Abstract: Devices, systems, and methods include controls for on-die termination (ODT) and data strobe signals. For example, a command to de-assert ODT for a data pin (DQ) during the read operation. An input, such as a mode register, receives an indication of a shift mode register value that corresponds to a number of shifts of a rising edge of the command in a backward or a falling edge in a forward direction. A delay chain delays the appropriate edge of received command the number of shifts in the corresponding direction to generate a shifted edge command signal. Combination circuitry then combines a falling edge command signal with a shifted rising edge command signal to form a transformed command.

Abstract: In an embodiment, a memory controller may determine that one or more neighboring memory cells associated with a target memory cell in a memory device are to be refreshed. The controller may generate a command associated with refreshing the one or more neighboring memory cells. The controller may transfer the command from the memory controller to the memory device containing the target memory cell. The command may direct the memory device to refresh the neighboring memory cells and/or return one or more addresses associated with the neighboring memory cells.

Abstract: Apparatuses for providing external terminals of a semiconductor device are described. An example apparatus includes an input pad, an input buffer including a first input node and a second input node, a switch that couples the first input node and the second input node in an active state and further decouples the first input node and the second input node in an inactive state, a control circuit that provides a signal causing the switch to be in the active state or an inactive state. The first input node of the input buffer is coupled to the input pad by a conductive wiring.

Abstract: The present invention is directed to a method for sensing the resistance state of a memory cell that includes an MTJ memory element coupled to a two-terminal selector element in series. The method includes the steps of raising a cell voltage across the memory cell above a threshold voltage for the selector element to become conductive; decreasing the cell voltage to a first sensing voltage and measuring a first sensing current passing through the memory cell, the selector element being nominally conductive irrespective of the resistance state of the MTJ memory element at the first sensing voltage; and further decreasing the cell voltage to a second sensing voltage and measuring a second sensing current, the selector element being nominally conductive if the MTJ memory element is in the low resistance state or nominally insulative if the MTJ memory element is in the high resistance state at the second sensing voltage.

Abstract: Apparatuses and methods are disclosed that include ferroelectric memory cells. An example ferroelectric memory cell includes two transistors and two capacitors. Another example ferroelectric memory cell includes three transistors and two capacitors. Another example ferroelectric memory cell includes four transistors and two capacitors.

Abstract: Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. Before reading a memory cell, the voltage on an access line of the memory cell may be initialized to a value associated with the threshold voltage of a switching component in electronic communication with the memory cell. The voltage may be initialized by reducing the existing voltage on the access line to the value. The switching component or an additional pull down device, or both, may be used to reduce the voltage of the access line. After the access line has been initialized to the value, the read operation may be triggered.

Abstract: Methods, systems, and devices for dual mode ferroelectric memory cell operation are described. A memory array or portions of the array may be variously operated in volatile and non-volatile modes. For example, a memory cell may operate in a non-volatile mode and then operate in a volatile mode following a command initiated by a controller while the cell is operating in the non-volatile mode. The memory cell may operate in the volatile mode and then operate in the non-volatile mode following a subsequent command. In some examples, one memory cell of the memory array may operate in the non-volatile mode while another memory cell of the memory array operates in the volatile mode.

Abstract: Methods, systems, and devices for time-based access of memory cells in a memory array are described herein. During a sense portion of a read operation, a selected memory cell may be charged to a predetermined voltage level. A logic state stored on the selected memory cell may be identified based on a duration between the beginning of the charging and when selected memory cell reaches the predetermined voltage level. In some examples, time-varying signals may be used to indicate the logic state based on the duration of the charging. The duration of the charging may be based on a polarization state of the selected memory cell, a dielectric charge state of the selected state, or both a polarization state and a dielectric charge state of the selected memory cell.

Abstract: Techniques, systems, and devices for time-resolved access of memory cells in a memory array are described herein. During a sense portion of a read operation, a selected memory cell may be charged to a predetermined voltage level. A logic state stored on the selected memory cell may be identified based on a duration between the beginning of the charging and when selected memory cell reaches the predetermined voltage level. In some examples, time-varying signals may be used to indicate the logic state based on the duration of the charging. In some examples, the duration of the charging may be based on a polarization state of the selected memory cell, a dielectric charge state of the selected state, or both a polarization state and a dielectric charge state of the selected memory cell.

Abstract: Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. A first ferroelectric memory cell may be initialized to a first state and a second ferroelectric memory cell may be initialized to a different state. Each state may have a corresponding digit line voltage. The digit lines of the first and second ferroelectric memory cells may be connected so that charge-sharing occurs between the two digit lines. The voltage resulting from the charge-sharing between the two digit lines may be used by other components as a reference voltage.

Abstract: Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. A ferroelectric memory cell may be used to store a logic state. The capacitance of a digit line of the ferroelectric memory cell may be dynamically increased prior to, and during a portion of, a read operation used to determine a stored logic state of the cell. The capacitance may be increased by leveraging intrinsic capacitance of digit lines of the array—e.g., by shorting one digit line to another digit line. Increasing the capacitance of the digit line may increase the signal on the digit line that is sensed during the read operation.

Abstract: Disclosed embodiments include a memory device having a memory array that includes a first memory cell coupled to a first bit line and a second memory cell coupled to a second bit line and a sense amplifier that includes first and second transistors arranged in a cross-coupled configuration with third and fourth transistors, the first and second transistors being of a first conductivity type and the third and fourth transistors being of a second conductivity type, a first inverter having an input coupled to a first common drain terminal of the first and third transistors and an output coupled to the first bit line, and a second inverter having an input coupled to a second common drain terminal of the second and fourth transistors and an output coupled to the second bit line.

Abstract: Methods, systems, and devices for preventing disturb of untargeted memory cells during repeated access operations of target memory cells are described for a non-volatile memory array. Multiple memory cells may be in electronic communication with a common conductive line, and each memory cell may have an electrically non-linear selection component. Following an access operation (e.g., a read or write operation) of a target memory cell, untargeted memory cells may be discharged by applying a discharge voltage to the common conductive line. The discharge voltage may, for example, have a polarity opposite to the access voltage. In other examples, a delay may be instituted between access attempts in order to discharge the untargeted memory cells.

Abstract: Some embodiments include an assembly having active material structures arranged in an array having rows and columns. Each of the active material structures has a first side which includes a bit contact region, and has a second side which includes a cell contact region. Each of the bit contact regions is coupled with a first redistribution pad. Each of the cell contact regions is coupled with a second redistribution pad. The first redistribution pads are coupled with bitlines, and the second redistribution pads are coupled with programmable devices. Some embodiments include methods of forming memory arrays.

Abstract: A semiconductor device may be provided. The semiconductor device may include an error scrub control circuit and or an active period signal generation circuit. The error scrub control circuit may be configured to generate an error scrub pre-charge signal and an error scrub bank signal for performing an error scrub operation of memory cells included in banks, based on a bank active signal and a row address signal which are generated based on a refresh signal. The active period signal generation circuit may be configured to generate an active period signal from the bank active signal and the error scrub pre-charge signal based on the error scrub bank signal.

Abstract: A nonvolatile memory device includes a memory cell array, a voltage generator, a page buffer circuit, a row decoder and a control circuit. The memory cell array includes a plurality of mats corresponding to different bit-lines. The voltage generator generates word-line voltages applied to the memory cell array. The page buffer circuit is coupled to the memory cell array through bit-lines. The row decoder is coupled to the memory cell array through word-lines, and the row decoder transfers the word-line voltages to the memory cell array. The control circuit controls the voltage generator, the row decoder and the page buffer circuit based on a command and an address. The control circuit selects a voltage between different voltages to apply the selected different voltages to at least one of the word-lines or at least one of the bit-lines according to a number of mats of the plurality mats, which operate simultaneously.

Abstract: Apparatuses and methods for configurable command and data input circuits for semiconductor memories are described. Example apparatuses include input signal blocks, clock blocking circuits, data input blocks, driver circuits, and data receiver circuits.

Abstract: An apparatus includes a first word line, a second word line and a control. The second word line is contiguous to the first word line. The control circuit includes a first defective address storing circuit and a first detection circuit. The first defective address storing circuit stores first enable information along with first defective address. The first enable information indicates whether or not the second word line is functional. The first detection circuit provides a first signal when the first word line is accessed. The first signal indicates whether or not the second word line is functional. The control circuit activates the second word line when the first signal indicates that the second word line is functional and does not activate the second word line when the first signal indicates that the second word line is not functional.

Abstract: The present disclosure provides a pump system of a DRAM and a method for operating the same. The pump system includes a pump device and a spare pump assembly. The pump device provides a current sufficient to allow a bank of the DRAM to operate at a normal refresh rate without other spare pump devices in response to a normal instruction which indicates that the bank is instructed to operate at the normal refresh rate. The spare pump assembly includes a first spare pump device configured to provide, in combination with the pump device, a current sufficient to allow the bank to operate at a first refresh rate greater than the normal refresh rate in response to a first instruction which indicates that the bank is instructed to operate at the first refresh rate.

Abstract: A semiconductor device includes a counter control signal generation circuit and an access information generation circuit. The counter control signal generation circuit generates a count enablement signal, a reset signal and a count increment signal in response to a first row address selected as a target address and a second row address selected as a neighboring address. The access information generation circuit receives the count enablement signal, the reset signal and the count increment signal to generate a first access information signal including information on the number of times that the target address is selected and a second access information signal including information on the number of times that the neighboring address is selected.

Abstract: A static random access memory unit structure and layout structure includes two pull-up transistors, two pull-down transistors, two slot contact plugs, and two metal-zero interconnects. Each metal-zero interconnect is disposed on each slot contact plug and a gate of each pull-up transistor, in which, each slot contact plug crosses a drain of each pull-down transistor and a drain of each pull-up transistor and extends to cross an end of each metal-zero interconnect. A gap between the slot contact plugs is smaller than a gap between the metal-zero interconnects.

Abstract: A memory device includes a memory cell array comprising a plurality of memory cells wherein each of the plurality of memory cells is configured to be in a data state, and a physically unclonable function (PUF) generator. The PUF generator further includes a first sense amplifier, coupled to the plurality of memory cells, wherein while the plurality of memory cells are being accessed, the first sense amplifier is configured to compare accessing speeds of first and second memory cells of the plurality of memory cells, and based on the comparison, provide a first output signal for generating a first PUF signature.

Abstract: An autocorrective writing to a multiport static random access memory device is performed on at least one multiport static random access memory cell circuit. A first datum is written to the multiport static random access memory cell circuit and a second datum stored in the circuit is read from the multiport static random access memory cell subsequent to writing. The first and second data are compared. In response to the results of that comparison, an operation to rewriting the first datum to the circuit along with application of a write assist mechanism is selectively performed.

Abstract: A circuit includes a memory cell array which includes: a plurality of memory cells; a plurality of word lines coupled to the memory cells, respectively, and a plurality of bit lines coupled to the memory cells, an address control circuit which includes: a first latch circuit into which a first address signal is input and from which a first output signal is output; a selection circuit into which a second address signal and the first output signal are input and which selects the first output signal or the second address signal for outputting the first output signal or the second address signal as a second output signal; a second latch circuit into which the second output signal is input and from which a third output signal is output; a decode circuit which decodes the third output signal and outputs a fourth output signal; and a word line drive circuit.

Abstract: In some embodiments, a semiconductor memory device includes an array of semiconductor memory cells arranged in rows and columns. The array includes a first segment of memory cells and a second segment of memory cells. A first pair of complementary local bit lines extend over the first segment of memory cells and is coupled to multiple memory cells along a first column within the first segment of memory cells. A second pair of complementary local bit lines extend over the second segment of memory cells and is coupled to multiple memory cells along the first column within the second segment of memory cells. A pair of switches is arranged between the first and second segments of memory cells. The pair of switches is configured to selectively couple the first pair of complementary local bit lines in series with the second pair of complementary local bit lines.

Abstract: The present disclosure includes memory cells programmed via multi-mechanism charge transports. An example apparatus includes a semiconductor material, a tunneling material formed on the semiconductor material, a charge trapping material formed on the tunneling material, a charge blocking material formed on the charge trapping material, and a metal gate formed on the charge blocking material. The charge trapping material comprises gallium nitride (GaN), and the memory cell is programmed to the target state via the multi-mechanism charge transport such that charges are simultaneously transported to the charge trapping material through a plurality of different channels.

Abstract: Apparatuses and methods for limiting current in threshold switching memories are disclosed. An example apparatus may include a plurality of first decoder circuits, a plurality of second decoder circuits, an array of memory cells, and a control circuit. Each memory cell of the array of memory cells may be cells coupled to a pair of first decoder circuits of the plurality of first decoder circuits, and further coupled to a pair of second decoder circuits of the plurality of second decoder circuits.

Abstract: Disclosed is a dual inline memory module with temperature-sensing scenario modes. A plurality of volatile memory components and an EEPROM component are disposed on a module board. A plurality of LED components and a scenario-lighting controller are disposed at a radiant side of the module board. A light bar is located at the radiant side of the module board without direct installing relationship. A plurality of clamping-type heat spreaders are fastened to one another in a manner that the light bar is tightly clamped. Therein, the power of the scenario-lighting controller component is shared and linked with the power supply system of the LED components and the signals of the scenario-lighting controller component are shared and linked with the signal connection system of the EEPROM component.

Abstract: A computing device includes bit line processors, multiplexers and a decoder. Each bit line processor includes a bit line of memory cells and each cell stores one bit of a data word. A column of bit line processors stores the bits of the data word. Each multiplexer connects a bit line processor in a first row of bit line processors to a bit line processor in a second row of bit line processors. The decoder activates at least two word lines of the bit line processor of the first row and a word line in the bit line processor in the second row and enables a bit line voltage associated with a result of a logical operation performed by the bit line processor in the first row to be written into the cell in the bit line processor in the second row.

Abstract: Methods of programming and sensing in a memory device including connecting first and second data lines in series before programming or sensing, respectively.

Abstract: A semiconductor memory device including a memory cell array including a plurality of memory blocks, a voltage generator applying operation voltages to a selected memory block, among the plurality of memory blocks, a control logic generating converted data by converting data bit sets respectively corresponding to at least one set of program states among a plurality of program states, during a program operation, and a read and write circuit temporarily storing the converted data and performing a program operation by controlling potential levels of bit lines of the memory cell array in accordance with stored converted data.

Abstract: A semiconductor memory device includes first and second memory cells, first and second select transistors having first ends connected to the first and second memory cells, respectively, first and second bit lines connected to second ends of the first and second select transistors, respectively, and a select gate line connected to the first and second select transistors. A write operation includes first and second program loops. While a program pulse is being applied to a word line, a first voltage is applied to the first bit line, a second voltage to the second bit line, and a third voltage to the select gate line. Before the program pulse is applied to the word line, the second voltage is applied to the second bit line and a fourth voltage is applied to the select gate line for different time periods while in the first and second program loops, respectively.

Abstract: A memory system comprises a plurality of non-volatile memory cells grouped into blocks of memory cells and a control circuit in communication with the memory cells. The control circuit is configured to program original data to a first block of memory cells and backup the original data by programming a copy of the original data across multiple blocks of memory cells at a word line offset. After being used to store backups of original data, blocks are rotated to be used for storing original data.

Abstract: Apparatuses and methods for nonconsecutive sensing of multilevel memory cells include methods of sensing a unit of information from a multilevel memory cell (MLC) using a sensing signal. The unit of information can correspond to a page of information. The MLC can store a plurality of units of information corresponding to a plurality of pages of information. The sensing signal can change from a first sensing magnitude to a second sensing magnitude and from the second sensing magnitude to a third sensing magnitude. The second sensing magnitude can be nonconsecutive from the first sensing magnitude and/or the third sensing magnitude can be nonconsecutive from the second sensing magnitude with respect to a plurality of sensing magnitudes corresponding to a plurality of charge storage states of the MLC.

Abstract: A method for reading data stored in a flash memory includes at least the following steps: controlling the flash memory to perform a plurality of read operations upon a plurality of memory cells included in the flash memory; obtaining a plurality of bit sequences read from the memory cells, respectively, wherein the read operations read bits of a predetermined bit order from the memory cells by utilizing different control gate voltage settings; and determining readout information of the memory cells according to binary digit distribution characteristics of the bit sequences.

Abstract: A method includes applying erase voltages to data lines and source lines of a memory block of memory cells in a non-volatile NAND architecture memory device during an erase operation. The memory block of memory cells includes a plurality of memory segments and a corresponding plurality of first select gate control lines. Each memory segment includes a plurality of memory sub-blocks that share a respective one of the first select gate control lines. The method includes applying a first bias voltage to the respective first select gate control line of a first one of the memory segments that has failed an erase verify operation to facilitate erasing the first memory segment during the erase operation, and applying a second bias voltage different from the first bias voltage to the respective first select gate control line of a second one of the memory segments that has passed the erase verify operation to facilitate inhibiting erasing of the second memory segment during the erase operation.

Abstract: A memory device has a memory cell array with memory cells. A page buffer group generates page buffer signals according to a verify read result of the memory cells. A page buffer decoding unit generates a decoder output signal corresponding to the number of fail bits from the page buffer signals based on a first reference current. A slow bit counter outputs a count result corresponding to the number of fail bits from the decoder output signal based on a second reference current corresponding to M times the first reference current, where M is a positive integer. A pass/fail checking unit determines a program outcome with respect to the memory cells based on the count result and outputs a pass signal or a fail signal based on the determined program outcome.

Abstract: A memory device and associated techniques for programming a select gate transistor. The programming of the select gate transistors in a NAND string is performed under similar biasing as is seen during the programming of a memory cell, when the select gate transistors are required to be in the conductive or non-conductive state for selected and unselected NAND strings, respectively. Program-verify tests for the select gate transistors use a current which flows from the source end to the drain end of the NAND string, and can be performed separately for odd- and even-numbered NAND strings, to avoid the effects of bit line-to-bit line coupling. The tests account for uneven doping in the channel of the select gate transistor. Program-verify tests for the memory cells use a current which flows from the drain end to the source end and can be performed concurrently.

Abstract: An apparatus comprises a memory and a controller. The memory configured to store data. The memory may comprise a write buffer and a plurality of memory dies. Each memory die may have a size less than a total size of the memory and include a plurality of cells. The memory may perform a program operation to write to and verify one or more of the plurality of cells in response to receiving a program command. The controller may be configured to issue the program command to program the plurality of memory dies and to issue the polling status command after issuing the program command to obtain a number of the cells that failed to be verified during the program operation. In response to the polling status command received from the controller, the memory reports a count of a number of bit-lines not having an inhibited state in the write buffer.

Abstract: A fuse-programmable register or memory location having a plurality of fusible links of differing electrical characteristics in parallel. In one embodiment, three fusible links with different resistances are provided, such that application of a programming voltage non-uniformly distributes the current among the links, allowing varying voltages to selectively blow one or more of the links. Sensing of the programmed state is performed by applying a voltage across the parallel links and measuring the current in comparison with a plurality of reference currents. Reduction in the overhead chip area per bit and in the serial data communication latency are obtained.

Abstract: Methods, systems, and devices for recovering fatigued ferroelectric memory cells are described. Recovery voltages may be applied to a ferroelectric memory cell that is fatigued due to repeated access (read or write) operations. The recovery voltage may have a greater amplitude than the access voltage and may include multiple voltage pulses or a constant voltage. The recovery operation may be performed in the background as the memory array operates, or it may be performed when a host device is not actively using the memory array. The recovery operations may be performed periodically or may include discrete series of pulses distributed among several instances.

Abstract: A serial arbitration for memory diagnostics and methods thereof are provided. The method includes running a built-in-self-test (BIST) on a plurality of memories in parallel. The method further includes, upon detecting a failing memory of the plurality of memories, triggering arbitration logic to shift data of the failing memory to a chip pad.

Abstract: Embodiments of the invention are directed to a system, method, or computer program product for building a geographic location based sharing request network. The invention generates and builds a sharing request network based on user geographic locations for efficiently and conveniently matching and connecting users to one another and third party systems. In this way, the sharing request network system may identify social events, volunteering opportunities, medical aid sharing, and transportation sharing for aging individuals. Furthermore, the system generates a knowledge sharing advice database, since aging individuals typically have professional or personal experiences. The user may be able to respond with answers or advice to questions posted by other users via the system. Additionally, the system may generate rewards based on the knowledge or advice provided in response to posted questions.

Abstract: A system and method for generating and using a wearable device profile are disclosed. A particular embodiment includes: a retention mechanism including an attachment mechanism configured to attach the retention mechanism to a body part of a user; a memory device for storage of information indicative of the location of the body part in a wearable device profile; and a data interface for communicating the wearable device profile to another electronic device.

Abstract: To predict which Hepatitis C patients are at high-risk for disease progression or adverse health outcomes, baseline characteristics are measured for patients as well as longitudinal data, including clinical, laboratory and/or biopsy results, which may be collected periodically in follow-up visits with a healthcare professional. A machine learning engine may predict whether a patient is at high-risk for disease progression or adverse health outcomes based on the baseline characteristics and the longitudinal data for the patient.

Abstract: A charged particle acceleration device according to some embodiments of the current invention includes a first triboelectric element, a second triboelectric element arranged proximate the first triboelectric element to be brought into contact with and separated from the first triboelectric element, an actuator assembly operatively connected to at least one of the first and second triboelectric elements to bring the first and second triboelectric elements into contact with each other and to separate the first and second triboelectric elements from each other, and a charged-particle source configured to provide charged particles in a gap between the first and second triboelectric elements.

Abstract: The present disclosure relates to a device for closing and opening a beam path of electromagnetic and/or ionizing radiation, comprising at least one part of a shutter body which is permanently situated in the beam path and rotatable about a longitudinal axis situated essentially transversely with respect to the beam path, and which contains a material that is opaque to the radiation and blocks the beam path when the shutter body is in a closed rotary position, and which defines a passage that is transparent to the radiation when in an open rotary position; and comprising a magnetic drive which is coupled to the shutter body for rotation of same about the longitudinal axis between the rotary positions. The magnetic drive is an electromagnetic drive, and is configured for moving the shutter body between the rotary positions, wherein at least one of the rotary positions corresponds to a stable position of the magnetic drive which maintains the magnetic drive without current.

Abstract: An X-ray metal grating structure of the present invention has a grating region in which a plurality of first structural portions are periodically provided, wherein an air gap is formed between each of the plurality of first structural portions and a second structural portion as a remaining part of the grating region other than the plurality of first structural portions. Thus, the X-ray metal grating structure of the present invention is formed as a grating structure having high flatness. A production method therefor comprises a step of forming the air gap between the first structural portion and the second structural portion. Thus, the production method makes it possible to produce an X-ray metal grating structure having high flatness. The present invention further provides an X-ray metal grating unit and an X-ray imaging device each comprising the X-ray metal grating structure.

Abstract: The present invention relates to an illumination and imaging device for high-resolution X-ray microscopy with high photon energy, comprising an X-ray source (1) for emitting X-ray radiation and an area detector (4) for detecting the X-ray radiation. Moreover, the device comprises a monochromatizing and two-dimensionally focussing condenser-based optical system (2) arranged in the optical path of X-ray radiation with two reflective elements (6) being arranged side-by-side for focussing impinging X-ray radiation on an object to be imaged (5) and a diffractive X-ray lens (3) for imaging the object to be imaged (5) on the X-ray detector (4). Typically, the illumination and imaging device is used for performing radiography, tomography and examination of a micro-electronic component or an iron-based material.

Abstract: A copper alloy for electronic devices has a low Young's modulus, high proof stress, high electrical conductivity and excellent bending formability and is appropriate for a component for electronic devices including a terminal, a connector, a relay and a lead frame. Also a method of manufacturing a copper alloy utilizes a copper alloy plastic working material for electronic devices, and a component for electronic devices. The copper alloy includes Mg at 3.3 to 6.9 at %, with a remainder substantially being Cu and unavoidable impurities. When a concentration of Mg is X at %, an electrical conductivity ? (% IACS) is in a range of ??{1.7241/(?0.0347×X2+0.6569×X+1.7)}×100, and an average grain size is in a range of 1 ?m-100 ?m. In addition, an average grain size of a copper material after an intermediate heat treatment and before finishing working is in a range of 1 ?m-100 ?m.