Abstract: A disk clamp for clamping a plurality of disks within a disk drive has a single fastening hole located at its symmetrical center sized to pass the shaft of a screw having a head diameter larger than the fastening hole. The screw fastens the disk clamp to a motor hub supporting the plurality of disks. The disk clamp has a moat around the fastening hole, at a maximum diameter that is smaller than the head diameter of the head on the fastening screw. The moat may be circular, have spike trenches angled toward the fastening hole, or be spiral. The diameter of the spiral moat decreases in a clockwise or counterclockwise direction toward the fastening hole. The midsection of the disk which the screw head covers is biased at a negative angle toward the fastening hole forcing particles generated during assembly toward the fastening hole of the disk clamp.

Abstract: Certain exemplary aspects of the present disclosure are directed towards an apparatus in which a base deck and a forged base deck cover are coupled to one another, via a weld joint, to provide a hermetically sealed cavity within. The base deck includes an outer region, and the base deck cover includes a lip that interfaces with the outer region of the base deck to provide the weld joint. Similarly, the base deck is formed by an outer region of a base deck bottom portion interfacing with a lip of the shroud to form, via welding, the base deck.

Abstract: A 3D memory structure and a method for manufactured the same are provided. The 3D memory structure comprises a plurality of strings, a plurality of first conductive lines, a plurality of second conductive lines and a plurality of third conductive lines. The strings are disposed in parallel. The first conductive lines are disposed over the strings. Center regions of the first conductive lines are disposed perpendicular to the strings. The second conductive lines are disposed over the first conductive lines. The second conductive lines connect end regions of half of the first conductive lines. The third conductive lines are disposed over the second conductive lines. The third conductive lines connect end regions of the other half of the first conductive lines.

Abstract: A memory device which can keep a stored logic state even when the power is off is provided. A signal processing circuit including the memory device, which achieves low power consumption by stopping supply of power, is provided. The memory device includes a logic circuit including a first node, a second node, a third node, and a fourth node; a first control circuit connected to the first node, the second node, and the third node; a second control circuit connected to the first node, the second node, and the fourth node; a first memory circuit connected to the first node, the first control circuit, and the second control circuit; and a second memory circuit connected to the second node, the first control circuit, and the second control circuit.

Abstract: An integrated circuit comprises a power supply input pin for receiving an off-chip supply voltage which can have a variable current, an on-chip power source to be powered by the off-chip supply voltage and which can provide a regulated current, a set of one or more circuits to be powered by at least one of the off-chip supply voltage and the on-chip power source, a configuration memory storing a set of one or more memory settings that indicate whether a circuit of said set of one or more circuits is powered by the on-chip power source, and control circuitry responsive to the at least one memory setting to control whether said circuit of said set of one or more circuits is powered by the on-chip power source.

Abstract: A sense amplifier circuit includes an enable signal generation unit configured to generate an enable signal when a change in a voltage level of input signals is sensed; a sink unit configured to provide a sense voltage in response to the enable signal; and a sense unit configured to generate an output signal in response to the sense voltage and the input signals.

Abstract: Apparatus, systems, and methods for data movement in a memory device are described. In one embodiment, a memory controller comprises logic to move a row of data from a first row of a memory in a first section of a memory device to a second row of memory in a second section of the memory device without passing the data through a communication interface. Other embodiments are also disclosed and claimed.

Abstract: A write driver for a memory circuit includes a control circuit configured to: operate a first push-pull driver to generate a first drive signal in a first voltage domain at a first node based on an input signal in a second domain and in response to a mode select signal being in a first mode, wherein the first drive signal is at a same logic level as the input signal; operate a second push-pull driver to generate a second drive signal in the first voltage domain at a second node based on the input signal and in response to the mode select signal being in the first mode, wherein the second drive signal is at a complement logic level with respect to the input signal; and operate the first and second push-pull drivers to float the first and second nodes in response to the mode select signal being in a second mode.

Abstract: An interface circuit provided in a semiconductor device supplies an operation clock to an external memory device based on a clock signal and receives a data signal and a strobe signal from the external memory device. The interface circuit includes a delay circuit delaying the received strobe signal. The delay circuit includes a first adjustment circuit and a second adjustment circuit connected in series with the first adjustment circuit. The first adjustment circuit is capable of adjusting a delay amount of the strobe signal in a plurality of steps in accordance with the set frequency of the clock signal. The second adjustment circuit is capable of adjusting the delay amount of the strobe signal with a higher precision than the first adjustment circuit.

Abstract: A clock signal processor includes a duty cycle corrector, a switch point calculator, and a multiplexer. The duty cycle corrector generates a second clock signal by modifying a duty cycle of a first clock signal. The switch point calculator activates a switch signal at an end of a latency period in which a read command is provided to a non-volatile memory device and an invalid data is read from the non-volatile memory device. The multiplexer outputs one of the first and second clock signals as a third clock signal based on the switch signal.

Abstract: A non-volatile memory device includes a memory cell array including memory cells, each having a resistance value reversibly transitioning among resistance value ranges in a variable state in accordance with application of different electrical signals, a control circuit that, in operation, receives a control signal, a read circuit that, in operation, obtains pieces of resistance value information each relating to the resistance value of one of the memory cells in accordance with the control signal, and an arithmetic circuit that, in operation, calculates a binary reference value based on at least a part of the pieces of resistance value information. In operation, the read circuit selectively assigns, based on the binary reference value, one of two values to each of the pieces of resistance value information.

Abstract: Apparatuses and methods involving accessing memory cells are described. In one such method, chunks of memory cells in a memory array are enabled to be accessed and then one or more of the chunks are disabled from being accessed. In one such apparatus, an array includes chunks of memory cells and a chunk selector circuit coupled to each chunk to enable the memory cells in the respective chunk to be accessed. Additional embodiments are described.

Abstract: A magnetic memory according to an embodiment includes: a multilayer structure including a semiconductor layer and a first ferromagnetic layer; a first wiring line electrically connected to the semiconductor layer; a second wiring line electrically connected to the first ferromagnetic layer; and a voltage applying unit electrically connected between the first wiring line and the second wiring line to apply a first voltage between the semiconductor layer and the first ferromagnetic layer during a write operation, a magnetization direction of the first ferromagnetic layer being switchable by applying the first voltage.

Abstract: A nonvolatile logic gate device is configured to include a resistive network of a memory structure in which at least three nonvolatile resistive elements are connected, a reference resistive network as a reference resistance providing a tolerance of the memory structure to a resistance value of the resistive network of the memory structure, a writing part operable to selectively write or rewrite a value of each of the nonvolatile resistive elements in the resistive network into a maximum or a minimum corresponding to a logical value to be read when data are stored into the resistive network, and a logic circuit structure operable to use, as a logical value of the memory structure, a value obtained by comparison between the resistance value of the resistive network and the resistance value of the reference resistive network.

Abstract: The present invention provides an improved SRAM memory cell based on a DICE structure, which comprises following structures: four inverter structures formed through arranging PMOS transistors and NMOS transistors in series, wherein the part between the drains of a PMOS transistor and an NMOS transistor serves as a storage node; each storage node controls the gate voltage of an NMOS transistor of the other inverter structure and of a PMOS transistor of another inverter structure; a transmission structure consisting of four NMOS transistors, whose source, gate and drain are respectively connected with a bit line/bit bar line, a word line and a storage node.

Abstract: A memory device includes a memory cell array, an intensively accessed row detection circuit, and a refresh control circuit. The memory cell array includes a plurality of memory cell rows. The intensively accessed row detection circuit generates an intensively accessed row address indicating an intensively accessed memory cell row among the plurality of memory cell rows based on an accumulated access time for each of the plurality of memory cell rows. The refresh control unit preferentially refreshes neighboring memory cell rows adjacent to the intensively accessed memory cell row indicated by the intensively accessed row address when receiving the intensively accessed row address from the intensively accessed row detection unit. The memory device effectively reduces a rate of data loss.

Abstract: A first semiconductor device equalizes levels of a bit line and a complementary bit line of a high-order bit line pair in a first memory block using a first drive voltage signal whose level is controlled when a power-down mode or a self-refresh mode is activated according to a level combination of high-order command/address signals. A second semiconductor device equalizes levels of a bit line and a complementary bit line of a low-order bit line pair in a second memory block using a second drive voltage signal whose level is controlled when the power-down mode or the self-refresh mode is activated according to a level combination of low-order command/address signals.

Abstract: Devices, systems, and methods include an active mode to accommodate read/write operations of a memory device and a self-refresh mode to accommodate recharging of voltage levels representing stored data when read/write operations are idle. At least one register source provides a first voltage level and a second voltage level that is less than the first voltage level. With such a configuration, during the active mode, the memory device operates at the first voltage level as provided by the at least one register source, and during the self-refresh mode, the memory device operates at the second voltage level as provided by the at least one register source.

Abstract: A method of operating a memory controller is disclosed. The method includes transmitting data signals to a memory device over each one of at least two parallel data links. A timing signal is sent to the memory device on a first dedicated link. The timing signal has a fixed phase relationship with the data signals. A data strobe signal is driven to the memory device on a second dedicated link. Phase information is received from the memory device. The phase information being generated internal to the memory device and based on a comparison between the timing signal and a version of the data strobe signal internally distributed within the memory device. A phase of the data strobe signal is adjusted relative to the timing signal based on the received phase information.

Abstract: Aspects of the disclosure provide an integrated circuit (IC) chip having a memory controller. The memory controller includes a memory interface circuit configured to interface the IC chip with a memory chip having a memory array, and a first control circuit. The memory chip has a configuration circuit for adjusting one or more configurations of the memory chip. The first control circuit is configured to control the memory interface circuit and to communicate with the configuration circuit in the memory chip via the memory interface circuit to adjust the one or more configurations of the memory chip.

Abstract: Apparatuses and methods are described for meeting timing and latency requirements using staggered clocking within the command path.

Abstract: A memory device includes a first memory circuit including a silicon transistor, a selection circuit including a silicon transistor, and a second memory circuit including oxide semiconductor transistors and a storage capacitor, in which one terminal of the storage capacitor is connected to a portion where two oxide semiconductor transistors are connected in series, an output of the second memory circuit is connected to a second input terminal of the selection circuit, and an input of the second memory circuit is connected to a first input terminal of the selection circuit or an output terminal of the first memory circuit.

Abstract: An input receiver is provided with a pass transistor that is controlled to pass an input signal to an inverter only while a first binary state for the input signal equals a low voltage. The input receiver also includes a source follower transistor configured to pass a threshold-voltage-reduced version of the input signal while the first binary state of the input signal equals a high voltage greater than the low voltage.

Abstract: A data reception chip coupled to an external memory including a first input-output pin to output first data and including a comparison module, a voltage generation module, a logic unit, a detection module and a switching module is provided. The comparison module is coupled to the first input-output pin to configure to receive the first data. The comparison module compares the first data with a first reference voltage to identify the value of the first data. The voltage generation module is configured to generate the first reference voltage. The logic unit is coupled to the comparison module and the voltage generation module and outputs at least one switching signal. The detection module detects the logic unit to generate at least one detection signal. The switching module transmits the detection signal to a test pin according to the switching signal.

Abstract: Methods, devices, arrays and systems for reducing standby power for a floating body memory array. One method includes counting bits of data before data enters the array, wherein the counting includes counting at least one of: a total number of bits at state 1 and a total number of all bits; a total number of bits at state 0 and the total number of all bits; or the total number of bits at state 1 and the total number of bits at state 0. This method further includes detecting whether the total number of bits at state 1 is greater than the total number of bits at state 0; setting an inversion bit when the total number of bits at state 1 is greater than the total number of bits at state 0; and inverting contents of all the bits of data before writing the bits of data to the memory array when the inversion bit has been set.

Abstract: An apparatus includes a first read port, a second read port, a write port, and at least one storage latch. A width of a bit cell that includes the first read port, the second read port, and the write port is greater than twice a contacted poly pitch (CPP) associated with the bit cell. For example, a bit cell may be a 3-port static random access memory (SRAM) bit cell that is compatible with self-aligned double patterning (SADP) processes and that can be manufactured using semiconductor manufacturing processes of less than 14 nanometers (nm).

Abstract: The present invention provides a memory unit (4) comprising: a storage element (6) comprising a pair of back to back inverters (12a, 12b and 14a, 14b) having respective first and second storage access nodes (24, 26); first and second voltage lines (VSS, VDD 16a, 6b) across which said pair of back to back inverters (12a, 12b and 14a, 14b) are connected; a first access transistor (18a), connected to said first storage node (24); a second access transistor (18b), connected to said second storage node (26); a write word line (22) connected to a gate (18g1) on said first access transistor (18a) and a gate (18g2) on said second access transistor (18b); a first bit line (28) operably connected for controlling 10 said node (24); a second bit line (30) operably connected for controlling said node (26); in which there is provided a data dependent conductive path (46) between the first and second bit lines (28, 30).

Abstract: Among other things, techniques and systems are provided for activating a memory cell of a memory arrangement in preparation for at least one of a read operation or write operation. The memory arrangement comprises a word-line driver comprising at least a first input terminal and a second input terminal. The first input terminal is operably coupled to a first decoder and the second input terminal is operably coupled to a second decoder. When the word-line driver senses a first voltage at the first input terminal and a second voltage at the second input terminal, the word-line driver outputs a gate voltage signal which activates the memory cell.

Abstract: A memory device may include an access transistor, and a memory cell configured to store an item of information. The memory cell may include first and second electrodes configured to have different optoelectronic states corresponding respectively to two values of the item of information, and to switch between the different optoelectronic states based upon a control signal external to the memory cell, the different optoelectronic states being naturally stable in an absence of the control signal. The memory cell may also include a solid electrolyte between the first and second electrodes.

Abstract: Mechanisms are provided, in a non-volatile memory device comprising a non-volatile memory and a memory controller, for controlling an operation of the non-volatile memory device. The non-volatile memory device receives a single combined memory command for accessing the non-volatile memory. The non-volatile memory device decodes the row address and the column address for the word-line to be accessed by the single combined memory command. The non-volatile memory device accesses the word-line such that at least a most significant bit (MSB) page and a least significant bit (LSB) page are accessed simultaneously.

Abstract: A memory cell undergoing programming is determined as belonging to a particular one of a plurality of second threshold voltage ranges that divide a present threshold voltage range of the particular memory cell. Programming pulses are applied to program the particular memory cell to within the target threshold voltage range. At least one of a program voltage and a total duration of the programming pulses applied to the particular memory cell is varied, depending on the particular second threshold voltage range of the memory cell.

Abstract: A method for writing data into a flash memory, wherein the flash memory includes a plurality multi-level cells, and each of the plurality of multi-level cells is capable of storing a plurality of bits. The method includes: storing a first bit into each of the plurality of multi-level cells respectively; determining if each of the plurality of multi-level cells stores the first bit respectively; and when each of the plurality of multi-level cells stores the first bit respectively, storing a second bit into each of the plurality of multi-level cells respectively.

Abstract: Apparatuses and methods for determining threshold voltage shift are described. A number of methods for determining threshold voltage shift in memory cells include determining changes in threshold voltage for memory cells at each data state of a first number of data states by searching threshold voltage data of memory cells programmed to the first number of data states and determining changes in threshold voltage for memory cells at each data state of a second number of data states by searching threshold voltage data of memory cells programmed to the second number of data states within a range of threshold voltages, wherein the range is shifted from a previous range based on the changes in threshold voltage for memory cells programmed to the first number of data states.

Abstract: A memory system is deigned for impedance matching using a network of resistors that are tuned to reduce reflections on a shared bus. Any deviation from the matched state causes a mismatch and results in reflections on the bus. Overall signal reflections are reduced by balancing the back reflections occurring at a connector junction coupled to a pair of resistors and the back reflections occurring at the input of the DIMMs. This balance or tradeoff is achieved by changing the resistance value of the resistor pair to reduce the overall back reflections in the memory system.

Abstract: Provided are a resistive memory device including a plurality of memory cells, and a method of operating the resistive memory device. The resistive memory device includes a sensing circuit connected to a first signal line, to which a memory cell is connected, the sensing circuit sensing data stored in the memory cell based on a first reference current; and a reference time generator for generating a reference time signal that determines a time point when a result of the sensing is to be output, based on the first reference current.

Abstract: A seasoned phase change memory has been subjected to a longer pulse to adjust resistance levels prior to use of the phase change memory.

Abstract: Circuitry and methods for restoring data in memory are disclosed. The memory may include at least one layer of a non-volatile two-terminal cross-point array that includes a plurality of two-terminal memory elements that store data as a plurality of conductivity profiles and retain stored data in the absence of power. Over a period of time, logic values indicative of the stored data may drift such that if the logic values are not restored, the stored data may become corrupted. At least a portion of each memory may have data rewritten or restored by circuitry electrically coupled with the memory. Other circuitry may be used to determine a schedule for performing restore operations to the memory and the restore operations may be triggered by an internal or an external signal or event. The circuitry may be positioned in a logic layer and the memory may be fabricated over the logic layer.

Abstract: Disclosed aspects include a content addressable memory device comprising at least two memory banks connectable to a global search line. Each memory bank comprises at least two content addressable memory cells. Each content addressable memory cell can store one bit. Each content addressable memory cell is coupled to a respective local search line. Aspects include a bank connection circuitry configured for coupling the global search line to the local search lines in dependence of a bank prediction signal line. The bank connection circuitry of the content addressable memory device may comprise bank hold circuitry for storing a search value transmitted by the global search line.

Abstract: A memory module is provided. In one example, the memory module includes a printed circuit board with one or more connectors, and a plurality of multi-chip packaged integrated circuit parts mounted to the printed circuit board. Each of the plurality of multi-chip packaged integrated circuit parts includes an integrated circuit package including a slave memory controller (SMC) die and one or more pairs of (1) a spacer under the slave memory controller die and (2) a flash memory die under the spacer. Each flash memory die is larger than each spacer to provide an opening into a perimeter of the flash memory die to which electrical connections may be made.

Abstract: In a semiconductor integrated circuit, an internal circuit is capable of executing a first operation and a second operation concurrently, and an output circuit outputs to the outside of the semiconductor integrated circuit information indicating whether or not the first operation is being executed and information indicating whether or not the second operation is executable.

Abstract: A semiconductor device includes a plurality of active strips, where active strips in the plurality are coupled together at one end by a pad and terminated at another end by a conductive line. The device includes memory cells at cross-points between the plurality of active strips and a plurality of word lines. The device includes string select structures arranged in an interlaced configuration as side gates for active strips. The device includes control circuitry, configured to turn on a particular active strip by applying a turn-on voltage to two string select structures arranged as side gates for the particular active strip, and to turn off a second particular active strip by applying a turn-off bias to at least one string select structure arranged as a side gate for the second particular active strip. The turn-off bias includes one of a ground voltage, a non-negative voltage, and a floating condition.

Abstract: A method for multilevel programming flash memory cells of a three dimensional array of flash memory cells, the method may include receiving or determining a multiple phase programming scheme that is responsive to coupling between flash memory cells of the three dimensional array; and programming data to multiple flash memory cells of the three dimensional array in response to the multiple phase programming scheme. The multiple phase programming scheme determine a manner in which multiple programming levels are applied. At least two programming levels of the multiple programming levels correspond to bits of different significance.

Abstract: A semiconductor memory device may include a plurality of cell strings. Each of the cell strings may include at least one source selection transistor connected to a common source line, a plurality of memory cells connected to the common source line through the at least one source selection transistor. Each of the cell strings may include at least one source selection line connected to source selection transistors of the plurality of the cell strings. The semiconductor memory device may include peripheral circuit. The peripheral circuit may be configured to control the plurality of the cell strings. The peripheral circuit may be configured to perform a program on the source selection transistors connected to a selected source selection line by applying a program voltage to the selected source selection line among the at least one source selection line, and by applying a reference voltage to the common source line.

Abstract: A memory system has an array of split gate non-volatile NVM cells that are in program sectors and the program sectors make up one or more erase sectors. The control gate of cells in a program sector are physically connected. A program/erase circuit programs a selected program sector by applying a programming signal to the control gates of the split gate memory cells of the selected program sector while applying a non-programming signal to the control gates of program sectors not selected for programming, that erases an erase sector comprising a plurality of the program sectors by contemporaneously applying an erase voltage to the control gates of the split gate NVM cells of the erase sector, wherein during the applying the programming signal, the program/erase circuit applies a source voltage to the sources of each of the split gate NVM cells of the erase sector.

Abstract: A nonvolatile semiconductor memory device includes a memory cell array having first and second groups of memory strings, each memory string including first and second memory cells connected between select transistors. The nonvolatile semiconductor memory device further includes a first word line connected to the first memory cells of the memory strings, a second word line connected to the second memory cells of the memory strings, and a control unit configured to control application of control voltages to the select transistors and the word lines, such that a select line voltage is applied to the first word line and a non-select line voltage is applied to the second word line and not discharged while select transistors of the first group of memory strings are turned off and select transistors of the second group of memory strings are turned on.

Abstract: A non-volatile memory device includes a first electrode layer, a second electrode layer adjacent to the first electrode layer, a third electrode layer adjacent to the second electrode layer, a fourth electrode layer adjacent to the third electrode layer, and a channel body extending through the first electrode layer, the second electrode layer, the third electrode layer and the fourth electrode layer in a first direction. The device further includes a circuit electrically connected to the first electrode layer, the second electrode layer, the third electrode layer, the fourth electrode layer, and the channel body. The circuit providing the second electrode layer with a first potential, the third electrode layer with a second potential higher than the first potential, the fourth electrode layer with a third potential between the first potential and the second potential and the channel body with a potential rising in the first direction.

Abstract: Systems and methods for reducing peak power supply current in a non-volatile memory system that includes a plurality of memory die are described. In some cases, prior to a first memory die of the plurality of memory die performing a particular memory operation (e.g., a programming operation), the first memory die may poll other memory die of the plurality of memory die to determine a total peak power supply current for the plurality of memory die. In response to detecting that the total peak power supply current for the plurality of memory die is at or above a peak current threshold (e.g., more than 200 mA), the first memory die may delay the performance of the particular memory operation or slow down the performance of the particular memory operation.

Abstract: Some embodiments include apparatuses and methods having a memory cell string including memory cells located in different levels of the apparatus and a data line coupled to the memory cell string. The memory cell string includes a pillar body associated with the memory cells. At least one of such apparatus can include a module configured to store information in a memory cell among memory cells and/or to determine a value of information stored in a memory cell among memory cells. The module can also be configured to apply a voltage having a positive value to the data line and/or a source to control a potential of the body. Other embodiments are described.

Abstract: Data are refreshed in a nonvolatile solid-state device to significantly reduce the likelihood of data retention errors. Test data are written in a region of the nonvolatile solid-state device when user data are stored in the nonvolatile solid-state device, and are subsequently read to detect the possibility of data retention errors occurring when the associated user data are read. The test data may be a portion of the user data or a predetermined test pattern. To increase sensitivity to incipient charge leakage that may compromise the user data, the test data may be written using a modified write process and/or read with a modified read operation. The nonvolatile solid-state device may be employed as part of a solid-state drive or as the flash-memory portion of a hybrid hard disk drive.

Abstract: A method of improving radiation tolerance of floating gate memories is provided herein. Floating gate memories can include a floating gate transistor or a block of floating gate transistors. A floating gate transistor can include a semiconductor region, a source region, a drain region, a floating gate region, a tunnel oxide region, an oxide-nitride-oxide region, and a control gate region. A floating gate transistor or block of floating gate transistors can be written to multiple times in order to accumulate charge on one or more floating gate regions in accordance with an embodiment of the invention. When exposed to radiation, a floating gate region can retain its charge above a certain voltage threshold. A block of floating gate transistors can communicate with an external device where the external device can read a state of the block of floating gate transistors in accordance with an embodiment of the invention.