Abstract: When the coating object area is positioned on the suction table, the film is stopped and is mounted on the suction table, and is further provided with tension in the longitudinal direction to eliminate slacks or the like, but, curl is caused in the both side end regions in the coating object area. Therefore, the coating object area is mounted on the suction table, and at the same time, the curl correction bars disposed on the both sides of the suction table are moved to the curled portions of the coating object area, and then the curled portions are pressed against the suction surface of the suction table to thereby perform the curl correction. Further, in the coating process with the UV-curing coating material, the UV light from the UV light source formed integrally with the coating head is applied to cure the material. In the vacuum suction section, as the destination, the bubbles or the like in the coating head are sucked.

Abstract: Broadly speaking, a method and an apparatus are provided for depositing a material on a semiconductor wafer (“wafer”). More specifically, the method and apparatus provide for selective heating of a surface of the wafer exposed to an electroless plating solution. The selective heating is provided by applying radiant energy to the wafer surface. The selective heating of the wafer surface causes a temperature increase at an interface between the wafer surface and the electroless plating solution. The temperature increase at the interface in turn causes a plating reaction to occur at the wafer surface. Thus, material is deposited on the wafer surface through an electroless plating reaction that is initiated and controlled by varying the temperature of the wafer surface using an appropriately defined radiant energy source.

Abstract: An epitaxial growth susceptor having a pocket that horizontally supports a single-crystal substrate in an epitaxial growth apparatus in which the pocket has an outer peripheral region with which the single-crystal substrate comes into contact to be supported; and a central region that is surrounded by the outer peripheral region and does not come into contact with the single-crystal substrate, one or more through holes that pierce the epitaxial growth susceptor are formed in the central region of the pocket, and the outer peripheral region of the pocket has a tapered shape that is inclined with a tilt angle that is greater than 0° and less than 1° in such a manner that a depth increases toward the central region, and also has a horizontal width that is 3.3% or more of a diameter of the single-crystal substrate to be supported.

Abstract: There is described an apparatus (1) for coating a cylinder (C), in particular a wiping cylinder of an intaglio printing press, with a plastic composition comprising, inter alia, heating means (6) for applying radiant heat to the cylinder throughout its length, the heating means being disposed in a movable hood part (7) adapted to be moved on top of the cylinder for applying heat thereto or away from the cylinder to allow mounting or dismounting of the cylinder (C) on or from the apparatus. In the closed state, the hood part forms an interior space enclosing the cylinder. The hood part includes a hood body (71) and a window panel (72, 73) mounted on a front side of said hood body to allow a human operator to monitor deposition of the plastic composition onto the surface of the cylinder.

Abstract: The present invention provides a portable apparatus for heating a surface of an object during powder coating. The object is fixed at a location, and a powder comprising a thermal plastic polymer or a thermoset polymer is applied to the surface of the object prior to heating. The apparatus comprises a portable support member, and a portable first heater for heating the surface of the object, the first heater being mounted to the support member.

Abstract: A heat treatment method includes a substrate holder that holds a plurality of substrates at predetermined vertical intervals and is carried into a heat treating furnace for performing a predetermined heat treatment on the substrates. The substrate holder has two holder constituting bodies each having a plurality of columns and substrate holding sections. One of the holder constituting bodies holds the substrates at a first, vertically adjacent distance so that their front surfaces face each other, while the other of the holder constituting bodies holds the substrates at a second, vertically adjacent distance so that their back surfaces face each other wherein the second distance is smaller than the first distance to ensure uniformity of the heat treatment. At least one of the holder constituting bodies moves in the vertical direction to change the positions of the holder constituting bodies relative to each other.

Abstract: A liquid droplet ejection apparatus includes: a liquid droplet ejection portion that ejects a liquid droplet containing a structure forming material onto a substrate; and drying means that dries the droplet on the substrate, thereby forming a structure made of the structure forming material. The drying means includes an energy outputting section that outputs energy onto the droplet on the substrate, thereby causing the structure forming material in the droplet to flow; and an energy profile controlling section controlling an energy profile of the energy output by the energy outputting section to be an energy profile that permits the structure forming material to flow such that the structure forming material is distributed in accordance with a structure profile of the structure to be formed. According to the liquid droplet ejection apparatus, a structure having a desired structure profile is obtained.

Abstract: A method of manufacturing an optical data storage medium, comprising at least one substrate (11) and a plurality of layers deposited on the substrate (11) is described. The medium includes at least one of a transparent spacer layer and transparent cover layer (12). The layer (12) is provided by applying a liquid onto the rotating substrate (11) and rotating the substrate (11) further in order to spread out the liquid into a layer substantially uniformly between an inner radius ri and an outer radius ro, and solidifying the liquid layer (12) by means of exposure to UV radiation. After applying the liquid onto the rotating substrate the liquid layer (12) is heated by heating means (14) in such a way that the temperature rise of the liquid layer (12) at ri has a value dTri, while the temperature rise of the liquid layer (12) between ri and ro gradually increases, and the temperature rise of the liquid layer (12) at ro has a value dTro>dTri.

Abstract: Methods and apparatus for processing a substrate (e.g., a semiconductor substrate) is disclosed that includes irradiating at least a portion of the substrate surface with a plurality of short radiation pulses while the surface portion is exposed to a dopant compound. The pulses are selected to have a fluence at the substrate surface that is greater than a melting fluence threshold (a minimum fluence needed for the radiation pulse to cause substrate melting) and less than an ablation fluence threshold (a minimum fluence needed for the radiation pulse to cause substrate ablation). In this manner a quantity of the dopant can be incorporated into the substrate while ensuring that the roughness of the substrate's surface is significantly less than the wavelength of the plied radiation pulses.

Abstract: Method and apparatus for depositing material in hard to reach locations of a workpiece. An elongated member is inserted in an opening. The member transports a laser beam from a fiber laser and material, preferably in powder form, to the desired location. The material is deposited on the workpiece and the laser beam contacts the material. The method and apparatus may be used to manufacture a part or to repair an existing part.

Abstract: A method, apparatus and material produced thereby in an amorphous or crystalline form having multiple elements with a uniform molecular distribution of elements at the molecular level.

Abstract: A substrate treating device comprising a treatment chamber for storing and treating substrates and a heating device having a heating element and a heat insulator and heating the substrates in the treatment chamber by the heating element. The heating element is so formed that only its one end is held by a holding part, and a projection projected to the treatment chamber side at the intermediate part of the heating element and positioned in proximity to or in contact with the heating element is formed on the heat insulator. A pin with an enlarged part is passed through the heating element and the heat insulator at the intermediate part of the heating element and the enlarged part is positioned in proximity to or in contact with the heating element. The plurality of projections may be formed on the heat insulator and the pins may be disposed between these plurality of projections.

Abstract: The present invention provides an automated continuous coating apparatus for coating industrial components such as porcelain, glass, and polymeric insulators. The apparatus consists of a several stage continuous inline operation. The stages are a cleaning operation, followed by drying and heating, coating, and curing.

Abstract: To perform a series of resist coating treatments from application of a resist solution to removal of a resist film on a wafer edge portion in a shorter time. A laser irradiation unit for applying a laser light is provided in a resist coating unit. At the time of resist coating treatment, the resist solution is discharged onto a central portion of the rotated wafer from a resist solution supply nozzle to form a resist film on the wafer. Thereafter, the laser irradiation unit moves to an outer peripheral portion of the wafer and applies the laser light onto the resist film on the outer peripheral portion to dry the resist film on the outer peripheral portion. After the resist film on the outer peripheral portion dries, the application of laser light is continued, and the solvent supply nozzle moves to a position above the edge portion of the wafer and supplies the solvent to the resist film on the edge portion of the wafer.

Abstract: A method and apparatus are described for forming a structure on a substrate. The structure may be a circuit element. The method uses a digital specification 910 for forming the structure, including specifications for printing and curing. The structure is printed (step 112) using a drop-on-demand printer 400, wherein the printing dispenses at least one material on the substrate 420 according to the digital specification 910. The structure is cured (step 130) by irradiating the dispensed material from one or more electromagnetic radiation sources 520, 525 in the printer 400, wherein curing parameters are specified by the digital specification 910 to obtain a desired electrical property when the structure is a circuit element. The curing specification may specify the intensity of the irradiation and the location of irradiation points in the print region.

Abstract: A cost effective method and apparatus are provided for forming metallized fibers and depositing multilayer films thereon to form thin film electrochemical energy storage devices. In one embodiment, a fibrous substrate is formed using a fiber spinning process and the fibrous substrate is plated with a copper layer using wet deposition. Multiple material layers are then deposited onto the copper layer to form a lithium-ion battery fiber.

Abstract: A recording head is operable to eject ink toward a recording medium. A carriage mounting the recording head is operable to carry the recording head in a first direction. At least one infrared ray heater is provided on the carriage so as to oppose the recording medium. An input energy of the infrared ray heater is 60 W or less.

Abstract: A system for and method of processing an article such as a semiconductor wafer is disclosed. The wafer includes first and second surface which are segmented into a plurality of first and second zones. The first surface of the wafer, for example, on which devices or ICs are formed is processed by, for example, laser annealing while the second surface is heated with a backside heating source. Corresponding zones on the first and second surfaces are processed synchronously to reduce variations of post laser anneal thermal budge across the wafer.

Abstract: This disclosure relates to systems and associated methods for applying a surface treatment to a part and curing the surface treatment without reorienting the part in the process. The systems include a first conveyor, a second conveyor, a system for applying a surface treatment, such as a powder coating application system, and a system for curing the surface treatment.

Abstract: Embodiments of the invention relate generally to an ultraviolet (UV) cure chamber for curing a dielectric material disposed on a substrate and to methods of curing dielectric materials using UV radiation. A substrate processing tool according to one embodiment comprises a body defining a substrate processing region; a substrate support adapted to support a substrate within the substrate processing region; an ultraviolet radiation lamp spaced apart from the substrate support, the lamp configured to transmit ultraviolet radiation to a substrate positioned on the substrate support; and a motor operatively coupled to rotate at least one of the ultraviolet radiation lamp or substrate support at least 180 degrees relative to each other.

Abstract: A method for forming a selective emitter of a solar cell and a diffusion apparatus for forming the same are provided. The method includes texturing a surface of a silicon substrate by etching the silicon substrate, coating an impurity solution on the surface of the silicon substrate, injecting a first thermal energy into the whole surface of the silicon substrate, and, while the first thermal energy is injected into the whole surface of the silicon substrate, injecting a second thermal energy by irradiating a laser beam into a partial region of the surface of the silicon substrate.

Abstract: A method for producing a metallized image on a sheet material includes impregnating the material with a metal salts-containing solution and exposing the specified material points to a pulse laser radiation. The interaction of the pulses with the solution within a laser spot irritates a photochemical reaction resulting in a metal ion reduction into the elementary state thereof by associating the required number of electrons and deposition of metallic film which is firmly fixed to the filler of the sheet material in the laser spot area on the material surface. In case of sufficient laser radiation power, a recess is formed on the sheet material surface, and the metallic film is deposited on the bottom of the recess.

Abstract: The invention relates to a device for coating substrates having a process chamber (1) disposed in a reactor housing and a two-part, substantially cup-shaped susceptor (2, 3) disposed therein, forming an upper susceptor part (3) with the cup floor thereof having a flat plate (2) and a lower susceptor part (3) with the cup side walls thereof, the outer side (4) of the plate (2) of the upper susceptor part (2) facing upwards toward the process chamber (1) and forming a contact surface for at least one substrate, the upper susceptor part (2) contacting a front edge (3?) of the lower susceptor part (3) at the edge of said upper susceptor part (2), the lower susceptor part (3) being supported by a susceptor carrier (6), and heating zones (A, B, C) for heating the upper susceptor part (2) being disposed below the plate (2?).

Abstract: Methods and apparatuses for forming components or circuits by ejecting a fluid including materials in a single ligament are disclosed.

Abstract: Method for the solvent-free production of acrylate adhesive masses, which comprises (a) continuously coating a mixture, containing one or more photoinitiators and a monomer mixture comprising (i) 70 to 100% by weight compounds selected from the group consisting of (meth)acrylic acid and the derivatives thereof in accordance with the formula where R1 is H or CH3 and R2 is an alkyl chain having 2 to 20 carbon atoms; (ii) 0 to 30% by weight of olefinically unsaturated monomers having functional groups; and (iii) optionally additional components, or a prepolymer of said monomer mixture on a process carrier; b) polymerizing the coated mixture by applying radiation to the coated sections of the process carrier using visible or ultraviolet light; (c) separating the polymer product from the process carrier and forming the polymer product; (d) transferring the polymer product into a mixing device; (e) mixing the polymer product with additional components in a mixing device; and (f) further processing the polymer p

Abstract: The present invention describes a system and device for self-tanning characterized by the fact that said device comprises a booth (2) whose two lateral walls (5) are fitted with a series of gratings (51) where, behind each grating (51), the presence of one or more lamps (52) is envisaged, which are intended to warm the area inside the booth and to radiate the skin of a person situated in the interior of the booth, means of movement (40) located externally to the rear wall (4) and intended to make a rod (41) run, with said rod being fitted with arms (42) whose free ends (43) are fitted with a spraying device (11) equipped with nozzles (12) designed to nebulize a tanning substance and a high pressure pump (14) connected to a compressor which is envisaged for sucking up the tanning solution from a recipient (15) and transferring it to a pipeline connected with the spraying device (11) The device comprises a control panel (6) connected to a means of management envisaged for activating and governing the diverse fu

Abstract: A semiconductor film formation device has: a reaction vessel that includes a gas flow path to allow source gas to pass through and a substrate mount site provided in the gas flow path to mount a substrate; a temperature control means that is disposed opposite to the substrate mount site and close to the reaction vessel to control the internal temperature of the reaction vessel; and a thermal conductivity adjusting member that is disposed between the reaction vessel and the temperature control means. The thermal conductivity adjusting member has a section with a thermal conductivity different from the other section along the gas flow path.

Abstract: A central dryer for electron beam curing is described which includes a first application unit for the application of a first coating to a web. The central dryer for electron beam curing also includes an irradiation unit in which a first electron beam generator and a second electron beam generator are arranged for the irradiation of the web. The electron beam generators arranged in the irradiation unit have connections for at least one pump system to generate an operating vacuum. In addition to this the central dryer for electron beam curing also has a web guiding system which feeds the web successively but not necessarily in direct succession, to the first application unit, the first electron beam generator, the second electron beam generator.

Abstract: A process includes vacuum coating a shaped profile with a UV curable coating composition and subsequently curing the coated shaped profile to form a shaped profile having a uniform coated, cured coating. The curing is carried out with a pulsed UV device operated at a pulse frequency at pulse power such that the coating composition is uniformly cured over the coated surfaces of the shaped profile. The process is carried out continuously to coat and cure a shaped profile moving lengthwise through sequentially arranged coating and curing devices. An apparatus for carrying out the process that includes a vacuum coater and a UV curing chamber.

Abstract: A glass object is heated by application of infrared energy and radio-wave energy. A coating is applied to the glass object and the glass object is subject to additional heating with radio-wave energy. The temperature and duration of the additional heating may be sufficient for a pyrolytic reaction to occur between the coating and the glass object. The coated glass object may be cooled either rapidly to temper the glass or cooled gently to anneal the glass.

Abstract: An apparatus comprises a deformable platform and a laser delivery system. The deformable platform has a surface capable of changing to conform to a shape of an object as the object is being manufactured during a sintering process. The laser delivery system is capable of sintering powder on the deformable platform to manufacture the object.

Abstract: Sandwiched structures for an optical disc, especially for Blu-ray discs, are disclosed. According to one exemplary structure, a substrate is sandwiched by two cover layers on both sides of a disc As a result, similar characteristics in material on both sides of the disc help sustain the shape and flatness of the disc. To provide the cover layers in uniform thickness, techniques for creating or producing such a cover layer are described. In one embodiment, a certain amount of the material in liquid form is dispensed onto a dispensing structure. After the dispensing structure is engaged to hold a disc, the dispensing structure and the disc as a whole unit is rotated at a predefined speed.

Abstract: In a laser cladding, a diamond particulate is applied to the base material of an article that has been melted by an energy source such as a laser. The particulates are introduced into the molten material and allowed to settle as the article surface cools and solidifies. The diamond particulates function to increase the wear resistant characteristics of the article. In one embodiment, the diamond particulates are covered with a metallic veneer, which may be tungsten.

Abstract: The present invention relates generally to production of photoelectric grade films or cells from semiconductor powders or dust. In one embodiment, the present invention provides a method for producing a photoelectric grade film from a semiconductor powder. The method includes providing a substrate, coating the substrate with a layer of the semiconductor powder and moving the substrate with the layer of the semiconductor powder under an energy source at a predefined rate, wherein the predefined rate is sufficient to melt the semiconductor powder by the energy source and to cool the substrate such that substantially all impurities are moved to an edge of the substrate.

Abstract: There are provided a method for imparting a high-durability function to a polymer formed article, which can efficiently impart various function-imparting agents to the polymer formed article, can decrease processing waste liquid as much as possible and recover the waste liquid and the function-imparting agents, can also reuse them as needed, and moreover, can impart the function-imparting agents to the polymer formed article by a continuous system, not by a batch system; and an apparatus thereof. A method for imparting a function to a polymer formed article, which comprises spraying a supercritical fluid to the polymer formed article to firmly fix a function-imparting agent to the polymer formed article.

Abstract: A method and apparatus are provided for growing a composite metal sulphide photcatalyst thin film, wherein photochemical deposition and chemical bath deposition are both performed for growing the composite metal sulphide thin film, such as (AgInS2)x/(ZnS)2(1-x), wherein x is 0-1.

Abstract: A strand is coated with a powdered material by first applying a layer of hot polymer resin to the strand, and spraying the powdered material onto the resin-coated strand from at least three nozzles disposed along the processing path and spaced radially therearound. The spray apparatus is disposed within nested containers so as to limit the escape of overspray powder. The powder-coated strand may be heat-set to increase the adhesion of the powder.

Abstract: An apparatus for coating an article where the apparatus includes an applicator, a conveyor for sequentially transporting a plurality of articles to the roller and a metering bar positioned against the applicator to meter a predetermined amount of coating composition to the applicator for transfer to an article transported to said applicator by the conveyor.

Abstract: A UV curing apparatus and method is provided for enhancing the distribution and application of UV light to UV photo initiators in a UV curable ink, coating or adhesive. The UV curing apparatus and method comprises UV LED assemblies in a first row with the UV LED assemblies spaced from adjacent UV LED assemblies. At least one second row of a plurality of UV LED assemblies are provided next to the first row but with the UV LED assemblies of the second row positioned adjacent the spaces between adjacent UV LED assemblies in the first row thereby to stagger the second row of UV LED assemblies from the UV LED assemblies in the first row. Desirably, the rows of staggered UV LED assemblies are mounted on a panel. UV curable products, articles or other objects containing UV photo initiators that are in or on a web can be conveyed or otherwise moved past the rows of UV LED assemblies for effective UV curing.

Abstract: An apparatus for applying and fusing a powder coating to substrates of various composition uses two lasers to accurately heat the coating to the optimum temperature. A second laser has less power and heats a smaller area than the first laser. Temperature control is enhanced by the ability to superheterodyne two lasers at separate frequencies. This allows for better absorption of certain materials being fused by the laser. Another common problem associated with laser processing occurs as the polymer heats up. During the heating process the spectral lines are Doppler broadened and slightly shifted. This can affect the absorption of a laser of a fixed wavelength. With the present invention, the optimum laser frequency can be turned to a more optimum frequency for absorption still with sufficient power for fast efficient thermal processing.

Abstract: Methods and apparatus for the deposition of a source material (10) are disclosed. An atomizer (12) renders a supply of source material (10) into many discrete particles. A force applicator (14) propels the particles in continuous, parallel streams of discrete particles. A collimator (16) controls the direction of flight of the particles in the stream prior to their deposition on a substrate (18). In an alternative embodiment of the invention, the viscosity of the particles may be controlled to enable complex depositions of non-conformal or three-dimensional surfaces. The invention also includes a wide variety of substrate treatments which may occur before, during or after deposition. In yet another embodiment of the invention, a virtual or cascade impactor may be employed to remove selected particles from the deposition stream.

Abstract: A radiation appliance for irradiating surfaces of objects during powder coating, having energy radiators movably arranged on one carrier wherein at least one measuring temperature sensor that can measure the temperature of the object in at least one section of the surface of the object and a control unit are provided, wherein the control unit can record the measured temperature of the temperature sensor(s) and controls at least one energy radiator, which is assigned to the section of the surface whose temperature is being measured, and an arrangement and method for powder coating wooden objects, comprising a powder-coating station, a first radiation appliance, and a section for hardening or crosslinking the powder, wherein the first radiation appliance is arranged between powder-coating station and section and the second radiation appliance is arranged in the section, and the moisture content of the objects is set to 7 to 7.8 weight-percent water.

Abstract: A method for applying hot melt adhesive powder onto a non-metallic object surface comprises the steps of applying a cleaning agent, applying a conductive liquid, radiating, spraying hot melt adhesive powder; and heating. A system for applying hot melt adhesive powder onto a non-metallic object surface comprises a convey belt, a radiation chamber, a spraying chamber and a heating chamber. The convey belt is used to deliver a non-metallic object treated by a cleaning agent and a conductive liquid through the radiation chamber where the surface of the non-metallic objected is radiated by ultraviolet rays and ozone and then through the spraying chamber where the surface of the non-metallic object is sprayed with charged hot melt adhesive powder, and finally into the heating chamber where the hot melt adhesive powder attached onto the non-metallic object will be melted into a liquid adhesive film ready to be bonded.

Abstract: The invention relates to a method for producing a metallic pressed sheet or an endless strip, whereby a surface structure is produced by applying a mask for partial chemical passivation followed by chemical surface treatment. The invention also relates to a device for implementing said method. In order to significantly improve the reproducibility and the resolution of the mask obtained, the mask is produced from a UV-hardening lacquer which is applied by a suitable device. The resolution is improved by means of a nozzle matrix which sprays the UV-hardening lacquer in dots, the individual dots forming a pattern as a result of the overspraying thereof, thereby forming the mask to be produced. The UV-hardening lacquer is especially advantageous in that it can be removed from the surface very easily after the etching process, and enables a high reproducibility compared to the conventional screen printing methods.

Abstract: In the method according to the invention for coating a plastic substrate with a transition layer, which particularly enables an improved bond of the optical functional layer system arranged above said transition layer to the plastic substrate lying underneath said transition layer, a polymerizable liquid is applied to a substrate surface of the plastic substrate to be coated, and said liquid is polymerized at that location, by irradiation with ultraviolet light, into a bonding agent which forms the transition layer. For this process, the plastic substrate passes consecutively through a high-pressure cleaning device (24), a spin-coating device (26), a UV-irradiation device (28), and a coating device (32) for applying the optical functional layer system.

Abstract: The present invention relates to a curing assembly comprising at least two light sources combined into one light path, wherein the light sources are capable of curing a material exposed to the combined light path. The invention also relates to a method of curing a material or material in contact with a heat sensitive material comprising providing a curable material or a material associated with a heat sensitive material and exposing curable material to a combined light path from the curing assembly.

Abstract: An image recording composition including water-absorbing resin particles and a curable material that is cured upon application of an external stimulus, a volume average particle diameter of the water-absorbing resin particles being from about 0.5 ?m to about 5.0 ?m, and a content of the water-absorbing resin particles in the image recording composition being from about 5% by weight to about 50% by weight.

Abstract: A powder metal cladding nozzle which is coaxially attached to a laser processing head that irradiates a process portion (W) with a laser beam (L) and that discharges powder metal (P) to a laser beam irradiation portion in the process portion (W). The powder metal cladding nozzle includes a body portion (2) that has a ring-shaped powder metal holding space (7) in which the powder metal (P) is held; and a nozzle portion (3) that is connected to the body portion (2) and that has plural discharge passages (18) which are communicated with the powder metal holding space (7) and which open at an outlet (19) for discharging the powder metal (P). The powder metal holding space (7) is formed in the body portion (2) and is divided into plural powder metal holding regions corresponding to plural supply passages (10) that open into the powder metal holding space (7) and that supply the powder metal (P) to the powder metal holding space (7).

Abstract: The present invention relates to an apparatus for laser cladding of a curved surface comprising: (a) an elongated arm having first and second ends and defining a chamber through the arm from the first end to the second end; (b) a laser delivery source connected to a focusing lens mounted in a housing within an opening on the first end of the arm for delivering a laser beam through the chamber; (c) a delivery head mounted on the second end of the arm comprised of (i) an enclosure having an inlet for receiving the laser and an outlet for delivering the laser to the curved surface, (ii) a powder nozzle for delivering a cladding powder to an inner surface of the curved surface, and (iii) a reflective surface for reflecting the laser to exit through the outlet; (d) mounting means for rotating the curved surface for the cladding of the curved surface; and (e) indexing means for moving the arm substantially parallel to a longitudinal axis of the curved surface so as to clad the curved surface during the rotation of

Abstract: An elevated containment structure in the shape of a wafer edge ring surrounding a surface of a semiconductor wafer is disclosed, as well as methods of forming and using such a structure. In one embodiment, a wafer edge ring is formed using a stereolithography (STL) process. In another embodiment, a wafer edge ring is formed with a spin coating apparatus provided with a wafer edge exposure (WEE) system. In further embodiments, a wafer edge ring is used to contain a liquid over a wafer active surface during a processing operation. In one embodiment, the wafer edge ring contains a liquid having a higher refractive index than air while exposing a photoresist on the wafer by immersion lithography. In another embodiment, the wafer edge ring contains a curable liquid material while forming a chip scale package (CSP) sealing layer on the wafer.