Abstract: A complex concentrated alloy (CCA) and/or high entropy alloy (HEA) additive manufacturing nozzle can include a nozzle body defining at least four powder channels. Each powder channel can be configured to be connected to a powder supply of a plurality of powder supplies to receive a powder from the powder supply for ejecting the powder toward a build area to form an additively manufactured article having a CCA and/or an HEA.

Abstract: A shield encircles a sputtering target that faces a substrate support in a substrate processing chamber. The shield comprises an outer band having a diameter sized to encircle the sputtering target, the outer band having upper and bottom ends, and the upper end having a tapered surface extending radially outwardly and adjacent to the sputtering target. A base plate extends radially inward from the bottom end of the outer band. An inner band joined to the base plate at least partially surrounds a peripheral edge of a substrate support. The shield can also have a heat exchanger comprising a conduit with an inlet and outlet to flow heat exchange fluid therethrough.

Abstract: The invention provides a method for positioning a wafer and a semiconductor manufacturing apparatus, which are applied to thin film processes. The method includes: Step S1: Obtain the state distribution of the first surface of the first wafer after the thin film process is performed on the first wafer, wherein the first surface is the surface opposite to a surface that the thin film formed thereon in the thin film process; Step S2: Determine whether the first wafer is located at the ideal positioning center according to the state distribution of the first surface, when the first wafer is not located at the ideal positioning center, according to the state distribution of the first surface adjusts the positioning position of the second wafer to be subjected to the thin film process, so that the second wafer is positioned at the ideal positioning center during the thin film process.

Abstract: A high viscosity material is discharged in the form of a continuous thread from an application nozzle toward an end of a workpiece and a space S on the side of the workpiece so that the high viscosity material in the form of the thread adheres to a front surface of the workpiece and the high viscosity material discharged in the form of the thread into the space on the side of the workpiece pivots around an edge of the workpiece to a back surface of the workpiece and adheres to the back surface of the workpiece. The high viscosity material can thus be applied to both the front and back surfaces of the workpiece in one step of discharging the high viscosity material only from the front surface side of the workpiece.

Abstract: A self-centering susceptor ring assembly is provided. The susceptor ring assembly includes a susceptor ring support member and a susceptor ring supported on the susceptor ring support member. The susceptor ring support member includes at least three pins extending upwardly relative to the lower inner surface of the reaction chamber. The susceptor ring includes at least three detents formed in a bottom surface to receive the pins from the susceptor ring support member. The detents are configured to allow the pins to slide therewithin while the susceptor ring thermally expands and contracts, wherein the detents are sized and shaped such that as the susceptor ring thermally expands and contracts the gap between the susceptor ring and the susceptor located within the aperture of the susceptor ring remains substantially uniform about the entire circumference of the susceptor, and thereby maintains the same center axis.

Abstract: Provided is a vacuum processing apparatus which is capable of performing baking processing of a deposition preventive plate without impairing the function of being capable of cooling the deposition preventive plate disposed inside a vacuum chamber. The vacuum processing apparatus has a vacuum chamber for performing a predetermined vacuum processing on a to-be-processed substrate that is set in position inside the vacuum chamber. A deposition preventive plate is disposed inside the vacuum chamber. Further disposed are: a metallic-made block body vertically disposed on an inner surface of the lower wall of the vacuum chamber so as to lie opposite to a part of the deposition preventive plate with a clearance thereto; a cooling means for cooling the block body; and a heating means disposed between the part of the deposition preventive plate and the block body to heat the deposition preventive plate by heat radiation.

Abstract: A method for large-scale, real-time simultaneous additive and subtractive manufacturing is described. The apparatus used in the method includes a build unit and a machining mechanism that are attached to a positioning mechanism, a rotating platform, and a rotary encoder attached to the rotating platform. The method involves rotating the build platform; determining the rotational speed; growing the object and the build wall through repetitive cycles of moving the build unit(s) over and substantially parallel to multiple build areas within the build platform to deposit a layer of powder at each build area, leveling the powder, and irradiating the powder to form a fused additive layer at each build area; machining the object being manufactured; and cutting and removing the build wall. The irradiation parameters are calibrated based on the determined rotational speed.

Abstract: The disclosed embodiments relate to portions of an article of footwear formed from an extruded member. In certain embodiments, a sole or portion of a sole can be formed from one or more extruded members. In certain embodiments, the extruded member can be a single, continuous piece of solid material. In certain embodiments, a sole for an article of footwear can be fashioned from an extruded member formed in a controlled geometric pattern. In certain embodiments, the sole can include one or more layers.

Abstract: A method for forming at least one three-dimensional article through successive fusion of parts of a powder bed on a support structure, the method comprising the steps of: providing at least one model of the three-dimensional article, lowering the support structure a predetermined distance and rotating the support structure a predetermined angle in a first direction before applying a first powder layer covering the lowered and rotated support structure, rotating the support structure the predetermined angle in a second direction opposite to the first direction before directing the at least one first energy beam from the at least one first energy beam source at selected locations of the first powder layer, the at least one first energy beam source causing the first powder layer on the stationary support structure which is stationary to fuse in the selected locations according to the model to form first portions of the three-dimensional article.

Abstract: Methods of forming porous nano-scale or micro-scale structured materials and structured materials formed thereby. Such methods entail providing a donor material and reacting the donor material to form a compound that deposits on a surface of a substrate to produce nano-scale or micro-scale geometric features of the structured material. In particular embodiments, the donor material is in a solution and the reacting step is performed by contacting the surface of the substrate with the solution and directing heat through the solution onto the surface to locally heat a portion of the solution in contact therewith.

Abstract: A method for manufacturing reinforced steel structural components is described. The method comprises providing a previously formed steel structural component, selecting one or more reinforcement zones of the previously formed structural component, and locally depositing a material on the reinforcement zone to create a local reinforcement on a first side of the structural component. Locally depositing a material on the reinforcement zone comprises supplying a metal filler material to the reinforcement zone, and substantially simultaneously applying laser heat to melt the metal filler material and create the reinforcement by drawing specific geometric shapes on the first side of the structural component with the metal filler material and the laser heating. And the method further comprises providing cooling to areas on an opposite side of the structural component. The disclosure further relates to a tool for manufacturing reinforced steel structural components and to the components obtained using such methods.

Abstract: Scanning Laser Epitaxy (SLE) is a layer-by-layer additive manufacturing process that allows for the fabrication of three-dimensional objects with specified microstructure through the controlled melting and re-solidification of a metal powders placed atop a base substrate. SLE can be used to repair single crystal (SX) turbine airfoils, for example, as well as the manufacture functionally graded turbine components. The SLE process is capable of creating equiaxed, directionally solidified, and SX structures. Real-time feedback control schemes based upon an offline model can be used both to create specified defect free microstructures and to improve the repeatability of the process. Control schemes can be used based upon temperature data feedback provided at high frame rate by a thermal imaging camera as well as a melt-pool viewing video microscope. A real-time control scheme can deliver the capability of creating engine ready net shape turbine components from raw powder material.

Abstract: A holding device includes: a plate-shaped base member defining a hole whose opening is formed at the lower face and extending toward an outer edge of the base member. A sheathed thermocouple is disposed in the hole. The hole has a first guide section that extends in a first direction, and a second guide section that extends in a second direction different from the first direction, through an intermediate guide section continuous with the first guide section, to a far end section of the hole, the sheathed thermocouple has an intermediate portion whose outer side surface is disposed closer to the opening with respect to the far end section of the hole. The outer side surface is in contact with an inner wall surface of the intermediate guide section. An end portion of the sheathed thermocouple is in contact with the far end section of the hole.

Abstract: A self-centering wafer carrier system for a chemical vapor deposition (CVD) reactor includes a wafer carrier comprising an edge. The wafer carrier at least partially supports a wafer for CVD processing. A rotating tube comprises an edge that supports the wafer carrier during processing. An edge geometry of the wafer carrier and an edge geometry of the rotating tube being chosen to provide a coincident alignment of a central axis of the wafer carrier and a rotation axis of the rotating tube during process at a desired process temperature.

Abstract: A UVLED apparatus and a related method provide increased UVLED intensity to promote efficient curing of a coated glass fiber. The apparatus employs a plurality of UVLED sources, each UVLED source emitting an oscillating output of ultraviolet radiation. Typically, at least two of the UVLED sources have oscillating outputs of ultraviolet radiation that are out of phase with one another. During curing, an incompletely cured coating on a glass fiber absorbs electromagnetic radiation emitted from the UVLED sources.

Abstract: Provided is a substrate processing apparatus.

Abstract: A light intensity adjustable ultraviolet device for curing an optical fiber coating includes a cylindrical mounting base; a UVLED light source module mounted along a peripheral direction and an axial direction in an inner cavity of the cylindrical mounting base; a cylindrical focusing lens configured in front of a light emitting surface of the UVLED light source module, so that ultraviolet light emitted by the UVLED light source module is focused on a curing axis; and an ultraviolet sensor mounted in the inner cavity of the cylindrical mounting base, wherein the ultraviolet sensor is connected to a UVLED power supply control module via an ultraviolet intensity signal processing module; the UVLED power supply control module is connected to the UVLED light source module, so that an optical fiber drawing speed and an ultraviolet intensity form a control closed loop.

Abstract: A substrate treatment method is provided, which includes a liquid film retaining step of retaining a liquid film of a treatment liquid on a major surface of a substrate, and a heater heating step of locating a heater in opposed relation to the major surface of the substrate to heat the treatment liquid film by the heater in the liquid film retaining step, wherein an output of the heater is changed from a previous output level in the heater heating step.

Abstract: This process for manufacturing an object by solidifying a powder (P) includes steps of: a) depositing a powder layer (P) on a working zone (Z); b) compacting this layer; c) solidifying a first zone (7) of the compacted layer using a laser; d) solidifying at least one second zone (11, 12, 13) of the compact layer, this second zone (11, 12, 13) making contact with the zone (7) solidified in step c), under solidifying conditions chosen so that this second solidified zone (11, 12, 13) is less strong than the first solidified zone (7); e) repeating steps a) to d) until the object (1) is obtained; and f), after step e) and when the object (1) is finished, removing the second zones (11, 12) with respect to the first zones (7).

Abstract: A cooling device includes: a cooling roller that cools down a sheet-like member by coming into contact with the sheet-like member; a belt member that is rotatably extended by a plurality of extending members, presses the sheet-like member against the cooling roller, and holds and carries the sheet-like member; and a driving roller that serves as one of the plurality of extending members and drives to rotate the belt member, wherein the driving roller is axially divided into a plurality of rollers and each of the plurality of rollers has a crown-like shape whose outer diameter continuously becomes larger from both end parts to a center part in an axial direction.

Abstract: A machine tool arranged to deliver an energy source through a processing head onto a work-piece, wherein; the machine-tool has a clamping mechanism arranged to temporarily receive the processing-head, or another machining or processing-head, to process a work-piece; the processing-head comprising one or more guiding mechanisms arranged to direct the energy source onto a work-piece and a processing-head docking-manifold arranged to have connected thereto one or more media to be, in use, supplied to the processing-head to facilitate processing of the work-piece; wherein the processing-head docking-manifold allows the one or more media to be supplied to the processing-head when the processing-head is connected to the clamping mechanism; and wherein the machine-tool also comprises at least one mechanism arranged to move a supply docking-manifold into and/or out of connection with the processing-head docking-manifold such that when the two manifolds are connected the or each media is supplied to the processing

Abstract: The disclosure relates to processes of preparing coated carrier particles by means of plasma activation and apparatus for use thereof.

Abstract: Nail gel curing devices emitting ultraviolet light, as well as methods of their making and use are disclosed. The devices are useful for curing, inter alia, acrylic compositions, more particularly, acrylic nail gel compositions, and typically employ ultraviolet and/or visible light emitting diodes (“LED”) to cure such ultraviolet and/or visible light curable nail gel resins.

Abstract: The invention relates to a device for coating substrates having a process chamber (1) disposed in a reactor housing and a two-part, substantially cup-shaped susceptor (2, 3) disposed therein, forming an upper susceptor part (2) with the cup floor thereof having a flat plate (2?) and a lower susceptor part (3) with the cup side walls thereof, the outer side (4) of the plate (2?) of the upper susceptor part (2) facing upwards toward the process chamber (1) and forming a contact surface for at least one substrate, the upper susceptor part (2) contacting a front edge (3?) of the lower susceptor part (3) at the edge of said upper susceptor part (2), the lower susceptor part (3) being supported by a susceptor carrier (6), and heating zones (A, B, C) for heating the upper susceptor part (2) being disposed below the plate (2?).

Abstract: A system and method for photo-grafting a coating polymer onto the surface of a medical device are provided. The system comprises a plurality of stations including a novel grafting station. The system and method of the invention are both time- and resource-efficient. The system includes several stations, each station including a dipping tank. The system allows for the automated, semi-automated, or manual dipping of medical devices into the dipping tanks in a specified order, as desired, wherein at least one of the stations is a grafting station for photo-grafting the coating polymer onto the surface of the medical device. The system is modular, which allows for modification of the process as required, depending on the needs of the user. The system may comprise stations for incorporating an antimicrobial agent into the coating, and/or for rendering the coating lubricious.

Abstract: When the coating object area is positioned on the suction table, the film is stopped and is mounted on the suction table, and is further provided with tension in the longitudinal direction to eliminate slacks or the like, but, curl is caused in the both side end regions in the coating object area. Therefore, the coating object area is mounted on the suction table, and at the same time, the curl correction bars disposed on the both sides of the suction table are moved to the curled portions of the coating object area, and then the curled portions are pressed against the suction surface of the suction table to thereby perform the curl correction. Further, in the coating process with the UV-curing coating material, the UV light from the UV light source formed integrally with the coating head is applied to cure the material. In the vacuum suction section, as the destination, the bubbles or the like in the coating head are sucked.

Abstract: Disclosed are coating apparatus including flow coating and roll-coating that may be used for uniform sol-gel coating of substrates such as glass, solar panels, windows or part of an electronic display. Also disclosed are methods for substrate preparation, flow coating and roll coating. Lastly systems and methods for skin curing sol-gel coatings deposited onto the surface of glass substrates using a high temperature air-knife are disclosed.

Abstract: A fabrication method is provided for use in making a component. The fabrication method may include generating a laser beam at a first orientation relative to a wear surface of the component to produce a first laser beam spot having a first characteristic, and feeding a cladding material into the first laser beam spot to produce a cladding layer on the wear surface. The fabrication method may also include generating a laser beam at a second orientation relative to the wear surface of the component to produce a second laser beam spot having a second characteristic, and moving the second laser beam spot along the cladding layer to substantially flatten the cladding layer.

Abstract: The present invention relates to a powder-coating apparatus for coating objects, comprising an application device which is designed to apply powder coating to regions of the object that are to be coated; and comprising an irradiation device which has at least one electromagnetic radiation source, which is designed to direct electromagnetic radiation onto areas of the object that are to be coated with powder coating and which is designed to thus cross-link the powder coating onto the coated regions. The present invention further relates to a powder-coating method for coating objects by means of a powder-coating apparatus according to the invention.

Abstract: A functionally graded thermal barrier coating (30) formed as a plurality of layers (34, 36 . . . 44, 46) of materials deposited by a powder deposition process wherein the composition of the various layers changes across a thickness of the coating. A composition gradient may exist within a single layer (58) due to the buoyancy of ceramic particles (62) within a melt pool (56) of bond coat material (64). The powder deposition process includes powdered flux material (20) which melts to form a protective layer of slag (28) during the deposition process.

Abstract: The present invention relates to a laser depositioning device with a machine bed, onto the surface of which can be deposited a powder material, using at least one first laser for layer by layer melting of the powder material, characterized in that at least one second laser is provided to melt on the powder material layer by layer, with the second laser having a higher power than the first laser, as well as to a method for producing a component provided with a supporting structure.

Abstract: A method and an arrangement are disclosed for producing an electrically conductive pattern on a surface. Electrically conductive solid particles are transferred onto an area of predetermined form on a surface of a substrate. The electrically conductive solid particles are heated to a temperature that is higher than a characteristic melting point of the electrically conductive solid particles, thus creating a melt. The melt is pressed against the substrate in a nip, wherein a surface temperature of a portion of the nip that comes against the melt is lower than said characteristic melting point.

Abstract: An apparatus for processing a wafer is disclosed that includes a wafer support and a processing base. The wafer support is configured to support a wafer in a processing position, and to rotate the wafer about a first substantially vertical axis while in the processing position. The processing base includes a shallow dish configured to receive processing chemistry. The wafer support places the wafer in contact with the processing chemistry while in the processing position. The shallow dish is rotatable about a second substantially vertical axis when the wafer support is in the processing position. The rotation of the wafer is independent of the rotation of the shallow dish. Further, the processing base may include a heating element, such as an infrared heating element, that is disposed to locally elevate the temperature of of the shallow dish and chemistry contained in it.

Abstract: An object is to improve use efficiency of an evaporation material, to reduce manufacturing cost of a light-emitting device, and to reduce manufacturing time needed for a light-emitting device including a layer containing an organic compound. The pressure of a film formation chamber is reduced, a plate is rapidly heated by heat conduction or heat radiation by using a heat source, a material layer on a plate is vaporized in a short time to be evaporated to a substrate on which the material layer is to be formed (formation substrate), and then the material layer is formed on the formation substrate. The area of the plate that is heated rapidly is set to have the same size as the formation substrate and film formation on the formation substrate is completed by one application of heat.

Abstract: A system or apparatus for forming a conductive pattern on a substrate (208) includes a thermal imaging head (220) that forms an image pattern on the substrate. A functional material (240) spraying element (224) applies a functional material on the substrate which bonds with the image pattern. The spraying element is integrated in the thermal imaging head. An electro-less deposition element is applied using the electro-less deposition element on the substrate to enhance the functionality of the final product.

Abstract: A machine, which is usable for additive manufacturing by sintering or melting of powder using an energy beam acting on a powder layer in a working zone, includes a device for producing a layer of the powder. The device includes a storage apparatus for storing the powder, a distributor for distributing the powder, a feeder for transferring the powder from the storage apparatus to the distributor, and a dose controller for controlling a quantity of the powder transferred from the storage apparatus to the distributor. The distributor travels over the working zone in order to distribute the powder in a layer having a final thickness adapted to the additive manufacturing. The storage apparatus is located above the working zone such that the feeder utilizes gravity. The feeder and the dose controller are movable with the distributor.

Abstract: According to one embodiment, a semiconductor manufacturing apparatus includes a substrate stage, a transfer unit, and a control unit. A substrate is settable on the substrate stage. The transfer unit is configured to transfer a pattern having an uneven configuration onto a major surface of the substrate by attachably and removably holding a template. The pattern is provided in the transfer surface. The control unit is configured to acquire information relating to a number of foreign objects on the major surface prior to the transferring of the pattern. The control unit adds the number for a plurality of the substrates including the pattern transferred by the transfer unit. The control unit causes the transfer unit not to implement the transferring of the pattern in the case where the sum has reached the upper limit.

Abstract: Embodiments of the present invention provide apparatus and method for improving gas distribution during thermal processing. One embodiment of the present invention provides an apparatus for processing a substrate comprising a chamber body defining a processing volume, a substrate support disposed in the processing volume, wherein the substrate support is configured to support and rotate the substrate, a gas inlet assembly coupled to an inlet of the chamber body and configured to provide a first gas flow to the processing volume, and an exhaust assembly coupled to an outlet of the chamber body, wherein the gas inlet assembly and the exhaust assembly are disposed on opposite sides of the chamber body, and the exhaust assembly defines an exhaust volume configured to extend the processing volume.

Abstract: Disclosed is a liquid processing apparatus which performs a liquid processing by supplying a chemical liquid from a chemical liquid supplying unit to substrate rotating around a vertical axis, and includes a cover member arranged at an upper surface of substrate to oppose the substrate and have a space therebetween is provided with a gas supplying port, and gas is supplied from gas supplying port toward the space. The gas is discharged from the space through a gap between protrusion at the circumferential edge of cover member protruding downward and the substrate. In addition, lamp heater heating the circumferential edge of substrate is arranged in the space along the circumferential direction of substrate, the chemical liquid supplied from a chemical liquid supplying unit is supplied to a position closer to the circumferential edge side than a position at which lamp heater is provided.

Abstract: A substrate processing apparatus includes a plurality of chuck pins and a heat source. The chuck pin includes a conductive member made of a material containing carbon, and a pin cover that covers the conductive member. The conductive member includes a gripping portion softer than the substrate, the gripping portion to be pressed onto a peripheral edge portion of the substrate, and protrudes outward from an outer peripheral edge of the substrate in a plan view in a state where the gripping portion is pressed onto the peripheral edge portion of the substrate. The pin cover covers, in a plan view, the entire region of a part of the conductive member protruding outward from the outer peripheral edge of the substrate in a plan view in a state where the gripping portion is pressed onto the peripheral edge portion of the substrate.

Abstract: Various embodiments relate to application of a fluid to a substrate. The fluid is locally heated, for example, to obtain a desired thickness profile.

Abstract: A UV forming apparatus and method for roll to roll alignment is disclosed. The apparatus comprises an unrolling mechanism (101), a coating mechanism (102), a UV forming mechanism (100), a stripping mechanism (107) and a withdraw roll mechanism (110); wherein the apparatus further comprises an adjusting alignment mechanism (10) comprising a flat mold supporting apparatus (116) and an alignment probe (108), the flat mold supporting apparatus (116) is capable of adjusting the position of the flat mold at three degrees of freedom including horizontal, vertical, and angle; the mold (112) is disposed on the flat mold supporting apparatus, the UV forming mechanism (100) and the adjusting alignment mechanism (10) are fixed to the forming apparatus. The present disclosure eliminates the influence of the cumulative error and the bubbles to patterns in the alignment procedure during production.

Abstract: Various embodiments provide a method and apparatus for forming a three-dimensional article through successive fusion of parts of at least one layer of a powder bed provided on a work table in an additive manufacturing machine, which parts corresponds to successive cross sections of the three-dimensional article. The method comprises the steps of: applying a layer of predetermined thickness of powder particles on the work table, applying a coating on at least a portion of the powder particles, which coating is at least partially covering the powder particles, and fusing the powder particles on the work table with an electron beam.

Abstract: A method and apparatus for the continuous powder coating of a non-conductive profile produced in a continuous forming process, such as pultrusion or extrusion, such that the profile is powder coated while on the profile forming machine and before the subject segment of the continuous profile is severed from the continuous profile on the forming machine (i.e. in-line).

Abstract: A method and a system for producing a change in a medium. The method places in a vicinity of the medium an energy modulation agent. The method applies an initiation energy to the medium. The initiation energy interacts with the energy modulation agent to directly or indirectly produce the change in the medium. The energy modulation agent has a normal predominant emission of radiation in a first wavelength range outside of a second wavelength range (WR2) known to produce the change, but under exposure to the applied initiation energy produces the change. The system includes an initiation energy source configured to apply an initiation energy to the medium to activate the energy modulation agent.

Abstract: A method of coating molded metals includes cleaning a molded metal, coating the molded metal with a coating, and curing the coated molded metal. The coating includes monofunctional monomers, multifunctional monomers, and acrylic oligomers. A molded metal coating application system includes a conveyor configured to transport a molded metal. A cleaning stage is configured to clean the molded metal. A coating stage is configured to deposit a coating on the molded metal. A curing stage is configured to cure the deposited coating on the molded metal. The coating includes monofunctional monomers, multifunctional monomers, and acrylic oligomers.

Abstract: According to one embodiment, a semiconductor device manufacturing method includes: bonding a first wafer and a second wafer to each other, to form a stack; rubbing a film attached with a fill material in a thin-film shape into a gap located between a bevel of the first wafer and a bevel of the second wafer, to fill the gap with the fill material; and thinning the first wafer.

Abstract: A process and apparatus are disclosed for the deposition of a layer of a first material onto a substrate of a second material. Powder particles of the first material are entrained into a carrier gas flow to form a powder beam directed to impinge on the substrate. This defines a powder beam footprint region at the substrate. The powder beam and the substrate are moved relative to each other to move the powder beam footprint relative to the substrate, thereby to deposit the layer of the first material. A laser is operated to cause direct, local heating of at least one of a forward substrate region and a powder beam footprint region. The laser beam direction is defined with reference to a plane coincident with or tangential to a surface of the substrate at the centre of the laser beam footprint in terms of an elevation angle from the plane to the laser beam direction and in terms of an acute azimuthal angle from the movement direction to the laser beam direction.

Abstract: This invention discloses apparatus for processing one or more of a Lens Precursor, a Lens Precursor Form and an ophthalmic Lens. The apparatus provides for vapor phase processing of the subject Lens Precursor, a Lens Precursor Form and an ophthalmic Lens.

Abstract: A method for treating a carbonaceous material comprising heating a carbonaceous material to form a mixture of the carbonaceous material and a tar; cooling the mixture of the carbonaceous material and the tar; and coating a surface of the carbonaceous material with the tar to form a tar-coated carbonaceous material, and a system related thereto.