Abstract: Inspection equipment for detecting defects in a wafer is provided in a coating and developing system including a plurality of kinds of processing units for performing processing necessary for coating a wafer with a resist and processing necessary for developing the resist on the wafer. The transfer of the wafer between the processing units and the inspection equipment is performed by means of a main transfer device. The inspection equipment sends an inspection result as a detection signal to a controller, and the controller which receives the detection signal controls exposure conditions for an aligner according to the presence or absence of defects and adjusts a frequency regulating mechanism to control inspection frequency. The wafer is transferred between the processing units and the inspection equipment by the main transfer device, whereby the wafer is not artificially contaminated.

Abstract: A semiconductor device is fabricated by the steps of coating an underlayer formed on a semiconductor substrate with chemically amplified resist, exposing the resist to light, bringing the resist into contact with an alkaline developing solution with applying a magnetic field to the alkaline developing solution for conducting development to form a resist pattern, and etching the underlayer on the semiconductor substrate using the resist pattern as a mask.

Abstract: An apparatus for forming a panel surface film of a cathode ray tube is provided with a faceplate having an opening for supporting the cathode ray tube in such a manner that the panel surface of the cathode ray tube is exposed when inserted in the opening and is directed downward, a base member, a bearing, provided for the base member, for rotatably supporting the faceplate, and a torque transmission mechanism, coupled to a torque source, for transmitting torque of the torque source to the faceplate through the bearing. The bearing includes an outer ring having a circular inner shape, an inner ring rotatably fitted within the outer ring, rolling elements arranged between the outer ring and the inner ring, a coupling section which is formed on one of the outer and inner rings and to which the faceplate is coupled, and a fixing section which is formed on another one of the outer and inner rings and which is fixed to the base member.

Abstract: A system and method is provided that facilitates the application of a uniform layer of developer material on a photoresist material layer. The system includes a multiple tip nozzle and a movement system that moves the nozzle to an operating position above a central region of a photoresist material layer located on a substrate, and applies a volume of developer as the nozzle scan moves across a predetermined path. The movement system moves the nozzle in two dimensions by providing an arm that has a first arm member that is pivotable about a first rotational axis and a second arm member that is pivotable about a second rotational axis or is movable along a translational axis. The system also provides a measurement system that measures the thickness uniformity of the developed photoresist material layer disposed on a test wafer. The thickness uniformity data is used to reconfigure the predetermined path of the nozzle as the developer is applied.

Abstract: Prior to transfer of an wafer W, a mixed gas is being generated and exhausted, thereby fluctuation of concentration and temperature of a solvent component at the beginning of gas introduction into a chamber 3 is suppressed. A step of gelling after the wafer W is carried into an aging unit is divided into several steps. Until a temperature of the wafer W reaches a predetermined treatment temperature, an average concentration of the solvent component in a mixed gas is gradually raised relative to the temperature of the wafer W. Thereby, immediately after the wafer W is transferred into a sealed chamber, the gas of the solvent component is prevented from condensing.

Abstract: A coater having a controllable pressurized process chamber for applying photoresist to a wafer is provided. The controllable pressurized process chamber reduces the evaporation of solvent in the photoresist during a spin-on process step. Reducing premature curing of the photoresist results in improved uniform planarization of the photoresist layer. Contaminants in the photoresist are also reduced by having an environmentally controllable process chamber. A housing having a upper and lower section forms a process chamber surrounding a wafer chuck. The upper housing section includes a solvent vapor opening for introducing pressurized solvent vapor into the process chamber and the lower housing section includes an exhaust opening. The upper housing section also includes an opening for introducing photoresist onto a wafer. A control device is coupled to the exhaust opening and a vacuum device for controlling the pressure in the process chamber.

Abstract: A liquid coating apparatus that is adapted for dispensing two or more different liquids and a method for using such apparatus are disclosed. In the apparatus, when two different liquids are dispensed in the same coating apparatus, two separate drain cups are utilized in which an upper drain cup is constructed in a toroidal shape and formed in two symmetrical halves such that they may be withdrawn from an operating position outwardly to allow a wafer platform and a liquid spray nozzle to be lowered into a lower drain cup for dispensing a second liquid material. The lower drain cup can be mounted concentrically with the upper drain cup. The present invention novel apparatus allows at least two different liquids to be processed in the same coating apparatus such that chemical reactions between the different liquids and the resulting particle formation and contamination problems can be avoided.

Abstract: An apparatus for exhausting coating materials used in the process of spin coating a top surface of a wafer, the wafer having an edge and a bottom surface that is supported and rotated by a rotatable chuck attached by a shaft to a spin motor. The apparatus includes a bowl having an exhausted drain configured to receive excess liquid and vapor from the spin coating and an assembly configured to maintain the drain at a negative pressure differential relative to the bowl. In a preferred embodiment, a baffle is attached to the bottom to limit the flow of the liquid and vapor into the drain to a predetermined direction.

Abstract: A resist processing system includes a sensor connected for detecting the surface level of the processing solution contained in an intermediate tank, and a controller connected for controlling the fluid pressure on the basis of the surface level detected by the sensor.

Abstract: A system and method distribute a resin disposed between a top substrate and a bottom substrate. Each substrate has a center hole, and the top and bottom substrates and the resin define an interior region. A top substrate assembly forms a seal over the center hole of the top substrate and creates a vacuum at the interior region. A bottom substrate assembly receives the top and bottom substrates with the resin disposed in-between. A spinning assembly causes the top and bottom substrates to spin according to a predetermined spin profile.

Abstract: To coat a surface of a medical implant such as an organ part or a synthetic prosthesis with a coating of living cells, the implant is inserted and fixed into a receiving container which is at least partially filled with a nutritive liquid medium containing the coating cells in suspension. Then the receiving container is rotated respectively about two distinct rotation axes, whereby preferably the two rotation motions are independently controllable and the two axes are substantially perpendicular to each other. Each of the two rotation motions can be a continuous rotation through 360°, or a stepwise intermittent rotation through successive rotational angle steps. The parameters of the two rotations about the two axes can be combined as needed for a particular application, for example a continuous rotation about one axis combined with a stepwise rotation about the other axis. The time period and rotational speed of each rotation can also be independently controlled.

Abstract: An interface apparatus places, in a boat, plural wafers transported thereto one by one from an application apparatus for performing single wafer processing, then transports the boat having the wafers placed therein to a heating apparatus for subjecting plural wafers to a heat treatment process, and after completion of the heat treatment process, receives the boat. The interface apparatus includes a stage, a rotary table rotatably arranged on the stage for placing the boat thereon, and a positioning mechanism for turning the rotary table in a direction of displacement of the boat to permit the boat to be placed on the rotary table when the boat is being placed on the rotary table with the position thereof displaced from a reference position in a rotatable direction of the rotary table, and after completion of the placement, turning the rotary table in a direction opposite to the displacement direction to thereby position the boat at the reference position.

Abstract: A track coater unit cup set for using in a wafer spin coating process comprises a hollow concave circular base cup, a hollow convex circular inner cup, and a hollow convex circular outer cup. The base cup has an inner circular groove with an inner groove wall and an eccentric outer circular groove with an outer circular groove wall. The inner cup capable of resting upon the base cup by engaging a downward protruding ring with the inner groove wall of the base cup on a meshing interface in between. The outer cup for shielding above top of the inner cup and capable of resting upon the base cup has a central top opening and a ring of inward tip extruding downward from an edge of the outer cup for forming the top opening. A stall-flow region is defined between the inward tip and adjacent insides of the outer cup. The meshing interface further includes at least a set of anchoring means for avoiding relative slipping between the base cup and the inner cup.

Abstract: A liquid dispense apparatus including a chuck having a support surface, a dispense nozzle directed toward the support surface, and a controller. The controller is connected to the dispense nozzle and the chuck and contains instructions which, when executed by the controller, perform the method including rotating the chuck at a first speed, dispensing a process liquid from the dispense nozzle, rotating the chuck at a reduced second speed, and distributing the process liquid while rotating the chuck at the reduced second speed.

Abstract: A method and apparatus for producing dual-zone lubricated magnetic disks. An absorbent medium is held against a selected portion of the surface of a lubricated disk. The disk is rotated in relation to the absorbent medium, and the absorbent medium removes mobile lubricant from the selected portion of the disk, leaving bonded lubricant in addition to a selected amount of mobile lubricant. In an specific embodiment, an absorbent tape is supplied to a roller that holds the tape against a surface of the disk, and solvent is applied to the tape and/or disk to facilitate the removal of mobile lubricant. Differential lubricant thicknesses are thus obtained.

Abstract: Apparatuses are disclosed for use in dispensing a process liquid onto a surface of a wafer. The apparatus may include a bowl having a bottom and a side defining an interior region. An air ring is disposed in the interior region to define an upper plenum in fluid communication with a lower plenum. The air ring may have at least one flow path therethrough to said lower plenum, preferably in the form of a plurality of holes in a circumferential groove. Also in a preferred embodiment, a top ring is provided to further define the upper plenum. A semiconductor wafer that has a liquid dispensed thereon, may be supported within the bowl to contact portions of the air ring to remove excess liquid migrating to the underside of the wafer. The excess liquid may be drained through the air ring into the lower plenum wherein it is removed by a drain. A solvent dispenser may be provided in the air ring to apply a solvent to the underside of the wafer.

Abstract: An apparatus and methods for use in spin coating a coating material onto a wafer. The apparatus includes a rotatable chuck capable of supporting the wafer and a bowl having a bottom and a side defining an interior region, the bottom containing an opening through which said rotatable chuck is movable and separable from the bowl. In a preferred embodiment the bottom has a raised cylindrical portion containing the opening and, the rotatable chuck is positioned within the opening so that the wafer is in close proximity to the raised portion of the bowl so as to prevent solvent vapors from escaping the bowl through the opening.

Abstract: The present invention relates to an apparatus for the uniform distribution of a small amount of liquid on bulk materials. The method is performed by spraying the liquid with at least one ultrasonic nozzle onto the bulk material, which is finely particulate. The spraying may occur before, during, or both before and during, mixing the particulate solid in a mixing apparatus. Dust may be significantly reduced by the apparatus of the instant invention, and the apparatus is useful for applying not only liquids, but emulsions, solutions, dispersions, or melts. The mixer may be mechanical or pneumatic.

Abstract: A spin holder has a disk-like supporting portion, and a circular wall portion for supporting the back side of a substrate is formed inside the periphery of the top surface of the disk-like supporting portion. A circular groove is formed near the periphery of the top surface of the disk-like supporting portion, the circular groove surrounding the outside of the circular wall portion. An O ring is fitted into the circular groove. The top surface of the circular wall portion on the spin holder supports the back side of the substrate and the O ring comes in close contact with the back side of the substrate. Even if a vacuum leakage occurs between the circular wall portion and the back side of the substrate due to suction force created by a vacuum suction source, the O ring keeps the hermetic state in the space between the circular wall portion and the O ring. This prevents mist around the spin holder from being drawn toward the suction surface between the O ring and the substrate.

Abstract: Methods of forming mask patterns and methods of forming field emitter tip masks are described. In one embodiment a first surface is provided over which a mask pattern is to be formed. A mixture comprising mask particles is applied to a second surface comprising material joined with the first layer. The mixture, as applied, leaves an undesirable distribution of mask particles over the first surface. After application of the mixture to the second surface, the mask particles are laterally distributed over the first surface, into a desirable distribution by placing a particle-dispersing structure directly into the mixture on the second surface and moving the particle-dispersing structure laterally through the mixture on the second surface. In another embodiment, a mixture is formed on the substrate's second surface and includes a liquid component and a plurality of solid mask-forming components.

Abstract: The present invention aims to form a thin coating film of even thickness within a short processing time under a curtailed consumption of coating liquid; where, a gas is spouted from nozzle 4 disposed facing to protection glass 2 of cathode ray tube, and a liquid containing fluorescent material is made to spout accompanied by the spouting gas, to be applied on protection glass 2 by shifting the positioning of protection glass 2 relative to nozzle 4 while spouting the liquid containing fluorescent material.

Abstract: In a process and machine for coating a surface of an ophthalmic lens, the lens is manually loaded by the operator to a wash/dry station within an enclosure of the coating machine. Thereafter, the machine computer controls the entire process. The machine is closed to minimize the introduction of external contaminates into the machine. Positive pressure and filtration of air is initiated in the enclosure before washing the lens. The loaded lens is washed and dried at the wash/dry station. The dried lens is transferred to a coating station within the enclosure and coated. The coated lens is transferred to a curing oven within the enclosure and cured. The cured lens is then discharged from the curing oven and the machine for collection by the operator. The machine can simultaneously process three lenses, one in the wash/dry/coat section, one in the cure section and one at a pick-off station between the wash/dry/coat and cure sections of the machine.

Abstract: A dual-layer DVD disc that does not require a stamping step (typically, as part of the 2P prior art manufacturing process) during its manufacture. A polycarbonate substrate is molded and coated with a semireflective data layer in the usual way. A PMMA substrate is molded and coated with a fully reflective data layer. Adhesive is placed on the semireflective data layer, and the fully reflective data layer is transferred from its PMMA substrate to the polycarbonate substrate. The polycarbonate substrate thus ends up with two data layers in conformance with the DVD specifications, and the PMMA substrate can even be recycled for another use.

Abstract: In a photoresist coating apparatus and method, a rotating wafer is scanned with a spray nozzle from which the photoresist issues. The rotational speed of the wafer is varied based on the relative position of the nozzle above the wafer. The varying of the rotational speed is designed to minimize the amount of photoresist necessary for coating the wafer. Specifically, the photoresist is sprayed from the nozzle while the nozzle scans the wafer in a direction from the peripheral edge of the wafer toward its center, and the rotational speed of the wafer is increased during such scanning.

Abstract: Apparatus for coating a surface of a semiconductor wafer includes at least one treatment module, a handling device that may access each of the treatment modules, and a host controller connected to the handling device and to each of the treatment modules. The treatment modules may include a coating assembly for coating the semiconductor wafer surface and may also include at least one thermal conditioning module. The host controller may control the handling device to move a semiconductor wafer relative to the treatment modules. The treatment modules may be disposed within opposing assemblies and may be removed from the assemblies without disabling the treatment modules remaining within the opposing assemblies.

Abstract: A system and method dispense resin between substrates. A top substrate device holds a top substrate concave up. A bottom substrate device holds a bottom substrate concave down. A resin dispensing device has a needle and dispenses a trajectory of resin defined by an arc having a tangent that touches a tangent of a concave-up-shaped top substrate. The top substrate device may be arranged to include a dampening mechanism to cause a dampened release of the top substrate. Moreover, the top substrate device may be arranged to hold a top substrate so that the top substrate has a continuous concave-up shape extending from a center portion of the top substrate to its outer diameter, and the bottom substrate device may be arranged to hold a bottom substrate so that the bottom substrate has a continuous concave-down shape extending from a center portion of the bottom substrate to its outer diameter.

Abstract: Apparatus and method for depositing fluids on both sides of a semiconductor wafer that has a central opening are provided. In one aspect, the apparatus includes a mandrel for holding the wafer and a motor coupled to the mandrel and that is operable to rotate the mandrel. The apparatus also includes means for dispensing a first volume of fluid on the semiconductor wafer and a second volume of fluid on the semiconductor wafer. According to the method, a semiconductor wafer is coupled to a rotatable mandrel. The mandrel is rotated to spin the semiconductor wafer and a semiconductor processing fluid is sprayed on the first and second sides of the semiconductor wafer.

Abstract: When applying a coating film by a spin coating method on a disc-shaped recording medium, the film thickness difference between the inner rim and the outer rim of the disc has to be suppressed. To this end, a coating liquid is supplied to a center portion of the disc-shaped recording medium and a rotary disc, as a center shaft of a rotary disc is inserted into a recess formed in a turntable on which the disc-shaped recording medium is set and the disc-shaped recording medium and a rotary disc are run in rotation. The coating liquid is spread under the centrifugal force caused by rotation for forming a coating film on the disc-shaped recording medium.

Abstract: A photoresist dispensing system used in a photoresist coating machine includes a pump, a sucking-back valve, a solenoid valve, a first pump speed controller, a second pump speed controller and a sucking-back speed controller. The pump is used to transport photoresist and spray a substrate. The sucking-back valve is used to suck back liquid photoresist from a transporting duct end. The solenoid is used to activate or inactivate the pump and the sucking-back valve. The first and the second pump speed controllers are separately coupled between the pump and the solenoid valve, and the sucking-back speed controller is coupled between the sucking-back valve and the sucking-back speed controller is coupled between the sucking-back valve and the route, where is between the pump and the second pump speed controller. Hence, the sucking-back valve produces a sucking force after the pump is inactivated and releases a sucking force after pump is activated.

Abstract: A coating apparatus of the present invention comprises coating solution supply sources for supplying a coating solution, a mounting table for holding a substrate to allow a surface to be coated to face upward, nozzles for pouring the coating solution toward the surface of the substrate to be coated, mounted on the mounting table, a pump chamber capable of swinging its volume and having a sucking port for introducing the coating solution from the coating solution supply source and a spurting port for spurting the coating solution and to be supplied toward the nozzle, pump driving mechanisms for increasing and decreasing an inner pressure of the pump chamber to introduce and spurt the coating solution into/from the pump chamber, a filter provided inside or at the upstream side of the pump chamber for filtrating the coating solution before the coating solution is spurted out from the pump chamber through the spurting outlet, a valve provided between the pump chamber and the nozzle for regulating a flow amount of

Abstract: Disclosed is a resist coating-developing method and apparatus including (a) a setting step for setting a target value and an allowable range thereof, (b) a resist-coating step, (c) a pre-baking step, (d) a first cooling step, (e) a light-exposure step, (f) a line width measuring step for measuring a line width of a latent image, (g) a post-baking step, (h) a second cooling step, (i) a developing step, (j) a judging step determining whether or not the value of the line width of the latent image measured in the step (f) falls within the allowable range of the target value set in the step (a), (k) a calculating step for calculating a difference between the measured value of the latent image line width and the target value, and (l) a correcting step for correcting the process condition in at least one previous step.

Abstract: An apparatus and method for use in producing three dimensional components by bonding together successive layers of a porous material with droplets of a binder material. A powder is dispensed on a support surface in a layer. A vibratory mechanism vibrates the layer of dispensed powder to compact the powder.

Abstract: A resin coating system includes a coating station for applying resin to dynamo-electric machine components such as electric motor armatures, one or more other stations adjacent to the coating station, a conveyor for transporting components through the coating station where the components are carried by holders holding at least one end of the components without touching the body portion of the components, another conveyor for transporting components through the other stations where the components are carried by holders supporting the body portion of the components, and a transfer device for transferring uncoated and coated components between the two conveyors. The holders attached to the conveyor in the coating station are capable of rotating the components about the longitudinal axis of each component during the coating operation for an even application of the resin to the component.

Abstract: A chamber includes a door which opens to introduce a workpiece into the chamber and which closes to enclose the workpiece within the chamber. A workpiece support is located within said chamber and supports the workpiece such that a coated surface of the workpiece faces in a given direction. A liquid supply mechanism floods the chamber with a liquid to immerse the workpiece support. A pressure pulse supply mechanism applies a pulse of pressure to the liquid such that the pulse of pressure is transmitted through the liquid in a direction opposite the given direction. The pulse of pressure is incident via the liquid on the coated surface of the workpiece supported by the workpiece support.

Abstract: A solid thin film is formed from a layer of liquid material in such a manner as to fill a contact hole formed in a semiconductor structure; a semiconductor structure is firstly cooled rather than ambience, thereafter, liquid material is spread over the semiconductor structure, then the layer of liquid material is pressed so that the liquid material perfectly fills the contact hole, and, finally, the layer of liquid material is heated so as to form a solid layer from the layer of liquid material.

Abstract: In a resist deposition machine, an edge rinse mechanism comprising a cover covering and surrounding an exfoliating-agent discharging nozzle and having an opening formed at a position in the proximity of a peripheral edge portion of a wafer held on a vacuum chuck, and a forced-exhausting tube coupled to the cover. In an edge rinsing operation, the peripheral edge portion of the wafer is accommodated through the opening into an inside of the cover, and a resist exfoliating agent is discharged from the exfoliating-agent discharging nozzle to a peripheral portion of a resist film formed on the wafer held on the vacuum chuck, so that a dissolved resist material and the resist exfoliating agent are scattered into the inside of the cover, and forcibly exhausted from the cover through the forced-exhausting tube. Thus, it is possible to prevent the dissolved resist material and the resist exfoliating agent from adhering on a resist pattern formation zone of the resist film formed on the wafer.

Abstract: A substrate holding apparatus holds a rotating substrate without idly rotating the substrate and keeps the substrate in proper balance while the substrate is rotated. In a revolvable holding member, a column-shaped holding part is disposed on a top surface of a column-shaped supporting part, at an eccentric position with respect to a rotation axis of the supporting part. The revolvable holding member is supported by a rotation base for free rotation, and linked to a magnet holding part which incorporates a permanent magnet. On the other hand, a ring-shaped magnet which is disposed in a processing liquid collecting cup is freely driven by an air cylinder in a vertical direction. As the ring-shaped magnet is moved upward or downward and crosses a predetermined line as viewed in a positional relationship relative to the permanent magnet, which is at a height where the permanent magnet is disposed, the direction of a magnetic line of flux of the ring-shaped magnet is reversed.

Abstract: An apparatus and methods for use in spin coating a coating material onto a wafer. The apparatus includes a rotatable chuck capable of supporting the wafer and a bowl having a bottom and a side defining an interior region, the bottom containing an opening through which said rotatable chuck is movable and separable from the bowl. In a preferred embodiment the bottom has a raised cylindrical portion containing the opening and, the rotatable chuck is positioned within the opening so that the wafer is in close proximity to the raised portion of the bowl so as to prevent solvent vapors from escaping the bowl through the opening.

Abstract: An automated method and apparatus for galvanizing threaded rods, comprising conveying threaded rods while horizontally oriented through a bath of molten zinc, then simultaneously spinning the threaded rods in horizontal orientation at sufficient rotational velocity to remove excess molten zinc therefrom by centrifugal force and conveying the threaded rods to a cooling bath. The automated apparatus then conveys the zinc coated threaded rods through a cooling bath to solidify the molten zinc coating and then collects cooled zinc coated threaded rods to permit efficient removal thereof from the apparatus. A rotary conveyor mechanism of the automated apparatus conveys the threaded rods through a molten zinc bath and removes excess molten zinc therefrom by rolling the coated threaded rods down an inclined zinc removal platform.

Abstract: There are disclosed an opening filling apparatus and a method for manufacturing a semiconductor device by using the same. An opening of a semiconductor device is filled by using the filling apparatus comprising: a chamber having a rotation shaft, a motor, a plurality of plates arranged in a circular form centering at the rotation shaft, and a heater; and injectors for injecting gas. When the opening of a semiconductor device such as a trench or a contact hole is filled, filling material may move down by using the centrifugal force generated by rotating the substrate, to thereby fill the opening completely without a void.

Abstract: The present invention provides an apparatus and method for forming a protective film on a disc-shaped recording medium including providing a turntable having a center aperture, setting the disc-shaped recording medium having a center opening on the turntable with the center opening being aligned with the center aperture, covering at least the center opening of the disc-shaped recording medium with a rotating disc having a portion larger in diameter than the center opening of the disc-shaped recording medium, and supplying a protective film material to the center of the rotating disc and simultaneously rotating the turntable, the disc-shaped recording medium, and the disc to cause an outward radial flow of the protective film material off the disc and onto the disc-shaped recording medium so that the protective film is obtained and has a thickness with a small variation.

Abstract: A system for dipping workpieces into a coating tank that includes a conveyor disposed above the tank and a workpiece carrier movable on the conveyor along a path above the tank. The carrier includes a box frame having pivotal corner connections and vertically spaced guide rollers disposed on laterally opposed sides of the frame. Longitudinally spaced cables suspend the carrier frame from winches on the conveyor for selectively raising and lowering the carrier with respect to the conveyor. The winches and cables are also selectively operable for rocking the carrier frame about a horizontal axis lateral to the path of travel along the conveyor. A pair of track rails are disposed in fixed position on laterally opposed sides of the conveyor for engaging the guide rollers on laterally opposed sides of the carrier frame during lowering of the frame into the tank and maintaining horizontal position of the carrier frame during rocking thereof within the tank.

Abstract: A developing storage disc boss adapted to engage a recess in a rotatable holding table for developing a storage disc including two discoid resin substrates with adhesive contained in a space therebetween. The developing storage disc boss includes a barrel portion for the engagement and a suction cylindrical portion that extends upwardly and orthogonally from a top planar wall of the barrel portion. There is a suction passage extending axially along the boss which includes first and second passages. There are a plurality of suction holes around the periphery of the suction cylindrical portion which communicate with the space between the two substrates. The holes extend radially through the suction cylindrical portion and have inner ends that open directly into the first passage. The first passage opens directly into the second passage, and the diameter of the second passage is greater than that of the first passage.

Abstract: A method for dispensing a chemical, such as an edge bead removal solvent, onto a semiconductor wafer comprising the steps of dispensing the chemical selectively onto the wafer and applying a suction to the area immediately surrounding the location at which the chemical is dispensed onto the wafer. Preferably, the suction is applied simultaneously with the dispensing of the chemical. One specific version of the invention provides an edge bead removal system wherein suction is applied to the area immediately surrounding the solvent dispensing nozzle to remove dissolved coating material and excess solvent from the wafer. In one aspect of this system, an apparatus for removing the edge bead includes a mechanism for dispensing a solvent selectively onto the edge of the wafer, and a mechanism surrounding the dispensing mechanism for vacuuming excess solvent and dissolved coating material from the edge of the wafer.

Abstract: An apparatus for forming a coating film, comprises a spin chuck for supporting a substrate with one surface facing upward and rotating the substrate about a vertical axis, a first nozzle for supplying a solvent of a coating solution on the substrate, and a second nozzle for supplying the coating solution on a central portion of the substrate. The first and second nozzles are supported by a head such that the supported nozzle moves between a dropping position above the substrate and a waiting position offset from the substrate. The solvent and coating solution are diffused along the surface of the substrate by rotating the spin chuck.

Abstract: The device for impregnating a web laterally guided in the width direction with a treatment liquid comprises a tank for the treatment liquid through which the web is taken on an impregnation section and a pair of squeeze rollers arranged above the tank between which the web can be taken from below immediately after leaving the tank. The tank takes the form of an upright flat channel, the flat sides of which are tightly opposed, through which the web can be taken upwards, which can be kept full up to an optional level and the lower end of which is limited by a resilient sealing arrangement bearing on the web from both sides.

Abstract: A substrate treating apparatus for performing a predetermined treatment of a substrate in a spin, has a spin motor including a rotor having a hollow opening centrally thereof, and a stator disposed coaxially with the rotor and having a hollow opening centrally thereof. The rotor includes holders for supporting the substrate in three peripheral positions thereof. A support mechanism switches the holders between a position for supporting the substrate, and a position retracted therefrom. The opposite surfaces of the substrate supported by the holders are cleaned with a cleaning solution supplied through nozzles. The holders have a substrate supporting force derived from a weight and magnetism of the support mechanism, to support the substrate reliably. A guide is disposed in the hollow of the rotor, and connected to the rotor. The holders are arranged in a substrate treating space formed inwardly of the guide. The holders are arranged on the guide.

Abstract: In the present invention, a waste solution and a exhaust gas are guided together from a drain cup DC into a storing means through common discharge means. Naturally, the gas-liquid separation is performed within the storing means in place of performing the gas-liquid separation within the drain cup DC. Therefore, the waste solution is not solidified within the drain cup so as to plug the common discharge means. Also, a predetermined waste solution is kept stored in the storing means included in the coating apparatus of the present invention, making it possible to permit the surface of the stored waste solution to absorb the mist, and the waste solution is prevented from being solidified within the storing means. Further, since a minimum amount of the exhaust gas is kept discharged even during non-operation of the coating apparatus by using an exhaust gas damper whose degree of opening can be controlled, the waste solution stored in the storing means is prevented from being solidified.

Abstract: A method and apparatus that prevents premature drying of a layer of a water-based coating composition on a substrate are disclosed.

Abstract: Apparatuses are provided for thermally conditioning material. The apparatus includes a plate having a top surface for receiving material, a temperature controller connected to control the temperature of the top surface of the plate and the temperature controller is controlled by a computer controller. In a preferred embodiment, three tubular shaped ceramic support members, each containing a bore, are provided to support the material and a negative pressure source is provided in fluid communication with the bores. In addition, three lift elements having contacting ends are slidably disposed through receiving holes in the thermal conditioning plate and aligned to support the material on the contacting ends.