Patents Issued in May 27, 2014
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Patent number: 8735688Abstract: According to the invention, there is provided seed and plants of the hybrid corn variety designated CH658401. The invention thus relates to the plants, seeds and tissue cultures of the variety CH658401, and to methods for producing a corn plant produced by crossing a corn plant of variety CH658401 with itself or with another corn plant, such as a plant of another variety. The invention further relates to genetic complements of plants of variety CH658401.Type: GrantFiled: April 18, 2011Date of Patent: May 27, 2014Assignee: Monsanto Technology LLCInventor: Richard G. Stelpflug
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Patent number: 8735689Abstract: The invention provides seed and plants of the hybrid corn variety designated 980008. The invention thus relates to the plants, seeds and tissue cultures of the variety 980008, and to methods for producing a corn plant produced by crossing a corn plant of variety 980008 with itself or with another corn plant, such as a plant of another variety. The invention further relates to genetic complements of plants of variety 980008.Type: GrantFiled: April 19, 2011Date of Patent: May 27, 2014Assignee: Agrigenetics, Inc.Inventor: James W. Bing
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Patent number: 8735690Abstract: The disclosure relates to a maize plant, seed, variety, and hybrid. More specifically, the disclosure relates to a maize plant containing a Cal-1 allele, whose expression results in increased cell wall-derived glucan content in the maize plant. The disclosure also relates to crossing inbreds, varieties, and hybrids containing the Cal-1 allele to produce novel types and varieties of maize plants.Type: GrantFiled: June 2, 2011Date of Patent: May 27, 2014Assignees: The Regents of the University of California, The United States of America, as represented by the Secretary of AgricultureInventors: Markus Pauly, Sarah Hake, Florian J. Kraemer
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Patent number: 8735691Abstract: The present invention provides an inbred corn line designated NPNA0003, methods for producing a corn plant by crossing plants of the inbred line NPNA0003 with plants of another corn plant. The invention further encompasses all parts of inbred corn line NPNA0003, including culturable cells. Additionally provided herein are methods for introducing transgenes into inbred corn line NPNA0003, and plants produced according to these methods.Type: GrantFiled: February 20, 2012Date of Patent: May 27, 2014Assignee: Syngenta Participations AGInventor: Adrian Jan de Dreu
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Patent number: 8735692Abstract: A novel maize variety designated PH1M3M and seed, plants and plant parts thereof. Methods for producing a maize plant that comprise crossing maize variety PH1M3M with another maize plant. Methods for producing a maize plant containing in its genetic material one or more traits introgressed into PH1M3M through backcross conversion and/or transformation, and to the maize seed, plant and plant part produced thereby. Hybrid maize seed, plant or plant part produced by crossing the variety PH1M3M or a locus conversion of PH1M3M with another maize variety.Type: GrantFiled: February 21, 2012Date of Patent: May 27, 2014Assignee: Pioneer Hi Bred International IncInventors: Mark Cooper, Andrew Jon Ross
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Patent number: 8735693Abstract: A novel maize variety designated X08C934 and seed, plants and plant parts thereof, produced by crossing Pioneer Hi-Bred International, Inc. proprietary inbred maize varieties. Methods for producing a maize plant that comprises crossing hybrid maize variety X08C934 with another maize plant. Methods for producing a maize plant containing in its genetic material one or more traits introgressed into X08C934 through backcross conversion and/or transformation, and to the maize seed, plant and plant part produced thereby. This invention relates to the maize variety X08C934, the seed, the plant produced from the seed, and variants, mutants, and minor modifications of maize variety X08C934. This invention further relates to methods for producing maize varieties derived from maize variety X08C934.Type: GrantFiled: February 21, 2012Date of Patent: May 27, 2014Assignee: Pioneer Hi Bred International IncInventor: Mario Rosario Carlone, Jr.
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Patent number: 8735694Abstract: A novel maize variety designated X08B705 and seed, plants and plant parts thereof, produced by crossing Pioneer Hi-Bred International, Inc. proprietary inbred maize varieties. Methods for producing a maize plant that comprises crossing hybrid maize variety X08B705 with another maize plant. Methods for producing a maize plant containing in its genetic material one or more traits introgressed into X08B705 through backcross conversion and/or transformation, and to the maize seed, plant and plant part produced thereby. This invention relates to the maize variety X08B705, the seed, the plant produced from the seed, and variants, mutants, and minor modifications of maize variety X08B705. This invention further relates to methods for producing maize varieties derived from maize variety X08B705.Type: GrantFiled: February 23, 2012Date of Patent: May 27, 2014Assignee: Pioneer Hi-Bred International, Inc.Inventors: Matthew David Smalley, Russell L. Fox
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Patent number: 8735695Abstract: According to the invention, there is provided seed and plants of the hybrid corn variety designated CH458430. The invention thus relates to the plants, seeds and tissue cultures of the variety CH458430, and to methods for producing a corn plant produced by crossing a corn plant of variety CH458430 with itself or with another corn plant, such as a plant of another variety. The invention further relates to genetic complements of plants of variety CH458430.Type: GrantFiled: April 26, 2012Date of Patent: May 27, 2014Assignee: Monsanto Technology LLCInventor: Kevin Cook
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Patent number: 8735696Abstract: A novel maize variety designated 10137650 and seed, plants and plant parts thereof, produced by crossing Pioneer Hi-Bred International, Inc. proprietary inbred maize varieties. Methods for producing a maize plant that comprises crossing maize variety 10137650 with another maize plant. Methods for producing a maize plant containing in its genetic material one or more traits introgressed into 10137650 through backcross conversion and/or transformation, and to the maize seed, plant and plant part produced thereby. This invention relates to the maize variety 10137650, the seed, the plant produced from the seed, and variants, mutants, and minor modifications of maize variety 10137650. This invention further relates to methods for producing maize varieties derived from maize variety 10137650.Type: GrantFiled: June 20, 2012Date of Patent: May 27, 2014Assignee: Pioneer Hi Bred International IncInventors: Gary Edward Henke, David Bernard Fischer, David Walter Whitaker, Terrill E. Williams, Nancy Guse
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Patent number: 8735697Abstract: A novel maize variety designated X13A478 and seed, plants and plant parts thereof, produced by crossing Pioneer Hi-Bred International, Inc. proprietary inbred maize varieties. Methods for producing a maize plant that comprises crossing hybrid maize variety X13A478 with another maize plant. Methods for producing a maize plant containing in its genetic material one or more traits introgressed into X13A478 through backcross conversion and/or transformation, and to the maize seed, plant and plant part produced thereby. This invention relates to the maize variety X13A478, the seed, the plant produced from the seed, and variants, mutants, and minor modifications of maize variety X13A478. This invention further relates to methods for producing maize varieties derived from maize variety X13A478.Type: GrantFiled: February 27, 2013Date of Patent: May 27, 2014Assignee: Pioneer Hi Bred International IncInventor: Lora Kilgore-Norquest
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Patent number: 8735698Abstract: A drive mechanism of a lifting rail for a musical instrument including a lifting rail, the drive mechanism including: a connection member connected to the lifting rail; and a movement-force giving mechanism configured to move the lifting rail via the connection member, wherein the lifting rail includes: a hollow portion opening at one end; and a through-hole formed through an upright wall portion of the lifting rail, wherein the connection member includes: an insertion member having an attachment hole corresponding to the through-hole; a fixing member for connecting the lifting rail and the connection member; and a contact portion configured to come into contact with the one end of the lifting rail when the insertion member is inserted in the hollow portion by a prescribed distance so as to prevent the insertion member from being further inserted in the hollow portion, thereby positioning the attachment hole relative to the through-hole.Type: GrantFiled: January 17, 2013Date of Patent: May 27, 2014Assignee: Yamaha CorporationInventors: Yoshiya Matsuo, Yasuhiko Oba, Yuji Fujiwara
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Patent number: 8735699Abstract: An upright piano main action rail with a special cross sectional shape of its lower half that angles or curves towards the back of the piano to effectively relocate the lower front surface of upright piano main action rail from a position in front of the row of whippen flanges as with the prior art to a relocated new position behind the row of whippen flanges to enable the front mounting of whippen flanges to the main action rail. Upright piano main action rail has all whippen mounting holes located its the lower front surface instead of the lower rear surface as with prior art upright piano main action rails.Type: GrantFiled: January 19, 2012Date of Patent: May 27, 2014Inventors: Kirk Burgett, Jamie Marks, Dana Mazzaglia
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Patent number: 8735700Abstract: A bearing member is to be used for an action mechanism in a keyboard instrument, the action mechanism provided with an action member that pivots in accordance with a key-depressing operation, and the bearing member includes: an inner layer having a through hole through which a shaft provided in the action member is inserted; and an outer layer formed in an outer side of the inner layer. The inner layer is formed of a first material having a higher stability against humidity than a stability against humidity of the outer layer. The outer layer is formed of a second material having a resilience greater than a resilience of the inner layer.Type: GrantFiled: September 27, 2012Date of Patent: May 27, 2014Assignee: Kabushiki Kaisha Kawai Gakki SeisakushoInventor: Kiyoshi Abe
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Patent number: 8735701Abstract: A tone control device is provided. The tone control device includes a weight assembly including at least a first magnet and a second magnet magnetically attracted to the first magnet, wherein the first magnet is positionable on a first surface of the bridge and the second magnet is positionable on a second surface of the bridge such that the weight assembly is securely coupled to the bridge.Type: GrantFiled: February 12, 2013Date of Patent: May 27, 2014Inventor: Michael Clement De Jule
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Patent number: 8735702Abstract: A dissipating medium made of a stone-like tile. The tile used for removing a wolf note and its related energy, when played on a string musical instrument. The tile is made of a natural mineral, such as travertine. Also, the tile has a shear wave velocity between 300 to 440 m/sec. The tile can have an angular or annular shape. The angular shape is in a range of 10 to 12 inches square and a thickness in a range of ½ to ¾ inch. A top surface of the tile includes an annular depression for receiving an end pin of a cello's tail piece. The medium can be constructed of two tiles with an upper tile 10 inches square and a lower tile 12 inches square. Also, the medium has a weight in a range of 6 to 12 pounds for ease in transporting.Type: GrantFiled: July 30, 2012Date of Patent: May 27, 2014Inventor: Deborah R. Miles
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Patent number: 8735703Abstract: A percussion instrument (1) in the form of a drum being a rectangular parallelepiped or a cuboid in shape and having three or more live striking faces (2), wherein each striking face (2) has a different percussive property. The invention further comprises a stand (30) specifically adapted to support a percussion instrument (1) in the form of a cuboid drum.Type: GrantFiled: May 21, 2010Date of Patent: May 27, 2014Inventor: Dion Dublin
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Patent number: 8735704Abstract: A cajon includes a box-like base body with a lower side, a front, a rear and two mutually remote lateral side walls and an upper side, as well as a playing surface. The base body is provided at the top on the two lateral side walls with widening bodies, which widen the upper side in the lateral direction. The playing surface is formed by the thus widened upper side of the base body lying horizontally in the playing position.Type: GrantFiled: January 17, 2013Date of Patent: May 27, 2014Assignee: Roland Meinl Musikinstrumente GmbH & Co. KGInventor: Michael Buchner
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Patent number: 8735705Abstract: A drum beating apparatus is provided. A base includes a bottom plate and a first post disposed on the bottom plate, and a connecting portion is arranged on the first post. An axle is coupled to the first post and rotatable around an axis of the axle. A linking assembly has corresponding first and second ends, a rod element which is connected between the first and second ends and an elastic element. The first end is pivoted to one end of the axle, the rod element is disposed through the connecting portion, and the elastic element is disposed around the rod element and located between the second end and the connecting portion. One end of a pedal is swingably coupled to one end of the bottom plate, and the other end of the pedal is co-movably connected to the axle.Type: GrantFiled: February 10, 2013Date of Patent: May 27, 2014Inventor: Kuo-Chang Chen
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Patent number: 8735706Abstract: A musical instrument keyboard is provided comprising a plurality of black and white keys being identically shaped and sized and arranged on a single plane in a parallel and fully adjacent manner relative to one another said keys being connected to key responsive means for enabling the generation of tones substantially within the tonal range of a standard piano.Type: GrantFiled: May 19, 2010Date of Patent: May 27, 2014Inventor: Sydney Mathews
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Patent number: 8735707Abstract: A system for documenting the music learning process of a music student to encourage more students to study long enough to become proficient in their musical form through involvement with an immersive interactive tool. A server computer is programmed to facilitate communication between the music student and other individuals. A music student computer is connected to the server computer. The music student computer is for transmitting and receiving music information related to the learning process of the music student. Likewise, a third party computer is connected to the server computer. The third party computer allows a pre-approved third party to transmit and receive music information related to the learning process of the music student An administrator computer is also connected to the server computer. The administrator computer permits an administrator to coordinate communication between the music student and the third party.Type: GrantFiled: June 1, 2010Date of Patent: May 27, 2014Assignee: Life Empowerment, Inc.Inventors: Jennifer M. Paterson, Richard J. Blue
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Patent number: 8735708Abstract: Systems and methods for music recognition and/or tag history synchronization are described. The system includes, for example, a first device, a second device and a server. The first device is configured to record music from a surrounding environment. The first device wirelessly sends the recorded music to the server for identification. The server is configured to identify the recorded music and to generate a tag corresponding to the identified music. The first tag history is updated to include the tag which includes information corresponding to the identified music. The first device and the second device are registered with the server as part of a particular user account. The server is configured to synchronize a second tag history stored in the second device with the updated first tag history.Type: GrantFiled: February 19, 2013Date of Patent: May 27, 2014Assignee: Google Inc.Inventors: Paul Joyce, Dominik Roblek, Owen Daniel Otto, Matthew Sharifi, Annie Chen, Lars Fabian Krüger
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Patent number: 8735709Abstract: A lead tone is generated on the basis of an input tone signal. Meanwhile, a specific pitch of the input tone signal is sequentially detected, from which is detected a normalized pitch corresponding to any one of the musical pitch names. Then, difference information is obtained which pertains to a difference between the specific pitch and the normalized pitch, and a pitch having a given pitch interval from the normalized pitch is determined as a target pitch of a tone signal to be generated. Then, a harmony tone is generated which has a pitch obtained by modulating the target pitch in accordance with the difference information.Type: GrantFiled: February 24, 2011Date of Patent: May 27, 2014Assignee: Yamaha CorporationInventors: Akira Yamauchi, Hikaru Kase, Motoaki Takashima
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Patent number: 8735710Abstract: Provided is an electronic stringed instrument comprising: a pickup that detects vibration of a string; a feedback operator used to select a level of feedback effect; a feedback control device that controls to add a feedback effect to a tone signal based on the vibration of the string detected by the string vibration detection device and based on the selected level of feedback effect from the feedback operator; and an output device that outputs the tone signal to which the feedback effect is added by the feedback control device.Type: GrantFiled: January 18, 2013Date of Patent: May 27, 2014Assignee: Roland CorporationInventor: Toshio Yamabata
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Patent number: 8735711Abstract: A signal processing apparatus 30 includes a FIR filter 33 that generates a signal corresponding to an instrument sound including a resonance of a body caused by a vibration of a string, based upon a pickup signal from a pickup sensor 21. The signal processing apparatus 30 guides the pickup signal from the pickup sensor 21 to an adder circuit 35 via a low-pass filter 32, guides the signal generated by the FIR filter 33 to the adder circuit 35 via a high-pass filter, and adds and mixes these signals in the adder circuit 35. The cut-off frequency of the high-pass filter 34 is equal to or higher than the cut-off frequency of the low-pass filter 32.Type: GrantFiled: February 26, 2013Date of Patent: May 27, 2014Assignee: Yamaha CorporationInventor: Ryuichiro Kuroki
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Patent number: 8735712Abstract: A system and method directed to using a PV array and laser beamed-power for aircraft and satellites is provided. More specifically, a system and method directed to a PV receiver that reduces power losses caused by variations in irradiance is provided. The use of a sloped array with a grooved cover glass coated with reflective coating allows the system and method to receive the laser beamed power at an angle and reduce any losses while producing a maximum power output. In addition, the use of capacitors in parallel with the PV cells in the array reduces resistive losses caused by short-term optical fluctuations and assists in maximizing power output for the array.Type: GrantFiled: July 21, 2006Date of Patent: May 27, 2014Assignee: The Boeing CompanyInventor: Brian J. Tillotson
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Patent number: 8735713Abstract: A sun-chasing device is provided, including a base, a first transmitter disposed on the base, a second transmitter, a support, a carrier pivotally connected to the support for carrying a solar module, a first supporting component pivotally connected to the first transmitter and the carrier, and a second supporting component pivotally connected to the second transmitter and the carrier. The sun-chasing device has great rigidity and carrying ability against strong wind, and has great precision and rotation angle, such that a solar plate can precisely aim at sun for long time and thus the efficiency of a solar module is significantly increased.Type: GrantFiled: August 30, 2012Date of Patent: May 27, 2014Assignee: National Chiao Tung UniversityInventors: You-Long Sie, Edward Yi Chang, Shyr-Long Jeng, Wei-Hua Chieng, Bin-Han Lue, Ming-Tsan Peng, Chia-Hua Chang, Jwu-Shen Hu, Chien-Hsun Chiang
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Patent number: 8735714Abstract: A device includes an enclosure mounted to an end portion of a photovoltaic panel and has an interior, an opening, an inclined ramp within the interior, a door pivotally disposed at the opening, and a latch mechanism. The door is on a panel surface in an open position, and blocks the opening in a closed position. The latch mechanism latches the door closed and releases the door to the open position. A flexible material blocks light from reaching panel photovoltaic cells and includes a first end coupled to the inclined ramp within the enclosure and an opposite second end coupled to a rod. The flexible material is rolled up about the rod and rests on the inclined ramp. The door's closed position blocks deployment of the material. In the open position, the material rolls down the inclined ramp and covers the panel surface. The door is automatically or manually deployed.Type: GrantFiled: November 26, 2012Date of Patent: May 27, 2014Assignee: Eaton CorporationInventor: James L. Lagree
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Patent number: 8735715Abstract: Disclosed is a photovoltaic device that comprises: a first electrode including a transparent conductive oxide layer; a first unit cell being placed on the first electrode; a second unit cell being placed on the first unit cell; and a second electrode being placed on the second unit cell, wherein the intrinsic semiconductor layer of the first unit cell includes hydrogenated amorphous silicon or hydrogenated amorphous silicon based material, wherein an intrinsic semiconductor layer of the second unit cell includes hydrogenated microcrystalline silicon or hydrogenated microcrystalline silicon based material, and wherein a ratio of a root mean square roughness to an average pitch of a texturing structure formed on the surface of the first electrode is equal to or more than 0.05 and equal to or less than 0.13.Type: GrantFiled: January 9, 2011Date of Patent: May 27, 2014Assignee: Intellectual Discovery Co., Ltd.Inventor: Seung-Yeop Myong
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Patent number: 8735716Abstract: A solar cell includes a graphite substrate, an amorphous carbon layer having a thickness of not less than 20 nm and not more than 60 nm formed on the graphite substrate, an AlN layer formed on the amorphous carbon layer, a n-type nitride semiconductor layer formed on the AlN layer; a light-absorption layer including a nitride semiconductor layer formed on the n-type nitride semiconductor layer; a p-type nitride semiconductor layer formed on the light-absorption layer; a p-side electrode electrically connected to the p-type nitride semiconductor layer; and an n-side electrode electrically connected to the n-type nitride semiconductor layer. The amorphous carbon layer is obtained by oxidizing the surface of the graphite substrate.Type: GrantFiled: July 12, 2012Date of Patent: May 27, 2014Assignee: Panasonic CorporationInventors: Nobuaki Nagao, Takahiro Hamada, Akihiro Itoh
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Patent number: 8735717Abstract: A highly reliable thin film solar cell and a method of manufacturing the same are provided to improve bonding strength between a back-surface electrode layer and a bus bar without limiting the kind of metal film of the back-surface electrode layer. The thin film solar cell at least includes a light-transmitting insulating substrate, a transparent conductive film, a photoelectric conversion layer, and a back-surface electrode layer provided on the light-transmitting insulating substrate, and a bus bar provided on the back-surface electrode layer. The bus bar is electrically connected with the back-surface electrode layer with a conductive tape interposed whereby the back-surface electrode layer is used as a take-out electrode. The conductive tape preferably includes a thermosetting resin and a conductive particle. Furthermore, the conductive tape is preferably an anisotropic conductive tape.Type: GrantFiled: April 25, 2008Date of Patent: May 27, 2014Assignee: Sharp Kabushiki KaishaInventor: Shinsuke Tachibana
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Patent number: 8735718Abstract: An organic photovoltaic cell structure and a method for fabricating the organic photovoltaic cell structure are each predicated upon an organic photovoltaic material layer located and formed interposed between an anode and a cathode. The organic photovoltaic cell structure and the method for fabricating the organic photovoltaic cell structure also include for the anode a nickel and indium doped tin oxide material layer (Ni-ITO) that has a nickel doping sufficient to provide a work function of the nickel and indium doped tin oxide material layer (Ni-ITO) anode preferably no more positive than about ?5.0 eV.Type: GrantFiled: April 20, 2011Date of Patent: May 27, 2014Assignee: University of Central FloridaInventors: Winston V. Schoenfeld, Hani Khallaf
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Patent number: 8735719Abstract: A leaky travelling wave array of optical elements provide a solar wavelength rectenna.Type: GrantFiled: January 24, 2012Date of Patent: May 27, 2014Assignee: AMI Research & Development, LLCInventors: John T. Apostolos, Judy Feng, William Mouyos
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Patent number: 8735720Abstract: Disclosed is a photoelectric conversion device wherein a methine dye represented by the formula (1) below is supported by a thin film of oxide semiconductor particles arranged on a substrate. Also disclosed is a solar cell manufactured by using such a photoelectric conversion device. (In the formula (1), n represents an integer of 0-5; m represents an integer of 0-5; R1-R4 independently represent a hydrogen atom, an optionally substituted aromatic residue, an optionally substituted aliphatic hydrocarbon residue or the like; X and Y independently represent a hydrogen atom; an optionally substituted aromatic residue, an optionally substituted aliphatic hydrocarbon residue or the like; Z represents an oxygen atom, a sulfur atom or the like; A1, A2, A3, A4 and A5 independently represent a hydrogen atom, an optionally substituted aromatic residue, an optionally substituted aliphatic hydrocarbon residue or the like; and rings a, b and c may be substituted.).Type: GrantFiled: March 1, 2007Date of Patent: May 27, 2014Assignee: Nippon Kayaku Kabushiki KaishaInventors: Koichiro Shigaki, Masayoshi Kaneko, Takayuki Hoshi, Teruhisa Inoue
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Patent number: 8735721Abstract: A case for housing and protecting an electronic device against moisture damage and contaminants is disclosed. The case includes a first member having a first plainer section and a first perimetric wall formed thereon, and a second member having a second planer section and a second perimetric wall formed thereon. The first perimetric wall and the second perimetric wall are engaged forming an overlap and a sealing structure for a watertight seal. The sealing structure includes a mated ring and a ridge-to-groove interlock. The case further includes a plurality interface feature accesses, including an optical access, an audio access, a button, and at least one open access for electrical connection. The case provides a cover with a plug adapted to cover up the open electrical connection access to form a watertight seal.Type: GrantFiled: April 15, 2013Date of Patent: May 27, 2014Assignee: Octo Products LLCInventor: Yichuan Pan
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Patent number: 8735722Abstract: The invention relates to an end fitting and an enclosure assembly with the end fitting, and with a sealing enclosure. In order to improve the reliability of the enclosure assembly, the invention provides that the end fitting is provided with a sealing protrusion and that a sealing section and a retention section of the sealing enclosure are arranged one behind the other in a connection direction.Type: GrantFiled: June 28, 2011Date of Patent: May 27, 2014Assignee: TE Connectivity Nederland B.V.Inventors: Martijn Scholten, Jacco Elenbaas, Jarno Verhoeven, Marc Jansen
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Patent number: 8735723Abstract: An apparatus and method for mounting cables within a magnetic resonance imaging (MRI) system are provided. One apparatus includes a cable assembly having a rigid support structure defining a channel with a cross-section and an electrical cable having a cross-section smaller than the cross-section of the channel. The electrical cable is secured within the channel of the rigid support structure, with the rigid support structure configured for coupling to a stationary component of the MRI system to resist movement from a movable component to which the electrical cable is connected.Type: GrantFiled: November 15, 2010Date of Patent: May 27, 2014Assignee: General Electric CompanyInventors: Longzhi Jiang, Robert Belinski, Robbi McDonald
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Patent number: 8735724Abstract: An electric equipment of the present invention has an insulation structure at a welding part formed by joining end parts of a plurality of conductors with each other, the welding part having a rectangular cross section and being coated with an insulating coating, in which the insulating coating is voidless and has a coating thickness of 50 to 1000 ?m in the welding part, and in which an edge cover ratio of the insulating coating is 20% or more. According to the present invention, the insulation performance of the insulation structure in which the welding part formed by joining the end parts of the plurality of conductors with each other can be improved, the welding part having a rectangular cross section and being coated with an insulating coating, and a highly reliable electric equipment can be provided.Type: GrantFiled: October 17, 2011Date of Patent: May 27, 2014Assignee: Hitachi, Ltd.Inventors: Takahito Muraki, Satoru Amou
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Patent number: 8735725Abstract: A signal transmission line disposed with a conductive plastic material layer is provided, which relates to the field of signal transmission line technologies, and specifically to electromagnetic interference (EMI) protection of the signal transmission line. The signal transmission line at least includes a metal wire disposed with an insulation layer, a conductive plastic material layer is disposed outside the metal wire disposed with the insulation layer, and an insulation outer coating layer is disposed outside the conductive plastic material layer. A conductive plastic material layer is used as a shielding layer for EMI protection. The conductive plastic material is also called conductive polymer plastic and has characteristics such as good conductivity and good antistatic property.Type: GrantFiled: May 14, 2012Date of Patent: May 27, 2014Assignee: Shenzhen Luxshare Precision Industry Co., Ltd.Inventor: Huabing Li
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Patent number: 8735726Abstract: A jacket for a data cable that comprises a main jacket body having an inner area for receiving one or more filaments and a central longitudinal axis. The main body has an inner surface that surrounds the inner area and an opposite outer surface. At least one longitudinal opening extends through the main jacket body between the inner and outer surfaces and substantially parallel to the central longitudinal axis of the main jacket body. The longitudinal opening is substantially enclosed within the main jacket body.Type: GrantFiled: November 25, 2009Date of Patent: May 27, 2014Assignee: General Cable Technologies CorporationInventor: Brian P. Skocypec
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Patent number: 8735727Abstract: An electronic device having a cable holding device is disclosed. The electronic device comprises a case; a circuit board in the case; a cable holding device attached to the circuit board and defining a through hole, a first positioning slot and a second positioning slot; the first positioning slot communicating with the through hole, and the second positioning slot communicating with the through hole; a cable electronically connected to the circuit board; wherein the cable is received either in the first positioning slot and the through hole or in the second positioning slot and the through hole.Type: GrantFiled: December 15, 2011Date of Patent: May 27, 2014Assignees: Hong Fu Jin Precision Industry (WuHan) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Yun-Lung Chen, Chung Chai, Zhao-Bin Yang
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Patent number: 8735728Abstract: A printed circuit board includes an insulating layer, a signal trace, a ground trace, and a fin. The insulating layer has a first surface and an opposite second surface. The signal trace and the ground trace are formed on the first surface of the insulating layer. The first fin is directly formed on the ground trace. Also provided is a method for manufacturing the printed circuit board.Type: GrantFiled: March 17, 2011Date of Patent: May 27, 2014Assignee: Zhen Ding Technology Co., Ltd.Inventor: Chien-Pang Cheng
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Patent number: 8735729Abstract: A double-sided substrate includes a ceramic substrate, a first metal layer formed on one surface of the ceramic substrate and having a plurality of subsidiary metal layers which are laminated on the surface of the ceramic substrate and whose purities differ from each other and a second metal layer formed on the other surface of the ceramic substrate, wherein the closer to the ceramic substrate any subsidiary metal layer is located, the lower purity the subsidiary metal layer has. Additionally, a semiconductor includes the above double-sided substrate, a power element and a heat sink.Type: GrantFiled: January 10, 2012Date of Patent: May 27, 2014Assignee: Kabushiki Kaisha Toyota JidoshokkiInventors: Shogo Mori, Yoshitaka Iwata
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Patent number: 8735730Abstract: A non-adhering portion where an adhesion layer is removed is provided on a lower surface of a display sheet directly above a connection portion. Even if bulges or recesses occur at the connection portion on an upper substrate owing to fluctuations or differences in thickness when adhering and connecting a wiring board, no bulge or recess occurs on the display sheet. Therefore, it is possible to obtain a touch panel which is easy to see and operate.Type: GrantFiled: May 11, 2011Date of Patent: May 27, 2014Assignee: Panasonic CorporationInventors: Akira Nakanishi, Shigeyuki Fujii
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Patent number: 8735731Abstract: In a flexible circuit board, signal wirings and ground wirings are provided on one main surface of a base film formed of a thermoset resin. A coverlay film formed of a thermoplastic resin is adhered to and integrated with the signal wirings, ground wirings, and base film. External terminals 15 are disposed in a predetermined conductor pattern on one main surface of the coverlay film, and a plated layer is formed on each of the external terminals. A first ground layer and a rear side resin film are adhered in this order below the base film to be integrated.Type: GrantFiled: September 16, 2011Date of Patent: May 27, 2014Assignee: Yamaichi Electronics Co., Ltd.Inventor: Noriaki Sekine
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Patent number: 8735732Abstract: A multilayer substrate is configured by stacking conductive layers and insulation layers. The multilayer substrate includes a core that is one of the conductive layers and is thicker than any of other conductive layers, and a first signal line that is included in the conductive layers and is adjacent to the core so that a first insulation layer that is one of the insulation layers is interposed between the core and the first signal line, the first signal line being used for transmission of an RF signal. The core has a recess portion so as to face the first signal line.Type: GrantFiled: December 20, 2011Date of Patent: May 27, 2014Assignee: Taiyo Yuden Co., Ltd.Inventors: Tetsuo Saji, Gohki Nishimura, Naoyuki Tasaka
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Patent number: 8735733Abstract: Disclosed are a resin composition containing (a) a maleimide compound having at least two N-substituted maleimide groups in a molecular structure and (b) a silicone compound having at least one reactive organic group in a molecular structure thereof; and a prepreg using the same, a laminate, and a printed wiring board. A resin composition having excellent heat resistance and low thermal expansion properties; and a prepreg, a laminate, and a printed wiring board using the same can be provided.Type: GrantFiled: January 18, 2012Date of Patent: May 27, 2014Assignee: Hitachi Chemical Company, Ltd.Inventors: Masato Miyatake, Tomohiko Kotake, Shunsuke Nagai, Shintaro Hashimoto, Yasuo Inoue, Shin Takanezawa, Hikari Murai
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Patent number: 8735734Abstract: A Z-directed signal delay line component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained with the PCB. In one embodiment the Z-directed delay line component is housed within the thickness of the PCB allowing other components to be mounted over it. The delay line embodiments include a W-like line and a plurality of spaced apart, semi-circular line segment connected such that current flow direction alternates in direction between adjacent semi-circular line segments, each of which in other embodiments can be varied by use of shorting bars. Several Z-directed delay line components may be mounted into a PCB and serially connected to provide for longer delays. The body may contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body. Methods for mounting Z-directed components are also provided.Type: GrantFiled: July 23, 2009Date of Patent: May 27, 2014Assignee: Lexmark International, Inc.Inventors: Keith Bryan Hardin, John Thomas Fessler, Paul Kevin Hall, Brian Lee Nally, Robert Aaron Oglesbee
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Patent number: 8735735Abstract: The present invention generally provides a novel method for manufacturing an electronic module with crossed conducting lines and a novel electronic module with crossed conducting lines. In particular, an aspect of the present invention is to provide a thin, single layer electronic module. It is also an object of the present invention to provide an electronic module with an embedded jumper element having reliable high quality connections and contacts. To achieve at least some of the aspects of the present invention, an embedded pre-fabricated jumper module is placed inside a printed circuit board which allows the crossing of conducting lines within the module without manufacturing additional layers over the whole PCB board. The resultant PCB will have improved contacts and will not have surface deformation.Type: GrantFiled: July 23, 2010Date of Patent: May 27, 2014Assignee: GE Embedded Electronics OyInventors: Petteri Palm, Tuomas Waris, Antti Iihola
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Patent number: 8735736Abstract: The electronic component module includes a substrate; an electronic component mounted on an electronic component mounting surface of the substrate; an insulating body that covers the electronic component on the electronic component mounting surface of the substrate; and a metal film formed by electroless plating, the metal film covering an exterior surface of the insulating body and a side surface of the substrate. The substrate has a space section in which a space is formed, the space being dented inward of the substrate in the periphery of a surface opposite to the electronic component mounting surface of the substrate, and the metal film entirely covers at least one side surface of the electronic component module except for at least a portion located on a surface perpendicular to the electronic component mounting surface of the substrate in the space section.Type: GrantFiled: October 21, 2011Date of Patent: May 27, 2014Assignee: SAE Magnetics (H.K.) Ltd.Inventors: Tamon Kasajima, Masashi Shiraishi
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Patent number: 8735737Abstract: A substrate includes a substrate base, first contact parts arranged in a pattern on a surface of the substrate base, and leads respectively having a generally U-shape with a flexible part, a first end fixed to a corresponding one of the first contact parts, and a second end that is located a predetermined distance away from the first end relative to the surface of the substrate base. The first and second ends of each of the leads are substantially aligned in a direction perpendicular to the surface of the substrate base in a state where the second end of each lead is pushed by a target object and deformed thereby in order to electrically connect the substrate to the target object.Type: GrantFiled: May 19, 2010Date of Patent: May 27, 2014Assignee: Shinko Electric Industries Co., Ltd.Inventors: Yoshihiro Ihara, Takehito Terasawa, Masakuni Kitajima