Abstract: A system and a method for self-aligned dual patterning are described. The system includes a platform for supporting a plurality of process chambers. An etch process chamber coupled to the platform. An ultra-violet radiation photo-resist curing process chamber is also coupled to the platform.

Abstract: A method of aligning an OLED substrate with a shadow mask includes forming a shadow mask with at least three spaced alignment openings, providing a precision alignment element into each of the alignment openings, and positioning the OLED substrate so that the edges of the OLED substrate engage the precision alignment elements and thereby align the shadow mask with the OLED substrate.

Abstract: An organic thin film deposition device that is compact and high in processing capability is provided. Inside a vacuum chamber, first and second substrate arrangement devices that can be in a horizontal posture and a standing posture are provided; and when in the standing posture, substrates held by the respective substrate arrangement devices and first and second organic vapor discharging devices face each other. When one of the substrate arrangement devices is in the horizontal posture, masks and the substrates are lifted up by alignment pins and transfer pins and are replaced with a substrate not yet film formed, for position adjustment. With one organic thin film deposition device, two substrates can be processed at the same time.

Abstract: A mask assembly for thin film vapor deposition of a flat panel display is disclosed. In the mask assembly, a cleansing solution remaining in the gap between a unit mask and a frame after cleansing the mask assembly may be minimized. The mask assembly includes a frame and a plurality of unit masks. The frame includes a pair of first supporting portions and a pair of second supporting portions that surround an opening. The plurality of unit masks have at least one set of pattern openings, and the unit masks are fixed on the first supporting portion while having a tensile force applied thereto. The first supporting portion includes a first surface and a second surface. The unit masks are fixed on the first surface, and the second surface has a height difference to the first surface along a thickness direction of the unit masks from the first surface.

Abstract: Provided is a method of manufacturing an organic electroluminescence display device including an emission region, the emission region including multiple organic compound layers arranged therein, each of the organic compound layers being provided between a pair of electrodes and including at least an emission layer, the method including: forming in the entire emission region an organic compound layer which is insoluble in water; forming on the organic compound layer a mask layer containing a water-soluble material in a predetermined pattern; removing a part of the organic compound layer which is formed in a region which is not covered with the mask layer; removing the mask layer; drying the organic compound layer; and forming a common layer on the organic compound layers, in which the steps from the drying of the organic compound layer to the forming of a common layer are carried out in a vacuum.

Abstract: A film formation method is disclosed for depositing a metal film on a target substrate by supplying a metal carbonyl source in gas phase to a surface of the target substrate and decomposing the source near the surface of the target substrate. The method includes a step of preferentially decomposing the metal carbonyl source in an area near the outer peripheral portion of the target substrate when the metal film is being deposited on the surface of the target substrate. As a result, a CO concentration in the atmosphere is increased locally near the outer peripheral portion of the target substrate and the depositing of the metal film on the outer peripheral portion is better controlled.

Abstract: A deposition mask for depositing a thin film and a method for fabricating the same are disclosed. The deposition mask is configured to ensure a positioning accuracy and a pattern size accuracy and is suitable for use in manufacturing a high definition display device. The deposition mask includes at least one pattern mask having the same patterns as the patterns that are to be formed on a substrate and a frame mask which has at least one opening. The pattern mask is individually and non-detachably fixed to the frame mask at a region of the frame mask corresponding to the opening.

Abstract: There is provided a vacuum film deposition apparatus which forms a film on a substrate by a vacuum film deposition technique, include: substrate holding means for holding the substrate; a deposition preventing member for preventing film deposition at undesired positions within the apparatus; and contacting means for bringing the substrate or the substrate holding means and the deposition preventing member into contact with each other.

Abstract: A mask holding device has a replaceable magnetic means, and a deposition apparatus for an organic light emitting device includes the mask holding device. The mask holding device is provided with magnets, and the magnets can be replaced as required so as to change the magnetic force of the mask holding device.

Abstract: An inertial masking assembly that allows multiple thin film structures to be deposited on a single substrate by rotation of a shadow mask relative to the substrate. The assembly rotates the position of the shadow mask by the conservation of momentum. The substrate is seated on means for rotating the substrate in a confined orbit within the mask. Abruptly changing the angular velocity of the mask causes the mask to rotate under the substrate, which is mediated by a combination of friction and the substrate's inertia.

Abstract: An organic EL device manufacturing method includes a step of supplying a substrate, and while moving the substrate with a non-electrode-layer side thereof in contact with a surface of a can roller, the non-electrode-layer provided with no electrode layer, discharging a material from a nozzle of a vapor deposition source to form an organic layer on an electrode-layer side of the substrate, the electrode-layer side provided with an electrode layer. The vapor deposition step includes supplying a shadow mask including an opening portion to interpose the shadow mask between the substrate contacting the can roller, and the nozzle; and forming the organic layer corresponding to the opening portion on the electrode-layer side of the substrate while moving the substrate and the shadow mask with through holes included at each of the substrate and the shadow mask engaged with projections included in the can roller.

Abstract: In one embodiment the disclosure relates to an apparatus for depositing an organic material on a substrate, including a source heater for heating organic particles to form suspended organic particles; a transport stream for delivering the suspended organic particles to a discharge nozzle, the discharge nozzle having a plurality of micro-pores, the micro-pores providing a conduit for passage of the suspended organic particles; and a nozzle heater for pulsatingly heating the micro-pores nozzle to discharge the suspended organic particles from the discharge nozzle.

Abstract: A deposition apparatus including: a chamber; a mask assembly including a mask arranged to deposit a material on a substrate included in the chamber and a mask frame for supporting the mask; and a magnet unit including a first magnet unit which contacts (or adheres or chucks or secures) the mask assembly to the substrate by magnetic force; and a second magnet unit corresponding to the mask frame, in order to ensure that the mask more closely contacts the substrate.

Abstract: The configuration of one or more barrier layers for encapsulating a device is controlled by setting parameters of atomic layer deposition (ALD). A substrate formed with the device is placed on a susceptor and exposed to multiple cycles of source precursor gas and reactant precursor gas injected by reactors of a deposition device. By adjusting one or more of (i) the relative speed between the susceptor and the reactors, (ii) configuration of the reactors, and (iii) flow rates of the gases injected by the reactors, the configuration of the layers deposited on the device can be controlled. By controlling the configuration of the deposited layers, defects in the deposited layers can be prevented or reduced.

Abstract: A thin film deposition apparatus for performing continuous deposition, and a mask unit and a crucible unit that are included in the thin film deposition apparatus. A thin film deposition apparatus includes a moving unit configured to move a substrate as a deposition target; a mask unit configured to selectively pass vapor of a deposition source toward the substrate; and a crucible unit including a plurality of crucibles accommodating the deposition source and proceeding along a circulation path passing through the mask unit.

Abstract: In a mask assembly and a method of fabricating the same, when the mask assembly is fabricated by tensile welding a pattern mask to a mask frame, a tensile welding portion of the pattern mask welded to the mask frame is structurally changed. Thus, the pattern mask can be easily welded to the mask frame, and patterns of the pattern mask can be precisely aligned, thereby minimizing stain failure rate due to the mask assembly. The mask assembly includes: a mask frame including an opening and a support; and a pattern mask including a pattern portion having a plurality of patterns arranged in a matrix and a plurality of tensile welding portions extending from the pattern portion in a first direction and spaced apart from each other in a second direction perpendicular to the first direction.

Abstract: A methodology and system for applying coatings onto the interior surfaces of components, includes a vapor creation device, a vacuum chamber having a moderate gas pressure and an inert gas jet having controlled velocity and flow fields. The gas jet is created by a rarefied, inert gas supersonic expansion through a nozzle. By controlling the carrier gas flow into a region upstream of the nozzle an upstream pressure is achieved. The carrier gas flow and chamber pumping rate control the downstream pressure. The ratio of the upstream to downstream pressure along with the size and shape of the nozzle opening controls the speed of the gas entering the chamber. Vapor created from a source is transported into the interior regions of a component using binary collisions between the vapor and gas jet atoms. These collisions enable the vapor atoms to scatter onto the interior surfaces of the component and deposit.

Abstract: The invention discloses a method and an apparatus for production of series-connected thin-film solar cells on rigid substrates. A semi-finished product having a rigid mount substrate is arranged on a receptacle, and is introduced into a deposition chamber having a deposition device. Furthermore, a masking device having at least one masking means, which is in the form of a strand and is prestressed in the longitudinal direction, is applied to a surface of the semi-finished product facing the deposition device, wherein the masking means which is in the form of a strand preferably has a plurality of filaments which rest on one another. In order to structure a material layer to be deposited, the surface of the semi-finished product is partially shadowed by means of the masking device with respect to the deposition device.

Abstract: A method of forming a gate valve for use in a high vacuum environment of an electron gun by machining a core of non-magnetic nickel-chromium-molybdenum-iron-tungsten-silicon-carbon alloy that is weldable with nickel alloys and has a tensile strength of about 750 megapascals, machining a cladding of nickel-iron, welding the core to the cladding to form the gate valve, and machining the gate valve so as to remove any dimensional differences at an interface between the core and the cladding. In this manner, because the final mechanical tolerance is controlled by machining instead of part assembling, extremely high alignment accuracy is obtained. The final part provides field shielding as provided by the nickel alloy shell, low stray field provided by the non-magnetic alloy, good vacuum performance, and tight mechanical tolerance control.

Abstract: A CVD apparatus is provided that can remarkably improve the quality and productivity of susceptors without causing increase in production cost or increase in size of the apparatus. The CVD apparatus is for forming a SiC film on a surface of a carbonaceous substrate (10) except for a part thereof covered by a masking jig (7) by introducing a gas into the apparatus. The carbonaceous substrate (10) has a recessed mask portion (10a) formed in a portion of the carbonaceous substrate (10), and the masking jig (7) is fitted in the mask portion (10a). In the CVD apparatus, the masking jig (7) is secured to a film formation jig (2) so that the carbonaceous substrate (10) is supported by the film formation jig (2), and an angle formed by a main surface of the carbonaceous substrate (10) with respect to the vertical axis (9) is set to 2°.

Abstract: A wafer supporting device of a sputter apparatus includes a pedestal positioned in a sputtering chamber and used to load a wafer for sputtering, a deposition ring having a recess positioned on a peripheral portion of the pedestal, and a cover ring positioned on the pedestal and the deposition ring. The cover ring has a gate corresponding to the recess.

Abstract: A masking apparatus includes a mask base body and a mask plate. The mask base body includes at least one spacer plate, and a cavity in which an electronic component can be housed. The mask plate is disposed on an upper surface and/or a lower surface of the mask base body. The mask plate includes a film-forming opening with a shape corresponding to the shape of an external structural body to be formed on an outer surface of the component. The mask plate thus allows a film-forming operation to be selectively performed on the outer surface of the component through the film-forming opening. The cavity includes, in an inner surface thereof, a film-forming groove communicating with the film-forming opening so that the external structural body can be formed at once on an upper surface and/or a lower surface of, and also on a peripheral surface of the component.

Abstract: An apparatus for manufacturing an organic electroluminescence display having an alignment chamber for aligning a mask having openings corresponding to a predetermined pattern with a substrate on which a first electrode layer is formed and detachably attaching the mask and the substrate. The apparatus further including a number of vacuum processing chambers for sequentially forming a number of organic material layers on the substrate attached with the mask. The apparatus also including a transfer robot for transferring the attached mask and substrate to one of the number of vacuum processing chambers and sequentially transferring it between the number of the vacuum processing chambers.

Abstract: A shadow mask deposition system includes a plurality of identical shadow masks arranged in a number of stacks to form a like number of compound shadow masks, each of which is disposed in a deposition vacuum vessel along with a material deposition source. Materials from the material deposition sources are deposited on the substrate via openings in corresponding compound shadow masks, each opening being formed by the whole or partial alignment of apertures in the shadow masks forming the compound shadow mask, to form an array of electronic elements on the substrate.

Abstract: A process kit comprises a shield and ring assembly positioned about a substrate support in a processing chamber to reduce deposition of process deposits on internal chamber components and an overhang edge of the substrate. The shield comprises a cylindrical band having a top wall that surrounds a sputtering target and a bottom wall that surrounds the substrate support, a support ledge, a sloped step, and a U-shaped channel with gas conductance holes. The ring assembly comprises a deposition ring and cover ring, the cover ring having a bulb-shaped protuberance about the periphery of the ring.

Abstract: Improved techniques for forming a reflective layer of an optical disc are provided. One improvement includes forming the reflective layer over an information layer of the disc by utilizing a metallizer and a masking device having an angled lip configured to align to an outer edge of the information layer. The masking device allows the applied reflective layer to extend to the outer diameter edge of the information layer, and shields plasma generated by the metallizer from reaching internal components of the metallizer. The masking device may include a pusher having a spring mechanism attached to an inner masking portion of the masking device.

Abstract: Embodiments of the invention include a selective deposition method that allows for coating of selective portions of an object, such as an electronic device, and inhibits coating of other selective portions of the object, such as the electric contacts. The selective deposition method includes providing a web to transport the object through a deposition chamber. The web may include and reference mechanisms to register the object relative to the web. The method further includes providing deposition material and a shadow mask that has open spaces in it to inhibit coating selective portions of the object. The deposition material serves as the coating material.

Abstract: A film forming device includes a mask member that is made of silicon and has first openings of predetermined patterns; a magnetic member that is made of a magnetic material and has a second opening, and that is aligned with the mask member so that the first openings are arranged in the second opening in plan view of the second opening; and a substrate holding member that generates magnetic force between the magnetic member and itself in order to adhere the mask member and a substrate to each other. The mask member and the substrate are interposed between the magnetic member and the substrate holding member in this order from the magnetic member.

Abstract: A photoplate for manufacturing a deposition mask that is used to form a matrix of pixel areas used in a display panel. The photoplate comprises a layer of material such as quartz, on which a matrix of pixel etching areas is defined. The pixel etching areas are configured to form pixel areas having a specified separation from each other in a vertical direction. The pixel etching areas on the photoplate include an outer periphery having a generally rectangular shape with elongated corners.

Abstract: An evaporation source is disclosed. In one embodiment, the evaporation source includes: i) a crucible being open on one side thereof and configured to store a deposition material and ii) a nozzle section located on the open side of the crucible and comprising a plurality of nozzles, wherein each of the nozzles has a sidewall configured to spray the deposition material therethrough, wherein the side wall has an inclined portion. The evaporation source also includes i) a heater configured to heat the crucible and ii) a housing configured to accommodate the crucible, the nozzle section, and the heater, wherein the nozzle section has a maximum spray angle less than about 60°.

Abstract: A device for fabricating a mask by plasma etching a semiconductor substrate comprises a semiconductor substrate part of the area whereof is partially covered by a mask for protecting at least one area that must not be etched and for exposing at least one area including a pattern to be etched, a support for the substrate and means for generating a plasma in the form of a flow of ions toward the substrate. According to the invention the device further comprises means for confining the ions, including a conductive material screen disposed over the substrate and along the limit between the pattern area to be etched and the area not to be etched.

Abstract: An apparatus for manufacturing a thin film solar cell of the present invention includes a film forming chamber in which a film is formed on a film formation face of a substrate using a CVD method; an electrode unit including a cathode unit having cathodes to which voltages are to be applied arranged on both sides thereof, and a pair of anodes each of which is arranged to face a different one of the cathodes, at a separation distance therefrom; a mask for covering a peripheral edge portion of the substrate; and a discharge duct installed around the cathode unit. A film formation space is formed between the cathode unit and the substrate installed on the side of the anode, an evacuation passage is formed between the mask and the cathode unit, the discharge duct and the film formation space are connected together via the evacuation passage, and a film forming gas introduced into the film formation space is evacuated from the discharge duct through the evacuation passage.

Abstract: To provide a method of controlling film thickness of dielectric multilayer film, such as optical thin film, with high precision, an optical film thickness controlling apparatus and a dielectric multilayer film manufacturing apparatus that can control the film thickness based on the same method, and dielectric multilayer film manufactured using the controlling apparatus or manufacturing apparatus. An optical film thickness controlling apparatus includes a film formation device 15 having a rotatable substrate 23 and a sputtering target 28, a photodiode 16 that detects each of a plurality of monochromatic light beams applied to the rotatable substrate along a radius thereof at predetermined intervals, and an A/D converter 17, in which a movable shutter 29 that moves along the direction of the radius of the rotatable substrate 23 to shut off film formation on the substrate 23 is provided between the substrate 23 and the target 28.

Abstract: In a substrate processing apparatus for forming thin layers on a substrate used for an organic light emitting diode, the apparatus includes a mask attaching chamber, a deposition chamber and a mask detaching chamber. The mask attaching chamber, the deposition chamber and the mask detaching chamber are provided with a transferring guide installed thereinside, and a substrate supporter for supporting the substrate moves along the transferring guide in or between the chambers. Thus, a time for processing the substrate and an area for the apparatus may be reduced. Also, the chambers are grouped in one or more, and a gate valve is installed between the grouped chambers for opening and closing a path between the grouped chambers. Accordingly, the chambers may be continuously maintained in a vacuum state when any one of the chambers is repaired.

Abstract: A mask assembly, a deposition apparatus for flat panel displays including the same, and associated methods, the mask assembly including an open mask having a plurality of first openings, and a pattern mask coupled to the open mask, the pattern mask having a plurality of second openings disposed within an area bounded by the first openings, wherein the open mask is formed of a material having a thermal expansion coefficient that is lower than a thermal expansion coefficient of the pattern mask.

Abstract: A mask includes: a base plate having an opening; a chip having an aperture pattern positioned at the opening in the base plate; a plug detachably arranged to the base plate; and a joining member joining the chip and the plug.

Abstract: A thin film deposition apparatus includes an electrostatic chuck that fixes a substrate on which a deposition material is to be deposited; a blocking member disposed at a side of the substrate fixed on the electrostatic chuck and covering at least a portion of the substrate; and a deposition unit including a chamber and a thin film deposition assembly disposed in the chamber and to deposit a thin film on the substrate fixed on the electrostatic chuck.

Abstract: A method of cleaning off organic deposition material accumulated on a mask includes forming an organic deposition material pattern on a substrate using the mask, which includes a plurality of slots, in a deposition chamber including a deposition source; transporting the mask to a stock chamber that is maintained at a vacuum and adjacent to the deposition chamber; and partially cleaning off the organic deposition material accumulated along the boundaries of the slots of the mask in the stock chamber. A system to clean off an organic deposition material accumulated on a mask having a plurality of slots, includes a deposition chamber including a deposition source; and a stock chamber that is maintained at substantially the same vacuum as the deposition chamber and includes a cleaning device that cleans off the organic deposition material accumulated on the mask.

Abstract: A thin film deposition apparatus that can be simply applied to manufacture large-sized display devices on a mass scale and that improves manufacturing yield includes: a deposition source; a first nozzle disposed at a side of the deposition source and including a plurality of first slits arranged in a first direction; a second nozzle disposed opposite to the first nozzle and including a plurality of second slits arranged in the first direction; a barrier wall assembly including a plurality of barrier walls that are arranged in the first direction in order to partition a space between the first nozzle and the second nozzle; and an alignment member including an interval control member that adjusts an interval between the second nozzle and the substrate, and/or an alignment control member that adjusts alignment between the second nozzle and the substrate.

Abstract: An evaporation mask, a method of manufacturing an organic electroluminescent device using the evaporation mask, and an organic electroluminescent device manufactured by the method are provided. The evaporation mask is formed of a thin film and is drawn taut by application of tension. The evaporation mask includes at least one mask unit, the mask unit including a plurality of main apertures, and a plurality of first dummy apertures formed adjacent to outermost ones of the main apertures in a direction in which tension is applied to the evaporation mask.

Abstract: The invention relates to a method for selective material deposition for sensitive structures in micro systems technology for producing mechanical adjustment structures (6, 5) for a vapour penetration mask (8), the adjustment structures on the component disc (7) and the mask being created using the same structuring method. Complementary adjustment structures can be produced thereon with a very high degree of precision. KOH etching in silicon can be used in order to create equally inclined flanks (2, 2a) in a depression and a complementary protrusion.

Abstract: A system and method for depositing metallic coatings on substrates using a laser printer toner mask. A novel laser printer toner mask provides well-defined masked regions on the substrate and complementary unmasked regions. Metallic vapor from a source may be directed to a substrate with the novel mask adhered to a surface of the substrate where it condenses on the masked surface of the substrate. The mask may then be removed using any suitable technique including simply brushing the material off. Once the mask has been removed, a well-defined metallic coating remains on the unmasked regions of the substrate surface. The system and method may be used on flexible substrates such as those formed of plastic or polyester films.

Abstract: A shadow mask and an evaporation system incorporating the same. The shadow mask comprises at least one opening. The length and the width of the opening range from about 100 ?m to about 2000 ?m and from about 25 ?m to about 75 ?m, respectively.

Abstract: Provided is a mask which is used to form on the surface of a substrate a plurality of linear film members disposed in parallel to each other by fixing one surface of the mask to the substrate and supplying a film material through the other surface of the mask by the use of a vapor process. The mask includes: a mask body having a plurality of openings corresponding to patterns of the linear film members; and reinforcement ribs which are disposed to cross the openings and which have a function of preventing deformation of the mask body due to the weight thereof. Here, the reinforcement ribs are disposed close to the other surface of the mask in the thickness direction of the openings.

Abstract: A technology for organic material vapor deposition is provided, which can enhance efficiency in the evaporation material, prevent time-degradation of the evaporation material, and surely prevent any mask deformation by heat during vapor deposition. An organic material evaporation source including: a shower-plate shape emission part having a plurality of emission orifices arranged within a plane thereof; a feeding pipe provided inside the emission part for feeding the vapor of introduced organic evaporation material into the emission part via the blowout orifices by emitting the vapor toward the bottom part of the emission part; and a cooling means provided at least in a position on the emission orifice side of the emission part. The cooling means is formed by, for example, covering the entire emission part, and has vapor passage holes for allowing the organic evaporation material vapor to pass in positions corresponding to the emission orifice of the emission part.

Abstract: A mask assembly includes a mask frame, the mask frame having an opening and a frame surrounding the opening, a pattern mask on the mask frame, the pattern mask including a pattern portion having at least one pattern overlapping the opening and a welding portion attached to the frame, and at least one support bar crossing the opening and attached to the pattern mask.

Abstract: A mask includes a substrate which includes a front side and a back side and is provided with through-holes; and a film which adjusts a shape of the substrate provided above at least one of the front side and the back side of the substrate. A method of manufacturing a mask includes the steps of: providing a substrate having a front side and a back side; forming a film which adjusts a shape of the substrate above at least one of the front side and the back side of the substrate; and drilling through-holes in the substrate.

Abstract: A method of manufacturing a light emitting device of upward emission type and a thin film forming apparatus used in the method are provided. A plurality of film forming chambers are connected to a first transferring chamber. The plural film forming chambers include a metal material evaporation chamber, an EL layer forming chamber, a sputtering chamber, a CVD chamber, and a sealing chamber. By using this thin film forming apparatus, an upward emission type EL element can be fabricated without exposing the element to the outside air. As a result, a highly reliable light emitting device is obtained.

Abstract: Plasma treatment apparatus and method for treatment of a surface of a substrate. A dielectric barrier discharge electrode structure is provided having a treatment space (5) and comprising a first electrode (2) and a second electrode (3), and a power supply (11) connected to the first electrode (2) and the second electrode (3) for generating an atmospheric pressure plasma in the treatment space (5). The plasma treatment apparatus further comprises a magnetic layer (6) provided on a surface of at least the first electrode (2). The first electrode (2) is arranged to receive, in operation, the substrate (1) to be treated and a mask device (7) in contact with the substrate (1), the mask device (7) interacting with the magnetic layer (6).

Abstract: A component of a disc drive has a coating of a predetermined length on its surface, the coating having at least two separate tapered regions applied in independent steps, the at least two separate tapered regions each having a length that is less than the predetermined length of the component surface. When the component is a shaft of a spindle motor, the ends of the shaft are masked before the tapered regions of coating are applied, and the thickness of the masks covering the shaft ends is varied to control a taper of tapered regions.