Abstract: An automated dispensing system and method for dispensing a viscous liquid material along an imperfect dispensing path. In a first scan, a scanning apparatus determines a dispensing path. A dispensing apparatus dispenses the viscous liquid material along the dispensing path. In a second scan, the scanning apparatus measures a dimension of the dispensed material. Object not meeting an acceptable liquid height are rejected.

Abstract: A method for dispensing a flowable substance, such as a flowable photoresist, on a microelectronic substrate. The method can include dispensing a portion of the flowable substance on the microelectronic substrate, receiving an image of at least some of the flowable substance on the microelectronic substrate, and, (with reference to the image), comparing a characteristic of the image with a pre-selected characteristic, or comparing a time required to dispense the portion of the flowable substance with a pre-selected, or both. The method can further include adjusting a characteristic of the dispense process when the image differs from the pre-selected image by at least a predetermined amount, or when the time differs from the pre-selected time by at least a predetermined amount, or both.

Abstract: A coating film forming apparatus for forming a film by applying a coating solution to a substrate, which is provided with a cassette section, coating unit, developing unit, pre-treatment/post-treatment units and a main arm for transferring the substrate between the respective units. In the coating unit, provided is a coating section in which a resist is applied on the substrate in a manner of single stroke by intermittently moving the substrate in a Y-direction and by moving a nozzle in an X-direction, and provided is a reduced-pressure drying section for drying under reduced pressure the substrate after being applied, and further provided is equipment for removing the coating film adhered to a periphery of the substrate. Additionally, when the reduced-pressure drying section is arranged outside the coating unit, the main arm is covered with a cover so that the inside thereof is under a solvent atmosphere.

Abstract: A method and apparatus for the non-contact in-situ temperature measurement of a material layer during chemical vapor deposition of the material on an underlying substrate are provided. Magnitude modulated UV light having a plurality of separated spectral components is directed at the material being deposited on the substrate. The modulated UV light has a plurality of wavelengths corresponding to different temperature dependencies of absorptance in the deposited material. The separated spectral components are within transparency spectral windows of a plasma media contained in the CVD reactor. A portion of the magnitude modulated UV light is directed as a reference into a comparison device, such as a spectrophotometer. Light reflected from the deposited material is also directed at the comparison device for comparison with the reference light. That is, the magnitudes of the magnitude modulated components of the reflected light and the reference light are compared at more than one spectral component.

Abstract: The present invention relates to illuminating an interior portion of a processing chamber in a semiconductor processing system. A light emitting diode is located in the chamber to illuminate the interior of the chamber to facilitate viewing the interior of the chamber.

Abstract: A plasma processing system and method for operating a windowless optical diagnostic system in conjunction with a plasma processing system. The plasma processing system comprises a windowless optical diagnostic system that is constructed and arranged to detect a plasma process condition. The method includes providing a first pressure within a chamber of the plasma processing system and providing a second pressure within a windowless optical diagnostic chamber in which the windowless optical diagnostic system is positioned. The method further includes controlling the second pressure within the windowless optical diagnostic chamber relative to the first pressure within the chamber and optically detecting a plasma process condition.

Abstract: A plasma processing apparatus for processing an object arranged within a chamber by utilizing the plasma caused within the chamber, the apparatus including: a sensor having plural lines of a plurality of elements for detecting a plurality of strip-like beams; an application unit for applying the plurality of strip-like beams generated from the light within the chamber in such a way that each of the illumination faces of the strip-like beams makes an angle with respect to each of the lines of the elements; and a control unit for adjusting the operation of the apparatus using outputs from the sensor.

Abstract: A plasma etching apparatus for a semiconductor wafer generates plasma in a plasma generation space between a susceptor and a showerhead. A shield member is detachably disposed inside the sidewall of a process chamber to prevent reaction products from sticking to the sidewall. A window device is arranged to lead plasma light emitted from plasma out of the process chamber. The window device includes a quartz window plate airtightly attached to the sidewall of the process chamber. The window device also includes an aluminum light guide having a number of capillary through holes for guiding the plasma light to the window plate, and a sapphire cover plate disposed between the window plate and the light guide and covering the openings of the through holes. The light guide and the cover plate are attached to the shield member.

Abstract: A process controller and method employing a machine vision system for automatically and continuously monitoring and controlling the processing of coated fasteners, and for separating the fasteners into three groups of “good”, “rejected” and “purge”/recyclable parts.

Abstract: When a resist film is formed by discharging a resist solution onto the front face of a wafer housed in a cup, a relation between the film thickness of a resist film and the line width of a circuit pattern when the resist film is exposed into a predetermined pattern and thereafter developed is obtained in advance, from that relation, a line width with less variations corresponding to the changes in film thickness of the resist film is selected from among line widths within a designated region to form a resist film to have the film thickness corresponding to the selected line width. Accordingly, the line width of the circuit pattern after development is not likely to vary regardless of the changes in film thickness of the resist film formed on the wafer.

Abstract: The present invention relates to a method and to apparatus for depositing thin layers. The technical field of the invention is that of manufacturing thin layer optical devices. In the invention, apparatus for depositing thin layers on a plurality of substrates comprises means for producing a light beam for monitoring the optical thicknesses of the substrates.

Abstract: A liquid crystal dispensing apparatus and a method of controlling a liquid crystal dropping amount are provided to drop liquid crystal onto a substrate corresponding to at least one unit panel area. In one aspect, the apparatus uses a liquid crystal dispensing unit to dispense liquid crystal. The liquid crystal dispensing unit includes a nozzle having a discharging hole through which the liquid crystal is dropped onto the substrate, a needle moveable between a down position in which the needle blocks the discharging hole and an up position in which the needle is separated from the discharging hole, a spring member to bias the needle toward the down position, and a solenoid coil to provide a magnetic force to move the needle to the up position. The dropping amount liquid crystal dispensing unit may be electrically controlled by controlling the solenoid coil or by controlling a gas pressure used to drive the liquid crystal through the discharging hole.

Abstract: The apparatus for processing an in-process substrate by generating a plasma have a processing chamber with an observation window, in which the in-process substrate is disposed; plasma generating means for generating a plasma in the inside of the processing chamber; irradiation means for projecting a light beam into the inside of the processing chamber through the observation window; detection means for detecting the light projected and reflected from the inside wall of the chamber by the irradiation means; and data processing means for obtaining information on the state of contamination of the inside wall of the processing chamber by processing signals obtained through detection of the reflected light by the detection means, and thereby permitting simultaneously monitoring of both the state of contamination of an inside wall of the processing chamber and foreign materials suspended in the processing chamber, with a single observation window and an optical system composed of one unit,

Abstract: A thin film of synthesized diamond is formed on an amorphous substrate such as of glass. The device has a hermetically sealable chamber 1, solid carbon 4 disposed in the chamber 1, an electricity applying device 5 for applying electricity to the solid carbon 4 for heating the same, a substrate 8 disposed in the chamber 1, and a device 10 for feeding hydrogen into the chamber 1 to produce a predetermined pressure therein. With a low pressure of hydrogen atmosphere established in the chamber 1, application of electricity to the solid carbon 4 to increase its temperature to 2000-2300° C. results in formation of a thin film of diamond on the substrate 8.

Abstract: A remote control device that provides a wireless connection between the operator and a control console of a material coating spraying system, thereby allowing the operator to select, change, modify and otherwise control a variety of parameters and functions of the spraying operation. The remote capability permits an operator to be stationed at, in or near the spray booth so as to be able to observe the actual spraying operation and transmit instructions to the control console. In one embodiment, a powder spray system includes a spray gun having a pressurized air inlet and a powder inlet, a powder spray booth, a powder supply for feeding powder to the gun, a control console separately located with respect to the booth; the console being operable to control a spraying operation; and a hand-held remote control device for wireless operation of the control console by an operator positioned a distance from the console.

Abstract: A manufacturing apparatus of a semiconductor device includes: a chamber having a sidewall; a window viewer of transparent material passing through the sidewall of the chamber; a window frame fixing the window viewer in the sidewall, the window frame having at least one opening; an image pickup device in the at least one opening, the image pickup device making image data showing a state of the chamber; and a logical operator connected to the image pickup device, the logical operator deciding whether the state of the chamber is normal or not by analyzing the image data.

Abstract: An apparatus for evaluating a performance of a plasma-polymerized polymer layer using a UV spectrometer, including polymerizing chamber for forming a polymerized polymer layer on a surface of a substrate by plasma discharging, a UV probe mounted contactless to the polymerized polymer layer formed in the polymerizing chamber and transmitting/receiving UV to and from the polymer layer and a UV spectrometer analyzing a signal inputted from the UV probe. With this apparatus, the characteristic of the surface of the substrate having a polymer layer consecutively polymerized by plasma can be evaluated in a contactless way, and the evaluation can be performed without affecting the process parameters such as the degree of vacuum within the chamber.

Abstract: A coating apparatus and a coating method are provided capable of adjusting the coating conditions into optimum and producing stabilized coating film continuously. The coating apparatus comprises a backing roll 2; a coating color delivery slit 4; a gas chamber 10, disposed upstream to the coating color delivery slit 4, containing therein a gas injection nozzle 9 and a pressure sensor 7; a gas recovery chamber 14 disposed upstream to the gas chamber; a nozzle group 20 disposed upstream to the gas recovery chamber 14; and a pressure control device for controlling the pressure inside of the gas chamber within a predetermined pressure range based on the detection results of the pressure sensor.

Abstract: A nozzle provided with a plurality of discharge apertures in line for discharging a resist solution as a coating solution toward a top surface of a substrate G held by a holding plate is provided at a lower portion of a main body of a coating head. The resist solution is simultaneously discharged from the plurality of discharge apertures while the nozzle is scan-moved in a direction orthogonal to an arranging direction of the discharge apertures. With the above configuration, the disadvantage of the coating solution dropping or the like is eliminated, the waste of the coating solution is avoided, and in addition, the time taken to perform coating processing is reduced.

Abstract: System and method for coating a medical appliance is provided. In accord with one embodiment, a system for applying a coating to a medical appliance having accessible patterned surfaces is provided. The system may include: a processor, an appliance support, and a solenoid type fluid dispensing head having an electromagnetically controlled valve. In the system, the appliance support may be adapted to hold the medical appliance and to provide direct access for a coating to contact the exposed external patterned surfaces of the medical appliance. The solenoid type fluid dispensing head in this system may move with respect to the medical appliance and may be in communication with a source of coating and with the processor. The processor in this system may contain commands that instruct the solenoid type fluid dispensing head to force coating onto the accessible patterned surfaces of the medical appliance in a pattern that correlates with the accessible patterned surfaces of the medical appliance.

Abstract: A method and system for using transmission spectroscopy to measure a temperature of a substrate (135). By passing light through a substrate, the temperature of the substrate can be determined using the band-edge characteristics of the wafer. This in-situ method and system can be used as a feedback control in combination with a variable temperature substrate holder (182) to more accurately control the processing conditions of the substrate. By utilizing a multiplicity of measurement sites the variation of the temperature across the substrate (135) can also be measured.

Abstract: A lid assembly for a semiconductor processing apparatus having at least two chambers comprises a lid plate having a first side and a second side and a plasma generation source mounted to the first side of the lid plate. Additionally, at least two gas boxes are coupled to the first side of the lid of the lid plate, and a divider is coupled between the plasma generation source and the at least two gas boxes.

Abstract: A spreading state of an outline of the outer periphery of a coating solution is detected by a detecting sensor, and the rotation speed or the like of a wafer as a substrate is controlled so that a spreading speed of the outline becomes not more than a predetermined speed with no danger of producing a scratchpad. Alternatively, the width in the radius direction of a scratchpad is measured, and the rotation speed or the like of the wafer is controlled so that the width in the radius direction becomes not more than a predetermined value. Thereby, occurrence of the scratchpad is prevented or the degree thereof is decreased, thereby avoiding uncoating of the coating solution on the substrate and reducing the amount of the coating solution used.

Abstract: An apparatus for performing in-situ curvature measurement of a substrate during a deposition process is provided which includes a clamp for retaining the substrate near one end while leaving the opposite end free. A plurality of displacement sensors are arranged in a spaced apart fashion along the length of the substrate and are directed to a surface of the substrate opposite a surface to be coated. Each sensor provides a signal to a computer corresponding to a position of the substrate relative to the sensor. The computer receives and stores data from the displacement sensors to determine a stress evolution during a deposition process and to determine a coating modulus based upon a resultant curvature of the substrate.

Abstract: Method and apparatus for coating the surface of an object, especially the surface of a car bumper (1) with a plastic film (2). During and/or after application of the plastic film to the surface, the coating is irradiated with infra-red radiation in order to heat at least parts of the coating and/or optionally residual moisture between the surface and the plastic film (2). This enables slight inequalities of the plastic film to be compensated, the adhesive coating is distributed in a homogeneous manner and the optionally residual moisture is collected in the form of bubbles following infrared radiation. Defects or irregularities in the coating can thus be identified during or shortly afterwards.

Abstract: The present invention relates to a method of and a device for optimizing at least one coating material at at least one point of a substrate surface to which the coating material is applied. The method, which is carried out with the corresponding device, comprises at least the following steps: a) applying said at least one coating material to said at least one point of the substrate surface, b) curing said at least one coating material at said at least one point of the substrate surface, and c) determining the state, especially the curing and/or yellowing and/or gloss, of said coating material at said at least one point of the substrate surface, possessed by said coating material as a consequence of steps a) and b).

Abstract: In this invention, the condition of a polysilicon film is evaluated, and a manufacture margin for the film is determined from the condition evaluated. The power of an excimer laser annealing apparatus is set based on the manufacture margin. The annealing apparatus anneals an amorphous silicon film, converting the same to a polysilicon film. The surface spatial structure of the polysilicon film thus formed exhibits linearity or periodicity, or both, depending on the energy applied to the amorphous silicon film during the annealing. The image data of the polysilicon film is processed, thereby determining the linearity and/or periodicity in numerical values, by utilizing the auto-correlation function of the surface image of the polysilicon film. A difference between the auto-correlation function of the surface image of parts of the polysilicon film, which are a source region and a drain region, and the auto-correlation function of the part of the polysilicon film, which lies above a gate electrode, is obtained.

Abstract: A coating defect detecting and marking system is provided for automatic detection and marking of a coating defect on the body surface of a car. The system detects a spot to mend such as a flaw or coating defect on the outer surface of a coated car body and marks the position of the spot to mend. There are provided along a production line along which the car body is conveyed an imaging block to detect a spot to mend such as a flaw or coating defect on the outer surface of the coated car body, and a piezo pump to provide a jet of marking solution to a corresponding position on the car body surface to the spot to mend detected by the imaging block.

Abstract: A process chamber 35 for processing a substrate 30 and monitoring the process conducted on the substrate 30, comprises a support 45, a gas distributor, and an exhaust 85. The process chamber 35 has a wall comprising a window 130 that allows light to be transmitted therethrough and reduces deposition of process residue from the process gas onto the window 130 during processing of the substrate 30. In one version, the window 130 comprises a transparent plate 135 covered by an overlying mask 140 that has at least one aperture 145 extending through the mask 140 so that light can be transmitted through the aperture 145 and the transparent plate 135.

Abstract: A system is disclosed for detecting or inspecting for a lining of a container closure that is formed of a sheet metal and has a panel on an inside surface of the closure. The panel of the closure has a lining formed thereon. The system according to the present invention includes a conveyor for moving plural closures longitudinally and substantially through the system, a color sensor that inspects the panel of each one of the closures on the conveyor for a predetermined color, and a separator that is capable of removing closures that lack the predetermined color. The system may include an oven downstream from the sensor to bake the lining. Thus, the system automatically identifies and removes the closure having the deficient color from the conveyor. A corresponding method for identifying and removing a closure having a deficient color is also disclosed.

Abstract: A microwave plasma processing apparatus has a process chamber in which an object to be processed is subjected to plasma processing under a predetermined negative pressure environment. A susceptor holding the object thereon is provided in the process chamber. The susceptor is moved by a susceptor moving member which is moved by a susceptor moving mechanism located outside the process chamber. The susceptor moving member extends from the process chamber via a bellows provided to a bottom of the process chamber. The bellows allows a vertical movement of the susceptor moving member while providing a hermetic seal to the process chamber to maintain the predetermined negative pressure environment in the process chamber. A vacuum pump is provided to the bottom of the process chamber so that an inlet opening of the vacuum pump aligns with the susceptor in the vertical direction.

Abstract: A view port of chemical vapor deposition apparatus for manufacturing semiconductor devices prevents heat loss in a chamber during a plasma deposition process. The view port includes a bracket protruding at the circumference of an opening in an electrode serving as a wall of a chamber of the apparatus, a transparent window pressed by the bracket against the wall via an O-ring, a pivoting cap for capping an opening in the bracket aligned with the window, and heat-insulative material and/or a heating element integral with the cap so as to be positioned close to the window when the cap is closed. The heating element can be a resistive heating wire or a warm air duct formed by a hose or the like. During the deposition process, the temperature of the window is maintained, thereby minimizing the tendency of polymer to adhere to the window.

Abstract: A spreading state of an outline of the outer periphery of a coating solution is detected by a detecting sensor, and the rotation speed or the like of a wafer as a substrate is controlled so that a spreading speed of the outline becomes not more than a predetermined speed with no danger of producing a scratchpad. Alternatively, the width in the radius direction of a scratchpad is measured, and the rotation speed or the like of the wafer is controlled so that the width in the radius direction becomes not more than a predetermined value. Thereby, occurrence of the scratchpad is prevented or the degree thereof is decreased, thereby avoiding uncoating of the coating solution on the substrate and reducing the amount of the coating solution used.

Abstract: The present invention teaches an apparatus and method for preventing the accretion of opaque material on an optical port of a reaction chamber by using a dual-window optical port to maintain a heated gas flow in contact with the windows of the dual-window optical port. The dual-window optical port can be an end point window, a viewing port, or any optical port for which accretion of an opaque material is unwanted. The opaque material can include reaction byproducts such as polymer or any other chemical species present in the chamber. The gas flow preferably includes an inert gas such as compressed dry air. The apparatus preferably includes a housing for maintaining a spaced pair of windows in optical alignment. Ideally, one of the windows is an existing optical port built into the chamber, and the housing is mounted on the chamber over the built-in optical port to form an enclosure or cavity about the optical port.

Abstract: A system and method for setting up an applicator to treat a target blank traveling on a conveyor includes placing a mark on an example blank, where the mark represents a desired location for treatment of the target blank. The marked example blank is passed along the conveyor, and the location of the mark is sensed on the example blank. The applicator is programmed to treat the target blank at the sensed location. Further, a method and system for regulating an applicator for treating a desired location of a target blank traveling along a conveyor include passing the target blank along the conveyor and sensing an applied location of the treatment to the target blank. The applied location is compared with the desired location and responsive to the comparing, the applicator is adjusted to apply the treatment closer to the desired location.

Abstract: A machine for applying adhesive to preset regions of products in general, particularly soles for shoes, comprising a conveyor for continuously moving individual products to be glued, a three-dimensional vision unit for acquiring a spatial shape of each individual product in transit, a first gluing head, which is driven by the vision unit to apply adhesive to a first portion of the product in transit, and at least one second gluing head, which is driven by the vision unit to apply the adhesive to a second portion of the product in transit which is different from the first portion.

Abstract: A system and method is provided that facilitates the application of a uniform layer of developer material on a photoresist material layer. The system includes a nozzle adapted to apply a predetermined volume of developer material on a photoresist material layer along a linear path having a length approximately equal to the diameter of the photoresist material layer. A movement system moves the nozzle to a first position offset from a central region of the photoresist material layer for applying a first predetermined volume of developer material to the photoresist material layer while the developer material is spin coated. The movement system also moves the nozzle to a second position offset from the central region for applying a second predetermined volume of developer material to the photoresist material layer while the developer is spin coated. The first position is located on an opposite side of the central region with respect to the second position.

Abstract: An apparatus for direct or indirect application of liquid or pasty coating medium onto a traveling material web, notably of paper or cardboard, includes a paint curtain applicator mechanism and at least one sensor unit to register the flow quantity of the coating medium layer applied onto the material web and to provide a corresponding flow quantity signal. At least one regulation device regulates at least one manipulated variable of the paint curtain applicator mechanism upon which the flow quantity of the coating medium layer applied onto the material web depends. A control unit, which receives the flow quantity signal provided by the at least one sensor device, determines at least one face value for the at least one manipulated variable and controls the at least one regulation device on the basis of the at least one manipulated variable-face value.

Abstract: A vertical heat treatment apparatus for forming oxide films on a plurality of semiconductor wafers. The apparatus comprises: a reaction tube which inclines from the vertical direction toward the horizontal direction by a predetermined angle; and a wafer supporting means which supports a plurality of semiconductor wafers inside the reaction tube such that the wafers are disposed parallel to each other while keeping a gap between adjacent upper and lower wafers and having an offset portion between adjacent upper and lower wafers. The plurality of semiconductor wafers disposed inside said reaction tube are heated and a predetermined gas is introduced into the reaction tube, thereby oxide films are formed on the plurality of semiconductor wafers.

Abstract: An end point window assembly in an etching apparatus includes an end point bracket having an inducing tube connected to an optic cable. The end point bracket is connected to a process chamber of the etching apparatus and a main window is provided to cut off a gap between the optic cable and the process chamber. The end point window assembly further includes at least a spare window insertion groove between the main window and the process chamber about the inner circumference of the inducing tube. A spare window guiding groove corresponding in location to the spare window insertion groove is connected to and tunnelled through an inside of a body of the end point bracket, a spare window is displacably movable between the spare window insertion groove and the window guiding groove wherein the spare quartz window selectively closes the inducing tube, and a moving mechanism for transferring the spare window along the spare window guiding groove in accordance with an extent of contamination of the spare window.

Abstract: An external electrode forming apparatus is used to form external electrodes on the component chips. The external electrode forming apparatus comprises a component conveyer belt, a belt feeding mechanism, a component-inserting machine, a component-reversing machine, a paste-coating machine, and a component-discharging machine. For the component-inserting machine, the component-reversing machine, and the component-discharging machine, pressure pins are used to insert or move the component chips. These pressure pins have at the tip part a taper portion with a tip shape smaller than that of the component holding hole. Since the pressure pins of this type are used, the tip portions of these pressure pins may be prevented from impinging upon the opening edges of the component holding holes, and the pressure pins after the impingement may be hindered from forcibly being inserted into the component holding holes, whereby damage to the interiors of the component holding holes can be extremely diminished.

Abstract: System and method for determining thermal characteristics, such as temperature, temperature uniformity and emissivity, during thermal processing using shielded pyrometry. The surface of a semiconductor substrate is shielded to prevent interference from extrinsic light from radiant heating sources and to form an effective black-body cavity. An optical sensor is positioned to sense emitted light in the cavity for pyrometry. The effective emissivity of the cavity approaches unity independent of the semiconductor substrate material which simplifies temperature calculation. The shield may be used to prevent undesired backside deposition. Multiple sensors may be used to detect temperature differences across the substrate and in response heaters may be adjusted to enhance temperature uniformity.

Abstract: A plasma processing system including a signal sampling unit for measuring electric signals reflecting a plasma condition; a model expression memory for storing a model expression for relating values of the electric signals with plasma processing characteristics; a computing unit for substituting the values of the electric signals measured by the signal sampling unit into the model expression read from the model expression memory to computer predicted values of the plasma processing characteristics; and a diagnosing unit for diagnosing a condition of a plasma, based on the predicted values of the plasma processing characteristics. The plasma processing system of this structure permits a condition of a plasma to be estimated by substituting realtime measured electric signals into a model expression, whereby when a change of plasma processing characteristics occurs, the operator can immediately know it. Accordingly, occurrence of a large number of defective wafers can be precluded.

Abstract: In a method of direct or indirect application of a liquid or viscous coating medium onto a moving material web, specifically a paper or cardboard web, a layer of the coating medium is applied to the material web by use of an applicator unit. The coating result is then checked for deviations from the desired coating result. In the event that such deviations are detected, and in order to correct them, at least one applicator unit operating parameter is adjusted. The adjustment is made within a short time period, and with the material web running, from an initial operating parameter value that is in effect prior to detection of the deviation. Subsequently, the operating parameter is then reset to at least approximately the initial parameter value, whereby the adjustment and the subsequent resetting may be repeated if necessary.

Abstract: Application of wax to fruit in a conveyor system is controlled to optimize the protective and cosmetic effects of the wax application and to efficiently utilize the wax notwithstanding variations in size, texture, nature or number of the fruit, the type(s) of wax or the processing environment by providing an intelligent wax controller. The wax controller has a camera which detects fruit passing through a field of view defined by an optical housing in which the camera is fixed. Two-dimensional pixel maps of the fruit passing through the viewing area are assembled and an image is processed to provide distinct pixel images even when the fruit are touching. The diameter of the fruit for each of the separated images is then determined from which the total surface area of the fruit passing under the viewing area is computed.

Abstract: A method for detecting an etching endpoint and a plasma etching apparatus and a plasma etching system using such a device are disclosed, in which time series data of a signal corresponding to the amount of light of the plasma light generated during the plasma etching process are arithmetically processed, so that the change of light amount is corrected and an etching endpoint is detected from the time series data after the correction.

Abstract: A system for evaluating the reflectance of an object (e.g., a CRT) that is coated with an anti-reflective coating material is disclosed. The quality and/or uniformity of the coating is evaluated by a reflectometer. The reflectometer is positioned relative to the object by non-contact sensors. Reflectance data gathered by the reflectometer is analyzed to determine to what extent the actual coating differs from the optimal (i.e., ideal) coating. A feedback system modifies the coating process for subsequent objects in an attempt to fine-tune the coating process and achieve optimal anti-reflective coatings.

Abstract: A new method of controlling the level of cleaning of the etch chamber by measuring the light emission caused by particles within the plasma of the etch chamber. The etch chamber clean process is invoked as soon as the level of contaminants within the etch chamber is observed as being too high. This measuring of the contaminants within the etch chamber is performed by measuring the particle light emission. The etch chamber cleaning process is considered complete when the light intensity created by existing particles in the chamber drops by a certain percentage.

Abstract: A CVD device for coating the inside of a hollow body, comprising a coating chamber, a microwave plasma-igniting device, a gas-supply device and an optical detective device, wherein the plasma-igniting device and optical detective device are connected to a control and analysis unit, analyzing the time correlation of ignition pulses and light pulses, and the intensity of at least one emission line of the plasma.

Abstract: A solder wave height measuring device is provided that may be constructed using a horizontal supporting member that is positioned on a set of conveyors. Perpendicularly attached to the horizontal supporting member is a graduated beam that slidably supports a measuring jacket. The jacket may have a cubic shape, drum shape, or any polyhedron shape, but the jacket will preferably have an upper surface that is perpendicular to the graduated beam to simplify taking visual readings. A surface of the measuring jacket is in contact with the top end of the solder wave to allow the measuring jacket to accurately indicate the height of the solder wave on the graduated beam. Additionally, a fastener can be used to fix the measuring jacket to the graduated beam. The measuring jacket is fixed to the graduated beam by a fastener when the measuring jacket indicates an optimum height to solder at maximum efficiency. This provides an easy and convenient measurement of the solder wave height.