Patents Issued in February 20, 2020
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Publication number: 20200057190Abstract: A method for manufacturing a light emitting module including the steps of: preparing a light source including a light emitting element that has a pair of electrodes on the same surface side, and an encapsulation member that covers the light emitting element so as to expose a portion of a surface of the pair of electrodes; preparing a lightguide plate having a first primary surface to be a light emitting surface, and a second primary surface on an opposite side from the first primary surface, wherein the second primary surface has a recessed portion that has a bottom surface and at least one lateral surface; placing the light source on the bottom surface of the recessed portion with the electrodes facing up so as to be spaced apart from the lateral surface of the recessed portion; arranging a cover member that buries a gap between the lateral surface of the recessed portion and the light source and covers the light source including the electrodes; removing the cover member until the electrodes are exposed; andType: ApplicationFiled: August 8, 2019Publication date: February 20, 2020Applicant: NICHIA CORPORATIONInventor: Shinichi Daikoku
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Publication number: 20200057191Abstract: A method of characterizing a multimode optical fiber results in a measure of estimated modal bandwidth (EMB) that is independent of the bandwidth of the light used in the characterization. The method includes propagating pulses of light along the multimode optical fiber at prescribed radial positions relative to an optical axis of the multimode optical fiber and detecting output pulses from the multimode optical fiber corresponding to the pulses of light propagated along the multimode optical fiber at the prescribed radial positions relative to the optical axis of the multimode optical fiber. An estimated modal bandwidth of the multimode optical fiber is calculated in a manner that accounts for chromatic dispersion of the multimode optical fiber.Type: ApplicationFiled: April 24, 2018Publication date: February 20, 2020Applicant: COMMSCOPE TECHNOLGOIES LLCInventors: Earl R. PARSONS, Randall L. PATTERSON, Peter Berggren KIDD
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Publication number: 20200057192Abstract: An optical circuit board which is mounted with a loop-back circuit for returning aligning light to the fiber array in the vicinity of the fiber array connection end. Since an aligning loop-back circuit can be formed in an optical waveguide pattern, a production cost does not increase in comparison to an optical circuit board of the related art. The aligning light combined from the optical fiber to the aligning port of the optical circuit board is returned to the optical fiber around the loop-back circuit. Therefore, it is possible to perform alignment using the returned light. That is, alignment can be performed while being mounted on a package without installing a light-reflecting film or mirror.Type: ApplicationFiled: November 2, 2017Publication date: February 20, 2020Inventors: Tomohiro NAKANISHI, Motoki MINAMI, Satoru KONNO, Yuichi SUZUKI, Teruaki SATO, Shigeo NAGASHIMA, Shinji MINO, Motohaya ISHII, Shunichi SOMA, Shin KAMEl, Shuichiro ASAKAWA
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Publication number: 20200057193Abstract: In one embodiment, a photonic waveguide comprises a layer of core material and a waveguide core extending through the core material. The core material surrounding the waveguide core is modified to simulate clad material. A method for forming the photonic waveguide is also disclosed herein.Type: ApplicationFiled: September 18, 2019Publication date: February 20, 2020Applicant: CISCO TECHNOLOGY, INC.Inventor: D. Brice Achkir
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Publication number: 20200057194Abstract: A photonic neural component includes optical transmitters, optical receivers, inter-node waveguides formed on a board, transmitting waveguides configured to receive optical signals emitted from the optical transmitters and transmit the received optical signals to the inter-node waveguides, mirrors to partially reflect optical signals propagating on the inter-node waveguides, receiving waveguides configured to receive reflected optical signals produced by the mirrors and transmit the reflected optical signals to the optical receivers, and filters configured to apply weights to the reflected optical signals. The transmitting waveguides and receiving waveguides are formed on the board such that one of the transmitting waveguides and one of the receiving waveguides crosses one of the inter-node waveguides with a core of one of the crossing waveguides passing through a core or clad of the other.Type: ApplicationFiled: October 23, 2019Publication date: February 20, 2020Inventors: Jean Benoit Heroux, Seiji Takeda, Toshiyuki Yamane
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Publication number: 20200057195Abstract: A low loss high extinction ratio on-chip polarizer is disclosed. The polarizer includes an input waveguide taper having an outer waveguiding region that widens in the direction of light propagation along at least a portion of the taper length, and a core waveguiding region that narrows in the direction of light propagation along at least a portion of the taper length, so as to selectively squeeze out light of undesired modes into the outer regions while preserving light of a desired mode in the waveguide core. An output filter section is provided to prevent light from reentering the output waveguide after being squeezed out. An integrated light absorber/deflector may be coupled to the outer waveguiding regions.Type: ApplicationFiled: October 25, 2019Publication date: February 20, 2020Inventors: Ruizhi Shi, Thomas Wetteland Baehr-Jones, Yangjin Ma, Yang Liu, Michael J. Hochberg, Matthew Akio Streshinsky, Alexandre Horth
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Publication number: 20200057196Abstract: An optical device includes a waveguide device and a fiber stub. The fiber stub at least partially contains a first optical fiber and is directly attached to the waveguide device by an adhesive. The first optical fiber is to be coupled to a second optical fiber included in an optical connector when the optical connector is inserted into a receptacle of the optical device. The fiber stub is to couple the first optical fiber to at least one of the waveguide device or an optical waveguide included in the waveguide device.Type: ApplicationFiled: June 28, 2019Publication date: February 20, 2020Inventors: Barthelemy FONDEUR, Yujian BAO, Zhaoming LI, Wei LI
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Publication number: 20200057197Abstract: An integrated photonic device comprising at least a first integrated photonic component supported by a substrate extending substantially in a plane of the device and optically isolating cladding facing the first integrated photonic component, the photonic device further comprising a waveguide formed by a deposited layer of group IV semiconductor material to extend on a slope in a direction out of the plane of the substrate, the waveguide arranged to, in use, couple light from/to the integrated photonic component through the optically isolating cladding.Type: ApplicationFiled: August 17, 2018Publication date: February 20, 2020Inventors: Harold Chong, Rafidah Petra, Graham Reed, Swe Zin Oo, Antulio Tarazona
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Publication number: 20200057198Abstract: A hybrid grating comprises a first grating layer composed of a first solid-state material, and a second grating layer over the first grating layer and composed of a second solid-state material, the second solid state-material being different than the first solid-state material and having a monocrystalline structure.Type: ApplicationFiled: October 28, 2019Publication date: February 20, 2020Inventors: Di Liang, Geza Kurczveil, Raymond G. Beausoleil
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Publication number: 20200057199Abstract: An optical attenuator has a male connector, a female connector that is spaced apart from the male connector in a front-rear direction, a holder, and an attenuating member. The holder extends in the front-rear direction and has two opposite ends respectively connected to the male and female connectors. The holder is formed with a mounting groove which extends in the front-rear direction. The attenuating member extends through the mounting groove, and has two opposite ends respectively inserted into the male and female connectors.Type: ApplicationFiled: July 23, 2019Publication date: February 20, 2020Inventors: Jim LIN, Kexue NING, Xiangxu ZENG
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Publication number: 20200057200Abstract: A method of manufacturing an optical device is disclosed. The method includes scanning along a curved path at a first surface of a glass plate with a laser beam directed orthogonally to the first surface to form a trench according to a pattern of a waveguide. The curved path is coincident with a longitudinal axis of the waveguide. The method further includes filling the trench with a material having an index different from that of glass to form the waveguide and, after filling the trench, depositing a cladding layer.Type: ApplicationFiled: October 24, 2019Publication date: February 20, 2020Inventors: Cédric Durand, Frédéric Gianesello, Folly Eli Ayi-Yovo
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Publication number: 20200057201Abstract: An optical device package includes a semiconductor substrate, and an optical device. The semiconductor substrate has a first surface, a second surface different in elevation from the first surface, and a profile connecting the first surface to the second surface. A surface roughness of the profile is greater than a surface roughness of the second surface. The optical device is disposed on the second surface and surrounded by the profile.Type: ApplicationFiled: August 15, 2018Publication date: February 20, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Huang-Hsien Chang, Po Ju Wu, Yu Cheng Chen, Wen-Long Lu
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Publication number: 20200057202Abstract: Assemblies, optical connectors, and methods for bonding optical elements to a substrate using a laser beam are disclosed. In one embodiment, a method of bonding an optical element to a substrate includes disposing a film layer on a surface of the substrate, disposing the optical element on a surface of the film layer, and directing a laser beam into the optical element. The method further includes melting, using the diameter laser beam, a material of the substrate to create a bond area between the optical element and the surface of the substrate. The film layer is capable of absorbing a wavelength of the laser beam to melt the material of the substrate at the bond area. The bond area includes laser-melted material of the substrate that bonds the optical element to the substrate.Type: ApplicationFiled: October 25, 2019Publication date: February 20, 2020Inventors: Douglas Llewellyn Butler, Stephan Lvovich Logunov, Mark Alejandro Quesada, Alexander Mikhailovich Streltsov, James Scott Sutherland
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Publication number: 20200057203Abstract: An epoxy-free, high-durability and low-cost plastic optical fiber splice design and fabrication process which meets commercial airplane environmental requirements. The splice design: (1) does not require the use of epoxy to join the end faces of two plastic optical fibers together; (2) incorporates double-crimp rings to provide highly durable pull force for the plastic optical fibers that are joined together; (3) resolves any vibration problem at the plastic optical fiber end faces using a miniature stop inside a splice alignment sleeve; and (4) incorporates a splice alignment sleeve that can be mass produced using precision molding or three-dimensional printing processes.Type: ApplicationFiled: October 25, 2019Publication date: February 20, 2020Applicant: The Boeing CompanyInventors: Dennis G. Koshinz, Eric Y. Chan, Tuong K. Truong, Kim Quan Anh Nguyen
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Publication number: 20200057204Abstract: A fiber optic connector includes a plug-in unit, a connecting unit, and a sleeving unit. The plug-in unit includes a switch member that is operable to move between a locking position and an adjusting position. The connecting unit includes a surrounding body that is formed with two through grooves. When the switch member is at the adjusting position, the switch member is moved away from of the through grooves and the connecting unit is operable to be separated from the plug-in unit. When the switch member is at the locking position, the switch member is moved into one of the through grooves to prevent separation of the connecting unit from the plug-in unit.Type: ApplicationFiled: August 13, 2019Publication date: February 20, 2020Inventor: Yen-Chang LEE
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Publication number: 20200057205Abstract: Devices such as multiports comprising connection ports with associated securing features and methods for making the same are disclosed. In one embodiment, the device comprises a shell, at least one connection port, at least one securing feature passageway, and at least one securing feature. The at least one connection port is disposed on the multiport with the at least one connection port comprising an optical connector opening extending from an outer surface of the multiport to a cavity of the multiport and defining a connection port passageway. The connection port passageway defines a keying portion. The at least one securing feature is associated with the connection port passageway, and the at least one securing feature is disposed within a portion of the at least one securing feature passageway.Type: ApplicationFiled: October 25, 2019Publication date: February 20, 2020Inventors: Thierry Luc Alain Dannoux, Robert Bruce Elkins, II, Joel Christopher Rosson, Dayne Wilcox, Michael Wimmer, Shane C. Woody, Zhiye Zhang
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Publication number: 20200057206Abstract: The present invention provides a circuit board-mounted optical interconnection system comprising a mounting bracket for holding a board-based first optical connector ferrule; a ferrule alignment housing for mating the first optical connector ferrule with a second optical connecter ferrule to form a mated ferrule sub-assembly; wherein the mounting bracket comprises a pair of curved portions; the mated ferrule sub-assembly comprises one or more pivoting features for engaging with the curved portions such that the mated ferrule sub-assembly is rotatable with respect to the mounting bracket. The present invention makes mating and un-mating of the connector ferrules easier, particularly in confined working spaces as with racks in telecommunication cabinets.Type: ApplicationFiled: October 25, 2019Publication date: February 20, 2020Inventor: Jeffrey GNIADEK
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Publication number: 20200057207Abstract: An optical ferrule adapted to receive and transmit light is described. The optical ferrule includes first and second alignment features for mating with corresponding alignment features of a mating optical ferrule. One of the first and second alignment features may be compressible or expandable.Type: ApplicationFiled: October 24, 2019Publication date: February 20, 2020Inventors: Michael A. Haase, Alexander R. Mathews, Terry L. Smith
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Publication number: 20200057208Abstract: A fiber optic connector includes a connector body housing a plurality of optical fibers. Each of the plurality of optical fibers includes a bare end having an angled face. Half of the plurality of optical fibers has an angled face that is at a first angle and the other half of the plurality of optical fibers has an angled face that is at a second angle that is different from the first angle. The fiber optic connector can comprise a ferrule-less or ferruled fiber optic connector.Type: ApplicationFiled: March 28, 2018Publication date: February 20, 2020Applicant: COMMSCOPE TECHNOLOGIES LLCInventors: Michael James OTT, John D. SCHMIDT
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Publication number: 20200057209Abstract: An optical cable subassembly includes one or more optical waveguides, at least light coupling unit comprising a first attachment area permanently attached to the optical waveguides, and at least one cable retainer comprising a second attachment area permanently attached to the optical waveguides and adapted to be installed in a housing. A length of the optical waveguides between the first attachment area and the second attachment area allows a bend in the optical waveguides that provides a predetermined mating spring force at a predetermined angle of the light coupling unit when installed in the housing.Type: ApplicationFiled: September 23, 2019Publication date: February 20, 2020Inventors: Michael A. Haase, Terry L. Smith, Alexander R. Mathews, James M. Nelson
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Publication number: 20200057210Abstract: A light module for illuminating an outer component of a vehicle, including: a housing for fastening the light module to the vehicle; a cover mounted on the housing; an inner space delimited between the housing and the cover; a printed circuit board in the inner space; a light source on the printed circuit board and configured for emitting an illumination beam; and a light guide in the housing facing the light source and extending outside the inner space for guiding the illumination beam along the outer component; wherein the housing and the printed circuit board are provided with complementary indexing means tightly fitted relative to each other, for directly positioning the light source mounted on the printed circuit board relative to the light guide in the housing. A process for manufacturing such light module is also described.Type: ApplicationFiled: October 21, 2016Publication date: February 20, 2020Applicant: Dura Operating, LLCInventors: Thomas FARGES, Francis DELAVIGNE
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Publication number: 20200057211Abstract: Methods and systems for two-dimensional mode-matching grating couplers may include in a photonic chip comprising a grating coupler at a surface of the photonic chip, where the grating coupler has increased scattering strength in a direction of a light wave traveling through the grating coupler: receiving an optical signal from a first direction within the photonic chip; and scattering the optical signal out of the surface of the photonic chip. A second optical signal may be received in the grating coupler from a second direction within the photonic chip. The second optical signal may be scattered out of the surface of the photonic chip. The increasing scattering strength may be caused by increased width scatterers along a direction perpendicular to the direction of light travel. The increased scattering strength may be caused by a transition of shapes of scatterers in the grating coupler.Type: ApplicationFiled: October 7, 2019Publication date: February 20, 2020Inventors: Roman Bruck, Attila Mekis
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Publication number: 20200057212Abstract: In the examples provided herein, an apparatus has a first substrate upon which one or more first filters have been fabricated on a first surface of the first substrate. The apparatus also has a second substrate upon which one or more second filters have been fabricated on a second surface of the second substrate, wherein the one or more first filters and the one or more second filters each transmit a different band of wavelengths. Additionally, the apparatus has a bonding material that bonds the first substrate to the second substrate.Type: ApplicationFiled: October 28, 2019Publication date: February 20, 2020Inventors: Sagi Varghese Mathai, Georgios Panotopoulos, Michael Renne Ty Tan, Paul K. Rosenberg, Wayne V. Sorin
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Publication number: 20200057213Abstract: A freeform DOE for use in an optical transmitter and a method of designing and manufacturing the DOE are provided. The freeform DOE is capable of achieving the same, or nearly the same, functionality as that of a glass DOE, but has a design that has been transformed to make the surface profile of the DOE compatible with a molding process that can be used to manufacture the DOE with high quality at low costs. The method of designing and manufacturing the DOE includes preselecting a CGH that will obtain a target freeform DOE design, using a preselected smoothing function to smooth the surface profile of the target freeform DOE design to transform the design into a DOE design that is compatible with a molding process, and using a fabrication process to manufacture a freeform DOE that is based on the transformed DOE design.Type: ApplicationFiled: August 17, 2018Publication date: February 20, 2020Inventors: Dongqing Cao, Ye Chen, Bing Shao, Andrew Schmit, Li Ding
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Publication number: 20200057214Abstract: Opto-electric hybrid boards are disclosed including an electric circuit board; light-emitting and light-receiving elements which are mounted on a first surface of the electric circuit board; and an optical waveguide having a core for an optical path and formed in a stacked manner on a second surface of the electric circuit board. The core of the optical waveguide includes: end portions formed as light reflecting surfaces for reflecting light to allow the light to propagate between the core and the light-emitting and light-receiving elements; extensions extending from the end portion side of the core toward the light-emitting and light-receiving elements; and a main portion from which the extensions extend. The extensions of the core and the main portion of the core are different from each other in shape of cross-sections perpendicular to an axial direction thereof.Type: ApplicationFiled: November 20, 2017Publication date: February 20, 2020Applicant: NITTO DENKO CORPORATIONInventors: Naoto Konegawa, Yuichi Tsujita
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Publication number: 20200057215Abstract: An optical assembly includes a combination of laser sources emitting radiation, focused by a combination of lenses into optical waveguides. The optical waveguide and the laser source are permanently attached to a common carrier, while at least one of the lenses is attached to a holder that is an integral part of the carrier, but is free to move initially. Micromechanical techniques are used to adjust the position of the lens and holder, and then fix the holder it into place permanently using integrated heaters with solder.Type: ApplicationFiled: July 26, 2018Publication date: February 20, 2020Inventors: Bardia Pezeshki, John Heanue
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Publication number: 20200057216Abstract: A fiber alignment or “fiberposer” device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.Type: ApplicationFiled: October 28, 2019Publication date: February 20, 2020Inventors: Nathan A. Nuttall, Daniel J. Blumenthal, Ari Novack, Holger N. Klein
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Publication number: 20200057217Abstract: Some embodiments include a latch mechanism and an optoelectronic module that includes the latch mechanism. The latch mechanism may include a driver, a follower, a pivot member, and a cam member. The driver may be configured to rotate relative to a housing of the optoelectronic module about an axis of rotation between a latched position and an unlatched position. The follower may be configured to be move when the driver rotates between the latched and unlatched position. The follower may include at least one electromagnetic interference (EMI) window that is configured to engage with at least one EMI protrusion positioned on the housing and thereby maintain contact with a cage of a host device.Type: ApplicationFiled: October 23, 2019Publication date: February 20, 2020Inventor: Demetrios Koutrokois
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Publication number: 20200057218Abstract: An interconnect package integrates a photonic die, an electronic die, and a switch ASIC into one package. At least some of the components in the electronic die, such as, for example, the serializer/deserializer circuits, transceivers, clocking circuitry, and/or control circuitry are integrated into the switch ASIC to produce an integrated switch ASIC. The photonic die is attached and electrically connected to the integrated switch ASIC.Type: ApplicationFiled: February 21, 2019Publication date: February 20, 2020Inventors: Rabiul Islam, Stefan Rusu, Nick Samra
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Publication number: 20200057219Abstract: A method of forming a coaxial wire that includes providing a sacrificial trace structure using an additive forming method, the sacrificial trace structure having a geometry for the coaxial wire, and forming a continuous seed metal layer on the sacrificial trace structure. The sacrificial trace structure may be removed and a first interconnect metal layer may be formed on the continuous seed layer. An electrically insulative layer may then be formed on the first interconnect metal layer, and a second interconnect metal layer is formed on the electrically insulative layer. Thereafter, a dielectric material is formed on the second interconnect metal layer to encapsulate a majority of an assembly of the first interconnect metal layer, electrically insulative layer and second interconnect metal layer that provides said coaxial wire. Ends of the coaxial wire may be exposed through opposing surfaces of the dielectric material to provide that the coaxial wire extends through that dielectric material.Type: ApplicationFiled: October 23, 2019Publication date: February 20, 2020Inventors: Daniel J. Buvid, Eric J. Campbell, Sarah K. Czaplewski, Christopher W. Steffen
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Publication number: 20200057220Abstract: There are described methods and systems for deploying optical fiber within a conduit. In one aspect, an optical fiber injector comprising a pressure vessel having a fluid inlet and a fluid outlet. The fluid outlet is engaged with an open end of the conduit. A length of optical fiber is provided within the pressure vessel. The optical fiber is then jetted into the conduit by injecting a fluid into the pressure vessel via the fluid inlet. The optical fiber injector is configured such that the fluid is directed from the fluid inlet to the fluid outlet, and urges the optical fiber to move through the conduit, thereby deploying the optical fiber within the conduit. In a further aspect, there is provided a modular assembly comprising a pipeline and a line of two or more conduits arranged end-to-end. Each pair of opposing ends of adjacent conduits is connected together by a separate splice box. The line is positioned along and adjacent to a length of the pipeline.Type: ApplicationFiled: February 9, 2018Publication date: February 20, 2020Inventors: John Hull, Neil Gulewicz, Robert Sokolowski, Alex Pletnyov, Souheil Merhi, Philip Cheuk, Seyed Ehsan Jalilian
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Publication number: 20200057221Abstract: This disclosure describes a sealing body (2) for sealing a telecommunication cable in a port entry device. The sealing body has a) a passageway for receiving a section of the cable, b) a base (31) forming a first axial portion of the passageway, and c) a segmented tubular wall (40, 41), elastically deformable and radially compressible, forming an adjacent second axial portion of the passageway.Type: ApplicationFiled: October 25, 2019Publication date: February 20, 2020Inventor: Christophe Desard
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Publication number: 20200057222Abstract: Devices such as port module inserts comprising connection ports with associated securing features and methods for making the same are disclosed. In one embodiment, the port module insert comprises a housing, at least one connection port, at least one securing feature passageway, and at least one securing feature. The at least one connection port is disposed on the port module insert with the at least one connection port comprising an optical connector opening extending from an outer surface of the port module insert to a cavity of the port module insert and defining a connection port passageway. The at least one securing feature is associated with the connection port passageway, and the at least one securing feature is disposed within a portion of the at least one securing feature passageway.Type: ApplicationFiled: October 23, 2019Publication date: February 20, 2020Inventors: Thierry Luc Alain Dannoux, Felice Scotta, Shane C. Woody
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Publication number: 20200057223Abstract: Multiports having connection ports formed in the shell and associated securing features are disclosed. One aspect of the disclosure is directed to a multiport for providing an optical connection comprising a shell comprising a first portion, at least one connection port comprising an optical connector opening, and a connection port passageway formed in the first portion of the shell, where the at least one securing feature is associated with the at least one connection port.Type: ApplicationFiled: October 23, 2019Publication date: February 20, 2020Inventors: Thierry Luc Alain Dannoux, Felice Scotta
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Publication number: 20200057224Abstract: Devices such as multiports comprising connection ports with associated securing features and methods for making the same are disclosed. In one embodiment, the device comprises a shell, at least one connection port, at least one securing feature passageway, and at least one securing feature. The at least one connection port is disposed on the multiport with the at least one connection port comprising an optical connector opening extending from an outer surface of the multiport to a cavity of the multiport and defining a connection port passageway. The at least one securing feature is associated with the connection port passageway, and the at least one securing feature is disposed within a portion of the at least one securing feature passageway.Type: ApplicationFiled: October 24, 2019Publication date: February 20, 2020Inventors: Thierry Luc Alain Dannoux, Robert Bruce Elkins, II, Joel Christopher Rosson, Dayne Wilcox, Michael Wimmer, Shane C. Woody, Zhiye Zhang
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Publication number: 20200057225Abstract: A system for improved cable management is disclosed in several example embodiments. The disclosed embodiments describe example structures for supporting cables, for example telecommunications and fiber optic cables, within a cable storage cabinet. The disclosed embodiments also describe a door for a cable storage cabinet. The example door includes a hinge control and handle system which allows the door to be opened along either side to therefore allow the door to be opened either way from a single handle. The disclosed embodiments also describes an indicator system which informs a user when the door for the cable storage cabinet is in either a closed position or an open position. Each of these embodiments improves the utility and safety of cable management, particularly within cable storage cabinets.Type: ApplicationFiled: April 27, 2018Publication date: February 20, 2020Applicant: COMMSCOPE TECHNOLOGIES LLCInventors: Jing WANG, Wenyong WU, Danny Ghislain THIJS, Christine Anne DOOLEY
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Publication number: 20200057226Abstract: An optical cassette includes a body defining a first termination region defined at the first end of the body; a second termination region defined at the second end of the body; a cable routing region disposed at a first level of the body; an optical splice holding region disposed at a second level of the body; and an optical coupler holding region disposed at the second level of the body. The first level is defined by a base of the body and the second level is defined by a divider tray that pivots relative to the body.Type: ApplicationFiled: August 14, 2019Publication date: February 20, 2020Inventors: Scott C. Sievers, Jonathan R. Kaml
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Publication number: 20200057227Abstract: A molding system includes a flexible cable carrier body that defines a sealing opening that provides access to an interior channel. A continuous length of the flexible cable carrier body is wrapped about a spool for storage and for ease of dispensing at a work site. The continuous length of the cable carrier body is cut to desired custom lengths during installation at the work site. An insertion tool having a plow and feeder channel can facilitate payoff of the fiber/cable into the cable carrier body.Type: ApplicationFiled: May 7, 2019Publication date: February 20, 2020Inventors: Derek Sayres, Thomas Marcouiller, Thomas G. LeBlanc, Wayne M. Kachmar, Ronald J. Kleckowski
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Publication number: 20200057228Abstract: A lens module includes a photosensitive chip, a hollow mounting frame, a filter, a lens holder, a lens, and a circuit board defining a first through hole and comprising a first surface and an opposite second surface. The photosensitive chip is installed on the first surface facing. The first surface includes electronic components and gold fingers installed thereon. One side of the photosensitive chip includes an electrical coupling portion electrically coupled to the gold fingers. The circuit board further includes an injection molding layer integrally formed onto the first surface. The injection molding layer seals the electronic components and the photosensitive chip therein. The mounting frame is fixed onto the second surface of the circuit board. The lens is installed within the lens holder. The lens holder is fixed onto a surface of the mounting frame facing away from the circuit board.Type: ApplicationFiled: November 9, 2018Publication date: February 20, 2020Inventors: LONG-FEI ZHANG, SHIN-WEN CHEN, KUN LI, XIAO-MEI MA
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Publication number: 20200057229Abstract: An optical image capturing module is provided, including a circuit assembly and a lens assembly. The circuit assembly may include a circuit substrate, a plurality of image sensor elements, a plurality of signal transmission elements, and a multi-lens frame. The image sensor elements may be connected to the circuit substrate. The signal transmission elements may be electrically connected between the circuit substrate and the image sensor elements. The multi-lens frame may be manufactured integrally and covered on the circuit substrate and the image sensor elements. A part of the signal transmission elements may be embedded in the multi-lens frame, whereas the other part may be surrounded by the multi-lens frame. The lens assembly may include a lens base, an auto-focus lens assembly, and a driving assembly.Type: ApplicationFiled: December 26, 2018Publication date: February 20, 2020Inventors: YEONG-MING CHANG, CHIEN-HSUN LAI, YAO-WEI LIU
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Publication number: 20200057230Abstract: An optical image capturing module is provided, including a circuit assembly and a lens assembly. The circuit assembly may include a circuit substrate, a plurality of image sensor elements, a plurality of signal transmission elements, and a multi-lens frame. The image sensor elements may be connected to the circuit substrate. The signal transmission elements may be electrically connected between the circuit substrate and the image sensor elements. The multi-lens frame may be manufactured integrally, be covered on the circuit substrate and the image sensor elements, and surround the image sensor elements and the signal transmission elements. The lens assembly may include a lens base, a fixed-focus lens assembly, an auto-focus lens assembly, and a driving assembly. The lens base may be fixed to a multi-lens frame. The fixed-focus lens assembly and the auto-focus lens assembly may have at least two lenses with refractive power.Type: ApplicationFiled: December 26, 2018Publication date: February 20, 2020Inventors: Yeong-Ming CHANG, Chien-Hsun LAI, Yao-Wei LIU
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Publication number: 20200057231Abstract: An optical image capturing module is provided, including a circuit assembly and a lens assembly. The circuit assembly may include a circuit substrate, a plurality of image sensor elements, a plurality of signal transmission elements, and a multi-lens frame. The image sensor elements may be connected to the circuit substrate. The signal transmission elements may be electrically connected between the circuit substrate and the image sensor elements. The multi-lens frame may be manufactured integrally and covered on the circuit substrate and the image sensor elements. The signal transmission elements may be embedded in the multi-lens frame. The lens assembly may include a lens base, a fixed-focus lens assembly, an auto-focus lens assembly, and a driving assembly. The lens base may be fixed to a multi-lens frame. The fixed-focus lens assembly and the auto-focus lens assembly may have at least two lenses with refractive power.Type: ApplicationFiled: December 26, 2018Publication date: February 20, 2020Inventors: Yeong-Ming CHANG, Chien-Hsun LAI, Yao-Wei LIU
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Publication number: 20200057232Abstract: An optical image capturing module is provided, including a circuit assembly and a lens assembly. The circuit assembly may include a circuit substrate, a plurality of image sensor elements, a plurality of signal transmission elements, and a multi-lens frame. The image sensor elements may be connected to the circuit substrate. The signal transmission elements may be electrically connected between the circuit substrate and the image sensor elements. The multi-lens frame may be manufactured integrally, be covered on the circuit substrate, and surround the image sensor elements and the signal transmission elements. The lens assembly may include a lens base and a fixed-focus lens assembly. The lens base may be fixed to a multi-lens frame. The fixed-focus lens assembly may have at least two lenses with refractive power.Type: ApplicationFiled: December 26, 2018Publication date: February 20, 2020Inventors: Yeong-Ming CHANG, Chien-Hsun LAI, Yao-Wei LIU
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Publication number: 20200057233Abstract: An optical image capturing module is provided, including a circuit assembly and a lens assembly. The circuit assembly may include a circuit substrate, a plurality of image sensor elements, a plurality of signal transmission elements, and a multi-lens frame. The image sensor elements may be connected to the circuit substrate. The signal transmission elements may be electrically connected between the circuit substrate and the image sensor elements. The multi-lens frame may be manufactured integrally and be covered on the circuit substrate and the image sensing elements. The signal transmission elements may be embedded in the multi-lens frame. The lens assembly may include a lens base and a fixed-focus lens assembly. The lens base may be fixed to a multi-lens frame. The fixed-focus lens assembly may have at least two lenses with refractive power.Type: ApplicationFiled: December 26, 2018Publication date: February 20, 2020Inventors: Yeong-Ming CHANG, Chien-Hsun LAI, Yao-Wei LIU
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Publication number: 20200057234Abstract: An imaging lens assembly includes a plastic barrel and a lens element set. The lens element set is disposed in the plastic barrel and has an optical axis. The lens element set includes an object-side lens element and an image-side lens element. The object-side lens element has an outer diameter surface and an optical effective portion, and includes a conical-aligning surface located on an image-side surface of the object-side lens element and for coaxially aligning and connecting the image-side lens element.Type: ApplicationFiled: May 1, 2019Publication date: February 20, 2020Inventors: Yeo-Chih HUANG, Chun-Hua TSAI
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Publication number: 20200057235Abstract: Provided is a lens module, including a lens barrel, a lens group and a light-shading plate. The lens group at least comprises a first lens and a second lens. The light-shading plate is sandwiched between the first lens and the second lens. The first lens includes a first optical portion, and a first peripheral portion, which includes a first planar surface extending from an outer edge of the first peripheral portion, a recess portion connected to the first planar surface, and a second planar surface connected to the recess portion. The light-shading plate includes a third planar surface partially attached to the first planar surface, a protruding portion protruding from the third planar surface, and a fourth planar surface extending from the protruding portion towards the optical axis. The protruding portion is attached to the recess portion, and the second planar surface and the fourth planar surface are spaced apart.Type: ApplicationFiled: July 30, 2019Publication date: February 20, 2020Inventor: Hailong Wang
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Publication number: 20200057236Abstract: Provided is a lens module, including a lens barrel and a lens group. The lens barrel includes a first barrel wall and a second barrel wall. The lens group at least include a first lens and a second lens. The first barrel wall has an image-side surface, including a first planar surface horizontally extending from a joint between the first barrel wall and the second barrel wall towards an optical axis, a protruding portion connected to the first planar surface and protruding towards the first lens, and a second planar surface horizontally extending from the protruding portion towards the optical axis. The first lens has a first peripheral portion, including a third planar surface, a recess portion connected to the third planar surface and a fourth planar surface connected to the recess portion. The protruding portion is attached to the recess portion.Type: ApplicationFiled: July 30, 2019Publication date: February 20, 2020Inventor: Hailong Wang
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Publication number: 20200057237Abstract: The present disclosure provides a lens module. The lens module includes: a lens barrel including a first barrel wall having a first inner diameter, a second barrel wall having a second inner diameter and a connecting wall connecting the first barrel wall with the second barrel wall, the first inner diameter being smaller than the second inner diameter; and a set of lenses received in the lens barrel, the set of lenses including a lens surrounded by the second barrel wall. The lens includes a thinned edge portion and a light shading structure sandwiched between the thinned edge portion and the connecting wall. The lens in the lens module provided by the present disclosure reduces stray light, and thus the optical performance is improved. In a case of space limitations, a light shading plate is further provided, so as to adjust gap spacing.Type: ApplicationFiled: August 2, 2019Publication date: February 20, 2020Inventor: Chuandong Wei
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Publication number: 20200057238Abstract: A lens module includes a lens barrel, and a lens group having a first and second lenses. An image side surface of a first barrel wall includes a first planar surface, a first oblique surface obliquely extending from the first planar surface, and a second planar surface extending from the first oblique surface. An object side surface of a peripheral portion of the first lens includes a second oblique surface attached to the first oblique surface and a fourth planar surface attached to the second planar surface. An image side surface of the peripheral portion of the first lens includes a fifth planar surface, a third oblique surface obliquely extending from the fifth planar surface, and a sixth planar surface extending from the third oblique surface towards the optical axis. An object side surface of the second lens includes a seventh planar surface and a fourth oblique surface.Type: ApplicationFiled: August 2, 2019Publication date: February 20, 2020Inventor: Hailong Wang
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Publication number: 20200057239Abstract: A lens module is provided, including: a lens barrel first and second barrel walls; and a set of lenses received in the lens barrel including at least a first lens and a second lens arranged from an object side to an image side. The first lens includes a first optical portion and a first peripheral portion surrounding the first optical portion. A surface of the first barrel wall close to the image side includes a first planar surface extending horizontally towards an optical axis from a position where the first barrel wall is connected to the second barrel wall; a first oblique surface extending obliquely from the first planar surface towards the optical axis and towards the object side; and a second planar surface extending horizontally from the first oblique surface towards the optical axis.Type: ApplicationFiled: August 2, 2019Publication date: February 20, 2020Inventor: Jie Ma