Abstract: A printed circuit board includes: a first insulating layer; a via pad including a first layer embedded in the first insulating layer and a second layer disposed on the first layer; and a first via layer disposed on the via pad, wherein the second layer has a width decreasing in a direction away from the first layer in a stacking direction of the first and second layers.

Abstract: An interlayer connective structure is suitable for being formed in a wiring board, in which the wiring board includes two traces and an insulation part between the traces. The insulation part has a through hole. The interlayer connective structure located in the through hole is connected to the traces. The interlayer connective structure includes a column and a pair of protuberant parts. The protuberant parts are located at two ends of the through hole respectively and connected to the column and the traces. The protuberant parts stick out from the outer surfaces of the traces respectively. Each of the protuberant parts has a convex curved surface, in which the distance between the convex curved surface and the axis of the through hole is less than the radius of the through hole.

Abstract: A circuit board structure includes a substrate, a third dielectric layer, a fourth dielectric layer, a first external circuit layer, a second external circuit layer, a conductive through hole, a first annular retaining wall, and a second annular retaining wall. The conductive through hole penetrates through the third dielectric layer, a second dielectric layer, and the fourth dielectric layer. The conductive through hole is electrically connected to the first external circuit layer and the second external circuit layer. The first annular retaining wall is disposed in the third dielectric layer, surrounds the conductive through hole, and is electrically connected to the first external circuit layer and the first inner circuit layer. The second annular retaining wall is disposed in the fourth dielectric layer, surrounds the conductive through hole, and connects to the second external circuit layer and the second inner circuit layer electrically.

Abstract: An electronic apparatus includes an electronic panel including a plurality of pads, a circuit board including a plurality of leads, and a conductive adhesive member configured to electrically connect the circuit board and the electronic panel. The plurality of pads include a plurality of pixel pads, an arrangement pad, and a resistance measurement pad disposed between the arrangement pad and the pixels pads and insulated from the pixel pads. The plurality of leads include a plurality of pixel leads, an arrangement lead, and a resistance measurement lead disposed between the pixel leads and the arrangement lead and insulated from the pixel leads. The resistance measurement lead includes a plurality of resistance measurement leads disposed between the arrangement lead and the pixel leads and electrically connected with the resistance measurement pad, and a dummy lead spaced apart from the plurality of resistance measurement leads in a plan view.

Abstract: A hybrid double-sided power switch module comprises a double PCB assembly with switch dies and conductive spacers disposed at both sides of the double PCB assembly in different topologies. The gate connections of the switch dies are enhanced by spring pins soldered in the THVs formed through the PCBs in alignment with the gate terminals. MFCs are positioned at both sides of the double PCBs assembly in contact with the tops of the switch dies and conductive spacers with fuzz buttons serving as contacts between the MFCs and the switch dies and spacers. MFCs serve different functions including AC bus-bars, DC bus-bars, heat-sinks, and their combination. The module can withstand external stress and is fabricated by a simplified and inexpensive process requiring only two solder pastes.

Abstract: In a flexible printed wiring board (1), a first electrical conduction pattern (4) prepared on the first surface (3a) on which a bare chip (2) is mounted is prepared only inside a mounting region (3c) of the bare chip. Preferably, the first electrical conduction patterns (4) are prepared so as to avoid positions opposite to test electrodes (2b) which the bare chip comprises. Thereby, in the flexible printed wiring board used for mounting the bare chip, occurrence of malfunction resulting from electrical connection with a part other than a bump of the bare chip can be certainly prevented, and reliability of various devices using the bare chip can be improved.

Abstract: A method for manufacturing a flex inlay is provided. The method includes providing a flexible printed circuit having opposed surfaces. The method includes attaching components to a surface of the flexible printed circuit. The method includes applying a coverlay over at least one surface of the flexible printed circuit, wherein the coverlay is patterned to not cover any components attached to the surface of the flexible printed circuit. The coverlay at least in part forms an essentially planar surface of the flex inlay.

Abstract: An etching method for manufacturing a substrate structure having a thick electrically conductive layer, and a substrate structure having a thick electrically conductive layer are provided.

Abstract: The method for processing a substrate includes the substrate preparation step of preparing the substrate, the pattern formation step of forming dummy patterns extending in an X-direction on the substrate, the mask arrangement step of arranging a stencil mask having multiple opening patterns on the substrate, the coating formation step of forming a metal film on the substrate through the multiple opening patterns, and the separation step of separating the dummy patterns from the substrate to obtain a submount. The dummy pattern has protrusion formed such that a side surface of the submount is exposed and formed close to the side surface with a clearance.

Abstract: A method of manufacturing package structures includes providing a carrier including a supporting layer, a metal layer, and a release layer between the supporting layer and the metal layer at first. Afterwards, a composite layer of a non-conductor inorganic material and an organic material is disposed on the metal layer. Then, a chip embedded substrate is bonded on the composite layer. Afterwards, an insulating protective layer having openings is formed on the circuit layer structure and exposes parts of the circuit layer structure in the openings. Afterwards, the supporting layer and the release layer are removed to form two package substrates. Then, each of the package substrates is cut.

Abstract: A method, system, apparatus, and/or device with a miniaturized impedance sensor. The method, system, apparatus, and/or device may include a substrate with locally non-flexible regions interconnected by a flexible material and a miniaturized impedance sensor disposed on the substrate. The miniaturized impedance sensor may include: an array of electrical contacts; an array of miniaturized electrodes disposed on the array of electrical contacts; and an interstitial filler disposed within the array of miniaturized electrodes. The locally non-flexible regions may correspond to subsets of the array of miniaturized electrodes. The locally non-flexible regions may retain shape as the flexible material changes shape.

Abstract: A vehicle display assembly includes a display configured to graphically depict information. A printed circuit board (PCB) is in communication with the display. A carrier is clamped between the display and PCB to form an instrument cluster assembly. The carrier includes cooling fins.

Abstract: A wireless transmitting device comprising a base, a circuit module, a supporting member and a casing is provided. The base comprises a main body and an extending portion integrally connected with the main body. The main body has a cavity. The circuit module is partially accommodated in the cavity. The supporting member props the circuit module and connects with the extending portion. The casing connects with the extending portion or the supporting member and covers the extending portion, the circuit module and the supporting member.

Abstract: An electronic control device according to an embodiment of the present disclosure comprises a lower cover including a side wall with a first coupling portion and a second coupling portion; a circuit board arranged inside the side wall of the lower cover and having on the upper surface thereof a button; a middle cover provided with a third coupling portion coupled to the first coupling portion and a first button hole, and coupled to the lower cover by coupling of the third coupling portion to the first coupling portion; a button cover arranged on the upper surface of the middle cover, covering the first button hole, and having a protrusion portion; and an upper cover including a side wall provided with a fourth coupling portion coupled to the second coupling portion, the upper cover provided with a second button hole, and covering the button cover and the middle cover.

Abstract: A display device attachment structure comprises a plate member configured to be attached to a rear housing of a display device and to which a component of the display device is configured to be attached, a fastening member attached to the plate member for fixing the plate member to a back surface of the rear housing opposite a display surface of the display device via a fastening hole, and a fixing member attached to the plate member for fixing the plate member to the back surface of the rear housing, the fixing member being a different type of fastener than the fastening member.

Abstract: Disclosed herein is an electronic device. The electronic device includes a housing provided to accommodate a printed circuit board, a cover coupled to the housing, and including a coupling protrusion protruding to a side of the housing to be accommodated in the housing, and including a coupling hole formed in the coupling protrusion, a fastening pin arranged in the coupling hole and configured to couple to the housing, and a sealing member arranged between an inner wall forming the coupling hole and the fastening pin to seal the coupling hole. Various other embodiments are possible.

Abstract: The present invention provides a multi-directional multi-joint turning piece and a display device including the multi-directional multi-joint turning piece. The multi-directional multi-joint turning piece is configured to connect a first display module and a second display module to provide a first display module unfolded or folded with the second display module. The multi-directional multi-joint turning piece includes a first coupling piece, a first turning piece, a second turning piece, a third turning piece, and a second coupling piece, wherein the first coupling piece is connected to the first display module, the second coupling piece is connected to the second display module, the first coupling piece is pivoted to the first turning piece, the first turning piece is pivoted to the second turning piece, the second turning piece is pivoted to the third turning piece, and the third turning piece is pivoted to the second coupling piece.

Abstract: Certain embodiments of the disclosure relate to a device and a method for increasing the efficiency of an antenna of an electronic device that includes a rollable display. The electronic device may include: a processor; a first housing, in which the processor is disposed, including a first conductive portion; a second housing configured to slide in a first direction from the first housing and including a second conductive portion; a rollable display, at least a portion of which is exposed in a slide-out manner according to movement of the second housing; and a variable element disposed in the second housing and is electrically connected to the second conductive portion. The processor may adjust an electrical characteristic of the variable element in response to sliding of the second housing. The disclosure may further include various other embodiments.

Abstract: An electronic device is provided. The electronic device includes a housing, a flexible display configured to be at least partially drawn out of an internal space of the housing, and a rotation module configured to move the flexible display, wherein the rotation module may include a shaft including one end and another end each coupled to a support member included in the electronic device, a cylindrical housing drivingly connected to the flexible display and configured to be capable of performing a rotational motion about the shaft, a pair of cylindrical cams penetrated by the shaft and accommodated in the cylindrical housing, wherein the pair of cylindrical cams are configured to be capable of performing a linear motion on the shaft and positioned to be symmetrical to each other with respect to a center of the shaft, and a pair of guide pins coupled to the cylindrical housing.

Abstract: A display device includes: a display panel which displays an image; and a frame set disposed on a rear side of the display panel, where the frame set bends the display panel. The frame set includes a frame including a body extending in a longitudinal direction and a head protruding toward the rear side of the display panel from the body, and a wire fixed to the head and extending in a longitudinal direction of the frame.

Abstract: A display device according to an exemplary embodiment of the present disclosure includes a display panel having a display area, a back cover disposed on a rear surface of the display panel, a first roller which winds or unwinds the back cover and the display panel, and a second roller which is disposed above the first roller to move in a vertical direction, the back cover and the display panel being overlaid on the second roller. The emission area is flexibly adjusted during the partial view so as to suppress a burn-in issue and improve the lifespan of the display device.

Abstract: Provided display device includes at least one magnetic component, first display segment and second display segment connected to each other and foldable towards each other. The magnetic component includes first magnetic module located in non-display region of first display segment and second magnetic module located in non-display region of second display segment. The display device includes first folded state in which contact ends come into contact and second folded state in which the contact ends in contact for period of time. The attractive force A of the first magnetic module to the second magnetic module in the first folded state is smaller than the attractive force B thereof in the second folded state. The preceding solution can prevent the user's hands from being gripped when the user folds the display device and can ensure that the display device maintains stable folded state.

Abstract: An image pickup unit includes: a printed wiring board provided with an image pickup element and having a first electrode on a surface layer; a flexible wiring substrate having a base member having first and second faces, a conductive layer provided on the first face, and an insulating layer provided on the conductive layer, wherein the conductive layer has a second electrode in which the insulating layer is not provided to one longitudinal end part; a conductive connection member that connects the first electrode to the second electrode; and a reinforcement member provided on the base member on the second face side, wherein the reinforcement member continuously covers an end part of the insulating layer on a side closer to the second electrode and an end part of the conductive connection member on a side closer to the insulating layer of a portion connected to the second electrode.

Abstract: A state detection apparatus and method for a folding screen and a folding screen apparatus. The state detection apparatus includes: at least one connection assembly, including a first component and a second component, the first component and the second component being electrically conductively coupled or decoupled correspondingly according to a motion state of the folding screen; and a detection assembly electrically coupled to the connection assembly, and configured to detect a state of electrical conduction connection or disconnection between the first component and the second component and determine a state of the folding screen according to the state of electrical conduction connection or disconnection between the first component and the second component.

Abstract: An extendable cover for a portable electronic device including a first back panel having a first edge portion and a second back panel having a second edge portion. The first back panel and the second back panel being linearly slidable to move the first and second edge portions relative to each other along a sliding axis, wherein the first and second edge portions are opposite ends of the extendable cover along the sliding axis. The cover may include an electrical cable management arrangement having a rotatable hub disposed at the second back panel, and a hub-biasing mechanism coupled between the rotatable hub and the second back panel to bias the rotatable hub in a biased rotational direction to reel in a first electrical cable extending between the first back panel and the rotatable hub as the first and the second edge portions are moved towards each other.

Abstract: A quick releasing device, which is adapted to be fixed in or removed from a slot of a casing, is provided. The quick releasing device includes a frame, an arm and a handle. The frame has a hole. The arm is disposed at one side of the frame and a part of the arm corresponds to the hole. The handle is rotatably disposed at another side of the frame to rotate between a working position and a retracting position. The handle includes a pressing member whose position corresponds to the hole. The pressing member of the handle passes through the hole of the frame and pushes the arm when the quick releasing device is inserted into the slot of the casing and the handle is rotated from the working position to the retracting position, deforming the arm and interfering with a wall surface of the casing beside the slot.

Abstract: An electrical device includes a connection part and a cover part connected to the connection part. A mounting part is accommodated and situated in the connection part, and a first circuit board is connected to the mounting part in a coded manner. A second circuit board is situated in the cover part, which is connected to a frame part in a coded manner. The first circuit board is connected to a plug connector part, and the second circuit board is connected to a mating plug connector part. A leading guide for a plug connection is provided on the mounting part, which becomes active when the cover part is connected to the connection part. The frame part being able to be connected to the mounting part in a coded manner.

Abstract: A system includes a housing and a first circuit board positioned inside the housing. The housing has top, bottom, left side, right side, front, and rear panels. The first circuit board has a length, a width, and a thickness, and the first circuit board has a first surface defined by the length and the width. The first surface of the first circuit board is substantially parallel to the front panel or at a second angle relative to the front panel in which the second angle is less than 60°. The system includes a first data processing module and a first optical interconnect module both electrically coupled to the first circuit board. The optical interconnect module is configured to receive first optical signals from a first optical link, convert the first optical signals to first electrical signals, and transmit the first electrical signals to the first data processing module.

Abstract: A support frame includes first and second mounting members, and an adjusting member. The second mounting member defines a groove. One groove wall of the groove defines a plurality of positioning holes. The adjusting member includes a base body, a sliding member, and an elastic member. The base body is disposed on the first mounting member, and at least a part of the base body is accommodated in the groove. The sliding member is slidably disposed on the base body and includes a clamping body. The elastic member is disposed on the sliding member, and the elastic member can drive the sliding member to engage the clamping body with one of the plurality of positioning holes. When the support frame is in a cabinet, an interior installation size of the cabinet is adjustable for any particular relative position between the first and second mounting members.

Abstract: A universal mounting system is provided for use in connection with substantially any type of electronic equipment so was to reduce or substantially avoid the need for rail kids or other mounting assemblies that are its equipment specific for mounting equipment to racks. In one implementation, a uniform mounting system (101) includes a number of rail and slider assemblies (112). Each of the rail and slider assemblies includes a slider that is slightly mounted on a support rail. Each of the slider is includes mounting flange is and brackets for mounting the slider to a piece of equipment. The mounting flanges 116 that's collectively define a segmented vertical rail. A safety stop mechanism can be used to define very a offset figurations of the equipment with respect to a front end of the rack.

Abstract: The present disclosure provides a method of standardizing the construction of a power distribution device that includes power conveying wires, a plurality of receptacles, a power conveying flexible bus assembly, a plurality of power connection boards, a plurality of circuit breakers, a standardized receptacle module carrier, and a customized cover. The standardized receptacles and the receptacle printed circuit boards are configured into modules arranged and aligned about the standardized receptacle module carrier. The standardized receptacle module carrier is attached to the standardized common chassis. A customized cover is attached to the standardized common chassis.

Abstract: A computational heat dissipation structure includes a circuit board including a plurality of heating components; and a radiator provided corresponding to the circuit board; wherein a space between the adjacent heating components is negatively correlated with heat dissipation efficiency of a region where the adjacent heating components are located. Since the space between the adjacent heating components of the disclosure is negatively correlated with the heat dissipation efficiency of the region where the adjacent heating components are located, i.e., the higher the heat dissipation efficiency of the region where the adjacent heating components are located is, the smaller the space between the adjacent heating components in the region will be, the heat dissipation efficiencies corresponding to the heating components are balanced, and load of a fan is reduced.

Abstract: Particular embodiments described herein provide for an electronic device that includes a fan. The fan can include a center shaft, fan blades that extend from the center shaft, and a plurality of magnets on an outside portion of at least two of the fan blades, where stator coils interact with the magnets to drive the blades around the center shaft. The center shaft and fan blades are a single component from the same material. In some examples, the center shaft and fan blades were created using a metal injection molding process.

Abstract: A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid cool the computer components. Advantageously, a pH indicator is employed to monitor the acidity of the dielectric fluid via, for example, a color change.

Abstract: Systems and methods for providing an electronic cooling apparatus comprising a chassis having an internal space that is sized/shaped to receive/structurally support circuit card(s). The internal space defined by sidewalls with a channel formed therein in which a coolant is disposed. The coolant is in thermal communication with the circuit card(s) via the sidewall(s) when the circuit card(s) is(are) disposed in the chassis. A refrigerant-based cooling system is disposed in the chassis and comprises an evaporator having inlet/outlet ports coupled to the channel of the chassis to define a first closed-loop channel for the coolant within the chassis. The evaporator facilitates heat transfer from the coolant to a refrigerant flowing through a second closed-loop channel of the chassis at least partially defined by the evaporator. A pump is disposed in the chassis and configured to cause the coolant to flow through the first closed-loop channel.

Abstract: An electronic assembly may include a chassis having electronic module mounting positions, each having a chassis cooling gas passageway and an electronic module received in each electronic module mounting position. A sealing retainer may be coupled between the chassis and each electronic module, and includes a cooling gas passageway aligned with the chassis cooling gas passageway and a module cooling gas passageway of a respective electronic module. The sealing retainer may include a retainer body, and a gas seal body coupled to the retainer body and movable between retracted and extended positions. The gas seal body in the retracted position permits insertion and removal of the electronic module, and in the extended position seals against the electronic module.

Abstract: A data rack system includes a data center rack frame, a shelf positioned within the data center rack frame; and a modular battery unit disposed on the shelf. The modular battery unit further includes a housing having an outer surface, a plurality of strips of phase change material (“PCM”) attached to the outer surface and spaced apart from one another; and air flow channels. The air flow channels are formed in spaces between two adjacent strips of the plurality of strips and defined by a shape and size of the spaces between the two adjacent strips.

Abstract: A cooling system for a datacenter is disclosed. The datacenter cooling system includes a refrigerant cooling loop to extract heat from a secondary cooling loop that is located within the datacenter or to provide supplemental cooling to one or more components of the datacenter that are coupled to the secondary cooling loop.

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a sensor string is associated with a first fluid line having a first flow controller and with a second fluid line having a second flow controller, so that sections of such a sensor string are enabled to maintain electrical connectivity there through by a mechanical coupling of a first flow controller and a second flow controller.

Abstract: A power electronic assembly includes a power electronic module having multiple of power electronic components and a cooling element. The cooling element is attached to a surface of the power electronic module and is arranged to transfer heat from the power electronic assembly to a cooling medium, wherein the assembly comprises multiple of vapour chambers arranged to transfer the heat generated by the multiple of power electronic components.

Abstract: A curved electronic device and a method for manufacturing the same are disclosed. The curved electronic device includes a substrate, a component layer, and a modulation layer. The component layer is disposed on the substrate. The component layer is composed of a plurality of electronic components and their connecting wiring arranged on the substrate. The modulation layer is disposed on the component layer, and includes at least one pattern area and at least one blank area that are formed on the component layer. The blank area allows one part of the electronic components to be exposed out of the modulation layer. The modulation layer and the substrate have different heat absorption rates, so that the positions of the substrate corresponding to the blank area and the pattern area have different degrees of softening, so as to prevent the component layer from being damaged in the process of stretching the substrate.

Abstract: A computing component is described. The computing component includes a cosmetic prefabricated sheet of material. In some embodiments, the cosmetic prefabricated sheet of material may have a cosmetic surface and a protrusion surface. The computing component includes a protrusion extending from the protrusion surface of the cosmetic prefabricated sheet of material. In some embodiments, the cosmetic surface of the cosmetic prefabricated sheet of material is uniform in appearance to the naked eye. In some embodiments, the protrusion may have a base and an end. The base may have a cross-sectional width and the end may have a cross-sectional width. A difference in the cross-sectional width of the base and the cross-sectional width of the end may be less than 250 microns.

Abstract: The present application provides a display device comprising: a display panel including a display region and a non-display region, wherein the non-display region includes first and second fan-out regions and a bending region; an optical functional film layer formed in the display region and the first fan-out region; an adhesive layer formed on the optical functional film layer; and a protective layer located in the bending region and with a gap with the optical functional film layer, and an end of the adhesive layer extends beyond the optical functional film layer and is connected to the protective layer, and the adhesive layer covers the optical functional film layer, the gap, and part of the protective layer.

Abstract: In an embodiment a device comprising for shielding electromagnetic radiation includes a lower protector mountable on a vehicle body, a conductive shielding structure mountable on the lower protector and conductively connectable to the vehicle body, a conductive shielding net wrapped around and attached to an outer surface of a high voltage wiring, the conductive shielding net attachable and conductively connectable with the conductive shielding structure and an upper protector attachable to the lower protector and configured to press the conductive shielding net to the conductive shielding structure.

Abstract: Cables, cable connectors, and support structures for cantilever package and/or cable attachment may be fabricated using additive processes, such as a coldspray technique, for integrated circuit assemblies. In one embodiment, cable connectors may be additively fabricated directly on an electronic substrate. In another embodiment, seam lines of cables and/or between cables and cable connectors may be additively fused. In a further embodiment, integrated circuit assembly attachment and/or cable attachment support structures may be additively formed on an integrated circuit assembly.

Abstract: Various implementations described herein are related to a device having multiple transistors that are arranged as a bitcell. The multiple transistors may include multiple P-type transistors that are arranged in a P-over-P stack configuration, and the multiple transistors may include multiple N-type transistors that are arranged in an N-over-N stack configuration.

Abstract: Provided is a static random-access memory (SRAM) device.

Abstract: Embodiments of present invention provide a SRAM device. The SRAM device includes a first, a second, and a third SRAM cell each having a first and a second pass-gate (PG) transistor, wherein the second PG transistor of the second SRAM cell and the first PG transistor of the first SRAM cell are stacked in a first PG transistor cell, and the first PG transistor of the third SRAM cell and the second PG transistor of the first SRAM cell are stacked in a second PG transistor cell. The first and second PG transistors of the first SRAM cell may be stacked on top of, or underneath, the second PG transistor of the second SRAM cell and/or the first PG transistor of the third SRAM cell.

Abstract: A method includes forming a first transistor including forming a first gate stack, epitaxially growing a first source/drain region on a side of the first gate stack, and performing a first implantation to implant the first source/drain region. The method further includes forming a second transistor including forming a second gate stack, forming a second gate spacer on a sidewall of the second gate stack, epitaxially growing a second source/drain region on a side of the second gate stack, and performing a second implantation to implant the second source/drain region. An inter-layer dielectric is formed to cover the first source/drain region and the second source/drain region. The first implantation is performed before the inter-layer dielectric is formed, and the second implantation is performed after the inter-layer dielectric is formed.

Abstract: The present application provides a method of manufacturing a memory device having a word line (WL) with improved adhesion between a work function member and a conductive layer. The method includes steps of providing a semiconductor substrate defined with an active area and including an isolation structure surrounding the active area; forming a recess extending into the semiconductor substrate and across the active area; forming a first insulating layer conformal to the recess; disposing a first conductive material conformal to the first insulating layer; forming a conductive member surrounded by the first conductive material; disposing a second conductive material over the conductive member and removing a portion of the first conductive material above the second conductive material to form a conductive layer enclosing the conductive member; and forming a second insulating layer over the conductive layer and conformal to the first insulating layer.