Abstract: In an embodiment, a method includes: placing a wafer on an implanter platen, the wafer including integrated circuit dies; measuring a position of the wafer by measuring a position of an outer edge of the integrated circuit dies with a camera; determining an angular displacement between the position of the wafer and a reference position of the wafer; and rotating the implanter platen by the angular displacement.

Abstract: A mask includes a frame, at least one mask sheet, and a shielding plate. The frame includes a plurality of borders. The borders are connected end to end in sequence to form the frame with a first hollow region. A mask sheet includes a pattern region and non-pattern regions. The pattern region includes at least one evaporation hole. The shielding plate includes a plurality of shielding strips. The plurality of shielding strips are arranged crosswise to form a plurality of second hollow regions. Orthogonal projections of the second hollow regions on a plane perpendicular to a thickness direction of the frame are located within a range of an orthogonal projection of the first hollow region on the plane. An inner edge of an orthogonal projection of the frame on the plane is located within a range of an orthogonal projection of the shielding plate on the plane.

Abstract: An apparatus generates energetic particles and generates a plasma of a vaporized solid material and gaseous precursors for the application of coatings to surfaces of a substrate by way of condensation of plasma and for electric propulsion applications.

Abstract: A deposition mask includes a body portion, a pattern portion that penetrates the body portion and is configured to allow deposition material to pass through the body portion, a blocking portion disposed on the body portion, and a support portion disposed on the body portion adjacent to the blocking portion. The blocking portion contacts a display substrate, blocks the deposition material, and defines the pattern portion. The support portion contacts the display substrate.

Abstract: Exemplary semiconductor processing chambers include a chamber body defining a processing region. The chambers may include a substrate support disposed within the processing region. The substrate support may have an upper surface that defines a recessed substrate seat. The chambers may include a shadow ring disposed above the substrate seat and the upper surface. The shadow ring may extend about a peripheral edge of the substrate seat. The chambers may include bevel purge openings defined within the substrate support proximate the peripheral edge. A bottom surface of the shadow ring may be spaced apart from a top surface of the upper surface to form a purge gas flow path that extends from the bevel purge openings along the shadow ring. A space formed between the shadow ring and the substrate seat may define a process gas flow path. The gas flow paths may be in fluid communication with one another.

Abstract: A diagnostic method and system for measuring potential and electric field of plasma are provided. According to operation parameters of a magnetic confinement fusion device and relevant parameter data of a plurality of candidate particle elements, signal-noise ratios are calculated. to select a neutral beam particle element. Beam trajectories varying in incident velocity, incident angle and sampling area are obtained by iterative calculation, and a preset parameter which enables the beam trajectories to pass through an entrance slit of an analyzer is obtained. A neutral beam that meets the preset parameter is injected into the plasma. An energy of the primary beam generated by collision ionization in a sampling area is measured, and potential of the sampling area is obtained according to law of conservation of energy. Sampling areas are detected to obtain potential spatial distribution of the plasma and a radial electric field, and the diagnostic is finished.

Abstract: A mask member for a deposition mask is provided. The deposition mask has a resin film in which a pattern of opening portions is formed. The mask member includes a resin film and a reflective film. The reflective film is on a surface of the resin film. The reflective film is adapted to reflect light having wavelengths of laser light.

Abstract: An apparatus as disclosed herein relates to a chamber body design for use within a thermal deposition chamber, such as an epitaxial deposition chamber. The chamber body is a segmented chamber body design and includes an inject ring and a base plate. The base plate includes a substrate transfer passage and one or more exhaust passages disposed therethrough. The inject ring includes a plurality of gas inject passages disposed therethrough. The inject ring is disposed on top of the base plate and attached to the base plate. The one or more exhaust passages and the gas inject passages are disposed opposite one another. One or more seal grooves are formed in both the base plate and the inject ring to enable the inject ring and the base plate to seal to one another as well as other components within the process chamber.

Abstract: A mask assembly includes a mask frame through which a plurality of openings is defined and a plurality of cell masks disposed to respectively correspond to the cell openings. Each of the cell masks includes a mask main body substantially parallel to a plane defined by a first direction and a second direction crossing the first direction, where a plurality of holes is defined through the mask main body, a bonding portion disposed along an edge of the mask main body, and a tensile portion extending from the bonding portion and disposed spaced apart from the mask main body. The tensile portion includes first tensile portions spaced apart from each other in the first direction and disposed at opposite sides of the mask main body and second tensile portions spaced apart from each other in the second direction and disposed at opposite sides of the mask main body.

Abstract: A chuck for heating and clamping a workpiece, such as a semiconductor workpiece, is disclosed. The chuck is configured to allow the workpiece to be heated to temperatures in excess of 600° C. Further, while the workpiece is heating, the components that make up the chuck may be maintained at a much lower temperature, such as room temperature. The chuck includes a housing, formed as a hollow cylinder with sidewalls and an open end. Electrodes are disposed at the top surface of the sidewalls to clamp the workpiece. A heat source is disposed in the cavity and emits radiated heat toward the workpiece. A clamp ring may be used to secure the workpiece. In some embodiments, a thermal sensor is used to monitor the temperature of the workpiece.

Abstract: A manufacturing method for an electronic device includes a preparation step of preparing a layered body including a substrate, two or more first electrodes, and organic layers, the substrate having a first surface and a second surface that is positioned opposite to the first surface, the two or more first electrodes positioned above the first surface of the substrate, the organic layers positioned above the first electrodes; a second electrode formation step of forming a second electrode above the organic layers so that the second electrode overlaps the two or more first electrodes when viewed in a normal direction to the first surface of the substrate; and a removal step of partly removing regions of the second electrode that is positioned between the first electrodes in plan view.

Abstract: A substrate carrier, includes: a unitary body fabricated from a single block of graphite, wherein the body comprises a back plate, and a pair of spaced apart, substantially parallel, side rails, wherein each of the side rails comprises: an inwardly facing surface extending outwardly of the back plate; a longitudinally extending selenium vapor bore formed therein, a top end of the selenium vapor bore being open and configured for coupling to a selenium supply container for receiving selenium vapor by gravity, a bottom end of the selenium vapor bore being closed; an inwardly directed selenium vapor channel; a plurality of selenium vapor outlets disposed between the selenium vapor bore and the inwardly directed selenium vapor channel so as provide a plurality of conduits between the selenium vapor bore and the selenium vapor channel; and, a longitudinally extending engagement slot formed in the inwardly facing surface of each side rail adjacent the back plate to engage and hold a substrate in proximity to the ba

Abstract: A vapor deposition apparatus is described. The vapor deposition apparatus includes a substrate support for supporting a substrate to be coated; a vapor source with a plurality of nozzles for directing vapor toward the substrate support through a vapor propagation volume; and a heatable shield extending from the vapor source toward the substrate support. The heatable shield surrounds the vapor propagation volume at least partially and includes an edge exclusion portion for masking areas of the substrate not to be coated. The substrate support may be a rotatable drum with a curved drum surface, and the vapor deposition apparatus may be configured to move the substrate on the curved drum surface past the vapor source in a circumferential direction.

Abstract: A method for thinning a wafer is provided. The method includes placing a wafer on a support assembly, and the support assembly includes a plurality of pin. The method includes securing an etching mask to a backside of the wafer, and the etching mask has an extending portion which covers a peripheral portion of the wafer. The etching mask has a plurality of circular bores extended along a vertical direction, and the etching mask is secured to the support assembly by connecting the circular bores and the pins. The method also includes performing a wet etching process on the backside of the wafer to foil a thinned wafer, wherein the thinned wafer has a peripheral portion with a first thickness and a central portion having a second thickness smaller than the first thickness.

Abstract: Disclosed herein is a full-size mask assembly and a manufacturing method thereof. The full-size mask assembly according to an embodiment of the present invention includes a frame having a frame opening formed therein and a support surrounding the frame opening, a structural auxiliary mask supported by the support and having a plurality of shafts in a grid shape to form a plurality of structural auxiliary mask openings, and a plurality of cell unit masks supported by the structural auxiliary mask and each of which has a deposition pattern portion through which a deposition material passes.

Abstract: Provided is a mask which includes a mask body having a plurality of through hole portions and including a polymer film and a plurality of magnetic particles dispersed in the polymer film, and a polymer coating layer disposed on an outer surface of the mask body. Accordingly, the time and cost of manufacturing a mask are reduced and the precision of a deposition process is improved as well, so that the manufacturing yield of a display panel using the mask is improved and a display panel manufactured using the same has improved reliability.

Abstract: A method for printing conductive solder paste on a base substrate to establish an electrical connection is provided. The method includes applying conductive solder paste over a stencil, and within an opening of the stencil to contact the base substrate therebeneath. In embodiments, a squeegee can be used to scrape some of the conductive solder paste off of the stencil, leaving behind some of the conductive solder paste within the opening. Subsequently, the stencil can be removed at a speed of more than 200 millimeters per second to help reduce the end-of-track bump ultimately formed at the end of the conductive solder paste that remains after the stencil is removed.

Abstract: A shadow mask for a substrate is disclosed. The shadow mask includes a frame circumscribing a surface of the substrate. The shadow mask further includes one or more island mask features within the surface of the substrate, configured to block a deposition of a material onto at least a portion of the surface of the substrate. The shadow mask further includes one or more crossbeams coupling one or more island mask features to the frame at an elevation relative to the substrate. The one or more cross beams are configured to permit deposition of a material onto the substrate surface underneath the one or more crossbeams. In some instances, the shadow mask is manufactured through an additive manufacturing process.

Abstract: A deposition mask group includes a first deposition mask having two or more first through holes arranged along two different directions, a second deposition mask having two or more second through holes arranged along two different directions and a third deposition mask having two or more third through holes. The first through hole and the second through hole or the third through hole partly overlap when the first deposition mask, the second deposition mask and the third deposition mask are overlapped.

Abstract: A method for producing a frame-equipped vapor deposition mask sequentially includes preparing a vapor deposition mask including a metal mask having a slit and a resin mask having an opening corresponding to a pattern to be produced by vapor deposition at a position overlapping the slit, the metal mask and the resin mask being stacked, retaining a part of the vapor deposition mask by a retainer and stretching the vapor deposition mask retained by the retainer outward, and fixing the vapor deposition mask in a state of being stretched to a frame having a through hole. During stretching, any one or both adjustments of a rotating adjustment and a moving adjustment of the vapor deposition mask are performed with respect to the vapor deposition mask in the state of being stretched or with the vapor deposition mask being stretched.

Abstract: The present disclosure provides a mask and a manufacturing method thereof, an evaporation method and a display screen, to achieve normal display of an area around such components as an earpiece, a front camera, and sensors on the front of a display screen, and increase the screen-to-body ratio. The mask comprises a substrate provided with at least one opening, an orthographic projection of the opening on a display plane of a display screen to be fabricated coinciding with a display area of the display screen to be fabricated; a shielding part arranged inside the opening, an orthographic projection of the shielding part on the display plane coinciding with an orthographic projection of a component to be shielded in the display screen to be fabricated on the display plane; and a connecting part located between the shielding part and a side wall of the opening.

Abstract: The present disclosures provide a deposition mask and a method of manufacturing the same. The disclosed deposition mask may include: a deposition portion including a plurality of deposition patterns; and a boundary portion surrounding the deposition portion and including a first region and a second region extending from the first region. The boundary portion may have a thickness thicker than that of the deposition portion. Through this, it is possible to prevent a thermal deformation of the mask which may occur when the mask and mask frame are welded to each other.

Abstract: The present disclosure provides a mask and a manufacturing method thereof, an evaporation method and a display screen, to achieve normal display of an area around such components as an earpiece, a front camera, and sensors on the front of a display screen, and increase the screen-to-body ratio. The mask comprises a substrate provided with at least one opening, an orthographic projection of the opening on a display plane of a display screen to be fabricated coinciding with a display area of the display screen to be fabricated; a shielding part arranged inside the opening, an orthographic projection of the shielding part on the display plane coinciding with an orthographic projection of a component to be shielded in the display screen to be fabricated on the display plane; and a connecting part located between the shielding part and a side wall of the opening.

Abstract: An embodiment of the present application provides a preparation method of a mask assembly, including: fixing, after stretching and aligning a blocking, the blocking on a side of a frame; opening at least one stretching align hole and at least one evaporation align mark in the fixed blocking and frame; fixing, after stretching and aligning a mask sheet, the mask sheet on a side of the blocking away from the frame according to the stretching align hole; and opening at least one evaporation align mark in the fixed mask sheet to obtain the mask assembly.

Abstract: Disclosed herein is a full-size mask assembly and a manufacturing method thereof. The full-size mask assembly according to an embodiment of the present invention includes a frame having a frame opening formed therein and a support surrounding the frame opening, a structural auxiliary mask supported by the support and having a plurality of shafts in a grid shape to form a plurality of structural auxiliary mask openings, and a plurality of cell unit masks supported by the structural auxiliary mask and each of which has a deposition pattern portion through which a deposition material passes.

Abstract: A display substrate, a method and a device for manufacturing the display substrate, and a display device are provided. The method includes shielding a to-be-cut region of a to-be-evaporated substrate with a shielding member and evaporating a common layer material onto the to-be-evaporated substrate to form a common layer of the display substrate. The display substrate includes the to-be-cut region and a display region surrounding the to-be-cut region, and the common layer material is deposited onto the display region rather than the to-be-cut region.

Abstract: A repatternable nanoimprint lithography stamp includes a magnetic substrate and magnetic core nanoparticles. The magnetic substrate includes a magnet and a magnetic mask, and the magnetic core nanoparticles are arranged in a pattern on a surface of the magnetic substrate. The pattern is defined by selective application of a magnetic field to the magnetic substrate using the magnet and the magnetic mask.

Abstract: A deposition mask includes: a mask sheet formed by stacking a metal layer provided with a plurality of through holes on a film layer provided with a plurality of opening patterns, each through hole enclosing at least one of the opening patterns, and by dividing one surface of the mask sheet into a plurality of unit cells each including two or more of the opening patterns and two or more of the through holes; and a support member which is made of metal and has openings corresponding to the unit cells of the mask sheet, the support member supporting the mask sheet by being joined to the metal layer of the mask sheet to which no external tension is applied. This ensures high shape and positional deposition accuracy in forming thin film patterns using the deposition mask.

Abstract: A vapor deposition apparatus disclosed in an embodiment is configured to allow an electromagnet (3) to attract a vapor deposition mask, and comprises a control circuit (7) connected between the electromagnet (3) and a power supply circuit (6) for driving the electromagnet (3). The control circuit gradually changes a magnetic field to be generated by the electromagnet (3) when a current is applied to the electromagnet (3). As a result, the change in current to flow in an electromagnetic coil (32) of the electromagnet (3) becomes gradual and an effect of electromagnetic induction is reduced, thereby suppressing the defect of elements formed on a substrate for vapor deposition or the deterioration in property of the element.

Abstract: A deposition mask extending in a first direction may include: a pattern portion including a plurality of pattern holes; and a clamping portion including a protrusion portion to be attached to the clamp and an indentation portion formed in a direction toward the pattern portion, wherein the pattern portion may include a blocking portion that at least partially overlaps the protrusion portion in the first direction and has an area gradually decreasing in a second direction from the protrusion portion toward the indentation portion, the second direction crossing the first direction.

Abstract: There are provided a vapor deposition mask capable of satisfying both high definition and lightweight in upsizing and forming a vapor deposition pattern with high definition while securing strength, a vapor deposition mask preparation body capable of simply producing the vapor deposition mask and a method for producing a vapor deposition mask, and furthermore, a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition. A metal mask 10 in which a slit 15 is provided and a resin mask 20 in which openings 25 corresponding to a pattern to be produced by vapor deposition are provided at a position of overlapping with the slit 15 are stacked, and the metal mask 10 has a general region 10a in which the slit 15 is provided and a thick region 10b larger in thickness than the general region.

Abstract: A vapor deposition apparatus comprises a vacuum chamber, at least two movable holders and an alignment system. A pedestal, a backboard supported on the pedestal and a metal mask located above the backboard are disposed inside the vacuum chamber, wherein an anti-plasma coated layer is provided on the metal mask; each of the movable holders is configured to clamp an end of the metal mask on which a pulling force can be applied; and the alignment system is configured to drive the movable holders to move in at least one direction of a first direction and a second direction that are perpendicular to each other within a plane in parallel to the backboard and a third direction perpendicular to the plane to perform at least one of applying a pulling force on the metal mask and attaching the metal mask onto a preset location of the backboard.

Abstract: Provided is an apparatus for treating a substrate which is capable of uniformly controlling a temperature of a support plate. The apparatus for treating the substrate includes a chamber having a treating space with an opened top surface, a support unit disposed within the chamber to support the substrate, a dielectric assembly disposed on the opened top surface of the chamber to cover the opened top surface, and a plasma source disposed above the dielectric assembly, the plasma source including an antenna generating plasma from a gas supplied into the chamber. The dielectric assembly includes a dielectric window, and heating units each of which is formed of a non-metallic material, the heating units being disposed on a top surface of the dielectric window to heat the dielectric window.

Abstract: A substrate processing apparatus includes: a reaction tube including inner and outer tubes installed to surround the inner tube; a substrate holder for holding substrates in a vertical direction; gas nozzles installed in a gap between the outer and inner tubes and having supply holes from which a gas is supplied toward an inlet port of the inner tube; a gas supply system for feeding gases to the reaction tube though the gas nozzles; an outlet port formed in the inner tube to flow out the gas; a discharge port for discharging the gas; a discharge part for discharging the gas staying in the gap from the discharge port; and a controller for controlling the gas supply system to supply a precursor gas and an inert gas and for causing the discharge part to purge the gas staying in the gap with the inert gas.

Abstract: A vapor deposition apparatus disclosed in an embodiment is configured to allow an electromagnet (3) to attract a vapor deposition mask, and comprises a control circuit (7) connected between the electromagnet (3) and a power supply circuit (6) for driving the electromagnet (3). The control circuit gradually changes a magnetic field to be generated by the electromagnet (3) when a current is applied to the electromagnet (3). As a result, the change in current to flow in an electromagnetic coil (32) of the electromagnet (3) becomes gradual and an effect of electromagnetic induction is reduced, thereby suppressing the defect of elements formed on a substrate for vapor deposition or the deterioration in property of the element.

Abstract: A mask plate includes an outer frame and a plurality of sub-mask plates, the outer frame includes a first side, a second side, a third side and a fourth side. The third side and the fourth side are parallel to each other and extended along a first direction, the first side and the second side are spaced apart from each other parallelly and extended along a second direction. Two opposite ends of the third side are connected to one end of the first side and one end of the second side, and two opposite ends of the fourth side are connected to another end of the first side and another end of the second side. The sub-mask plates selectively shield the luminescent material when preparing pixels, and extend along the first direction and arrange along the second direction and do reciprocating motion along the first direction or the second direction.

Abstract: A plasma processing apparatus may include a process chamber having an interior processing volume, first, second and third RF coils disposed proximate the process chamber to couple RF energy into the processing volume, wherein the second RF coil disposed coaxially with respect to the first RF coil, and wherein the third RF coil disposed coaxially with respect to the first and second RF coils, at least one ferrite shield disposed proximate to at least one of the first, second or third RF coils, wherein the ferrite shield is configured to locally guide a magnetic field produced by an RF current flow through the first, second or third RF coils toward the process chamber, wherein the plasma processing apparatus is configured to control a phase of each RF current flow through each of the of the first, second or third RF coils.

Abstract: A mask frame assembly including a frame, a mask coupled to the frame and including a pattern region for deposition, and a partitioning stick coupled to the frame and configured to partition the pattern region of the mask into unit cell patterns. The partitioning stick includes a pair of opposing fixing ends fixed to sides of the frame, and a narrow width portion connecting the pair of fixing ends and including a first partitioning portion and a second partitioning portion respectively recessed inwards from both edges of the fixing ends in a width direction to maintain rigidity balance between the first and second partitioning portions.

Abstract: The present invention discloses an analysis method of a tensioning process of a fine mask plate. The analysis method, based on the simulation function of ANSYS software, finds an appropriate tensile force for stretching a fine mask plate and a corresponding actual counterforce applied to a metal frame before each fine mask plate is welded onto the metal frame through establishing a finite element model of the fine mask plate and a finite element model of the metal frame. The analysis process requires no physical tests, thereby effectively avoiding damaging the fine mask plate and further effectively saving the test cost.

Abstract: A mask for thin film deposition used in forming an organic thin film or a conductive layer in an organic light emitting device is disclosed. In one embodiment, the mask includes i) a base member, ii) a plurality of slits configured to penetrate through the base member, wherein the plurality of slits have a predetermined length and extend in a first direction, wherein the plurality of slits comprise an outermost slit positioned in an outermost in a second direction having a predetermined angle with respect to the first direction, and wherein the outermost slit comprises two sub-slits separated from each other and iii) a rib supporting part formed between and contacting the two sub-slits, wherein the rib supporting part extends from a rib which is adjacent to the outermost slit.

Abstract: A mask frame assembly includes a frame having an opening, a support bar extended in a first direction crossing the opening of the frame and having distal ends installed over the frame, and a mask having extended in a second direction crossing the first direction, having distal ends installed over the frame, and having a pattern unit extended along the second direction and configured to pass a deposition material. The support bar includes a first opening disposed on one side of the support bar and having a first width in the second direction, and a second opening disposed on the other side of the support bar opposite to the one side of the support bar and having a second width greater than the first width in the second direction.

Abstract: A frame and a mask assembly having the same. The frame supports both ends of each unit mask, each unit mask applying a tensile force in a first direction. The frame includes a frame main body part forming an opening exposing the unit mask, and a first through hole formed by passing through the frame main body part.

Abstract: A vapor deposition mask includes a metal mask and a resin mask having an opening. An inner wall surface for composing the opening has an inflection point in a thicknesswise cross section of the resin mask. When an intersection of a first surface, not facing the metal mask, of the resin mask and the inner wall surface is set to be a first intersection, an intersection of a second surface, facing the metal mask, of the resin mask and the inner wall surface is set to be a second intersection, and there is set a first inflection point first positioned from the first intersection toward the second intersection, an angle formed by a line connecting the first intersection and the first inflection point and the first surface is larger than an angle formed by a line connecting the first inflection point and the second intersection and the second surface.

Abstract: In a method for stretching a vapor deposition mask including a metal mask in which a slit is formed and a resin mask in which an opening corresponding to a pattern to be produced by vapor deposition is formed at a position overlapping with the slit, a stretching assistance member is overlapped on one surface of the vapor deposition mask, the stretching assistance member is fixed to the vapor deposition mask in at least part of a portion in which the one surface of the vapor deposition mask and the stretching assistance member overlap with each other, and the vapor deposition mask fixed to the stretching assistance member is stretched by pulling the stretching assistance member fixed to the vapor deposition mask.

Abstract: A mask manufacturing apparatus includes a laser irradiator, a stage, a frame, and a heat spreader sheet. The laser irradiator divides a laser beam into a plurality of sub-laser beams and irradiates the sub-laser beams to a shadow mask material which is placed over a stage. The frame is disposed over the stage to support the shadow mask material. The heat spreader sheet makes contact with the shadow mask material, absorbs heat generated from the shadow mask material, and dissipates the heat to surroundings of the shadow mask material. Accordingly, the shadow mask material is protected from overheating.

Abstract: Mask carriers and mask alignment in vacuum deposition processes, mask handling modules, and methods for aligning a mask. A mask handling module can include a substrate carrier for carrying at least one substrate; a mask carrier for carrying at least two masks. The mask carrier can include at least two mask carrier sections each being adapted to carry a mask and a mask carrier positioning device for moving the mask carrier relative to the substrate carrier. The mask carrier sections are arranged so that the masks carried on the mask carrier sections can be positioned on the mask carrier in respective planes forming an angle with respect to each other so that only one of the at least two masks can be aligned to one of the at least one substrates.

Abstract: A system to install a mask onto a component of a gas turbine engine includes a drive movable along an axis with respect to a movable base.

Abstract: Provided is a heat treatment apparatus that can form films having a uniform thickness on a plurality of substrates. The heat treatment apparatus comprises a process chamber configured to grow silicon carbide (SiC) films on wafers, a boat configured to hold a plurality of wafers in a state where the wafers are vertically arranged and approximately horizontally oriented so as to hold the wafers in the process chamber, a heating unit installed in the process chamber, and a gas supply nozzle configured to supply a reaction gas. The heating unit comprises a susceptor configured to cover at least a part of the boat, and a susceptor wall disposed between the boat and the susceptor.

Abstract: A thin-film depositing apparatus including a mask, and a chucking unit for adhering the mask to a surface of a substrate, wherein the chucking unit includes a plurality of magnet units that contact another surface of the substrate by independently rising or falling by using their weight and thus are magnetically combined with the mask.

Abstract: A mask holding device has a replaceable magnetic means, and a deposition apparatus for an organic light emitting device includes the mask holding device. The mask holding device is provided with magnets, and the magnets can be replaced as required so as to change the magnetic force of the mask holding device.