Abstract: A grounded insulated electrostatic supply tank comprised of a conductive tank that has several liners to fully insulate a waterborn fluid in the tank from ground. The interior of the tank and a sealed lid are coated with an insulating liner. An intermediate lining is placed in the tank and third interior insulating inner liner is inserted in the tank and has a lip that wraps around the upper rim of the tank and is sealed between the lid and the tank. Electrostatic spray equipment is connected to the tank by a coaxial hose having an inner non-conductive hose and preferably, an outer hose that is conductive. Inner non-conductive hose extends through the lid into an insulating teflon pick-up tube that extends to near the bottom of the tank. Depleted waterborn fluid in the tank is grounded after use by a manual probe or by a piston operated automatic grounding system.

Abstract: Corn Buttering Tool is an invention created with the intent of simplifying and efficiently buttering an ear of corn, alleviating slippage and mess. The components consist of a stainless mesh screen which secures and cradles the corn; one butter bin, accommodating up to 1 lb. of butter; and one plastic cover which keeps the butter fresh. The butter is placed into the bin, the mesh is set upon the butter and the heated corn rests on the mesh. Rotating the corn on the mesh attains the desired amount of butter. Combining rotating and sideways motion will allow more butter to be applied to the corn. The design's primary function is to butter corn however it may be used as a butter storage unit. The bin's arched shaped base allows for maximum butter usage. The side lip of same prevents excess melted butter from spilling over.

Abstract: The present invention is directed to a shield fabricated from a sheet of material having a trough disposed on the lower edge and peripheral flanges disposed about the remaining edges for confining excess spray/mist when positioned rearwardly of an object being painted, cleaned or otherwise treated, and directing it to the trough where it is collected and discharged. More specifically, the shield is fabricated from any of a variety of materials including cardboard, plastic, tin, stainless steel, etc., may optionally be provided with a coating to enhance the flow of the excess spray/mist downwardly into the trough, and is provided with means for suspending, staking or wedging the same onto support means during use.

Abstract: A substrate heating equipment for use in a semiconductor fabricating apparatus includes a heater support frame disposed within a vacuum vessel, opposed panel heaters disposed in a pluri-shelved fashion within the heater support frame, and support means for supporting a substrate to be treated between an adjacent pair of the opposed panel heaters, whereby simultaneous heating of plural substrates to be treated is enabled. By controlling the individual temperature of the panel heaters, it also becomes possible to significantly reduce a tact time and to effect uniform heating of the substrates while the equipment is rendered compact.

Abstract: A rapid thermal heating apparatus including a substrate support and a bearing assembly in a processing chamber. The substrate support is mounted on the bearing assembly so that it may be rotated. A rotatable drive ring is located external to the processing chamber. The drive ring provides a force to couple the bearing assembly to the drive ring without the use of a vacuum seal so that rotation of the drive ring causes the substrate support to rotate.

Abstract: Gas shielding is employed to prevent metal plating on contacts during electroplating to reduce particulate contamination and increase thickness uniformity. In another embodiment, gas shielding is employed to prevent deposition on the backside and edges of a semiconductor wafer during plating.

Abstract: An apparatus for facilitating plasma processing and in particular chemical plasma enhanced vapor deposition, plasma polymerization or plasma treatment of barrier materials onto the interior surface of containers barrier materials are useful for providing an effective barrier against gas and/or water permeability in containers and for extending shelf-life of containers, especially plastic evacuated blood collection devices.

Abstract: A source of alternating current (3), is connected to two magnetron cathodes (4, 5), one pole (8) of the a.c. current source (4) being connected to one of the cathodes (4), while the other pole (9) is connected to the other cathode (5), each by its own power supply line (10, 11). Each of the two cathodes (4, 5) is installed in its own compartment (12, 13), the two compartments enclosing between them a third compartment (14), connected to a vacuum source (21). The two outside compartments (12, 13) are connected to each other by openings (15, 16) or gaps in the walls (17, 18) separating them, and the substrate (2) set up in the third compartment (14) facing a CVD source, which consists essentially of a reactive gas inlet (19) and a collimator (20).

Abstract: An apparatus for manufacturing a plastic container coated with carbon film, which comprises: an external electrode having a hollow space approximately similar to an external shape of the container which is accommodated in the hollow space; an insulating member for insulating the external electrode, a mouth of the container abutting against the insulating member when the container is accommodated in the hollow space of the external electrode; an internal electrode inserted through the mouth of the container into the container accommodated in the hollow space of the external electrode, the internal electrode being earthed; discharging means communicated with the hollow space of the external electrode to discharge air in the hollow space; feeding means for feeding raw gas into the container accommodated in the hollow space of the external electrode; and a high frequency electric source connected to the external electrode.

Abstract: A process chamber is described wherein a plasma is generated by electron-cyclotron resonance (ECR) and is isolated from chamber walls by a magnetic field from two diametrically-opposed solenoids. A substance to be deposited on a substrate is introduced into the chamber by laser ablation, evaporation, or other techniques. The ECR plasma has a relatively large volume to ensure a homogeneous influx of material, and a low potential that results in less aggressive ion bombardment of the substrate. The process chamber can be used in a variety of processes, including deposition and oxidation of superconducting metal oxides, and reduction of indium-tin-oxide with nitrogen at low temperatures.

Abstract: The plasma processing apparatus of the present invention increases the throughput of plasma processing. This objective is achieved by a composition which comprises a processing chamber (10) for performing surface processing of substrates (W) by means of a plasma discharge, load-lock chambers (20R) and (20L) whereto passage from the processing chamber (10) is possible through slots (11R) and (11L) formed in a wall portion (10a) of the processing chamber (10), a gate element (30) which opens and closes the slots (11R) and (11L) from within the processing chamber 10, and transport element(s) for transporting substrates (W) between the processing chamber (10) and the load-lock chambers (20R) and (20L).

Abstract: An apparatus of forming thin films, which is small and requires a short thin-film formation time, is provided which comprises at least one physical vapor deposition device and at least one chemical vapor deposition device, wherein said physical vapor deposition device and said chemical vapor deposition device are provided with an exhaust pipe respectively for connection with a common exhaust means and an exhaust switching means. A method of forming thin films using this apparatus is also provided. According to the configuration in which the exhaust switching means is connected via exhaust pipes to the physical vapor deposition device, to the chemical vapor deposition device, and to the exhaust means, this apparatus can be accomplished in a small size which has at least two chambers and one exhaust means.

Abstract: There are disclosed method and apparatus for producing a magnetic recording medium including a non-magnetic substrate, a magnetic layer formed on one surface of said non-magnetic substrate and a back coat layer formed on an opposite surface of said non-magnetic substrate. By using the method and the apparatus, the magnetic recording medium having the back coat layer, which exhibits a high lubricating property and a low dynamic friction coefficient, can be produced with a high operating efficiency. The method includes the steps of forming the back coat layer by a plasma chemical vapor deposition and supplying a lubricant, substantially at the time when the back coat layer is formed by the plasma chemical vapor deposition, such that the lubricant is introduced into the back coat layer.

Abstract: An apparatus and process are disclosed for depositing a barrier layer, such as an SiOx barrier layer, onto a moving web of substrate material in a continuous process at atmospheric pressure using a gaseous phase precursor and an oxidizer.

Abstract: An apparatus for aligning the object focus of an elliptical reflector, such as positioned within the filament tube of a filament irradiating unit, with a directional axis, such as the centerline of the filament as it travels through the tube. The apparatus includes a support assembly for mounting the tube in a precisely fixed position, and three adjustable mounting assemblies connected to the support assembly at three spaced apart connection points for mounting the support assembly on a stationary base. Each of the mounting assemblies includes a pair of linkages each of adjustable length and forming two sides of a triangle with its apex at the point of connection to the support assembly.

Abstract: A method for compensating against wafer edge heat loss during rapid thermal processing is disclosed. A semiconductor wafer is exposed to radiant energy that is uniform across the entire wafer surface. The wafer is exposed by projecting a radiant energy image onto the edge of said semiconductor wafer while providing radiant energy rays directly to the wafer's surface. The radiant energy image comprises reflecting radiant energy rays that pass through a positionally adjustable object onto the edge of the wafer. The positionally adjustable object is optional and it is mounted between an optical lens and a radiant energy source or it is mounted between a reflector and each radiant energy source (A second optical lens is optional). The energy rays absorbed at the edge of the wafer contain more heat intensity than do the rays which are absorbed by the inner portion of the wafer, thus producing uniform heat across the entire wafer.

Abstract: In the present invention, a waste solution and a exhaust gas are guided together from a drain cup DC into a storing means through common discharge means. Naturally, the gas-liquid separation is performed within the storing means in place of performing the gas-liquid separation within the drain cup DC. Therefore, the waste solution is not solidified within the drain cup so as to plug the common discharge means. Also, a predetermined waste solution is kept stored in the storing means included in the coating apparatus of the present invention, making it possible to permit the surface of the stored waste solution to absorb the mist, and the waste solution is prevented from being solidified within the storing means. Further, since a minimum amount of the exhaust gas is kept discharged even during non-operation of the coating apparatus by using an exhaust gas damper whose degree of opening can be controlled, the waste solution stored in the storing means is prevented from being solidified.

Abstract: An improved method of in-situ cleaning a throttle valve in a CVD device and exhaust flow control apparatus for facilitating such cleaning. The throttle valve is repositioned such that it is juxtaposed in close proximity to the exhaust gas port of the reaction chamber. A plasma is then ignited in a cleaning gas mixture of nitrogen trifluoride, hexafluoroethane and oxygen.

Abstract: A treatment chamber (1) evacuable by vacuum pumps (13,13') has a mounting (26,26', . . .) bearing the hollow body (4) in the treatment chamber (1), and a line (9,9') for the admission of a process gas into the treatment chamber (1). A microwave conductor (20,20' . . .) is connected with a generator (19,19' . . .) for igniting a plasma in the area of channels formed by a sheet-metal shroud (2,2') matching the configuration of the hollow body (4). A closure (7,7') is provided through which the filler opening (6, 6') of the hollow body (4) can be closed pressure-tight, and a line (9,9') for the process gas passes through the closure.

Abstract: A novel rapid thermal process (RTP) reactor processes a multiplicity of wafers or a single large wafer, e.g., 200 mm (8 inches), 250 mm (10 inches), 300 mm (12 inches) diameter wafers, using either a single or dual heat source. The wafers or wafer are mounted on a rotatable susceptor supported by a susceptor support. A susceptor position control rotates the wafers during processing and raises and lowers the susceptor to various positions for loading and processing of wafers. A heat controller controls either a single heat source or a dual heat source that heats the wafers to a substantially uniform temperature during processing. A gas flow controller regulates flow of gases into the reaction chamber. Instead of the second heat source, a passive heat distribution element is used, in one embodiment, to achieve a substantially uniform temperature throughout the wafers.

Abstract: Method and apparatus for potting components in an impregnating composition which does not set at room temperature, but which sets at elevated temperatures in a short time. A one-component composition is used. The potting chamber optionally consists of a forechamber, a main chamber and an exit chamber. The potting chamber is followed by a tunnel oven which itself consists of an airlock entry chamber, a main chamber and an airlock exit chamber.

Abstract: A system and method for adhering resin to the exterior of the bottles includes a coating section, a flash-off section, and a curing section. In the coating section, the bottles are dipped in a solution of resin and solvent. Only the exterior of the bottles is coated. The bottles are fed from the coating section to the flash-off section where they will be conveyed along a zig-zag path. In the flash-off section, air will pass over the bottles in order to remove solvent from their exterior. The bottles are then fed to the curing section where they pass in front of a plurality of ultraviolet lights. The ultraviolet lights will cure the resin on the exterior of the bottles.

Abstract: Method and apparatus for treating a workpiece implantation surface by causing ions to impact the workpiece implantation surface. An implantation chamber defines a chamber interior into which one or more workpieces can be inserted. A support positions one or more workpieces within an interior region of the implantation chamber so that implantation surfaces of the workpieces are facing the interior region. A dopant material in the form of a gas is injected into the implantation chamber to cause the gas to occupy a region of the implantation chamber in close proximity to the one or more workpieces. A plasma of implantation material is created within the interior region of the implantation chamber. First and second conductive electrodes positioned within the implantation chamber include conductive surfaces in proximity to the chamber interior occupied by the one or more workpieces. A voltage source outside the chamber relatively biases the first and second conductive electrodes.

Abstract: A vacuum deposition system is shown in the form of a sputtering system for rigid disk substrates which uses a single vacuum envelope and a single transport to avoid multiple pump downs or valved isolation structures during the multiple coating processes or the transfer of workpieces between conveyer devices. Work stations carried by a modular processing unit provide a slotted opening through which work pieces supported on the transport enter and leave the work station and which affords sufficient restriction to enable a processing gas atmosphere to be maintained within the work station that is above the pressure of the vacuum envelope while being isolated from the adjoining work stations. The work stations are supported on and readily releasable from the modular processing units to allow service and target replacement to occur offline.

Abstract: A plasma-processing method used in processes for manufacturing semiconductor devices. During plasma processing, ultraviolet radiation is emitted from a region where a plasma is created. An ultraviolet radiation-blocking means blocks the ultraviolet radiation from impinging on the sample surface to protect it. The blocking means passes particles forming a plasma onto the sample surface. The particles passed through the ultraviolet radiation-blocking plates are implanted into the sample. Alternatively, the processed surface of the sample is etched, or a film is deposited on the processed surface of the sample.

Abstract: A reactor is provided for heating a workpiece in a sealed environment. The reactor has a chamber with a gas inlet port, a gas outlet port, and at least one tube for receiving a heat source. The tube passes from outside the chamber into the inside of the chamber without breaking the chamber seal. Alternately, the tubes may be used for treating the workpiece with light, in combination with or instead of heat treatment.

Abstract: An apparatus and a method are provided for depositing both surfaces of the substrate in one deposition process via on-axis oriented laser ablation.

Abstract: An ultraclean evaporation system which includes a vessel formed of a fluoropolymer inert to hydrogen peroxide and having an impurity level less than the impurity level of samples to be analyzed therein, preferably perfluoroalkoxy (PFA). A radiant heater is spaced from the vessel for uniformly heating the contents of the vessel. A shield, manufactured of aluminum and coated with a fluoropolymer encases the vessel alone or in conjunction with the heater. An inert gas supply is coupled to the vessel with a coupler of fluoropolymer inert to hydrogen peroxide, preferably PFA. An output is provided from the vessel formed of a fluoropolymer inert to hydrogen peroxide, preferably PFA. An orifice is provided which is formed of a fluoropolymer inert to hydrogen peroxide, preferably PFA, for controlling the flow rate of the inert gas supply. The tubing has a length of at least about 3 meters. The vessel has a side wall and a bottom forming a corner and is disposed so that the corner is the lowest region of the vessel.

Abstract: A process and apparatus for plasma-activated electron beam vaporization is rovided. The vaporizing material from at least two vaporizer crucibles is vaporized with electron beams. An electric voltage is applied to the vaporizer crucibles in such a way that the vapor-emitting areas serve as electrodes of an electric discharge. The vaporizing material acts as a cathode or anode. The process and apparatus are preferably intended for the reactive coating of large surfaces and for the reactive coating of components, tools and strip steel.

Abstract: A process for joining solid compositions, comprising placing a first solid composition having a first joining zone and a second solid composition having a second joining zone in a chamber; positioning a first gas phase, which comprises a substance that decomposes to a material that adheres to the first and second solid compositions during the process, proximate the target area; directing an energy beam to the first and second joining zones to selectively deposit material from the first gas phase on the first joining zone and the second joining zone until a joint is formed between the first and second solid compositions wherein the joint adheres to the first and second compositions at the first and second joining zones.

Abstract: Disclosed herein is an apparatus for manufacturing an oxide superconducting film employing laser ablation method. This apparatus has a thin film forming chamber having a laser-transparent laser entrance window, a target being provided in the thin film forming chamber and containing components of an oxide superconductor, a laser beam source for irradiating the target with a laser beam from the exterior of the thin film forming chamber through the laser entrance window, and apparatus for controlling power of the laser beam which is applied to the target for preventing the power of the laser beam, being applied to the target, from reduction by contamination of the entrance window caused by scattered particles. According to the present invention, it is possible to form an oxide superconducting film having high and uniform characteristics even if a long time is required for film formation, thereby attaining a remarkable effect in improvement of superconductivity of a large area oxide superconducting film.

Abstract: A method and apparatus for producing a magnetic recording medium in which production of flakes in a film-forming process and the occurrence of arc discharge in the film-forming surface of a substrate are prevented to thereby attain improvement in the quality of the resulting film and in producing efficiency. A web-like substrate is made to run in a vacuum chamber while the substrate is arranged opposite to a sheet-shaped plasma stream. At the same time, a reactive gas is supplied to the plasma stream while an electric field is generated in a direction crossing the plasma stream and the substrate, which are arranged opposite to each other to thereby form a thin film on the plasma stream side surface of the substrate. Accordingly, the production of flakes is prevented, so that the occurrence of arc discharge in the film-forming surface of the substrate is prevented.

Abstract: The invention disclosed defined a vertically extending passage through the rotary center of an inner cup or the rotary center of a spinner in a notary chemical treater, disposes a stationary cleaning fluid nozzle in the passage, and injects the cleaning fluid from the nozzle to clean a lid of the rotary chemical treater and the underside of an object treatment within the treater. The underside of the lid and the underside of the objective part are efficiently cleaned, and the need for sealing the movable parts against the cleaning fluid is eliminated because the nozzle is stationary, ensuring the prevention of the cleaning fluid from leaking.

Abstract: A spin coating device for a substrate, in which a uniform thin film can be formed by applying an application liquid to a substrate and the quality of the substrate can be further improved. The spin coating device for a substrate comprises a turntable 2 for holding and rotating a substrate 1; an application liquid supply means 4 for supplying an application liquid 3 to the rotating substrate 1: splash preventing means 20, which are arranged at the periphery of the substrate 1 held by the turntable 2, prevent the droplets of the application liquid from splashing and provide with an opening portion 10 for circulating the flow A of external air in an area ranging from the central portion toward the peripheral portion of the substrate 1 held by the turntable 2. Exhaust means 8 and 9 for exhausting air from within the splash preventing means 20 are provided.

Abstract: The workpiece, which is horizontally held in the treatment chamber, is heated by the planar heat generating members disposed on the upper and lower surfaces of the treatment chamber and controlled to predetermined temperature through respective heat equalizing members. Thus, the workpiece can be quickly heated with an equal temperature distribution and high repeatability on the entire surface regardless of the diameter thereof. Further, a stream that is vertically symmetrical is obtained due to the shapes of the shoulder portions. Thus, since an eddy current and a turbulence that tend to take place upon supply of a process gas is prevented, the process gas can be equally contacted to the entire surface of the workpiece.

Abstract: A continuous drier for board-shaped piece material, especially for coated in-layers or printed circuit boards, is described which comprises a drying chamber, in which the board-shaped piece material to be dried is exposed to a guided air stream while being transported in a transport plane along a transport path from an entrance to an exit of the drying chamber by transport means acting preferably at its longitudinal edges. The drying chamber is equipped with an inlet for incoming air and with an outlet for outgoing air. Arranged above and below the transport path of the board-shaped piece material are infrared radiators the radiation of which acts directly on the coated piece material and which, in addition, form a heat source for the guided air stream. The air stream in the drying chamber is guided counter to the transport direction of the board-shaped piece material and substantially parallel to the transport plane. A coating installation comprising such a continuous drier is also described. (FIG.

Abstract: A plasma assisted deposition of a very thin inner surface coating inside a plastic or metal container is achieved using insoluble, inert, inorganic substances such as silica, or insoluble metal oxides, or by using mixtures of substances, for example of metals, metal oxides, metal salts and carbon and/or organic radicals, so as to form a flexible structure or lattice, or by using different layers of such structures. It involves locating the container in an evacuated enclosure, placing a vaporizer containing inert inorganic material of a predetermined constituency inside the container, generating a vapor of said material, forming a plasma of said vapor, and depositing a relatively thin coating of said material over a predetermined area of an inside surface of said container, whereby the high temperature of the particles of said coating penetrate said surface due to their heat energy while causing no overall rise in surface temperature because of the low mass flow.

Abstract: A compact slide spinner is disclosed. In the preferred embodiment, the compact slide spinner is used to prepare smears for microscopic evaluation. The spinner incorporates a disposable or reusable slide holder which encases a portion of a slide onto which the material to be smeared is placed. The holder containing the slide is then accelerated by spinning. Specimen fluid not adhering to the slide is contained within the slide holder which is discarded following preparation of the smear. Using this low-cost device, a uniform quality smear is quickly and easily prepared, while reducing the risk that laboratory personnel will be exposed to aerosol borne contagions.

Abstract: A method and apparatus are disclosed for forming thin films of chemical compounds utilized in integrated circuits. The method includes steps of forming a precursor liquid comprising a chemical compound in a solvent, providing a substrate within a vacuum deposition chamber, producing a mist of the precursor liquid, and flowing the mist into the deposition chamber while maintaining the chamber at ambient temperature to deposit a layer of the precursor liquid on the substrate. The liquid is dried to form a thin film of a solid material on the substrate, then the integrated circuit is completed to include at least a portion of the film of solid material in a component of the integrated circuit.

Abstract: Apparatus for applying powdered coating to a workpiece--particularly to electric motor armatures and stators--including features relating to handling and masking of workpieces before, during and after coating, is provided. A first feature of the invention is the inclusion of all coating steps--e.g., coating, cleaning and precuring--as modules in a single treatment station on the production line. The treatment station can also be enclosed in a single housing to contain excess powder from both the coating and cleaning processes, so that a single powder recovery system can be used to recover the excess powder from both processes. The invention also includes a handling system for removing the workpiece from the production line, inserting it into the treatment station and moving it past the various modules in the treatment station, withdrawing it from the treatment station, and returning it to the armature production line.

Abstract: A plurality of glass plates 10 are stacked in a block form without forming gaps between adjacent glass plates while the stacked glass plates are separable; the stacked glass plates are cut off in a circular shape or a doughnut-like shape in a block; and then, the processed glass plates are separated. According to this method, tipping which may result when glass plates are processed individually can be prevented whereby processing is easy, and productivity is improved.

Abstract: A spincup having a wafer backside deposition reduction apparatus is used to reduce wafer backside particle deposition of materials on a wafer during processing. The spincup includes an opening for accommodating a wafer supporting chuck and a particle guard which circumscribes the chuck. The particle guard contacts the base of the spincup and circumscribes the chuck. When the chuck supports a wafer, a wafer backside region is defined between the chuck and the particle guard. The spincup further includes an exhaust channel coupled to the wafer backside region to independently exhaust the wafer backside region. In one embodiment, the exhaust channel includes an exhaust port for connecting a vacuum generator to the exhaust channel and a shroud contacting a base of the spincup and the particle guard. In another embodiment, the exhaust channel includes exhaust tubes which replace the exhaust manifold shroud and exhaust port.

Abstract: A length of sheet material is continuously surface treated, typically modified or coated, by continuously feeding helium gas or a helium gas mixture into a treating chamber while a plasma region is created in the gas under atmospheric pressure, continuously moving a length of sheet material into and out of the chamber through entrance and exit ports to pass through the plasma region, thereby continuously subjecting the sheet at either surface to plasma discharge treatment. The entrance and exit ports are sealed in a less gas tight manner to allow leakage of the helium gas or gas mixture.

Abstract: An apparatus for conveying discrete parts between first and second locations. The conveying apparatus has a receptacle for at least one part. Structure is provided for guiding movement of the part receptacle between the first and second locations. Structure is also provided for conveying the part receptacle a) from the first location to the second location and b) from the second location to the first location.

Abstract: In order to subject a workpiece, such as a semiconductor wafer, to elevated pressures the workpiece is enclosed in a void (16) between two enclosure parts (6,7) which have been forced together by upper and lower actuators (12,13). The enclosure parts (6,7) are themselves enclosed in a vacuum chamber (1) evacuatable by a vacuum pumping system. Gas is then supplied from a suitable pressure source via a pipe (17) into void (10), thereby to subject the workpiece to elevated pressure. Heating means may be provided to permit the workpiece to be subject to elevated temperature.

Abstract: A system for controlling a thermal reactor is disclosed that characterizes the thermal reactor with a reactor model that indicates behavior of the thermal reactor and of a load contained in the thermal reactor and that accounts for interaction among a set of heating zones of the thermal reactor. An online reactor model is then determined that estimates the thermal behavior of the load based upon an online input power to the thermal reactor and upon an online temperature indication from the thermal reactor. A time varying temperature and reactant flow recipe is determined that minimizes end of run parameters on the load. A multi-variable controller is employed to minimize temperature deviations of the load from a predetermined temperature recipe or time varying trajectory.

Abstract: Hard substrates such as ophthalmic lenses or molds are coated with a UV curable monomer which is polymerized to construct a scratch resistant coating on a surface of the lens. The present invention is directed to an apparatus for and method of applying the UV curable monomer to the surface of the ophthalmic lens or mold. Polymerization of the monomer occurs by radiation of UV light while the lens is encased in a curing chamber. The spin coater of the present invention has the following advantages: Excess monomer is collected in a dish away from UV exposure and is readily disposed of. The substrate is revolved at a high rate of speed during the application of the coating to achieve a uniform coating of monomer. Only the holder and substrate are moved to the curing chamber minimizing the items exposed to UV light. The UV light is electrodeless, it has a standby mode and operates cyclically during use so as to prolong its life and to allow a greater degree of control over extent of polymerization.

Abstract: A thermal processing furnace provided with a helical-shaped heating resistance element along an inner wall surface of a cylindrical insulating member, wherein support members support the heating resistance element that has been divided into a plurality of parts in an axial direction of the insulating member. Each of the support members is formed of a plurality of support pieces that extend in a radially outward direction with respect to the furnace and at a pitch corresponding to that of the heating resistance element, on a base portion positioned on an inner side of the heating resistance element, and tip portions of the support pieces are embedded in the insulating member. Since this enables a simplification of the structure, it is possible to improve the practicability of the process and reduce the fabrication time, with a simple fabrication design, and it is also possible to improve the accuracy of the pitch at which the heating resistance element is arrayed.

Abstract: An apparatus for manufacturing an oxide superconducting film employing laser ablation method having a thin film forming chamber having a laser-transparent laser entrance window, a target being provided in the thin film forming chamber and containing components of an oxide superconductor, a laser beam source for irradiating the target with a laser beam from the exterior of the thin film forming chamber through the laser entrance window, and a controller for controlling power of the laser beam which is applied to the target for preventing the power of the laser beam, being applied to the target, from reduction by contamination of the entrance window caused by scattered particles. According to the present invention, it is possible to form an oxide superconducting film having high and uniform characteristics even if a long time is required for film formation, thereby attaining a remarkable effect in improvement of superconductivity of a large area oxide superconducting film.

Abstract: A wafer heater for use in a semiconductor producing apparatus or the like. The heater includes a discoidal substrate made of a dense ceramic, and a resistance heating element buried in the substrate. The surface of the substrate other than that surface upon which a wafer is to be placed for heating is a flat surface. The heating unit further includes a hollow sheath of which inner pressure is not substantially varied even when the pressure inside the chamber changes and is partially embedded and joined to the heater, and a thermocouple inserted into the hollow sheath.