layer, a domain-stabilization ferromagnetic layer, and a soft magnetic anti-parallel layer.Type: GrantFiled: April 8, 2005Date of Patent: October 21, 2008Assignee: Hitachi Global Storage Technologies Netherlands B.V.Inventors: Hiroyuki Hoshiya, Katsumi Hoshino, Masahiko Hatatani, Kenichi Meguro
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Patent number: 7440241Abstract: A magnetoresistive head and a fabricating method thereof accomplishing high read sensitivity and excellent linear response with low noise even if track width narrowing makes progress are provided. In one embodiment, using a magnetoresistive film having a laminated body of a pinned layer/an intermediate layer/a free layer/a separate layer/a first ferromagnetic layer/a 90-degree magnetic interlayer coupling layer/a second ferromagnetic layer, and the magnetizations of both the pinned layer and the second ferromagnetic layer are fixed nearly in the direction along the sensor height. On the other hand, the magnetizations of the first ferromagnetic layer and the second ferromagnetic layer have an interlayer interaction being directed in nearly orthogonal directions to each other through the 90-degree magnetic interlayer coupling layer, and the first ferromagnetic layer has a magnetization directed nearly in the direction along the track width in zero external magnetic field.Type: GrantFiled: October 3, 2005Date of Patent: October 21, 2008Assignee: Hitachi Global Storage Technologies Netherlands B.V.Inventors: Katsumi Hoshino, Hiroyuki Hoshiya, Hiroyuki Katada, Kenichi Meguro
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Patent number: 7440242Abstract: A magnetic head with improved hard magnet properties includes a sensor stack structure of current-perpendicular-to-the-planes (CPP) type formed in a central region between first and second shield layers, and a multi-layered seed layer structure formed in side regions adjacent the central region. The multi-layered structure has a first layer including nitrogenated nickel-tantalum (NiTa+N) and a second layer including chromium-molybdenum (CrMo), which are formed over an insulator in the side regions. A hard bias layer formed over the multi-layered structure is preferably a cobalt-based alloy. Methods of making the magnetic head are also described.Type: GrantFiled: April 5, 2007Date of Patent: October 21, 2008Assignee: Hitachi Global Storage Technologies Netherlands B.V.Inventor: Mustafa Michael Pinarbasi
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Patent number: 7440243Abstract: A read sensor of the current-perpendicular-to-the-planes (CPP) type includes a sensor stack structure formed in a central region between first and second shield layers which serve as leads for the read sensor; insulator layers formed in side regions adjacent the central region; seed layer structures formed over the insulator layers in the side regions; and hard bias layers formed over the seed layer structures in the side regions. The hard bias layers are made of a nitrogenated cobalt-based alloy, such as nitrogenated cobalt-platinum (CoPt). Suitable if not exemplary coercivity and squareness properties are exhibited using the nitrogenated cobalt-based alloy. The hard bias layers may be formed by performing an ion beam deposition of cobalt-based materials using a sputtering gas (e.g. xenon) and nitrogen as a reactive gas.Type: GrantFiled: April 9, 2007Date of Patent: October 21, 2008Assignee: Hitachi Global Storage TechnologiesInventors: James Mac Freitag, Mustafa Michael Pinarbasi
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Patent number: 7440244Abstract: A modular and scaleable Matrix Fault Current Limiter (MFCL) that functions as a “variable impedance” device in an electric power network, using components made of superconducting and non-superconducting electrically conductive materials. The matrix fault current limiter comprises a fault current limiter module that includes a superconductor which is electrically coupled in parallel with a trigger coil, wherein the trigger coil is magnetically coupled to the superconductor. The current surge doing a fault within the electrical power network will cause the superconductor to transition to its resistive state and also generate a uniform magnetic field in the trigger coil and simultaneously limit the voltage developed across the superconductor. This results in fast and uniform quenching of the superconductors, significantly reduces the burnout risk associated with non-uniformity often existing within the volume of superconductor materials.Type: GrantFiled: April 2, 2005Date of Patent: October 21, 2008Inventors: Xing Yuan, Kasegn Tekletsadik
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Patent number: 7440245Abstract: An arc fault circuit interrupter includes separable contacts, an operating mechanism adapted to open and close the separable contacts, and a trip mechanism cooperating with the operating mechanism to trip open the separable contacts. The trip mechanism includes a peak detector determining a peak amplitude of a current pulse of the current flowing in a power circuit. A microprocessor determines whether the peak amplitude of the current pulse is greater than a predetermined magnitude. A plurality of routines including a time discounted accumulation algorithm, a short delay algorithm and a series time discounted accumulation algorithm, employ the peak amplitude to determine whether an arc fault condition exists in the power circuit.Type: GrantFiled: September 28, 2004Date of Patent: October 21, 2008Assignee: Eaton CorporationInventors: Theodore J. Miller, Kevin L. Parker
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Patent number: 7440246Abstract: The present disclosure relates to resettable circuit interrupting devices and apparatus capable of being tested and reset from remote locations, and in particular to portable circuit interrupting devices and apparatus capable of being tested and reset from remote locations.Type: GrantFiled: September 26, 2005Date of Patent: October 21, 2008Assignee: Leviton Manufacturing Co., Inc.Inventors: Gaetano Bonasia, James Richter, Steve Campolo
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Patent number: 7440247Abstract: A gate coupling electrostatic discharge protection circuit is disclosed. The protection circuit that is connected an ESD structure with gate coupling to a first level circuit and other ESD structures with gate coupling to a derived circuit derived from the first level circuit in parallel could be used to drain the electrostatic discharge. The resistance of the first level circuit and the resistance of derived circuit are matched in draining the electrostatic discharge, whereby the current wouldn't concentrate on a certain portion of these cascades structures.Type: GrantFiled: February 17, 2005Date of Patent: October 21, 2008Assignee: VIA Technologies, Inc.Inventors: Joe Wang, Yung-Chi Sung
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Patent number: 7440248Abstract: A semiconductor integrated circuit device includes: a protected circuit protected against electro-static discharge applied from outside the device; an SCR protection circuit having an anode terminal connected to a power line, a cathode terminal connected to a ground line and a trigger terminal; and a trigger circuit connected to the trigger terminal and including an RC circuit connected between the power line and the ground line.Type: GrantFiled: February 22, 2006Date of Patent: October 21, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Katsuya Arai, Toshihiro Kougami, Masayuki Kamei
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Patent number: 7440249Abstract: An undervoltage detection circuit includes a first transistor and a second transistor coupled to a supply voltage node and arranged to form a current mirror. The undervoltage detection circuit also includes a first bipolar transistor and a second bipolar transistor. A collector of the first bipolar transistor is coupled to the first transistor, and an emitter of the first bipolar transistor is coupled to a reference voltage node. A collector of the second bipolar transistor is coupled to the second transistor and an emitter of the second bipolar transistor is coupled to the reference voltage node through a first resistor. The undervoltage detection circuit further includes a third transistor coupled through a second resistor to an input voltage node. An output signal indicative of an input voltage is derived from a voltage established at the collector of the second bipolar transistor.Type: GrantFiled: March 30, 2005Date of Patent: October 21, 2008Assignee: Silicon Laboratories, Inc.Inventors: Wenjun Sheng, Xiaoyu Xi
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Patent number: 7440250Abstract: A circuit breaker includes line and load terminals, separable contacts electrically connected between the line and load terminals, and a line neutral pigtail. An operating mechanism including an operating handle is adapted to open and close the contacts. A trip circuit responds to current flowing through the contacts and cooperates with the operating mechanism in response to predetermined current conditions to open the contacts. The trip circuit is powered from the line terminal and the line neutral pigtail. A solenoid includes a plunger and a coil, which is energized from the line terminal and the line neutral pigtail. The plunger engages the operating handle when the coil is not energized to prevent movement of the handle from the open to the closed position thereof. The plunger disengages from the operating handle when the coil is energized to permit movement of the handle from the open to the closed position thereof.Type: GrantFiled: November 30, 2005Date of Patent: October 21, 2008Assignee: Eaton CorporationInventor: Bruce R. Terhorst
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Patent number: 7440251Abstract: A multi-path switching configuration provides independent switching of multiple circuit paths. In a preferred arrangement, a plurality of circuit interrupters have one end connected in common with each other and a second end providing a circuit path connection. An operating facility is arranged to independently operate the circuit interrupters via an operating member operatively connected to a respective circuit interrupter and controlling the respective interrupting path. Two or more of the operating members are moved to selectively provide desired connections of circuit paths.Type: GrantFiled: December 12, 2005Date of Patent: October 21, 2008Assignee: S & C Electric Co.Inventor: John C. Opfer
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Patent number: 7440252Abstract: The invention provides electrical energy conditioners particularly useful for power applications. Internal structure of the energy conditioners may be included as components of connectors or electrical devices.Type: GrantFiled: June 1, 2004Date of Patent: October 21, 2008Assignee: X2Y Attenuators, LLCInventor: Anthony Anthony
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Patent number: 7440253Abstract: A protective device for transmitting electromagnetic signals of a desired frequency band from a source to a load comprises an outer conductor, an inner conductor extending coaxially within the outer conductor and a quarter wavelength shunt conductor. A radio frequency impedance control (RFIC) tube is used to maintain the proper transmission line impedance for the device. The shunt conductor is connected, at one end, to the inner conductor and extends along a multi-curved path through an opening in the RFIC tube and wraps around the RFIC tube in at least one plane. The other end of the stub is connected to the outer conductor either directly or indirectly by means of distributed capacitance through a dielectric insulator. A plurality of gas discharge tubes may be coupled to the shunt conductor to shunt undesired voltages.Type: GrantFiled: December 2, 2003Date of Patent: October 21, 2008Inventor: George M. Kauffman
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Patent number: 7440254Abstract: A micro-electromechanical variable capacitor with first and second capacitor plates spaced apart to define a gap therebetween. The first plate has two control electrodes and an active electrode. The second plate is movable relative to first plate when a voltage is applied to produce a potential difference across the control electrode and the second capacitor plate. This has the effect of varying the capacitance of the capacitor. The facing surface of at least one of the plates is formed in such a way that it has a roughened surface. The degree of roughness is sufficient to prevent the facing surfaces adhering together through stiction.Type: GrantFiled: June 9, 2003Date of Patent: October 21, 2008Assignee: RFMD (UK) LimitedInventor: Andrew James Gallant
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Patent number: 7440255Abstract: A capacitor construction includes a first electrode and a layer between the first electrode and a surface supporting the capacitor construction. The capacitor construction can exhibit a lower RC time constant compared to an otherwise identical capacitor construction lacking the layer. Alternatively, or additionally, the first electrode may contain Si and the layer may limit the Si from contributing to formation of metal silicide material between the first electrode and the supporting surface. The layer may be a nitride layer and may be conductive or insulative. When conductive, the layer may exhibit a first conductivity greater than a second conductivity of the first electrode. The capacitor construction may be used in memory devices.Type: GrantFiled: July 21, 2003Date of Patent: October 21, 2008Assignee: Micron Technology, Inc.Inventors: Brent A. McClure, Casey R. Kurth, Shenlin Chen, Debra K. Gould, Lyle D. Breiner, Er-Xuan Ping, Fred D. Fishburn, Hongmei Wang
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Patent number: 7440256Abstract: A laminated ceramic substrate includes a side electrode in which a side edge electrode layer formed on a side edge portion of a ceramic layer overlaps with and connects to a side edge electrode layer formed on a side edge portion of another ceramic layer directly above and/or directly below the former ceramic layer. The side edge electrode layer includes a parallel wall unexposed and approximately parallel to a side surface of the laminated ceramic substrate and a perpendicular wall approximately perpendicular to the side surface of the laminated ceramic substrate. A length La of the parallel wall and a depth Lb of the parallel wall from the side surface of the laminated ceramic substrate have a relationship of La>Lb.Type: GrantFiled: September 27, 2004Date of Patent: October 21, 2008Assignee: Sanyo Electric Co., Ltd.Inventors: Masanori Hongo, Hiroyuki Nishikiori, Natsuyo Nagano, Takashi Ogura
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Patent number: 7440257Abstract: A double-layer capacitor includes a first electrode having a first polarity, a second electrode having a second polarity, the first polarity being different from the second polarity, and an electrolyte that is in contact with the first electrode and the second electrode. The first electrode has a first charge of the first polarity and the second electrode has a second charge of the second polarity, and maximum values of the first charge and the second charge are substantially equal.Type: GrantFiled: October 17, 2003Date of Patent: October 21, 2008Assignee: EPCOS AGInventors: Edith Kirchner, Harald Landes, Hartmut Michel, Barbara Schricker, Andree Schwake, Christoph Weber
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Patent number: 7440258Abstract: A thermally fitted interconnect couples energy storage cells without the use of additional materials of fasteners. Variations of the interconnect can be used to facilitate fitting of multiple energy storage cell with multiple cell to cell spacings in a rapid and inexpensive manner.Type: GrantFiled: September 2, 2005Date of Patent: October 21, 2008Assignee: Maxwell Technologies, Inc.Inventors: Guy C. Thrap, James L. Borkenhagen, Mark Wardas, Adrian Schneuwly, Philippe Lauper
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Patent number: 7440259Abstract: A closure device for a withdrawable rack adapted for receiving power circuit breaker includes a plate arrangement having at least two plates provided with openings and movable relative to one another so that the plate arrangement is changeable between an open position in which the openings of the plates are in alignment and a closed position in which the openings are out of alignment. An actuating mechanism is acted upon by the power circuit breaker as it is inserted to cause a movement of at least one of the plates to thereby change the plate arrangement between the closed and open positions. The actuating mechanism includes two V-shaped linkage assemblies. Each linkage assembly has two legs connected by a hinge to allow the linkage assembly to spread apart, with one of the legs having a free end which is connected to the at least one of the plates, and a coupler is connected to the hinge. Both couplers are jointly articulated to actuating element.Type: GrantFiled: June 14, 2007Date of Patent: October 21, 2008Assignee: Siemens AktiengesellschaftInventors: Erhard Deylitz, Burkhard Engemann, Stefan Losch
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Patent number: 7440260Abstract: An electrical bus member mounting system is provided for an electrical enclosure including a housing having a front, a back and a plurality of sides, a plurality of sections disposed between the sides, at least one electrical apparatus disposed within a first one of the sections, and an electrical bus assembly electrically connected to the electrical apparatus. The electrical bus member mounting system includes a mounting assembly having a first portion and a second portion. A plurality of electrical bus members are coupled to the first portion and the second portion is coupled at or about at least one of the sides of the housing within a second one of the sections thereof. Accordingly, the electrical bus member mounting system consolidates a substantial portion of the electrical bus assembly at a single location within the second one of the sections of the housing, in order to facilitate access thereto.Type: GrantFiled: September 8, 2006Date of Patent: October 21, 2008Assignee: Eaton CorporationInventors: Paul K. Parker, James E. Smith, Paul A. Colbaugh, Marcy D. Scialabba, Ronald A. Carder
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Patent number: 7440261Abstract: A power regulator with a bypass and splice capacity includes at least one phase member and a driver. Each one of the at least one phase member includes two cooling fins, two SCR thyristors, a conductive resilient tab and a conductive rigid tab. The cooling fins are conductive and adjacent to each other. The SCR thyristors are mounted on the cooling fins and are inversely connected in parallel to each cooling fin. The conductive resilient tab is mounted on one of the cooling fins and has a moveable contact. The conductive rigid tab is mounted on the other cooling fin and has a stationary contact aligned with the movable contact. When the driver is energized, the driver drives the conductive resilient tab and the moveable contact is contacts the stationary contact and power is bypassed and spliced through the cooling fins.Type: GrantFiled: October 19, 2006Date of Patent: October 21, 2008Inventor: Saul Lin
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Patent number: 7440262Abstract: A modular power distribution system comprises a chassis and a backplane including a power input, and a plurality of module connection locations. A plurality of modules are mounted in the chassis, each module mounted to one of the module connection locations. Each module includes: (i) a circuit protection device; and (ii) a power output connection location. Bus bars connect front power inputs to the backplane.Type: GrantFiled: February 26, 2007Date of Patent: October 21, 2008Assignee: ADC Telecommunications, Inc.Inventors: Joseph Coffey, David Johnsen, Duane Sand, Bradley Blichfeldt
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Patent number: 7440263Abstract: An image sensor and a method for manufacturing the same. The image sensor includes a substrate, a photosensitive chip mounted to the substrate, a plurality of wires for electrically connecting the photosensitive chip to the substrate, a frame layer mounted to the substrate to surround the photosensitive chip. And a transparent layer is fixed and encapsulated by the frame layer such that the photosensitive chip may receive optical signals passing through the transparent layer.Type: GrantFiled: July 16, 2003Date of Patent: October 21, 2008Assignee: Kingpak Technology Inc.Inventor: Chung Hsien Hsin
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Patent number: 7440264Abstract: One aspect of the invention pertains to a stiffener for a computer housing so as to increase the rigidity and strength of the computer housing.Type: GrantFiled: August 4, 2005Date of Patent: October 21, 2008Assignee: Apple Inc.Inventors: Lawrence Lam, Jory Bell, Chris J. Stringer, Roy Riccomini
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Patent number: 7440265Abstract: A variable-sized screen includes a support, at least one scrolling device and a flexible display. The support has a fixing frame and a movable frame, which are retractably connected. The scrolling device and the flexible display are assembled on the support. The flexible display is wrapped around the support, and the size of the flexible display is variable due to displacement of the support. When the support changes size through a retracted movement of the movable frame and the fixing frame, the flexible display also changes size correspondingly and the size of the screen becomes variable. Therefore, the dimensions of the screen and electronic products are not limited, and the display device has the advantages of a big screen yet is still portable and convenient for a user.Type: GrantFiled: December 27, 2005Date of Patent: October 21, 2008Assignee: Lite-On Technology CorporationInventor: Liang Ou Yang
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Patent number: 7440266Abstract: The present invention discloses a portable electronic device including a main body, a recess at an end of the main body for containing at least one first display module, and at least one connecting member between the recess and the first display module. An end of the connecting member is pivotally connected to the recess and another end of the connecting member is pivotally connected to the first display module, such that the first display module with the connecting member can be stored into the recess or turned out from the recess to a position parallel and next to an end of the main body.Type: GrantFiled: January 22, 2007Date of Patent: October 21, 2008Assignee: Inventec CorporationInventor: Christine Yu
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Patent number: 7440267Abstract: The present invention relates to various types of electronic apparatus having a folding structure via hinges and aims to help further enrich and compact functions. The apparatus includes: a first enclosure having a circuit component; a hinge unit rotatably connected to the first enclosure via a hinge; and a second enclosure having a circuit component and connected to the first enclosure via the hinge unit, in which the hinge unit has a circuit component.Type: GrantFiled: November 8, 2005Date of Patent: October 21, 2008Assignee: Fujitsu LimitedInventors: Ikki Tatsukami, Minoru Kumagai, Yutaka Satou, Takashi Iijima, Tadashi Kikkawa
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Patent number: 7440268Abstract: A computer case includes a primary frame body formed from a plurality of primary supports, a cover case mounted on the outside of the primary frame body, and a power supply coupled to the rear area of the primary frame body. The computer case preferably also includes a power supply support frame so that the power supply can be fixed, in a steady manner, onto the primary frame body. In addition, for the ornamental purposes, an ornamental case can be coupled to the outside of the power supply.Type: GrantFiled: May 18, 2006Date of Patent: October 21, 2008Assignee: AOPEN Inc.Inventors: Jui-Hu Lan, Cheng Tu, Chun-Chang Lai, Te-An Lin
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Patent number: 7440269Abstract: A notebook computer is suitable for a user who wears make-up. In addition to the computing power, a cosmetic set is integrated into the notebook computer. Thus the user can carry the notebook computer with the cosmetic set together as one single item instead of carrying two separate items.Type: GrantFiled: October 18, 2006Date of Patent: October 21, 2008Assignee: Micro-Star Int'l Co., Ltd.Inventors: Po-Yu Liao, You-Wei Teng, Chung-Yuo Wu, Yu-Chung Lin
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Patent number: 7440270Abstract: A mounting apparatus for mounting a data storage device that defines a locking hole in a sidewall thereof, includes a bracket for holding the data storage device, a first locking member, and a second locking member. The bracket includes a side wall. The side wall defines a through-hole therein. The first locking member is pivotably mounted to the side wall of the bracket. A locking portion protrudes from the first locking member for being inserted through the through-hole of the bracket to engage in the locking hole of the data storage device. The second locking member is pivotably mounted to the side wall of the bracket, and releasably mounted to the first locking member.Type: GrantFiled: November 25, 2006Date of Patent: October 21, 2008Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Ji-Wei Zheng, Wei Zhang, Qin Guo, Guang-Yao Lee, Chun-Chi Liang
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Patent number: 7440271Abstract: A mounting apparatus is provided for securing a data storage device. The data storage device has two opposite side walls. Each side wall forms a pair of posts. The mounting apparatus includes a chassis, a bracket mounted in the chassis for accommodating the data storage device, and a latch member pivotally mounted to the bracket. A plurality of slots is defined in one side wall of the bracket for receiving the posts of the data storage device. The latch member includes a base. An elastic arm and a hook extend from the base. The elastic arm resists against the chassis to urge the hook partially covering one of the mounting slots for preventing a corresponding post received in the mounting slot disengaging therefrom. The latch member is being pressable to depress the elastic arm and remove the hook away from the mounting slot thereby release the corresponding post.Type: GrantFiled: February 9, 2007Date of Patent: October 21, 2008Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Yun-Lung Chen, Yu-Ming Xiao
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Patent number: 7440272Abstract: A mounting apparatus for data storage device (50) with securing holes (52) defined therein, includes a base (20) and a pivot member (30) with one end pivotally attached to the base. The base includes at least a securing piece (241) corresponding to the securing hole of the data storage device and a clip (2231) protruded therefrom. The pivot member includes at least a securing piece (321) corresponding to the securing hole of the data storage device and an opening (343) corresponding to the clip. The clip of the base engages into the opening of the pivot member for mounting the data storage device when the pivot member rotates to a locked position. The clip of the base disengages from the opening of the flange panel of the pivot member when the pivot member rotates to an unlocked position.Type: GrantFiled: February 9, 2007Date of Patent: October 21, 2008Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Yun-Lung Chen, Qing-Hao Wu
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Patent number: 7440273Abstract: A computer enclosure includes a chassis with an opening defined therein, an elastic piece, a first drive bracket secured in the chassis, and a second drive bracket. One end of the elastic piece is secured to the chassis adjacent the opening, and the other end of the elastic piece is free and forms a protrusion thereon. The second drive bracket defines a hole therein corresponding to the protrusion. The second drive bracket extends through the opening from an outside of the chassis to pull the protrusion and elastically bend the elastic piece, and then slides on the first drive bracket until the protrusion of the elastic piece is in alignment with the hole of the first drive bracket, the elastic piece rebounds to have the protrusion inserted into the hole to secure the second drive bracket on the first drive bracket.Type: GrantFiled: April 2, 2007Date of Patent: October 21, 2008Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Yun-Lung Chen, Yu-Ming Xiao
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Patent number: 7440274Abstract: A digital storage arrangement is interfaceable with a host device which defines a cavity. The digital storage arrangement includes a housing receivable in the cavity, with a movement margin between the housing and host device, while a resilient support arrangement is provided for fixed engagement with the host device and for engaging the housing, while extending through the movement margin, to support the housing within the storage device cavity and to subject the storage device to a lesser degree of mechanical shock when the host device receives a given mechanical shock. The resilient support arrangement provides support by extending from each corner region of the housing to the host device. The support arrangement is molded through an opening defined by the housing in each corner region to extend outwardly to the host device. A bumper configuration is provided integral with the support arrangement and including a sealing arrangement.Type: GrantFiled: December 25, 2007Date of Patent: October 21, 2008Assignee: Benhov GmbH, LLCInventors: Curtis H. Bruner, John F. Fletcher, Frida E. Romauli Fletcher
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Patent number: 7440275Abstract: A portable video system comprises a video unit for facilitating play of a video medium, the player having a hinge, a display pivotally attached to the video player on the hinge, and a base unit secured to a substrate for selectively coupling a control panel of the video unit to the substrate, wherein the control panel can be selectively un-coupled from the base unit.Type: GrantFiled: September 26, 2005Date of Patent: October 21, 2008Assignee: Audiovox CorporationInventor: George C. Schedivy
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Patent number: 7440276Abstract: A cooling-fan-free system module includes a housing unit having a front and a rear case together defining a receiving space therebetween, and the rear case being highly thermal-conductive; a circuit module received in the receiving space of the housing unit and including a circuit board having at least one heat-producing element electrically connected thereto; a heat radiating unit including a heat-conducting pad raised from an inner side of the rear case corresponding to the heat-producing element for transferring heat produced by the heat-producing element to the rear case, and at least one fin-like heat radiating member integrally formed on a back side of the rear case; and a tightening unit including at least two sets of internally threaded posts, screw fasteners, and elastic elements to ensure tight and good contact of the heat-conducting pad with the heat-producing element.Type: GrantFiled: June 19, 2007Date of Patent: October 21, 2008Assignee: Posiflex Inc.Inventor: Mao-Chiang Chen
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Patent number: 7440277Abstract: A chassis venting apparatus includes a chassis wall base member comprising a first wall. A chassis vent structure is located on the chassis wall base member. A chassis venting passageway is defined between the chassis vent structure and the first wall of the chassis wall base member. The chassis venting apparatus may be, for example, removeably coupled to a chassis or fabricated as part of the chassis in order to provide obscured venting of the chassis and a handle for lifting the chassis.Type: GrantFiled: June 14, 2006Date of Patent: October 21, 2008Assignee: Dell Products L.P.Inventors: Kenneth Musgrave, Huy Nguyen
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Patent number: 7440278Abstract: A water-cooling heat dissipator mounted on an electronic heat-generating element includes a water-cooling head member and at least one heat pipe. The water-cooling head member includes a first cover and a second cover connected to the first cover. Both ends of the first cover and the second cover are formed with a receiving portion corresponding to each other, respectively. The receiving portions are adapted to be connected to the conduit connectors. A channel portion is formed between the first cover and the second cover for receiving one end of the heat pipe. With the above arrangement, the present invention can perform the heat dissipations of different heat-generating elements simultaneously to make the heat-generating elements operate under acceptable working temperatures. Further, the present invention can be widely used in the heat dissipation of compact electronic products.Type: GrantFiled: April 7, 2006Date of Patent: October 21, 2008Assignee: Cooler Master Co., Ltd.Inventor: Chia-Chun Cheng
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Patent number: 7440279Abstract: A heat dissipation device includes a heat conducting plate (100) for contacting with an electronic component (400), a heat sink (200) mounted on the heat conducting plate and a heat pipe (300). The heat conducting plate comprises a groove (110) defined in. The heat pipe comprises an evaporating portion (310) sandwiched between the heat conducting plate and the heat sink, and a condensing portion (320) thermally connecting with the heat sink. The evaporating portion comprises a middle portion (3104) having a circular cross section and accommodated in the groove of the heat conducting plate, and a pair of end portions (3102) formed on opposite sides of the middle portion. The end portions have flat bottom surfaces.Type: GrantFiled: March 14, 2006Date of Patent: October 21, 2008Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Cheng-Tien Lai, Zhi-Yong Zhou, Yi-San Liu
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Patent number: 7440280Abstract: A heat exchange structure includes a plurality of elongated air ducts. The heat exchange structure has an exterior heat exchange surface and interior heat exchange surfaces, the interior surfaces being in the elongated air ducts. The heat exchange structure includes a plurality of heat generators that are distributed on the exterior heat exchange surface along an elongated direction of the air ducts, in which air flowing in the air duct is heated successively by heat from the heat generators, and air flow in the air duct is enhanced by buoyancy of heated air.Type: GrantFiled: March 31, 2006Date of Patent: October 21, 2008Assignee: Hong Kong Applied Science & Technology Research Institute Co., LtdInventor: Geoffrey Wen-Tai Shuy
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Patent number: 7440281Abstract: An apparatus for conducting heat from a computer component to a heat sink. The invention may include a thermal interface material (TIM). The invention may further include a seal or gasket that at least partially encloses the TIM. The gasket may facilitate retaining the TIM within its sidewall, and thus in place on or near a computer component. Generally, the gasket may be placed between the computer component (or a silicon board or other material upon which the computer component is located) and a heat sink. An insert may be placed within the gasket and define an aperture. The chip seats in the aperture and thus is spatially located with respect to the insert. The TIM abuts both the computer component and a heat sink. A desiccant may be located within the gasket and absorb any moisture diffusing or migrating through the gasket.Type: GrantFiled: February 1, 2006Date of Patent: October 21, 2008Assignee: Apple Inc.Inventors: Sean Ashley Bailey, Richard Lidio Blanco, Jr., David Edwards, Supratik Guha, Michael David Hillman, Yves C. Martin, Phillip Lee Mort, Roger Schmidt, Prabjit Singh, Ronald Jack Smith, Gregory L. Tice, Theodore Gerard van Kessel
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Patent number: 7440282Abstract: An electronic package is provided for dissipating heat away from electronic devices. The package includes a substrate and electronic devices mounted on the substrate. The package also has a thermally conductive heat sink assembled over the electronic device. The heat sink includes compliant pedestals each having a contact surface for contacting a surface of an electronic device to conduct thermal energy away from the electronic device. The package is held together such that the heat sink is in contact with the surface of an electronic device such that each compliant pedestal applies a compressive force to the surface of the electronic device.Type: GrantFiled: May 16, 2006Date of Patent: October 21, 2008Assignee: Delphi Technologies, Inc.Inventors: Scott D. Brandenburg, Suresh K. Chengalva, David W. Zimmerman
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Patent number: 7440283Abstract: A device for isolating a heat sensitive component includes a heat sink positioned adjacent to the heat sensitive component. The heat sink has a stepped thermal response to an applied heat. The heat sink may include two or more thermally decoupled masses. Thermal decoupling may be achieved by positioning a nanoporous material positioned between the two masses. The heat sensitive component and the heat sink may be positioned inside a container such as a Dewar-like flask and connected to the container with a connector. The connector may function as a thermal isolator that impedes the flow of heat into the interior of the container. In one embodiment, the connector includes at least one bridge portion having a reduced cross-sectional area and/or a longitudinally elongated opening to impede heat flow. Nanoporous material may be positioned in the container at locations that assist in thermally isolating the heat sink and heat sensitive components.Type: GrantFiled: July 13, 2007Date of Patent: October 21, 2008Assignee: Baker Hughes IncorporatedInventor: Saeed Rafie
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Patent number: 7440284Abstract: A holding device for a heat sink being attached to a circuit board includes a back plate and a frame member. The back plate provides a plurality of fixing posts with a free end of the respective fixing post having a neck recess piecing the circuit board and each of the fixing posts being surrounded with a spring. The frame member provides a plurality of corners with a support leg vertically extending from the corners respectively and a first flat fixing ear horizontally extending outward from the corners. The first fixing ear has a first elongated hole with a first end part for being pierced by the fixing post and a second end part for fitting with the neck recess. The first elongated hole extends from the first end part to the second end part in a way of allowing the frame member being moved along a direction before the second end part fitting with neck recess.Type: GrantFiled: May 4, 2007Date of Patent: October 21, 2008Assignee: Asia Vital Components Co., Ltd.Inventor: Hsin-Cheng Lin
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Patent number: 7440285Abstract: Apparatus and methods for housing an electronic device are provided. In some implementations an apparatus is provided. The apparatus includes a base, an electronic device positioned on the base, and a lid positioned to cover the base and at least a portion of the electronic device. The lid and the base form a housing for the electronic device, the lid including a lid aperture, the lid aperture exposing at least a portion of the electronic device. The apparatus also includes a transparent portion positioned such that a first region of the transparent portion is positioned within the lid aperture and where at least a portion of the electronic device is covered by the transparent portion.Type: GrantFiled: December 29, 2006Date of Patent: October 21, 2008Assignee: Piranha Plastics, LLCInventor: Charles A. Centofante
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Patent number: 7440286Abstract: A dual-personality card reader system supports both USB and micro-SD devices using a card reader and an extended 9-pin USB socket. The card reader includes a PCBA having four standard USB metal contact pads and several extended purpose contact pads disposed on an upper side, components and IC chips covered by a molded case on a lower side, a molded lead-frame connector mounted on the PCBA and including five forward-facing extended purpose pins and eight rear-facing micro-SD connector pins that communicate with the PCBA through the extended purpose contact pads, and a housing including a slot for receiving a micro-SD card such that it communicates with the PCBA through the micro-SD connector pins. The extended 9-pin USB socket includes standard USB contacts and extended use contacts that communicate with the PCBA through the standard USB metal contacts and forward-facing extended purpose pins. The PCBA includes dual-personality electronics for SD/USB communications.Type: GrantFiled: October 29, 2007Date of Patent: October 21, 2008Assignee: Super Talent Electronics, Inc.Inventors: Siew S. Hiew, Nan Nan, Jim Chin-Nan Ni, Abraham C. Ma
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Patent number: 7440287Abstract: An extended Universal-Serial-Bus (USB) connector plug and socket each have a pin substrate with one surface that supports the four metal contact pins for the standard USB interface. An extension of the pin substrate carries another 8 extension metal contact pins that mate when both the connector plug and socket are extended. The extension can be an increased length of the plug's and socket's pin substrate or a reverse side of the substrate. Standard USB connectors do not make contact with the extension metal contacts that are recessed, retracted by a mechanical switch, or on the extension of the socket's pin substrate that a standard USB connector cannot reach. Standard USB sockets do not make contact with the extension metal contacts because the extended connector's extension contacts are recessed, or on the extension of the connector pin substrate that does not fit inside a standard USB socket.Type: GrantFiled: October 11, 2007Date of Patent: October 21, 2008Assignee: Super Talent Electronics, Inc.Inventors: Jim Chin-Nan Ni, David Q. Chow, Frank I-Kang Yu, Abraham C. Ma, Ming-Shiang Shen
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Patent number: 7440288Abstract: A casing for carrying a detachable expansion card having a connecting plate includes a main frame, a first limit element and a second limit element. The main frame has a first surface for leaning against the connecting plate partially, a second surface and a third surface. The first limit element pivoted to the main frame swings about a first axis between a first location and a second location. The second limit element pivoted to the main frame, disposed on the second surface and adjacent to the first limit element swings about a second axis between a third location and a fourth location. The first limit element locked by the second limit element locks the connecting plate and covers part of the third surface to fix the detachable expansion card in the casing when the first and the second limit elements are located at the second and the fourth locations respectively.Type: GrantFiled: August 21, 2007Date of Patent: October 21, 2008Assignee: Inventec CorporationInventor: Lin-Wei Chang
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Patent number: 7440289Abstract: A memory module includes a memory chip MC1 disposed at a position opposite to a memory buffer via a module substrate, a memory chip MC3 disposed at a position not opposite to the memory buffer via the module substrate, and a memory chip MC11 disposed at a position opposite to the memory chip MC3 via the module substrate. A branch point at which a wiring part connected to the memory chip MC1 and a wiring part connected to the memory chips MC3 and MC11 are branched is positioned at the memory buffer side from the viewpoint of the intermediate point between the planar mounting position of the memory buffer and the planar mounting position of the memory chips MC3 and MC11. Accordingly, the wiring length of the wiring part can be made sufficiently short.Type: GrantFiled: November 27, 2007Date of Patent: October 21, 2008Assignee: Elpida Memory, Inc.Inventors: Toshio Sugano, Shunichi Saito, Atsushi Hiraishi