Abstract: One embodiment of an electronic component packaging system includes a base adapted for supporting an electronic component, a lid sealed to the base, the lid including a fillport, and the fillport hermetically sealed by light irradiation.

Abstract: A semiconductor device 10 includes a silicon substrate 20 having a first interconnection layer 24, a second interconnection layer 26, and grooves 22 provided at the second main surface 20b. Mounted on the substrate 20 are one or more semiconductor chips 30 having chip external terminals 32 electrically connected to the first interconnection layer; and one or more peripheral chips 40 electrically connected to the first interconnection layer on the silicon substrate. By the provision of the grooves 22, the heat radiating property is improved.

Abstract: A system is described that can assemble substrates over one another to form a stacked substrate. The various layers of the stacked substrate can be separated from each other by using Coulomb forces. In addition, a beam substrate can be used to increase the separation. The instructions for assembly and a FSM (Finite State Machine) can be included in the stacked substrate to pave the way for a self-constructing 3-D automaton. The beam substrate can be used to carry heat, fluids, electrical power or signals between the various layers of the stacked cells besides providing a mechanical support. A stacked substrate can be assembled into a cylindrical coil, a transformer or a coupled transformer depending on the construction of the beam structure. The magnetic coupling of the transformer can be altered by changing the distance between the separated substrates.

Abstract: A multilayer PCB includes a plurality of signal layers, a ground layer and a power layer disposed between the plurality of signal layers, a signal via extending through the plurality of signal layers to allow a signal current to flow therethrough, at least one stitching capacitor provided in one of the plurality of signal layers to allow a return current that corresponds to the signal current to flow between the power layer and the ground layer. Thus, the multiplayer PCB can form a path of a return current that minimizes generation of EMI when a signal current is generated.

Abstract: A semiconductor device in accordance with the present invention includes IC chips (semiconductor elements) (2, 3, 4) having solder bumps (24) (projecting electrodes) formed on electrode pads, and a first wiring board (1) having connection terminals (7) to which the respective solder bumps (24) of the IC chips (2, 3, 4) are connected, external connection terminals (8) for connection to an external apparatus, and conductor wires (9) provided in respective groove portions formed in a board surface and connected to the respective connection terminals (7). In spite of the reduced pitch of the conductor wires (9), the presence of the groove portions enables an increase in cross section, allowing a reduction in wiring resistance.

Abstract: A polygonal semiconductor device includes a substrate and a wiring layer. The substrate includes semiconductor circuit elements. The wiring layer includes a dielectric sealing layer, a plurality of first electrodes, and a plurality of second electrodes. The first and second electrodes both extend through the dielectric sealing layer in its thickness direction. The first electrodes are electrically connected to the semiconductor circuit elements. Each of the corners of the polygonal device is formed, throughout the thickness of the wiring layer, by one of the second electrodes. The corners of the device are thereby reinforced, as the electrode material is tougher than the dielectric sealing material.

Abstract: Herein disclosed an electronic component having a passivation layer in which an opening that exposes a part of a pad electrode is formed, an underlying metal layer formed on the pad electrode and the passivation layer, and a barrier metal layer formed on the underlying metal layer for an external connection electrode, the electronic component including a recess or/and a projection configured to be provided under the barrier metal layer outside or/and inside the opening, the underlying metal layer being formed on the recess or/and the projection and having a surface shape that follows the recess or/and the projection.

Abstract: A semiconductor device includes: a semiconductor substrate; an insulating film provided on the semiconductor substrate; a plurality of copper interconnections provided on the same level in the insulating film. The copper interconnection includes: a first copper interconnection having a relatively narrow width; and a second copper interconnection having a relatively wide width. The first copper interconnection has the top surface thereof principally composed of copper, and the second copper interconnection has the top surface thereof principally composed of copper.

Abstract: Embodiments of the invention include a copper interconnect structure having increased electromigration lifetime. Such structures can include a semiconductor substrate having a copper layer formed thereon. A dielectric barrier stack is formed on the copper layer. The dielectric barrier stack includes a first portion formed adjacent to the copper layer and a second portion formed on the first portion, the first portion having improved adhesion to copper relative to the second portion and both portions are formed having resistance to copper diffusion. The invention also includes several embodiments for constructing such structures. Adhesion of the dielectric barrier stack to copper can be increased by plasma treating or ion implanting selected portions of the dielectric barrier stack with adhesion enhancing materials to increase the concentration of such materials in the stack.

Abstract: Aimed at improving adhesiveness between upper and lower interconnects in semiconductor devices, a semiconductor device of the present invention includes a second dielectric multi-layered film formed on a substrate, and containing a lower interconnect; a first dielectric multi-layered film formed on the second dielectric multi-layered film, and having a recess; an MOx film formed on the inner wall of the recess, and containing a metal M and oxygen as major components; an M film formed on the MOx film, and containing the M as a major component; and an electric conductor formed on the M film so as to fill the recess, and containing Cu as a major component, wherein the surficial portion of the interconnect fallen straight under the bottom of the recess has an oxygen concentration of 1% or smaller.

Abstract: A semiconductor device comprising a first insulation layer, a second insulation layer, a first barrier film, a second barrier film, a diffusion layer. The device further comprises an upper contact hole, a lower contact hole, and a contact plug. The upper contact hole penetrates the second insulation layer and has a bottom in the second barrier film. The bottom has a width greater than a trench made in the first insulation layer, as measured in a direction crossing the widthwise direction of the trench. The lower contact hole penetrates the first insulation layer and first barrier film, communicates with the first contact hole via the trench and is provided on the diffusion layer. The upper portion of the lower contact hole has the same width as the trench. The contact plug is provided in the upper contact hole and lower contact hole.

Abstract: A method for selective deposition of self-assembled monolayers to the surface of a substrate for use as a diffusion barrier layer in interconnect structures is provided comprising the steps of depositing a first self-assembled monolayer to said surface, depositing a second self-assembled monolayer to the non-covered parts of said surface and subsequently heating said substrate to remove the first self-assembled monolayer. The method of selective deposition of self-assembled monolayers is applied for the use as diffusion barrier layers in a (dual) damascene structure for integrated circuits.

Abstract: Provided are a semiconductor package which is small in size but includes a large number of terminals disposed at intervals equal to or greater than a minimum pitch, and a method of fabricating the semiconductor package. The semiconductor package includes a semiconductor chip having a bottom surface on which a plurality of bumps are formed, redistribution layer patterns formed under the semiconductor chip and each including a first part electrically connected to at least one of the bumps and a second part electrically connected to the first part, an encapsulation layer surrounding at least a top surface of the semiconductor chip, and a patterned insulating layer formed below the redistribution layer patterns and exposing at least parts of the second parts of the redistribution layer patterns.

Abstract: An optical semiconductor device of which the moisture resistance and the like are improved and the manufacturing method thereof are provided. An optical semiconductor device of the embodiment is configured to include an optical semiconductor element on a surface of which a circuit portion including a light-receiving or light-emitting element is formed; a terminal portion which is provided on a back of the optical semiconductor element and electrically connected with the circuit portion; a covering layer which covers the surface of the optical semiconductor element and is made of a transparent material; and sealing resin which covers side faces of the covering layer and of the optical semiconductor element. The circuit portion and the terminal portion may be connected by a rewiring pattern.

Abstract: The reliabilities of a wiring substrate and a semiconductor apparatus are improved by reducing the internal stress caused by the difference of thermal expansion coefficients between a base substrate and a semiconductor chip. A wiring layer (5) is provided on one surface of a silicon base (3). An electrode as the uppermost layer of the wiring layer (5) is provided with an external bonding bump (7). A through-electrode (4) is formed in the base (3) for electrically connecting the wiring layer (5) and an electrode terminal. The electrode terminal on the chip mounting surface is bonded to an electrode terminal of a semiconductor chip (1) by an internal bonding bump (6). The thermal expansion coefficient of the silicon base (3) is equivalent to that of the semiconductor chip (1) and not more than that of the wiring layer (5).

Abstract: A semiconductor device includes: a semiconductor chip mounted on a mounting substrate; a first resin filling a gap between the chip and the substrate; a frame-shaped stiffener surrounding the chip; a first adhesive for bonding the stiffener to the substrate; a lid for covering the stiffener and an area surrounded by the stiffener; and a second resin filling a space between the stiffener and the chip. A thermal expansion coefficient of the second resin is smaller than that of the first resin. The first resin includes an underfill part filling a gap between the chip and the substrate and a fillet part extended from the chip region.

Abstract: A method for mounting a semiconductor package onto PCB is disclosed. A semiconductor package is provided, which comprises a plurality of outer terminals exposed out of an encapsulant. A PCB is provided and has a surface with a plurality of contact pads. Each contact pad has a first exposed side, an opposing exposed second side and a center between the exposed sides. A plurality of first pre-solders and a plurality of second pre-solders are formed on the surface by one single printing. The first pre-solders and the second pre-solders respectively cover the first and second exposed sides of the contact pads, spaces between the opposing first and second pre-solders expose the centers of the contact pads. Then the first and second pre-solders are reflowed and the semiconductor package is mounted on the PCB.

Abstract: A semiconductor device manufacturing technique which allows reduction of semiconductor chip size. First, a pad and other wires are formed over an insulating film. A surface protective film is formed over the insulating film including the pad and wires, and an opening is made in the surface protective film. The opening lies over the pad and exposes a surface of the pad. A bump electrode is formed over the surface protective film including the opening. Here, the pad is smaller than the bump electrode. Consequently, the wires are arranged just beneath the bump electrode in the same layer as the pad 10. In other words, the wires are arranged in space which becomes available because the pad is small enough.

Abstract: A method for fabricating a semiconductor component with a through wire interconnect includes the step of providing a substrate having a circuit side, a back side, and a through via. The method also includes the steps of: threading a wire through the via, forming a contact on the wire on the back side, forming a bonded contact on the wire on the circuit side, and then severing the wire from the bonded contact. The through wire interconnect includes the wire in the via, the contact on the back side and the bonded contact on the circuit side. The contact on the back side, and the bonded contact on the circuit side, permit multiple components to be stacked with electrical connections between adjacent components. A system for performing the method includes the substrate with the via, and a wire bonder having a bonding capillary configured to thread the wire through the via, and form the contact and the bonded contact.

Abstract: A difference in delay of signal transmission due to the wiring within a board is minimized. A wiring board includes wiring for connecting terminals included in one of a plurality of semiconductor chips to terminals included in another one of the plurality of semiconductor chips, through branch points. Each of the plurality of semiconductor chips includes first and second terminals. Moreover, a first wiring up to the first terminals and a second wiring up to the second terminals are in a positional relationship of being shifted parallel to each other in a planar direction of the wiring board so as not to come into electrical contact with each other.

Abstract: A semiconductor device production method which includes steps of: preparing a wafer on which multiple integrated circuits are formed on a principal face; forming a rewiring which is electrically connected to the integrated circuits via a pad electrode; and dicing the wafer after forming an electrode terminal on the rewiring, including steps of: forming a first resin layer by sealing at least the rewiring and the electrode terminal formed on the principal face of the wafer with a first resin; processing a first dicing from a back face of the wafer to the principal face of the wafer or halfway to the first resin layer when the first resin layer is formed; forming a second resin layer by sealing a cut line outlined upon the first dicing and the back face of the wafer continuously with a first resin; and processing a second dicing while leaving the second resin layer which covers a side face outlined upon the first dicing.

Abstract: The present invention is a rotary device that may be adapted for use as a propeller assembly and electrical generator for aerial vehicles or other vehicles intended for fluid media. In one example, the device includes a ring assembly having a plurality of centrally linked blades coupled to a rotatable common hub. Rotary motion of the ring assembly is facilitated by coupling it to an opposed cylinder, opposed piston, internal combustion. The ring assembly includes components of an electrical power generating system so that electrical power is produced from the rotation of the ring assembly.

Abstract: An assembly includes a gearbox for a gas turbine having a geartrain, and at least one starter/generator coupled mechanically to the gearbox. The starter/generator includes a generator module with a first casing, a generator housed in the first casing, and a first shaft constrained to rotate with the rotor of the generator, projecting from the first casing, and carrying a first mechanical coupling member; an exciter module, including a second casing, an exciter housed in the second casing, and a second shaft distinct from the first shaft, constrained to rotate with the rotor of the exciter, projecting from the second casing, and carrying a second mechanical coupling member; and an electrical connection including a rectifier and at least one connector for connecting the secondary circuit of the exciter to the primary circuit of the generator.

Abstract: A process and apparatus for reducing nitrogen oxide emissions in a genset comprising an engine and a generator and a shaft coupled to the engine and generator. The apparatus directs the generator to reduce load on the shaft while directing the engine to seek a steady state shaft speed for a desired energy transfer to the shaft when a shaft speed correction signal representing a shaft speed correction to reach the desired energy transfer meets a criterion.

Abstract: The present invention is to drive a hydraulic pump and a generator motor by an engine, electrically charge a battery by a generator operation of the generator motor, and assist the engine through driving the generator motor by electric power of the battery. On the premise of the configuration above, when a deviation between a target rotation speed of the engine and an actual rotation speed of the engine is equal to or more than a preset value, and when a residual amount of fuel is equal to or less than a preset value, it is considered to be engine failure or an operation state which is directly connected to the engine failure and an engine assisting action is automatically stopped.

Abstract: Improved generator output circuitry for twin turbine includes boost DC converters for each of a pair of generators with their output introduced to a single inverter, which serves both generators and converters in common. The inverter output then proceeds in conventional AC form through a disconnect switch to a power grid.

Abstract: A wind power generation system includes: a wind turbine in which at least one blade is mounted on an axis; a generator for generating multiphase alternating current power by rotation of the axis; and a multiphase power conversion device for performing PWM-control for adjustment and output of generated power of the generator. With the configuration, the PWM-control provides for each phase a control paused period in which no overlap occurs. Thus, the pulse density between the control period and the control paused period of other phases is low, thereby generating high and low density in an inter-phase pulse.

Abstract: A wind power generator system including: a windmill rotor including a blade having a variable pitch angle; a generator driven by the windmill rotor; and a control unit controlling the output power of the generator and the pitch angle of the blade in response to the rotational speed of the windmill rotor or the generator.

Abstract: A device consisting of a container which is partially submerged in the sea which may be buoyant and connected to the seabed with cables or mounted on a platform and whose interior is connected to its exterior via pipes where in response to the passing of waves is filled and emptied through these pipes. The force of the water flowing through the pipes causes turbines to rotate thus generating electricity which may be transmitted to land. These turbines may be turbines which rotate in different directions depending on the direction of water flow or turbines which maintain the same direction of rotation irrespective of the direction of water flow.

Abstract: A helical auger turbine and hydrokinetic device for use with electrical generators for producing electricity. The auger turbine includes a generally helical turbine blade rotatably mounted on a central shaft, which may be tapered at each end, and a flange extending perpendicularly to an edge of the turbine blade. At least one turbine blade support connection is included for connecting the central shaft to a support structure. An electrical generator may be powered by the helical auger turbine, that can be used in a tidal water flow. The helical auger turbine can operate a high pressure pump connected to a hydraulic accumulator for storing pressurized hydraulic fluid from the high pressure pump. An electrical generator can be operated by hydraulic fluid delivered from the hydraulic accumulator at times of slow water flow. A plurality of helical auger turbines can be horizontally oriented under water, tethered to legs of an ocean platform such as an oil rig secured to the seabed.

Abstract: An omni-direction array 22 of wind turbine assemblies 10 is positioned upon and about the periphery of the roof of a building. Each wind turbine assembly 10 comprises a self supporting modular box-shaped housing 12 having an inlet and outlet for accelerating the flow of air therethrough. Turbine 14 comprises a hub 27, a peripheral band 28 and vanes 25 having proximal and distal ends positioned there between and having a ring gear 18 positioned on the peripheral band in mechanical communication with a plurality of generators 20 for converting wind energy into electricity. Parabolic collectors 16 are positioned and attached to the inlet and outlet of the housing 12 for collecting, concentrating, directing and accelerating wind through the turbine 14 in the throat section of the assembly. Each self supporting box-shaped modular housing 12 is structurally communicated with other housings 12 by interlocking mating surfaces 26.

Abstract: A vehicle auxiliary electric-power-supplying system can normally stop an electric power inverter by the frequency in use for an electric power supplier being suppressed as low as possible, and electric power being immediately started to be supplied from the power supplier to a controller in a case in which normal electric power has become unable to be obtained from power-outputting of the electric power inverter.

Abstract: When an ignition switch (22) is operated to other than a start position for cranking an engine (20), a switch (relay 28) places a megafuse (30) in circuit with protecting cables to the electric starter motor (18) and alternator (16) to protect against shorts. When ignition switch (22) is operated to start position for cranking the engine (20), switch (28) removes the megafuse (30) from protecting the cables. If a short blew the megafuse (30) before starting, the ignition switch (22) cannot operate the switch (28) and the engine cannot be cranked.

Abstract: The present invention is an energy generating system for a telecommunications megasite which uses fuel cells and capacitors to backup a commercially available primary source of power.

Abstract: A power supply. The power supply provides power to a real-time clock generator when system power is not available and comprises first and second regulators, an energy storage device, and a switch. The first regulator receives a system power and generates a first regulated voltage when the system power is available. The energy storage device is coupled to a node. The second regulator comprises an input coupled to the node and provides a second regulated voltage to a real-time clock generator. The switch is coupled between the first regulator and the node. The switch is turned on when the system power is available and turned off when the system power is not available.

Abstract: A power supply system (and method) for an exhibition stand having a frame that includes upstanding posts and transverse members. The power supply system (and method) includes an elongate member forming in use one of the transverse members of the frame. The elongate member includes a power inlet connectable to a power supply, a power outlet, and a circuit connecting the power inlet and power outlet. The power supply system (and method) also includes a power take off unit having a power inlet and at least two power outlets, and a plurality of electrical connecting means. The power outlet of the elongate member can be connected by means of one of the electrical connecting means to the power inlet of the power take-off unit such that power can be tapped from the elongate member and directed from one power outlet of the take-off unit, via another of the electrical connecting means, to the elongate member of an adjacent exhibition stand.

Abstract: Disclosed is an improved noise reducing apparatus using an anti-circuit, including a digital logic circuit and a digital anti-circuit corresponding to the digital logic circuit. The digital anti-circuit functions to cancel noise generated by the digital logic circuit. The anti-circuit includes logic to generate a similar number of switching edges as the logic circuit, where the anti-circuit edges are in the opposite direction as the logic circuit. The anti-circuit may have a circuit structure close to that of the noisy circuit, or can be formed of components different in structure but generating an output pattern similar to (and opposite from) the noisy circuit. In some embodiments, the differently structured components can include a state machine coupled to a memory or look-up-table.

Abstract: Stage devices for various uses including use as a reticle stage or substrate stage in a microlithography system. An exemplary device includes a carrier and multiple linear EM actuators that couple the carrier monolithically to a base. The linear EM actuators collectively provide controlled movability of the carrier relative to the base in all six DOFs (X, Y, Z, ?X, ?Y, ?Z). The multiple linear EM actuators comprise at least one multiple-DOF linear actuator but fewer than six linear EM actuators. For example, the stage device can have two two-DOF linear actuators providing respective motions of the carrier in the X, Y and Y, Z DOFs (and collectively in all six DOFs) or can have two two-DOE linear actuators providing motions of the carrier in the Y, Z, ?X, ?Y, and ?Z DOFs and a one-DOF linear actuator providing motions in the X DOF.

Abstract: A system and method for a multiple degrees of freedom motor includes an output shaft. A stator is provided having at least a first lamination stack. Each lamination stack has an interior curved surface. The lamination stacks are disposed adjacent the output shaft. A rotor is fixed to the output shaft and movably supported adjacent the stator with an air gap disposed between the rotor and the stator. The rotor includes at least one magnet disposed thereon. The magnet is movable along the interior curved surface of the lamination stacks in directions defining at least a first degree of freedom. The rotor is biased toward a base position along at least one degree of freedom.

Abstract: A rotor for a pneumatic tool having electricity-generating capabilities comprises a shaft and an integral rotor body. The rotor body includes recesses dimensioned to receive an insulated subassembly comprising a magnet received within a nonmagnetic insulator. The nonmagnetic insulator acts to allow flux to be concentrated against stator windings. The improved rotor can be fitted with the insulated subassemblies in order to cooperate with a stator in the tool to generate electricity upon rotation of the rotor when pressurized fluid is applied to the vanes. A ring stator is supportable by a nonmagnetic end plate of the pneumatic tool, is disposed between the rotor and the rotor bearing and is preferably formed of Silicon Core Iron “B-FM” and magnet wire.

Abstract: There is provided a hybrid stepping motor comprising the following: a first rotor yoke and a second rotor yoke, each of the rotor yokes having a plurality of rotor teeth on a periphery thereof; a rotating shaft located between the first and second rotor yokes and supporting the first and second rotor yokes on a same axis, the rotating shaft including at least one permanent magnet magnetized in a direction of the axis; and a plurality of stator yokes, each of the stator yokes having a core portion, a coil wound around the core portion, and a plurality of stator teeth extending parallel to the axis from opposed end portions of the core portion, the stator yokes being disposed at regular intervals around the rotating shaft so that a constant air gap is maintained between radially inward surfaces of the stator teeth and radial end surfaces of the rotor teeth. A positive current is applied to the opposed and paired coils of said coils and a negative current is applied to the rest coils of said coils.

Abstract: The machine contains a rotor with a hot rotor housing in which a cold part with a superconductive rotor winding is located. A part which acts as a baffle screen is provided on the outside of the rotor housing, facing a stator. Supporting elements are intended to be provided at predetermined points between the hot housing and the cold part, extending in the radial direction to such an extent that, during normal operation of the machine, a short separation is in each case formed between the supporting elements and the hot housing or the cold part, and such that a force fit is produced between the hot housing and the cold part via the supporting elements only in the event of a defect which leads to deformation of the hot housing of the machine.

Abstract: A heat generating member cooling structure in which a coolant space is formed between a heat releasing surface that is thermally connected to a heat generating member and an opposing surface that is positioned opposite the heat releasing surface, includes a plurality of heat releasing fins that are provided within the coolant space so as to be parallel to one another and stand from the heat releasing surface toward the opposing surface, and an inter-fin passage, through which a coolant flows, formed between every two of the plurality of heat releasing fins that are positioned adjacent to each other.

Abstract: A lamination has at least one spacing strip which is formed by cutting out sheet-metal pieces from a metal sheet in order to define an inner boundary and an outer boundary of the lamination. A cut line is made in the metal sheet to define a contour for a spacing strip which is bent out of the main plane of the lamination.

Abstract: In a motor driving apparatus, an incline of boundary lines of magnetic poles with respect to a rotating shaft of a rotor and an incline in a movable direction of a magnetic detection unit with respect to the rotating shaft of the rotor are different.

Abstract: An electric motor, e.g., a fan motor for an air conditioning fan of a motor vehicle, includes a receiving housing serving as a motor housing, which has a receiving opening into which the electric motor at least partially extends, as well as including connection elements for supplying power to the electric motor, and attachment means for the electrical connection elements. The attachment for the electrical connection elements is provided on the electric motor.

Abstract: A method of manufacturing a terminal assembly of an alternator for vehicles and the terminal assembly manufactured by the method. The terminal assembly manufacturing method of the present invention includes a first step of notching and piercing a blank plate, a second step of deep-drawing notched portions of the plate to form a plurality of assembly protrusions, each of which has a pierced cylindrical shape protruding from the plate, a third step of trimming and piercing the plate to give it a predetermined shape, and a fourth step of coining and bending the plate, thus forming the terminal assembly.

Abstract: Gear drive unit (10) with a plug-in electronics module (44), in particular for adjusting moving parts in a motor vehicle, comprising an electric motor (12) which has an armature shaft (18), a lower housing shell (14) and an upper housing shell (16), which housing shells can be joined together radially with respect to the armature shaft (18) at a separating plane (32) and enclose the electric motor (12), wherein an electronics interface (42) for receiving a plug-in electronics module (44) is arranged on the lower housing shell (14), and the electronics interface (42) has a sealing plane (54) between an outer face (40) of the lower housing shell (14) and the plug-in electronics module (44), this sealing plane been arranged at least approximately parallel to the separating plane (34).

Abstract: A electric rotating machine includes a rotor winding constituting a part of a rotor, a conductor provided in a center portion in a radial direction of a rotor body for supplying electricity to the rotor winding from the outside, a leader drawn from the conductor to an outside diameter side, and a connecting line constructed by stacking a plurality of conductor plates to electrically connect the rotor winding and the leader. The connecting line consists of a radial direction linear portion which is straight in the radial direction on the leader side, and a bending portion which branches into two routes toward opposite directions to each other in a rotor shaft direction from the radial direction linear portion and has a linear portion formed at a part of the bending portion. The linear portion of the bending portion is joined to a bottom surface of the rotor winding.

Abstract: In a rotor of a magneto generator in which permanent magnets are attached to the inner circumference of a peripheral wall of a cup-shaped formed flywheel, and a plurality of trigger poles are arranged on the outer circumference of the flywheel; the plurality of trigger poles are simultaneously punched out by press working to form a protrusion ring which is formed of a separate member from the flywheel, and the protrusion ring is integrally incorporated to the flywheel to configure the rotor.