Abstract: In one embodiment, the invention is directed to aperture mask deposition techniques using aperture mask patterns formed in one or more elongated webs of flexible film. The techniques involve sequentially depositing material through mask patterns formed in the film to define layers, or portions of layers, of the circuit. A deposition substrate can also be formed from an elongated web, and the deposition substrate web can be fed through a series of deposition stations. Each deposition station may have an elongated web formed with aperture mask patterns. The elongated web of mask patterns feeds in a direction perpendicular to the deposition substrate web. In this manner, the circuit creation process can be performed in-line. Moreover, the process can be automated to reduce human error and increase throughput.

Abstract: A magnetic dipole ring assembly positioned inside a vacuum chamber and around a wafer being sputter deposited with a ferromagnetic material such as NiFe or other magnetic materials so that the material is deposited with a predetermined magnetization direction in the plane of the wafer. The magnetic dipole ring may include 8 or more arc-shaped magnet segments arranged in a circle with the respective magnetization directions precessing by 720° around the ring. The dipole ring is preferably encapsulated in a vacuum-tight stainless steel carrier and placed inside the vacuum chamber. The carrier may be detachably mounted on a cover ring, on the shield, or on the interior of the chamber sidewall. In another embodiment, the magnet is a magnetic disk placed under the wafer. Such auxiliary magnets allow the magnetron sputter deposition of aligned magnetic layers.

Abstract: To generate an especially good heat transfer between a seating face of a storage plate support and a storage plate, during coating with a sputter source in a vacuum installation, the seating face of the storage plate support is slightly annularly convexly arched and the storage plate is clamped in the center as well as on its outer margin by a center mask and an outer mask against the arched seating face. Hereby an especially good heat transfer is attained with very low arching d, whereby the storage plate is treated gently and simultaneously, during the coating process, no layer thickness distribution problems occur through arching that is too large.

Abstract: A device for coating a film with more than two kinds of thickness, including a turntable, a mask and a coating source. The turntable spins regularly. The shape of the mask depends on the thickness of the film and the mask is set close to the substrate. The coating source is set opposite to the turntable, and the mask is set between the coating source and the turntable. The invention also discloses a method for coating a film with more than two kinds of thickness. The method including setting a substrate on a turntable that spins regularly, setting a mask close to the substrate and coating a film on the substrate by a coating source.

Abstract: A system (10) produces patterned deposition on a substrate (14) from supercritical fluids. A delivery system (12) cooperates with a partial enclosure environment (30, 100, 200) retaining a movable substrate (14) for receiving precipitated functional material (44) along a fluid delivery path (13) from the delivery system (12). A shadow mask (22) is arranged in close proximity to the movable substrate (14) for forming the patterned deposition on the movable substrate (14).

Abstract: A mask assembly includes a frame and at least one linear element secured onto the frame. The linear elements define a masking part. The masking part has at least one opening. The openings are made by removing predetermined linear elements from those secured to the frame.

Abstract: A method includes a step of attracting a glass substrate 20 that is a subject for deposition using the electrostatic attraction of a stage 1, a step of aligning the attracted glass substrate with a deposition mask 2, and a step of evaporating an organic compound that is a deposition material, used for forming electroluminescent elements so as to deposit the compound on the glass substrate 20. An electrostatic chucking function is provided to the deposition mask according to needs, whereby the adhesion is enhanced.

Abstract: A system for marking the different sides of a substrate so that the different sides can be identified is disclosed. A substrate holder is used for marking a substrate during the film growth process so that the different sides of the substrate can be distinguished includes a set of fingers having a groove for holding the substrate. The fingers extend over a surface of the substrate for shielding incoming material being deposited onto the surface of the substrate leaving a portion of the surface uncovered. The fingers are positioned asymmetrically. The fingers include a first finger, a second finger, and a third finger, with a distance between said first finger and said second finger is less than the distance between said first finger and said third finger and is less than the distance between said second finger and said third finger.

Abstract: An alignment device for permitting a deposition mask having a plurality of magnetic mask segments to be positioned relative to a substrate to facilitate simultaneous deposition of organic material on to the substrate which will be part of an organic light emitting device.

Abstract: The invention in one embodiment is realized in a plasma reactor for processing a semiconductor workpiece. The reactor includes a vacuum chamber having a side wall and a ceiling, a workpiece support pedestal within the chamber and generally facing the ceiling, a gas inlet capable of supplying a process gas into the chamber and a solenoidal interleaved parallel conductor coil antenna overlying the ceiling and including a first plurality conductors wound about an axis of symmetry generally perpendicular to the ceiling in respective concentric helical solenoids of at least nearly uniform lateral displacements from the axis of symmetry, each helical solenoid being offset from the other helical solenoids in a direction parallel to the axis of symmetry. An RF plasma source power supply is connected across each of the plural conductors.

Abstract: An apparatus and method for performing uniform gas flow in a processing chamber is provided. In one embodiment, an apparatus is an edge ring that includes an annular body having an annular seal projecting therefrom is provided. The seal is coupled to a side of the annular body opposite a side adapted to seat on the substrate support. In another embodiment, a processing system is provided that includes a chamber body, a lid, a substrate support and a plurality of flow control orifices. The lid is disposed on the chamber body and defining an interior volume therewith. The substrate support is disposed in the interior volume and at least partially defines a processing region with the lid. The flow control orifices are disposed between the substrate support and the lid. The flow control orifices are adapted to control flow of gases exiting the processing region.

Abstract: A new and improved, self-aligning mark shield for PVD chambers. The mark shield of the present invention comprises an annular body having a retainer flange for engaging and retaining a substrate on a substrate support of a process chamber. An annular locating pin is provided on the bottom surface of the body for engaging the substrate support and preventing excessive X- and Y-axis movement of the substrate on the substrate support. The mark shield obviates the need for a standard ceramic isolation assembly to maintain the mark shield in position in the chamber.

Abstract: One embodiment relates to an apparatus for sputtering material onto a workpiece, the apparatus including a vacuum chamber and a target disposed in the vacuum chamber, the target comprising a material to be deposited onto said workpiece. The apparatus also includes a holder for the workpiece and at least one recyclable process kit component positioned to accumulate material sputtered from the target. The process kit component includes a base metal layer including titanium and an outer layer of titanium nitride. The titanium nitride layer acts as an etch stop during recycling of the process kit component. The process kit component may include a part selected from the group of a shield, pedestal, shutter, coil, collimator, deposition ring, cover ring, and clamp ring.

Abstract: A system and method for manufacturing thin-film structures disposed on a substrate. The thin-film structures have different respective thicknesses that vary along a radius of the substrate. A substrate rotates about an axis of rotation and a source of deposited material is directed at the rotating substrate. A mask having a stepped profile is positioned between the rotating substrate and the source. The stepped mask selectively blocks material emanating from the source from reaching the substrate. Each step of the profile of the mask corresponds to one of the respective thicknesses of the thin-film structures. The radius along which the different respective thicknesses of the film-thin structures vary is measured from the axis of rotation of the rotating substrate, and the substrate includes at least one wafer having a center that is either coincident or offset from the axis of rotation.

Abstract: A laser correction apparatus irradiates a laser upward onto a defect on a photomask formed on the bottom surface thereof. The particles generated by the laser irradiation is removed by blowing a gas to the space between the bottom surface of the substrate and a window port. The window port has a top flat surface having a central opening and an inner wall having a top portion of a funnel shape and a bottom portion of a cylindrical shape. The gas introduced to the space passes the central opening, forms a spiral flow while increasing the diameter thereof, and is exhausted from gas outlet ports formed on the cylindrical portion.

Abstract: An alignment mark shielding ring for use in a physical vapor deposition chamber and a method for using the ring to avoid arcing problems on the wafer. The alignment mark shielding ring can be constructed of a ring that has a generally L-shaped cross-section, at least one hood portion to function as the shield for the alignment mark, at least one alignment pin for engaging at least one alignment sleeve mounted in a lower chamber shield for holding the alignment mark shielding ring in place. The alignment sleeve is constructed in two halves, each having an aperture therethrough. The aperture in the top half is larger than the aperture in the bottom half such that even when the apertures are coated with a metal layer deposited in the PVD process, the alignment pin does not electrically short to the lower chamber shield and thus, any possibility of arcing is avoided.

Abstract: A device to fix a substrate for a thin film sputter, includes a mask, a mask pressing plate, a magnetic body, and a driving unit. The mask having patterns is positioned under the substrate so as to form the patterns on the substrate. The mask pressing plate is positioned over the substrate and moves toward and contacts a back surface of the substrate at a predetermined pressure. The magnetic body is placed over the mask pressing plate and moves toward the mask pressing plate so as to have the mask adhere closely to the substrate by a magnetic force of the magnetic body. The driving unit applies a driving force to move the magnetic body. Where the mask pressing plate descends, the mask pressing plate adheres closely to the substrate. Thereafter, the magnetic body descends toward the back surface of the substrate which is supported by the mask pressing plate. The mask underneath the substrate adheres closely to a front surface of the substrate by the magnetic force of the magnetic body.

Abstract: An apparatus and a method for self-aligning a cover ring onto a wafer pedestal in a physical vapor deposition chamber are described. The apparatus for self-aligning a cover ring to a wafer pedestal includes a wafer pedestal in the shape of a circular disk equipped on an outer periphery of the disk at least two, and preferably four, male alignment members such as protruding tabs; and a cover ring of annular shape that has an inwardly, horizontally extending lip and at least one downwardly, vertically extending lip equipped on an inner periphery at least two, and preferably four, female alignment members such as recessed slots that are adapted for receiving the at least two male alignment members when the wafer pedestal is raised to engage the cover ring.

Abstract: A replaceable shielding apparatus provides a cost effective way of shielding a portion of a workpiece during processing. The apparatus includes a replaceable shield, made of comparable weight as the workpiece for allowing replacement of the shield in the same way as the replacement of the workpiece. With this feature, the replacement of the shield is a routine process and would not interfere much with the workpiece operation. The invention further includes a shield clamp for clamping the shield onto the workpiece. In a preferred embodiment, the invention further includes a non-reactive gas inlet for creating a pressurized cavity in the vicinity of the shielded portion of the workpiece.

Abstract: Shadow mask, flat display fabricated by using the same, and method for fabricating the flat display, the shadow mask including a substrate, a plurality of via holes formed in the substrate on a plurality of tows, inclusive of first via holes on odd numbered rows, and second via holes on even numbered rows, wherein the first via holes are arranged to straddle the second via holes, and bridges formed between the first via holes, and between the second via holes, thereby improving an aperture.

Abstract: A method and apparatus for fabricating a wafer spacing mask and a substrate support chuck. Such apparatus is a stencil containing a plurality of dual counterbored apertures that is positioned atop the substrate support chuck while material is deposited onto the stencil and through the apertures' openings onto the chuck. Upon completion of the deposition process, the stencil is removed from the workpiece support chuck leaving deposits of the material of various widths but the same heights to form the wafer spacing mask.

Abstract: Aperture masks and deposition techniques for using aperture masks are described. In addition, techniques for creating aperture masks and other techniques for using the aperture masks are described. The various techniques can be particularly useful in creating circuit elements for electronic displays and low-cost integrated circuits such as radio frequency identification (RFID) circuits. In addition, the techniques can be advantageous in the fabrication of integrated circuits incorporating organic semiconductors, which typically are not compatible with wet processes.

Abstract: An alignment device for permitting a deposition mask having a plurality of mask segments to be positioned relative to a substrate to facilitate simultaneous deposition of organic material on to the substrate which will be part of an organic light emitting device.

Abstract: The invention relates to a method for producing a marking device (1), according to which a coding coating is applied to the surface of a support (2). The coding coating comprises at least one magnetic base layer (3), at least one magnetic coding layer (5) and a non-magnetic intermediate layer (4) placed therebetween. Said intermediate layer is composed in such a way that areas of non-parallel or anti-parallel magnetic coupling occur. The invention is characterized in that zones on the surface of the support (2) are roughened, before the coding coating is applied. The invention also relates to apparatus for carrying out said method.

Abstract: A protective package comprises an enclosure including a back plate that has a base, a top, a first sidewall and a second sidewall mounted thereon to form a cavity including an opening opposite the back plate. A plurality of filament positioning frames occupy the cavity to provide an organized distribution. Each of the filament positioning frames comprises a filament container having a filament clamp, in spaced-apart relationship from the filament container for gripping a plurality of filaments providing a plurality of filament tips extending from each filament clamp. Each of the filament positioning frames further comprises a frame between the filament container and the filament clamp. The frame has a first frame member parallel to a second frame member attached to the filament clamp with each of the plurality of filament tips located adjacent to the opening.

Abstract: A replaceable shielding apparatus provides a cost effective way of shielding a portion of a workpiece during processing. The apparatus includes a replaceable shield, made of comparable weight as the workpiece for allowing replacement of the shield in the same way as the replacement of the workpiece. With this feature, the replacement of the shield is a routine process and would not interfere much with the workpiece operation. The invention further includes a shield clamp for clamping the shield onto the workpiece. In a preferred embodiment, the invention further includes a non-reactive gas inlet for creating a pressurized cavity in the vicinity of the shielded portion of the workpiece.

Abstract: An alignment device for permitting a deposition mask to be positioned relative to a substrate to facilitate deposition of organic material on to the substrate which will be part of an organic light emitting device, including a base having a first set of alignment pins and a second set of alignment pins; a plate secured to the base; a frame having an opening aligned with the plate, the frame being formed with a first set of alignment pin receiving holes corresponding to the position of the first set of pins so that the frame is removably mounted to the base; the deposition mask and positioned on the plate; a transparent flat plate contacting the second set of pins and the deposition mask and being sized to expose portions of the deposition mask; and securing the exposed portions of the deposition mask to the frame.

Abstract: The present invention discloses a vacuum evaporation apparatus comprising a vacuum pump, an evaporation chamber and a power supply. The evaporation chamber comprises a substrate, an evaporation source and an evaporation mask. The evaporation mask exhibits a coefficient of thermal expansion substantially equal to the substrate, and the evaporation mask has a pattern of metal tracks. Thus, the apparatus of the present invention also can be applied to form solder bumps on a large sized silicon wafer. Moreover, the position pattern of the mask is formed by an anisotropic etching process; the diameter of the pattern will not be influenced by the thickness of the mask. Therefore, the tendency of the solder bumps with the smaller size and the pitch are met.

Abstract: A plasma processing chamber includes a substrate holder and a member of silicon carbide such as a liner, focus ring, perforated baffle or a gas distribution plate, the member having an exposed surface adjacent the substrate holder and the exposed surface being effective to minimize contamination during processing of substrates. The chamber can include an antenna which inductively couples RF energy through the gas distribution plate to energize process gas into a plasma state.

Abstract: A replaceable shielding apparatus provides a cost effective way of shielding a portion of a workpiece during processing. The apparatus includes a replaceable shield, made of comparable weight as the workpiece for allowing replacement of the shield in the same way as the replacement of the workpiece. With this feature, the replacement of the shield is a routine process and would not interfere much with the workpiece operation. The invention further includes a shield clamp for clamping the shield onto the workpiece. In a preferred embodiment, the invention further includes a non-reactive gas inlet for creating a pressurized cavity in the vicinity of the shielded portion of the workpiece.

Abstract: Apparatus and method to facilitate vapor phase coating of turbine airfoils. A dovetail receptacle receives the dovetails of a plurality of airfoils. The airfoils are separated by spacers with the airfoil dovetails sealed in a chamber of the receptacle to facilitate vapor phase coating of airfoil flowpath surfaces and platform upper surfaces of several airfoils simultaneously while masking the dovetail sections.

Abstract: A system and method for manufacturing thin-film structures disposed on a substrate. The thin-film structures have different respective thicknesses that vary along a radius of the substrate. A substrate rotates about an axis of rotation and a source of deposited material is directed at the rotating substrate. A mask having a stepped profile is positioned between the rotating substrate and the source. The stepped mask selectively blocks material emanating from the source from reaching the substrate. Each step of the profile of the mask corresponds to one of the respective thicknesses of the thin-film structures. The radius along which the different respective thicknesses of the film-thin structures vary is measured from the axis of rotation of the rotating substrate.

Abstract: A method and apparatus for improving etch uniformity in reticle etching by eliminating local effects at the edge of the reticle is disclosed. The present invention relates to a reticle frame which surrounds the reticle. The reticle frames are patterned with a pattern profile similar to that of the reticle to prevent edge uniformities of the reticle by allowing uniform plasma etching of the entire reticle surface. The reticle frames may also be used to move the reticle in and out of etch chambers without damaging them.

Abstract: The present invention relates to an improved tool for holding at least one turbine blade having a platform during the application of a coating to underplatform areas of the at least one turbine blade. The tool includes at least one fixture for holding the at least one turbine bladed during the coating application. The at least one fixture has a base receptacle for receiving the at least one turbine blade and a cover for the base receptacle. Each of the base receptacle and the cover has an opening which corresponds in shape to each of the underplatform areas to be coated.

Abstract: A distribution mask including at least two separate blanking panels (22), one of which is mounted mobile. The two blanking panels (22) are substantially coplanar, and, controlled by a common control unit (23), both mounted continuously mobile between two extreme positions, namely, a close position, and for which the space (E) between them is minimal, and a spaced position, for which the space (E) is on the contrary at its maximum. The invention is particularly applicable to antiglare treatment of ophthalmic lenses.

Abstract: A gas turbine airfoil has an external surface and an internal passage therethrough. The internal passage is selectively coated by providing a source of a flowable precursor coating material in contact with the internal passage of the airfoil, and providing a coating prevention structure overlying at least a portion of the external surface. The flowable precursor coating material is flowed from the source of the flowable precursor coating material and through the internal passage of the airfoil. The coating prevention structure prevents contact of the flowable precursor coating material with the external surface of the airfoil.

Abstract: A method of forming a multi-layer structure over an insulating layer comprises the steps of: selectively depositing a barrier layer on a predetermined region of an insulating layer by use of a first deposition mask; selectively depositing a metal seed layer made of a metal which is different in substance from the barrier layer by use of a second deposition mask, so that the metal seed layer extends not only on an entire surface of the barrier layer but also a peripheral region positioned outside the predetermined region of the insulating layer; and forming a metal plating layer made of the metal as the seed layer, so that the metal layer is adhered on the metal seed layer whereby the metal plating layer is separated from the barrier layer and also from the insulating layer.

Abstract: A method and apparatus for fabricating a wafer spacing mask on a workpiece support chuck. Such apparatus is a central body containing a plurality of apertures that is positioned atop the workpiece support chuck and an outer ring shaped body positioned on a flange of the workpiece support chuck while material is deposited onto the apparatus and through the apertures onto chuck. Upon completion of the deposition process, the central body and ring shaped body are removed from the workpiece support chuck leaving deposits of the material to form the wafer spacing mask.

Abstract: A fixture for selectively masking a turbine blade 60 includes a locator 10 with a separable receptacle 40 having portals 50. Guide bars 18 extend from the locator for guiding a pair of shield carriers 20 between deployed and retracted positions. Each shield carrier has a shield 26 projecting therefrom. In use, a turbine blade 60, whose root 70 includes a fir tree attachment 72 and a damper pocket 74, is mounted on the fixture so that the receptacle embraces the blade root. The shield carriers are translated along the guide bars until the shields penetrate through the portals and into the receptacle thus segregating the attachment 72 from the damper pocket 74. Masking powder 84 is then compressed into the receptacle to envelop the attachment while leaving the damper pocket unmasked.

Abstract: A process of producing relatively large, dense, free-standing silicon carbide articles by chemical vapor deposition is enabled by the provision of specially designed isolation devices. These devices segregate silicon carbide deposits on the intended portions of substrates, thereby alleviating the need to fracture heavy silicon carbide deposits in order to remove, or otherwise move, the substrate, with the heavy deposit thereon, from the deposition furnace. The isolation devices enable the use of more efficient vertically extended vacuum furnaces. The isolation devices also enable the commercial production of relatively dense, large, thin-walled, silicon carbide shells.

Abstract: A method of using a monitor wafer to monitor the shielding of alignment marks during material deposition steps. The alignment marks are shielded using shielding tabs attached to the clamp ring used to clamp the wafer during deposition of a layer of material. An oxide monitor wafer, having the same size and shape of product wafers, has monitor marks formed thereon. The center of the monitor marks has the same location on the monitor wafer as the alignment marks have on the product wafers. The monitor wafer is subjected to the same processing steps as the product wafers through the step of material deposition. The clamp ring is removed from the monitor wafer and the distance from the center of the monitor marks and the edge of the deposited material is determined. The monitor marks are formed so that the distance from the center of the monitor marks and the edge of the deposited material can be determined by direct observation of the monitor marks.

Abstract: A substrate handling system auxiliary to a plasma sputtering system is described. The substrate handling system inserts an unprocessed substrate (e.g., an optical disk), an inner mask, and an outer mask into a loadlock of the sputtering system, and then seals the access opening to the loadlock. The substrate and the masks then are moved to a sputtering chamber where the substrate is coated by sputtering. Subsequently, the substrate handling system moves a processed substrate, and its accompanying inner mask and an outer mask, from the loadlock to an external disk change station, where the processed substrate is removed from the masks, which are still gripped by the substrate handling system. Subsequently, another unprocessed disk is placed on the inner mask and within the outer mask, and the sequence repeats. The substrate handling system only contacts the masks on surfaces thereof that are not subjected to direct sputter deposition, so that the masks can be gripped without causing particulate contamination.

Abstract: A method and apparatus for fabricating a wafer spacing mask on a workpiece support chuck. Such apparatus is a central body containing a plurality of apertures that is positioned atop the workpiece support chuck and an outer ring shaped body positioned on a flange of the workpiece support chuck while material is deposited onto the apparatus and through the apertures onto chuck. Upon completion of the deposition process, the central body and ring shaped body are removed from the workpiece support chuck leaving deposits of the material to form the wafer spacing mask.

Abstract: An apparatus for forming a film having high uniformity in its film thickness distribution is provided. An evaporation source is used in which an evaporation cell, or a plurality of evaporation cells, having a longitudinal direction is formed, and by moving the evaporation source in a direction perpendicular to the longitudinal direction of the evaporation source, a thin film is deposited on a substrate. By making the evaporation source longer, the uniformity of the film thickness distribution in the longitudinal direction is increased. The evaporation source is moved, film formation is performed over the entire substrate, and therefore the uniformity of the film thickness distribution over the entire substrate can be increased.

Abstract: The holding unit of a vacuum machining device is capable of preventing a work piece from being excessively heated and capable of stably machining the work piece. The holding unit comprises: a holder for holding a work piece; a pressing member for pinching the work piece with the holder; and a heat insulating member being provided to the holder, the heat insulating member contacting the work piece to restrict heat conduction thereto.

Abstract: A method and apparatus for fabricating a wafer spacing mask on a substrate support chuck. Such apparatus is a stencil containing a plurality of apertures and at least one high aspect ratio opening that is positioned atop the substrate support chuck while material is deposited onto the stencil and through the apertures and high aspect ratio openings onto the chuck. Upon completion of the deposition process, the stencil is removed from the workpiece support chuck leaving deposits of the material of various widths but the same heights to form the wafer spacing mask.

Abstract: A mark shielding ring for use in a physical vapor deposition chamber and a method for using such ring are disclosed. The mark shielding ring may be suitably used for shielding alignment marks or any other marks provided on the top surface of a wafer along a peripheral region. The novel mark shielding ring includes an alignment means for mechanically joining a shielding ring to a wafer pedestal on which the ring is positioned. Any up-and-down motion of the wafer pedestal therefore does not change the alignment between the shielding ring and the pedestal and therefore the function of the shielding ring for protecting an alignment mark can be insured.

Abstract: A clamping ring design that eliminates the Wafer sticking problem. In the first embodiment of the present invention the wafer clamp ring is redesigned to sharply reduce the wafer to wafer-ring contact area. In the second embodiment of the present invention a clamp ring guide is added to prolong the lifetime of the clamp ring.

Abstract: The invention relates to apparatus for use in the coating of surfaces of substrates by Physical Vapor Deposition systems (PVD) wherein the deposition in material is applied onto the said surfaces by the sputtering of the same using the PVD system. The invention provides means for preventing sputtering material from applying or landing onto surfaces other than which is desired to be coated in the said coating process. The masking means allow the prevention and/or removal of such material which is known as backscattered material and the invention described claims protection for several embodiments and methods of achieving this thereby improving subsequent adhesion propertied and optical quantities, if applicable, of the coating.

Abstract: Cr(CO).sub.6 gas is fed into a chamber, in which a photomask substrate having any clear deflect resulting from partial loss of a light-shielding film to fill the inside of the chamber with a Cr(CO).sub.6 gas atmosphere. By irradiating with a laser beam the clear defect of the photomask substrate in the Cr(CO).sub.6 gas atmosphere, the Cr(CO).sub.6 gas is decomposed to form a Cr film over the clear defect. Tetrakis dimethylamino titanium gas (TDMAT) is fed into the chamber to switch the atmosphere in the chamber to a TDMAT gas atmosphere. By irradiating with a laser beam the area of the photomask substrate, arranged in the TDMAT gas atmosphere, where the Cr film has been formed, the TDMAT gas is decomposed to form a TiN film, whose reflectance is smaller than that of the Cr film, over the Cr film.