Abstract: This technology provides an electronic device and a method of fabricating the same. An electronic device in accordance with an implementation of this document includes semiconductor memory, and the semiconductor memory includes a contact plug which is disposed over a substrate and extends in a vertical direction; a variable resistance element which is coupled to the contact plug and includes a first magnetic layer having a variable magnetization direction, a second magnetic layer having a pinned magnetization direction, and a tunnel barrier layer interposed between the first magnetic layer and the second magnetic layer; and a third magnetic layer which surrounds a sidewall of the contact plug and has a same magnetization direction as the second magnetic layer.

Abstract: Spin torque transfer magnetic random access memory devices configured to be programmed unidirectionally and methods of programming such devices. The devices include memory cells having two pinned layers and a free layer therebetween. By utilizing two pinned layers, the spin torque effect on the free layer from each of the two pinned layers, respectively, allows the memory cells to be programmed with unidirectional currents.

Abstract: Methods and apparatus relating to spin-orbit-torque magnetoresistive random access memory with voltage-controlled anisotropy are disclosed. In an example, disclosed is a three-terminal magnetic tunnel junction (MTJ) storage element that is programmed via a combination of voltage-controlled magnetic anisotropy (VCMA) and spin-orbit torque (SOT) techniques. Also disclosed is a memory controller configured to program the three-terminal MTJ storage element via VCMA and SOT techniques. The disclosed devices improve efficiency over conventional devices by using less write energy, while having a design that is simpler and more scalable than conventional devices. The disclosed devices also have increased thermal stability without increasing required switching current, as critical switching current between states is essentially the same.

Abstract: Systems, apparatuses and methods may provide for detecting a read-write condition in which a read operation from a location in magnetoresistive memory such as spin transfer torque (STT) memory is to be followed by a write operation to the location. Additionally, a current level associated with the read operation may be increased, wherein the read operation is conducted from the location at the increased current level. In one example, the increased current level causes a reset of all bits in the location.

Abstract: A resistance change memory includes a memory cell array comprising memory cells including magnetic tunnel junction (MTJ) elements; a write and read circuit which performs a write operation and a read operation for the memory cells; a temperature sensor which outputs temperature information corresponding to a temperature of the memory cell array; and a memory controller which controls the write operation and the read operation by the write and read circuit in response to the temperature information, such that a first time period from a write command input to a pre-charge command input is variable according to the temperature information, while a second time period from an active command input to the pre-charge command input is fixed constant regardless of the temperature information.

Abstract: Circuitry and methods provide an increased tunnel barrier endurance (lifetime) previously shortened by dielectric breakdown by providing a charging pulses of opposite polarity in comparison with write pulses. The charging pulse of opposite polarity may comprise equal or different width and amplitude than that of the write pulse, may be applied with each write pulse or a series of write pulses, and may be applied prior to or subsequent to the write pulse. A register is also used to keep track of the read pulse polarity such that read pulses of alternating polarity can be used in reading operations.

Abstract: Word shift static random access memory (WS-SRAM) cell, word shift static random access memory (WS-SRAM) and method using the same employ dynamic storage mode switching to shift data. The WS-SRAM cell includes a static random access memory (SRAM) cell having a pair of cross-coupled elements to store data, a dynamic/static (D/S) mode selector to selectably switch the WS-SRAM cell between the dynamic storage mode and a static storage mode, and a column selector to selectably determine whether or not the WS-SRAM cell accepts shifted data. The WS-SRAM includes a plurality of WS-SRAM cells arranged in an array and a controller to shift data. The method includes switching a storage mode and activating a column selector of, coupling data from an adjacent memory cell to, and storing the coupled data in, a selected WS-SRAM cell.

Abstract: In a semiconductor device in accordance with one embodiment, a memory access control unit counts the number of addresses accessed by burst access to each address included in an address set of an external memory that is going to be accessed. When the number of addresses is larger than a reference value, the memory access control unit performs burst access to the address, and when the number of addresses is smaller than the reference value, the memory access control unit performs random access to the address.

Abstract: A method of operating a memory device may include: providing a first power supply voltage to a sense amplifier during a first time interval, the first time interval being between a first time at which a voltage is provided to a first bit line, and a second time at which a pre-charge command is received; and providing a second power supply voltage to the sense amplifier during a second time interval, during which the word line is enabled after the pre-charge command is received. The second power supply voltage may be greater than the first power supply voltage.

Abstract: An apparatus having a first circuit and a second circuit. The first circuit may be configured to buffer an input signal received as a single-ended signal from a data bus connected between a memory channel and a memory controller. The second circuit may be configured to condition the input signal relative to a reference voltage to generate a differential signal. The reference voltage may be isolated from the second circuit in response to a transition from a power down condition to a power on condition.

Abstract: Embodiments relate to systems, methods and computer readable media to enable design and creation of memory driver circuitry using a voltage translation capacitor. One embodiment is high speed level translation memory driver apparatus comprising a plurality of field effect transistors (FETs), complementary metal oxide semiconductor (CMOS) logic gates to drive the FETs, and a voltage translation capacitor with a first terminal of the voltage translation capacitor connected to an output of a second CMOS logic gate and a second terminal of the voltage translation capacitor connected to a gate terminal of a first P-type FET. Additional embodiments including other circuitry, associated methods, and media comprising instructions associated with generation of circuit design files are also described.

Abstract: A semiconductor device includes a first memory block, a second memory block, a first refresh control block for generating a first block control signal and a second block control signal in response to a refresh pulse signal, a second refresh control block for generating a first refresh control pulse signal and a second refresh control pulse signal corresponding to a first refresh operation section of the first memory block and a second refresh operation section of the second memory block, respectively, in response to the refresh pulse signal and the first and second block control signals, and a third refresh control block for controlling the first and second memory blocks so that a first refresh operation of the first memory block and a second refresh operation of the second memory block are discontinuously performed in response to the first and second refresh control pulse signals.

Abstract: A method of accessing a semiconductor memory includes operations as follows. A first voltage is received at a first data line, and a second voltage is received at a second data line, during a write operation of the semiconductor memory, in which the first voltage is lower than the second voltage, and a first coupling line is capacitively coupled with the first data line to lower the first voltage at the first data line in the write operation of the semiconductor memory.

Abstract: The invention comprises a non-volatile memory device with a sensing amplifier that includes a current mirror comprising a pair of resistors.

Abstract: The invention refers to an ultrafast quench based nonvolatile bistable device which consists of an active material on a passive or active substrate which changes its physical properties, after exposure to a sufficiently temporally short external perturbation causing an ultrafast quench. The perturbation can be from an external ultrashort laser pulse or ultrafast electrical pulse from an electrooptic device or any other generator of ultrashort pulses. This change of the materials properties can be detected as a change of optical properties or electrical resistance. The dielectric properties can be reverted back to their original state by the application of a heat pulse applied by an electrical heater within the device or an external laser.

Abstract: A resistive memory device includes a column decoder having a first switch unit, including at least one pair of switches arranged in correspondence to each of a plurality of signal lines, and a second switch unit including a pair of switches arranged in correspondence to the at least one pair of switches of the first switch unit. A first pair of switches of the first switch unit includes a first switch and a second switch that are of the same type, and a second pair of switches of the second switch unit includes a third switch and a fourth switch that are connected to the first pair of switches. A selection voltage is provided to the first signal line by passing through the first switch, and an inhibit voltage is provided to the first signal line by selectively passing through the first switch or the second switch.

Abstract: A resistive memory device. Implementations may include an array of memory cells including resistive memory elements which are coupled to isolation transistors and which may include a magnetic tunnel junction. A decoder decodes input address information to select a row of the array. A binarizer coupled to the memory array assigns binary weights to outputs of the memory array output through bit lines coupled to the memory cells. A summer sums the binary weighted outputs, and a quantizer generates an output digital code corresponding to data stored in a plurality of memory cells during a prior program cycle. The outputs of the memory array may be currents or voltages. In implementations multiple arrays of memory cells may be utilized and their respective outputs combined to form higher bit outputs, such as eight bit, twelve bit, sixteen bit, and so forth.

Abstract: Examples may include techniques to mitigate bias drift for memory cells of a memory device. A first memory cell coupled with a first word-line and a bit-line is selected for a write operation. A second memory cell coupled with a second word-line and the bit-line is de-selected for the write operation. First and second bias voltages are applied to the first word-line and the bit-line during the write operation to program the first memory cell. A third bias voltage is applied to the second word-line during the write operation to reduce or mitigate voltage bias to the second memory cell due to the second bias voltage applied to the bit-line to program the first memory cell.

Abstract: A device that includes a semiconductor device and a contact electrode with a first side that is opposite a second side. The first side abuts the semiconductor device. The contact electrode has a stoichiometry that varies from the first side to the second side. The stoichiometry of the first side inhibits the diffusion of metal from the semiconductor device into the first contact electrode.

Abstract: Disclosed are methods, systems and devices for operation of dual non-volatile memory devices. In one aspect, a pair of non-volatile memory device coupled in series may be placed in complementary memory states any one of multiple memory states in a write operation by controlling a current and a voltage applied to terminals of the non-volatile memory device.

Abstract: A storage element with monitoring circuit, comprising a previous state information storage element configured to record a previous state of a monitored state information storage element, a state change indication unit having a clock input terminal coupled to the clock signal input interface, a state change indication unit being configured to generate a state change indication signal indicative of whether the monitored state information storage element shall have performed a state change by observing the data at a data input interface and a data output terminal, and a state change confirmation unit configured to generate a storage fault indicator by observing the data output terminal of the monitored state information storage element and the data output of the previous state information storage element and checking whether the result of this observation is in line with the state change indicator.

Abstract: A first potential and a second potential lower than the first potential are applied to a first end of a memory gate electrode part of the nonvolatile memory and to a second end of the memory gate electrode part, respectively, so that a current is caused to flow in a direction in which the memory gate electrode part extends, then, a hole is injected from the memory gate electrode part into a charge accumulating part below it, therefore, an electron accumulated in the charge accumulating part is eliminated. By causing the current to flow through the memory gate electrode part of a memory cell region as described above, Joule heat can be generated to heat the memory cell. Consequently, in the erasing by a FN tunneling method in which the erasing characteristics degrade at a low temperature, the erasing speed can be improved by heating the memory gate electrode part.

Abstract: A memory array has a NVM element with a plurality of FETs. A first set of FETs of the plurality of FETs is coupled to a bitline true of the memory array. The first set of FETs has a first channel width. A second set of FETs of the plurality of FETs is coupled to a bitline complement of the memory array. The second set of FETs has a second channel width. The first channel width is greater than the second channel width. The channel width disparity provides the NVM element of the unprogrammed memory array with a default state.

Abstract: A method of a operating a data storage device including a nonvolatile memory device and a memory controller is provided. The method includes reading a first selection transistors connected to a first selection line from among a plurality of selection lines with a reference voltage, determining whether a first number of selection transistors, from among the first selection transistors, which have a threshold voltage less than the reference voltage is larger than a first reference value, and if the first number is larger than the first reference value, programming the first selection transistors to have threshold voltage larger than or equal to a target voltage.

Abstract: A semiconductor memory device includes a first page buffer block and a second page buffer block corresponding to a first memory bank and a second memory bank, respectively, an input/output control circuit suitable for transferring input data to data lines, a first column decoder and a second column decoder suitable for latching the input data transferred through the data lines to the first page buffer block and the second page buffer block, respectively, based on a column address transferred through address lines that are shared by the first and second column decoders, and a control signal generation circuit suitable for generating a plurality of page buffer selection signals to control the first and second column decoders to selectively perform data latch operations on the first and second page buffer blocks.

Abstract: A level shifter receiving an input with a relatively narrow voltage range and provides an output with a relatively wide voltage range. The level shifter including a transistor with a turn-on voltage. Control circuitry applies a bias to the level shifter such that the transistor does not receive the turn-on voltage.

Abstract: A nonvolatile memory device includes a memory cell array including cell strings stacked in a direction orthogonal to a substrate and including a first substring group and a second substring group dividing the cell strings, and an address decoder connected to memory cells of the cell strings via a plurality of word lines and configured to provide operating voltages to the memory cells, wherein the address decoder is disposed between the first substring group and second substring group.

Abstract: Apparatus and methods are disclosed, such as a method that includes precharging channel material of a string of memory cells in an unselected sub-block of a block of memory cells to a precharge voltage during a first portion of a programming operation. A programming voltage can then be applied to a selected memory cell in a selected sub-block of the block of memory cells during a second portion of the programming operation. The selected memory cell is coupled to a same access line as an unselected memory cell in the unselected sub-block. Additional methods and apparatus are disclosed.

Abstract: Systems, apparatuses, and methods may be provided that adapt to trim set advancement. Trim set advancement may be a change in trim sets over time. A cell of a semiconductor memory may have a first charge level and be programmed with a first trim set. The cell may be reprogrammed by raising the first charge level to a second charge level that corresponds to the cell programmed with a second trim set.

Abstract: A page buffer circuit includes a plurality of page buffers including a first page buffer. The first page buffer is configured to load input data of the first page buffer, and input data of at least one neighboring page buffer. The first page buffer is also configured to apply a bias corresponding to the input data of the first page buffer, and the input data of the at least one neighboring page buffer to a bit line.

Abstract: A semiconductor memory device includes a memory string including a first cells portion and a second cells portion each including a multiple of memory cells, the second cells portion being disposed over the first cells portion, and a control logic configured to control a peripheral circuit such that each of at least two memory cells in a top of the first cells portion and each of at least two memory cells in a bottom of the second cells portion is programmed to have a smaller data bit than remaining memory cells in the first and second cells portions.

Abstract: A semiconductor memory device includes a memory string on a well, the memory string including a memory cell connected in series between first and second select transistors, a bit line and a source line respectively connected to the first and second select transistors, a well line connected to the well, first and second select lines respectively connected to gates of the first and second select transistors, a word line connected to a gate of the memory cell transistor, and a control circuit that performs a write operation on the first select transistor, the write operation including a pre-charge operation of the bit line, in which a first voltage is applied to the word line and the second select line, a second voltage higher than the first voltage to the source line and the well line, and a third voltage higher than the first voltage to the first select line.

Abstract: A circuit for erasing data includes: a high voltage generation unit, adapted for generating an erasing signal; a first control unit, adapted for modifying the erasing signal to a first conduction control signal with a decreased voltage ascending speed; a second control unit, adapted for sending a second conduction control signal based on the first conduction control signal; a lift unit, adapted for lifting an output voltage for erasing data based on the first conduction control signal; a switch unit, adapted for forming an electrical access between the high voltage generation unit and the output end of the circuit for erasing data; and a reference current generation unit, adapted for providing a bias current to the first control unit and the second control unit. Under a circumstance that erasing effect of storage units is improved, area of a chip is relatively reduced by using the circuit for erasing data.

Abstract: A semiconductor memory device according to an embodiment includes: a memory cell array including a plurality of charge accumulation type memory cells; and a control unit that controls the memory cell array. The control unit, when executing an erase operation on the memory cell array, applies an erase voltage to the memory cells. The erase voltage is a voltage in a pulse form. The control unit performs control that, compared to when the erase operation is in a first stage, increases a voltage value and shortens a pulse width of the erase voltage when the erase operation is in a second stage.

Abstract: A method of performing an operation on a non-volatile memory (NVM) cell of a memory device is disclosed. The pass transistor of the NVM cell is an asymmetric transistor including a source with a halo implant. The source of the pass transistor is coupled to a common source line (CSL) that is shared among NVM cells of a sector of NVM cells. The operation may be performed by applying a first signal to a word line (WLS) coupled to a gate of a memory transistor of the NVM cell and applying a second signal to a bit line (BL) coupled to a drain of the memory transistor of the NVM cell.

Abstract: A circuit has a wordline with an NVM element utilizing a first FET coupled to bitline true and a second FET coupled to bitline complement. A NFET coupled to the bitline complement is configured to pull bitline true toward ground in response to bitline complement reaching a first voltage. One or more wordline drivers are coupled to the NVM element such that a first path from a wordline driver is coupled to the first FET while a second path from a wordline driver is coupled to the second FET. The first path is current-limited in comparison to the second path, such that a first slew rate between a wordline driver and the first FET is slower than a second slew rate between a wordline driver and the second FET. The slew rate disparity allows the bitline complement to reach the first voltage.

Abstract: Technologies are generally provided for methods and circuitry to rank a large number of cells in a timeframe of about one sense cycle. In some examples, an architecture may be implemented to rank memory cells such as volatile memories, non-volatile memories, and other types of data storage devices, where there may not be an equivalent to threshold voltage. In other examples, an arbitrary group of circuits, such as in neural networks where there may not be an equivalent control gate to set the timing resolution, may be ranked. Relative sense timing may be used to rank the cells having different current carrying abilities. A ramped gate voltage may be used to control the timing resolution and to reduce contention between close separate cells. Digital logic may be used to latch and/or record the rank information.

Abstract: Systems and methods for low latency acquisition of soft data from a memory cell based on a sensing time and/or a leakage current are described. In one embodiment, the systems and methods may include applying a first read voltage to a word line of a page of memory cells selected by a processor of a flash memory device for a read operation, applying a pass voltage to word lines associated with one or more different pages of memory cells of the memory block, upon applying the first read voltage sensing whether a bit line of a memory cell in the selected page conducts, measuring a side effect associated with sensing whether the bit line of the memory cell in the selected page conducts, and assigning a LLR value to the memory cell as a soft LDPC input based at least in part on the measured side effect.

Abstract: According to one embodiment, a voltage generation circuit includes a first boost circuit, a voltage division circuit, a first detection circuit, a capacitor and a first switch. The first boost circuit outputs a first voltage. The voltage division circuit divides the first voltage. The first detection circuit is configured to detect a first monitor voltage supplied to the first input terminal, based on a reference voltage which is supplied to a second input terminal of the first detection circuit, and to control an operation of the first boost circuit. The capacitor is connected between an output terminal of the first boost circuit and the first input terminal of the first detection circuit. The first switch cuts off a connection between the capacitor and the first detection circuit, based on an output signal of the first detection circuit, until the first voltage is output from the first boost circuit.

Abstract: The disclosure provides an internal power supply voltage auxiliary circuit for an internal power supply voltage generating circuit, wherein the internal power supply voltage generating circuit includes: a differential amplifier, comparing an internal power voltage supplied to a loading circuit with a predetermined reference voltage, and outputting a control voltage from an output terminal; and a driving transistor, driving an external power voltage according to the control voltage. The internal power supply voltage auxiliary circuit includes: a time sequence detecting circuit, detecting a transition of a data signal, generating and outputting a detecting signal; and an internal power voltage auxiliary supplying circuit, auxiliary supplying a current for the loading circuit based on the detecting signal. Therefore, it is possible to output an internal power voltage stably, while power consumption would not increase greatly, even when being used in the semiconductor memory device with the DDR.

Abstract: Approaches for a memory including a cell array are provided. The memory includes a first device of the cell array which is connected to a bitline and a node and controlled by a word line, and a second device of the cell array which comprises a third device which is connected to a source line and the node and controlled by the word line and a fourth device which is connected between the word line and the node. In the memory, in response to another word line in the cell array being activated and the word line not being activated to keep the first device in an unprogrammed state, the third device isolates and floats the node such that a voltage level of a gate to source of the first device is clamped down by the fourth device to a voltage level around zero volts.

Abstract: Methods of operating a memory include storing a first target data state of multiple possible data states of a first memory cell to be programmed in a target data latch coupled to a data node, storing at least one bit of a second target data state of the multiple possible data states of a second memory cell to be programmed in an aggressor data latch coupled to the data node, and programming the first memory cell and performing a program verify operation for the first target data state to determine if the first memory cell is verified for the first target data state.

Abstract: A memory device includes a word line above a semiconductor substrate, a semiconductor pillar extending through the word line in a direction crossing a surface of the semiconductor substrate, a memory cell at an intersection of the word line and the semiconductor pillar and having a gate electrically connected to the word line, a bit line electrically connected to a first end of the memory cell, a source line electrically connected to a second end of the memory cell, and a controller that controls a write operation on the memory cell, the write operation including a program operation followed by a verify operation. During the verify operation on the memory cell, the semiconductor pillar is charged after performing a read operation on the memory cell.

Abstract: A method of programming target memory cells of a nonvolatile memory device includes; programming the target memory cells using an incrementally adjusted program time, reading a code word stored by the target memory cells and determining a bit error rate (BER) associated with the target memory cells in view of the read code word, and if the BER exceeds an upper BER limit, increasing the program time by a unit time.

Abstract: A resistive memory device includes a resistive memory cell whose resistance value varies based on a logic value of data stored therein, a current amplification block suitable for amplifying a current flowing through the resistive memory cell by N times, where N is a natural number greater than 1, and a sensing block suitable for sensing the data based on the amplified current.

Abstract: A one-time programmable (OTP) memory capable of performing a multi-programming and a semiconductor memory device including the OTP memory are disclosed. The OTP memory includes a plurality of fuse cells in which two or more fuse cells are programmed at a time. In a program mode, in response to determining that a current flowing through each of the fuse cells increases to a predetermined value, the OTP memory blocks the current flowing through each of the fuse cells.

Abstract: The present disclosure discloses a gate driver, an array substrate, a display panel and a display device so as to address problems in the gate driver that some shift register units become abnormal so that a succeeding shift register unit depending upon the shift register unit may not be triggered and consequently the entire GOA circuit may operate improperly and even become inoperative. The gate driver includes N shift register units, each of which is connected with respective one of N gate lines of a display panel, and a plurality of gate units. While a gate unit is enabled, the gate unit is configured to provide a current gate line with an output signal of a corresponding shift register unit connected to a preceding gate line and/or a corresponding shift register unit connected to a succeeding gate line.

Abstract: An amorphous silicon gate driving circuit includes multiple cascaded shift registers. Each of the shift registers includes a shift register unit, which contains multiple TFTs and multiple capacitors, an N-th output terminal GN, an (N+1)-th output terminal GN+1, a high voltage signal terminal Vgh and a low voltage signal terminal Vgl; and an output control unit having an N-th additional output terminal. The output control unit is configured to control a time period during which the N-th additional output terminal outputs a high voltage level to be within a time period during which the N-th output terminal outputs the high voltage level, where a signal falling edge for turning off TFTs at a former one of two adjacent rows of pixel units is completely separated from a signal rising edge for turning on TFTs at a latter one.

Abstract: A gate drive circuit is disclosed. The drive circuit includes M cascaded shift registers, where M is a natural number, and a clock controller configured to generate two reverse-phase clock signals. The drive circuit also includes a high level controller configured to generate a high level signal, and a low level controller configured to generate a low level signal, where one of the high level controller and the low level controller is configured to generate an initial pulse signal during an initial stage. The drive circuit also includes a start unit cascaded with the M shift registers, where the start unit is configured to provide a start signal to the shift registers.

Abstract: A semiconductor memory device includes a memory cell array including a plurality of word lines; a repair fuse section programmed with one or more repair-target addresses and fuse enable information; an address generation section suitable for generating test addresses during a test operation, corresponding to the word lines based on the repair-target addresses and the fuse enable information; and a word line control section suitable for selectively activating the word lines based on the test addresses.