Abstract: A fluid handling structure for a gas phase deposition apparatus, the structure defining a flow path with an inlet and an outlet for transmitting pressurized fluid from said inlet to the outlet, wherein the structure includes an elongated slit and a series of nozzles through which pressurized fluid is allowed to enter the elongated slit, the inlet being upstream the series of nozzles, and wherein the outlet is formed downstream at a gap opening of the elongated slit allowing pressurized fluid to discharge from the elongated slit towards a substrate, wherein the series of nozzles are configured to provide a larger flow resistance than the elongated slit, and wherein the series of nozzles are adapted to form a series of jet flows directed towards one or more impingement surfaces of the structure when pressurized fluid is transmitted through the flow path.

Abstract: Impurities in a liquefied solid fuel utilized in a droplet generator of an extreme ultraviolet photolithography system are removed from vessels containing the liquefied solid fuel. Removal of the impurities increases the stability and predictability of droplet formation which positively impacts wafer yield and droplet generator lifetime.

Abstract: The present invention relates to a coating apparatus also called coating tunnel or coating hood for applying a protective coating to hollow glass containers. In particular it relates to a coating apparatus also called coating tunnel or coating hood with air curtains for reducing the loss of the carrier gas comprising a coating compound for applying the protective coatings to glass containers. More particularly the present invention relates to a coating apparatus also called coating tunnel or coating hood with specific air curtains at the entry and the exit of the coating apparatus for reducing the loss of the carrier gas comprising a coating compound for applying the protective coatings to glass containers.

Abstract: An apparatus, a system and a method are disclosed. An exemplary method includes providing a wafer process chamber and a plurality of radiant heat elements under the wafer process chamber, receiving a wafer holder configured to be used in the wafer process chamber, and processing a wafer located on the wafer holder in the wafer process chamber. The wafer holder includes: a wafer contact portion including an upper surface and a lower surface, an exterior portion including an upper surface and a lower surface, and a tapered region formed in the wafer contact portion.

Abstract: A mask assembly may include a frame, first sticks, and masks. The first sticks may extend in a first direction and may be arranged in a second direction. The plurality of masks may be disposed on the frame and the first sticks. The plurality of masks may extend in the second direction and may be arranged in the first direction. Each of the first sticks may have a first edge and a second edge, which are opposite to each other in the second direction. When viewed in a plan view defined by the first and second directions, the first and second edges of an outermost stick of the first sticks may have different shapes, and linear lengths of the first and second edges of the outermost stick may be substantially equal to each other, where the linear lengths are lengths of the first and second edges in a straight state.

Abstract: A plasma processing apparatus including powered electrodes having elongated planar surfaces; grounded electrodes having elongated planar surfaces parallel to and coextensive with the elongated surfaces of the powered electrodes, and spaced-apart a chosen distance therefrom, forming plasma regions, is described. RF power is provided to the at least one powered electrode, both powered and grounded electrodes may be cooled, and a plasma gas is flowed through the plasma regions at atmospheric pressure; whereby a plasma is formed in the plasma regions. The material to be processed may be moved into close proximity to the exit of the plasma gas from the plasma regions perpendicular to the gas flow, and perpendicular to the elongated electrode dimensions, whereby excited species generated in the plasma exit the plasma regions and impinge unimpeded onto the material.

Abstract: The present disclosure provides a mask plate frame. The mask plate frame includes two opposite rims, and a plurality of connectors detachably mounted to a first surface of each rim along a length direction of each rim. Each connector is used to mount a mask strip.

Abstract: A hood for depositing vaporized metals on glass container surfaces includes a vaporized metal source that produces vaporized metal; an enclosure, receiving one or more glass containers, comprising at least one side wall and at least one center section having a top above the glass containers; and one or more conduits that fluidly communicate the vaporized metal to an opening in at least one of the top of the center section and the side wall using one or more conduit fans.

Abstract: A first region of a valid portion formed on a mask sheet has a shape corresponding to a shape of each of active regions and provided for each active region of a vapor target substrate. A second region of the valid portion is located outside of the first region, and includes a plurality of vapor deposition holes (H) covered with a hauling sheet.

Abstract: A box coating apparatus for vacuum coating of substrates has a vacuum chamber containing an evaporation source and a substrate holder formed as a dome related to the evaporation source and rotatable about an axis. A masking arrangement is located in between for partially shadowing the substrates on the substrate holder relative to the evaporation source. The masking arrangement comprises a fixed masking portion stationary in the vacuum chamber, and a plurality of gradient sector portions carrying gradient shields assigned to the substrates on the substrate holder, for forming a gradient mask. The gradient sector portions can be rotated about the axis between a gradient mask open position where they are stored behind the fixed masking portion, and a gradient mask closed position where they are spread like a fan between the evaporation source and the substrate holder.

Abstract: A deposition system that mitigates feathering in a directly deposited pattern of organic material is disclosed. Deposition systems in accordance with the present disclosure include an evaporation source, an electrically conductive shadow mask, and an electrically conductive field plate. The source imparts a negative charge on vaporized organic molecules as they are emitted toward a target substrate. The source and substrate are biased to produce an electric field having field lines that extend normally between them. The shadow mask and field plate are located between the source and substrate and each functions as an electrostatic lens that directs the charged vapor molecules toward propagation directions aligned with the field lines as the charged vapor molecules approach and pass through them.

Abstract: A mask and a fabricating method thereof are provided. In the mask, a plurality of pairs of grooves corresponding to the plurality of mask sheets are disposed on a mask frame, each of the mask sheets includes a portion overlapping with a corresponding pair of grooves, and includes a plurality of pairs of locking fittings; each of the locking fittings includes an engaging portion and two connecting portions disposed on two sides thereof; the engaging portion are engaged with the corresponding grooves to clamp a portion of the mask sheet overlapping with the grooves, and the connecting portions are detachably connected with the mask frame to fix the plurality of mask sheets on the mask frame; during the rework process of the mask, only the locking fittings need to be removed to separate the mask frame and the mask sheets, so the mask frame does not need to be polished.

Abstract: In accordance with various embodiments, provision is made of a substrate holding device, wherein the latter may comprise a carrier plate with a recess, the recess extending from an upper side of the carrier plate to a lower side of the carrier plate through the carrier plate, a holding frame, which has a frame opening and a support area, surrounding the frame opening, for holding a substrate in the recess, wherein the holding frame inserted into the recess lies on the carrier plate in sections.

Abstract: A vapor deposition mask including a metallic substrate provided with a plurality of openings for passing vapor deposition particles, wherein at least a portion of the plurality of openings are structured by one or more opening groups in which the plurality of openings are repeatedly arranged in accordance with a constant rule, and a plurality of protrusions of identical height are arranged to support the entire substrate from one side, and are provided only outside the opening group formation region.

Abstract: The present invention relates to a substrate processing apparatus, comprising, a chamber comprising a base frame formed to open at least a part of faces extending in vertical direction and horizontal direction, a main heat source provided in a row with isolation on an opened face of the base frame, and a block which is connected to the opened face of the base frame and forms a space in the base frame in which the substrate is processed; and a substrate support portion which is provided in the chamber and supports the substrate, and by integrating the chamber and the heat source, the size of the chamber itself is reduced, the space can be used efficiently with reduced installation space, and facilities cost can be saved.

Abstract: A vapor deposition apparatus is configured to attract a vapor deposition mask by an electromagnet. The electromagnet includes a first electromagnet for generating a magnetic field in a first orientation, and a second electromagnet for generating a magnetic field in a second orientation, which is a reverse orientation to the first orientation. As a result, a generated magnetic field is weakened by operating the first and second electromagnets at the same time when a current is turned on, and an intended magnetic field can be obtained by thereafter turning off the second electromagnet. As a result, an influence of electromagnetic induction is reduced, reducing failure of elements and the like formed on a substrate for vapor deposition and degradation in properties of the elements. Meanwhile, by turning off the operation of the second electromagnet after the current is turned on, a normal attraction force can be obtained.

Abstract: A substrate processing system and substrate processing method. The substrate processing system includes: a chamber; a susceptor disposed inside the chamber and allowing a substrate to be seated thereon; a mask member disposed over the substrate; and a controller for controlling an arrangement height of the mask member with respect to the substrate. Here, an encapsulation layer covering a device formed on the substrate is formed using the mask member adjusted in height by the controller. The substrate processing method includes disposing a substrate inside a chamber; disposing a mask member over the substrate inside the chamber; and forming an encapsulation layer covering a device formed on the substrate by adjusting an arrangement height of the mask member with respect to the substrate.

Abstract: Methods and apparatus for processing substrates are provided herein. In some embodiments, an apparatus includes a process kit, the process kit comprising a first ring to support a substrate proximate a peripheral edge of the substrate; a second ring disposed about the first ring; and a path formed between the first and second rings that allows the first ring to rotate with respect to the second ring, wherein the path substantially prevents light from travelling between a first volume disposed below the first and second rings and a second volume disposed above the first and second rings.

Abstract: A system for combinatorial deposition of a thin layer on a substrate is described. The system comprises at least one deposition material source holder and a substrate holder. The system also comprises a rotatable positioning system for subsequently positioning the at least one substrate in parallel and in non-parallel configuration with at least one deposition material source. The system comprises at least one mask holder arranged for positioning a mask between at least one of the target holder and the positioning system, for allowing variation of the material flux across the at least one substrate when the combinatorial deposition is performed. The mask holder is in a fixed arrangement with respect to the at least one deposition material source holder during the combinatorial depositing.

Abstract: A physical vapor deposition system includes a deposition chamber; a wafer support structure disposed within the deposition chamber and configured to support at least one wafer thereon, and at least one effusion cell disposed at least partially outside the deposition chamber and coupled to a wall of the deposition chamber. The at least one effusion cell is configured to generate physical vapor by evaporation or sublimation of material within the at least one effusion cell, and to inject the physical vapor into the deposition chamber through an aperture in the wall of the deposition chamber. The at least one effusion cell is configured such that the at least one effusion cell can be filled with the material to be evaporated or sublimated without removing the at least one effusion cell from the deposition chamber and without interrupting a deposition process performed using the deposition system.

Abstract: A novel interchangeable spin chuck system is provided that allows the user to quickly change substrate sizes and spin chuck styles without any extra tools. This system has a two-piece design and overcomes many of the drawbacks of previous spin chuck designs, such as difficulty in seating the spin chuck and ensuring that the spin chuck is at a consistent flatness and height. Furthermore, this spin chuck system allows the spin chucks to be manufactured at a lower cost. Thus, rather than restricting users to “make do” with incorrect spin chucks due to budget limitations, this economical design gives users access to a wider range of spin chuck sizes and styles.

Abstract: The present disclosure relates to the field of display technology, particularly to a vacuum deposition apparatus and a vapor deposition method. The vacuum deposition apparatus includes a vacuum chamber and a rotary base, an evaporation source, and a plurality of vapor deposition zones arranged in series from bottom to top in the vacuum chamber, wherein the shape of the rotary base is a Reuleaux triangle, and the trajectories of movement of its vertices in the horizontal plane is a rounded square, the vapor deposition zones are arranged at intervals along the trajectories of movement of the vertices of the rotary base, the evaporation source is driven by the rotary base to pass below the vapor deposition zones sequentially, so that the evaporation source can be used to perform the vapor deposition operation in multiple directions simultaneously, thus improving the uniformity of film formation and utilization of the evaporation material.

Abstract: Provided is a substrate processing apparatus, which comprises a processing chamber, a substrate sensing assembly, a rotation shaft and a driving assembly. A portion of the rotation shaft is provided inside the processing chamber and the remaining portion thereof is provided outside the processing chamber. The substrate sensing assembly is provided on the portion of the rotation shaft outside the processing chamber. The driving assembly is fixed at the portion of the rotation shaft inside the processing chamber. The driving assembly drives, when coming into contact with the substrate, the rotation shaft to rotate about its own axis along a first direction, and drives, when the substrate comes into no contact with the driving assembly, the rotation shaft to rotate about its axis along a second direction opposite to the first direction. The treatment liquid does not affect the substrate sensing assembly since it is provided outside the processing chamber.

Abstract: The film forming apparatus includes a mask member and a shield member. The mask member is made of a cylindrical insulation material that can expose inner surfaces of cylinder bores, and mask the inner surface of a crankcase. The shield member is made of a metal material disposed along an inner surface of the mask member.

Abstract: Embodiments of the invention generally provide a process kit for use in a physical deposition chamber (PVD) chamber. In one embodiment, the process kit provides adjustable process spacing, centering between the cover ring and the shield, and controlled gas flow between the cover ring and the shield contributing to uniform gas distribution, which promotes greater process uniformity and repeatability along with longer chamber component service life.

Abstract: A heating processing performed on an outer peripheral portion of a substrate can be optimized. A substrate processing apparatus includes a holding unit configured to hold a substrate; a rotation unit configured to rotate the holding unit; a processing liquid supply unit configured to supply a processing liquid onto the substrate held in the holding unit; and a heating device configured to heat an outer peripheral portion of the substrate held in the holding unit. Further, the heating device includes a discharge flow path through which a gas is discharged toward the outer peripheral portion of the substrate held in the holding unit; a branch flow path through which a gas is discharged toward a region other than the substrate held in the holding unit; and a heating unit configured to heat the discharge flow path and the branch flow path.

Abstract: A photolithography system includes a variable-volume buffer tank, a dispensing system connected to the buffer tank, and a valve configured to release gas from a head space of the buffer tank while blocking the release of liquid from the head space. A storage container has an opening at the bottom and drains to the buffer tank through that opening. The buffer tank has a storage capacity sufficient to receive the full contents of the storage container. The system supplies chemical solutions to the dispensing system while keeping the chemical solutions from contact with air and other gases.

Abstract: Disclosed is a chemical vapor deposition system for forming an organic thin film over a substrate. The system introduces a mask roll including two or more mask patterns for depositing an organic material on the substrate. The mask roll is released from one side and takes up on the other side to selectively provide one of the two or more patterns.

Abstract: Embodiments of the invention generally relate to a process kit for a semiconductor processing chamber, and a semiconductor processing chamber having a kit. More specifically, embodiments described herein relate to a process kit including a deposition ring and a pedestal assembly. The components of the process kit work alone, and in combination, to significantly reduce their effects on the electric fields around a substrate during processing.

Abstract: A method for manufacturing a compound film comprising a substrate and at least one additional layer is disclosed. The method comprising the steps of depositing at least two chemical elements on the substrate and/or on the at least one additional layer using depositions sources, maintaining depositing of the at least two chemical elements while the substrate and the deposition sources are being moved relative to each other, measuring the compound film properties, particularly being compound film thickness, compound-film overall composition, and compound-film composition in one or several positions of the compound film, comparing the predefined values for the compound film properties to the measured compound film properties, and adjusting the deposition of the at least two chemical elements in case the measured compound film properties do not match the predefined compound film properties.

Abstract: The present disclosure provides a magnetic device and a vapor deposition device. The magnetic device is configured to adsorb a metal mask in the vapor deposition device, including: a metal plate; an electromagnet array including a plurality of electromagnets; each of the electromagnets being inserted in the metal plate; a power supply module configured to supply a current; a control module configured to, when adsorbing the metal mask during a vapor deposition process, control the power supply module to supply a direct current to all or some of the plurality of electromagnets and control a direction and a size of the direct current by sending a first control signal to the power supply module.

Abstract: Substrate supports are provided herein, In some embodiments, a substrate support includes a first plate; a plurality of vacuum passages disposed through the first plate; a plurality of vertical passages formed partially into the first plate; a plurality of horizontal passages disposed in the first plate, each of the plurality of horizontal passages beginning proximate a perimeter of the first plate and terminating proximate one of the plurality of vertical passages such that the horizontal passages and the vertical passages are in fluid communication; a second plate coupled to the first plate at an interface; an elongate shaft having a vacuum line and an edge purge line internal to the shaft; a vacuum channel formed at the interface fluidly coupling the vacuum line to the plurality of vacuum passages; and an edge purge channel formed at the interface fluidly coupling the edge purge line to the plurality of vertical passages.

Abstract: Embodiments of a process kit for substrate process chambers are provided herein. In some embodiments, a process kit for a substrate process chamber may include a ring having a body and a lip extending radially inward from the body, wherein the body has a first annular channel formed in a bottom of the body; an annular conductive shield having a lower inwardly extending ledge that terminates in an upwardly extending portion configured to interface with the first annular channel of the ring; and a conductive member electrically coupling the ring to the conductive shield when the ring is disposed on the conductive shield.

Abstract: A unit mask is extended in a direction and is supported by a frame including an opening. The unit mask includes a first fixed part located in the opening and fixed to one surface of the frame disposed in the direction, a second fixed part spaced apart from the first fixed part and fixed to another surface of the frame disposed in the direction, and a mask part held by the first fixed part and the second fixed part between the first fixed part and the second fixed part.

Abstract: The plasma generator has the dielectric having the inner circumferential surface, and a pair of electrodes which are arranged separated from each other in the direction along the inner circumferential surface and are isolated from each other by the dielectric and which are capable of generating plasma on the inner circumferential surface by application of voltage. In the inner circumferential surface, at the positions between the pair of electrodes in a plan view, recessed portions causing electric field concentration are formed.

Abstract: A deposition apparatus includes a deposition source unit that has a crucible heating a deposition material filled therein to vaporize the deposition material and a plurality of nozzles spraying the vaporized deposition material, a substrate disposed to face the nozzles, a blind plate disposed between the deposition source unit and the substrate and including a plurality of first openings to guide a traveling direction of the deposition material sprayed from the nozzles, a mask disposed between the substrate and the blind plate and including a plurality of second openings to provide a path through which the deposition material passing through the first openings of the blind plate is deposited on the substrate, and a heater unit that heats the blind plate at a predetermined temperature to vaporize the deposition material stacked up on the blind plate.

Abstract: The present invention provides an evaporation device for which maintenance is readily conducted, and further, provides an electrode cover which can prevent an evaporation material from being adhered to electrodes. Moreover, the present invention provides an evaporation device including an evaporation chamber; a holding portion for holding an object to be treated; an evaporation source; an electrode; an electrode cover; and a power supply, in which the evaporation chamber includes the holding portion in an upper portion, and includes the evaporation source, the electrode, and the electrode cover in a lower portion; the electrode cover covers at least a part of an exposed surface of the electrode; the electrode and the power supply are electrically connected.

Abstract: An apparatus and method for coating an organic film are disclosed. The apparatus comprises an evaporation device, an electron emission device and a spray device; wherein the evaporation device comprises an evaporation container, the evaporation container is a linear evaporation container, in which a uniform organic gas is generated; the electron emission device is horizontally arranged over the evaporation container such that the organic gas evaporated in the evaporation container is uniformly charged and becomes charged organic gas; the spray device is provided with an electric field, under which the charged organic gas is moved toward a substrate so as to deposit the organic film on the substrate.

Abstract: An apparatus with two-chamber structure for growing silicon carbide (SiC) crystals is disclosed. The apparatus comprises a sample feed chamber and a crystal growth chamber, both of which are separately connected with each other by a vacuum baffle valve and connected with a vacuum system. The crystal growth apparatus ensures that the insulation materials in the crystal growth chamber cannot contact with air, minimizes the adsorption of nitrogen and pollutants on the insulation materials and the growth chamber, improves purity of SiC crystals and achieves precise control of the impurities so that growth of high-quality SiC crystals such as conductive, doped semi-insulating or high-purity semi-insulating SiC crystals and the like is enabled.

Abstract: A consumable isolation ring of a movable substrate support assembly is described. The consumable isolation ring is configured to be supported on a step of a movable ground ring fit around a fixed ground ring. The consumable isolation ring is configured to electrically isolate the movable ground ring from a dielectric ring of the movable substrate support assembly.

Abstract: A deposition mask assembly having a plurality of deposition masks consecutively arranged in parallel is discussed. The deposition mask has a frame coupled with the plurality of deposition masks, wherein cross section of one end of each deposition mask having first and second sectors which are asymmetric and meet each other at a first contact point, wherein the first sector has a first radius and a first center angle, and connected to an upper surface of the deposition mask, the second sector has a second radius different from the first radius and a second center angle different from the first center angle, and connected to a lower surface of the deposition mask, and the contact point is asymmetric, pointed and protruded horn-shaped or arrow-shaped.

Abstract: A deposition apparatus 50 forms a thin film 3 in a predetermined pattern on a substrate 10 for an organic EL display. A first correction plate 81 and a second correction plate 82 are placed between a shadow mask 60 and a deposition source 53 that emits deposition particles. Each of the correction plates 81, 82 has a plurality of blade plates 83 and a frame 84 that supports the plurality of blade plates 83. The blade plates 83 are placed so as to be tilted with respect to the shadow mask 60, and to extend parallel to each other with an opening 86 between adjoining ones of the blade plates 83 as viewed in a direction perpendicular the deposition mask 60.

Abstract: Combinatorial plasma enhanced deposition techniques are described, including designating multiple regions of a substrate, providing a precursor to at least a first region of the multiple regions, and providing a plasma to the first region to deposit a first material on the first region formed using the first precursor, wherein the first material is different from a second material formed on a second region of the substrate.

Abstract: Sources, devices, and techniques for deposition of organic layers, such as for use in an OLED, are provided. A vaporizer may vaporize a material between cooled side walls and toward a mask having an adjustable mask opening. The mask opening may be adjusted to control the pattern of deposition of the material on a substrate, such as to correct for material buildup that occurs during deposition. Material may be collected from the cooled side walls for reuse.

Abstract: According to one embodiment, a stage apparatus includes a height control unit includes height control elements each which is drove in an upward/downward direction independently, a measuring unit which divides an upper surface of the substrate into areas, and measures a height of each of the areas. The control unit is configured to set the height of each of the areas independently by controlling a height of each of the height control elements based on a data value, determine using the measuring unit whether the height of each of the areas in the upper surface of the substrate is in a allowable range, and set the height of the area out of the allowable range again by the height control elements.

Abstract: A mask holding device has a replaceable magnetic means, and a deposition apparatus for an organic light emitting device includes the mask holding device. The mask holding device is provided with magnets, and the magnets can be replaced as required so as to change the magnetic force of the mask holding device.

Abstract: A substrate processing apparatus capable of forming an oxide film on a substrate by forming a layer on the substrate by supplying a source gas into a process vessel accommodating the substrate via the first nozzle, and simultaneously supplying an oxygen-containing gas through a second nozzle and a hydrogen-containing gas through a first nozzle into the process vessel having an inside pressure thereof lower than atmospheric pressure; mixing and reacting the oxygen-containing gas with the hydrogen-containing gas in a non-plasma atmosphere within the process vessel to generate atomic oxygen; and oxidizing the layer with the atomic oxygen to change the layer into an oxide layer is disclosed.

Abstract: In one embodiment the disclosure relates to an apparatus for depositing an organic material on a substrate, including a source heater for heating organic particles to form suspended organic particles; a transport stream for delivering the suspended organic particles to a discharge nozzle, the discharge nozzle having a plurality of micro-pores, the micro-pores providing a conduit for passage of the suspended organic particles; and a nozzle heater for pulsatingly heating the micro-pores nozzle to discharge the suspended organic particles from the discharge nozzle.

Abstract: The present disclosure generally relates to systems and methods for growing and preferentially volumetrically enhancing group III-V nitride crystals. In particular the systems and methods include diffusing constituent species of the crystals through a porous body composed of the constituent species, where the species freely nucleate to grow large nitride crystals. The systems and methods further include using thermal gradients and/or chemical driving agents to enhance or limit crystal growth in one or more planes.

Abstract: An apparatus for depositing a layer of material at different thicknesses on a substrate using atomic layer deposition (ALD) to form patterns that exhibit different colors. The patterns may be formed using a printer head that moves in a two-dimensional plane over the substrate along a path while injecting the precursor gases onto the substrate. Patterns are formed on the substrate along the path along which the printer head moves. The refraction of light incident on the layer of material on the substrate causes the deposited material to exhibit different colors.