Abstract: A particle-coated substrate (in particular, an abrasive material formed by coating a substrate with abrasive particles) in which a substrate is coated uniformly and in a thin layer with cohesive fine particles, a particle ejector for fabricating the coated substrate, a coated substrate fabricating apparatus comprising the ejector, a particle-coated substrate fabricating method (in particular, a method of fabricating an abrasive material in which a substrate is coated with abrasive particles), and an abrasive sheet. Agitation gas is fed through the porous wall of a particle storage container in the ejector, and an ejection gas is fed from an ejector nozzle through the container to deliver the fluidized particles and ejection gas through a discharge tube generally coaxial with the ejection gas nozzle. The particle ejector is capable of attaining a uniform particle size distribution without causing the particles to undergo blocking, agglomeration, or bridging.

Abstract: In a flow coater for applying coating liquid to a plate member such as a printed board by a curtain flow method, a heat exchanger unit of a temperature controller is arranged in a collection tray which is arranged below a coating liquid supplying head across a conveyance path for the plate member. This heat exchanger unit has a coil-shaped structure. The coating liquid is caused to flow down curtainly from the head to come in contact with the heat exchanger unit in which the heat exchange is carried out. Since a small amount of coating liquid comes in contact with the heat exchanger unit, an excellent efficiency of the heat exchange can be obtained, and hence it is possible to cope speedily and accurately with temperature changes. In addition, since after the coating liquid has flowed down from the head, the coating liquid flows naturally down in the tray while contacting the heat exchanger unit, there is no need of providing a special drive apparatus therefor.

Abstract: A system for pumping resist to a wafer coating machine includes a line that returns a selected proportion of the resist entering the resist pump to the resist supply tank. The return line to the tank is connected to the pump outlet at a higher point than the pump outlet to the wafer coating machine, and the resist that is returned to the tank carries substantially all of the bubbles that are carried in the resist entering the tank. The bubbles are removed from the resist in the tank and the resist can be used normally.

Abstract: Disclosed is an apparatus for forming a coating film for semiconductor processing, including a holder for holding a substrate, a coating solution supply device arranged to face one main surface of the substrate held by the holder and provided with a discharge port for supplying a coating solution onto the one main surface of the substrate, the coating solution forming a band-like stream having a width smaller than that of the substrate, a moving device for moving the coating solution supply device in parallel and relative to the substrate held by the holder to form a coating region and a non-coating region on the one main surface of the substrate, and a clearance retaining device for maintaining constant the distance between the discharge port of the coating solution supply device and the one main surface of the substrate.

Abstract: A chemical supplied onto a substrate is contained in a chemical container. A chemical cooling unit keeps the chemical contained in the chemical container cooled to a proper temperature for storage. A chemical pressure-transferring portion causes the chemical to flow from the chemical container into a chemical introducing pipe. A chemical temperature controller portion changes the temperature of the chemical guided by the chemical introducing pipe to a proper temperature for application on a substrate. The chemical brought to the proper application temperature is guided to a chemical dispensing unit, which dispenses the chemical onto a substrate.

Abstract: A method of and an apparatus for coating a substrate with a polymer solution to produce a film of uniform thickness, includes mounting the substrate inside an enclosed housing and passing a control gas, which may be a solvent vapor-bearing gas into the housing through an inlet. The polymer solution is deposited onto the surface of the substrate in the housing and the substrate is then spun. The control gas and any solvent vapour and particulate contaminants suspended in the control gas are exhausted from the housing through an outlet and the solvent vapor concentration is controlled by controlling the temperature of the housing and the solvent from which the solvent vapor-bearing gas is produced. Instead the concentration can be controlled by mixing gases having different solvent concentrations. The humidity of the gas may also be controlled.

Abstract: An improved chip termination or application wheel for applying a layer of silver paste to the edge or end of a chip including a wheel that is defined by a broad circumferential surface, for contact with the chip, the surface containing an increased surface area for accepting a larger amount of termination paste for transfer to the edge of a chip.

Abstract: A plant for preparing and feeding a coating composition to a coating head for paper or the like includes a plurality of hoppers, each hopper being intended to receive and deliver one ingredient of the composition. The plant further includes a premixer tank which is fed by the hoppers and mixes and homogenizes the formed composition and a homogenizing tank, fed by the premixer tank, having a high-speed stirrer for shearing the composition. A buffer capacity is directly and continuously fed by the homogenizing tank and connected to the coating head, wherein the buffer capacity preferably has a volume and an attached level detector for determining when the composition in the buffer capacity is below a predetermined level. A set of controllers attached to the level detector control the delivery of components from the plurality of hoppers.

Abstract: The invention relates to a process for application of an organic coating on a moving metallurgical product 7 from a bath of a liquid organic material 3 contained in a vat 2 and liable to comprise air bubbles, the transfer of said liquid organic material 3 onto the product being accomplished in a coating zone, characterized in that, in order to eliminate said air bubbles, there is created in at least one zone of the bath, located upstream from said coating zone, an ascending current in the liquid material so as to convey the air bubbles from the bath to the vicinity of its surface and cause their bursting. The invention also relates to an apparatus for the implementation of this process.

Abstract: In processing an object by irradiating it with laser light, a laser irradiation chamber is evacuated to a pressure value suitable for the intended laser light processing and the laser light processing is performed with the pressure in the chamber kept constant at the above value. Further, electrodes are provided in the laser irradiation chamber, and the inside of the chamber is cleaned by introducing an etching gas into the chamber during or immediately before the laser light irradiation and rendering the etching gas active.

Abstract: A CRT panel developing apparatus includes a body; a panel fixing portion, which is placed in the upper portion of the body and is structured so as to ground the conduction layer of the panel; a developing gun, which sprays powder that has been coated with organic matter on to the panel fixed to the panel fixing portion; a supply line, which is a passageway for the powder and air to be supplied to the developing gun; an air supply apparatus and a powder supply apparatus which are connected to the supply line; a powder charging portion, which is formed on the supply line that charges the powder that passes through the supply line; a turbulent air line which supplies air to the powder charging portion; a power supply apparatus that supplies electrical power to the powder charging portion; an evaporation portion, where the organic matter evaporates; an evaporation air line which supplies air to the evaporation portion; an evaporated organic matter line, which connects the evaporation portion and the supply line;

Abstract: The fiber-coating concentricity of a coated optical fiber is controlled by non-axisymmetrically heating the coating material in the sizing die with respect to the z-axis along which the fiber is drawn. By controlling the temperature profile and thus the viscosity profile of the coating material, the amount of coating material applied to each azimuthal position of the fiber is controlled as it exits the sizing die. The apparatus that provides the desired temperature profile can also be employed to control the coating diameter.

Abstract: Tubelining device and technique using a coating-applicator for slip-casting a fluent liner coating onto the internal surface of a tube.

Abstract: A photoresist spraying apparatus for coating a photoresist with pressure from a nitrogen gas includes a tank which has a photoresist holding portion and an air portion. A photoresist inflow conduit is connected to a sidewall of the tank to intake photoresist and a photoresist outflow conduit is connected to a bottom of the tank for discharging photoresist. A T-shaped gas conduit has a gas inlet, a gas outlet and a connecting portion therebetween for connecting to the tank. The flow of a gas from the gas inlet to the gas outlet lowers the air pressure inside the tank so that air and bubbles remaining inside the tank are discharged to the gas outlet via the connecting portion, while a photoresist flows into the tank via the photoresist inflow conduit. A valve, provided in the gas outlet of the gas conduit, opens and closes to fill and discharge photoresist in the tank according to the pressure inside the tank.

Abstract: A device is disclosed for applying adhesive to platens of a textile screen printing machine as the platens move from the unload stage to the load stage. The device comprises a frame mountable to the screen printing machine so that it extends over the moving platens, at least one interconnectable housing carried by the frame. Each housing has an array of adhesive-depositing nozzles and adhesive-spreading air nozzles plus a drying nozzle. As a platen passes under the housings, a sensor initiates the array of adhesive nozzles to deposit columns of adhesive onto the platens. Then the air nozzles spread the columns of adhesive by blowing air onto the columns. Finally, the spread adhesive is dried by gas from the drying nozzle, preferably directing a single curtain of air under pressure onto the adhesive. The housings are modular so that the device can be used with larger platens by simply adding one or more housings.

Abstract: The present invention provides an acoustic dispenser for propelling objects toward a substrate, together with methods of use of the dispenser. The acoustic dispenser uses a source of acoustic vibration and a membrane for the application of acoustic vibration wherein the objects are propelled from the membrane to a substrate. The acoustic dispenser and the methods of the invention can be used with numerous types of objects. In some embodiments, the objects are particles in a dry powder, which can include, for example, a pharmaceutically active ingredient. In other embodiments, the objects are beads, which preferably have an average diameter of about 100 to about 300 microns. Additionally, the acoustic dispenser can be used with more than one type of object, for example, two types of objects such as beads and dry powder.

Abstract: System for producing a plurality of semiconductor device assemblies utilizing a grid array of conductive epoxy for connecting them to an electronic system. Conductive epoxy is screen printed in a desired pattern onto a printed wire board of the semiconductor device assembly. The conductive epoxy is B-staged by heating in an oven. The semiconductor device assembly is then placed onto a system printed circuit board wherein the B-staged conductive epoxy is further cured by heat and effectively makes mechanical and electrical connections between the semiconductor device assembly and the system printed circuit board.

Abstract: An apparatus and method are disclosed for producing and dispersing herbicidal foam within a sewer line in such a manner as to apply the foam to either the entire interior surface or a specific or a plurality of specific areas within a generally cylindrical line.

Abstract: A coating apparatus and method for applying a coating to a workpiece, comprising:a vessel to contain molten metal;an induction coil disposed about said vessel; and,temperature regulation means;wherein, in use, said induction coil induces a magnetic field within said vessel such that a meniscus of molten metal is formed above said vessel, through which said workpiece is passed for coating, whilst said temperature regulation means regulates temperature of said molten metal and/or controls the meniscus height of said meniscus.

Abstract: An area of an insulating strip (3) which is to remain free of metal is covered by an endless cover strip (4), which rests on the insulating strip (3) and travels along with it at the same speed. Before it enters a vapor deposition zone (5), the cover strip is provided with a film of oil on the side facing the metal evaporator (6) and, after the cover strip (4) has passed through the vapor deposition zone (5) and after the cover strip (4) and the insulating strip (3) have been separated from each other, the oil which has been deposited from the vapor phase onto the cover strip (4) is removed by heating the cover strip (4) with a heater (7) installed in the immediate vicinity of the cover strip (4).

Abstract: In a plasma-CVD method and apparatus, plasma is formed from a film material gas in a process chamber and, in the plasma, a film is deposited on a substrate disposed in the process chamber. Formation of the plasma from the material gas is performed by application of an rf-power prepared by effecting an amplitude modulation on a basic rf-power having a frequency in a range from 10 MHz to 200 MHz. A modulation frequency of the amplitude modulation is in a range from 1/1000 to 1/10 of the frequency of the basic rf-power. Alternatively, the rf-power is prepared by effecting on the basic rf-power a first amplitude modulation at a frequency in a range from 1/1000 to 1/10 of the frequency of the basic rf-power, and additionally effecting a second amplitude modulation on the modulated rf-power. A modulation frequency of the second amplitude modulation is in a range from 1/100 to 100 times the modulation frequency of the first amplitude modulation.

Abstract: A static blending device for continuously blending particulate matter for even dispersion onto a substrate, wherein blending can be achieved automatically by gravity flow of the material. The static blending device includes an inlet for receiving particulate matter and an outlet for dispensing particulate matter and a dispersing section provided between the inlet and the outlet that is divided into a first compartment and a second compartment. The first and second compartment are each preferably divided into a manifold cavity and a transfer section by a manifold plate with multiple manifold openings that is positioned on an angle within each compartment.

Abstract: An applicator system for applying color coating on a paper web is disclosed having a color coating applicator along with a backing roll around which is wrapped the paper web. A measuring system is incorporated for measuring a predetermined property of the color coating at several points along the width of the paper web. Predetermined qualities of the color coating include weight, thickness, or surface properties of the coated surface. A control means is included for controlling the color coating arriving at the application zone. The color coating is controlled by varying the temperature, or the consistency of the color coating in a zonewise fashion across the width of the paper web.

Abstract: An assembly for the deposition of aqueous coating compositions in printing processes including wet-trap in-line, off-line dry-trap, gravure, offset (using water and waterless), silk-screen, flexography and related printing processes. Use of the present invention results in the adaption of an aqueous coating to virtually any coating method without the need to change the chemical content of that formulation and in certain embodiments, produces unexpectedly high levels of solid being incorporated into printing coating compositions for obtaining levels of gloss on surfaces which have been heretofore unobtainable. In addition, the present invention is readily adaptable to virtually every type of coating process used to coat inked, uninked and related surfaces.

Abstract: A mastic applicator system for delivering a mastic material to a surface in a precisely controlled manner. The system includes a mastic pump, a regulator receiving the mastic from the pump, a nozzle, and a jacketed hose assembly interconnecting the regulator output and the nozzle input. The hose assembly includes an end block having a flat sealing surface, and the end block and the body of the nozzle are fixedly secured together with the sealing surface on the end block in flush sealing contiguous relation to a flat sealing surface on the nozzle body so that a mastic passage and water passages in the end block may respectively sealingly communicate with a mastic passage and water passages in the nozzle body at the sealing surfaces. The mastic passage from the hose assembly to the nozzle outlet is thus totally internal and totally insulated so as to preclude the formation of cold plugs of mastic material during system shut down.

Abstract: Methods and apparatus for coating materials are provided. The apparatus includes a first member located above a rotating member and including a top opening and a bottom opening. A second member is located at least partly within the first member including a bottom opening and a closed top portion. A feeder for feeding the first material through the top opening of the first member is provided. A second feeder for feeding the second material.

Abstract: In a curtain pouring apparatus for coating circuit boards with a photopolymerizable lacquer, the improvement comprising a heatable roll disposed in a gutter heatable vat above a conveyor belt for the circuit boards and a heatable doctor blade is applied against the roll and infrared lamps are arranged parallel to the doctor blade.

Abstract: A method and apparatus is provided for controlling the diameter of a coated optical waveguide fiber. The viscosity profile of the coating material is controlled by adjusting the temperature of a portion of the coating assembly based on a measurement of the diameter of the coated fiber. By controlling the viscosity profile of the coating material, the amount of coating applied to the fiber is controlled,, thereby determining the diameter of the coated fiber.

Abstract: A process for making a battery paste includes steps of forming an active material in an aqueous slurry, then dewatering the slurry to form a battery paste. In one described embodiment, a slurry containing one or more basic lead sulfates suitable for use as the active material in lead-acid battery electrodes is formed in a continuously stirred tank reactor (36). The slurry is withdrawn from the reactor (36) and fed to a belt press (67) which reduces the moisture content of the slurry to the desired level. Battery pastes produced according to the invention may be fed continuously to a paster (89) for mass production of positive and negative battery plates from grids (91).

Abstract: An electroless plating device which comprises an electroless plating tank for accommodating an electroless plating solution; a draft pipe provided in the electroless plating tank for blowing air into the electroless plating solution; and a shield plate having perforations provided between an object of plating and bubbles blown out from the draft pipe, a size of each of said perforations being of dimensions whereby the bubbles cannot pass through the perforations.

Abstract: A jet stripping apparatus includes two dual-nozzle assemblies (12) which, when in use, are disposed one on either side of an ascending, substantially vertical steel strip (10) which is to be partly stripped of a molten zinc or aluminium/zinc alloy coating (19). Each assembly comprises upper and lower elongate nozzles (13,14) extending transversely of the strip, a device to supply pressurized gas (15) to the nozzles for emergence therefrom as jet streams (20,21) directed towards the strip, and a reaction body (16) intermediate the nozzles defining a pressurized stabilizing zone (17) between itself and the strip. The lower jet streams are inclined downwardly at 5.degree. to the horizontal.

Abstract: A plant for the manufacture of feedthrough (through-hole plated) printed-circuit boards or multilayers which comprises four modules (1, 11, 16, 21) through which the objects (3) to be treated are passed in a horizontal continuous process. In the first module (1) the surfaces to be coated are conditioned in an alkaline aqueous solution. An oxidative pre-treatment of the surfaces to be coated takes place in the second module (11). In the third module (16) a coating of organic monomers is deposited on the surfaces to be coated. Finally, in the fourth module (21) the deposited monomers are polymerized to form an electrically conductive coating. The printed-circuit boards or multilayers (3) thus treated and made electrically conductive on the lateral surfaces of the drill-holes are then passed on for the metallization of the lateral surfaces of the drill-holes (FIG. 1).

Abstract: A roll (30) of adhesive worked between two rollers (10, 12) of the gumming device is supplied by feed nozzles (34a, 34b) projecting fine streams of adhesive (35a, 35b) with monitored flow. In case of an increase in the measured viscosity of the adhesive or stopping of the machine on which the gumming device is used, a water-atomizing device (40) allows the viscosity to be reduced and prevents the adhesive from drying out. A dimension of the adhesive roll is monitored and controls regulation of the output of the adhesive-feeding nozzles. The gumming device thereby ensures proper gumming of a strip of paper (2).

Abstract: An epoxy floor roller tool formed by spirally winding a continuous strip of carding cloth having wires protruding outwardly therefrom around a roller core tube. The carding cloth wires are made of a cadmium plated steel which allows the wires to remain rigid even though quite thin and densely packed, whereby when the roller tool is rolled against a wet epoxy material spread over a floor surface, the wires will break even very small, closely spaced air bubbles in the epoxy, allowing the air to be released so that the voids caused by the air bubbles will flow closed without cratering before the epoxy hardens.

Abstract: A system and method for uniformly coating one or more fibers (10) with particles of a material is described. The method uses a vibrator preferably an acoustic speaker (17b) in a housing (17c) to fluidize the particles (P.sub.1) in a chamber (17 or 30) to deposit them on spread fibers (10b). The fibers can be in the form of a tow of fibers. After the particles are coated on the fibers, the particles can be bonded to the fiber such as by using a heater (19). The resulting product has a uniform deposit of the particles and in the case of the tow of fibers can serve as a prepreg for laminate structures to be produced from the coated tow of fibers.

Abstract: Apparatus for collecting and drying powder used for electrostatic coating of a workpiece has air injection means incorporated into the collection bin both to dry and also to homogenize powder recovered, just prior to withdrawal from the bin.

Abstract: Disclosed is a coating apparatus for applying a resist or developing solution to a semiconductor wafer. This coating apparatus comprises a plurality of nozzles supplied with various resist from a resist source and each adapted to drip the different solution onto the wafer, a vessel in which the nozzles is kept on stand-by, while maintaining the liquids in a predetermined state in the vicinity of discharge port portions of the nozzles, when the nozzles need not be operated, and a nozzle operating mechanism for selecting one of the nozzles kept on stand-by in the vessel, and transporting the selected nozzle to the location of the wafer, whereby the resist is applied to the wafer by means of only the nozzle transported by the nozzle operating mechanism.

Abstract: An apparatus for tempering fluid glues in continuous operation has a heat transfer body made of a cuboid aluminum block (26) in which is integrated the glue channel (24, 25), and the broad-side surfaces of which are thermally linked to Peltier elements (28) for heating and cooling the glue to be tempered. The Peltier elements (28) are provided on their heat transfer surfaces opposite to the aluminum block (26) with heat conductive ribs (30) that can be charged with a flow of cooling and/or heating air through an air channel (44). Inside the glue channel (24, 25) are arranged baffle plates or ribs as static mixers (36) that ensure a thorough mixing and an even temperature within the flow of glue.

Abstract: UV-hardenable reaction resin compounds are irradiated in an applicator and immediately fed to an object that is to be covered. An initial, not activated reaction resin compound is irradiated after entering an input opening in a reactor having an irradiation space, a UV-radiation source and, optionally, a reflector. Immediately thereafter the activated compound is fed to an object to be coated or to an object to be surrounded, in an open casting mold or to a closed casting mold via the exit opening, optionally via a casting canal. The method and the apparatus are particularly well suited for covering semiconductor components and for encapsulating active and passive components as well as for cementing UV-impermeable fitting parts.

Abstract: A solder paste applicator for applying solder to a selected area of a printed circuit board on which electronic components are mounted. The applicator includes a housing with a plate mounted in one end. The plate has a pattern of holes through it corresponding to the pattern of solder to be applied to the board. The housing has movable legs mounted to the outer surface for positioning the plate a distance from the surface of the board which corresponds to the thickness of the solder to be applied. The solder is held in a reservoir above the patterned plate. A piston is positioned in the housing and is pushed against the reservoir for dispensing the solder.

Abstract: An apparatus for waxing skis, where the skiing person glides through the apparatus with his skis on, comprises transport rolls, a warm air unit for drying and pre-heating the skis, and a waxing unit with a wax roll, 4/5 to 9/10 thereof being immersed into a wax container. The wax in the container is heated by a heating plate extending under the bottom of the wax container and having underneath an insulating layer. The apparatus further comprises a scraping unit with spring mounted scraping knives. For improving the finish of the gliding surface of the skis there is mounted a driven brushing unit, arranged after the scraping knives viewed in the moving direction, and comprising a pair of brushes mounted in pivoted levers and being forced against at least one tension spring, which is fixed to said pivoted lever and at the other end to an adjustable support. The apparatus is coin operated.

Abstract: A system for soldering, leveling and cooling printed circuit panels including a preheater, a fluxer, and soldering, leveling and cooling stations. The cooperation of the soldering, leveling and cooling stations provides for efficient processing of printed circuit panels. The soldering station, which includes a solder immersion chamber through which the panels are conveyed, provides an oil coating on the solder to minimize formation of dross. Automatic replenishment of oil through use of suitable flux on the panels to be soldered provide continuous cleaning of the soldering system to permit extended operation. A cooling table transports the soldered panels on a cushion of air to prevent marring.

Abstract: A tool employing a solder foot to deposit solder on a series of conductive surfaces as the tool moves. In one embodiment, non-wettable blade attached to the tool breaks the film. A pair of sensors coupled to a control circuit monitor the position of the solder foot and the position may be changed as a function of the operation to be performed, i.e. deposit, reflow, standby while tool is moved. In a second embodiment a discrete solder mass is extruded and deposited on a preheated pad. In a third embodiment, solder wire is delivered to an omnidirectional tool for deposition.

Abstract: A machine for removing bubbles from coated flat substrates, namely PC boards. The machine includes one or more conveyors for transporting the boards into an enclosure and a vacuum platen positioned above the conveyor which, when lowered into contact with the conveyor encloses the board in a plenum. A pump withdraws air from the plenum to create a vacuum and remove any entrained or surface bubbles from the boards.

Abstract: An electroless copper plating process for producing fine patterned wiring boards is improved by supplying very fine oxygen-containing gas bubbles through a porous alkali-resistant resin gas dispersing tube. An electroless copper plating apparatus having such a gas dispersing tube is also provided.

Abstract: An apparatus and method achieves the submersiontype processing of silicon wafers in a manufacturing process for the fabrication of semiconductor devices therefrom. The silicon wafer is uniformly flooded with the process fluid in a manner which prevents impingement thereof during chemical processing, such as wet etching, cleaning, photoresist developing and the like. Upon flooding the silicon wafer, a gas pocket is formed between a portion of the lower surface of the wafer and an adjacent portion of vacuum chuck to which the wafer is mounted. The resulting gas pocket prevents accumulation of processed fluid therein to facilitate spin drying of the wafer.

Abstract: A method for the application of chilled particles such as polytetrafluoroethylene generally marketed under the trade mark "TEFLON.revreaction., graphite, molybdenum sulfide and boron nitride to a metal surface having crevices or pores therein. With the metal heated to expand the crevices or pores and the particles chilled to contract them, the particles will be locked into the pores when both the metal and the particles come to equilibrium temperature with the particles thereby expanding and the pores contracting. The method is directed to such an application of chilled particles to expanded pores in large metal objects such as for example, large rolls. The large object is rotated on its linear axis while maintained at the desired temperature and the particles are given an electrostatic charge and chilled prior to their application to the metal surface.

Abstract: A process for forming a multilayered coating film is disclosed, comprising forming a liquid film of a coating composition, increasing the viscosity of the liquid film, and laminating the liquid film having an increased viscosity onto a support or onto a coating film on a support. A multilayered coating film can thereby be formed easily and efficiently without involving interlaminar mixing between adjacent layers.

Abstract: An improved chemical vapor reaction system is described. The system is characterized by its light source which radiates ultraviolet light to a substrate to be processed. Before the light source, an obturating plate is placed so that the intensity of the light source is apparently reduced at the center position. With this light, the substrate is irradiated with light having uniform intensity over the surface of the substrate to be processed.

Abstract: A gas distributor beam includes a plenum and distribution slot surrounded by a generally V-shaped cooling fluid chamber. The circulation of a suitable cooling fluid tends to maintain the plenum and distribution slot at a temperature below four hundred degrees Fahrenheit for the distribution of diborane gas to an upper surface of a heated glass ribbon. Carbon blocks are utilized to stabilize the glass temperature above nine hundred fifty degrees Fahrenheit for the proper deposition of boron on the surface of the glass. Insulation between the carbon blocks and the outer walls of the cooling fluid chamber minimize heat transfer and the shape of the cooling chamber minimizes the exposure of the glass to the lower temperatures of the cooling chamber.