Abstract: A method of manufacturing GaAs single crystals in which gas in the vicinity of the surface of a substrate crystal is irradiated with light so as to an epitaxial growth of GaAs single crystals may be enabled by the halogen transport method under such condition that the temperature of the substrate crystal is lowered less than 700.degree. C.

Abstract: A deposition method of a compound semiconductor forming a semiconductor device comprises the steps of; covering the surface of a compound semiconductor containing a V group element with a III group element with a thickness of one or more monolayers; and forming a second compound semiconductor containing a V group element different from said V group element on said III group element while utilizing said III group element as a protective film for preventing the desorption of said V group element.

Abstract: In a method of selectively growing an Si epitaxial film, a gas consisting of not less than one type of a gas containing at least silane gas is used as a source gas. A substrate obtained by partially forming an insulating film pattern on a single-crystal Si substrate is heated to a predetermined temperature in a vacuum. An Si epitaxial film is grown on exposed single-crystal Si except for the insulating film pattern. Intermittent irradiation by vacuum ultraviolet light on the heated substrate is performed at predetermined time intervals.

Abstract: A method of growing a layer of a III-V compound semiconductor on a silicon substrate comprises an oxide layer removing step of removing an oxide layer on a surface of the silicon substrate at a first temperature, a low-temperature grown layer forming step of forming a low-temperature grown layer of the III-V compound semiconductor on the silicon substrate while introducing a source gas for Group III and a source gas for Group V at a second temperature lower than the first temperature, and a single crystal layer growing step of growing a single crystal layer of the Group III-V compound semiconductor on the low-temperature grown layer while introducing the source gas for Group III and the source gas for Group V at a third temperature higher than the second temperature and lower than the first temperature.

Abstract: A silicon single crystal for use as semiconductor is grown by supplying, to a seed rod of single-crystal silicon, hydrochloride gas and silicon formed by admixing at least one chlorosilane gas selected from the group consisting of dichlorosilane, trichlorosilane and tetrachlorosilane with hydrogen gas at a high temperature to grow single-crystal silicon on the seed rod while etching the growing single-crystal silicon with the hydrochloride gas. The silicon single crystal is irradiated with laser rays so that the energy of the laser rays on the irradiated surface of the crystal ranges from 3100 to 3358 mW/cm.sup.2 and then spectra emitted by the crystal are optoelectrically determined to quantify the ultratrace elements present in the silicon single crystal. Moreover, the amounts of these ultratrace elements are reduced to those of ultratrace elements present in the chlorosilane gas.

Abstract: A method of growing a plurality of epitaxial layers each having a property which is different from each other simultaneously on a common substrate comprises steps of forming at least a first crystal surface and a second crystal surface which are crystallographically non-equivalent to each other on the substrate, introducing particles comprising constituent elements of the epitaxial layers into a region in the vicinity of the substrate, the particles including at least metal-organic molecules containing one of the elements constituting the epitaxial layers, decomposing the metal-organic molecules such that the layer constituting element therein is released as a result of the decomposition, and depositing the aforesaid particles including the element released by the decomposition of the metal-organic molecules on the first and second crystal surfaces so that a first epitaxial layer and a second epitaxial layer, respectively differing in properties from each other, are grown on respective the first and second cr

Abstract: X-ray wave diffraction devices are constructed using atomic layer epetaxy. A crystalline substrate is prepared with one or more surface areas on which multiple pairs of layers of material are to be deposited. These layers are then formed by atomic layer epetaxy on the surface areas of the substrate, one on top of another, with the material of each layer of each pair being selected to have a different index of refraction from that of the material of the other layer of each pair. The layers are formed so that the thickness of each layer of a pair is substantially the same as that of the corresponding layer of every other pair and so that x-ray waves impinging on the layers may be reflected therefrom. Layer pairs having a thickness of about 20 angstroms or less are formed on the substrate.

Abstract: A semiconductor film having a very high light response of photoconductivity and good electrical characteristics such a wide band gap, for example, a non-monocrystalline silicon carbide film, is formed by decomposition reaction of a silicon-containing raw material gas and a hydrocarbon as a carbon raw material under light irradiation or high frequency, where the carbon raw material gas comprises at least one of tertiary and quaternary carbon atom-containing hydrocarbons of specific chemical formulae, and a semiconductor device using the thus formed semiconductor film is also provided.

Abstract: A substrate is heated in a crystal growth vessel evacuated to a ultrahigh vacuum, and gases containing component elements of a crystal to be grown on the substrate are introduced into the vessel under predetermined conditions to cause successive epitaxial growth of single molecular layers, the number of growth cycles being automatically controlled. A mass analyzer is disposed opposite to the substrate in the vessel so that the progress of crystal growth can be incessantly traced and evaluated for each of the molecular layers. An etchant gas introduction nozzle extends into the vessel to make etching treatment of the surface of the substrate in the evacuated vessel prior to the crystal growth.

Abstract: A liquid precursor containing a metal is applied to a substrate, RTP baked, and annealed to form a layered superlattice material. Prebaking the substrate and oxygen in the RTP and anneal is essential, except for high bismuth content precursors. Excess bismuth between 110% and 140% of stoichiometry and RTP temperature of 725.degree. C. is optimum. The film is formed in two layers, the first of which uses a stoichiometric precursor and the second of which uses an excess bismuth precursor. The electronic properties are so regularly dependent on process parameters and material composition, and such a wide variety of materials are possible, that electronic devices can be designed by selecting from a continuous record of the values of one or more electronic properties as a continuous function of the process parameters and material composition, and utilizing the selected process and material composition to make a device.

Abstract: A process for growing single crystal epitaxial BaF.sub.2 layers on gallium arsenide substrates by slowly reacting BaF.sub.2 vapor with the clean, hot GaAs substrate at 500.degree. to 700.degree. C. in high vacuum until a uniform, thin (.about.12.ANG.) layer of reaction product is formed and then vapor depositing BaF.sub.2 onto the reaction layer at room temperature to 400.degree. C. to form the single crystal, epitaxial BaF.sub.2 layer.

Abstract: A liquid precursor containing a metal is applied to a substrate, RTP baked, and annealed to form a layered superlattice material. Prebaking the substrate and oxygen in the RTP and anneal is essential, except for high bismuth content precursors. Excess bismuth between 110% and 140% of stoichiometry and RTP temperature of 725.degree. C. is optimum. The film is formed in two layers, the first of which uses a stoichiometric precursor and the second of which uses an excess bismuth precursor. The electronic properties are so regularly dependent on process parameters and material composition, and such a wide variety of materials are possible, that electronic devices can be designed by selecting from a continuous record of the values of one or more electronic properties as a continuous function of the process parameters and material composition, and utilizing the selected process and material composition to make a device.

Abstract: A deposition method of a compound semiconductor forming a semiconductor device comprises the steps of; covering the surface of a compound semiconductor containing a V group element with a III group element with a thickness of one or more monolayers; and forming a second compound semiconductor containing a V group element different from said V group element on said III group element while utilizing said III group element as a protective film for preventing the desorption of said V group element.

Abstract: A method for controlling roughness on a surface of a monocrystal comprises supplying atomes for deposition on the surface of the monocrystal having the roughness under irradiation with ions having controlled energy to carry out epitaxial growth, thereby reducing the roughness.

Abstract: A process for fabricating a diode laser is disclosed which allows the laser to be easily aligned with other components. Furthermore, the disclosed method provides a means for fabricating an entire diode laser upon a single substrate, thus eliminating the complexity of positioning and alignment. Ion beam deposition is used to create many of the components, thus forming very efficient and very uniform components.

Abstract: A crystalline silicon carbide film is grown on a heated crystalline silicon substrate by laser ablation of a pure carbon target. For substrate temperatures during deposition above 1000.degree. C. and single crystal silicon substrates the resulting SiC film is expitaxially oriented with respect to the substrate. Films of stoichiometric SiC are grown up to thicknesses of about 4000.ANG.. These films grow on top of the silicon substrate and whereas the source of carbon for the film is from the ablation plume of the carbon target the source of the silicon is from the substrate. By using a method of alternate ablation of a pure carbon and a pure silicon target, similar epitaxial films can be grown to thicknesses in excess of 1 .mu.m with part of the silicon being supplied by the ablation plume of the silicon target.

Abstract: A method for growing a deposit upon a substrate of semiconductor material involves the utilization of pulsed laser deposition techniques within a low-pressure gas environment. The substrate and a target of a first material are positioned within a deposition chamber and a low-pressure gas atmosphere is developed within the chamber. The substrate is then heated, and the target is irradiated, so that atoms of the target material are ablated from the remainder of the target, while atoms of the gas simultaneously are adsorbed on the substrate/film surface. The ablated atoms build up upon the substrate, together with the adsorbed gas atoms to form the thin-film deposit on the substrate. By controlling the pressure of the gas of the chamber atmosphere, the composition of the formed deposit can be controlled, and films of continuously variable composition or doping can be grown from a single target of fixed composition.

Abstract: In semiconductor manufacture, a pulse plasma enhanced chemical vapor deposition (PPECVD) method is provided for depositing a conductive film of low resistivity on a substrate. The PPECVD method is especially suited to the deposition of metal silicides such as TiSi.sub.x on a silicon substrate during contact metallization. The PPECVD method can be carried out in a vacuum reaction chamber of a cold wall CVD reactor. A metal precursor deposition gas such as TiCl.sub.4 is reacted with a silicon source gas such as SiH.sub.4 at a deposition temperature of about 500.degree. C. For generating a pulsed plasma, an rf power supply is coupled to the reaction chamber and to a pulse generator.