Abstract: A semiconductor chip includes a substrate having a front surface and a back surface opposite the front surface, a conductive column part passing through the substrate from the front surface to the back surface, a cavity formed by removing a part of the back surface around an end portion of the conductive column part such that the end portion of the conductive column part protrudes from the cavity, a first insulation layer formed in the cavity such that a portion of the end portion of the conductive column part is exposed, and a back electrode electrically connected to the exposed end portion of the conductive column part.

Abstract: A wiring board includes a silicon substrate with a through hole communicating with first and second substrate surfaces. A capacitor includes a capacitor part mounted on an insulating film covering the substrate first surface and including a first electrode on the insulating film, a first dielectric layer on the first electrode, and a second electrode on the first dielectric layer. A multilayer structure arranged on a wall surface defining the through hole includes the insulating film on the through hole wall surface, a first metal layer on the insulating film formed from the same material as the first electrode, a second dielectric layer on the first metal layer formed from the same material as the first dielectric layer, and a second metal layer on the second dielectric layer formed from the same material as the second electrode. The multilayer structure covers a penetration electrode in the through hole.

Abstract: An integrated circuit with a passivation trapping layer. An integrated circuit with a hydrogen or deuterium releasing layer underlying a passivation trapping layer. Method for forming an integrated circuit having a hydrogen or deuterium releasing layer. Method for forming an integrated circuit having a passivation trapping layer.

Abstract: Methods of forming metal oxide structures and methods of forming metal oxide patterns on a substrate using a block copolymer system formulated for self-assembly. A block copolymer at least within a trench in the substrate and including at least one soluble block and at least one insoluble block may be annealed to form a self-assembled pattern including a plurality of repeating units of the at least one soluble block laterally aligned with the trench and positioned within a matrix of the at least one insoluble block. The self-assembled pattern may be exposed to a metal oxide precursor that impregnates the at least one soluble block. The metal oxide precursor may be oxidized to form a metal oxide. The self-assembled pattern may be removed to form a pattern of metal oxide lines on the substrate surface. Semiconductor device structures are also described.

Abstract: Methods and apparatus for improved electromagnetic interference (EMI) shielding and thermal performance in integrated circuit (IC) packages are described. A die-up or die-down package includes a protective lid, a plurality of ground posts, an IC die, and a substrate. The substrate includes a plurality of ground planes. The IC die is mounted to the substrate. Plurality of ground posts is coupled to plurality of ground planes that surround IC die. Protective lid is coupled to plurality of ground posts. The plurality of ground posts and the protective lid from an enclosure structure that substantially encloses the IC die, and shields EMI from and radiating towards the IC die. The enclosure structure also dissipates heat generated by the IC die during operation.

Abstract: A leadframe for a QFN/SON semiconductor device comprising a strip of a first metal as the leadframe core with a plurality of leads and a pad. a layer of a second metal over both surfaces of the strip. There are sidewalls normal to the surfaces. The first metal exposed at the sidewalls and at portions of a surface of the pad.

Abstract: A driver IC which is operated by a power supply system insulated from a control IC is mounted in the vicinity of a switching element on a first conductor pattern. A second conductor pattern connected to a source terminal or an emitter terminal of the switching element is electrically connected to a third conductor pattern on which the driver IC is mounted. A ground terminal of the driver IC is electrically connected to the third conductor pattern, and a drive terminal of the driver IC is electrically connected to a gate terminal or a base terminal of the switching element.

Abstract: A method of manufacture of an integrated circuit packaging system includes: forming a package paddle; forming a lead adjacent the package paddle, the lead having a lead overhang protruding from a lead non-horizontal side and a lead ridge protruding from the lead non-horizontal side; mounting an integrated circuit over the package paddle; connecting an electrical connector to the lead and the integrated circuit; and forming an encapsulation over the integrated circuit, the lead, and the package paddle, the encapsulation under the lead overhang.

Abstract: A semiconductor device package comprises a lead frame having a die paddle comprising a first chip installation area and a second chip installation area, a recess area formed in the first chip installation area, and multiple metal pillars formed in the recess area, a notch divides the first chip installation area into a transverse base extending transversely and a longitudinal base extending longitudinally, and separates the recess area into a transverse recess part formed in the transverse base and a longitudinal recess part formed in longitudinal base; a portion of a transverse extending part connecting to an external pin extends into a portion inside of the notch.

Abstract: A device includes a package substrate including a first non-reflowable metal bump extending over a top surface of the package substrate; a die over and bonded to the package substrate; and a package component over the die and bonded to the package substrate. The package component includes a second non-reflowable metal bump extending below a bottom surface of the package component. The package component is selected from the group consisting essentially of a device die, an additional package substrate, and combinations thereof. A solder bump bonds the first non-reflowable metal bump to the second non-reflowable metal bump.

Abstract: To provide an inexpensive lead component which can be easily connected to a semiconductor chip and which has satisfactory connectability. There is provided a lead component including a base material having a connection part for connecting to a semiconductor chip, comprising: a solder part having a Zn layer made of a Zn-bonding material rolled and clad-bonded on the base material, and an Al layer made of an Al-bonding material rolled and clad-bonded on the Zn layer, in a prescribed region including the connection part on the base material; and the solder part further comprising a metal thin film composed of one kind or two kinds or more of Au, Ag, Cu, Ni, Pd, and Pt covering a surface of the Al layer.

Abstract: A semiconductor device includes: a wiring board which includes a first face and a second face and in which a conductor pattern and a through part are provided; an electronic component which includes an electrode pad forming face where an electrode pad is formed and which is housed in the through part so that the electrode pad forming face is provided on the first face side; a seal resin which is provided in the through part and the electrode pad forming face, seals the electronic component and includes a first plane exposing a connection face of the electrode pad; and a wiring pattern which is provided in the first face of the wiring board and the first plane of the seal resin and electrically connects the connection face of the electrode pad with a first connected face of the conductor pattern, and which includes a pad part.

Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a package paddle having a single integral structure with a paddle central portion surrounded by a paddle peripheral portion; forming a terminal adjacent the package paddle; mounting an integrated circuit over the paddle central portion; and forming an encapsulation over the integrated circuit and the terminal, the encapsulation free of delamination with the encapsulation directly on the paddle peripheral portion.

Abstract: A chip package is provided, the chip package including: a chip including at least one contact pad formed on a chip front side; an encapsulation material at least partially surrounding the chip and covering the at least one contact pad; and at least one electrical interconnect formed through the encapsulation material, wherein the at least one electrical interconnect is configured to electrically redirect the at least one contact pad from a chip package first side at the chip front side to at least one solder structure formed over a chip package second side at a chip back side.

Abstract: An interconnect for transmitting an electric signal between electronic devices includes a first coupling element electromagnetically coupled to, and immediately juxtaposed to, a second coupling element. The first coupling element is mounted on and is electrically connected to a first electronic device having a first integrated circuit. The second coupling element may be mounted on and electrically connected to the first electronic device, and electrically connected to an interconnect on a second electronic device, or the second coupling element may be mounted on and electrically connected to the second electronic device.

Abstract: Stacked semiconductor devices and assemblies including attached lead frames are disclosed herein. One embodiment of a method of manufacturing a semiconductor assembly includes forming a plurality of first side trenches to a first intermediate depth in a molded portion of a molded wafer having a plurality of dies arranged in rows and columns. The method also includes forming a plurality of lateral contacts at sidewall portions of the trenches and electrically connecting first side bond-sites of the dies with corresponding lateral contacts of the trenches. The method further includes forming a plurality of second side channels to a second intermediate depth in the molded portion such that the channels intersect the trenches. The method also includes singulating and stacking the first and second dies with the channels associated with the first die aligned with channels associated with the second die.

Abstract: A structure, a system, and a method for manufacture of crosstalk-free wafer level chip scale packaging (WLCSP) structure for high frequency applications is provided. An illustrative embodiment comprises a substrate on which various layers and structures form circuitry, a signal pin formed on the substrate and coupled with the circuitry, a ground ring encircling the signal pin, and a grounded solder bump coupled to the ground ring.

Abstract: A semiconductor device includes plural electrode pads arranged in an active region of a semiconductor chip, and wiring layers provided below the plural electrode pads wherein occupation rates of wirings arranged within the regions of the electrode pads are, respectively, made uniform for every wiring layer. To this end, in a region where an occupation rate of wiring is smaller than those in other regions, a dummy wiring is provided. On the contrary, when the occupation rate of wiring is larger than in other regions, slits are formed in the wiring to control the wiring occupation rate. In the respective wirings layers, the shapes, sizes and intervals of wirings below the respective electrode pads are made similar or equal to one another.

Abstract: Structure and methods of making the structures. The structures include a structure, comprising: an organic dielectric passivation layer extending over a substrate; an electrically conductive current spreading pad on a top surface of the organic dielectric passivation layer; an electrically conductive solder bump pad comprising one or more layers on a top surface of the current spreading pad; and an electrically conductive solder bump containing tin, the solder bump on a top surface of the solder bump pad, the current spreading pad comprising one or more layers, at least one of the one or more layers consisting of a material that will not form an intermetallic with tin or at least one of the one or more layers is a material that is a diffusion barrier to tin and adjacent to the solder bump pad.

Abstract: A device includes a dielectric layer, a metal line in the dielectric layer, and a via underlying and connected to the metal line. Two dummy metal patterns are adjacent to the metal line, and are aligned to a straight line. A dummy metal line interconnects the two dummy metal patterns. A width of the dummy metal line is smaller than lengths and widths of the two dummy metal patterns, wherein the width is measure in a direction perpendicular to the straight line. Bottoms of the two dummy metal patterns and the dummy metal line are substantially level with a bottom surface of the metal line.

Abstract: A fastening device is provided that includes a semiconductor body with an integrated circuit, and a dielectric passivation layer formed on the surface of the semiconductor body, and a trace formed underneath the passivation layer, and an oxide layer formed beneath the trace, and a connecting component that forms a frictional connection between a component formed above the passivation layer and the semiconductor body, wherein a formation passing through the passivation layer and the oxide layer and having a bottom surface is formed, and a conductive layer is formed on the bottom surface and the connecting component forms an electrical connection between the conductive layer and the component.

Abstract: A wiring over a substrate capable of reducing particles between wirings and a method for manufacturing the wiring is disclosed. A wiring over a substrate capable of preventing short-circuiting between wirings due to big difference in projection and depression between wirings and a method for manufacturing the wiring is also disclosed. Further, a wiring over a substrate capable of preventing cracks in the insulating layer due to stress at the edge of a wiring or particles and a method for manufacturing the wiring is also disclosed.

Abstract: A stacked die package for an electromechanical resonator system includes an electromechanical resonator die bonded or fixed to a control IC die for the electromechanical resonator by, for example, a thermally and/or electrically conductive epoxy. In various embodiments, the electromechanical resonator can be a micro-electromechanical system (MEMS) resonator or a nano-electromechanical system (NEMS) resonator. Certain packaging configurations that may include the chip that contains the electromechanical resonator and the control chip include chip-on-lead (COL), chip-on-paddle (COP), and chip-on-tape (COT) packages. The stacked die package may provide small package footprint and/or low package thickness, and low thermal resistance and a robust conductive path between the dice.

Abstract: A solder resist and a central pad to which a central Au bump provided on a semiconductor chip is flip-chip bonded are formed on a substrate main body. In a flip-chip mounting substrate where an underfill resin is provided after the semiconductor chip is mounted, a central opening portion for exposing the central pad is formed in the solder resist, and also, an edge portion forming the central opening portion of the solder resist is partially overlapped with the outer peripheral portion of the central pad.

Abstract: An integrated circuit includes a substrate. A surface region of the substrate includes a contact pad region. A passivation layer stack includes at least one passivation layer. The passivation layer stack is formed over the surface region and adjacent to the contact pad region. An upper portion of the passivation layer stack is removed in, in a portion of the passivation layer stack proximate the contact pad region.

Abstract: An electrical generating method is provided that generates electricity when bending of a first flexible plurality of conductors, a second flexible plurality of conductors and a flexible magnetic field source causes movement of the conductors relative to a magnetic field provided by the magnetic field source.

Abstract: An apparatus for the conversion of the energy of sea or ocean swells. The apparatus comprises: a frame including a vertical post and horizontal beam; a first generator slidably connected to the vertical post; a second generator slidably connected to the horizontal beam; a first pinion connected to the first generator; a second pinion connected to the second generator; a float; a connection mechanism for connecting the float to the generators; a horizontal first rack connected to the float for engaging the first pinion; a vertical second rack connected to the one float for engaging the second pinion, wherein all components connected to the float are disposed at or above sea level.

Abstract: Systems and methods for regulating voltage in a doubly fed induction generator (DFIG) system are provided. More particularly, the voltage of the auxiliary power feed in a DFIG wind turbine system can be regulated by outputting reactive power from a power converter to a reactive element coupled between the auxiliary power feed and a stator bus. The reactive element can include a winding of the transformer used to couple the wind turbine system to the electrical grid and/or an inductive element coupled between the output of the power converter and the stator bus. The voltage of the auxiliary power feed can be maintained within a reduced operating range while an increased operating range can be provided for wind turbine system.

Abstract: A system of dense packaging of turbomachinery in a gas turbine engine by means of close-coupling of components and by the ability to rotate various engine components with respect to other engine components is disclosed. In addition, spool shaft rotational direction may be reversed to suit the application. In multiple engine configurations, the same ability to close-couple and rotate components and to reverse shaft rotational direction in order to rearrange the engine geometry package is used for packaging two or more gas turbine engines to achieve high power density. Dense-packing is possible because of a number of features of the basic engine.

Abstract: Pressurized hydraulic flow created in wind farms with wind driven pumps (wind-pumps) used for rated electric power production by means of hydraulic motors, or turbines, of constant speed and variable torque which actuate alternately and/or simultaneously rated electric generators as function of wind power availability. Use of positive displacement pumps driven by rotors of fixed pitch blades for maximum capture of wind power enables the attainment tip-speed-ratio of rotors in the range of high power coefficient by means of the pressurized hydraulic flow of the wind farms. Another application of wind farms with wind driven pumps is for the creation of variable hydraulic flow of fixed pressure as function wind power availability which may be used for water elevation as well as for the desalination of salt water solutions by reverse osmosis.

Abstract: A wind turbine which includes a direct drive generator is disclosed. The direct drive generator includes an inner stator arrangement and an outer rotor arrangement and a stationary shaft with a center axis. The stator arrangement is arranged on the outside of the stationary shaft, the rotor arrangement is substantially arranged around the stator arrangement, on the front side at least indirectly supported or arranged on the stationary shaft by a main bearing and on the rear side at least indirectly supported or arranged on the stationary shaft by a support bearing. The main bearing and/or the support bearing is a four-point bearing.

Abstract: A power supply control section calculates a target charge/discharge current of a secondary power supply apparatus based on an actual charged amount and a target charged amount of the secondary power supply apparatus, and feedback-controls the stepped-up voltage of a step-up circuit such that an actual charge/discharge current detected by a secondary current sensor coincides with a target charge/discharge current. When the actual charged amount (1) is equal to or greater than the target charged amount, the target charge/discharge current is set to zero to prevent overcharging, and (2) is less than the target charged amount, a target charge current corresponding to a capacity margin of the step-up circuit is set to quickly charge the secondary power supply apparatus. When the output of the step-up circuit has no margin, the target charge/discharge current is set to zero.

Abstract: A power supply circuit and a method for operating the power supply circuit are described. In one embodiment, a power supply circuit includes at least one input terminal to receive at least one input voltage, a power element including multiple power element components configured to convert the at least one input voltage to at least one output voltage, multiple regulator controllers configured to control the power element components for the conversion of the at least one input voltage to the at least one output voltage, at least one first switch coupled to the regulator controllers and the power element components, and multiple output terminals to output the at least one output voltage. The at least one first switch is used to configure the power supply circuit to function as either one voltage regulator or multiple independent voltage regulators. Other embodiments are also described.

Abstract: A solar array power generation system includes a solar array electrically connected to a control system. The solar array has a plurality of solar modules, each module having at least one DC/DC converter for converting the raw panel output to an optimized high voltage, low current output. In a further embodiment, each DC/DC converter requires a signal to enable power output of the solar modules.

Abstract: In embodiments of the present invention improved capabilities are described for a method and system comprising a first resonator coupled to an energy source generating a field having magnetic material, and a second resonator located a variable distance from the source resonator having magnetic material and not connected by any wire or shared magnetic material to the first resonator, where the source resonator and the second resonator are coupled to provide near-field wireless energy transfer among the source resonator and the second resonator, and where the field of at least one of the source resonator and the second resonator is shaped using magnetic materials to increase the coupling factor among the resonators.

Abstract: A wireless power feeder which performs power feed to a wireless power receiver having a power receive resonance circuit including a power receive coil and a power receive capacitor, this wireless power feeder including: a power feed coil; a resonance current detector; and a control circuit; wherein the power feed coil does not substantially constitute a resonance circuit; the current detector has a detection resonance circuit including a detection coil and a detection capacitor, and detects a resonance current of the power receive resonance circuit; the winding region of the detection coil in the current detector is smaller than the winding region of the power feed coil; and the detection coil in the current detector is disposed such that the central winding axis thereof forms an angle of not less than 80° and not more than 100° with respect to magnetic field vectors generated by the power feed coil.

Abstract: A wireless power feeder which performs power feed by a non-contact method to a wireless power receiver having a power receive coil, this wireless power feeder having a power feed coil; and a control circuit having a phase delay device which generates a delayed AC voltage where the phase of the output AC voltage is delayed; a magnetic sensor biased by the delayed AC voltage and detects a magnetic field generated by power receive coil; phase detection circuits which generate phase difference instruction voltages corresponding to a phase difference between an output voltage from the magnetic sensor and a comparison voltage, on the basis of the output voltage and the comparison voltage; and AC current generation circuits which generate the output AC voltage having a frequency based on the phase difference instruction voltage, and generate the AC current having a frequency corresponding to the frequency of the output AC voltage.

Abstract: There is provided a linear vibrator, including: a fixed part providing an interior space having a predetermined size; at least one magnet disposed in the interior space and generating magnetic force; a vibration part including a coil facing the magnet and generating electromagnetic force through interaction with the magnet and a mass body; and an elastic member coupled to the fixed part and the vibration part to mediate vibrations of the vibration part and having a damping increasing portion attached to a predetermined region of a surface thereof.

Abstract: A torsional vibration damper is integrated into a rotating electrical machine. A rotatable assembly of the electrical machine includes a rotor core pack having a first end and a second end, The integrated torsional vibration damper consists of a torsional elastic coupling and a torsional elastic damper and provides mechanical damping. The integrated torsional vibration damper is mounted to the rotatable shaft of the electrical machine by a flange. The rotor core pack is mounted at the first end to the integrated torsional vibration damper by suitable structure members such as a mounting flange and is not fixedly mounted directly to the rotatable shaft. In the case where the rotor core pack is cooled by circulating coolant fluid (e.g. MIDEL) then the integrated torsional vibration damper may be a viscous damper that uses the coolant fluid as a viscous working, fluid.

Abstract: A bar-wound stator, which is connectable to a plurality of fixed terminal points, includes a plurality of stator teeth and a plurality of magnet wires. Each of the plurality of magnet wires has a winding portion wound about at least one of the plurality of stator teeth and a junction portion extending away therefrom. A plurality of flexible leads each have a first portion ultrasonically welded directly to a respective one of the junction portions of the plurality of magnet wires. A second portion of each of the plurality of flexible leads extends flexibly away from the first portion and is configured for attachment to a respective one of the fixed terminal points.

Abstract: A synchronous rotating electrical machine is disclosed, of the type including a stator (10) and a rotor (11). The rotor is of the flux concentration type and includes a plurality of alternate North and South poles formed from permanent magnets (PM). The magnets are housed in slots (E1) arranged in the magnetic body of the rotor. The rotor includes, for each permanent magnet, a magnetic circuit allowing the circulation of a defluxing magnetic flux. This magnetic circuit has a magnetic reluctance of the defluxing circuit (Rf) determined as a function of an internal magnetic reluctance of the magnet (Ra) such that the ratio (Rf/Ra) of the magnetic reluctance of the defluxing circuit on the internal magnetic reluctance of the magnet (Ra) is within a range of predetermined values guaranteeing the magnet against a risk of demagnetization. This range of predetermined values is from approximately 0.3 to approximately 3 depending on the type of magnet.

Abstract: The present invention relates to a stator core including at least two or more stator core-continuous bodies each formed by coupling at least two or more unit cores to each other, each unit core consisting of a tooth portion having a coupling slot and a coupling projection formed along both ends thereof and connected to adjacent unit core by means of a connection portion formed at each of both end portions of the tooth portion, wherein the at least two or more stator core-continuous bodies are fitting-connected to each other by means of the coupling slots formed at one side ends thereof and the coupling projections formed at the other side ends thereof to form the stator core having a round shape.

Abstract: The present invention relates to a stator core including at least two or more stator core-continuous bodies each formed by coupling at least two or more unit cores to each other, each unit core consisting of a tooth portion having a coupling slot and a coupling projection formed along both ends thereof and connected to adjacent unit core by means of a connection portion formed at each of both end portions of the tooth portion, wherein the at least two or more stator core-continuous bodies are fitting-connected to each other by means of the coupling slots formed at one side ends thereof and the coupling projections formed at the other side ends thereof to form the stator core having a round shape.

Abstract: An electric generator of a wind power turbine has a stator having a cylindrical shell; a number of segments arranged, along the inner face of the cylindrical shell, in a circumferential configuration; and a number of adjustable locking devices located between the segments to press the segments together circumferentially and lock the segments in a given position.

Abstract: A rotor of the invention includes a core made of laminated steel sheets and formed with a rotation-transmitting-member mounting end face (a wall surface of a through hole for shaft) extending over a lamination direction and a rotation transmitting member (a shaft) mounted to the rotation-transmitting-member mounting end face of the core. The core is formed with a welding end face (a wall surface of a through hole for welding) extending over the lamination direction and in a position adjacent to a rotation-transmitting-member mounting end face. A welded trace is formed in the welding end face, extending to the rotation transmitting member and over the lamination direction of the core. The invention can easily achieve size reduction and weight reduction of a rotary machine and manufacture a rotor in the reduced number of working processes.

Abstract: The present disclosure relates to a method of adjusting the resonance frequency of a vibrating element, comprising measuring the resonance frequency of the vibrating element, determining, using abacuses and as a function of the resonance frequency measured, a dimension and a position of at least one area of modified thickness to be formed on the vibrating element so that the resonance frequency thereof corresponds to a setpoint frequency, and forming on the vibrating element, an area of modified thickness of the determined dimension and position.

Abstract: A Love wave sensor uses a single-phase unidirectional interdigital transducer (IDT) on a piezoelectric substrate for leaky surface acoustic wave generation. The IDT design minimizes propagation losses, bulk wave interferences, provides a highly linear phase response, and eliminates the need for impedance matching. As an example, a high frequency (˜300-400 MHz) surface acoustic wave (SAW) transducer enables efficient excitation of shear-horizontal waves on 36° Y-cut lithium tantalate (LTO) giving a highly linear phase response (2.8° P-P). The sensor has the ability to detect at the pg/mm2 level and can perform multi-analyte detection in real-time. The sensor can be used for rapid autonomous detection of pathogenic microorganisms and bioagents by field deployable platforms.

Abstract: A smart material actuator comprising a mechanical amplifier with a fixed supporting member, at least one mountable actuating arm, and mechanical web having at least one compliant member attached to the mountable arm and a movable supporting member. A piezoelectric stack is affixed between a first mounting surface on the fixed supporting member and a second mounting surface on the movable supporting member. With the fixed supporting member being substantially rigid, and the piezoelectric stack being affixed between the first mounting surface and the second mounting surface, which are substantially parallel, applying an appropriate electric potential to the piezoelectric stack will cause it to expand substantially without angular movement. The expansion urges the second mounting surface away from the first, thereby causing the compliant members of the mechanical web to flex, thereby moving the mountable actuating arm.

Abstract: Provided is a piezoelectric sound generating device capable of obtaining a stable connection state of lead-out conductors constituted of a conductive resin layer. A piezoelectric sound generating device 10, wherein lead-out conductors 18a, 18b are so flatly formed as to extend from surface electrodes 11a, 11b1 of a piezoelectric element 11 exposed to first openings 13a1, 13b1 to terminal electrodes 15a, 15b of a terminal portion 15 exposed to second openings 13a2, 13b2 on one main surface side of a diaphragm 12, respectively. As a result, the surface electrode 11a1 of the piezoelectric element 11 and the terminal electrode 15a of the terminal portion 15, and also the surface electrode 11b1 and a surface electrode 11c of the piezoelectric element 11, and the terminal electrode 15b of the terminal portion 15 are conductively connected. Hence, poor connection caused by cracks or the like is not likely to occur in the lead-out conductors.

Abstract: A micro-scale, smart material actuator having an overall length smaller than 10 mm comprising a multilayer piezoelectric stack housed in a mechanical amplifier made up of a fixed supporting member, a movable supporting member connected to compliant links attached to one or more actuating arms such that, when a suitable electric current is applied to the piezoelectric stack, the resulting expansion is translated through the movable supporting member, thereby causing movement in the actuating arms A method of generating electricity from motion using such an actuator is also disclosed in which the actuating arms are connected to a source of mechanical motion and the piezoelectric stack is connected to an electrical load, whereby the mechanical motion causes the piezoelectric stack to generate electrical charge that is then discharged into the load.