Abstract: A robotic arm assembly in a transport module is expansible to have an effector at its end receive a substrate in a cassette module and is then contracted and rotated with the effector to have the effector face a process module. Planets on a turntable in the process module are rotatable on first parallel axes. The turntable is rotatable on a second axis parallel to the first axes to move successive planets to a position facing the effector. At this position, an alignment assembly is aligned with, but axially displaced from, one of the planets. This assembly is moved axially into coupled relationship with such planet and then rotated to a position aligning the substrate on the effector axially with such planet when the arm assembly is expanded. A lifter assembly aligned with, and initially displaced from, such planet is moved axially to lift the substrate from the effector. The arm assembly is then contracted, rotated with the effector and expanded to receive the next cassette module substrate.

Abstract: A robotic arm assembly in a transport module is expansible to have an effector at its end receive a substrate in a cassette module and is then contracted and rotated with the effector to have the effector face a process module. Planets on a turntable in the process module are rotatable on first parallel axes. The turntable is rotatable on a second axis parallel to the first axes to move successive planets to a position facing the effector. At this position, an alignment assembly is aligned with, but axially displaced from, one of the planets. This assembly is moved axially into coupled relationship with such planet and then rotated to a position aligning the substrate on the effector axially with such planet when the arm assembly is expanded. A lifter assembly aligned with, and initially displaced from, such planet is moved axially to lift the substrate from the effector. The arm assembly is then contracted, rotated with the effector and expanded to receive the next cassette module substrate.

Abstract: A robotic arm assembly in a transport module is expansible to have an effector at its end receive a substrate in a cassette module and is then contracted and rotated with the effector to have the effector face a process module. Planets on a turntable in the process module are rotatable on first parallel axes. The turntable is rotatable on a second axis parallel to the first axes to move successive planets to a position facing the effector. At this position, an alignment assembly is aligned with, but axially displaced from, one of the planets. This assembly is moved axially into coupled relationship with such planet and then rotated to a position aligning the substrate on the effector axially with such planet when the arm assembly is expanded. A lifter assembly aligned with, and initially displaced from, such planet is moved axially to lift the substrate from the effector. The arm assembly is then contracted, rotated with the effector and expanded to receive the next cassette module substrate.

Abstract: A detachable sponge device for a spin coating machine used to coat a liquid material over a semiconductor wafer is provided. The detachable sponge device is used to prevent the solvent that is jetted on the edge of the wafer from being oversprayed elsewhere on the wafer. The detachable sponge device is composed of a curved mounting piece and a corrugated piece of sponge attached on the curved inner side of the mounting piece. The mounting piece can be detachably mounted on the spin coating machine. The corrugated piece of sponge can absorb splattered particles of solvent from the wafer which can thus be prevented from bouncing back onto the wafer. The planarization of the coating of SOG on the wafer thus will not be affected by splattering particles of the solvent. Excellent results of planarization of SOG or photoresist layers can thus be achieved.

Abstract: Apparatus for surface coating or for lacquering of a substrate, such as a disk-shaped substrate 2, which can be placed on a substrate support 14 and can be driven or made to perform a rotating movement, wherein the medium to be applied or the lacquer fluid is applied to the substrate 2 via a feed device 6 which can be displaced in relation to the substrate 2 and/or can be driven. The substrate 2 or the substrate support 14 can be displaced by means of a guide device or in a connecting link guide 7 in such a way that in the area of the substrate 2 the feed device 6 for applying the fluid or the lacquer is conducted approximately parallel with the surface of the substrate 2 and can be stopped at any arbitrary point above the substrate 2 at an even height distance.

Abstract: Apparatuses and methods are disclosed for use in spin dispensing a process liquid onto a surface of a wafer. The wafer is supported and rotated by a rotatable chuck attached by a shaft to a spin motor. A dispense assembly is positioned to dispense process liquid, such as photoresist, onto the wafer support by the chuck. The apparatus further includes a bowl having a bottom and a side defining an interior region, the bottom containing an opening in which the shaft is movable. An air ring is disposed in the interior region around said chuck to define an upper plenum in fluid communication with a lower plenum. The air ring further includes at least one flow path through the air ring to said lower plenum, preferably in the form of a plurality of holes in a circumferential groove. Also in a preferred embodiment, a top ring is provided having a bottom face and an inner lip having dimensions smaller than the outer rim and larger than the wafer.

Abstract: A robotic arm assembly in a transport module is expansible to have an effector at its end receive a substrate in a cassette module and is then contracted and rotated with the effector to have the effector face a process module. Planets on a turntable in the process module are rotatable on first parallel axes. The turntable is rotatable on a second axis parallel to the first axes to move successive planets to a position facing the effector. At this position, an alignment assembly is aligned with, but axially displaced from, one of the planets. This assembly is moved axially into coupled relationship with such planet and then rotated to a position aligning the substrate on the effector axially with such planet when the arm assembly is expanded. A lifter assembly aligned with, and initially displaced from, such planet is moved axially to lift the substrate from the effector. The arm assembly is then contracted, rotated with the effector and expanded to receive the next cassette module substrate.

Abstract: By irradiating with high-intensity pulsed laser light of wavelength 9.0.mu. to 11.0.mu. the organic film on rollers, and specifically, the film on photosensitive drums, fixing rollers, rubber rollers, and magnetic rollers used in photocopying equipment, printers, facsimile machines, and other equipment, said film can be removed from the roller surface without damaging the underlying metal layer in any way. Metal cylinders from which film has been removed by this method can either be reused as is, or may be recoated, and then, reused as rollers in photocopying equipment, printers, and facsimile machines.Furthermore, a method is disclosed, wherein laser light irradiation is used to remove film from the surface of various rollers, as is equipment for roller machining and processing.

Abstract: A robotic arm assembly in a transport module is expansible to have an effector at its end receive a substrate in a cassette module and is then contracted and rotated with the effector to have the effector face a process module. Planets on a turntable in the process module are rotatable on first parallel axes. The turntable is rotatable on a second axis parallel to the first axes to move successive planets to a position facing the effector. At this position, an alignment assembly is aligned with, but axially displaced from, one of the planets. This assembly is moved axially into coupled relationship with such planet and then rotated to a position aligning the substrate on the effector axially with such planet when the arm assembly is expanded. A lifter assembly aligned with, and initially displaced from, such planet is moved axially to lift the substrate from the effector. The arm assembly is then contracted, rotated with the effector and expanded to receive the next cassette module substrate.

Abstract: An apparatus for the spin coating of substrates including a substrate carrier, a motor for rotating the substrate carrier, and a spinning bowl surrounding the substrate carrier. A lid is also provided in this spin coating apparatus which at least partially covers the spinning bowl for diminishing the escape for fumes into the ambient atmosphere during the spin coating of a substrate carried by the substrate carrier. The lid is also designed for improving the air flow around the substrate carried by the substrate carrier during the spin coating of the substrate.

Abstract: A velocity adjusting plate is provided above a substrate processing part in the interior of a substrate processing apparatus which is isolated from the external air. Thus, a downflow which is formed by conditioned air in the interior of the apparatus is separated into downflows having high and low velocities to be supplied to the substrate processing part and the periphery of the substrate processing part respectively. Consequently, the former downflow has a velocity which is suitable for controlling the temperature-humidity on the substrate surface and preventing the substrate from adhesion of particles and fine grains of a processing solution scattered from the substrate, while the latter downflow is suppressed to the minimum velocity which is necessary for preventing dusts and particles from creeping up by dispersion. Thus, it is possible to reduce consumption of air which is adjusted in temperature-humidity while isolating the interior of the apparatus from the external air.

Abstract: An apparatus is provided for coating a surface of a plate-like material, or substrate, specifically a semiconductor wafer, with a coating material. The apparatus includes a plurality of self-controlled removable modules including a coating assembly, at least one thermal conditioning module, and a substrate handling device, and a host controller. The coating assembly is used to dispense coating material from a coating source onto the surface of the substrate material positioned in the coating assembly. The material handling device is positioned to access and move substrates between the coating assembly, the at least one thermal conditioning module and other modules included in the apparatus. The host controller provides substrate thermal conditioning, coating and handling information to the corresponding modules and tracks the location of each substrate in the apparatus.

Abstract: An apparatus for exhausting coating materials used in the process of spin coating a top surface of a wafer, the wafer having an edge and a bottom surface that is supported and rotated by a rotatable chuck attached by a shaft to a spin motor. The apparatus includes a bowl having an exhausted drain configured to receive excess liquid and vapor from the spin coating and an assembly configured to maintain the drain at a negative pressure differential relative to the bowl. In a preferred embodiment, a baffle is attached to the bottom to limit the flow of the liquid and vapor into the drain to a predetermined direction.

Abstract: An apparatus for surface coating or for lacquering a substrate, such as a disk-shaped substrate 2, which can be placed on a substrate carrier 14 and can be driven or given a rotating movement by means of a drive device, wherein the material or the lacquer fluid 5 to be applied is placed on the substrate 2 from a feed device 6. The fluid medium or the lacquer 4 released by the substrate support 14 is delivered at least to a first collecting reservoir 17 which is connected with at least one filter 28, from where the fluid is indirectly or directly conducted via a pump 29 to the first collecting reservoir 27, wherein an underpressure can be set between a first flow-off line 33 of the first collecting reservoir 27 and the pump 29.

Abstract: A substrate spin coating apparatus for forming a coating film on the upper surface of a spinning substrate includes a spin chuck for supporting and spinning the substrate while holding same substantially in horizontal posture. A scatter preventive cup surrounds lateral and lower regions of the spin chuck, and defines an opening in an upper central region thereof for allowing entry of air flows. An exhaust vent is provided for downwardly exhausting the air flows, and a nozzle is provided for supplying a coating solution through the opening of the scatter preventive cup to the upper surface of the substrate. The scatter preventive cup includes an air passage formed in a bottom region thereof and opening toward a lower surface of the substrate. An air flow adjusting unit is connected to the air passage for adjusting an air flow to a predetermined temperature and supplying the adjusted air flow to the air passage.

Abstract: A robotic arm assembly in a transport module is expansible to have an effector at its end receive a substrate in a cassette module and is then contracted and rotated with the effector to have the effector face a process module. Planets on a turntable in the process module are rotatable on first parallel axes. The turntable is rotatable on a second axis parallel to the first axes to move successive planets to a position facing the effector. At this position, an alignment assembly is aligned with, but axially displaced from, one of the planets. This assembly is moved axially into coupled relationship with such planet and then rotated to a position aligning the substrate on the effector axially with such planet when the arm assembly is expanded. A lifter assembly aligned with, and initially displaced from, such planet is moved axially to lift the substrate from the effector. The arm assembly is then contracted, rotated with the effector and expanded to receive the next cassette module substrate.

Abstract: A substrate wafer processing method and apparatus is disclosed utilizing a bowl having a central axis, a baffle surface positioned above the inside bottom surface of the bowl and a chuck member having a top surface for supporting and spinning substrate and positionable coaxially within the bowl closely spaced from the baffle surface. Means and methods are described for directing a gas stream radially outwardly between the bottom surface of the chuck member and the baffle. The specific surface construction of the baffle is disclosed as part of a plenum member as well as a deflecting surface that projects to a level above the top surface of the substrate.

Abstract: An apparatus for subjecting a plurality of wafers to coating and heating treatments, including a coating section for subjecting the wafers to a coating treatment one by one, a heating section for subjecting wafers which have undergone the coating treatment to a heating treatment all together, and an interface section arranged between the coating section and the heating section. The wafers are heat-treated in the heat treatment section while the wafers are stacked at intervals in a vertical direction in a boat. The wafers which have undergone the coating treatment are loaded into the boat by a conveying member in the interface section. The conveying member and the boat are surrounded by a surrounding space formed by a casing at the interface section. A circulation line is combined with an air supply and exhaust system, for circulating air in the surrounding space.

Abstract: A apparatus of resist-processing a rectangular substrate including a resist coating step of supplying resist solution to the substrate, while rotating it, to form resist film at least on one surface of it and a resist removing step of jetting removing liquid, which can solve resist, to both surfaces of it at its side peripheral portions to remove the resist film from them.

Abstract: In the present invention, a waste solution and a exhaust gas are guided together from a drain cup DC into a storing means through common discharge means. Naturally, the gas-liquid separation is performed within the storing means in place of performing the gas-liquid separation within the drain cup DC. Therefore, the waste solution is not solidified within the drain cup so as to plug the common discharge means. Also, a predetermined waste solution is kept stored in the storing means included in the coating apparatus of the present invention, making it possible to permit the surface of the stored waste solution to absorb the mist, and the waste solution is prevented from being solidified within the storing means. Further, since a minimum amount of the exhaust gas is kept discharged even during non-operation of the coating apparatus by using an exhaust gas damper whose degree of opening can be controlled, the waste solution stored in the storing means is prevented from being solidified.

Abstract: A plurality of petri dishes or other glass or plastic containers are coated on the inside bottom surface of the containers by passing the containers through a coating or layering apparatus. The apparatus includes an indexing conveyor to sequentially pass the open containers through a filling station where an amount of a coating material is applied while tilting the container to one side thereby distributing the material to the entire bottom surface of the container. The containers are conveyed to an aspirating station to aspirate excess material while tilting the container toward the aspirating nozzle. Subsequent to the aspiration step, the containers are tilted in the opposite direction to distribute the material in the container. The material is then dried and the containers stacked and packaged. The coating material includes metal ions such as calcium or other divalent metal ions, in a suitable carrier that is able to bond the bottom inside surface of the container.

Abstract: A method and an apparatus are disclosed for preventing the formation of humps along the edge of substrates while being spin coated. Said humps are especially observed in edge rinsing substrates that are being coated with spin-on-glass (SOG) and state of the art photoresists. The edge rinse is usually directed at the edge of the substrate at a certain angle from the vertical axis of the rotating substrate. The hump is a consequence of the phenomenon of hydraulic jump that occurs in fluid flow. The humps, later in the manufacturing process, disintegrate causing particle contamination problems. A novel technique is proposed where the formation of humps is prevented by directing a jet stream of gas at the hump. The jet is placed along the plane of the spinning substrate, and behind the rinse nozzle in the direction of the spin.

Abstract: Disclosed is an apparatus for coating resist comprising a spin-chuck capable of moving vertically, holding a substrate received and rotating together with the substrate, resist solution supplying mean for supplying a resist solution onto a substrate held on the spin-chuck, a rotating cup surrounding the substrate held on the spin-chuck and rotated in synchronism with the spin-chuck, for receiving the resist solution centrifugally separated from the substrate, a drain cup provided around the rotating cup, for receiving a waste material discharged from the rotating cup, the drain cup having a collecting space for collecting the waste material received, a drainage passage having a drainage port opening into the collecting space for discharging a liquid component of the waste material collected in the collecting space therefrom, an exhaust passage having an exhaust port communicating with the collecting space, for discharging a gas component of the waste material collected in the collecting space therefrom, an ex

Abstract: A process and device are disclosed for coating with a suspension the inside of meandrous one-tube glass vessels with U-bends. After the introduction of a measured amount of a suspension, the vessel is axially rotated moving horizontally and is tilted, so that the legs of the one-tube glass vessel take a horizontal position between the reversal points of the tilting movement.

Abstract: A method for reducing the abrasiveness of a coated product web is described, in which the product web is guided with its coated side over a deflection roller (2) and thereafter, in the course of a contact zone over guide rollers and deflection rollers or linear zones in between, is treated with itself, ie. once again with an abrasive surface. The abrasive action can be controlled in a specific manner through the relative speeds of the two surfaces, the tape tension and the length of the contact surface. Abraded particles present on the layer surface are subsequently removed by extraction.

Abstract: A product collecting device for use in an apparatus for coating seed with gel includes a product receiving case, a top portion of which is open, arranged in a downward direction of water wash bath. A partition wall is provided for a bottom wall of the product receiving case. A product collecting port is provided for one side of the partition wall. The other side of the partition wall is provided with a draining hole located directly under a carrying out side end portion of the water wash bath. A draining chute which covers the other side of bottom wall, is inclined downward toward the product collecting port water breaking hole is provide in such a way that a length of the water breaking hole is long along the direction both of inclination and hardening.

Abstract: An apparatus including a structure which separates a first transport robot (high temperature robot), which accesses a first processing part group including the thermal processing parts, from a second transport robot (low temperature robot) which accesses the only non-thermal processing parts. During circulating transportation of substrates to be processed, heat created at thermal processing parts is prevented from flowing into non-thermal processing parts. Semiconductor wafers are circulated one by one between the first processing part group which includes a hot plate and a second processing part group which does not include a hot plate and processed one at a time at each processing part. The high temperature robot accesses the first processing part group while the low temperature robot accesses the second processing part group. Transfer of a semiconductor wafer between the two robots is performed at a transfer part which is formed using a cool plate.

Abstract: A substrate processing apparatus has an article transferring unit for transferring articles, and an arm assembly is provided on the transferring unit. Each arm of the arm assembly is provided with pawls for contacting and supporting undersurface portions of the peripheral side wall of each of the articles, and one or more sucking portions are provided on the upper surface of the arm and are disposed above the corresponding pawl or pawls. The pawls, or the sucking portion or sucking portions are selected for every process, and supporting or holding of each of the articles and the required transfer of each of the articles are performed. The transfer can be performed by changing the operating range of each of the arms without replacing the arms. Taking each of the articles in and out of the processing units are carried out smoothly and a series of processes are achieve efficiently.

Abstract: An automated coating system includes a first coating station where a coating material is sequentially applied to bearing assemblies while a first side of each bearing assembly faces upward. A conveyor sequentially moves the bearing assemblies to a turning station where the bearing assemblies are turned over. The conveyor then moves the bearing assemblies to a second coating station where coating material is sequentially applied to the bearing assemblies while second sides of the bearing assemblies face upward. The conveyor then moves the bearing assemblies to a rotating station where an inner bearing race is rotated relative to an outer bearing race to promote even distribution of the coating material.

Abstract: The invention disclosed defined a vertically extending passage through the rotary center of an inner cup or the rotary center of a spinner in a notary chemical treater, disposes a stationary cleaning fluid nozzle in the passage, and injects the cleaning fluid from the nozzle to clean a lid of the rotary chemical treater and the underside of an object treatment within the treater. The underside of the lid and the underside of the objective part are efficiently cleaned, and the need for sealing the movable parts against the cleaning fluid is eliminated because the nozzle is stationary, ensuring the prevention of the cleaning fluid from leaking.

Abstract: A substrate processing apparatus according to this invention includes an interface section having a first transfer member for transferring an object from a coating process section for applying a process solution to the object in accordance with a single sheet process to an object holding member, and a moving member for detachably supplying a plurality of object holding member and simultaneously moving the plurality of object holding member, and a heat-treatment section having a second transfer member for transferring the object placed on the object holding member to a heat-treatment section for heat-treating the plurality of objects, which have undergone the coating process, in accordance with a batch process.

Abstract: A device for applying an evaporation-inhibiting film to an exposed liquid surface of a liquid body, which includes an impeller disposed below and coplanar with the exposed liquid surface; means for rotating said impeller; means for delivering the evaporation-inhibiting film to the exposed liquid surface at a location immediately above said impeller; and means for bringing liquid from beneath the exposed surface of the liquid body to above said impeller.

Abstract: Apparatus for applying powdered coating to a workpiece--particularly to electric motor armatures and stators--including features relating to handling and masking of workpieces before, during and after coating, is provided. A first feature of the invention is the inclusion of all coating steps--e.g., coating, cleaning and precuring--as modules in a single treatment station on the production line. The treatment station can also be enclosed in a single housing to contain excess powder from both the coating and cleaning processes, so that a single powder recovery system can be used to recover the excess powder from both processes. The invention also includes a handling system for removing the workpiece from the production line, inserting it into the treatment station and moving it past the various modules in the treatment station, withdrawing it from the treatment station, and returning it to the armature production line.

Abstract: A method and apparatus are disclosed for coating uniformly thick photoresist upon the surface of a semiconductor having an uneven topography.The uniform thickness of photoresist on a wafer provided with a variety of patterns can be achieved by use of the apparatus of the present invention. In this regard, a wafer of which the upper surface is primarily coated with photoresist is mounted in the wafer cassette 6 so that the upper surface faces downward and the heater 7 raises the temperature of the chamber 4 to an extent that the primarily coated photoresist may flow while the pressure is kept twice or three times larger than atmosphere by the pressure control terminal 5 under a gaseous atmosphere. Under the influence of gravity, the photoresist is distributed and flows from the surface of the wafer to the patterns since the wafer is upset. The resultant photoresist has a surface which is reshaped along with the topology thereunder and thus, has almost uniform thickness everywhere.

Abstract: A spincup having a wafer backside deposition reduction apparatus is used to reduce wafer backside particle deposition of materials on a wafer during processing. The spincup includes an opening for accommodating a wafer supporting chuck and a particle guard which circumscribes the chuck. The particle guard contacts the base of the spincup and circumscribes the chuck. When the chuck supports a wafer, a wafer backside region is defined between the chuck and the particle guard. The spincup further includes an exhaust channel coupled to the wafer backside region to independently exhaust the wafer backside region. In one embodiment, the exhaust channel includes an exhaust port for connecting a vacuum generator to the exhaust channel and a shroud contacting a base of the spincup and the particle guard. In another embodiment, the exhaust channel includes exhaust tubes which replace the exhaust manifold shroud and exhaust port.

Abstract: Hard substrates such as ophthalmic lenses or molds are coated with a UV curable monomer which is polymerized to construct a scratch resistant coating on a surface of the lens. The present invention is directed to an apparatus for and method of applying the UV curable monomer to the surface of the ophthalmic lens or mold. Polymerization of the monomer occurs by radiation of UV light while the lens is encased in a curing chamber. The spin coater of the present invention has the following advantages: Excess monomer is collected in a dish away from UV exposure and is readily disposed of. The substrate is revolved at a high rate of speed during the application of the coating to achieve a uniform coating of monomer. Only the holder and substrate are moved to the curing chamber minimizing the items exposed to UV light. The UV light is electrodeless, it has a standby mode and operates cyclically during use so as to prolong its life and to allow a greater degree of control over extent of polymerization.

Abstract: Apparatus for impregnating wood veneer with a liquid impregnant comprises a container having an upper chamber communicated to a lower impregnation chamber. A clamping mechanism is releasably engageable to a peripheral region of the wood veneer and is cooperably received in the upper chamber in a manner to suspend the wood veneer in the impregnation chamber. An elevator overlies the container and is releasably connectable to the clamping mechanism for lowering the clamping mechanism into the upper chamber to suspend the wood veneer in the impregnation chamber therebelow. The clamping mechanism is disconnected from the elevator such that the clamping mechanism remains in the upper chamber during impregnation of the wood veneer with liquid impregnant. The impregnation chamber is evacuated by a vacuum pump after the wood veneer is suspended therein, and liquid impregnant is introduced from a storage tank to the impregnation chamber about the wood veneer.

Abstract: A coating system for detecting the presence of contaminants carried by a fluid that is applied as a coating on a workpiece. A tube guides the fluid along a flow path to the workpiece. A light source illuminates the fluid along at least a portion of the flow path, and this light is scattered by any contaminants present in the fluid. Light scattered by the contaminant particles is more intense than light scattered by the other fluid particles, and this brighter scattered light is detected by a light detector positioned adjacent to the fluid flow path. If one or more contaminant particles is detected in the fluid, a warning signal can be given and/or the flow of fluid can be stopped. This coating system is particularly well suited for use in a spin-on coating process that applies a liquid, such as a photoresist material or a dielectric material, to a semiconductor wafer or other workpiece that is secured to a rotating turntable.

Abstract: A disk body (1) is arranged so that a portion of the coating forming surface thereof exists over a spray region A of a substantially circular cross-section made by a nozzle (10) for production of super fine particles to spray a coating forming agent, and the coating forming agent is sprayed while the disk body (1) is being rotated about the center thereof. The section near the peripheral edge of the disk body (1) passes through the section near the center of the spraying region where the density of fine particles is higher; however the passing speed thereof is fast, so the deposit efficiency of fine particles per unit area of the disk body (1) is lower, while the section near the center of the disk body (1) passes through the section near the peripheral edge of the spray region where the density of fine particles is lower; however, the passing speed thereof is slow, so the deposit efficiency of fine particles per unit area of the disk body is higher.

Abstract: An apparatus and method are provided for controlling the rate of drying of a high-viscosity chemical applied to a substantially flat surface of a spinning article. The rate of drying of the chemical is controlled by controlling the saturation level of a solvent in the local atmosphere in which the article is spinning, i.e., in the air space adjacent to the surface of the article. By spinning the article in a solvent-laden vapor, the evaporation of solvent from the chemical is slowed and therefore the rate at which the chemical dries and thickens is also slowed. Spreading of the chemical may also be facilitated and premature drying of the chemical may be avoided by applying to the surface of the article a thin layer of the solvent prior to application of the chemical.

Abstract: The invention provides a method and apparatus for coating horizontal and vertical components of a vehicle body. The designations horizontal component and vehicle component generally refer to the in-body position of such components (panels) after final assembly. In the method, coating is conducted prior to assembly of such components. According to one aspect of the invention, the vertical panels are coated in their in-body position, and then moved to a horizontal position while baking sufficiently to set the coating. Preferably, the horizontal position is maintained for the entire bake cycle.

Abstract: The invention relates to a device and a method for manufacturing a mould for a disc-shaped registration carrier, said device being provided with a station for applying a photosensitive layer, such as a photoresist layer, to a substrate, with a station for exposing said photosensitive layer in accordance with the registration data to be stored, with a station for developing the photosensitive layer and metallizing the side of the substrate carrying the developed photoresist layer, and with a station for applying a metal coating, wherein the various stations are accommodated in a housing and means for receiving the substrates are provided in the various stations, whilst a transport mechanism disposed within the housing is provided with at least one transport means for gripping a substrate, which transport means is movable in a horizontal plane in two directions including an angle with each other, and which is also capable of moving upward and downward within the housing.

Abstract: A semiconductor treatment apparatus has a gas-phase decomposing device for decomposing a gas-phase on a surface of a semiconductor substrate, a substrate supporting device for supporting the substrate, and a substrate transfer device for transferring the substrate between the gas-phase decomposing device and the substrate supporting device. The apparatus further has a liquid-drop applicator for applying a liquid-drop on the surface of the substrate supported by the substrate supporting device, with the liquid-drop being brought into contact with the surface of the substrate, and a liquid-drop preserving device for preserving the liquid-drop that has been applied to the surface of the substrate.

Abstract: A liquid coating system according to the present invention comprises, a liquid supply source, a nozzle having an inlet communicating with the liquid supply source and a substantially linear liquid discharge portion, a pressure feed unit for feeding the liquid under pressure from the liquid supply source to the nozzle by means of compressed gas, a spin chuck for fixedly supporting a semiconductor wafer, an up-and-down cylinder for causing the liquid discharge portion of the nozzle to closely face the wafer on the spin chuck, and a rotating mechanism for rotating the spin chuck. The nozzle includes a liquid reservoir, in which the liquid supplied from the liquid supply source is collected, and a large number of small passages communicating with the liquid reservoir.

Abstract: A method is disclosed for coating dowels with a substantially uniform coat of water soluble glue. A plurality of dowels and a preselected amount of liquid, water soluble glue are placed in a closed container. The container is rapidly shaken so that the container moves in a combination oscillating motion comprising an up and down movement and a back and forth movement that is substantially perpendicular to the up and down movement. Dowels coated with the liquid, water soluble glue are removed from the container and deposited on a drying surface. The dowels are dried by applying heat and a stream of air to the dowels. When the exposed surface of the coat of water soluble glue on the dowels has become essentially tack free but before the coat has dried completely, the dowels are rotated about their longitudinal axes so as to separate any dowels that are stuck together and to free any dowels stuck to the drying surface.

Abstract: A compact slide spinner is disclosed. In the preferred embodiment, the compact slide spinner is used to prepare smears for microscopic evaluation. The spinner incorporates a disposable or reusable slide holder which encases a portion of a slide onto which the material to be smeared is placed. The holder containing the slide is then accelerated by spinning. Specimen fluid not adhering to the slide is contained within the slide holder which is discarded following preparation of the smear. Using this low-cost device, a uniform quality smear is quickly and easily prepared, while reducing the risk that laboratory personnel will be exposed to aerosol borne contagions.

Abstract: A method and apparatus for producing a breathable coated fabric is disclosed. The method involves coating a fabric substrate with a resin then opening pores in the resin by directing a flow of air through the fabric substrate and resin coating. The pores provide breathability of the coated fabric and allow for a vapor or moisture transmission rate about ten times that of a resin coated fabric without pores.

Abstract: A developer-supply apparatus has a developer-liquid supply nozzle, a spin chuck for supporting a wafer, and a holder for allowing the supply nozzle to wait there. The supply nozzle is transferred between a position above the chuck and a waiting position on the holder. The supply nozzle has a nozzle tip with a plurality of through holes communicating with a space containing a developer liquid. A U-shaped conduit extending along the line of the through holes is provided in the holder, for removing drops of the developer liquid hanging from the nozzle tip. The conduit has a bottom provided with a plurality of through holes for exhausting the developer liquid.

Abstract: An apparatus for forming phosphor layers in cathode-ray tubes includes a table having a plurality of operating positions for processing panels for cathode-ray tubes to coat phosphor layers thereon. A plurality of angularly spaced clamp heads for holding the panels, respectively, are supported on the table for rotation about a first axis and angular movement about a second axis in each of the operating positions. A cam, which is operatively connected to the clamp heads, has a first cam groove for angularly moving the clamp heads through different angles about the second axis in the operating positions and a second cam groove for keeping the clamp heads in a fixed angular position with respect to the second axis in the operating positions. Joint cam groove mechanisms are combined with the cam for selectively switching between the first and second cam grooves.

Abstract: A resist film coating apparatus comprises a resist receiving plate secured to a rotatable support plate carrying a wafer so as to be disposed along the outer periphery of the wafer, an interference type film thickness meter for measuring the thickness of a resist film spun out to the resist receiving plate, and modifying means for changing the revolution number of the support plate on the basis of a result of measurement by the film thickness meter such that a desired resist film thickness can be obtained.