Abstract: A server includes a main board, a side panel having an attached female connector, an expansion card, and a lever. The expansion card includes a latching member having a pivot and a male connector. The lever includes an engaging portion defining a slot, and a main body connected to the engaging portion and pivotally connected to the main board. When the lever is rotated in a first direction, the pivot is slid into the slot, causing the engaging portion to engage with the latching member. Further rotating the lever in the first direction, the expansion card is urged to move toward the side panel until the male connector mate with the female connector. When the lever is rotated in a second direction opposite to the first direction, the expansion card is urged to move away from the side panel, causing the male connector to disengage from the female connector.

Abstract: A fixing structure for an interface card connector is provided and includes a bottom housing, a board body, an interface card connector, a fixing plate, a torsion spring, and a spring. The bottom housing has an opening and a stop wall. The interface card connector is rotatably located on the board body by a fixing axis and includes a slot. The fixing plate includes a main body, a second spring fixing portion, an interface card connector fixing portion, and a protruding portion. When the board body is moved out the opening and the protruding portion contacts the stop wall, the fixing plate is stopped, and the interface card connector is separated from the interface card connector fixing portion. As a result, the interface card connector is rotated on the board body by the torsion spring, such that the slot is directed upwardly on the board body.

Abstract: A module includes a housing. The housing can include a port. The port can extend though an opening in the housing if the module is inserted in the chassis.

Abstract: The present solution provides an adjustable docking apparatus configurable to accommodate a variety of mobile electronic devices. The adjustable docking apparatus is removably coupled to a base electronic device. The apparatus further includes an electrical connector movably and removably connected to the adjustable docking apparatus and electrically coupleable to the base electronic device.

Abstract: A device may include multiple power supplies that are cooled by a system fan. The power supplies may be cross-connected to supply power to one another and the device may monitor temperatures of the power supplies. Based on the temperatures of the power supplies, the device may determine whether any of the power supplies are likely to be on fire. The device may shut off the fan when a power supply is determined to be likely to be on fire.

Abstract: A heat dissipation system includes a computer case having a base plate and a back plate perpendicularly to the base plate, a motherboard on the base plate adjacent to the back plate, and a mass storage device beside the motherboard. The motherboard has a heat sink and a first fan on the heat sink. The base plate has a second fan beside the motherboard. The second fan is adjacent to the back plate. The mass storage device is away from the back plate. The first fan rotates in such a manner that airflow is drawn into the computer case, flows through the heat sink and is exhausted out of the computer case. The second fan rotates in such a manner that airflow is drawn into the computer case, flows through the mass storage device and is exhausted out of the computer case.

Abstract: A daughterboard can include an airflow path or opening.

Abstract: An electronic device in which a holding member for holding an external instrument is arranged rotatably on a housing section, and a restricting part for restricting, at a predetermined angle, rotation angle of the holding member is formed on an inner wall of the housing section. The holding member makes contact with a front side surface engaged with a connector of the external instrument. The restricting part restricts rotation of the holding member whose back surface facing the front side surface is exposed from the housing section. When holding member includes a guiding part that guides the external instrument in a direction that detaches it from the housing section when the holding member is further rotated beyond the restriction by the restricting part, the external instrument can be detached from the housing section when the rotation is equal to or larger than a restriction angle defined by the restricting part.

Abstract: A holding device includes a plurality of holding sections each including a recess or an opening through which a hand of a user can be inserted; and a connection section connecting the plurality of holding sections to each other. When the holding device is fixed to two surfaces of an electronic device which are adjacent to each other, a handle that can be held by the user with a hand and a grip belt that can be supported by the user with the hand can be connected to each other via the connection section. Thus, the number of parts can be reduced and management of parts is easy.

Abstract: A thermal management system for an electronic equipment enclosure is provided. The thermal management system includes an intake duct for routing cold air in the front of the electronic equipment enclosure to the side of electronic equipment enclosure and one or more blanking panels for separating cold air in the front of the electronic equipment enclosure and hot air in the back of the electronic enclosure, as needed, for example, depending on the configuration of the thermal management system and/or the electronic equipment enclosure. The intake duct includes a front cover, which acts as an additional blanking panel, when installed, changing the airflow pattern of the electronic equipment enclosure, for example, from side-to-side to front-to back.

Abstract: A computer comprising at least one outer chamber, compartment, or bladder, at least one inner chamber, compartment, or bladder inside said outer chamber, compartment, or bladder, at least one internal sipe separating at least a part of said outer chamber, compartment, or bladder and at least a part of said inner chamber, compartment, or bladder, at least one Faraday cage; and the computer being configured to connect to at least one network of computers and comprising at least a first internal hardware firewall configured to deny access to at least a first protected portion of said computer from said network. At least a portion of an outer surface of said outer chamber, compartment, or bladder is proximate to an outer surface of said computer.

Abstract: An inverter for a vehicle is disclosed. The inverter for the vehicle illustratively includes: a power module provided with a power semiconductor device; a cooling module coupled to the power module and flowing a coolant therethrough; and a capacitor module mounted at the cooling module through a mounting unit and adapted to absorb a ripple current of the power module.

Abstract: A cooling system has an inlet plenum and at least one cooling channel which communicates with the inlet plenum. The cooling channel passes adjacent to a component to be cooled from an upstream inlet to a downstream outlet. A pair of electrodes are positioned adjacent the inlet to create an electric field tending to resist a bubble formed in an included dielectric liquid from moving in an upstream direction due to a dielectrophoretic force. Instead, a dielectrophoretic force urges the bubble in a downstream direction.

Abstract: A thermal interface material facilitates heat transfer between an integrated circuit device and a thermally conductive device. According to an example embodiment, a thermal interface material includes carbon nanotube material that enhances the thermal conductivity thereof The interface material flows between an integrated circuit device and a thermally conductive device. The carbon nanotube material conducts heat from the integrated circuit device to the thermally conductive device.

Abstract: The invention relates to a heat sink (1) for an electronic or electrical component, including: a base element (2) including a first main surface (2a) suitable for receiving the electronic component in close thermal contact; a plurality of elongate fins (3) projecting outwards from the second main surface (2b) of the base element (2), opposite the first surface (2a), and arranged around the entire periphery of the case element with enough space between fins to allow air circulation, characterized in that said space can be obtained by cutting a star-shaped geometrical shape matching said base element and said fins in a thin plate; and folding the fins relative to the plane of the base element.

Abstract: A semiconductor structure for dissipating heat away from a resistor having neighboring devices and interconnects. The semiconductor structure includes a semiconductor substrate, a resistor disposed above the semiconductor substrate, and a thermal protection structure disposed above the resistor. The thermal protection structure has a plurality of heat dissipating elements, the heat dissipating elements having one end disposed in thermal conductive contact with the thermal protection structure and the other end in thermal conductive contact with the semiconductor substrate. The thermal protection structure receives the heat generated from the resistor and the heat dissipating elements dissipates the heat to the semiconductor substrate.

Abstract: An apparatus includes a base plate including a plurality of depressions, and a power electronics printed circuit board including a plurality traces and a plurality of high voltage components. The plurality of high voltage components is located at a plurality of locations corresponding to the plurality of depressions in the base plate. A plurality of fasteners secures the printed circuit board to the base plate with the plurality of high voltage components received at the corresponding plurality of depressions. A thermally conductive and electrically isolating interface between the base plate and the printed circuit board is made of a gap filler material conforming to the base plate and to the plurality of depressions in the base plate, and conforming to the printed circuit board and to the plurality of high voltage components.

Abstract: A rack-mounted console module includes a lower unit slideably mounted on a rail and an upper unit pivotally coupled to the lower unit. A locking mechanism includes a first part moveably disposed in the lower unit and a second part fixedly disposed on the rail. When the upper unit is closed and the lower unit slides along the rail to a target position, the first part of the locking mechanism changes from a released state to a locked state where it engages the second part of the locking mechanism to lock the lower unit. When the upper unit is opened, the first part changes from the locked state to a ready-to-released state. When the upper unit is subsequently closed, the first part changes from the ready-to-released state to a released state where it disengages from the second part, and the console module can be slid back into the rack.

Abstract: A mounting apparatus for bezel includes a first mounting structure secured, and a chassis. A plurality of first hooks is defined in the bezel. The chassis includes a first sidewall. The first sidewall defines an installation groove. The first mounting structure includes an installation member, and a locking member slidably installed in the installation member. The installation member is engaged with the plurality of first hooks. The locking member is slidably installed on the installation member. The installation member defines a through hole, and a latching portion is located on the locking member. The latching portion extends through the through hole to be engaged in the installation groove and the latching portion can be disengaged from the installation groove when the locking member slides.

Abstract: A securing structure used to mount a server including a housing to a server cabinet includes a sliding member and a fixing member. The sliding member includes a sliding portion, a receiving portion, and a fixing portion configured between the sliding portion and the receiving portion. The sliding portion extends into the housing and is slidably connected to a sidewall of the housing. The receiving portion is used to receive at least one cable connected to the server. The fixing member is securely connected between the fixing portion and the server cabinet.

Abstract: A latching apparatus for a memory card includes a socket and a pair of latching members assembled on opposite ends of the socket. A cutout is defined in each end of the memory card. Each latching member includes a main body, two pivoting portions extending from opposite ends of the main body for pivotably attaching the latch member to one end of the socket, and a C-shaped locking portion extending down from a middle portion of the main body. The insertion of the memory card in the socket causes the bottom edge of the memory card to engage with distal ends of the locking portions and so rotate the latch member, until the main bodies of the latching members engage in the cutouts of the memory card.

Abstract: The present disclosure relates to the field of fabricating microelectronic packages and the fabrication thereof, wherein a microelectronic device may be formed within a bumpless build-up layer coreless (BBUL-C) microelectronic package and wherein a warpage control structure may be disposed on a back surface of the microelectronic device. The warpage control structure may be a layered structure comprising at least one layer of high coefficient of thermal expansion material, including but not limited to a filled epoxy material, and at least one high elastic modulus material layer, such as a metal layer.

Abstract: A power semiconductor module includes an electrically conductive connecting element, an accommodating region, and a clamping element which can be brought from a first position into a second position. If the clamping element is situated in the first position, a connecting region of a module-external connecting conductor can be inserted into the accommodating region and be clamped to the power semiconductor module with the formation of an electrically conductive connection between the connection region and the connecting element. For this purpose, the clamping element is brought from the first position into the second position.

Abstract: The instant disclosure relates to a data access module, which includes a plurality of data access devices, a circuit board defining a plurality of holes, a base frame, a plurality of partition panels, a cover frame, and a plurality of locking pieces. The base frame includes a bottom plate and a pair of sidewalls. A plurality of fixing pieces and ridges are formed on the bottom plate. The partition panels are directed along the retrieving direction of the data access devices and fixed on the bottom plate. Each partition panel has a hooking portion for engaging the corresponding hole of the circuit board. The cover frame includes a top plate and a pair of side plates. The locking pieces are rotatably disposed on the cover frame. Each locking piece has a pressing portion selectively pressing against the circuit board. A chassis is also discussed.

Abstract: A system for mounting a flash blade in a storage system includes a motherboard with a series of card guide cutouts for aligning flash blades. A flash blade can be aligned perpendicular to the motherboard and aligned parallel to adjacent flash blades by inserting the flash blade into one of the card guide cutouts and connecting the flash blade to a connector at one end of the cutout. This beneficially aligns the flash blade while making efficient use of the available vertical space within a chassis. The flash blade can also extend through the cutout to the other side of the motherboard. The efficient use of vertical space enables an increase in the number of solid state memory can be added to the flash blade relative to conventional designs, thereby improving capacity.

Abstract: A power transducer is downsized by reducing the size of a power source board and highly reliable. The power source board is provided in the power transducer and for a large-current circuit. The power transducer includes a power semiconductor module having lead terminals. Of the lead terminals provided for the power semiconductor module and connected with the main circuit board, predetermined one or ones of the lead terminals is or are connected with the main circuit board in the vicinity of a main circuit terminal stage and at a position or positions lower than the main circuit terminal stage. Alternatively, predetermined one or ones of the lead terminals is or are connected with the main circuit board at a position or positions lower than a position at which the main circuit terminal stage is provided.

Abstract: The present disclosure relates to reducing unwanted RF noise in a printed circuit board (PCB) containing an RF device. An isolation filter is embedded in a PCB containing an RDF device. By placing the isolation filter as close as possible to the RF device in order to dramatically reduce unwanted RF noise due to unavoidable coupling between Vias and planes in the PCB structure.

Abstract: In order to keep impedance characteristics to desired values across the entire operating frequency band, an electronic circuit of the present invention includes an integrated circuit, a decoupling capacitor, and a multilayer circuit board on which the integrated circuit and the decoupling capacitor are mounted. In the electronic circuit, a planar land is formed on one or both of a power layer and a ground layer of the multilayer circuit board, the land having densely disposed therein a plurality of via holes that connect a terminal of the integrated circuit and a corresponding terminal of the decoupling capacitor, and the land formed on the power layer or the ground layer is discontinuously disposed at a predetermined interval with a gap having a predetermined width provided therebetween.

Abstract: The present invention provides a shield case having electrical conductivity and being mountable on a circuit board. The shield case includes a first surface adapted to be placed on the circuit board and a second surface provided continuously with the first surface and extending at an angle or at a right angle with respect to the first surface. A first recess of generally U-shape is provided in a boundary area of the first surface with the second surface and including first and second end portions. A pair of second recesses is provided in a boundary area of the second surface with the first surface and communicating with the first and second end portions of the first recess. The shield case also includes a pad, being defined by the first and second recesses and connectable by soldering to an electrode of the circuit board.

Abstract: An electrical device includes a first substrate and a second substrate which are disposed in an opposing manner so as to interpose a functional element, a first electrode (rear surface electrode) which is provided more to the first substrate side than the functional element, a second electrode which is provided on the second substrate and is electrically connected to the first electrode, and a functional element and an electronic component which drives the functional element in a region which is a region where the first substrate and the second substrate overlap and which is interposed between the first electrode and the second electrode.

Abstract: An electronic device provided with a plurality of circuit boards uses a support member for supporting the circuit boards as the transmission path of a wireless signal. For example, the electronic device is provided with a first printed circuit board for processing a millimeter-wave signal, a second printed circuit board which is signal-coupled to the printed circuit board and receives the millimeter-wave signal to subject the received signal to signal processing, and a waveguide which is disposed with a predetermined dielectric constant between the printed circuit boards, wherein the waveguide constitutes the dielectric transmission path, and the waveguide supports the printed circuit boards. This configuration makes it possible to receive the electromagnetic wave based on a millimeter-wave signal radiated from one end of the waveguide constituting the dielectric transmission path, at the other end thereof.

Abstract: A multi-chip module includes a chip stack package including at least one pair of stacked dies, the dies having overlapping opposing faces, and at least one capacitive proximity communication (CPC) interconnect between the pair of stacked dies. The CPC interconnect includes a first capacitor plate at a first one of the overlapping opposing faces and a second capacitor plate at a second one of the overlapping opposing faces spaced from and aligned with the first capacitor plate. The CPC interconnect further includes an inductive element connected in series with the first capacitor plate and second capacitor plate, wherein the capacitor plates form part of a capacitor and the capacitor cooperates with the inductor element to form a LC circuit having a resonant frequency.

Abstract: A component is configured for connection with a microelectronic assembly having terminals and a microelectronic element connected with the terminals. The component includes a support structure bearing conductors configured to carry command and address information, and a plurality of contacts coupled to the conductors and configured for connection with the terminals. The contacts have address and command information assignments arranged in a first predetermined arrangement for connection with a first type of microelectronic assembly in which the microelectronic element is configured to sample command and address information coupled thereto through the contacts at a first sampling rate, and in a second predetermined arrangement for connection with a second type of microelectronic assembly in which the microelectronic element is configured to sample the command and address information coupled thereto through a subset of the contacts at a second sampling rate greater than the first sampling rate.

Abstract: A module is configured for connection with a microelectronic assembly having terminals and a microelectronic element. The module includes a circuit panel bearing conductors configured to carry command and address information, co-support contacts coupled to the conductors, and module contacts coupled to the conductors. The co-support contacts include first contacts having address and command information assignments arranged in a first predetermined arrangement for connection with a first type of microelectronic assembly in which the microelectronic element is configured to sample command and address information coupled thereto through the first contacts at a first sampling rate, and in a second predetermined arrangement for connection with a second type of the microelectronic assembly in which the microelectronic element is configured to sample the command and address information coupled thereto through a subset of the first contacts at a second sampling rate greater than the first sampling rate.

Abstract: An electronic apparatus includes a housing, an electronic device and an electronic device fixing module. The electronic device includes at least one protrusion. The electronic device fixing module includes at least one fixing structure and at least one positioning element. The fixing structure is integrally connected with the housing. The positioning element is fixed to the fixing structure and contacts the electronic device to prevent movement of the electronic device relative to the housing along a first axis. The positioning element includes a concave portion in which the protrusion is positioned to prevent movements of the electronic device relative to the housing along a second axis and a third axis. The second axis is perpendicular to the first axis. The third axis is perpendicular to the first axis and the second axis. The material of the positioning element is a resilient material. The positioning element is an integrally formed structure.

Abstract: A radio frequency (RF) circuit is configured for impedance matching, such as for mitigating noise. In connection with an example embodiment, an RF circuit includes a transceiver in a substrate, and a conductive ring-type of material in the substrate and around at least a portion of the transceiver circuit. An upper conductive ring material is over the substrate and separated from the conductive ring-type material by an insulating layer. The upper conductive ring material is configured to generate an inductance that matches input impedance characteristics of the transceiver circuit. In some implementations, the upper conductive ring material connects a gate input pin of the circuit with the gate of an input transistor of an amplifier in the transceiver, and exhibits an impedance that matches the impedance of the input transistor.

Abstract: An electronic device includes a printed circuit board (PCB), at least one socket mounted to the PCB, at least one connector inserted into the at least one socket, a first member mounted to the PCB, a second member mounted to the PCB, and a first cover. The first cover covers and presses against the at least one connector, the first cover includes a first end for being fixed to the first member and a second end opposite to the first end for being fixed to the second member. At least one of the first member and the second member is soldered to the PCB, and a soldered area of the at least one of the first member and the second member is larger than a predetermined value.

Abstract: An electronic device includes a metal shield, a housing, a circuit board, an engaging element, and a fixing element. The circuit board is located between the metal shield and the housing. The engaging element is disposed on the circuit board. The circuit board is fixed on the housing and connected to the metal shield via the engaging element.

Abstract: A magnetic integration double-ended converter with an integrated function of a transformer and an inductor includes an integrated magnetic member having a magnetic core with three magnetic columns having at least three windings (NP, NS1, NS2) and at least one energy storage air gap, where a primary winding (NP) and a first secondary winding (NS1) are both wound around a first magnetic column or are both wound around a second magnetic column and a third magnetic column, and a second secondary winding (NS2) is wound around the second magnetic column; an inverter circuit with double ends symmetrically working, acting on the primary winding (NP); and a group of synchronous rectifiers (SR1, SR2), gate electrode driving signals of which and gate electrode driving signals of a group of power switch diodes (S1, S2) of the inverter circuit with the double ends symmetrically working complement each other.

Abstract: In a direct-current power supply device that includes a smoothing capacitor C1, which performs a DC/DC converter operation, a transformer T1, a switching element Q1, a diode D2, a smoothing capacitor C2, a reactor L1, which performs a PFC operation, a fast recovery diode D1 and a switching element Q1, when compared with the case of a rated load, the voltage of the smoothing capacitor C1 of a PFC circuit rises at a time when a load is light. Therefore, the following has been required: a capacitor having a sufficient withstanding voltage rating, or an operation of connecting a plurality of capacitors in series or any other operation to secure a voltage-withstanding capability.

Abstract: A VHF switching power converter comprising one or more VHF switching frequency resonant synchronous rectifiers receives an output from an inverter and delivers a DC output to a load. The power converter includes a controller for controlling at least one of the one or more VHF switching frequency resonant synchronous rectifiers based on feedback derived from a waveform of at least one of the rectifiers. The controller controls a phase angle of at least one of the rectifiers with a delay locked loop. The power converter delivers a regulated DC output via adjustment of a phase shift between at least one of the one or more rectifiers and the inverter.

Abstract: A system and method are provided for performing reactive power control. The system includes a power converter and a controller coupled to the power converter. The power converter is configured to convert a first form of electric power generated from the power source to a second form of electric power suitable to be distributed by the electrical grid. The controller is configured to monitor the electric power transmitted between the power converter and the electrical grid. The controller is further configured to decouple a positive sequence component and a negative sequence component from the monitored electric power. The controller is further configured to perform a positive reactive power control and a negative reactive power control with respect to the decoupled positive and negative sequence components. The controller is further configured to transmit a control signal to the power converter based on the positive and negative reactive power control.

Abstract: A power electronic converter for use in high voltage direct current power transmission and reactive power compensation includes at least one converter limb, which includes first and second DC terminals and an AC terminal. Each converter limb defines first and second limb portions connected in series between the AC terminal and a respective one of the first and second DC terminals. Each limb portion includes a chain-link converter connected in series with at least one primary switching element. Each chain-link converter includes a plurality of modules connected in series, and each module includes at least one secondary switching element connected to at least one energy storage device. Each primary switching element in each limb portion of a respective converter limb selectively defines a circulation path which carries a DC circulation current to regulate the energy level of at least one energy storage device in a respective chain-link converter.

Abstract: A power factor correction apparatus is applied to an alternating-current voltage apparatus and a rear end circuit. The power factor correction apparatus includes a power factor correction unit, a control unit, and a ripple detecting unit. The power factor correction unit is electrically connected to the rear end circuit and the alternating-current voltage apparatus. The control unit is electrically connected to the power factor correction unit. The ripple detecting unit is electrically connected to the rear end circuit, the power factor correction unit, and the control unit. The control unit is informed by the ripple detecting unit to control the power factor correction unit to adjust the power factor after the ripple of the signal outputted from the power factor correction unit is detected by the ripple detecting unit.

Abstract: A compensating system for a power system includes a compensator including semiconductor switch means, which compensator has phase legs which on a first side of the compensator defines AC inputs for connection to a respective phase of the power system. The phase legs are connected in wye connection at a second side of the compensator, which wye connection has a neutral point. A filter arrangement at a first side thereof is connected to the neutral point of the wye connection and at a second side is connected to the AC inputs to thereby form a circuit with the compensator. The filter arrangement is arranged such that the circuit acts essentially as an open circuit for positive sequence currents or voltages and negative sequence currents or voltages, and as a closed circuit for zero-sequence currents.

Abstract: An exemplary power conversion system is disclosed including a DC bus for receiving DC power; a line side converter electrically coupled to the DC bus for converting the DC power to AC power; and a voltage source controller to provide control signals to enable the line side converter to regulate the AC power. The voltage source controller comprises a signal generator to generate the control signals based at least in part on a power command signal and a power feedback signal. The voltage source controller further comprises a current limiter to, during a transient event, limit the control signals based at least in part on an electrical current threshold. The voltage source controller further comprises a voltage limiter to, during the transient event, limit the control signals based at least in part on a DC bus voltage feedback signal and a DC boundary voltage threshold.

Abstract: The invention relates to a DC to AC converter circuit. In particular, the invention relates to a half-bridge inverter for converting a DC to an AC voltage. The half-bridge inverter for converting a DC input voltage to provide an AC output voltage at an output terminal, comprising a first switching circuit connected to at least one input terminal and to the output terminal and configured to provide a high or a low voltage level at the output terminal; a second switching circuit connected to the output terminal and configured to provide a connection to an intermediate voltage level, the intermediate voltage level being between the high and the low voltage level; and wherein the second switching circuit is further connected to the at least one input terminal allowing the second switching circuit to provide the high or the low voltage level at the output terminal.

Abstract: A method and a single-phase voltage type AC/DC converting device and a three-phase voltage type AC/DC converting device arranged between a load and a distribution network. The converting devices are capable of contributing to stabilize a system frequency and a system voltage. By applying an autonomous parallel operation control technique of an AC/DC converter to a load, which receives power from a distribution network, drooping characteristics (governor-free characteristics) for a frequency of active power and voltage-maintaining characteristics (V-Q characteristics) may be obtained. The governor-free characteristics automatically decrease and increase received power when the system frequency decreases and increases, so that even the load may contribute to stabilize the system frequency. The V-Q characteristics generates/absorbs reactive power so as to maintain a voltage at a receiving end constant regardless of load power to further stabilize the system voltage.

Abstract: A method in a voltage source chain-link converter. The method includes: detecting a failure of a device of one converter cell module; blocking a phase-leg including the failed position; discharging to zero a capacitor unit of the converter cell module including the failed position; and providing a current path for the phase current through the converter cell module with the failed position, the current path including a first branch, in turn including corresponding positions of the first phase-leg and the second phase-leg in the full H-bridge arrangement, the first branch being connected in parallel to a second branch including the failed position, the second branch including the remaining two positions of the full H-bridge arrangement. The invention also encompasses corresponding computer program and computer program products.

Abstract: In an electric power conversion system having a discharge control device capable of discharging a voltage charged in a capacitor to a voltage of not more than a predetermined voltage, a linear regulator decreases a voltage of the capacitor and outputs the decreased voltage to a drive unit at a bottom arm in a U phase. A flyback converter for discharging use inputs an output of the linear regulator, and outputs electric power to a drive unit at an upper arm in the U phase. When detecting that own vehicle collides with an obstacle, the discharge control device starts to execute discharge control of the capacitor by turning off a photo coupler and turning on the linear regulator.