Patents Issued in February 8, 2011
  • Patent number: 7884474
    Abstract: A method of fabricating a semiconductor device having an air-gapped multilayer interconnect wiring structure is disclosed. After having formed a first thin film on or above a substrate, define a first opening in the first thin film. Then, deposit a conductive material in the first opening. Then form a second thin film made of a porous material above the first thin film with the conductive material being deposited in the first opening. Next, define in the second thin film a second opening extending therethrough, followed by deposition of a conductive material in the second opening. The first thin film is removed through voids in the second thin film after having deposited the conductive material in the second opening. An integrated semiconductor device as manufactured thereby is also disclosed.
    Type: Grant
    Filed: September 17, 2008
    Date of Patent: February 8, 2011
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Akihiro Kojima
  • Patent number: 7884475
    Abstract: A microelectronic structure includes a dielectric layer located over a substrate. The dielectric layer is separated from a copper containing conductor layer by an oxidation barrier layer. The microelectronic structure also includes a manganese oxide layer located aligned upon a portion of the copper containing conductor layer not adjoining the oxidation barrier layer. A method for fabricating the microelectronic structure includes sequentially forming and sequentially planarizing within an aperture within a dielectric layer an oxidation barrier layer, a manganese containing layer (or alternatively a mobile and oxidizable material layer) and finally, a planarized copper containing conductor layer (or alternatively a base material layer comprising a material less mobile and oxidizable than the mobile and oxidizable material layer) to completely fill the aperture.
    Type: Grant
    Filed: October 16, 2007
    Date of Patent: February 8, 2011
    Assignee: International Business Machines Corporation
    Inventors: Jeffrey Peter Gambino, Stephen Ellinwood Luce
  • Patent number: 7884476
    Abstract: Embodiments relate to a semiconductor device. In embodiments, the semiconductor device may include a semiconductor substrate having a first metal line; a pre-metal dielectric (PMD) layer over the first metal line on the semiconductor substrate; a first metal layer formed in a first contact hole in the PMD layer; a second metal layer formed in a second contact hole in the PMD layer; and a second metal line electrically connected to the first and second metal layers, respectively, over the PMD layer, wherein the first and second metal layers are located at prescribed positions and configured to be electrically connected to the first metal line.
    Type: Grant
    Filed: February 2, 2009
    Date of Patent: February 8, 2011
    Assignee: Dongbu HiTek Co., Ltd.
    Inventor: Keun Soo Park
  • Patent number: 7884477
    Abstract: A hard mask is formed on an interconnect structure comprising a low-k material layer and a metal feature embedded therein. A block polymer is applied to the hard mask layer, self-assembled, and patterned to form a polymeric matrix of a polymeric block component and containing cylindrical holes. The hard mask and the low-k material layer therebelow are etched to form cavities. A conductive material is plated on exposed metallic surfaces including portions of top surfaces of the metal feature to form metal pads. Metal silicide pads are formed by exposure of the metal pads to a silicon containing gas. An etch is performed to enlarge and merge the cavities in the low-k material layer. The metal feature is protected from the etch by the metal silicide pads. An interconnect structure having an air gap and free of defects to surfaces of the metal feature is formed.
    Type: Grant
    Filed: December 3, 2007
    Date of Patent: February 8, 2011
    Assignee: International Business Machines Corporation
    Inventors: Griselda Bonilla, Daniel C. Edelstein, Satyanarayana V. Nitta, Takeshi Nogami, Shom Ponoth, David L. Rath, Chih-Chao Yang
  • Patent number: 7884478
    Abstract: In a semiconductor apparatus having a plurality of wiring layers, the semiconductor apparatus includes a bonding pad formed by an uppermost wiring layer, a first-layer plug wire formed by a first lower wiring layer in a region under the bonding pad, and a first conductive plug connecting the bonding pad and the first-layer plug wire. The first-layer plug wire may include a plurality of first-layer plug wires arranged in parallel to one another in a stripe pattern.
    Type: Grant
    Filed: February 26, 2007
    Date of Patent: February 8, 2011
    Assignee: Elpida Memory, Inc.
    Inventor: Shoji Azuma
  • Patent number: 7884479
    Abstract: A method of closely interconnecting integrated circuits contained within a semiconductor wafer to electrical circuits surrounding the semiconductor wafer. Electrical interconnects are held to a minimum in length by making efficient use of polyimide or polymer as an inter-metal dielectric thus enabling the integration of very small integrated circuits within a larger circuit environment at a minimum cost in electrical circuit performance.
    Type: Grant
    Filed: August 16, 2007
    Date of Patent: February 8, 2011
    Assignee: Megica Corporation
    Inventor: Mou-Shiung Lin
  • Patent number: 7884480
    Abstract: A technique for enhancing the performance of a memory- and logic-equipped semiconductor device is provided. The semiconductor device comprises a semiconductor substrate (1), an insulating layer (19) on the semiconductor substrate (1), a plurality of contact plugs (16, 66) in the insulating layer (19), and an insulating layer (30) where capacitors (82), a plurality of contact plugs (25, 75), barrier metal layers (27, 87) and copper interconnections (29, 88) are formed. Source/drain regions (9) in the upper surface of the semiconductor substrate (1) are electrically connected to the copper interconnections (29). One of adjacent source/drain regions (59) in the upper surface of the semiconductor substrate (1) is electrically connected to the copper interconnection (88), while the other is electrically connected to the capacitor (82).
    Type: Grant
    Filed: August 5, 2008
    Date of Patent: February 8, 2011
    Assignee: Renesas Electronics Corporation
    Inventors: Atsushi Hachisuka, Atsushi Amo, Tatsuo Kasaoka, Shunji Kubo
  • Patent number: 7884481
    Abstract: A semiconductor chip package is disclosed. The semiconductor chip package comprises a package substrate having a bottom surface. At least four adjacent ball pads are on the bottom surface, arranged in a first two-row array along a first direction and a second direction. At least four vias are drilled through the package substrate, arranged in a second two-row array, wherein each of the vias in a row of the second two-row array is offset by a first distance along the first direction and a second distance along the second direction from the connecting ball pads in a row of the first two-row array, and each of the vias in the other adjacent row of the second two-row array is offset by the first distance along an opposite direction to the first direction and the second distance along the second direction from the connecting ball pads in the other adjacent row of the first two-row array.
    Type: Grant
    Filed: November 28, 2007
    Date of Patent: February 8, 2011
    Assignee: Mediatek Inc.
    Inventor: Tung-Hsien Hsieh
  • Patent number: 7884482
    Abstract: It is a flip-chip mounting substrate according to the invention has a wiring pattern in which bonding pads and predetermined parts of lead wires continuously extending from the bonding pads are exposed from an insulating layer or a solder resist. In the flip-chip mounting substrate, exposed parts of the wiring pattern are formed in to a plurality of different shapes. The exposed parts are formed so that the areas of the bonding pads are substantially equal to one another, and that the total areas of predetermined parts of the lead wires continuously extending from the bonding pads are substantially equal to one another.
    Type: Grant
    Filed: December 17, 2007
    Date of Patent: February 8, 2011
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Takashi Ozawa, Yasushi Araki, Masatoshi Nakamura, Seiji Sato
  • Patent number: 7884483
    Abstract: A method of electrically joining a first contact on a first wafer with a second contact on a second wafer, the first contact, a rigid material, and the second contact, a material that is malleable relative to the rigid material, such that when brought together the rigid material will penetrate the malleable material, the rigid and malleable materials both being electrically conductive involves bringing the rigid material into contact with the malleable material, applying a force to one of the first contact or the second contact so as to cause the rigid material to penetrate the malleable material, heating the rigid and malleable material so as to cause the malleable material to soften, and constraining the malleable material to within a pre-specified area.
    Type: Grant
    Filed: January 10, 2006
    Date of Patent: February 8, 2011
    Assignee: Cufer Asset Ltd. L.L.C.
    Inventors: John Trezza, John Callahan, Gregory Dudoff
  • Patent number: 7884484
    Abstract: A wiring board includes an insulating layer in which a semiconductor chip is embedded, and a wiring structure connected to the semiconductor chip. A reinforcing member reinforcing the insulating layer is embedded in the insulating layer. This enables reduction in a thickness of the wiring board and a suppression of warpage of the wiring board.
    Type: Grant
    Filed: March 10, 2006
    Date of Patent: February 8, 2011
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Takaharu Yamano, Masahiro Sunohara, Hajime Iizuka, Tetsuya Koyama
  • Patent number: 7884485
    Abstract: Systems and methods are disclosed for forming interconnects between semiconductor devices in accordance with one or more embodiments of the present invention. For example, a method of forming interconnects between semiconductor devices includes depositing a plurality of first contacts on a plurality of corresponding first pads of a first semiconductor device; forming a plurality of plated contacts on a plurality of corresponding second pads of a second semiconductor device; aligning the plurality of first contacts with the plurality of plated contacts; and joining the plurality of first contacts to the plurality of plated contacts to form the interconnects between the first semiconductor device and the second semiconductor device.
    Type: Grant
    Filed: February 14, 2007
    Date of Patent: February 8, 2011
    Assignee: Flir Systems, Inc.
    Inventors: Jeffrey B. Barton, Diane M. Salazar, Joseph H. Durham
  • Patent number: 7884486
    Abstract: A chip stacked package structure and applications are provided. The chip-stacked package structure includes a main substrate, a baseboard substrate, and a molding compound. The main substrate has a substrate and a first chip. The substrate has a first surface and a second surface opposite to the first surface. The first chip is disposed on the first surface and electrically connected to the substrate via first bumps. The baseboard substrate has a third surface and a fourth surface faced towards the substrate. The baseboard substrate includes a core layer having a plurality of first through holes and a first accommodation space in which the first chip is received. The second chip is disposed on the third surface of the baseboard substrate. The molding compound is used to encapsulate the main substrate, and the baseboard substrate.
    Type: Grant
    Filed: December 29, 2009
    Date of Patent: February 8, 2011
    Assignee: Chipmos Technology Inc.
    Inventors: Yu-Tang Pan, Shih-Wen Chou
  • Patent number: 7884487
    Abstract: Provided are a rotation joint capable of compensating for a mismatch due to thermal expansion and a semiconductor device having the same. The rotation joint can include a support member and a first contact member coupled to a first portion of the support member such that a surface of the first contact member is moveable relative to a surface of the support member adjacent to the first contact member. The first contact member can include solder material.
    Type: Grant
    Filed: November 19, 2007
    Date of Patent: February 8, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Se-Young Yang, Wang-Ju Lee
  • Patent number: 7884488
    Abstract: A structure and method of forming low cost bond pads is described. In one embodiment, the invention includes depositing an insulating layer over a last metal line of a substrate and forming an opening in the insulating layer. A colloid is printed over the insulating layer and fills the opening in the insulating layer. A conductive via and bond pads are formed by heating the colloid.
    Type: Grant
    Filed: May 1, 2008
    Date of Patent: February 8, 2011
    Assignee: Qimonda AG
    Inventor: Harry Hedler
  • Patent number: 7884489
    Abstract: An insulative substrate includes a plurality of flexible retaining clips and a plurality of alignment and retaining pins. A metal leadframe includes a plurality of leads. Each lead terminates in a spring contact beam portion. The leadframe is attached to the substrate (for example, by fitting a hole in each lead over a corresponding alignment and retaining pin and then thermally deforming the pin to hold the lead in place). An integrated circuit is press-fit down through the retaining clips such that pads on the face side of the integrated circuit contact and compress the spring contact beams of the leads. After the press-fit step, the retaining clips hold the integrated circuit in place. The resulting assembly is encapsulated. In a cutting and bending step, the leads are singulated and formed to have a desired shape. The resulting low-cost package involves no wire-bonding and no flip-chip bond bump forming steps.
    Type: Grant
    Filed: January 12, 2010
    Date of Patent: February 8, 2011
    Assignee: IXYS CH GmbH
    Inventors: Thomas Stortini, John A. Ransom
  • Patent number: 7884490
    Abstract: An apparatus for generating electric current from a vibrating blade exposed to a fluid flow. in one embodiment, a plurality of blades are secured within a tail cone of a steam turbine and each blade includes a magnet and a coil associated with the magnet to produce electric current in the coil when the magnet moves across the coil. Each blade is designed to have a natural frequency so that the blade will resonate under the influence of the exhaust flow from the turbine in the tail cone. Abutment members are mounted on the blade or the fixed support to limit the range of motion of the vibrating blade so that it does not exceed the fatigue limit. The blades are made from a low damping material such as titanium so that a low frequency is produced.
    Type: Grant
    Filed: December 2, 2009
    Date of Patent: February 8, 2011
    Assignee: Florida Turbine Technologies, Inc.
    Inventors: Jack W Wilson, III, Jack W Wilson, Jr.
  • Patent number: 7884491
    Abstract: A power turbine speed control system for a turbo-shaft type gas turbine engine that has a gas generator compressor spool and a power turbine spool and drives an electrical generator that powers at least one electrical load by way of at least one electrical bus, comprises a power turbine controller that senses the rotary speed of the power turbine spool and generates at least one signal that changes the torque of the electrical generator in response to the sensed change in the rotary speed of the power turbine spool.
    Type: Grant
    Filed: July 5, 2010
    Date of Patent: February 8, 2011
    Assignee: Hamilton Sundstrand Corporation
    Inventors: David G. Halsey, Charles J. Romenesko
  • Patent number: 7884492
    Abstract: Methods and systems for reducing heat loss in a generator system are provided. The generator system includes an electrical generator and a power converter. The method includes generating electricity in the generator at a first power factor and converting electricity in the converter at a second power factor in a first mode of operation and generating electricity in the generator at a third power factor wherein the third power factor is greater than the first power factor and converting electricity in the converter at a fourth power factor wherein the fourth power factor is less than the second power factor in a second mode of operation such that the power output of the generator system in the second mode of operation is substantially equal to the power output of the generator system in the first mode of operation and the generator currents are facilitated being reduced.
    Type: Grant
    Filed: November 13, 2007
    Date of Patent: February 8, 2011
    Assignee: General Electric Company
    Inventors: Qimou Xiong, Xiang Yu, Yu Zhou, Yingming Zhang, David Smith, Giesbert Krueger, Andre Langel
  • Patent number: 7884493
    Abstract: A disc brake arrangement is provided as adapted for a wind turbine generator incorporating a rotor shaft supporting a rotor wheel and support ring for a rotor structure surrounded by a stator structure within a generator casing. The disc brake arrangement includes a brake disc mounted normal to and concentric with the rotor shaft and operatively connected to the support ring. A plurality of disc brake calipers are arranged concentrically with the rotor shaft and adapted to engage the brake disc.
    Type: Grant
    Filed: September 30, 2008
    Date of Patent: February 8, 2011
    Assignee: General Electric Company
    Inventors: Eric S. Buskirk, Blake W. Wilson
  • Patent number: 7884494
    Abstract: A pushbutton device for actuating an electropneumatic parking brake (EPH) of a vehicle, which is connected to an evaluating electronic unit via connecting cables. In order to detect switching processes and/or faults, the input resistance of the pushbutton device between the connecting points is evaluated, thus allowing the evaluating electronic unit to reliably detect both the switched position of the pushbutton device and potential fault conditions.
    Type: Grant
    Filed: November 11, 2006
    Date of Patent: February 8, 2011
    Assignee: WABCO GmbH
    Inventors: Matthias Grimm, Jens Ohlendorf
  • Patent number: 7884495
    Abstract: A method and an apparatus are used in hot swap of AC or DC line replaceable modules (40A). The apparatus according to one embodiment comprises a pin assembly (183), the pin assembly (183) being connectable to a module (40A) and connectable to a backplane (104), the pin assembly (183) resistively reducing a current associated with the module (40A) during disconnection of the module (40A) from the backplane (104), and presenting a high resistance to the module (40A) during connection of the module (40A) to the backplane (104), and a low resistance to the module (40A) at completion of the connection of the module (40A) to the backplane (104); and a hot swap detector (134) connectable to the pin assembly (183), the hot swap detector (134) detecting the disconnection of the module (40A) from the backplane (104), and detecting the connection of the module (40A) to the backplane (104).
    Type: Grant
    Filed: May 16, 2006
    Date of Patent: February 8, 2011
    Assignee: Honeywell International Inc.
    Inventor: Hassan Ali Kojori
  • Patent number: 7884496
    Abstract: The configurations of a switched-mode power supply and a controlling method thereof are provided. The proposed switched-mode power supply includes a first output converter receiving a DC input voltage and generating a first high power DC voltage output and at least one low power DC voltage output, and a second output converter receiving the DC input voltage and generating a second high power DC voltage output coupled to the first high power DC voltage output to generate a coupled output, wherein the first output converter works and the second output converter idles when a transient power of the coupled output is not larger than a rated output power of the first high power DC voltage output, and both the first and the second output converters work when the transient power is larger than the rated output power.
    Type: Grant
    Filed: June 27, 2008
    Date of Patent: February 8, 2011
    Assignee: Delta Electronics, Inc.
    Inventors: Fei Li, Hongjian Gan, Jianping Ying
  • Patent number: 7884497
    Abstract: Provided is a power supply circuit generating a desired voltage by voltage multiplication, and satisfying both a demand to reduce current consumption and a demand to enable operation with a low power voltage at the same time. A power supply circuit of the present invention includes: a voltage generating circuit for generating internal voltages VI1 and VI2 from a power supply voltage VDD; a voltage step-up/down circuit for generating voltages VO1 to VO3 each having a different level by multiplying the internal voltages VI1 and VI12; and a voltage comparison circuit for comparing the voltage VO2 with the power supply voltage VDD. The voltage generating circuit is configured to select one of the internal voltages VI1 and VI2 according to an output of the voltage comparison circuit. Additionally, a voltage multiplication rate of the voltage multiplication circuit is switched according to the output of the voltage comparison circuit.
    Type: Grant
    Filed: February 13, 2009
    Date of Patent: February 8, 2011
    Assignee: Renesas Electronics Corporation
    Inventors: Makoto Sasaki, Kentaro Tanaka, Takafumi Natsume
  • Patent number: 7884498
    Abstract: In a method and an apparatus for operation of a dishwasher, a total maximum electric output is assigned to a group of electric consumer elements of the dishwasher. In addition, at least two output levels are assigned to each electric consumer element of said group. An optimum combination of output levels is then selected in a requirement determination step, based on an operational state B of the dishwasher, whereby for each consumer element the selected output level is adapted to the output requirement of the consumer element in operational state B and the total output of all consumer elements does not exceed the maximum electric total output. The output levels of the individual consumer elements are optimally adapted in accordance with the requirements in operating phases of the dishwasher, thus allowing a response to be made to any fluctuations in the operational state.
    Type: Grant
    Filed: August 25, 2005
    Date of Patent: February 8, 2011
    Assignee: Meiko Maschinenbau GmbH & Co KG
    Inventors: Engelbert Ecker, Marcus Eggs, Dietmar Zapf, Michael Streb
  • Patent number: 7884499
    Abstract: Methods and apparatuses for intervening in the self power or thermal regulations of a plurality of independent power consumption devices are described herein. The novel methods may include monitoring power consumption and thermal conditions of the plurality of power consumption (i.e., power/heat dissipation) devices that are configured to independently self-regulate their power/thermal production. A determination may then be made as to whether an aggregate of the power and/or thermal production of the plurality of power consumption devices exceed a threshold. And if the aggregate of the power or thermal production of the power consumption devices was determined to exceed the threshold, terminating, at least partially, the independent self-regulating of the thermal production and intervening in the thermal regulation of one or more of the power consumption devices.
    Type: Grant
    Filed: June 30, 2008
    Date of Patent: February 8, 2011
    Assignee: Intel Corporation
    Inventors: Leslie E. Cline, Sitaram Yadavalli, Ishmael Santos, Jim Hermerding
  • Patent number: 7884500
    Abstract: A direct current to pulse amplitude modulated (“PAM”) current converter, denominated a “PAMCC”, is connected to an individual source of direct current. The PAMCC receives direct current and provides pulse amplitude modulated current at its output. An array of PAMCCs constructed in accordance with the present invention form a distributed multiphase inverter whose combined output is the demodulated sum of the current pulse amplitude modulated by each PAMCC. The array is configured as a series of stages, wherein the power sources within each stage are in parallel. The series of stages provides for a high voltage AC or DC output. In some embodiments a weak power source is compensated for by adjusting the voltage or the current of the weak power source.
    Type: Grant
    Filed: April 22, 2009
    Date of Patent: February 8, 2011
    Assignee: Array Converter Inc.
    Inventor: Kent Kernahan
  • Patent number: 7884501
    Abstract: A method for automatic operating voltage detection, in which one internal supply voltage (vdd) is selected from at least two different external supply voltages, with a first external voltage supply (VDDA) being applied permanently, is based on the object of reducing the circuit complexity for automatic operating voltage detection, the operating current caused by the selection arrangement and the required chip area, in which case the voltage ratios between the two different external supply voltages can be as required. This object is achieved in that a reference voltage (Vref) and a voltage (VDDreg) is produced from the first external supply voltage (VDDA), the reference voltage (Vref) is compared with a second external supply voltage (VDDIO), and either the voltage (VDDreg) produced from the first external supply voltage (VDDA) or the second external supply voltage (VDDIO) is released as an internal supply voltage (vdd), depending on the comparison.
    Type: Grant
    Filed: March 2, 2007
    Date of Patent: February 8, 2011
    Assignee: Zentrum Mikroelektronik Dresden AG
    Inventors: Michael Gieseler, Manfred Sorst
  • Patent number: 7884502
    Abstract: A self-contained conveyable power unit for producing 12V/24V, 110V AC, and 220V AC electricity at a desired location independent of external power sources integrates within one weather-resistant molded nonmetallic material based housing a power generating device of a selectable combination of a renewable energy type (e.g., solar), power management devices, power storage devices and management reporting devices. Additional optional power generating devices, renewable or of traditional fuel type, can be contained within or coupled to the housing. The system includes devices or an array of devices contained within the housing for the storage of electrical power. A device for power management is contained within the housing as is networking equipment of wireless or wired type for remote system observation and reporting. The system and housing are modular and configured to produce power using any combination of renewable and non-renewable energy resources.
    Type: Grant
    Filed: August 9, 2007
    Date of Patent: February 8, 2011
    Assignee: Zerobase Energy, LLC
    Inventors: Zachary Lyman, Cabot Lyman, Henry Gentenaar
  • Patent number: 7884503
    Abstract: The invention relates to a method and to an arrangement for harmonic-wave suppression in AC voltage-operated PTC heaters, especially in frequency-stable and frequency-variable alternating-voltage networks in aerospace applications. The problem of harmonic-wave suppression for AC voltage-operated PTC heaters, in which the harmonic waves are suppressed by superimposing a correction current, which permits a simple and economical generation of the harmonic-wave suppression signal, is solved according to the invention by generating a correction current in a correction current circuit arranged parallel to the PTC heater using an ohmic resistor (4). The correction current is generated and additively superimposed exclusively for suppressing the third harmonic of the heating current of the PTC heater.
    Type: Grant
    Filed: March 13, 2008
    Date of Patent: February 8, 2011
    Assignee: ESW GmbH
    Inventors: Klaus Seidler, Joerg Engelhardt
  • Patent number: 7884504
    Abstract: A high voltage, fast pulse rise/fall time, and high repetition rate pulse generator solves the high pulse repetition rate limitations associated with RF power amplifiers and gap switch type pulse generators. The pulse generator employs a transmission line architecture and structural techniques that allow for continued high voltage, fast rise/fall time, and high repetition pulse rate operation of the pulse generator without impairment of the pulse generator while exceeding performance characteristics achievable with conventional RF power amplifiers and gap switch type pulse generators.
    Type: Grant
    Filed: March 3, 2008
    Date of Patent: February 8, 2011
    Assignee: General Electric Company
    Inventors: Fengfeng Tao, Frank Jakob John Mueller, Robert Carl Murray, Seyed Gholamali Saddoughi, Abdelkrim Younsi
  • Patent number: 7884505
    Abstract: A dry-type high-voltage load system apparatus has a space-saving structure, which is resistant to chain breaking, arc discharge and vibration, and a method of preventing the chain breaking and the arc discharge for use with the system apparatus. The system apparatus includes a dry-type high-voltage load system circuit including a low-voltage bank formed of lower-capacity configuration banks which include three-phase resistor circuits which are low-voltage resistor circuit. A high-voltage bank includes lower-capacity configuration banks for a high-voltage resistor circuit formed of three-phase resistor circuits. The three-phase resistor circuits are connected to a high-voltage power generator in parallel and arein the form of a Y-connection of three resistor arrays so that an isolated and independent neutral point is unconnected to other neutral points. The three phase resistor circuits may also be in the form of a ?-connection.
    Type: Grant
    Filed: April 16, 2009
    Date of Patent: February 8, 2011
    Assignee: Kouken Company, Limited
    Inventor: Kesafumi Matsumoto
  • Patent number: 7884506
    Abstract: An electronic device having at least a loop-shaped electric conductor generating electric power by electromagnetic induction is provided. The electronic device includes a voltage-detecting unit, a voltage-comparing unit and a separating unit. The voltage-detecting unit is configured to detect a voltage generated in the electric conductor by the electromagnetic induction. The voltage-comparing unit is configured to make a comparison between the voltage detected by the voltage-detecting unit and a predetermined reference voltage and determining whether the voltage detected by the voltage-detecting unit exceeds the predetermined reference voltage. The separating unit is configured to break an electric connection between the electronic conductor and an electronic circuit connecting to the electric conductor when the voltage-comparing unit determines that the voltage detected by the voltage-detecting unit exceeds the predetermined reference voltage.
    Type: Grant
    Filed: February 12, 2008
    Date of Patent: February 8, 2011
    Assignees: Sony Ericsson Mobile Communications Japan, Inc., Seiko Epson Corporation
    Inventors: Hiroshi Kato, Kuniharu Suzuki, Katsuya Suzuki, Manabu Yamazaki, Kota Onishi, Kentaro Yoda
  • Patent number: 7884507
    Abstract: The present invention is a remote electrical equipment power source. The remote electrical equipment power source includes an electrical generator adapted to power remote electrical equipment and a repulsive force conversion drive. The repulsive force conversion drive includes at least two repulsive units to repulse each other. One unit is fixed, while the second is movably suspended. There is a motion inducing plate positioned between the two repulsive units and movable between the two repulsive units. The first motion inducing plate is of a material that reduces the repulsive force between the two repulsive units. There is a drive mechanism connected to second repulsive unit.
    Type: Grant
    Filed: August 8, 2007
    Date of Patent: February 8, 2011
    Inventors: Sei-Joo Jang, Gyu-Seop Hyun
  • Patent number: 7884508
    Abstract: A linear motor comprising a stator core and/or a mover. The stator core of said linear motor comprising an inner perimeter, an outer perimeter essentially encircling the inner perimeter, a first and a second tooth being arranged along one of the inner perimeter or the outer perimeter, a slot for receiving a stator coil, said slot being a cavity arranged within the stator core, wherein said stator core is divided into a first stator part and a second stator part, said first stator part including the first tooth, being arranged to partially define the slot, and being made of soft magnetic powder, and said second stator part including the second tooth, being arranged to partially define the slot, and being made of soft magnetic powder.
    Type: Grant
    Filed: May 12, 2008
    Date of Patent: February 8, 2011
    Assignee: Höganäs AB
    Inventors: Alan Jack, Lars-Olov Pennander, Philip George Dickinson
  • Patent number: 7884509
    Abstract: A tool moving device with a linear motor is provided with a movable body which is movable bodily with a tool on a support frame through a pair of fluid bearings. A plurality of magnet constructs are circumferentially arranged on the movable body to respectively face stationary coils secured to the support frame. Each of the magnet constructs comprises at least one pair of magnet members juxtaposed in the moving direction of the magnet yoke and arranged with their polarities of magnet pole being opposite to each other, wherein respective pairs of the magnet members attached to the circumferential surface form first and second rows spaced from each other in the moving direction of the magnet yoke. Each magnet member in each of the first and second rows is arranged to be opposite in polarity of magnet pole to each of the magnet members next thereto in the circumferential direction.
    Type: Grant
    Filed: January 14, 2008
    Date of Patent: February 8, 2011
    Assignee: JTEKT Corporation
    Inventor: Naomasa Mukaide
  • Patent number: 7884510
    Abstract: The present invention is used with a stopper mechanism for mechanically stopping the rotation of a motor. A pair of brushes is disposed such that a line which passes through the center of a rotor and connects the centers of the paired brushes is offset by a predetermined angle from a line which connects the centers of paired magnets. A commutator is disposed in such a manner as to be offset from a reference position by the same angle as the predetermined angle by which the paired brushes are offset. The predetermined angle falls within a range between an angle obtained by dividing 70° by the number of pairs of stator poles and an angle obtained by dividing 290° by the number of pairs of stator poles. Specifically, in the case of two stator poles, the predetermined angle falls within a range of 70° to 290° inclusive. In the case of four stator poles, the predetermined angle falls within a range of 35° to 145° inclusive.
    Type: Grant
    Filed: December 21, 2007
    Date of Patent: February 8, 2011
    Assignee: Mabuchi Motor Co. Ltd.
    Inventors: Hiroshi Yamazaki, Hiroyuki Masutani, Masafumi Momma, Junichi Harano
  • Patent number: 7884511
    Abstract: Due to a centrifugal force in a vehicle width direction due to turning of an automobile, oil in an electric motor housing chamber housing an electric motor and oil in a transmission housing chamber housing a reduction gear and a differential gear flows to-and-fro via oil communication passages that penetrate a partitioning wall. An opening on the transmission housing chamber side of the oil communication passages is spaced from the partitioning wall. Hence, when oil moves from the transmission housing chamber side to the electric motor housing chamber side, it is possible to prevent the oil quantity on the electric motor housing chamber side from increasing excessively and suppress an increase in resistance to oil stirring by a rotor of the electric motor while retaining a constant oil amount on the transmission housing chamber side to ensure lubricating performance for the reduction gear and the differential gear.
    Type: Grant
    Filed: November 10, 2008
    Date of Patent: February 8, 2011
    Assignee: Honda Motor Co., Ltd.
    Inventors: Seiichi Mogi, Tatsuya Fukushima
  • Patent number: 7884512
    Abstract: The present invention relates to a fixing structure for printed circuit board (PCB) of micro motor, including a base and a PCB. The base has a shaft tube disposed centrally therein; at least a circuit board fixing pin is protruded beyond the base peripheral to the shaft tube; the PCB has a center hole for the shaft tube to be inserted in, and the diameter of the center hole shall be close to but not less than the outer diameter of the shaft tube; each circuit board fixing pin corresponds to a through hole disposed on the center of the PCB. Sensing plates are prevented from dropping to secure the motor to stably rotate; the circuit board fixing pin, after passing through the through hole, is fixed by an adhesive or a soldering means to make the PCB and the base perfectly fit and free from warp and vibration.
    Type: Grant
    Filed: May 3, 2007
    Date of Patent: February 8, 2011
    Assignee: Sunonwealth Electric Machine Industry Co., Ltd.
    Inventors: Alex Horng, Tso-Kuo Yin
  • Patent number: 7884513
    Abstract: A rotor includes a hub, a permanent magnet and a shaft. The hub has an inner surface and an outer surface, with an assembling hole being formed at the center of the inner surface. The permanent magnet is mounted on the inner surface of the hub. The shaft has two ends, with one end being a connecting end. The connecting end is fixed in the assembling hole of the hub. An extending member is arranged at the connecting end and extends radially from a radial surface of the shaft. The extending member is embedded in a wall of the hub. Consequently, a contact area between the hub and the shaft is radially extended and increased to provide a reliable combination of the hub and the shaft, and the rotor can be applied to a motor with minimizing dimensions.
    Type: Grant
    Filed: December 24, 2008
    Date of Patent: February 8, 2011
    Assignee: Sunonwealth Electric Machine Industry Co., Ltd.
    Inventor: Alex Horng
  • Patent number: 7884514
    Abstract: In a method for winding the stator of a multiphase electric motor a plurality of mutually spaced stator teeth are assigned to each phase, wherein all the teeth of the stator are wound without a break in the winding wire, and wherein the winding wire is taken via a contact-making element of a contact-making device before or after the winding of all the stator teeth assigned to a phase.
    Type: Grant
    Filed: September 26, 2008
    Date of Patent: February 8, 2011
    Assignees: Brose Fahrzeugteile GmbH & Co., Kommanditgesellschaft
    Inventors: Joachim Baumgartner, Tobias Buban
  • Patent number: 7884515
    Abstract: A power transmission unit includes an electric motor including a rotor arranged on an inner circumference of a stator and concentrically with the stator and a transmission mechanism for transmitting power. A portion of a predetermined constructional element of the transmission mechanism protrudes toward the stator or the rotor side coaxially with the stator or the rotor. The rotor is loosely fitted onto an outer circumferential face of the protruding portion, and a clearance is created between an outer circumferential face of the protruding portion and an inner circumferential face of the rotor into which a guide sleeve for guiding the rotor in an axial direction is inserted. The structure improves a convenience in assembling the rotor of the electric motor of the power transmission unit including the electric motor and transmission mechanism.
    Type: Grant
    Filed: March 22, 2007
    Date of Patent: February 8, 2011
    Assignees: Toyota Jidosha Kabushiki Kaisha, Aisin AW Co., Ltd.
    Inventors: Hirotatsu Ihara, Tetsuya Miura, Satoru Kasuya, Masashi Kito
  • Patent number: 7884516
    Abstract: A motor may include a rotor provided with a rotor shaft, a cylindrical bearing made of resin material and provided with a bearing part for rotatably supporting a shaft end of the rotor shaft, and a bearing holder provided with a through-hole into which the cylindrical bearing is inserted. The cylindrical bearing is slidably held in the through-hole and at least one of a first end face where the bearing part is formed and a second end face which is an opposite end face to the first end face is formed with a ring-shaped groove. Therefore, a wall thickness of resin for forming the bearing can be made thinner and thus shrinkage of the side wall part of the bearing which faces an inner peripheral face of the through-hole of the bearing holder is reduced.
    Type: Grant
    Filed: February 28, 2008
    Date of Patent: February 8, 2011
    Assignee: Nidec Sankyo Corporation
    Inventors: Shingo Iwashima, Takeyoshi Miyashita
  • Patent number: 7884517
    Abstract: A two-phase electric motor includes first and second coil groups and a magnet group. In the magnet group, N poles and S poles are disposed alternatively opposite the first and second coil groups. The first and second coil groups are disposed at positions that are out of phase with each other by an odd multiple of ?/2 in electrical angles. The coils of the first and second coil groups have substantially no magnetic material cores, and the electric motor has substantially no magnetic material yoke for forming a magnetic circuit.
    Type: Grant
    Filed: January 26, 2009
    Date of Patent: February 8, 2011
    Assignee: Seiko Epson Corporation
    Inventor: Kesatoshi Takeuchi
  • Patent number: 7884518
    Abstract: An electrical synchronous machine, in particular for use as a drive machine in motor vehicle applications. A stator has an electrical winding arrangement for generating a rotating field. A rotor has magnetic flux generating means for generating a rotor flux with which the rotating field interacts. The rotor has a first rotor section with first magnetic flux generating means and a second rotor section with magnetic flux influencing means. It is possible to move the two rotor sections relative to one another between at least a first and a second relative position in such a way that the rotor flux provided by the rotor has a different magnitude in the two relative positions.
    Type: Grant
    Filed: December 1, 2008
    Date of Patent: February 8, 2011
    Assignee: GETRAG Getriebe- und Zahnradfabrik Hermann Hagenmeyer GmbH & Cie KG
    Inventors: Uli Christian Blessing, Alexander Kreim, Ulrich Knoedel, Matthias Beck
  • Patent number: 7884519
    Abstract: Provided is a generator in which straight rod magnets have been heated to form curved ones, with the identical polarity ends of the magnets having been forcibly butted together by diamagnetic connecting devices to form a field element ring. The field element ring is arranged through three Y-shaped sets (evenly spaced apart) of one inner and two outer roller devices set on a base steel sheet. Rotary drive force is applied from the centrally placed drive motor to one of the inner and outer roller devices to rotate the field element ring. Between, and in line with, the three sets of inner and outer roller devices are arranged three segments of an armature coil that is wound around the field element ring. In turn, the armature coil is encased within three segments of an armature core that are set on the base steel sheet.
    Type: Grant
    Filed: September 11, 2006
    Date of Patent: February 8, 2011
    Inventor: Iichi Okuno
  • Patent number: 7884520
    Abstract: A brushless motor according to the present invention is provided with a tubular stator case, a stator core fitted into the stator case, and a rotor rotatably supported via a bearing inside the stator core. The stator core includes a tubular yoke portion and a plurality of split cores which are detachably mounted on the tubular yoke portion. A plurality of commutating-pole teeth which extend radially inward are integrally formed on an inner peripheral surface of the tubular yoke portion at regular intervals in the peripheral direction of the tubular yoke portion; and a root portion of each of the commutating-pole teeth has inclined shoulders which are gradually enlarged radially outward.
    Type: Grant
    Filed: November 4, 2008
    Date of Patent: February 8, 2011
    Assignees: Mitsuba Corporation, Honda Motor Co., Ltd.
    Inventors: Hisashi Ishida, Tohru Yumoto, Masaki Ishizeki, Susumu Miyazaki, Kazushi Hamaya
  • Patent number: 7884521
    Abstract: A rotor shaft (200) for a magnetic bearing device (1) is disclosed. The shaft comprises an inner portion on whose periphery a plurality of targets (240, 260, 280) separated by spacers (250, 270) are mounted. This is achieved exerting an axial pressing force (F, F?) to the peripheral parts, rather than applying a radial press fit. In this manner, a simplified construction, a higher stiffness and a higher stability at high rotational speed are achieved. Further disclosed is a rotor having a thrust disk (220) whose diameter decreases towards the periphery. This allows to use a larger thrust disk at a given rotational speed.
    Type: Grant
    Filed: August 18, 2006
    Date of Patent: February 8, 2011
    Assignee: Mecos Traxler AG
    Inventors: Philipp Buhler, Rene Larsonneur
  • Patent number: 7884522
    Abstract: Embodiments of the invention relate generally to electric motors, alternators, generators and the like, and more particularly, to stator structures and rotor-stator structures for motors that can be configured to, for example, reduce detent.
    Type: Grant
    Filed: October 26, 2007
    Date of Patent: February 8, 2011
    Assignee: NovaTorque, Inc.
    Inventors: John Petro, Ken G. Wasson, Jeremy F. Mayer
  • Patent number: 7884523
    Abstract: A brushless DC motor includes a base, a stator, a rotor, and a leak flux absorber. The base couples with the rotor. The stator has a coil module and is mounted on the base. The rotor has a shaft and a permanent magnet, with the rotor coupling with the base through the shaft. A gap is axially formed between the permanent magnet and the coil module. Also, the leak flux absorber is disposed around the coil module and is adjacent to, partially in, or totally in the gap. Consequently, a leak flux generated by the permanent magnet, which does not pass through the coil module, is absorbed by the leak flux absorber and forms close magnetic flux paths, so that high-frequency noise in operation is thus lowered.
    Type: Grant
    Filed: July 17, 2008
    Date of Patent: February 8, 2011
    Assignee: Sunonwealth Electric Machine Industry Co., Ltd.
    Inventors: Alex Horng, Tso-Kuo Yin