Abstract: Light emitting device, method of manufacturing the light emitting device, and display device including the light emitting device are disclosed. The light emitting device includes a first electrode and a second electrode each having a surface opposite the other, a light emitting layer including quantum dots that is disposed between the first electrode and the second electrode, and an electron auxiliary layer disposed between the light emitting layer and the second electrode, wherein the electron auxiliary layer includes metal oxide nanoparticles including an anion of an organic acid bound to a surface of the metal oxide nanoparticle.

Abstract: To provide a transfer chamber capable of replacing a chemical filter without affecting an internal atmosphere, and shortening or eliminating stop time of a transfer process of a wafer (W) associated with replacement of the chemical filter. The transfer chamber transfers the wafer (W) to or from a processing device (6) by using a transfer robot (2) provided thereinside, and includes a circulation path (CL1) formed inside of a transfer chamber (1) to circulate gas, a chemical filter unit (7) provided in the midstream of the circulation path (CL1), and a connecting and disconnecting means (8) which switches connection and disconnection of the chemical filter unit (7) to and from the circulation path (CL1).

Abstract: The present disclosure relates to a slot die coating apparatus for coating an electrode active material slurry onto an electrode collector, the slot die coating apparatus including a coating roller, a die comprising a lower discharge opening, through which a first electrode active material slurry is discharged, and an upper die located on the upper side of the lower die and having an upper discharge opening, through which a second electrode active material slurry is discharged, and an upper air vent may be installed in the upper die and a lower air vent may be installed in the lower die.

Abstract: The disclosure concerns a coating method and a corresponding coating device for coating components with a nozzle applicator with several nozzles, in particular for painting motor vehicle body components. The disclosure provides that the nozzle applicator is flexibly controlled during the coating method.

Abstract: A substrate processing device includes: a chamber; a substrate processing mechanism that has a holding member, and discharges a processing fluid onto a substrate held by the holding member; a joint pipe that has a lower opening provided below the holding member, and an upper opening provided above the holding member, and is disposed such that at least part of the joint pipe from the lower opening to the upper opening passes through the outside of the chamber; and an air flow generator that is provided in the joint pipe. The air flow generator circulates an atmosphere in the chamber by discharging the atmosphere in the chamber from the lower opening to the joint pipe to allow the atmosphere to pass through the joint pipe, thereby introducing the atmosphere again into the chamber via the upper opening so that a downflow of the atmosphere occurs in the chamber.

Abstract: A method and apparatus for forming extruded shapes having at least a hollow portion using a hydrodynamic nozzle, a curable fluid, and a core fluid.

Abstract: A substrate processing method includes: carrying out a substrate from a substrate transfer container by a substrate transfer device; placing the substrate in a first position of a substrate holder; moving the substrate holder into a reaction container and processing the substrate in the reaction chamber; obtaining a film thickness measurement result of the substrate processed in the reaction container; creating a model from the film thickness measurement result; determining a second position where the substrate is placed in the substrate holder and a transfer position setting value obtained from the model; adjusting the first position of the substrate to the second position; calculating an eccentricity state of the substrate from a newly obtained film thickness measurement result; calculating an optimization such that the eccentricity state is minimized; and determining a third position to which a new substrate is placed from the transfer position setting value.

Abstract: A three-dimensional (3D) printing system for manufacturing a three-dimensional article includes a resin vessel for containing a volume of photocurable resin having a resin upper surface, an imaging system configured to define a build plane, a build plate having a build plate upper surface, a build plate positioner, a sensor configured to generate a signal indicative of a fluid-related vertical position of one or more of the resin upper surface and a component of a volume compensator (VC), and a controller. The controller is configured to (1) operate the build plate positioner to vertically translate build plate upper surface, (2) concurrent with operating the build plate positioner, receiving the signal from the sensor, (3) analyze the signal to determine a build plate geometric signature, and (4) determine or suspend a build plan for building the 3D article based upon the determined geometric signature.

Abstract: A dispensing device includes a dispensing mechanism and a calibration mechanism coupled to the dispensing mechanism. The calibration mechanism includes a control unit. The control unit is configured to detect a position difference between a dispensing needle and a reference coordinate in a direction. The dispensing mechanism is configured to adjust the dispensing needle in the direction according to the position difference.

Abstract: A method of fabricating a display device, the method comprising: preparing a mother substrate having a first cell region and a second cell region, and a first target region and a second target region in the first cell region and the second cell region, respectively; providing an encapsulation material on a first printing region in the first target region to form a first encapsulation layer; and providing the encapsulation material on a second printing region in the second target region to form a second encapsulation layer, wherein a center of the second printing region is shifted from a center of the second target region in a specific direction.

Abstract: In a method for the lithography-based generative production of a three-dimensional component, in which electromagnetic radiation emitted by an irradiation device is successively focused on focal points within a material, wherein in each case a volume element of the material located at the focal point is solidified by means of multiphoton absorption, wherein a substructure is each built up from the volume elements in a writing area of the irradiation device, the build-up of the component comprises the following steps: a) a plurality of substructures are arranged next to one another, then b) substructures are arranged one above the other so that upper substructures bridge the interface(s) between lower substructures arranged next to one another.

Abstract: A deposition device is described. The deposition device has a substrate support and an imaging system disposed to image a portion of a substrate positioned on the substrate support. The imaging system comprises an LED light source and an imaging unit, and is coupled to a deposition assembly disposed across the substrate support.

Abstract: The present invention provides a three-dimensional bioprinter for fabricating cellular constructs such as tissues and organs using electromagnetic radiation (EMR) at or above 405 nm. The bioprinter includes a material deposition device comprising a cartridge for receiving and holding a composition which contains biomaterial that cures after exposure to EMR. The bioprinter also includes an EMR module that emits EMR at a wavelength of about 405 nm or higher. Also provided is a bioprinter cartridge which contains cells and a material curable at a wavelength of about 405 nm or greater. The cells are present in a chamber and are extruded through an orifice to form the cellular construct.

Abstract: A physical vapor deposition system includes a chamber, three target supports to targets, a movable shield positioned having an opening therethrough, a workpiece support to hold a workpiece in the chamber, a gas supply to deliver nitrogen gas and an inert gas to the chamber, a power source, and a controller. The controller is configured to move the shield to position the opening adjacent each target in turn, and at each target cause the power source to apply power sufficient to ignite a plasma in the chamber to cause deposition of a buffer layer, a device layer of a first material that is a metal nitride suitable for use as a superconductor at temperatures above 8° K on the buffer layer, and a capping layer, respectively.

Abstract: Provided are an apparatus for processing a substrate and a method for measuring a temperature of the substrate. The apparatus for processing the substrate includes a temperature measurement part and a light-transmitting shield plate. The temperature measurement part includes a light source, a light receiving part configured to receive reflected light reflected by the substrate or the shield plate among the light irradiated from the light source, and a radiant light emitted from the substrate to measure a quantity of the reflected light and an intensity of the radiant light and a temperature calculation part configured to calculate the temperature of the substrate, to which a contamination level of the shield plate is reflected, by using the quantity of the reflected light and the intensity of the radiant light.

Abstract: A solenoid valve having a solenoid body with a solenoid receiving cavity and a flow receiving passage. A solenoid assembly is provided in the solenoid receiving cavity. A valve is provided in the flow receiving passage. An armature extends from the solenoid to the valve. The solenoid valve also includes a control circuitry, a power connection and a bidirectional communications connection. At least one sensor is provided in the flow receiving passage. The at least one sensor is in communication with the control circuitry. When in operation, power is continuously supplied through the power connection and the actuation of the solenoid valve is initiated by the bidirectional communications connection.

Abstract: Disclosed is a method for providing a control command set for an additive manufacturing device. The method includes providing a parameter set consisting of a number of parameters, and a construction rule, which is suitable for describing at least one section of the object by the parameter set geometrically as a number of linear or flat elements in space; generating a computer-based layer model of the section of the object by determining, for each layer, the position and shape of a cross-section of the section of the object within the layer, generating a control command set for an additive manufacturing device by which the production of the section of the object is implemented on the basis of the layer model.

Abstract: A cooling controller receives, from one or more sensors, wafer information associated with a wafer. The cooling controller determines a pattern mask area for the wafer based on the wafer information. The cooling controller determines a cooling time for the wafer based on the pattern mask area. The cooling controller causes a cooling plate to cool the wafer for a time duration equal to the cooling time. Determining the cooling time for a wafer based on a pattern mask area provides stable and consistent wafer temperatures for wafers having different mask and layout properties, which reduces mask overlay variation and increases wafer yield.

Abstract: In some examples, a method for conditioning a wafer processing chamber comprises setting a pressure in the chamber to a predetermined pressure range, setting a temperature of the chamber to a predetermined temperature, and supplying a process gas mixture to a gas distribution device within the chamber. A plasma is struck within the chamber and a condition in the chamber is monitored. Based on a detection of the monitored condition meeting or transgressing a threshold value, a chamber conditioning operation is implemented. The chamber conditioning operation may include depositing a preconditioning film onto an internal surface of the chamber, depositing a silicon oxycarbide (SiCO) film onto the preconditioning film, and depositing a protective layer onto the SiCO film.

Abstract: A substrate processing apparatus includes a processing tub, a liquid recovery unit, a liquid recovery unit drain line, a storage, a first and a second liquid supply lines, a discharge line, a first and a second liquid flow rate controllers. The liquid recovery unit receives a processing liquid overflown from the processing tub. The liquid recovery unit drain line drains the processing liquid from the liquid recovery unit. The first and the second liquid supply lines supply a first and a second liquids, respectively. The cleaning liquid contains the first liquid and the second liquid, and removes a precipitate from the processing liquid. The discharge line discharges the cleaning liquid, the first liquid or the second liquid toward the liquid recovery unit. The first and the second liquid flow rate controllers are provided at the first and the second liquid supply lines, and adjust flow rates thereof, respectively.

Abstract: An imprint apparatus that forms a pattern of an imprint material on a substrate with use of a mold includes a mold holding unit configured to hold the mold, a suction unit provided at the mold holding unit and configured to suction a gas in a space in which the mold and the substrate face each other, a detector configured to detect particles included in the gas suctioned by the suction unit, and a control unit configured to perform error processing depending on a result of detection performed by the detector.

Abstract: A substrate processing method is provided. In the method, a process gas is supplied into a chamber. A pressure in the chamber is controlled to a first pressure by evacuating the chamber via a first exhaust line. Then, the pressure in the chamber is controlled to a second pressure that is higher than the first pressure by evacuating the chamber via a second exhaust line while closing the first exhaust line. Next, the pressure in the chamber is controlled to the first pressure by evacuating the chamber via the first exhaust line while closing the second exhaust line.

Abstract: A substrate processing method in substrate processing apparatus comprises repeating cycle including: supplying source gas into process container causing the source gas to be adsorbed to substrate; exhausting excess source gas from the process container; supplying reaction gas into the process container causing the reaction gas to react with the source gas; and exhausting excess reaction gas, wherein at least one of a gap width between placement stage and member forming processing space between the member and the stage and degree of opening of pressure adjustment valve in at least one of the supplying the source gas and the supplying the reaction gas is smaller than at least one of a gap width between the stage and the member and the degree of opening of the pressure adjustment valve in at least one of the exhausting the excess source gas and the exhausting the excess reaction gas, respectively.

Abstract: An article of footwear including an upper and a sole secured to the upper, where the sole includes an upper surface. A support member is positioned on the sole, and includes at least one portion positioned a designated distance above the upper surface of the sole to form a space between the support member and the sole, where the portion of the support member moves through the space and toward the upper surface of the sole when pressure is applied to the portion of the support member, and flexes away from the upper surface when pressure is decreased or released from the portion of the support member.

Abstract: A wafer manufacturing system includes a wafer manufacturing device provided with a sensor; a host PC that is connected to the wafer manufacturing device via a data communication line; a logic controller that samples and stores an analog output signal of the sensor; and a relay PC that extracts tracking information transmitted on the data communication line for a wafer or a single crystal that is being processed by the wafer manufacturing device and sends the tracking information to the logic controller, and the logic controller stores a digital value of the analog output signal of the sensor in association with the tracking information that is sent from the relay PC.

Abstract: Systems and method for producing graphene on a substrate are described. Certain types of exemplar systems include lateral arrangements of a substrate gas scavenging environment and an annealing environment. Certain other types of exemplar systems include lateral arrangements of a graphene producing environment and a cooling environment, which cools the graphene produced on the substrate. Yet other types of exemplar systems include lateral arrangements of a localized annealing environment, localized graphene producing environment and a localized cooling environment inside the same enclosure. Certain type of exemplar methods for producing graphene on a substrate include scavenging a first portion of the substrate and preferably, contemporaneously annealing a second portion of the substrate.

Abstract: Systems and method for producing graphene on a substrate are described. Certain types of exemplar systems include lateral arrangements of a substrate gas scavenging environment and an annealing environment. Certain other types of exemplar systems include lateral arrangements of a graphene producing environment and a cooling environment, which cools the graphene produced on the substrate. Yet other types of exemplar systems include lateral arrangements of a localized annealing environment, localized graphene producing environment and a localized cooling environment inside the same enclosure. Certain type of exemplar methods for producing graphene on a substrate include scavenging a first portion of the substrate and preferably, contemporaneously annealing a second portion of the substrate.

Abstract: A system and method for positioning a food product with respect to a print head for printing on a surface thereof. The system is incorporated into a printer. The system has a movable support surface for supporting the food product thereon, the support surface being vertically and horizontally moveable with respect to the print head. A sensor is provided for detecting a position of a surface of the food product positioned on the moveable support surface with respect to the print head. The sensor provides a signal to the printer indicative of a position of the surface of the food product and wherein the moveable support surface is adjustable in response thereto. The sensor is a position sensor configured to detect the position of a top surface of the food product.

Abstract: Particulate deposition rate on a photolithographic mask, particularly of tin (Sn) particles produced within an EUV light source, is reduced by producing turbulence within a radiation source chamber of the EUV light source. Turbulence can be produced by changing the temperature, pressure, and/or gas flow rate within the radiation source chamber. The turbulence reduces the number of particles exiting the EUV light source which could be deposited on the photomask.

Abstract: A system for forming surface modified substrates includes a laser system, and a laser processing chamber. A laser scanner automatically controls a position of the laser beam or an x-y translating stage upon which the laser processing chamber is mounted thereon for scanning the laser beam relative to a substrate of material (M) having a bulk portion and an outer surface integrated with the bulk portion, and a coating including metal organic molecules including at least one metal X or particles of metal X on the outer surface. At laser-heated spots atoms of X from the metal coating diffuse into the outer surface to form a modified surface layer including both M and X. The modified surface layer has a thickness of 1 nm, and a 25° C. electrical conductivity ?2.5% above or ?2.5% below a 25° C. electrical conductivity in the bulk portion.

Abstract: A method for controlling and optimizing a transverse uniformity of a coating thickness on at least one side of a running metal strip in an industrial galvanization installation, the coating being deposited by hot dip coating in a pot containing a liquid metal bath, includes at least the steps of: heating the strip substrate to a temperature higher than a pot temperature; passing the strip through the bath by wrapping the strip around at least a first deflector roll or sink roll followed by at least one second deflector roll, the second deflector roll improving a flatness of the strip; wiping excess coating thickness carried away by the strip on one or both sides of the strip by wiping nozzles blowing a gas on the strip at an exit of the liquid metal bath; and measuring an actual distance profile between the nozzles and the strip.

Abstract: A coating of a coating medium, produced by means of a multichannel printhead (5) in a coating region (3) on a two- or three-dimensional surface (2) of an object (1), which is built up from coating points (8) along tracks (7) of one or more coating paths (6), characterized in that the starting coating point (HP) of at least one track (7) is aligned with a starting contour (AK) and an end coating point (EP) of the track (7) is aligned with an end contour (EK).

Abstract: A single pass inkjet printer that utilizes a modular printing system with one or more self-contained printing modules, where each printing module is easy to remove and replace from a large printing machine, thus resulting in an overall system that is easy to service and maintain Each module is a self-contained printer including an ink supply, printhead drive electronics, and printhead assembly in order to provide one color or fluid of inkjet printing capability. Each module includes a precise three-point compliant self-aligning mount system to obtain accurate printhead positioning, and a unique integrated printhead tending system that includes a compact movable vacuum knife for cleaning the printheads, and a printhead capping station for sealing and protecting the printheads from the ambient environment when not in use.

Abstract: A substrate processing apparatus includes a substrate stage on which a substrate is disposed, a first radio-frequency power supply configured to supply first radio-frequency power having a first frequency to the substrate stage, an impedance converter configured to convert an impedance on a load side seen from the first radio-frequency power supply into a set impedance, a second radio-frequency power supply configured to supply second radio-frequency power having a second frequency lower than the first frequency to the substrate stage, and a controller configured to control the set impedance of the impedance converter, and the controller sets the set impedance according to a substrate processing.

Abstract: The invention is in particular directed to a method for manufacturing a three-dimensional object by successive deposition of uniform layers of a viscous material, the method comprising a prior calibrating operation comprising the following steps: positioning at least one calibration stop at a distance comprised between a first distance and a second distance from a working surface, the at least one calibration stop being configured to enable the triggering of a signal in case of contact between the at least one calibration stop and a proximity sensor linked to a recoater blade; moving the recoater blade (310) linked to the proximity sensor towards one of the at least one calibration stop; stopping the movement of the recoater blade as soon as a signal indicates a contact between the calibration stop and the proximity sensor; and estimating (320) the distance between the recoater blade and the working surface after stopping the movement, the at least one calibration value comprising the estimated distance.

Abstract: A re-circulatory blasting device obtained is capable of performing stable treatment for a prolonged period of time even in cases in which an elastic abrasive employed has abrasive grains adhered to the surface of elastic cores. An elastic abrasive regeneration device provided to the blasting device regenerates elastic abrasive employed for re-circulation. The elastic abrasive regeneration device includes a mixer and a combining unit. Recovered abrasive fed in from an abrasive recovery section is mixed in the mixer with abrasive grains fed in from an abrasive grain feeder, and the abrasive grains are adhered to the surface of the cores of the recovered abrasive. In the combining unit, the abrasive grains are pressed against and combined to the surface of the cores by passing an aggregated state of the recovered abrasive mixed by the mixer along a constricted flow path having a flow path cross-sectional area that gradually narrows.

Abstract: An apparatus and a method for performing liquid treatment for a substrate are provided. The apparatus for treating the substrate includes a treating container having a treatment space inside the treating container, a substrate support unit to support a substrate in the treatment space, and a liquid supply unit to supply treatment liquid to the substrate supported by the substrate support unit. The liquid supply unit includes a nozzle, a supply line to supply the treatment liquid to the nozzle and having a first valve mounted in the supply line, and a discharge line branching from a branch point which is a point downstream of the first valve in the supply line to discharge the treatment liquid from the supply line, and having a second valve mounted in the discharge line. A valve is absent in an area between the branch point and the nozzle, in the supply line.

Abstract: An outer packing material for vacuum insulation material including a thermally weldable film and a gas barrier film; wherein the gas barrier film includes a base material and a metal aluminum film formed on one surface of the base material; and the metal aluminum film satisfies the below formula (1) and formula (2): 1.0*10?3?(IA/IB)/T?3.5*10?3??(1) (A/B)/T?3.8*10?3??(2).

Abstract: An optical distance measuring device and a method for operating an optical distance measuring device are disclosed. In an embodiment an optical distance measuring device includes a pixelated radiation source with at least two pixels, a radiation detector configured to detect electromagnetic radiation emitted by the radiation source and reflected in measuring regions and a control unit configured to operate the radiation source and to receive electrical signals from the radiation detector, wherein the pixelated radiation source is configured to illuminate different measuring regions with electromagnetic radiation with pairwise different properties.

Abstract: A pipe doping apparatus comprises a bucket assembly including a base and a bucket supported on the base and having an inside volume, a lubricating unit having at least one lubricant applicator inside the bucket; and a source of torque configured to rotate the bucket and/or the lubricating unit relative to a tubular. The apparatus may include a cleaning unit and/or a drying unit and the source of torque may be a fluid jet in either. At least one lubricant applicator may be retractable and may be actuated between a retracted position and an extended position by centripetal force. The apparatus may further include a positioning assembly supporting the base and the rotary bucket assembly and a controller connected to and controlling each of:—the positioning assembly, the cleaning unit, the drying unit, and the lubricating unit.

Abstract: Provided are a photocuring-type three-dimensional printing device capable of automatic continuous printing, and a system. A three-dimensional model is automatically composed, the composed three-dimensional model is automatically printed and pick-up collected, and a material tank can also be automatically replenished when replenishment is needed, thereby implementing automatic continuous printing without manual intervention.

Abstract: Embodiments of systems and methods for monitoring one or more characteristics of a substrate are disclosed. Various embodiments of utilizing optical sensors (in one embodiment a camera) to provide data regarding characteristics of a fluid dispensed upon the substrate are described. A variety of hardware improvements and methods are provided to improve the collection and analysis of the sensor data. More specifically, a wide variety of hardware related techniques may be utilized, either in combination or singularly, to improve the collection of data using the optical sensor. These hardware techniques may include improvements to the light source, improvements to the optical sensors, the relationship of the physical orientation of the light source to the optical sensor, the selection of certain pixels of the image for analysis, and the relationship of the optical sensor frame rate with the rotational speed of the substrate.

Abstract: A system for reflowing a semiconductor workpiece including a stage, a first vacuum module and a second vacuum module, and an energy source is provided. The stage includes a base and a protrusion connected to the base, the stage is movable along a height direction of the stage relative to the semiconductor workpiece, the protrusion operably holds and heats the semiconductor workpiece, and the protrusion includes a first portion and a second portion surrounded by and spatially separated from the first portion. The first vacuum module and the second vacuum module respectively coupled to the first portion and the second portion of the protrusion, and the first vacuum module and the second vacuum module are operable to respectively apply a pressure to the first portion and the second portion. The energy source is disposed over the stage to heat the semiconductor workpiece held by the protrusion of the stage.

Abstract: An apparatus for producing semiconductor cells, the apparatus comprises a printing device for printing on a semiconductor cell, a monitoring device configured to monitor characteristics of the printed semiconductor cell, and a cleaning device configured for cleaning at least one part of the printing device based on the monitored characteristics of the semiconductor cells.

Abstract: A robot for transferring a wafer is disclosed. A blade of the robot includes a first sensor on an upper surface of the blade and the second sensor on a back surface of the blade. The first sensor is operable to align the blade with a wafer. The second sensor is operable to align the blade with a holder that holds the wafer.

Abstract: An ink jet process is used to deposit a material layer to a desired thickness. Layout data is converted to per-cell grayscale values, each representing ink volume to be locally delivered. The grayscale values are used to generate a halftone pattern to deliver variable ink volume (and thickness) to the substrate. The halftoning provides for a relatively continuous layer (e.g., without unintended gaps or holes) while providing for variable volume and, thus, contributes to variable ink/material buildup to achieve desired thickness. The ink is jetted as liquid or aerosol that suspends material used to form the material layer, for example, an organic material used to form an encapsulation layer for a flat panel device. The deposited layer is then cured or otherwise finished to complete the process.

Abstract: A gas supply system includes first and second gas supply lines, first and second valves, and a controller. The first gas supply line is connected between a process gas source and a substrate processing chamber and has an intermediate node. The second gas supply line is connected between a purge gas source and the intermediate node. The first valve is disposed upstream of the intermediate node on the first gas supply line. The second valve is disposed upstream of the first valve on the first gas supply line. A controller controls the first and second valves to open the first and second valves in a first mode for supplying a process gas from the process gas source to the substrate processing chamber, and close the first and second valves in a second mode for supplying a purge gas from the purge gas source to the substrate processing chamber.

Abstract: The present disclosure discloses a light-emitting device, a display apparatus and a manufacturing method.

Abstract: A method for forming an isolating layer of a crucible includes placing a round crucible sideways with a bottom surface of an inside thereof perpendicular to a horizontal plane, and then performing a plurality of spraying processes to form the isolating layer on the bottom surface and a wall surface of the round crucible. Each spraying process includes spraying a slurry on the bottom surface; using an optical positioner to set a spraying range the same as one of a plurality of partial areas divided from the wall surface; aligning one of the plurality of partial areas with the spraying range; fixing the round crucible and spraying the slurry in the spraying range; stopping the spraying; and rotating the round crucible to move another partial area to the spraying range. Then, the steps are repeated until the spraying of all the partial areas is completed.

Abstract: A thin film deposition system includes a vacuum-preloaded gas bearing deposition head positioned in an external environment having an ambient pressure, the deposition head having an output face including a plurality of source openings through which gaseous materials are supplied and one or more exhaust openings. An exhaust pressure at the exhaust openings is less than ambient pressure, and a source pressure at the source openings is greater than that at the exhaust openings, with the pressure at the outermost source openings being greater than ambient pressure. A motion control system moves a substrate unit over the output face in the in-track direction without constraining its motion in a direction normal to the output face to a point where a center of gravity of the substrate unit is beyond the first edge of the output face.