Abstract: A thermal lens set includes an imaging lens group including an inner lens group and an outer lens group. The outer lens group includes at least one outer lens element. A heater is used to heat the imaging lens group and includes at least two portions. One of the at least two portions is in direct contact with the imaging lens group. A lens barrel is used to accommodate another one of the at least two portions.

Abstract: A wavefront manipulator includes a first optical component and a second optical component arranged one behind the other along a reference axis. The first optical component and the second optical component are arranged movably relative to one another in a plane perpendicular to the reference axis. The first optical component and the second optical component each include a first optical element having at least one freeform surface, a refractive index m and an Abbe number v1, and a second optical element having at least one freeform surface, a refractive index n2 and an Abbe number v2, which are arranged one behind the other along the reference axis, the Abbe numbers v1 and v2 differing from one another (v1?v2).

Abstract: An optical system and a head mounted display are disclosed. The optical system comprises: a third lens, a second lens and a first lens arranged successively along a propagation direction of incident light. There are two adjacent Fresnel surfaces in the optical system, and at least one of the Fresnel surfaces has a curved base. The present disclosure provides a solution of short-focus and lightweight optical structure, in which, compared with a flat base, the use of Fresnel surface having a curved base can improve the imaging quality to a certain extent, and can reduce the total optical length and the total weight of the optical system.

Abstract: An optical lens module includes a lens element and an adjustable aperture module disposed at object side of the lens element, and the adjustable aperture module includes a blade assembly and a driving component. The blade assembly includes rotatable blades disposed around an optical axis of the lens element to form a light passing aperture. Each rotatable blade includes a rotatable portion and a light blocking portion. The light blocking portion extends and tapers away from the rotatable portion. The rotatable portion has a positioning hole and a dynamic hole. The positioning hole enables rotation of the rotatable blade, and the dynamic hole is disposed close to the positioning hole. The driving component includes a rotatable element corresponding to the dynamic holes to rotate the rotatable blades, to thereby vary aperture size. The light blocking portion includes a protruding segment which extends and tapers toward the light passing aperture.

Abstract: An optical element includes a holographic pinhole array. The holographic pinhole array includes a plurality of holographic pinhole grating sets. The holographic pinhole grating sets are configured to diffract light incident on the optical element into a plurality of light beams respectively. Each of the light beams has a field of view.

Abstract: Disclosed herein is an optical accessory identification system and device comprising a plurality of camera filters having a ring. The ring includes an inside rim, an attachment, and an indicator. The inside rim is connected to a top portion of the ring. The attachment is connected to an underside portion of the ring. The one or more indicators are disposed on the ring. The system may include a second optical accessory device with distinct identifiers.

Abstract: A manufacturing method of a liquid crystal optical element includes preparing a liquid crystal film having a cholesteric liquid crystal, preparing a transparent substrate in which at least a material forming a main surface is an inorganic material, applying a solution containing a silane coupling agent to the main surface of the transparent substrate, stacking the liquid crystal film on the silane coupling agent, and heating the silane coupling agent.

Abstract: There is provided a polarizing plate comprising a polarizing film with a thickness of 20 ?m or less, wherein the amount of a non-oriented amorphous part in the polarizing film is 55 to 70%. Here the amount of an oriented crystalline part in the polarizing film is preferably 10 to 15%. By thermoforming the polarizing plate, there can be provided a thermoformed article having sufficient polarization performance and free from cracks even with a large deformation amount during thermoforming.

Abstract: An optical laminate having a barrier layer having excellent adhesiveness to a pressure sensitive adhesive layer, a polarizing plate, and an image display device. The optical laminate has a film substrate, a barrier layer, and a pressure sensitive adhesive layer in this order, in which the barrier layer is formed of a composition for forming a barrier layer, containing a monomer having a polymerizable group, and satisfies Condition 1: a functional group that reacts with a hydroxyl group to form a covalent bond is present on a surface of the barrier layer on a pressure sensitive adhesive layer side and Condition 2: no hydroxyl group other than the hydroxyl group included in the functional group is present in a region from the surface of the barrier layer on the pressure sensitive adhesive layer side to a half of a thickness of the barrier layer.

Abstract: An optical device includes a first waveguide, having parallel first and second faces and parallel third and fourth faces forming a rectangular cross-section, that guides light by four-fold internal reflection and is associated with a coupling-out configuration that couples light out of the first waveguide into a second waveguide. The first or second face is subdivided into first and second regions having different optical characteristics. The optical device also includes a coupling-in configuration having a surface that transmits light into the first waveguide. The surface is deployed in association with a portion of the third or fourth face adjoining the second region such that an edge associated with the surface trims an input collimated image in a first dimension, and a boundary between the first and second regions trims the input collimated image in a second dimension to produce a trimmed collimated image that advances by four-fold internal reflection.

Abstract: A backlight module is configured to illuminate at least one key cap. The backlight module includes a light emitting unit, a light guide plate and a lighting board. The light guide plate has a light guide plate hole for accommodating the light emitting unit. The lighting board has at least one pair of pads connected to the light emitting unit respectively. The lighting board includes a first reflective layer surrounding the light emitting unit and at least partially covering the at least one pair of pads. Each of the at least one pair of pads has a plurality of branches and at least one hollow area. The at least one hollow area overlaps with at least one part of the light emitting unit. At least one lighting area is located between the at least one pair of pads.

Abstract: According to one embodiment, a display device includes a first transparent substrate, a second transparent substrate, a liquid crystal layer, a third transparent substrate having a first side surface, a second side surface, and an inner surface, a transparent layer arranged on the inner surface, and light emitting elements. The transparent layer includes a band-shaped portion extending from the first side surface toward the second side surface and a frame-shaped portion formed in a frame shape surrounding the band-shaped portion. The band-shaped portion is separated from the frame-shaped portion. A width of the band-shaped portion on a first side surface side is larger than a width of the band-shaped portion on a second side surface side.

Abstract: An optical construction includes an optical film between first and second prismatic films, which each include pluralities of parallel, linear first and second prisms. Each of the first and second prisms have opposing first and second sides extending from first and second ends of a base of the prism and meeting at a peak. The first and second sides make first and second base angles with the base of the prism. The peaks of the prismatic films face away from each other and the optical film. For a collimated, normally incident light, for at least a first wavelength in a first wavelength range, and for each of first and second polarization states: the optical film has an optical transmission of less than about 1%, and the optical construction transmits at least 1% of the incident light at an oblique angle greater than 5 degrees with respect to the optical film.

Abstract: A glass wafer for manufacturing a light guide plate, the glass wafer including: a glass part in a thin sheet shape; and a diffractive optical element part on two main surfaces of the glass part, in which one main surface of the glass part has an area of 1950 mm2 or greater, the glass part has a thickness of 3.0 mm or less, and the glass part has a Young's modulus of 100 GPa or greater.

Abstract: An electronic device is provided, including a housing, a circuit board, an infrared generator, and a light guide member. The housing is provided with a light-transmitting hole and an accommodating cavity for accommodating the circuit board, the infrared generator, and the light guide member. The infrared generator is mounted on the circuit board. The light guide member includes a light incident surface and a light exit surface. The light guide member is at least partially arranged in the light-transmitting hole. The light incident surface and the light exit surface are arranged in a staggered manner. The light incident surface is arranged corresponding to the infrared generator, and the light incident surface is an aspherical curved surface. Infrared light emitted by the infrared generator emits outward through the light guide member.

Abstract: Backlight module and display device are provided. Backlight module is for providing light source for display panel. Display panel has bonding side at a side of display panel in first direction. Backlight module includes: back plate, including base plate at backlight side of display panel, and first side plate at bonding side, where a side of first side plate away from base plate is bent towards direction away from center of base plate to form top plate supporting display panel; rubber frame, including second side plate at bonding side, where first opening is in middle of second side plate in extension direction of second side plate to accommodate first side plate; main circuit board, including opposite first and second ends in first direction, where first end is inserted between top plate and first side plate, and second end has first bonding area for bonding connection with display panel.

Abstract: The present disclosure provides an aerosol delivery device. The aerosol delivery device comprises one or more rechargeable batteries, charging circuitry including an electrical connector configured to interconnect the one or more rechargeable batteries with a power supply, and a sensor configured to detect an action of using the aerosol delivery device by a user and output a signal. The aerosol delivery device also comprises a microprocessor coupled to the charging circuitry and the sensor, the microprocessor, in response to receiving the signal from the sensor, is configured to control the aerosol delivery device to allow vaping or puffing by a user while the aerosol delivery device is connected to a charger.

Abstract: A light receiving module is provided, including a beam contraction module, a multi-core multi-mode waveguide, and a detector. The beam contraction module is configured to receive a first optical signal, and contract a mode spot of the first optical signal, to obtain a second optical signal. The multi-core multi-mode waveguide includes a cladding layer and N waveguides. The multi-core multi-mode waveguide is configured to: receive the second optical signal, and concentrate energy of the second optical signal in a plurality of waveguides of the N waveguides, to obtain a plurality of third optical signals. A plurality of sub-detectors are in one-to-one correspondence with the plurality of third optical signals. The plurality of sub-detectors are configured to receive the plurality of third optical signals, to obtain a plurality of electrical signals based on the plurality of third optical signals.

Abstract: A terminated hollow-core optical fiber includes a capillary, a hollow-core optical fiber including a structured cladding, and an endcap. A first end of the hollow-core optical fiber terminates inside the capillary a non-zero distance away from a first end face of the capillary. The hollow-core optical fiber is adhered to the capillary at a second end face of the capillary where the hollow-core optical fiber extends out of the capillary. The endcap is fused to the first end face of the capillary. The endcap has a larger diameter than the first end of the hollow-core optical fiber. This termination scheme does not require fusing the hollow-core fiber itself to the endcap or any other part. Therefore, this termination scheme is applicable to hollow-core fibers with a structured cladding that cannot tolerate the temperatures associated with fusing the hollow-core fiber to another part.

Abstract: An optical waveguide device includes an optical waveguide substrate including a first cladding layer disposed on a support, a core layer disposed on the first cladding layer, and a second cladding layer selectively covering the core layer, and a silicon photonic chip including a silicon substrate and a silicon waveguide disposed on one side of the silicon substrate, wherein part or all of a thickness of one end of the silicon waveguide is embedded in the core layer exposed from the second cladding layer, wherein a thickness of the core layer in a place covered with the silicon substrate is less than that of the core layer in a place not covered with the silicon substrate, and wherein a width of the core layer at a point of contact with the silicon substrate is wider than that of the core layer in a place covered with the second cladding layer.

Abstract: An optical receiver includes: a support base; a waveguide-type light receiving element fixed to a surface of the support base; and an optical circuit element fixed to the surface of the support base, wherein the waveguide-type light receiving element includes: a semi-insulating semiconductor substrate; a light absorbing layer formed on one main surface of the semiconductor substrate and has a pair of joint surfaces perpendicular to the one main surface of the semiconductor substrate and an incident end face on which light is incident and which has facing end sides of the joint surfaces as a pair of opposite sides, the incident end face having a layer thickness longer than a layer width; an n-type semiconductor layer joined to one of the joint surfaces of the light absorbing layer, and a p-type semiconductor layer joined to the other of the joint surfaces of the light absorbing layer.

Abstract: A device includes a photonic routing structure including a silicon waveguide, photonic devices, and a grating coupler, wherein the silicon waveguide is optically coupled to the photonic devices and to the grating coupler; an interconnect structure on the photonic routing structure, wherein the grating coupler is configured to optically couple to an external optical fiber disposed over the interconnect structure; and computing sites on the interconnect structure, wherein each computing site includes an electronic die bonded to the interconnect structure, wherein each electronic die of the computing sites is electrically connected to a corresponding photonic device of the photonic devices.

Abstract: A photonic integrated circuit (PIC) with a first structure of a ordinary optical material is enhanced with a second structure of a nonlinear optical material. The second structure provides or enhances nonlinear optical effects within the PIC. The first structure and the second structure may be in distinct layers. The first structure may be directly over and in contact with the second structure. Alternatively, the first structure and the second structures may be evanescently coupled while being vertically separated by a layer of cladding material. Lateral spacing may be used in combination with vertically spacing to precisely control a degree coupling between the first structure and the second structure.

Abstract: A dual ring resonator including a base substrate, and a silicon oxide layer positioned on the base substrate having a first waveguide, a primary ring resonator optically coupled to the first waveguide, a second waveguide, and a secondary ring resonator optically coupled to the primary ring resonator and the second waveguide. The dual ring resonator further includes at least one heater disposed partially on the primary ring resonator, and a trench within at least the silicon oxide layer and surrounding at least a portion of the first waveguide and the second waveguide.

Abstract: In part, in one aspect, the disclosure relates to a photodiode. The photodiode may include a substrate; a semiconductor layer comprising an semiconductor material, the semiconductor layer disposed on the substrate and in communication with at least a region of the substrate, the semiconductor layer having a first side, a second side, and an upper surface, the semiconductor layer having a height; a semiconductor structure partially disposed on the upper surface, the semiconductor structure comprising at least one elongate portion that extends beyond the first side and along a portion of the upper surface of the semiconductor layer; and a metal contact that is in electrical connection with the elongate portion of the semiconductor structure.

Abstract: Some implementations described herein include a photonics integrated circuit device including a photonics structure. The photonics structure includes a waveguide structure and an optical attenuator structure. In some implementation, the optical attenuator structure is formed on an end region of the waveguide structure and includes a metal material or a doped material. In some implementations, the optical attenuator structure includes a gaussian doping profile within a portion of the waveguide structure. The optical attenuator structure may absorb electromagnetic waves at the end of the waveguide structure with an efficiency that is improved relative to a spiral optical attenuator structure or metal cap optical attenuator structure.

Abstract: Embodiments described provide for waveguide combiners with phase matching regions. The waveguide includes one or more gratings. The one or more gratings includes grating structures disposed over a waveguide substrate. A phase matching region is disposed over the waveguide substrate between the one or more gratings and a waveguide region. The phase matching region includes a waveguide layer having a thickness varying from a first end to a second end of the waveguide layer, or a plurality of structures having depths therebetween. The one or more of the depths are different from each other, or at least two or more structures of the plurality of structures have a first duty cycle different than a second duty cycle of the plurality of structures.

Abstract: An optical connection structure includes a first optical waveguide and a second optical waveguide. The first optical waveguide is a rib-type optical waveguide including a core and a slab by a rib. Also, the first optical waveguide is formed in an optical connection region on a substrate. The second optical waveguide is formed on the substrate. The second optical waveguide includes an Si core made of Si. The second optical waveguide is disposed on the substrate in the optical connection region to overlap the first optical waveguide in a height direction.

Abstract: An integrated optical device includes a substrate, a waveguide structure and a grating structure. The substrate has a waveguide region and a grating region adjacent to each other. The waveguide structure is disposed on the substrate in the waveguide region. The grating structure is disposed on the substrate in the grating region. In some embodiments, the grating structure includes grating bars and grating intervals arranged alternately, and widths of the grating bars of the grating structure are varied.

Abstract: An optical component, an optical module, and a communication device are provided. The optical component includes a chip (11), a fiber array unit (12), and at least one fastener (13). The fiber array unit (12) is located on a side of the chip (11), the fiber array unit (12) includes at least one optical fiber (121), at least one waveguide (141) is disposed on a surface of the chip (11), and matching glue is filled between an end face of the waveguide (141) and an end face of the optical fiber (121). One end of the fastener (13) is bonded to the chip (11) by using fastening glue, and the other end is bonded to the fiber array unit (12) by using the fastening glue. Bonding strength of the fastening glue is greater than bonding strength of the matching glue.

Abstract: Structures including a cavity adjacent to an edge coupler and methods of forming such structures. The structure comprises a semiconductor substrate including a cavity with a sidewall, a dielectric layer on the semiconductor substrate, and an edge coupler on the dielectric layer. The structure further comprises a fill region including a plurality of fill features adjacent to the edge coupler. The fill region includes a reference marker at least partially surrounded by the plurality of fill features, and the reference marker has a perimeter that surrounds a surface area of the dielectric layer, and the surface area overlaps with a portion of the sidewall of the cavity.

Abstract: An optical coupler is provided. The optical coupler includes: a first optical structure, and a second optical structure disposed over the first optical structure. The first optical structure includes: a first substrate, a first cladding layer disposed on the first substrate, and a first waveguide disposed on the first cladding layer. The first waveguide includes a first coupling portion, and the first coupling portion including a first taper part. The second optical structure includes: a second substrate, a dielectric layer disposed on the second substrate; and a second waveguide disposed on the dielectric layer. The second waveguide includes a second coupling portion, and the second coupling portion including a second taper part. The second taper part is disposed on and optically coupled with the first taper part, and a taper direction of the first taper part is the same as a taper direction of the second taper part.

Abstract: Provided in the present disclosure are a grating structure, a preparation method thereof and a display device. The preparation method of the grating structure includes: forming a plurality of first convex structures arranged in a first direction; and forming a first rubber material at least covering the plurality of first convex structures, and forming the grating structure including a plurality of second convex structures by using convex structures including the first convex structures and the first rubber material, wherein a surface of the first rubber material facing away from the first convex structures is a flat surface, and the convex structures including the first convex structures and the first rubber material are in one-to-one correspondence with the second convex structures, shapes of cross sections of the second convex structures in the first direction are triangles, and the second convex structures have at least one inclined flat surface.

Abstract: A coupling system includes an optical fiber configured to carry an optical signal. The coupling system further includes a grating on a first side of a semiconductor layer, wherein the grating is configured to receive the optical signal. The coupling system further includes an interconnect structure over the grating on the first side of the semiconductor layer, wherein the interconnect structure defines a cavity aligned with the grating. The coupling system further includes a first polysilicon layer on a second side of the semiconductor layer, wherein the second side of the semiconductor layer is opposite to the first side of the semiconductor layer.

Abstract: Disclosed are apparatus and methods for optical coupling.

Abstract: A double flexible optical circuit includes: a flexible substrate supporting a plurality of optical fibers; a first connector terminating the optical fibers at a first end of the double flexible optical circuit; and a second connector terminating the optical fibers at a second end of the double flexible optical circuit. Each of the optical fibers is positioned in one of a plurality of separate extensions formed by the flexible substrate as the optical fibers extend from the first connector to the second connector. The first and second connectors are configured to be tested when the first and second connectors are connected through the double flexible optical circuit. The double flexible optical circuit is configured to be divided in half once the testing is complete to form two separate flexible optical circuits.

Abstract: An optical connector comprises one or more optical cables disposed within a housing. Each optical cable includes an array of at least one optical waveguide and at least one optical ferrule attached to the array of optical waveguides. The housing includes a first housing portion and a second housing portion engaged with the first housing portion. The second housing portion comprises at least one carrier and one frame. The carrier and frame of the second housing portion are configured to support the one or more optical cables. The first housing portion and the second housing portion are configured such that mechanical engagement of the first housing portion with the second housing portion moves the carrier relative to the frame. Movement of the carrier relative to the frame causes a bend in each optical waveguide and rotation of each ferrule. The bend provides a predetermined spring force of the optical waveguides at a predetermined angle of the ferrule.

Abstract: A fiber optic ferrule push includes a main body extending between a front end and a rear end, the main body having a central opening extending between the front end and the rear end to receive a plurality of optical fibers therethrough, a front facing surface configured to engage a rear surface of a fiber optic ferrule, and at least one projection extending outward from the main body to engage a housing configured to receive the fiber optic ferrule, the fiber optic ferrule push may also include a key extending outward from a surface of the main body. The fiber optic ferrule push may be paired with a fiber optic ferrule in a fiber optic assembly.

Abstract: An apparatus for collimating or focusing a coherent light beam without beam misalignment or beam focal point drift due to thermal deformation. The apparatus includes an optical component made of a material having an optical coefficient of thermal expansion and an optomechanical component having an optical support configured to hold the optical component. The optical support is made of a material having an optomechanical coefficient of thermal expansion, wherein the optical coefficient of thermal expansion and the optomechanical coefficient of thermal expansion are selected such that the optical component and the optomechanical component expand or contract as a single entity under varying temperatures.

Abstract: An opto-electronic assembly includes a substrate having a plurality of first optical waveguides, a cradle, and a first cover encapsulating at least portions of the first optical waveguides and the cradle. The cradle is bonded to the substrate and defines a pocket therein having an opening. The pocket is configured to receive an optical ferrule through the opening and align the optical ferrule to the first optical waveguides. The first cover includes an aperture exposing the opening of the pocket, such that when the optical ferrule is received in the pocket through the opening and secured therein and a plurality of second optical waveguides are attached to the optical ferrule, the opto-electronic assembly is configured to transfer light between the pluralities of first and second optical waveguides.

Abstract: The optical communication cable includes an optical cord, a connector, a first housing, a second housing, and a resin for fixing the optical cord. An end portion of the optical cord for connection to the connector has a first end region and a second end region. A tip portion of the plastic optical fibers in the first end region is connected to the connector. The resin is disposed so as to be in contact with the end portion of the optical cord and the second housing. Expression is satisfied: t ? 1 ? t ? 2 + 5 ( 1 ) where t1 is the coefficient of linear expansion of the resin and t2 is the coefficient of linear expansion of the plastic optical fibers.

Abstract: A connector assembly includes a guiding shield cage, a side cover plate, a light guide member and a first assembling construction. The guiding shield cage has a side wall. The side cover plate is assembled to the side wall of the guiding shield cage. The light guide member has a plurality of light guiding pipes. Each light guiding pipe has a light inputting end and a light outputting end. The light guide member is assembled on the side cover plate. The first assembling construction is provided between the light guide member and the side cover plate and is used to assemble the light guide member on the side cover plate.

Abstract: Method and apparatus for vision assisted optical alignment. In the apparatus, one or more main waveguides of a photonic integrated circuit (PIC) are selected, and respective one or more corresponding auxiliary waveguides are terminated with a respective scattering structure. The scattering structures deflect externally supplied light out of the PIC for detection by a camera or photo detector to provide feedback on the amount of light coupled into the main waveguides during the optical alignment process. The method and apparatus eliminate the need to power up the PIC circuitry, speed up the subsequent alignment process, and allow control and failure analysis of multiple channels at once.

Abstract: An optical module for modifying a light beam, wherein the optical module is made of a single-piece solid body material and has a passage surface for receiving the light beam. Furthermore, the optical module comprises a beam deflecting region lying opposite the passage surface for deflecting the light beam, wherein the beam deflecting region is designed as a curved region on the exterior of the optical module, in particular so as to have a hollow mirror function, a pass-through surface for outputting the light beam deflected by the beam deflecting region and a beam shaping region that is designed to shape the light beam and additionally or alternatively thereto the deflected light beam such that the light beam has a beam profile a with homogeneous intensity distribution over a specified range.

Abstract: A system including a device configured to be partially inside of a target object (and to remain affixed to such object substantially irremovably and in an unchanged orientation with respect to such object at least on a time-scale comparable to term of life or use of the target object itself) to provide chronic access to an internal object location from an outside location and communication with such location along multiple communication channels that are spatially separate and substantially immovable with respect to one another while remaining moveable together and synchronously with the object. Delivery of electromagnetic energy and a material stimulus along the first and second communication channels is carried out such as to necessarily maintain unchanged mutual spatial positioning and orientation between the channels regardless of whether the channels are being used or not and regardless of whether the target object—together with these channels—is spatially repositioned.

Abstract: The present invention relates to a dual XGS-PON Small Form-Factor Pluggable Plus optical module, projected to provide connection to two SC optical fiber connectors, and to be incorporated in any state of the art SFP plus transceiver host to allow double XGS-PON-OLT channels. The module comprises a case housing a specific set of technical elements such as bidirectional optical subassemblies, high-speed electrical interface, and all the necessary electronic circuits, printed circuit board and flex-printed circuit board to ensure proper assembly and electronic performance of all elements.

Abstract: A structure includes an integrated circuit (IC) chip including a substrate. An input/output (I/O) opening extends inwardly from an exterior surface of the IC chip. A metal finger structure protrudes partly into the I/O opening, and outer surfaces of the metal finger structure are covered by a moisture barrier. The metal finger structure may provide stress-relief by removing attacking surfaces for stress in the I/O opening and/or otherwise reduces stress, such as film stresses, to reduce damage to the moisture barrier and improve reliability compared to conventional devices.

Abstract: In a method, a stacked structure including an electronic integrated circuit (IC) and a photonic IC is bonded to a heat spreader releasably attached to a carrier. A first multilayer structure is sequentially deposited and patterned over the stacked structure to form, in the first multilayer structure, a first waveguide optically coupled to the photonic IC. A redistribution structure is sequentially deposited and patterned over the first multilayer structure, the redistribution structure electrically coupled to the photonic IC. The carrier is detached from the heat spreader.

Abstract: The present invention is directed to semiconductor devices and packages. According to an exemplary embodiment, one or more substrate extensions are coupled to a base substrate, with portions of one or more substrates extending beyond the base substrate. Electrical and/or optical connections are connected to these substrate extensions. There are additional embodiments as well.

Abstract: A photonic integrated circuit (PIC) is adapted to an optical transmitter. The optical transmitter includes a printed circuit board (PCB), a photonic integrated circuit, and a set of PCB bond wires. The PCB includes a transmitter circuit with a set of signal output ports. The photonic integrated circuit includes a substrate, a micro ring modulator and a matching circuit. The substrate has a set of input pads. The micro ring modulator is located on the substrate and includes a set of electrical pads. The input pads are electrically connected to the electrical pads. The matching circuit is electrically connected to the electrical pads. The PCB bond wires are electrically connected to the signal output ports and the input pads. An impedance value of the matching circuit and the PCB bond wires substantially matches the modulation impedance value.