Abstract: A method, in one approach, includes forming a magnetic recording layer having: encapsulated nanoparticles each comprising a magnetic nanoparticle encapsulated by an encapsulating layer, and a polymeric binder binding the encapsulated nanoparticles.

Abstract: A coating system may include a coating chamber; a substrate holder to move a substrate along a motion path; and a sensor device in the coating chamber, wherein the sensor device is configured to move along the motion path, and wherein the sensor device is to perform a spectral measurement on the substrate.

Abstract: The present invention relates to an arrangement for handling one or more tyres simultaneously in storage shelving of a high bay warehouse, where the tyres are brought in and stored and from where the tyres are taken. The arrangement according to the invention comprises a shelving track and a load handling device arranged to move along the shelving track, which load handling device comprises a horizontal longitudinal picking bar having a first end and a second end and which longitudinal picking bar is arranged to handle one or more tyres simultaneously in an axial direction of the tyres when the tyres stand in upright position one after the other so that the longitudinal picking bar is arrangeable to the centre of the tyre, and a rear support arranged to the longitudinal picking bar. The present invention also relates to a method for handling tyres and a high bay warehouse.

Abstract: A solution treatment apparatus includes: a substrate holding unit holds and rotates a substrate; a coating solution supply unit applies a coating solution to the substrate held by the substrate holding unit; a cup unit arranged outside the substrate holding unit in a manner to be able to surround the substrate held by the substrate holding unit; an exhaust path provided between the substrate holding unit and an inner peripheral surface of the cup unit; a coating solution collection unit provided above the exhaust path in a manner to cover the exhaust path and including an opening part communicating in a vertical direction; a solvent supply unit supplies a solvent for the coating solution to the coating solution collection unit; and a relay unit located above the coating solution collection unit and projecting from the inner peripheral surface of the cup unit toward the coating solution collection unit.

Abstract: A treatment solution supply apparatus supplies a treatment solution to a solution treatment apparatus which applies the treatment solution to a substrate to perform a predetermined treatment. Plural solution treatment apparatuses are supply destinations of the treatment solution. The treatment solution supply apparatus includes: a sending unit common among the solution treatment apparatuses, the sending unit sends the treatment solution stored in a treatment solution supply source to each of the solution treatment apparatuses; and a control unit that controls the sending unit. The sending unit includes pumps that suck the treatment solution and load the treatment solution thereinto and send the loaded treatment solution. The control unit controls suction timing of each of the pumps so that one (or more) of the pumps becomes in a state capable of sending the treatment solution to the solution treatment apparatuses at all times.

Abstract: A method of estimating an operating state of a drive system is presented. The drive system comprises an electric motor and a mechanical unit being moved by the electric motor. The method comprises a) operating the electric motor using electrical properties, b) determining movement properties regarding the movement of the mechanical unit using the electrical properties, repeating steps a) and b) for a number of times using changed electrical properties, and generating a distribution function. The distribution function allocates electrical properties to the resulting movement properties. The method also comprises estimating the operating state in response to the generated distribution function.

Abstract: The invention relates to a method for producing at least one functional region on an electrical contact element such as, for example, a switching contact or a plug type contact. In order to prevent the high environmental burden which is disadvantageous in wet-chemical methods and to overcome the restriction to a very small number of materials caused in hot dip methods in physical technical terms, and to substantially improve the spatial possibility for selection and structuring which is insufficient in both techniques, there is provision according to the invention for at least one material coating to be applied mechanically in a highly selective manner to the contact element in the functional region and subsequently highly energetic thermal radiation such as, for example, a particle beam in the form of an ion and/or electron beam, to be directed onto the at least on material coating.

Abstract: A substrate processing apparatus includes a chamber providing a space in which a substrate is processed, a first substrate support within the chamber and configured to support the substrate when the substrate is loaded into chamber, a second substrate support within the chamber and configured to support the substrate in a height greater than the height in which the first substrate supports the substrate, a first supply port through which a supercritical fluid is supplied to a first space under the substrate of a chamber space, a second supply port through which the supercritical fluid is supplied to a second space above the substrate of the chamber space, and an exhaust port through which the supercritical fluid is exhausted from the chamber.

Abstract: Provided are a method and a device for descaling that make it possible to effectively remove oxide scale from the surface of a metal wire. The descaling includes spraying the surface of a metal wire (W) with a mixture (9) of water and hard particles from a plurality of nozzles (8). The plurality of nozzles (8) include a plurality of self-cleaning nozzles that spray at a spray angle (?) of 90° or smaller with respect to the metal wire (W). The spray angle (?) is the angle formed by the central axis (X) of the spraying and a vector (Vt) indicating a conveyance direction that originates at the intersection (P) of the central axis (X) and the metal wire surface.

Abstract: A method of masking a feature of a substrate using a fixture includes removably coupling a fixture to a first side of the feature of the substrate, the fixture including walls configured to abut sides of the feature and extend beyond a top surface of the feature when the fixture is removably coupled to the first side. The method further includes applying a masking material to the top surface of the feature. The method further includes removably coupling the fixture to a second side of the feature, the second side opposing the first side, the walls of the fixture configured to abut the sides of the feature and extend beyond a bottom surface of the feature when the fixture is removably coupled to the second side. The method further includes applying the masking material to the bottom surface of the feature while the fixture is removably coupled.

Abstract: A method for loading a blank composed of fused silica with hydrogen, including loading the blank at a first temperature (T1) and a first hydrogen partial pressure (p1), and further loading the blank at a second temperature (T2) which is different from the first temperature and at a second hydrogen partial pressure (p2) which is different from the first hydrogen partial pressure. The first and second temperatures (T1, T2) are lower than a limit temperature (TL) at which a thermal formation of silane in the fused silica of the blank commences. Also disclosed are a lens element produced from such a blank and a projection lens that includes at least one such lens element.

Abstract: A technique for reducing the amount of particles adhering to a substrate with a simple structure is provided. A substrate processing apparatus is an apparatus for processing a substrate by ejecting a processing liquid from a nozzle. The substrate processing apparatus includes supply piping and an air-bubble capturing part. One end of the supply piping is connected via a first filter for removing particles to a tank of a processing-liquid supply part that supplies the processing liquid, and the other end of the supply piping is connected to the nozzle. The air-bubble capturing part is inserted at a position between the first filter and the nozzle in the supply piping, and captures air bubbles contained in the processing liquid. Pressure loss caused by the air-bubble capturing part is approximately equal to or smaller than pressure loss caused by the first filter.

Abstract: A wheel spraying protection device is composed of a hollow mounting rack, an electric cylinder, a tray, an electromagnetic chuck, a sleeve, a piston, a soft rubber cover, a support column, an end cover, high temperature resistant plastic protective plugs, springs and iron posts. The device can play a role in protecting during a wheel spraying process, and solves the problem that a flange face, a center hole and bolt hole conical surfaces are adhered with paint. The device has the characteristics of advanced process, easiness in manufacturing, simple structure, strong function and the like.

Abstract: A composition is provided including a resin including one or more silicon-based materials, one or more organic-based materials, or a combination of silicon-based materials and organic-based materials. The composition further includes a first solvent having a boiling point from 140° C. to 250° C. and a second solvent having a boiling point from 50° C. to 110° C., wherein the a weight ratio of the first solvent to the second solvent is from 1:1 to 1:5. Methods for applying coatings to substrates are also provided.

Abstract: A gas-pressure-driven apparatus includes a main body having a working chamber, a movable member moving relative to the main body with a pressure of the working chamber, a pressure sensor for detecting the pressure, a flow rate sensor for detecting the flow rate of the working gas. A method for controlling the apparatus includes calculating a pressure change amount from the detected pressure and an integrated flow rate from the detected flow rate when the pressure is changed in a state in which the volume of the working chamber cannot be changed, calculating an initial volume of the working chamber from the pressure change amount and the integrated flow rate, and calculating a post-change volume of the working chamber from the integrated flow rate and the initial volume after creation of a state in which the volume of the working chamber can be changed from the initial volume.

Abstract: The present disclosure provides methods, device, and system for wafer processing. The wafer processing apparatus uses lid dispenser to disperse at least one reagent to the surface of the wafer. Further, the wafer is positioned on top of a rotatable vacuum chuck configured to spread at least one reagent over the surface of the wafer via a centrifugal force or surface tension, thereby permitting the at least one reagent to react with an additional reagent. Further, when dispensing the at least one reagent, a separation gap between the lid dispenser and the wafer is at a predetermined distance, for example, from 50 ?m to 2 mm.

Abstract: In a substrate processing apparatus, a chamber lid and a cup are located at a first position, a cup side wall and a liquid receiving side wall overlap each other in a radial direction, and a guard is supported by a liquid receiving side wall. When the chamber lid and the cup move to a second position that is above the first position, the guard moves upward while being suspended from the cup side wall. When the chamber lid and the cup are located at the second position, the lower end of the cup side wall is located above the upper end of the liquid receiving side wall, and the guard covers a gap between the lower end of the cup side wall and the upper end of the liquid receiving side wall.

Abstract: A substrate processing apparatus includes an indexer block, a first processing block, a second processing block, and an interface block. The indexer block includes a pair of carrier platforms and a transport section. A carrier storing a plurality of substrates in multiple stages is placed in each of the carrier platforms. The transport section includes transport mechanisms. The transport mechanisms concurrently transport the substrates.

Abstract: There is provided a method of developing an exposed resist film formed on a surface of a substrate to form a resist pattern, which includes: rotating the substrate about a rotation axis that extends in a direction perpendicular to the surface of the substrate that is horizontally supported; supplying a developing solution through a discharge hole positioned above the substrate onto the resist film such that the developing solution is widely spread on a surface of the resist film; and positioning a wetted part having a surface that faces the surface of the substrate, above a preceding region in the surface of the substrate, the preceding region being a region to which the developing solution is preferentially supplied through the discharge hole.

Abstract: At the time of initiating coating, when a first end of an ejecting port of a coating nozzle is located at one end of a peripheral edge of a wafer, the wafer and the coating nozzle are relatively moved by a moving mechanism while exposing a coating liquid from the ejecting port. During the coating, the wafer and the coating nozzle are relatively moved by the moving mechanism while the coating liquid ejected from the ejecting port is in contact with the wafer, to coat the coating liquid on the wafer. At the time of finishing the coating, when a second end of the ejecting port is located at the other end of the peripheral edge of the wafer, the wafer and the coating nozzle are relatively moved by the moving mechanism while exposing the coating liquid from the ejecting port.

Abstract: A developing method includes: horizontally holding a substrate; disposing an opposing surface of a developer nozzle that faces a portion of a surface of the substrate, above one of central and peripheral portions of the surface; discharging a developer to form a liquid collection portion of the developer; spreading the liquid collection portion by moving the developer nozzle toward the other of the central and peripheral portions with the opposing surface brought into contact with the liquid collection portion; lifting the developer nozzle relative to the surface while stopping the discharge of the developer, and pulling up a portion of the liquid collection portion; stopping the lifting, and forming a pillar of the developer having a tapered upper end which is brought into contact with the opposing surface; and applying a shearing force to the pillar to shear the tapered upper end and separating the pillar from the opposing surface.

Abstract: A method, which forms an air-bubble-free thin film with a high-viscosity fluid resin, initially dispenses the fluid resin on an outer region of a semiconductor wafer while the semiconductor wafer is spinning, and then dispenses the fluid resin onto the center of the semiconductor wafer after the semiconductor wafer has stopped spinning.

Abstract: A crate includes a base and an enclosure extending upwardly from the base defining a storage volume. A setback is defined around the enclosure such that a gap exists between corresponding sides of the base and the enclosure. The enclosure utilizes a lightweight, modular construction allowing the crate to be repeatedly assembled and disassembled for use and storage, and to allowing an enclosure storage volume to readily re-dimensioned as needed.

Abstract: A method for controlling the manufacturing of tires for wheels of vehicles includes: extracting a cured tire from a curing station, in which the cured tire has accumulated heat during a curing process; and verifying the presence of possible defects or imperfections in that cured tire. The verification includes detecting first electromagnetic radiations representative of a heat emission from different portions of the cured tire while the cured tire frees the accumulated heat; providing at least one output signal representative of the first electromagnetic radiations detected to allow an analysis of the cured tire and to verify the presence of the possible defects or imperfections. A plant for the manufacturing of tires for wheels of vehicles is also described.

Abstract: A substrate entire region treatment process of discharging a processing fluid of a temperature different from a surface temperature of a substrate 3 from a first nozzle 24 toward the substrate is performed while moving the first nozzle toward an outer side from an entire region treatment start position P2 located at a central portion to an entire region treatment end position P5 located at a peripheral portion. Then, after moving the first nozzle toward an inner side to a peripheral region treatment start position P6 located at an outer position than the entire region treatment start position P2, a substrate peripheral region treatment process of discharging the processing fluid from the first nozzle toward the substrate is performed while moving the first nozzle toward the outer side from the peripheral region treatment start position P6 to a peripheral region treatment stop position P7 located at a peripheral portion.

Abstract: A coating apparatus includes: a rotation holding unit configured to hold and rotate a substrate; a coating liquid supply unit configured to supply a coating liquid onto a surface of the substrate; and a control unit configured to control the rotation holding unit and the coating liquid supply unit. The control unit performs: controlling the coating liquid supply unit to supply the coating liquid onto an encircling line surrounding a rotational center of the substrate while controlling the rotation holding unit to rotate the substrate; followed by controlling the coating liquid supply unit to supply the coating liquid onto a central area; and followed by controlling the rotation holding unit to rotate the substrate at an angular velocity greater than that when the coating liquid is supplied onto the encircling line.

Abstract: A spin treatment apparatus includes an annular liquid receiver, an annular cup body and an annular partitioning member. The annular liquid receiver surrounds a rotating substrate at a distance from an outer periphery of the substrate and is configured to receive liquid flying from the rotating substrate and accommodate the liquid. The annular cup body surrounds the liquid receiver at a distance from an outer periphery of the liquid receiver and forms an annular outer exhaust flow channel for generating an airflow along an upper surface to an outer peripheral surface of the liquid receiver. The annular partitioning member is provided inside the annular liquid receiver and forms an annular inner exhaust flow channel for generating an airflow along an inner peripheral surface to a lower surface of the liquid receiver.

Abstract: A coating film forming apparatus includes: a substrate holding unit to horizontally hold a substrate; a rotating mechanism to rotate the substrate held by the substrate holding unit; a coating liquid supplying mechanism to supply coating liquid to form a coating film on the substrate; an annular member to rectify a gas stream above a periphery of the substrate when liquid film of the coating liquid is dried by rotation of the substrate, the annular member being provided above the periphery of the substrate and along a circumferential direction of the substrate so as to cover the periphery of the substrate; and a protrusion provided on an inner periphery of the annular member along circumferential direction of the annular member so as to protrude upward to reduce component of the gas stream flowing directly downward near an inner peripheral edge of the annular member.

Abstract: A method for developing a substrate includes spinning the substrate with a spin holder and discharging a developer to the substrate from a plurality of exhaust ports arranged in a row on a developer feeder. The method also includes causing a moving mechanism to move said developer feeder in one direction extending to a center of the substrate in plan view while maintaining a direction of arrangement of said exhaust ports in said one direction, thereby to move said developer feeder between substantially the center and an edge of the substrate. The method further includes causing the developer discharged from said exhaust ports to impinge in separate streams on the substrate, and causing each of the separate streams to impinge spirally on the substrate, thereby to develop the substrate. At least two of loci of positions of impingement of the developer corresponding to said exhaust ports overlap each other.

Abstract: Provided is a cleaning solution and its applications. The cleaning solution comprises a mixture of a basic chemical compound and a solvent solution. In some embodiments, the basic chemical compound is tetramethylammonium hydroxide (TMAH) and the solvent solution includes a solution of water and at least one of propylene glycol ethyl ether (PGEE), propylene glycol monomethylether (PGME), and propylene glycol monomethylether acetate (PGMEA). The cleaning solution is effective in removing silicon-containing material off a surface of a system or a surface of a semiconductor substrate. In some embodiments, the system comprises a pipeline for delivering the silicon-containing material in semiconductor spin-coating processes. In some embodiments, the system comprises a drain for collecting waste fluid in semiconductor spin-coating processes.

Abstract: A plating apparatus 20 includes a substrate holding device 110 configured to hold and rotate the substrate 2; a first discharge device 30 configured to discharge a plating liquid toward the substrate 2 held on the substrate holding device 110; and a top plate 21 that is provided above the substrate 2 and has an opening 22. The first discharge device 30 includes a first discharge unit 33 configured to discharge the plating liquid toward the substrate 2, and the first discharge unit 33 is configured to be moved between a discharge position where the plating liquid is discharged and a standby position where the plating liquid is not discharged. Further, the first discharge unit 33 is configured to be overlapped with the opening 22 of the top plate 21 at the discharge position.

Abstract: A method and system for delivering drug includes a first set of holes filled with a first formulation of the drug and a second set of holes filled with a second formulation of the same drug. This dual formulation or dual release kinetic system allows the creation of specifically tailored release kinetics by summation of multiple release kinetics.

Abstract: A substrate processing apparatus includes an indexer block, a first processing block, a second processing block, and an interface block. The indexer block includes a pair of carrier platforms and a transport section. A carrier storing a plurality of substrates in multiple stages is placed in each of the carrier platforms. The transport section includes transport mechanisms. The transport mechanisms concurrently transport the substrates.

Abstract: A semiconductor wafer spinning chuck includes a rotatable base, a plurality of arms, upstanding from the base, a selectively releasable clamping mechanism, associated with the arms, and a spray nozzle, extending through the base. The clamping mechanism has a first portion configured to mechanically clamp an edge of a first semiconductor wafer and hold the first wafer in a substantially horizontal orientation upon all of the arms, with a backside of the first wafer facing down. The spray nozzle is oriented to direct a spray of fluid at the backside of the first wafer.

Abstract: An injector nozzle for intake of liquids, including an injector chamber, a liquid inlet opening for an overpressured carrier liquid, the inlet opening issuing into the injector chamber, a liquid intake opening for a liquid to be drawn in, the intake opening issuing into the injector chamber, wherein downstream of the liquid inlet opening, the injector chamber has a first section conically enlarging in the flow direction and a second section conically enlarging in the flow direction, wherein the second conical section adjoins the first conical section and the second conical section has a greater cone angle than the first conical section.

Abstract: A powder coating system which is provided with a rotating stage which makes a metal cylindrical member rotate while holding its internal circumferential surface, a first booth which covers part of the metal cylindrical member which is held by the rotating stage, and a second booth which holds the first booth. A powder coating introduction nozzle which is provided with a filling port of powder coating and a plurality of powder coating spray ports is provided so that a filling port is positioned at the outside of the second booth and so that the plurality of spray ports can be changed in position in the first booth to face surface parts of the metal cylindrical member. The sprayed powder coating is collected inside the second booth by a flow of air from a blow device and is removed by being sucked up by a powder collector.

Abstract: According to one embodiment, a processing system includes a storage section, a processing section, a mounting section, a first transport section, and a second transport section. The mounting section includes a plurality of holding sections with a first spacing in a stacking direction. The first transport section is configured to transport the workpiece between the storage section and the mounting section and to enter the mounting section at a first position in the stacking direction. The second transport section is configured to transport the workpiece between the processing section and the mounting section and to enter the mounting section at a second position different from the first position in the stacking direction. The first position is provided at two sites in the stacking direction across the second position. The first transport section and the second transport section are enabled to enter the mounting section around a same time.

Abstract: A spray coating system has a wash module with an enclosed wash space. A plurality of liquid tanks disperse liquids within the wash space via emitters. A spray module has at least one spray port coupled to an enclosed spray space. A part hanger dimensioned to carry parts, is rotatable about a vertical axis while in the wash space and the spray space. A conveyor may be included, for example, for transporting the part hanger between the wash space and the spray space.

Abstract: A cap metal forming method capable of obtaining a uniform film thickness on the entire surface of a substrate is provided. A method for forming a cap metal on a processing surface of a substrate provided with two or more regions having different water-repellent properties, includes: holding the substrate horizontally by a rotatable holding mechanism installed in an inner chamber; supplying a gas between the inner chamber and an outer chamber covering the inner chamber via a gas supply hole provided in a top surface of the outer chamber; forming a pressure gradient between the inner chamber and the outer chamber; and supplying a plating solution to a preset position on the processing surface of the substrate after a pressure of the gas inside the inner chamber reaches a preset value so as to form the cap metal on at least one of the regions.

Abstract: Improved wafer coating processes, apparatuses, and systems are described. In one embodiment, an improved spin-coating process and system is used to form a mask for dicing a semiconductor wafer with a laser plasma dicing process. In one embodiment, a spin-coating apparatus for forming a film over a semiconductor wafer includes a rotatable stage configured to support the semiconductor wafer. The rotatable stage has a downward sloping region positioned beyond a perimeter of the semiconductor wafer. The apparatus includes a nozzle positioned above the rotatable stage and configured to dispense a liquid over the semiconductor wafer. The apparatus also includes a motor configured to rotate the rotatable stage.

Abstract: A coating apparatus produces a spray of charged droplets and controls the spray angle of travel of the spray toward the object to be coated. Electrically charging droplets minimizes the amount of coating material required to uniformly coat a surface as compared to conventional web coating techniques such as blade coating. An inductive ring guides the spray charged droplets as they exit the nozzle of a spray device. The electrostatic repulsion between the charged droplets insures that a uniform coating of liquid formulation can be applied to a web surface.

Abstract: A non-contact edge coating apparatus includes an applicator for applying a coating material on an edge of a solar cell substrate and a control system configured to drive the applicator. The control system may drive the applicator along an axis to maintain a distance with an edge of the substrate as the substrate is rotated to have the edge coated with a coating material. The applicator may include a recessed portion into which the edge of the substrate is received for edge coating. For example, the applicator may be a roller with a groove. Coating material may be introduced into the groove for application onto the edge of the substrate. A variety of coating materials may be employed with the apparatus including hot melt ink and UV curable plating resist.

Abstract: A method for developing a substrate includes spinning the substrate with a spin holder and discharging a developer to the substrate from a plurality of exhaust ports arranged in a row on a developer feeder. The method also includes causing a moving mechanism to move said developer feeder in one direction extending to a center of the substrate in plan view while maintaining a direction of arrangement of said exhaust ports in said one direction, thereby to move said developer feeder between substantially the center and an edge of the substrate. The method further includes causing the developer discharged from said exhaust ports to impinge in separate streams on the substrate, and causing each of the separate streams to impinge spirally on the substrate, thereby to develop the substrate. At least two of loci of positions of impingement of the developer corresponding to said exhaust ports overlap each other.

Abstract: A pretreatment process, carried out prior to a developing process, spouts pure water, namely, a diffusion-assisting liquid for assisting the spread of a developer over the surface of a wafer, through a cleaning liquid spouting nozzle onto a central part of the wafer to form a puddle of pure water. The developer is spouted onto the central part of the wafer for prewetting while the wafer is rotated at a high rotating speed to spread the developer over the surface of the wafer. The developer dissolves the resist film partly and produces a solution. The rotation of the wafer is reversed, for example, within 7 s in which the solution is being produced to reduce the water-repellency of the wafer by spreading the solution over the entire surface of the wafer. Then, the developer is spouted onto the rotating wafer to spread the developer on the surface of the wafer.

Abstract: A nanotube-photoresist composite is fabricated by preparing a nanotube suspension using a nanotube structure-containing raw material, dispersing the nanotube suspension in a photoresist using ultra-sonication to produce a nanotube suspension-photoresist mix, spin-coating the nanotube suspension-photoresist mix on a substrate to form a nanotube suspension-photoresist composite layer, and removing one or more solvents in the nanotube suspension-photoresist composite layer by baking.

Abstract: A drug coating apparatus (100) for coating an implant (206) with a drug is described. The drug coating apparatus (100) includes a holding unit (102) having a top collet (202-1) for holding the implant (206) from a top end of the implant (206), and a bottom collet (202-2) to hold the implant (206) from a bottom end of the implant (206). The drug coating apparatus (100) includes at least one rotary drive (115) coupled to the holding unit (102) for rotating the top collet (202-1), the bottom collet (202-2) and the implant (206), and includes a spraying unit (104) to spray-coat the drug on the implant (206).

Abstract: A device to form a coating film which can quickly coat a substrate of a follow-up lot after coating a preceding lot. The device is configured such that nozzles for a preceding lot and a following lot are integrated into a common movement mechanism and moved between an upper side of a liquid processing unit and a standby area. A coating method includes sucking air into the nozzle for the preceding lot to form an upper gas layer, sucking a solvent for the preceding lot in the standby area to form a thinner layer, and sucking air into the nozzle for the preceding lot to form a lower gas layer within the nozzle, and thus forming a state that a solvent layer is interposed between the upper gas layer and the lower gas layer.

Abstract: A system and method for coating an expandable member of a medical device comprising a support structure to support the expandable member and a dispenser positioned with at least one outlet proximate a surface of an expandable member. A drive assembly establishes relative movement between the at least one outlet and the surface of the expandable member to apply fluid on the surface of the expandable member along a coating path. A guide maintains a substantially fixed distance between the at least one outlet and the surface of the expandable member during relative movement therebetween by displacing the expandable member relative to the at least one outlet.

Abstract: A method for wet treatment of plate-like articles includes, a chuck for holding a single plate-like article having an upwardly facing surface for receiving liquid running off a plate-like article when being treated with liquid, wherein the chuck is outwardly bordered by a circumferential annular lip. The chuck has an outer diameter greater than the greatest diameter of the plate-like article to be treated, and a rotatable part with an upwardly facing ring-shaped surface for receiving liquid running off the circumferential lip of the chuck. The rotatable part is rotatable with respect to the chuck, the ring-shaped surface is coaxially arranged with respect to the circumferential annular lip, the inner diameter of the ring-shaped surface is smaller than the outer diameter of the chuck, and the distance d between the lip and the upwardly facing ring-shaped surface is in a range from 0.1 mm to 5 mm.

Abstract: A photoresist coating process including a first step and a second step is provided. In the first step, a wafer is accelerated by a first average acceleration. In the second step, the wafer is accelerated by a second average acceleration. The first acceleration and the second acceleration are both larger than zero, and photoresist material is provided to the wafer only in the second step.