Abstract: A method and apparatus for removing excess coating material from a honeycomb body of a catalytic converter. The coated honeycomb body is mounted on an eccentric tappet and is rotated around a first rotational axis with a first rotational frequency such that the distance from the center of gravity of the honeycomb body to the first rotational axis is at least 1.5 times the length of the honeycomb body. The honeycomb body is further rotated around a second rotational axis even out the coating material and provide a more uniform coating surface.

Abstract: The present invention is a film forming unit for applying a coating solution to a substrate to form a coating film on the substrate, which has a heating and/or cooling member brought into direct or indirect contact with said substrate for changing a temperature of at least a peripheral portion of the substrate. By changing the temperature of a perimeter portion of the substrate by means of it, a temperature of the coating solution applied on the substrate can be changed. Consequently, surface tension of the coating solution decreases or increases, and swelling of the coating solution occurring at the substrate perimeter portion and reduction in film thickness can be prevented. As a result, a coating film with a predetermined film thickness is formed also on the perimeter portion of the substrate, thus making it possible to enhance yield.

Abstract: A surface-sized paper web is made by supplying pulp from a headbox (100) where additives and/or fillers and/or fines are admixed into the pulp, to the wire section (200), where water is removed. The web is guided from the wire section (200), to the press section (300), the front drying section (400), is surface-coated in the coating section (500) dried in the post-drying section (600), and reeled by a reeler (800). In the headbox (100) starch and optionally hydrofobic size are admixed or layered into the pulp, so that on at least one side of the web an essentially dense surface is formed, on which in surface-coating a coating paste is spread out, which has a high dry matter content, whereby a bond is achieved in direction z inside the web in between the base paper and the surface-coating layer spread out on the surface.

Abstract: A coating film forming apparatus for forming a film by applying a coating solution to a substrate, which is provided with a cassette section, coating unit, developing unit, pre-treatment/post-treatment units and a main arm for transferring the substrate between the respective units. In the coating unit, provided is a coating section in which a resist is applied on the substrate in a manner of single stroke by intermittently moving the substrate in a Y-direction and by moving a nozzle in an X-direction, and provided is a reduced-pressure drying section for drying under reduced pressure the substrate after being applied, and further provided is equipment for removing the coating film adhered to a periphery of the substrate. Additionally, when the reduced-pressure drying section is arranged outside the coating unit, the main arm is covered with a cover so that the inside thereof is under a solvent atmosphere.

Abstract: In an organic insulating film coating apparatus, an organic insulating film is applied onto a wafer by a spin coating. Thereafter, the wafer is subjected to heat processing and an inorganic insulating film is applied onto the wafer by a spin coating in an inorganic insulating film coating apparatus. After the coating of the inorganic insulating film, the wafer is subjected to aging processing and exchange-chemical coating processing. Thereafter, a solvent in the coating film is removed in a low-temperature heat processing apparatus and a low-oxygen and high-temperature heat processing apparatus, and thermal processing is performed for the wafer in a low-oxygen curing and cooling processing apparatus.

Abstract: The present invention relates to illuminating an interior portion of a processing chamber in a semiconductor processing system. A light emitting diode is located in the chamber to illuminate the interior of the chamber to facilitate viewing the interior of the chamber.

Abstract: Continuous void-free uniform coatings are formed on filamentous articles by applying a voided or otherwise substantially uneven coating to at least some of the exposed portion of a filamentous article or to a rotating substrate. The filamentous article or substrate is passed through an improvement station containing a plurality of coating-wetted rolls that contact and re-contact the wet coating at different positions along the length of the filamentous article or rotating substrate, wherein the periods of the rolls improve the uniformity of the coating. For coatings applied to a rotating substrate, the uniform wet coating is transferred to the filamentous article. The final coating can be very thin, very uniform and completely or substantially void-free. The coating improvement can be quickly and easily obtained using low cost equipment.

Abstract: The invention provides a method and system for coating a web. The method comprises the steps of (a) applying a coating material to a surface of the moving web at an application point; and then, (b) directing a jet of gas towards each surface of the web simultaneously at least one of the edges of the web to remove a portion of the coating material from said at least one edge. This enables a substantially uniform coating to be formed over the entire width of the web.

Abstract: An apparatus includes a holding portion for holding a substrate, a nozzle, provided to face the substrate held by the holding portion, for discharging a solution to the substrate, a driver for moving the nozzle along a surface of the substrate relatively with respect to the substrate while the solution is being discharged to the surface of the substrate from the nozzle, a mask unit covering a portion other than a film formation area of the substrate and including a mask member for catching the solution from the nozzle, and a cleaner provided in the mask unit. The coating solution can be supplied to the surface of the substrate in a way similar to a picture drawn with a single stroke of a brush. A cleaning unit for cleaning the mask member does not need to be provided separately, leading to the facilitation of cleaning and a reduction in space.

Abstract: A cassette station, a processing station having a coating unit and a developing unit, and an inspecting station having a film thickness inspecting apparatus and a defect inspecting apparatus are disposed in the direction approximately perpendicular to the direction of the disposition of cassettes of the cassette station in such a manner that the inspecting station is disposed midway between the cassette station and the processing station. In the structure, the inspecting station and the processing station are connected and wafers are automatically transferred among the stations, operations from the substrate process to the inspection can be simplified and the time period necessary therefore can be shortened.

Abstract: Gas wiping apparatus and method can reliably prevent edge overcoat and splash, and has face gas wiping nozzles extending widthwise of a strip material, a pair of baffle plates spaced from an edge of the strip material, an edge wiping nozzle disposed between baffle plates at its inner edge and adjacent the strip material edge, all with critical spacings relative to each other.

Abstract: Prior to transfer of an wafer W, a mixed gas is being generated and exhausted, thereby fluctuation of concentration and temperature of a solvent component at the beginning of gas introduction into a chamber 3 is suppressed. A step of gelling after the wafer W is carried into an aging unit is divided into several steps. Until a temperature of the wafer W reaches a predetermined treatment temperature, an average concentration of the solvent component in a mixed gas is gradually raised relative to the temperature of the wafer W. Thereby, immediately after the wafer W is transferred into a sealed chamber, the gas of the solvent component is prevented from condensing.

Abstract: This substrate processing device is identical to a wafer cleaning device 5 for cleaning a wafer W, which includes a supply nozzle 34 for supplying APM and the pure water, a spin chuck 31 for carrying the wafer W and a container 31 for accommodating the spin chuck 31. The container 30 includes an inner processing chamber 42 and an outer processing chamber 43 and is constructed so as to be movable up and down to the spin chuck 31. A first drainage line 50 is connected to the inner processing chamber 42 to discharge APM and the interior atmosphere, while a second drainage line 51 is connected to the outer processing chamber 43 to discharge pure water and the interior atmosphere. With the connection of the first drainage line 50, the wafer cleaning device 5 is adapted so that the supply nozzle 34 supplies APM to a surface of the wafer W again. Therefore, it is possible to reuse this processing liquid advantageously and additionally, an exhaust displacement can be reduced.

Abstract: An apparatus for the coating treatment comprises a coating section for coating a substrate with a process solution, a heating section for heating the substrate coated with the process solution, and a recovery section for recovering at least a part of the solvent vapor contained in the hot exhaust gas discharged from the heating section. The recovery section includes a cooling apparatus, and the hot exhaust gas containing a solvent vapor generated from the substrate when the substrate is subjected to a heating treatment is passed through the cooling apparatus so as to cool and condense at least a part of the solvent vapor contained in the hot exhaust gas so as to recover the solvent in the form of a liquid.

Abstract: A method and apparatus for forming a generally uniform liquid layer on a surface of an upper surface microelectronic substrate. The apparatus can include a support that engages less than the entire lower surface of the microelectronic substrate and rotates the microelectronic substrate at a selected rate. A barrier can extend over the upper surface of the microelectronic substrate and can rotate at about the same rate as the substrate to separate a rotating air mass adjacent to the upper surface and within the barrier from a stationary air mass external to the barrier. The rotating air mass can reduce the likelihood for liquid/air interface disturbances that create non-uniformities in the liquid layer. Accordingly, the method and apparatus can increase the range of thicknesses to which the liquid layer can be formed and can reduce the topographical non-uniformities of the liquid layer.

Abstract: When a running web (3) is coated with a liquid coating mixture, at least one side of the web is provided with a coating (40, 40′) of coating mixture. Existing excess (33) of coating mixture in or adjacent to the regions of the edge portions of the web is removed by being blown off downstreams of where the coating operation is performed.

Abstract: In one aspect, the invention includes a method of improving uniformity of liquid deposition when a liquid is spin-coated over a non-circular substrate. The substrate is retained on a platform and spun. The circular platform includes a plurality of shaping members pivotally connected to the platform. The plurality of shaping members are biased by spinning the platform to form a platform surface with a circular periphery. In another aspect, the invention includes a substrate coating apparatus. Such apparatus comprises a non-circular substrate support configured to support a substrate with a planar surface and non-circular periphery. The apparatus further comprises a motor configured to spin the substrate support. A plurality of shaping members are pivotally connected with the substrate support and each shaping member has a curved outer side surface.

Abstract: A coating processing apparatus is structured by a rotating cup having an opening portion on the top thereof for housing a substrate, a spin chuck for rotating the substrate in the rotating cup, a lid body having an opening and attached to the rotating cup, a resist solution discharge nozzle for discharging a resist solution onto the substrate through the opening of the lid body, a small lid for blocking up the opening of the lid body, and a protrusion member provided on the underneath surface of the small lid to be positioned inside the rotating cup when the small lid is attached into the opening of the lid body. Thus, adjustment of a film thickness of a coating film after a coating solution is coated can be effectively performed.

Abstract: A solvent of a resist solution is dropped from a solvent supply nozzle onto the surface of a semiconductor wafer held by a spin chuck. The semiconductor wafer is rotated by the spin chuck to spread the resist solution over the entire surface of the semiconductor wafer W. Simultaneously, the resist solution is dropped from a resist solution supply nozzle onto the semiconductor wafer and spread following the solvent. During the processing, the processing space is isolated from the outer atmosphere by closing a lid of a processing vessel and a sprayed solvent is supplied into the processing space. The processing space is thus filled with the mist of solvent. In the processing space supplied with the solvent, evaporation of the solvent from the resist solution is suppressed. A film of the resist solution is formed with a uniform film thickness to the edge of the semiconductor wafer W.

Abstract: Disclosed herein is a coating system for pre-coating a vehicle chassis, comprising a coating station and a curing oven, the coating station being upstream from said curing oven along a travel path, the coating station to deliver a layer of coating material thereon, the chassis having a number of sites, each of which is known to be source for accumulating excess coating to cause unwanted drips thereof during curing, further comprising a plurality of nozzles, each being in a nozzle group of one or more, where each group is arranged to deliver a flow of air sufficient to remove the excess coating.

Abstract: A method of forming a film of a coating solution on a substrate includes steps of moving a coating solution discharge member relative to a substrate while a coating solution is being discharged from the coating solution discharge member to the surface of the substrate, and changing a discharge direction of the coating solution to an outer peripheral portion of the substrate to make the amount of application to the outer peripheral portion smaller than that to other portions. This can reduce the amount of application to the outer peripheral portion of the substrate, thereby making it possible to restrain protuberance of the coating solution at the outer peripheral portion of the substrate caused by surface tension. Consequently, a coating film which is uniform also at the outer peripheral portion on the substrate is formed.

Abstract: An upper side of a cup provided around a wafer is formed in a rectangular shape and a lower side thereof is formed in a cylindrical shape. The cup is formed such that, when seen from above, the portion forming the cylindrical shape is positioned within the portion forming the rectangular shape. The cup has a raising and lowering mechanism and is controlled by a control section. The upper side of the cup is placed by the side of the wafer during a scan by a supply nozzle. The lower side of the cup is placed over an upper level and a lower level of the wafer while a rinse liquid and a developing solution are shaken off. The scan by the supply nozzle is performed with the supply nozzle positioned in the upper cup portion.

Abstract: This invention describes improved apparatus and methods for spin-on deposition of semiconductor thin films. The improved apparatus provides for controlled temperature, pressure and gas compositions within the deposition chamber. The improved methods comprise dispensing of solutions containing thin film precursor via a moveable dispensing device and the careful regulation of the pattern of deposition of the precursor solution onto the wafer. The invention also comprises the careful regulation of deposition variables including dispensation time, wafer rpm, stop time and rates of wafer rotation. In one embodiment, the precursor solution is dispensed from the outer edge of the wafer toward the center. In alternative embodiments, processors regulate the movement of the dispensing arm and the precursor pump to provide an evenly dispensed layer of precursor solution. The invention also describes improved methods for evaporating solvents and curing thin films.

Abstract: In a solution treatment apparatus, a nozzle for discharging a treatment solution toward a substrate held by a spin chuck includes a discharge opening for discharging the treatment solution on a surface of the substrate. A collision body against which the treatment solution discharged from the nozzle collides is disposed between the discharge opening of the nozzle and the substrate. Since the collision body is disposed between the discharge opening and the substrate, even when the discharge pressure of the treatment solution is high, the discharged treatment solution once collides against the collision body so that the discharge speed on reaching the substrate is reduced, damage to the substrate is eased, and the amount of air entering into the discharged treatment solution is decreased. Accordingly, no micro-bubble occurs.

Abstract: A machine for applying sauce to a pizza crust rapidly and accurately. The crust is placed on a turntable, is centered by stationary platforms having terraced surfaces, and the turntable raises the crust to beneath a plurality of nozzles. The nozzles are mounted to cylinder blocks in which cylindrical cavities are formed. Pistons are slidably mounted in the cavities, and are drivingly linked to a linear prime mover to be displaced upwardly and downwardly to pump sauce into and out of the cavities. Check valves control the flow of sauce from the source of sauce to the crust through the nozzles. The pistons are selectively linked to the linear prime mover for reducing the area onto which the sauce is dispensed, for accommodating smaller and larger pizza crusts.

Abstract: A first pressure generating chamber, which is sealed by a first elastic plate mounted with a first piezoelectric element at one surface, and a second pressure generating chamber, which is sealed by a second elastic plate mounted with a second piezoelectric element at one surface are formed in a casing. The second pressure generating chamber is formed with an opening which is a discharge port. A mixture is discharged from the discharge port. A nozzle formed with an opening jets gas toward a substrate surface, and is provided in the vicinity of the discharge port of the ink head.

Abstract: A resonant cavity frequency sensing device is used to sense the moisture content of a substrate. Data obtained by the sensing device can be used in a feedback loop in the apparatus employing the device, to help control the operation of the apparatus in order to obtain consistent results. The sensor may employ one pair of sensing plates or an array of pairs of sensing plates to obtain data from each part of the substrate. In an illustrated embodiment, the device is used to monitor and control dip uptake in a fabric adhesive dipping process.

Abstract: A catalyst composition is applied to an interior of a hollow substrate. The composition is coated on the substrate by immersing the substrate into a vessel containing a bath of coating slurry. A vacuum is then applied to the partially immersed substrate. The intensity of the vacuum and its application time is sufficient to draw the coating slurry upwardly from the bath into each of a plurality of channels located in the interior of the hollow substrate. After removing the substrate from the bath it is rotated 180°. A blast of pressurized air is applied at an intensity and for a time sufficient to distribute the coating slurry within the channels of the substrate to form a uniform coating profile therein.

Abstract: The present invention is a method of supplying a developing solution to an entire face of a substrate to perform a developing treatment, including the steps of: moving a developing solution supply nozzle at a predetermined speed at least from one end to another end of the substrate while the developing solution is being supplied; measuring an amplitude of a wave on a solution face of the developing solution supplied on the substrate after the supply of the developing solution; and changing the predetermined speed of the developing solution supply nozzle based on a measured value. Accordingly, it is unnecessary to measure a line width or the like which is finally formed on the substrate before correction as in the conventional art, and thus the correction can be made earlier as compared with the conventional case, resulting in a reduced number of defective items and improved yield.

Abstract: A spreading state of an outline of the outer periphery of a coating solution is detected by a detecting sensor, and the rotation speed or the like of a wafer as a substrate is controlled so that a spreading speed of the outline becomes not more than a predetermined speed with no danger of producing a scratchpad. Alternatively, the width in the radius direction of a scratchpad is measured, and the rotation speed or the like of the wafer is controlled so that the width in the radius direction becomes not more than a predetermined value. Thereby, occurrence of the scratchpad is prevented or the degree thereof is decreased, thereby avoiding uncoating of the coating solution on the substrate and reducing the amount of the coating solution used.

Abstract: A method for processing a semiconductor wafer or similar article includes the step of spinning the wafer and applying a fluid to a first side of the wafer, while it is spinning. The fluid flows radially outwardly in all directions, over the first side of the wafer, via centrifugal force. As the fluid flows off of the circumferential edge of the wafer, it is contained in an annular reservoir, so that the fluid also flows onto an outer annular area of the second side of the wafer. An opening allows fluid to flow out of the reservoir. The opening defines the location of a parting line beyond which the fluid will not travel on the second side of the wafer. An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location.

Abstract: An inside wall of an elongated syringe body is coated by supplying at least an outer surface of an applicator ring with a coating of silicon oil while displacing a rod carrying the coated ring from a rear end to a front end of the body with the ring in continuous annular engagement with the inside wall thereof so as to transfer the oil from the ring to the inside wall. Thereafter a scraper ring also carried on the rod is displaced from the front end to the rear end of the body with the scraper ring in continuous annular engagement with the inside wall so as to scrape excess silicone oil from the inside wall.

Abstract: A substrate processing method and apparatus capable of uniformly supplying a processing liquid to a substrate surface in substrate processing such as development processing without exerting an influence on the physical properties of the processing liquid and without damaging the substrate. A rotating blade is disposed above the horizontally placed substrate so as to face the substrate. The processing liquid is supplied to the surface of the substrate, and the rotating blade is rotated while being kept out of contact with the processing liquid to induce a gas current. The gas current forms a mass of processing liquid having an internal circulating current on the substrate surface below the rotating blade.

Abstract: A coating apparatus has a spin chuck for attracting and holding a semiconductor wafer in a horizontal state by means of vacuum. A movable beam is arranged above the spin chuck. The movable beam includes first and second nozzles integrally formed. The first nozzle is used for supplying a photo-resist liquid while the second nozzle is used for supplying a solvent for the photo-resist liquid. When a coating process is performed, the movable beam above the wafer is horizontally moved in one direction. The solvent is first supplied onto the wafer from the second nozzle, and the coating or photo-resist liquid is then supplied from the first nozzle, following the solvent. Wettability of the wafer relative to the photo-resist is increased by the solvent, prior to supply of the photo-resist liquid.

Abstract: An apparatus for processing a substrate by supplying a process liquid to a substrate to be processed in a photolithographic process, comprises a cup, a washing control plate for washing an inner surface of the cup, a spin chuck for rotating the washing control plate or the substrate while holding the washing control plate or the substrate substantially horizontally in the cup, a solvent supply mechanism for supplying a solvent capable of dissolving the process liquid, onto the washing control plate or the substrate held by the spin chuck, a process liquid supply mechanism for supplying the process liquid onto the substrate held by the spin chuck, and a control section for selecting either a solvent to be supplied to the substrate or a solvent to be supplied to the washing control plate and controlling the solvent supply mechanism in accordance with the solvent selected.

Abstract: Methods of dispensing process liquid to provide a uniform layer of the liquid on a surface are disclosed in accordance with the present invention. The methods include dispensing a process liquid on the surface and rotating the surface at a first speed to distribute an effective amount of the process liquid to substantially wet the surface. The method further includes rotating the surface at a second speed to distribute an effective amount of the process liquid to produce a layer of the process liquid on the surface. In a preferred embodiment for dispensing photoresist onto the surface of a semiconductor wafer, the method includes rotating the wafer at the first speed prior to dispensing the photoresist onto the surface. The preferred method further includes decelerating the wafer from the first to the second speed during the dispensing of the photoresist and terminating the dispensing process after the second speed is reached.

Abstract: In one aspect, the invention includes a method of improving uniformity of liquid deposition when a liquid is spin-coated over a non-circular substrate. The substrate is retained on a platform and spun. The circular platform includes a plurality of shaping members pivotally connected to the platform. The plurality of shaping members are biased by spinning the platform to form a platform surface with a circular periphery. In another aspect, the invention includes a substrate coating apparatus. Such apparatus comprises a non-circular substrate support configured to support a substrate with a planar surface and non-circular periphery. The apparatus further comprises a motor configured to spin the substrate support. A plurality of shaping members are pivotally connected with the substrate support and each shaping member has a curved outer side surface.

Abstract: An improved shield for preventing the contamination of a wafer back from resist is combined with process steps that further prevent this contamination. The shield is located where vortex like air currents could otherwise deposit the resist vapor on the wafer back. The shield has the general shape of a cylinder that is open at the top and closed at the bottom. The bottom provides an attachment to a conventional part of the wafer coater and also forms part of the shield. The sides are arranged to extend close to the wafer back at a radius just less than the radius of the wafer. In the improved process, the spindle of the wafer chuck is not rotated at more than 1200 revolutions per minute in any of the wafer spinning operations, and the conventional step of washing the wafer back with a solvent is performed only at the end of the other operations.

Abstract: A method and a device for bonding a first plate-shaped object to a second plate-shaped object by means of an adhesive. The adhesive is applied to one surface of the first object. Thereafter, said surface of the first object and one surface of the second object are pressed together. The objects are rotated at equal rotational velocities about an axis extending perpendicular to the surfaces of the objects while the two objects are pressed together. The adhesive present between the two objects spreads homogeneously therebetween by the centrifugal force acting on the adhesive. A homogeneous, relatively thin and strong layer of adhesive is formed between the two objects. The pressure is reduced on the objects to be pressed together. In a special embodiment, during a first phase, the two objects are moved towards each other at a predetermined relatively low approach speed, and are rotated at a predetermined relatively low rotational speed.

Abstract: A mechanism for effectively dispensing liquid onto a surface of an IC (Integrated Circuit) wafer with minimized back-splash. A nozzle includes a liquid chamber that fills up with the liquid to be dispensed onto the surface of the IC wafer, and the nozzle includes a plurality of nozzle passages. A nozzle passage carries and directs the liquid from the liquid chamber toward the surface of the IC wafer to provide a respective liquid stream from a respective location on the nozzle to a respective spot on the surface of the IC wafer as the IC wafer is spinning. A nozzle passage is disposed within the nozzle at a respective angle with respect to the surface of the IC wafer such that the respective liquid stream from the nozzle passage is directed toward a velocity vector at the respective spot on the surface of the IC wafer where the respective liquid stream hits the surface of the IC wafer. For example, the respective angle of the nozzle passage with respect to the surface of the IC wafer may be 45°.

Abstract: A drive pulley is disposed to a driving motor. A plurality of follower pulleys are disposed to a rotating shaft of a spin chuck that vacuum sucks a substrate. A belt is passed from one follower pulley to the drive pulley. Belts are passed from the other follower pulleys to the drive shafts of a plurality of air motors. Since the air motors assist the driving of the driving motor, a large substrate can be rotated at a predetermined rotating acceleration. Thus, a film forming apparatus and a film forming method that allow the quantity of process solution supplied to be reduced and a film of process solution to be equally formed on a substrate can be provided.

Abstract: In a method of manufacturing a display device, a substrate is provided with a pattern of barrier ribs of frit material by moving a squeegee across a substrate. The barrier ribs extend in a longitudinal direction and have a predefined profile in cross-section which is perpendicular to the longitudinal direction. A contact portion of the squeegee has grooves which correspond in cross-section to the predefined cross-sectional profile of the barrier ribs.

Abstract: Apparatus for coating rotatable objects to be coated include a mechanism for forwarding a plurality of rotatable objects to be coated. The objects to be coated are forwarded rotatingly to receive paint flowing in a curtain form. Paint flowed down is accumulated for re-use. A gravitational shift of paint applied on the objects which is flowable after coating is used to rotate the objects and change an angle of the objects with respect to a horizontal plane so as to control movement of the flowable paint.

Abstract: An apparatus for forming a coating film, comprising a process section for applying a series of processes for forming a coating film to a substrate, and a common transfer mechanism for transferring a substrate in the process section, in which, the process section comprises a cooling unit for cooling a substrate, a coating unit for applying a coating solution containing a first solvent to the substrate to form a coating film, an aging unit for changing the coating film formed in the coating unit to a gel-state film if the coating film is formed in a sol state, a solvent exchange unit for bringing a second solvent, which differs from the first solvent in composition, into contact with the coating film to replace the first solvent contained in the coating film with the second solvent, a curing process unit for heating and cooling the substrate under an atmosphere low in oxygen concentration, thereby curing the coating film, and a heating unit for heating the coating film formed on the substrate.

Abstract: A photoresist dispensing device for use in applying a metered amount of photoresist on a wafer comprises, a photoresist storage tank, a nozzle for spraying the photoresist on the wafer, a feeder unit for drawing a metered amount of the photoresist out of the storage tank and discharging it through the nozzle, a pneumatic control unit for controlling the operation of the feeder unit with the use of pressurized air; and a filter disposed in between the storage tank and the feeder unit for removing alien matters present the photoresist.

Abstract: A spreading state of an outline of the outer periphery of a coating solution is detected by a detecting sensor, and the rotation speed or the like of a wafer as a substrate is controlled so that a spreading speed of the outline becomes not more than a predetermined speed with no danger of producing a scratchpad. Alternatively, the width in the radius direction of a scratchpad is measured, and the rotation speed or the like of the wafer is controlled so that the width in the radius direction becomes not more than a predetermined value. Thereby, occurrence of the scratchpad is prevented or the degree thereof is decreased, thereby avoiding uncoating of the coating solution on the substrate and reducing the amount of the coating solution used.

Abstract: An apparatus for forming a photoresist film including a photoresist coating unit for coating a photoresist on a wafer, a first chamber in which a nitrogen gas of high pressure and low temperature is dispersed for planarizing the surface of the photoresist film formed on the wafer, the first chamber connected to the photoresist coating unit, and a second chamber in which a dried nitrogen gas of high temperature is dispersed for removing a solvent contained within the photoresist film and baking the photoresist film, the second chamber connected to the first chamber. During the baking process in the second chamber, heat is transferred from the photoresist film to the wafer by dispersing the dried nitrogen gas of high temperature from a nozzle at the upper side of the second chamber.

Abstract: In an apparatus for coating a surface of at least one lens having pair of opposed major surfaces, al least one lens support is coupled to a frame and is rotatable relative thereto. A lens is releasably mounted to the lens support leaving one of the major lens surfaces exposed. A mounting plate is coupled to the frame and is positioned proximate to the lens support. A series of work stations are carried by the mounting plate for sequentially performing work operations on the exposed major surface of the lens. The lens support is indexable relative to the mounting plate to position the exposed lens surface adjacent to each of the work stations in response to commands issued from a controller.

Abstract: A first cooling unit group and a second cooling unit group are disposed in the vicinity of a resist coating unit group. Each of the first cooling unit group and the second cooling unit group is composed of various cooling units. Each of the cooling units cools a wafer. A first heating unit group and a second heating unit group are disposed in the vicinity of a developing unit group. Each of the first heating unit group and the second heating unit group is composed of various heating units. Each of the heating units heats a wafer. A first conveying unit is disposed between the cooling unit groups. A second conveying unit is disposed between the heating unit groups. A transfer table is disposed between the conveying units. The transfer table temporarily holds a wafer. The first conveying unit conveys a wafer among the resist coating unit group, the transfer table, and the cooling unit groups.

Abstract: In a solution treatment apparatus, a nozzle for discharging a treatment solution toward a substrate held by a spin chuck includes a discharge opening for discharging the treatment solution on a surface of the substrate. A collision body against which the treatment solution discharged from the nozzle collides is disposed between the discharge opening of the nozzle and the substrate. Since the collision body is disposed between the discharge opening and the substrate, even when the discharge pressure of the treatment solution is high, the discharged treatment solution once collides against the collision body so that the discharge speed on reaching the substrate is reduced, damage to the substrate is eased, and the amount of air entering into the discharged treatment solution is decreased. Accordingly, no micro-bubble occurs.