Abstract: Two circuit layout areas on two surfaces of a chip are connected. Holes in the chip are coordinated with a conductive paste to connect the two surfaces. Thus, fabrication is made easy and cost is reduced.

Abstract: In sophisticated semiconductor devices, the contact elements connecting to active semiconductor regions having formed thereabove closely spaced gate electrode structures may be provided on the basis of a liner material so as to reduce the lateral width of the contact opening, while, on the other hand, non-critical contact elements may be formed on the basis of non-reduced lateral dimensions. To this end, at least a first portion of the critical contact element is formed and provided with a liner material prior to forming the non-critical contact element.

Abstract: This publication discloses an electronic module and a method for manufacturing an electronic module, in which a component (6) is glued (5) to the surface of a conductive layer, from which conductive layer conductive patterns (14) are later formed. After gluing the component (6), an insulating-material layer (1), which surrounds the component (6) attached to the conductive layer, is formed on, or attached to the surface of the conductive layer. After the gluing of the component (6), feed-throughs are also made, through which electrical contacts can be made between the conductive layer and the contact zones (7) of the component. After this, conductive patterns (14) are made from the conductive layer, to the surface of which the component (6) is glued.

Abstract: A multi-chip package may include a first semiconductor package, a second semiconductor package and an interposer chip. The second semiconductor package may be arranged over the first semiconductor package. The interposer chip may be interposed between the first semiconductor package and the second semiconductor package. The interposer chip may have a receiving groove configured to receive the first semiconductor package. Thus, electrical connection reliability between the first semiconductor package and the second semiconductor package may be improved under a condition that the connecting terminals may have small sizes.

Abstract: A semiconductor device comprises a substrate, pluralities of first and second external electrodes formed in two end portions of one surface of the substrate, a first semiconductor chip mounted on the other surface of the substrate, the first semiconductor chip having an electrode pad row formed in one end portion of one surface of the first semiconductor chip and electrically connected to the first external electrodes, the first semiconductor chip being disposed so that the one end portion of the first semiconductor chip is positioned on an end portion on which the first external electrodes of the substrate are formed, and a second semiconductor chip mounted on the first semiconductor chip, the second semiconductor chip having an electrode pad row formed in one end portion of one surface of the second semiconductor chip and electrically connected to the second external electrode, the second semiconductor chip being disposed so that the one end portion of the second semiconductor chip is positioned on an end p

Abstract: A packaged microelectronic element includes a package element that further includes a dielectric element having a bottom face and a top face, first and second bond windows extending between the top and bottom faces, a plurality of chip contacts disposed at the top face adjacent to the first and second bond windows, and first and second sets of package contacts exposed at diagonally opposite corner regions of the top face, wherein the first and second sets conductively connected to the chip contacts. There is also a microelectronic element adjacent to the bottom face of the dielectric element, as well as bond wires extending through the first and second bond windows to conductively connect the microelectronic element to the chip contacts.

Abstract: Packaged microelectronic elements are provided which include a dielectric element, a cavity, a plurality of chip contacts and a plurality of package contacts, and microelectronic elements having a plurality of bond pads connected to the chip contacts.

Abstract: Thermally induced stress in a semiconductor die, i.e., in a complex metallization system thereof, may be reduced by “dividing” a package substrate into two or more substrate sections, which may have formed therebetween an appropriate stress buffer region, for instance a region of superior resiliency. In this case, the total deformation of the package substrate may be reduced, thereby also reducing the thermally induced stress forces in the complex metallization system of the semiconductor die. Hence, for a given size and complexity of a metallization system, an increased production yield and superior reliability may be achieved.

Abstract: A stress compensation region that may be appropriately positioned on a package substrate may compensate for or at least significantly reduce the thermally induced mechanical stress in a sensitive metallization system of a semiconductor die, in particular during the critical reflow process. For example, a stressor ring may be formed so as to laterally surround the chip receiving portion of the package substrate, wherein the stressor ring may efficiently compensate for the thermally induced deformation in the chip receiving portion.

Abstract: The present invention includes a dicing sheet-attached film for forming a semiconductor protection film (14), which protects a semiconductor element (18) mounted on a base material and positioned on the outermost side. The dicing sheet-attached film for forming a semiconductor protection film (14) comprises a protection film-forming layer (12) which is composed of a resin composition and protects a surface of the semiconductor element (18) opposite to the surface of the semiconductor element (18) mounted on the base material, and a dicing sheet (13) laminated on the protection film-forming layer.

Abstract: A method for producing semiconductor components and a component obtainable by such a method is disclosed. The method comprises the following steps: fixing a conductive film on a carrier; adhesively bonding semiconductor chips onto the conductive film using an adhesive layer, wherein active surfaces of the semiconductor chips, the active surfaces having connection contacts, are situated on that side of the chips which faces the film; overmolding the chips adhesively bonded onto the conductive film with a molding compound; and releasing the conductive film with the overmolded chips from the carrier. In this case, the adhesive layer is structured in such a way that at least connection contacts of the semiconductor chips are free of the adhesive layer and are kept free of the molding compound.

Abstract: A method of producing an electronic module with at least one electronic component and one carrier. A structure is provided on the carrier so that the electronic component can take a desired target position relative to the structure. The structure is coated with a liquid meniscus suitable for receiving the electronic component. Multiple electronic components are provided at a delivery point for the electronic components. The carrier, with the structure, is moved nearby and opposite to the delivery point, where the delivery point delivers one of the electronic components without contact, while the structure on the carrier is moving near the delivery point, so that after a phase of free movement the electronic component at least partly touches the material, and the carrier, with the structure, is moved to a downstream processing point, while the electronic component aligns itself to the structure on the liquid meniscus.

Abstract: A semiconductor device includes a die pad, a semiconductor element which is loaded on the die pad, and a sealing resin. A plurality of electrically conductive portions each having a layered structure including a metal foil comprising copper or a copper alloy, and electrically conductive portion plating layers provided at both upper and lower ends of the metal foil are arranged around the die pad. The die pad has a lower die pad plating layer, and the semiconductor element is loaded on the die pad comprising such a die pad plating layer. Electrodes provided on the semiconductor element are electrically connected with top ends of the electrically conductive portions via wires, respectively. The lower electrically conductive portion plating layers of the electrically conductive portions and the die pad plating layer of the die pad are exposed outside from the sealing resin on their back faces.

Abstract: A method of making a microelectronic package, and a microelectronic package made according to the method. The method includes: bonding and thermally coupling a plurality of IC dies to an IHS panel to yield a die-carrying IHS panel; mounting the die-carrying IHS panel onto a substrate panel including a plurality of package substrates to yield a combination including the die-carrying IHS panel mounted to the substrate panel; and singulating the combination to yield a plurality of microelectronic packages, each of the packages including: an IHS component of the IHS panel, one of the plurality IC dies bonded and thermally coupled to said IHS component, and one of the plurality of package substrates, said IHS component and said one of the plurality of IC dies being mounted to said one of the plurality of package substrates to form said each of the packages.

Abstract: Disclosed herein is a humidifier. The humidifier includes a rear casing, a front casing placed in front of the rear casing and having an opening formed on its front side, a fan housing having an air intake unit formed on its front side, wherein an air blower unit is formed on one side of a circumference part of the fan housing, a humidification filter placed in front of the air intake unit, and a water tank placed on a side of the humidification filter. The fan housing has a partition wall projected therefrom between the humidification filter and the water tank, and the partition wall partitions a front side of the fan housing into a space through which air passes and a space where the water tank is placed.

Abstract: A roll-over valve attaches over an existing carburetor float bowl vent tube and closes when a car is involved in a crash to prevent or reduce fuel from escaping from a tilted or inverted carburetor and starting a fire. Carburetors are used in many special interest cars and race cars. The carburetors include float bowls containing fuel and the float bowls are vented to outside air by the carburetor vent tubes. The carburetor vent tubes are generally vertical tubes reaching upward from the carburetor into an air cleaner or the volume above the carburetor. The roll-over valve includes a compression fitting or other connector and is easily fitted to the carburetor.

Abstract: A diversion station is provided. The diversion station makes it possible to particularly effectively cool diverted water vapor by mixing it with water. The diversion station includes a mixing device, which comprises a so-called static mixer that is substantially made of a wire mesh. The wire mesh is produced by at least one wire that is substantially interlaced into loops. In the intended installation situation, the mixer is installed upstream of a water injection with regard to a flow direction specified by the water vapor such that the mixture of water and water vapor flows through the loops.

Abstract: Various methods and apparatus are disclosed that relate to one or more aspects of an abatement system that removes heat and/or one or more byproducts of combustion from a gas flow. In various aspects a misting array assembly is provided that includes at least one nozzle tubing having at least one nozzle coupled thereto.

Abstract: Various methods and apparatus are disclosed that relate to one or more aspects of an abatement system that removes heat and/or one or more byproducts of combustion from a gas flow. In various aspects a misting array assembly is provided that includes at least one nozzle tubing having at least one nozzle coupled thereto.

Abstract: A method for the monolithic furnaces construction with refractory concrete for the manufacture of glass through the formation of temporary structures for the filling and molded of refractory concrete.

Abstract: A process for extending the cyclic service life of thermal barrier coatings made of yttrium-stabilized zirconium oxide (YSZ) or the like which have been applied to a substrate with an oxidizing bond coat in between includes increasing or long-term stabilizing the strain tolerance of the thermal barrier coating.

Abstract: In an extrusion die in which a mandrel ring is outwardly arranged around a spindle, the present invention aims to enhance the fixing stability of the mandrel ring and enables easy maintenance. The extrusion die includes a mandrel (30) for forming an inner surface of an extruded material. The mandrel includes a spindle (32) and a mandrel ring (35) outwardly arranged around the spindle (32). The mandrel ring (35) is made of a material having a coefficient of thermal expansion smaller than that of a material of the spindle (32).

Abstract: Processes for manufacturing porous ceramic honeycomb articles are disclosed. The processes include mixing a batch of inorganic components with processing aids to form a plasticized batch. The batch of inorganic components include talc having dpt50?10 ?m, a silica-forming source having dps50?20 ?m, an alumina-forming source having a median particle diameter dpa50 of less than or equal to 10.0 ?m, and a pore former having dpp50?20 ?m. The plasticized batch is formed into a green honeycomb article and fired under conditions effective to form a porous ceramic honeycomb article comprising a cordierite crystal phase and having a microcrack parameter (Nb3) of from about 0.05 to about 0.25. After firing, the green honeycomb article the porous ceramic honeycomb article is exposed to a microcracking condition, which increases the microcrack parameter (Nb3) by at least 20%.

Abstract: A cast formed filter and a method for making the filter is provided.

Abstract: A method for arranging nanotube elements within nanotube fabric layers and films is disclosed. A directional force is applied over a nanotube fabric layer to render the fabric layer into an ordered network of nanotube elements. That is, a network of nanotube elements drawn together along their sidewalls and substantially oriented in a uniform direction. In some embodiments this directional force is applied by rolling a cylindrical element over the fabric layer. In other embodiments this directional force is applied by passing a rubbing material over the surface of a nanotube fabric layer. In other embodiments this directional force is applied by running a polishing material over the nanotube fabric layer for a predetermined time. Exemplary rolling, rubbing, and polishing apparatuses are also disclosed.

Abstract: The invention relates to a method for manufacturing wood fiber insulating boards, wherein wood fibers are mixed with thermoplastic plastic fibers as binders and a fiber mat is produced therefrom, wherein multi-component fibers composed of at least one first and one second plastic component having different melting points are used as plastic fibers, wherein the fiber mat is heated in such a way that the second component of the plastic fiber softens and wherein the fiber mat is cooled down to produce the insulating board, characterized in that a steam/air mixture having a specified dew point flows through the fiber mat to heat the fiber mat and that multi-component plastic fibers are used as binders, the first component of which has a melting point above the dew point and the second component of which has a melting point below the dew point.

Abstract: Moldable, curable, reinforcing particle-filled compositions and methods for making the compositions are provided. The moldable compositions are characterized by high loadings of reinforcing filler particles in a thermosetting matrix and, as such, can be strong, yet lightweight. The moldable compositions can be formed into shaped cores and cured to provide a variety of articles. Optionally, a layer of reinforcing material can be applied over the shaped cores to finish and strengthen the final article.

Abstract: Described herein are extrusion processes to produce hollow pellets. Also disclosed are pelletizer devices that can be used to produce the hollow pellets. The processes and devices make use of an extrusion die having a die orifice and an insert that is placed in the die orifice to produce the hollow pellets.

Abstract: Methods of extruding a honeycomb body with an extruder comprise the step of feeding batch material to the extruder, wherein the batch material comprises a ceramic or ceramic-forming material. The methods further include the step of rotating at least one mixing screw to cause the batch material to travel along a flow path defined by a barrel of the extruder. The methods further include the step of indexing a carriage to remove a first device from the flow path and introduce a second device into the flow path of the batch material. In one example, the pressure of the batch material changes less than about 25% as a result of indexing the carriage. In addition or alternatively, further methods include the step of reducing a decrease in temperature of the batch material resulting from the step of indexing. In further examples, the method includes the step of pre-filling a second honeycomb extrusion die held by the carriage with a plugging material.

Abstract: Device for taking an impression of a subject's ear minimizes risk of damage on the eardrum when the impression is made. The device comprises a nozzle having a first essentially tubular part that has a centre axis and a side wall. The first tubular part has also a first end intended to be inserted into a subject's ear, a first opening for the outlet of impression material, and a second end connected to a supply member for impression material to the tubular part. The first opening has a centre axis that is essentially perpendicular to the centre axis of the first tubular part at the point where the two centre axes intersect each other, alternatively has a direction, as seen from the centre axis of the first tubular part through the side wall, from said first end. The first opening is preferably arranged in the side wall of the tubular part.

Abstract: A method, system and apparatus for manufacturing anatomically and functionally accurate soft tissue phantoms with multimodality characteristics for imaging studies is disclosed. The organ/tissue phantom is constructed by filling a container containing an organ having inner vasculature therein with a molten elastomeric material; inserting a plurality of rods with bumps thereupon through the container and the organ; allowing the molten elastomeric material to harden and cure; removing the organ; replacing the organ with a plurality of elastomeric segments; and removing an elastomeric segment and replacing the void created thereupon with molten PVA to create a PVA segment; allowing the molten PVA segment to harden and cure; and repeating the creation of PVA segments until all the elastomeric segments have been removed, such that each successive molten PVA segment adheres to and fuses with the previous hardened PVA segment so as to form an approximately complete organ phantom cast.

Abstract: Acetaldehyde production in a polyester may be reduced by using a formulation which comprises an acetaldehyde scavenger and a phosphorous additive. The two materials appear to act synergistically in reducing acetaldehyde production. Preferred formulations comprise anthranilamide and phosphorous acid and are used in combination with aluminium or titanium catalysed PET resins.

Abstract: A positioner to secure a conduit guide in a cement pouring form for forming a concrete structural member. The positioner includes a body having a surface portion configured and positioned to support a corresponding surface portion of the conduit guide in the form. A first ferromagnetic member is associated with the body. The body selectably secures the conduit guide in the form without requiring a fastener.

Abstract: The invention comprises a golf ball. The golf ball is formed with a core, at least one intermediate layer, and a cover. The intermediate layer has a non-planar parting line. The molds used to form the intermediate layer have non-planar mating surfaces. The non-planar mating surfaces of the molds mesh, and when the intermediate layer is formed therein, the intermediate layer has a non-planar parting line thereon. If compression molding is used, hemispherical layer blanks may be pre-formed in the shape of the mold halves. To form the intermediate layer, the two blanks are compression molded together. If injection molding is used, a core is placed inside a mold chamber and layer material is injected into the mold chamber to form the intermediate layer about the core. If reaction injection molding is used, two or more reactive precursors are mixed and injected into the mold cavity, and they react to form the intermediate layer.

Abstract: A process for the production of a stiffener made of composite material that includes a central part with wings on both sides such that when the wings are resting against an element to be reinforced, the central part is separated from the element to be reinforced, with the process including producing a flat strip (16) that includes at least one layer of fibers, placing it on a mold (26) that includes at least one hollow shape that corresponds to the central part of the stiffener that is to be produced, heating the strip (16), and deforming it in such a way as to make it assume the shapes of the mold (26), characterized in that it includes exerting a transverse traction on the strip (16) during the deformation of the strip.

Abstract: A shaping slurry that forms a shaped product with a granule includes: a water-based solvent; a hydrophobic granule that forms the shaped product; and an amphiphatic solid polymer that forms the shaped product, and is dissolved in the water-based solvent.

Abstract: A core assembly for an injection moulding-machine. The assembly includes a movable mould half and a stationary mould half clamped onto each their platen of an injection moulding-machine . It also includes an actuator for advancing and retracting during operation at least one core into and from a mould cavity in a mould. The actuator is connected to a core-carrier for carrying the at least one core. The core-carrier is slidingly mounted to and partly projecting from a guidance connected to one of the mould halves. A first hole is formed in the closed mould for slidingly receiving the projecting part of the core-carrier. The core assembly allows products to be continuously moulded with an extremely high degree of accuracy, and it is simple, inexpensive and easy to mount and maintain while also allowing for positioning of cores at various angles relative to the mould.

Abstract: Apparatus for controlling the rate of flow of fluid material through an injection molding flow channel leading to a gate of a mold cavity, the apparatus comprising: a pin having a longitudinal length being adapted for back and forth axial movement through the flow channel; the pin having a protrusion having a maximum diameter circumferential surface; the channel having an interior surface complementary to the maximum diameter circumferential surface of the protrusion; the pin being slidable to a position within the channel such that the maximum diameter circumferential surface of the protrusion forms a seal with the complementary interior surface portion of the channel to stop flow of the fluid material, an electrically powered actuator interconnected to and controllably driving the pin through the channel.

Abstract: A system for marking pellet shaped articles includes a conveyer to convey the pellet-shaped articles along a transport path, and a laser to generate at least one beam to print or etch information on one or more of the pellet-shaped articles. The information includes at least one of alphabetical characters, numeric characters, and/or logos. The information comprises at least one engraving, e.g., two engravings or holes, apertures, etc., that are adjacent one another and at least partially overlapping. The system includes a controller to control x and y or x, y and z coordinates of the beam of the laser relative to the transport path to align the beam with the one or more of the pellet-shaped articles.

Abstract: A lamination or replication method for making an article having a structured solid layer, including: dispensing a curable liquid onto a first member; contacting the curable liquid on the first member with a complimentary second member having a curvature aspect, to form an assembly having the curable liquid disposed between the first and second members; and curing the curable liquid to form the article, the structure being imparted by at least one of the first and second members. A display system that incorporates the article, as defined herein, is also disclosed.

Abstract: An apparatus for manufacturing a three-dimensional object by layerwise consolidation of powder comprises a lowerable build platform for supporting the object during manufacture and a sealable chamber for controlling the atmosphere around the object. The apparatus also has gas transport devices, such as pumps and valves. Substantially all of the gas transport devices are maintained within a controlled atmosphere.

Abstract: A method for the at least two-stage temperature control of preforms (28) made from a thermoplastic material. In this method, the preforms (28) are brought, immediately prior to a blow molding or a stretch blow molding process, to a process-specifically distributed softening temperature (T3) according to a predefineable thermal profile, with said softening temperature (T3) being the temperature required for blow molding or stretch blow molding at least the preform's (28) body section located below the thread section (29) and/or a collar area located therebelow. In addition, the preforms (28) are first preheated to a near uniform temperature, particularly with a largely homogeneous temperature distribution (T2). The invention furthermore includes a heating device (10) for performing the method.

Abstract: A device for introducing dust into a molten bath of a pyrometallurgical installation is provided. An electrodeless plasma torch includes an essentially tubular housing, wherein the housing allows a passage of a carrier gas containing dust particles, and wherein the housing is coaxially surrounded by an inductive load coil which forms a heating zone.

Abstract: A system for damping vibration in a drill string can include a valve assembly having a supply of a fluid, a first member, and a second member capable of moving in relation to first member in response to vibration of the drill bit. The first and second members define a first and a second chamber for holding the fluid. Fluid can flow between the first and second chambers in response to the movement of the second member in relation to the first member. The valve assembly can also include a coil or a valve for varying a resistance of the fluid to flow between the first and second chambers.

Abstract: A hydraulically damped mounting device has first and second anchor parts connected by a first deformable wall, and a working chamber for hydraulic fluid partially bounded by the first deformable wall. The working chamber is connected to a composition chamber for the hydraulic fluid by a first passageway, the composition chamber being partially bounded by a second deformable wall. There is also an auxiliary chamber partially bounded by a third deformable wall connected to the working chamber by a second passageway. The mounting device then has a vacuum chamber connectable to a vacuum source for varying the pressure in the vacuum chamber.

Abstract: Axially damping hydraulic mount is provided, relating to elastomer mounts for engine mounts for damping the vibrations transmitted from internal combustion engine to the body and for acoustic decoupling. The hydraulic mount includes a frustoconical elastomer support spring, between mount core and upper part of outer jacket, with a working chamber and a compensating chamber for fluid damping medium. Chambers are separated from one another by a separator extending transversely to the mount axis and includes a coupling diaphragm, wherein the working chamber is enclosed by support spring and separating element. Compensating chamber is enclosed by separating element and elastomer bellows. A duct on the separating element is enclosed by a duct part. To counteract excessive increase in dynamic spring rate when frequencies of axially acting vibrations are present, the duct part is occupied by an additional mass. Then the duct part is rigidly connected to a mass element.

Abstract: The bump stop device, particularly for a motor vehicle, comprises a bearing 6 forming an axial stop, a bottom support cover 5 of the bearing and a bottom retainer 7 for a spring comprising at least one stiffening strut. The support cover 5 and/or the retainer 7 comprises at least one axial securing means 15 of the bottom retainer and of the bottom support cover, the said means being situated axially set back from a bottom end of the retainer.

Abstract: The present invention relates to dual-spring assembly that may be employed in cooperation with a damper unit to form a shock absorber. The spring rate of at least one of the springs is adjustable with a preload mechanism, which in turn is movable relative to the damper unit. Further, the dual-spring assembly includes two compression springs arranged in series and each having selected, but different spring rates. The first spring primarily absorbs the energy of applied loads that are below a first amplitude or threshold of applied load. Once the applied loads exceed the first amplitude of applied load, the dual-spring assembly operates with an effective spring rate to absorb the energy of applied loads that exceed the first amplitude of applied load. After a second spring of the dual-spring assembly achieves a desired amount of deflection, the first spring continues to absorb energy from the applied loads.

Abstract: A positioning device includes a base, a platform, a support fixed on the base, a rotatable member, and a positioning member. The rotatable member is fixed to the platform and is rotatably connected to the support. The positioning member is fixed to the platform. The positioning member is operable to cooperate with the support to lock the platform in a desired position.

Abstract: A rectangular parallelepipedic (cuboidal) work is fixed by clamping the opposing two edges between clamp jaws attached to a pair of clamps. With the work fixed, at least one surface of the work is machined. Then, the position of the work is changed by rotating the clamps and the work all together around the rotating axis, and the other surface is machined. The foregoing step is repeated to machine all the six surfaces of the work, during which the work is kept fixed by clamping.