Abstract: A semiconductor device has a semiconductor die and first insulating layer formed over the semiconductor die. A plurality of first micro-vias can be formed in the first insulating layer. A conductive layer is formed in the first micro-openings and over the first insulating layer. A second insulating layer is formed over the first insulating layer and conductive layer. A portion of the second insulating layer is removed to expose the conductive layer and form a plurality of second micro-openings in the second insulating layer over the conductive layer. The second micro-openings can be micro-vias, micro-via ring, or micro-via slots. Removing the portion of the second insulating layer leaves an island of the second insulating layer over the conductive layer. A bump is formed over the conductive layer. A third insulating layer is formed in the second micro-openings over the bump. The second micro-openings provide stress relief.

Abstract: A packaged semiconductor device includes a substrate including a first major surface, a second major surface, first vias running between the first major surface and the second major surface, first contact pads contacting the first vias at the first major surface, second contact pads contacting the first vias at the second major surface, and an opening between the first major surface and the second major surface. A first integrated circuit (IC) die is positioned in the opening in the substrate. Electrical connections are formed between the second IC die and the second contact pads. A first conductive layer is over the first contact pads and contact pads on the first IC die. Encapsulating material is on the second major surface of the substrate around the first IC die, the second IC die, the electrical connections, and between edges of the opening and edges of the first IC die.

Abstract: A trench contact silicide is formed on an inner wall of a contact trench that reaches to a buried conductive layer in a semiconductor substrate to reduce parasitic resistance of a reachthrough structure. The trench contact silicide is formed at the bottom, on the sidewalls of the trench, and on a portion of the top surface of the semiconductor substrate. The trench is subsequently filled with a middle-of-line (MOL) dielectric. A contact via may be formed on the trench contact silicide. The trench contact silicide may be formed through a single silicidation reaction with a metal layer or through multiple silicidation reactions with multiple metal layers.

Abstract: A semiconductor device with a connection pad in a substrate, the connection pad having an exposed surface made of a metallic material that diffuses less readily into a dielectric layer than does a metal of a wiring layer connected thereto.

Abstract: An integrated circuit (IC) die has a top side surface providing circuitry including active circuitry configured to provide a function, including at least one bond pad formed from a bond pad metal coupled to a node in the circuitry. A dielectric passivation layer is over a top side surface of a substrate providing a contact area which exposes the bond pad. A metal capping layer includes an electrically conductive metal or an electrically conductive metal compound over at least the contact area to provide corrosion protection to the bond pad metal, which is in electrical contact with the bond pad metal. The metal capping layer can extend over structures other than the bond pads, such as to cover at least 80% of the area of the IC die to provide structures on the IC die protection from incident radiation.

Abstract: A dielectric layer is formed on a substrate and patterned to form an opening. The opening is filled and the dielectric layer is covered with a metal layer. The metal layer is thereafter planarized so that the metal layer is co-planar with the top of the dielectric layer. The metal layer is etched back a predetermined thickness from the top of the dielectric layer to expose the inside sidewalls thereof. A sidewall barrier layer is formed on the sidewalls of the dielectric layer. A copper-containing layer is formed over the metal layer, the dielectric layer, and the sidewall barrier layers. The copper-containing layer is etched to form interconnect features, wherein the etching stops at the sidewall barrier layers at approximately the juncture of the sidewall of the dielectric layer and the copper-containing layer and does not etch into the underlying metal layer.

Abstract: An electronic device is described comprising at least one chip enclosed in a package, in turn provided with a metallic structure or leadframe having a plurality of connection pins, this chip having at least one first contact realized on a first face and at least one second contact realized on a second and opposite face of this chip. The chip comprises at least one through via crossing the whole section of the chip as well as a metallic layer extending from the second contact arranged on the first face, along walls of the at least one through via up to the second and opposite face in correspondence with an additional pad. The electronic device comprises at least one interconnection layer for the electrical and mechanical connection between the chip and the metallic structure having at least one portion realized in correspondence with the at least one through via so as to bring the second contact placed on the second face of the chip back on its first face.

Abstract: Integrated circuits and methods for fabricating integrated circuits are provided. In an exemplary embodiment, a method for fabricating integrated circuits includes forming a metal contact structure that is electrically connected to a device. A capping layer is selectively formed on the metal contact structure, and an interlayer dielectric material is deposited over the capping layer. A metal hard mask is deposited and patterned over the interlayer dielectric material to define an exposed region of the interlayer dielectric material. The method etches the exposed region of the interlayer dielectric material to expose at least a portion of the capping layer. The method includes removing the metal hard mask with an etchant while the capping layer physically separates the metal contact structure from the etchant. A metal is deposited to form a conductive via electrically connected to the metal contact structure through the capping layer.

Abstract: A multi-layer micro-wire structure includes a substrate having a surface. A plurality of micro-channels is formed in the substrate. A first material composition is located in a first layer only in each micro-channel and not on the substrate surface. A second material composition different from the first material composition is located in a second layer different from the first layer only in each micro-channel and not on the substrate surface. The first material composition in the first layer and the second material composition in the second layer form an electrically conductive multi-layer micro-wire in each micro-channel.

Abstract: A method and structure for bump-on-trace bonding is provided. In an embodiment traces to be used for bump-on-trace (BOT) bonding are protected during a pre-solder treatment. The pre-solder treatment improves the adhesion between the exposed traces (e.g., the non-BOT traces) and a solder resist layer.

Abstract: To provide a semiconductor device comprising a first layer that is provided on a semiconductor substrate and includes a first wiring pattern planarized by CMP and a plurality of first dummy patterns made of a same material as the first wiring pattern and a second layer that is provided above the semiconductor substrate and includes a second wiring pattern planarized by CMP and a plurality of second dummy patterns made of a same material as the second wiring pattern. A central axis of each of the second dummy patterns coincides with that of a corresponding one of the first dummy patterns in a direction perpendicular to the semiconductor substrate.

Abstract: Various embodiments of mechanisms for forming a die package using through sidewall vias (TsVs), which are formed by sawing through substrate via (TSV) in half, at edges of dies described enable various semiconductor dies and passive components be electrically connected to achieve targeted electrical performance. Redistribution structures with redistribution layers (RDLs) are used along with the TsVs to enable the electrical connections. Since the TsVs are away from the device regions, the device regions do not suffer from the stress caused by the TSV formation. In addition, electrical connections between upper and lower dies by the TsVs increases the efficiency of the area utilization of the die package.

Abstract: A semiconductor device includes a semiconductor substrate. A through hole extends through the semiconductor substrate. A first insulating layer covers an upper surface of the semiconductor substrate and includes an opening in communication with the through hole. An insulating film covers wall surfaces of the through hole and the opening. A through electrode is formed in the through hole and the opening. A first connection terminal includes an electroless plating metal layer formed on an end surface of the through electrode and an end surface of the insulating film. The first connection terminal has a larger diameter than the through electrode. A wiring pattern is laminated on a lower surface of the semiconductor substrate. An electrode pad is connected to the wiring pattern. The through electrode is connected to the wiring pattern.

Abstract: A semiconductor device has a core semiconductor device with a through silicon via (TSV). The core semiconductor device includes a plurality of stacked semiconductor die and semiconductor component. An insulating layer is formed around the core semiconductor device. A conductive via is formed through the insulating layer. A first interconnect structure is formed over a first side of the core semiconductor device. The first interconnect structure is electrically connected to the TSV. A second interconnect structure is formed over a second side of the core semiconductor device. The second interconnect structure is electrically connected to the TSV. The first and second interconnect structures include a plurality of conductive layers separated by insulating layers. A semiconductor die is mounted to the first interconnect structure. The semiconductor die is electrically connected to the core semiconductor device through the first and second interconnect structures and TSV.

Abstract: The present disclosure relates to the field of integrated circuit package design and, more particularly, to packages using a bumpless build-up layer (BBUL) designs. Embodiments of the present description relate to the field of fabricating microelectronic packages, wherein a first microelectronic device having through-silicon vias may be stacked with a second microelectronic device and used in a bumpless build-up layer package.

Abstract: A semiconductor construct includes a semiconductor substrate and connection pads provided on the semiconductor substrate. Some of the connection pads are connected to a common wiring and at least one of the remaining of the connection pads are connected to a wiring. The construct also includes a first columnar electrode provided to be connected to the common wiring and a second columnar electrode provided to be connected to a connection pad portion of the wiring.

Abstract: Subject matter disclosed herein may relate to word line electrodes and/or digit line electrodes in a cross-point array memory device. One or more word line electrodes may be configured to form a socket area to provide connection points to drivers and/or other circuitry that may be located within a footprint of an array of memory cells.

Abstract: A microelectronic assembly includes a dielectric element having first and second surfaces, first and second apertures extending between the first and second surfaces and defining a central region of the first surface between the first and second apertures, first and second microelectronic elements, and leads extending from contacts exposed at respective front surfaces of the first and second microelectronic elements to central terminals exposed at the central region. The front surface of the first microelectronic element can face the second surface of the dielectric element. The front surface of the second microelectronic element can face a rear surface of the first microelectronic element. The contacts of the second microelectronic element can project beyond an edge of the first microelectronic element. At least first and second ones of the leads can electrically interconnect a first central terminal of the central terminals with each of the first and second microelectronic elements.

Abstract: A chip package has multiple chips that may be arranged side-by-side or in a staggered, stair step arrangement. The contacts of the chips are connected to interconnect pads carried on the chips themselves or on a redistribution substrate. The interconnect pads desirably are arranged in a relatively narrow interconnect zone, such that the interconnect pads can be readily wire-bonded or otherwise connected to a package substrate.

Abstract: A semiconductor package, comprising: a substrate; a first semiconductor chip disposed on the substrate and having a rectangular shape with a long side and a short side; and a second semiconductor chip disposed on the first semiconductor chip and having a rectangular shape with a long side and a short side. The long side of the first semiconductor chip and the long side of the second semiconductor chip are rotated relative to each other; and an angle between the long side of the first semiconductor chip and the long side of the second semiconductor chip is greater than 45 degrees and less than 135 degrees.

Abstract: A silicon polymer material, which has a silicon polymer backbone with chromophore groups attached directly to at least a part of the silicon atoms, the polymer further exhibiting carbosilane bonds. The film forming composition and resulting coating properties can be tailored to suit the specific exposure wavelength and device fabrication and design requirements. By using two different chromophores the refractive index and the absorption co-efficient can be efficiently tuned. By varying the proportion of carbosilane bonds, and a desired Si-content of the anti-reflective coating composition can be obtained.

Abstract: A refrigerator is disclosed. The refrigerator includes a body, a storage chamber defined in the body while having an opened front side, a door to open or close the opened front side of the storage chamber, a water tank to store clean water, a carbonated water production module mounted to a back surface of the door, the carbonated water production module including a carbon dioxide gas cylinder stored with carbon dioxide gas, a carbonated water tank to produce carbonated water through mixing of the clean water with the carbon dioxide gas, and a module support to support a bottom of the carbonated water tank, and a water leakage sensor disposed on the module support, to sense water leakage occurring at the carbonated water production module. Through this configuration, it is possible to sense water leakage, and thus to minimize damage caused by water leakage.

Abstract: A refrigerator is disclosed. The refrigerator includes a body, a carbonated water tank to produce carbonated water through mixing of clean water with carbon dioxide gas, a sensor unit inserted, at at least a portion thereof, into the carbonated water tank, to sense an internal state of the carbonated water tank, and a holding unit disposed at one side of the carbonated water tank while holding the sensor unit in a fixed state. Through this configuration, it is possible to achieve easy coupling of the sensor unit and lines to the carbonated water tank while preventing water leakage even when the internal pressure of the carbonated water tank is high.

Abstract: An apparatus is disclosed including: a housing including a conduit having an inlet port and an outlet port; an insert at least partially disposed within the conduit and including a tapered portion extending from a narrower end proximal the inlet port to a wider end distal the inlet port; and a facility for adjusting the position of the insert within the conduit. In some embodiments, the apparatus is configured to receive a mixed flow of liquid and gas at the inlet port, direct the mixed flow through the conduit around a portion of the insert disposed within the chamber, and outlet the mixed flow at the outlet port.

Abstract: A packed tower for the absorption of water or SO3 in sulfuric acid includes a jacket and a domed grid disposed within the jacket. The domed grid is held on an L-shaped ring such that a gap is formed between an outside diameter of the domed grid and the jacket. A bed of packings is held on the domed grid through which the sulfuric acid charged from above trickles. A gas supply tube is disposed in a lower region of the tower. A gas outlet is disposed above the bed. An acid outlet is disposed in the lower region of the tower.

Abstract: An apparatus is disclosed for dispensing water including: a main inlet configured to receive water from a source; a chilled water line, including: an in-line carbonator; a carbonator water inlet valve configured to selectively direct water from the main inlet to the carbonator; a carbonator gas inlet valve configured to selectively direct carbonating gas to the carbonator; and a chilled water line outlet. The apparatus may be integrated in a refrigerator or other major appliance.

Abstract: A refrigerator is disclosed. The refrigerator includes a body, a storage chamber defined in the body while having an opened front side, a door to open or close the opened front side of the storage chamber, a water tank to store clean water, a carbonated water production module mounted to a back surface of the door, the carbonated water production module including a carbon dioxide gas cylinder stored with carbon dioxide gas, a carbonated water tank to produce carbonated water through mixing of the clean water with the carbon dioxide gas, and a gas regulator to adjust a pressure of the carbon dioxide gas flowing from the carbon dioxide gas cylinder to the carbonated water tank, and a safety device to selectively move the carbon dioxide gas cylinder toward or away from the gas regulator, thereby coupling or separating the carbon dioxide gas cylinder to or from the gas regulator.

Abstract: The present invention provides an optical film and a retardation film that each include an acryl resin, and 20 to 65 parts by weight of a graft copolymer including a conjugated diene rubber based on 100 parts by weight of the acryl resin, and an electronic device including the same.

Abstract: A system/method allowing hydrophilicity alteration of a polymeric material (PM) is disclosed. The PM hydrophilicity alteration changes the PM characteristics by decreasing the PM refractive index, increasing the PM electrical conductivity, and increasing the PM weight. The system/method incorporates a laser radiation source that generates tightly focused laser pulses within a three-dimensional portion of the PM to affect these changes in PM properties. The system/method may be applied to the formation of customized intraocular lenses comprising material (PLM) wherein the lens created using the system/method is surgically positioned within the eye of the patient. The implanted lens refractive index may then be optionally altered in situ with laser pulses to change the optical properties of the implanted lens and thus achieve optimal corrected patient vision. This system/method permits numerous in situ modifications of an implanted lens as the patient's vision changes with age.

Abstract: Inhalable pharmaceutical compositions can include an aqueous dispersion of particles including a hydrophobic bioactive agent (e.g., CoQIO) suitable for continuous aerosolization. Due to their chemical composition and methods of manufacture, the pharmaceutical compositions exhibit distinctive physicochemical properties that provide advantageous aerosol transmission and output.

Abstract: Water is used to control particle size in a process comprising mixing water with a composition comprising a rheology modifying agent and possibly sugar and cellulose to produce a paste. The paste is extruded to form particles which are then spheronised and dried. One advantage of using water to control particle size is that the number of particles having a diameter within a required range, e.g. between from about 800 to about 1500 ?m, may be increased.

Abstract: A composition includes a light-curable viscous mixture that includes: 0-50% by weight of a poly(methyl methacrylate)/methyl methacrylate solution; 5-20% by weight of at least one kind of multifunctional aliphatic (meth)acrylate; 5-40% by weight of at least one kind of aliphatic urethane (meth)acrylate oligomer; 25-65% by weight of at least one kind of difunctional bisphenol-A dimethacrylate; 0.1 to 5% by weight of at least one kind of a photoinitiator; 0.05 to 2% by weight of at least one kind of light stabilizer; and 0.1 to 3% by weight of color pigment based on the total weight of the composition.

Abstract: In one form, the invention is directed to a method for forming a porous implant suitable for a cavity from which tissue has been removed, including mixing soluble alginate and a radiopaque imaging agent with water; incorporating a gas or a pore forming agent into the alginate-water mixture; transferring the alginate-water mixture with the gas or the pore forming agent into a mold to form the mixture into a solid body of desired shape; removing the water from the body; and converting at least part of the soluble alginate to a less soluble alginate. In another form, the invention includes forming a mixture by mixing about 0.5 percent to about 4 percent by weight chitosan into an acidified aqueous solution containing 1 percent to 25 percent by weight acetic acid, along with about 0.5 percent to about 5 percent by weight of a powdered radiopaque imaging agent.

Abstract: A system and method for patterning a substrate includes a mold holding fixture for holding a mold with nanostructures and a substrate holding fixture for holding a substrate having a molding surface, a stage assembly has two or more independent axis movements for moving either the mold or the substrate therein, a contact force sensor sensing a contact force between the mold surface and the molding surface, a chamber for holding the mold and substrate and for the applying of a pressure inside that is higher or lower than atmospheric pressure, a pressure regulator and a manifold for changing the pressure inside the chamber, a door on the chamber housing provides for selectively allowing the substrate and the mold to pass there through, and means to divide the chamber into two fluidly separate sub-chambers.

Abstract: A method for using the quantity of heat output from an extrudate during a cooling operation in an extrusion process, wherein a fluid, in particular air, is guided along the extrudate and/or through the die counter to an extrusion direction, at least some of the heat from the extrudate and/or the die is transmitted to the fluid, the heated fluid is supplied from a first sub region of a process chain, comprising at least one die, a calibrating and cooling device and a take-off apparatus, via a connecting region, preferably consisting of at least one connecting pipe, to a second sub region of the process chain, comprising at least one suction apparatus. In the connecting region, an extraneous fluid can be added to the heated fluid in order to reduce the actual temperature of the heated fluid at least below a predetermined maximum value before said fluid is supplied to the second sub region of the process chain.

Abstract: A method of forming a composite member comprises placing a heat formable resin adjacent fibers to form a fiber member or members and forming the same into a plurality of for example tubular members. The fiber member is placed against a first mold part. An expandable material is distributed into a distributed configuration and expands under the application of heat. The distributed material is optionally stabilized in the distributed configuration to form an expandable member, which is placed said expandable member adjacent said fiber member. A second mold parts seals the mold forming a closed cavity containing the fiber member and the expandable member. The mold parts are heated, causing the expandable material to expand and form a pressure, which drives the fiber member against one of the mold parts, the mold parts also heating the resin adjacent the fibers. The resin then hardens to form the composite member.

Abstract: A composite and process for the production of a composite component, comprising a) a support of a thermoplastic composition, and b) at least one polyurethane layer in direct contact with the support.

Abstract: A low pressure dryer for granular or powdery material includes a plurality of canisters rotatable about a common vertical axis serially among material heating, vacuum drying and material inventory discharge positions; pneumatic piston-cylinder means for rotating the canisters about said axis among said heating, vacuum drying and inventory discharge positions; means for heating contents of a canister at said heating position; means for sealing and drawing vacuum within a canister at said vacuum drying position and means for selectably permitting downward flow of dried granular or powdery material out of a canister at said discharge position where said canisters move collectively and unitarily one with another.

Abstract: Refractory metal and refractory metal carbide nanoparticle mixtures and methods for making the same are provided. The nanoparticle mixtures can be painted onto a surface to be coated and heated at low temperatures to form a gas-tight coating. The low temperature formation of refractory metal and refractory metal carbide coatings allows these coatings to be provided on surfaces that would otherwise be uncoatable or very difficult to coat whether because they are carbon-based materials (e.g., graphite, carbon/carbon composites) or temperature sensitive materials (e.g., materials that would melt, oxidize, or otherwise not withstand temperatures above 800° C.), or because the high aspect ratio of the surface would prevent other coating methods from being effective (e.g., the inner surfaces of tubes and nozzles). The nanoparticle mixtures can also be disposed in a mold and sintered to form folly dense components.

Abstract: Methods for producing construction material utilizing loose pieces of aggregate (30), enzyme producing bacteria, an amount of urea and an amount of calcium ions. A first solution is prepared which includes urease which is formed by enzyme producing bacteria. A second solution is prepared which includes urea and calcium ions. The first and second solutions are added to the loose aggregate (30). The calcium ions contribute to the formation of calcium carbonate wherein the calcium carbonate fills and bonds between at least some of the gaps between the loose pieces of aggregate forming a solid construction material (92).

Abstract: A hydrogel composition includes 0.1 to 10 wt % of a cross-linking agent, 0.2 to 6 wt % of a gelling polymer, 0.5 to 20 wt % of a polyhydric alcohol, and 70 to 90 wt % of purified water to maintain a form without a supporter, be stable without fluidization even when a hydrogel is immersed in cosmetics or pharmaceuticals, and allow the cosmetics or the pharmaceuticals to be uniformly delivered to skin.

Abstract: Methods for forming discrete deformations in web materials are disclosed. In some embodiments, the method involves feeding a web into an apparatus having nips that are formed between intermeshing rolls. The apparatus may be in the form of nested or other arrangements of multiple rolls, in which the web is maintained in substantial contact with at least one of the rolls throughout the process, and at least two of the rolls define two or more nips thereon with other rolls. In some embodiments, rolls can be used to expose a different side of the web for a subsequent deformation step. In these or other embodiments, the rolls can be used to transfer the web between rolls in such a manner that it may offset the rolls and/or web so that subsequent deformations are formed at a different cross-machine direction location than prior deformations.

Abstract: A method which allows creation of an ornamental urn from an object such as horns, antlers, rocks, or the like. The method generally includes steps which form an ornamental urn adapted to resemble an object. The ornamental urn may include an access port having a funnel portion leading to an inner cavity adapted to store particulate materials, such as cremated remains. A plug, which may include a burr edge, is also provided to close the access port. The urn is fabricated by coating the object in a first coating to create an object mold, forming a second coating around the object mold to create an outer casing, and uniformly distributing a casting material along the inner walls of the object mold. After the casting material has cured, the ornamental urn may be removed from the object mold and finished to closely resemble the original object.

Abstract: A system and method of manufacturing an over molded wire harness is disclosed herein. The system and method includes designing and manufacturing a positive mold made from interchangeable and reusable modular blocks. The positive mold is used to create a negative mold tool die, whereby the wire harness can be assembled in the negative mold and overmold material can be injected into the negative mold.

Abstract: A device for fabricating a composite material part by injecting resin into a fiber structure. The device includes: a first die presenting two adjacent support surfaces defining a reentrant angle between them; at least one chock with a wedge-shaped portion configured to press the fiber structure into the angle; and a second die movable relative to the first die, the first and second dies being configured to clamp on the fiber structure and the chock. The chock is connected to the second die by at least one link, the link being hinged relative to the second die and relative to the chock to guide the wedge-shaped portion towards the angle to press the fiber structure into the angle when the second die approaches the first die.

Abstract: Forming multi-layer 3D structures involving the joining of at least two structural elements, at least one of which is formed as a multi-layer 3D structure, wherein the joining occurs via one of: (1) elastic deformation and elastic recovery, (2) relative deformation of an initial portion of at least one element relative to another portion of the at least one element until the at least two elements are in a desired retention position after which the deformation is reduced or eliminated, or (3) moving a retention region of one element into the retention region of the other element, without deformation of either element, along a path including a loading region of the other element and wherein during normal use the first and second elements are configured relative to one another so that the loading region of the second element is not accessible to the retention region of the first element.

Abstract: An inner sole board having varying regions of flexibility is provided for use in an article of footwear. The inner sole board may include different materials along its length at different locations that vary its flexibility. An inner sole board is manufactured in an injection molding process requiring only one mold. The process includes a first step of providing a mold, a second step of providing an injection molding assembly, a third step of preparing an injection molding assembly and mold, a fourth step of injecting material into the mold, and a fifth step of establishing the dimensions of a first portion. During the injection molding process, the flow rate of at least one material may be controlled by a nozzle gate to control the shape and size of the flex zone it creates. In this manner, the inner sole board may be customized for a specific sport or individual.

Abstract: A molded waterway assembly for a centerset faucet including a hot water inlet tube, a cold water inlet tube, and a central body of a coupler overmolded within hot and cold water bodies of the coupler.

Abstract: A molding arrangement serves for molding articles at each stroke of an injection-molding machine in which an injection mold is mounted. The articles are composed of components made of different materials in cavities formed in the injection mold, with each cavities corresponding to the shape of a component whereby identical cavities are separated by angular distances and placed at equal distances from a central axis of the injection mold and parts of the cavities are formed in a separately movable section of the movable mold half. The injection molding arrangement includes an operation part for displacing the section to-and-fro between closed and open positions of the injection mold and in open positions to turn the section about the central axis angles corresponding to the angles between the cavities to form whole cavities in the injection mold in closed position.

Abstract: Disclosed are a mold and a method of manufacturing a mesh-integrated filter using the same. The mold includes a lower body; a protruding pin provided to the lower body to protrude upward; a plurality of sliders slidably disposed on the lower body to move forward and surrounding a circumference of the protruding pin; an upper body covering upper sides of the sliders and having an injection hole formed therethrough such that a liquid resin is injected into a gap between the protruding pin and the sliders through the injection hole; and a shaping portion for forming a mesh-integrated filter upon hardening of the liquid resin. The mold can form a mesh-integrated filter in a closed state to improve productivity by eliminating a separate process for assembling a mesh and a filter.