Abstract: A mask for covering a substrate for performing capacitance-voltage measurements on the substrate is a full-faced mask covering substantially all of the substrate and having a thin outer section and a thicker inner section, so that the outer section is thin enough to permit desired clearance tolerances when inserting the substrate/mask assembly into or removing it from a cassette, and the inner section is thick enough to provide structural stability to the mask to ensure proper contact between the mask and the test substrate. The mask may include a ring with one or more strips across the ring with holes in the strips for target material deposition. In an alternative embodiment, the mask may be a disk with holes at various locations across the disk. In either embodiment, the mask generally conforms to the shape of the substrate, so that the clamp ring of the PVD chamber seats on the mask or on the substrate, so little or none of the plasma or sputtered material can escape between the substrate and clamp ring.

Abstract: A base plater or a vacuum deposition apparatus 24 having individually and selectively controlled work holders 10 and a capactively coupled crystal monitor 26. A flipping control mechanism 31 individually and selectively controls flipping of each of the work holders 10 by selectively engaging a flip lever 32 to a flip gear 14 of each work holder 10. The flipping control mechanism 31 allows individual and selective rotation of the work holders 10 to plating and non-plating positions for particular plating processes or runs. Rings 28, 36, 40, and 42 are used to provide a generally open central area 60 that is generally free from obstructions that may adversely affect the plating process and/or the surface or components of the base plater apparatus 24. A crystal monitor 26 is mounted to rotational ring 28 which is in the same rotational plane and periphery of the work holders 10.

Abstract: A method, apparatus and carrier for coating a CRT screen after assembly. The method and apparatus includes isolating a surface portion of the CRT to be coated from the remaining surface to prevent or minimize coating problems resulting from outgassing or difficulty in controlling coating process parameters and to isolate noncompatible components from the deposition environment.

Abstract: A metallized film capacitor formed by laminating or winding a metallized film 1 with metal evaporated electrode on one or both sides thereof so that a pair of metal evaporated electrodes 2 are opposite to each other, wherein electrode lead-out portions 3 are provided at both ends of the capacitor, each metal evaporated electrode is composed of a low resistance area abutting on the electrode lead-out portion and a remaining high resistance area having higher resistance than it, a split electrode pattern with a plurality of minute blocks 8 formed in a longitudinal direction and width direction and fusing areas 9 between the adjacent minute blocks is formed on at least one of the metal evaporated electrodes, and electrode partitioning lines 7 are formed at regular intervals in a longitudinal direction of the film.

Abstract: A clamp for fixturing a substrate when forming and thermally processing upon the substrate a thermally flowable layer. The clamp comprises a backing member having a top member connected through a first mechanical means to the backing member. The backing member and the top member are sized such that a substrate may be clamped between the backing member and the top member. A portion of the top member overlaps the substrate and leaves exposed a first portion of the substrate when the substrate is clamped between the backing member and the top member. The clamp also comprises a shroud connected through a second mechanical means to the backing member, where a portion of the shroud overlaps the top member. The shroud leaves exposed a second portion of the substrate which is smaller than and contained within the first portion of the substrate. The shroud is removable from the backing member while the substrate remains clamped between the backing member and the top member.

Abstract: A mask for covering a substrate for performing capacitance-voltage measurements on the substrate is a full-faced mask covering substantially all of the substrate. The mask may include a ring with one or more strips across the ring with holes in the strips for target material deposition. In an alternative embodiment, the mask may be a disk with holes at various locations across the disk. In either embodiment, the mask generally conforms to the shape of the substrate, so that the clamp ring of the PVD chamber seats on the mask or on the substrate, so little or none of the plasma or sputtered material can escape between the substrate and clamp ring. Various embodiments of the mask provide different ways to hold the mask on the substrate, such as clamping with clips, gluing with an adhesive, folding extensions of the mask over the edge of the substrate, and holding by surface tension.

Abstract: A deposition-preventing part, particularly a masking tool, which is used over an area to be protected from adhesion of a physical vapor deposition film, for physical vapor deposition apparatuses which are used to form physical vapor deposition films of metals, particularly noble metals, on CD-ROM, CD-R or CD-E substrates. One or more of a solder-plated Cu wire, a solder-plated Cu foil tape, an Al foil tape and a synthetic resin tape are attached, in a peelable manner, on a solder film formed on the surface of the substrate of a deposition-preventing part such as a masking tool, which has a surface roughness of 0.01-1 .mu.m when expressed as the arithmetic mean roughness defined according to JIS B 0601, a thickness of 5-100 .mu.m and a melting point of 100-450.degree. C.

Abstract: A method and apparatus for fabricating a wafer spacing mask on a workpiece support chuck. Such apparatus is a plate containing a plurality of apertures that is positioned atop the workpiece support chuck while material is deposited onto the plate and through the apertures onto chuck. Upon completion of the deposition process, the plate is removed from the workpiece support chuck leaving deposits of the material to form the wafer spacing mask.

Abstract: The present invention relates to an apparatus for simultaneously coating a plurality of workpieces. The apparatus includes a modular fixture having a plurality of bushing and spindle arrangements for supporting the workpieces to be coated. The bushing and spindle arrangements allow each workpiece to rotate about its longitudinal axis. They further allow each workpiece to assume a first position where it is tilted towards a source of coating material during a first portion of the coating cycle and a second position substantially parallel to the source of coating material during a second portion of the coating cycle. By providing the novel bushing and spindle arrangement of the present invention, it is possible to coat surfaces of the workpiece which are substantially perpendicular to other surfaces of the workpiece and still obtain a substantially uniform coating along the other surfaces of the workpiece. A process for simultaneously coating the workpieces is also described.

Abstract: The present invention provides a process and apparatus for manufacturing organic electroluminescence cell, wherein the steps after formation of a transparent electrode on a substrate plate up to formation of a protective film are successively carried out in vacuum chambers which are isolated from the oxidative external atmosphere and thereafter withdrawn from the chambers into the air. A plurarity of layer portions of at least a portion of the electroluminescence cell is formed in a plurality of woriking chambers and withdrawn to the outside after formation of a protective film thereon.

Abstract: The present invention provides a method and apparatus for protecting the edge of a substrate and securing the substrate to the support member during processing. The present invention preferably provides minimal contact with the substrate and provides improved edge exclusion. Support tabs extend inwardly from the lower roof surface to support the apparatus on the substrate and the inner terminus of the apparatus approaches the edge of the substrate to provide the improved edge exclusion. A variable height lower roof surface is provided over the edge of the substrate to provide an effective increased roof aspect ratio (width of the roof:height of the roof above the substrate) over the edge of the substrate which reduces the likelihood that a bridging layer will form between the apparatus and the substrate or beyond the substrate.

Abstract: The present invention relates to an improved fixture for facilitating the coating of workpieces such as turbine blades and vanes. The fixture has a hollow core member and a plurality of workpiece receptacles positioned along the length of and about the periphery of the core member. Each of the workpiece receptacles comprises an open sided workpiece support structure and a cover for closing the open side of the support structure. During the coating operation, the fixture of the present invention is rotated about its longitudinal axis while the workpieces being coated remain stationary within the receptacles.

Abstract: A fixture (90) for use in selectively applying a protective coating to a gas turbine engine blade (10) includes a base (92) having a blade retention slot (102), and a disposable shield (110). The shield (110) includes a sheet metal sleeve (112) and a cap (114) having a window (116) the cap being affixed to one end of the sleeve. When fully assembled with the blade properly positioned in the fixture only those portions of the blade selected to be coated are exposed. Additional features such as a locator dowel (104) extending from the floor of the slot and mutually cooperative track (121) and nub (122) assist in locating the blade correctly in the fixture and orienting the window with respect to the blade platform (16). A lock exemplified by a groove (128) and the nub (122) resists separation of the shield from the base during coating operations.

Abstract: A structure and method is described for securing an overspray shield in processing chambers in the wall sandwich of the chamber or using a dimensionally compliant floating spacer ring to elastically clamp the overspray shield in position in a vacuum substrate processing chamber without the use of removable fasteners. The configuration uses the differential pressures between the inside and outside of the chamber to clamp the overspray shield along with its shield clamping assembly components at a spacer position in the chamber. The spacer position is generally interior to vacuum sealing limits of the chamber. The arrangement is such that if misalignment occurs a good vacuum-type seal cannot be achieved unless the parts are moved to correct alignment. When correctly aligned the overspray shield is tightly held to the processing chamber wall and electrical continuity between the processing chamber wall and the overspray shield is assured throughout expected process conditions.

Abstract: A method, apparatus and carrier for coating a CRT screen after assembly. The method and apparatus includes isolating a surface portion of the CRT to be coated from the remaining surface to prevent or minimize coating problems resulting from outgassing or difficulty in controlling coating process parameters and to isolate noncompatible components from the deposition environment.

Abstract: A vacuum treatment facility and method are provided for the surface treatment of workpieces, particularly for the covering of the central and/or peripheral area of circular-disk-shaped workpieces, as in the manufacturing of CD's or storage plates. The facility comprises a chamber arrangement that can be evacuated, and transport devices in order to transport the workpieces into, through and out of the chamber arrangement. Along the transport devices, an application station is provided for applying at least one loose masking element respectively to one workpiece respectively. The method is a method for masking a workpiece, particularly for covering the central and/or peripheral area of circular-disk-shaped workpieces, as in the manufacturing of storage plates, during a vacuum surface treatment. At least one masking element is applied as a separate part to the workpiece on its path to the treatment and is subsequently removed therefrom again.

Abstract: An area of an insulating strip (3) which is to remain free of metal is covered by an endless cover strip (4), which rests on the insulating strip (3) and travels along with it at the same speed. Before it enters a vapor deposition zone (5), the cover strip is provided with a film of oil on the side facing the metal evaporator (6) and, after the cover strip (4) has passed through the vapor deposition zone (5) and after the cover strip (4) and the insulating strip (3) have been separated from each other, the oil which has been deposited from the vapor phase onto the cover strip (4) is removed by heating the cover strip (4) with a heater (7) installed in the immediate vicinity of the cover strip (4).

Abstract: A structure and method for handling and processing wafers in a face down configuration is disclosed. A robot insertion blade supports a wafer to be processed in a recess having conically sloping wafer holding surfaces which touch the wafer only at its outer periphery. Once positioned in the chamber, a set of three transfer finger with sloped contact surfaces supported from a "C" shaped support assembly raise the wafer adjacent to a susceptor bottom surface. A recess in the face of the susceptor covering a large portion of the wafer is evacuated, compared to process chamber pressure, and when the differential pressure between the processing chamber and the evacuated recess behind the wafer can support the wafer, the transfer finger supports are lower and rotated out from under the wafer and susceptor assembly. The susceptor with the wafer attached by vacuum is then lowered to a processing location in contact with shadow rings supported by the "C" shaped support assembly and opposite a gas distribution plate.

Abstract: A chamber for depositing a film layer on a substrate includes a support member on which the substrate is positioned for processing in the chamber, and a ring assembly suspended in the chamber on a chamber shield. The ring assembly comprises first and second rings, the second ring being disposed intermediate the first ring and the substrate. The support member is positionable in the chamber to receive a substrate thereon, and further positionable to pass the substrate through the shield and thereby lift the ring assembly off the shield. After deposition is complete, the support member retracts through the shield, to reposition the outer ring on the shield. The inner ring continues to move downwardly with the substrate support member a short distance before it is repositioned on the shield.

Abstract: Structural components (2), such as turbine blades (16) partially to be coated, for example with precious metal coatings, are inserted into a circumferential pocket on a carrier wheel (8), so that surface areas (10, 10A) protruding radially outwardly are presented for a coating operation, for example by vapor deposition, gas diffusion, plasma spraying, or sputtering, while surface portions (9) of the components within the wheel are protected against coating by wheel disks (8A, 8B). The wheel is rotated either continuously or stepwise through an active coating chamber (3). Surfaces to be coated participate in forming first and second walls for enclosing a coating space (11). Other walls of the space (11) are formed by one or two coating sources (12, 13), such as cathode sputterers, whereby the need for screens or masks (4, 14) that form the remaining walls of the space (11) are minimized. The bottom (59) of the space (11) is preferably formed by wall portions (4A) of the turbine blades (16).

Abstract: A system for sputtering a substrate is disclosed. The system includes a central housing having at least one process module for forming the layer, wherein the process module is in fluid communication with the central housing and includes a first device used in conjunction with forming the layer on the substrate. In addition, the system includes at least one service module in fluid communication with the central housing, wherein the service module includes at least one replacement device suitable for replacing the first device. The central housing includes a robotic element for transporting the first device from the process module to the service module and for transporting the replacement device from the service module to the process module in order to replace the first device. In addition, the service module includes a dedicated pump for evacuating the service module to a high vacuum in order to reduce surface outgassing of the replacement device to a desired level before use.

Abstract: An improved vacuum arc coating apparatus is provided, having a tube defining reaction zone with a plasma channel defined within a series of aligned annular substrate holders, or between an outer wall of an axial chain of substrate holder blocks and the inner wall of the tube. The substrate holders thus act as a liner, confining an arc within the plasma channel. Carrier and plasma-creating gases and the reaction species are introduced into the tube, and the deposition process may be carried out at a pressure between 100 Torr and 1000 Torr. Magnetic coils may be used to create a longitudinal magnetic field which focuses the plasma column created by the arc, and to create a transverse magnetic field which is used to bias the plasma column toward the substrates. Substrates can thus be placed anywhere within the reaction zone, and the transverse magnetic field can be used to direct the plasma column toward the substrate, or the tube itself can be rotated to pass the substrate through the plasma column.

Abstract: The present invention relates to an improved fixture (70) for masking a portion of an airfoil (12) during coating operations. The fixture (70) includes a masking member (54) and a clamp (74) for forcing the masking member (54) into contact with the portion of the airfoil (12) requiring masking.

Abstract: First and second transport chambers are joined to one another through a common opening (5), and house respective substrate carriers (6, 7) mounted for rotation about parallel axes. In at least one position the carriers may be superposed, plungers (14 and 15) being disposed in the area of this superposition on opposite sides of the carriers, both carriers being longitudinally displaceable parallel to the pivot axes (a and b, respectively). After a coating operation in the second transport chamber, the second plunger releases the mask from the second carrier, moves it back to the first carrier where the substrate is peripherally engaged, then moves the mask still further in order to release it from the substrate. The second plunger then retreats, and the coated substrate can be rotated in the first chamber.

Abstract: A method and apparatus for coating a CRT screen after assembly. The method and apparatus includes isolating a surface portion of the CRT to be coated from the remaining surface to prevent or minimize coating problems resulting from outgassing and to isolate noncompatible components from the deposition environment.

Abstract: In a mask (7) for covering the outer marginal area of a disk-shaped substrate surface during a coating process, for example a vacuum sputtering or vapor depositing process, the mask (7) is made of an elastic material in the form of a planar plate with an essentially circular opening. To center and lock it onto the substrate (1) an inwardly extending annular flange is provided which assumes the actual masking function and extends in a plane parallel to the plane of the plate. The substrate (1) is laid on this flange and retained by projections extending radially inward. Prior to positioning the substrate it is bowed axially to spread apart the projections.

Abstract: A vacuum chamber houses a rotatable substrate holder next to a door having a cathode target mounted therein. A plate-like mask is movable to a position between the substrate holder and the door so that the target can be cleaned without contaminating the substrate. The mask is preferably moved by a screw jack including a tube driven through a sealed hole in the chamber wall.

Abstract: A holding apparatus, a metal deposition system and a wafer processing method which preserve topographical marks, including those used as alignment targets, on a semiconductor wafer by preventing metal from depositing on such marks during metal deposition. The invention eliminates the need to use window mask and etch techniques to provide replication of topographical marks on a newly formed metal layer when a CMP planarization technique is used prior to metal deposition. As a result, cost, cycle time and yield loss due to the additional window mask and etch steps can be eliminated. The holding apparatus includes a wafer retainer for retaining a wafer which has at least one topographical mark and a clamp ring with at least one tab. The wafer is pressed against the clamp ring by the retainer for securing the wafer in the retainer.

Abstract: On a semiconductor substrate, chips to be products and alignment chips located at a portion a part thereof is left out from a peripheral part of the semiconductor substrate are formed. Contact holes and alignment marks are formed at the chips to be products and the alignment chips. Covering the alignment chips with alignment mark cover parts of a substrate holder, a material for metal wiring is deposited on the semiconductor substrate to form a metal film on the substrate. A mask pattern is formed on the metal film using the alignment marks of the alignment chips on which the metal film is not formed.

Abstract: A monolithic circuit, such as a piezoelectric device, semiconductor, or the like, may be fabricated by forming an operational metallization layer (12) on a substrate (10). A subsequent layer (40), such as a sealing ring pattern (42) may then be applied using a thin film deposition technique. A thin film material is applied through a mask assembly (28). The mask assembly (28) includes a mask material (30) that has been applied to a screen (24) and patterned as desired. The mask material (30) extends beyond the screen (24) so that only the mask material contacts the substrate (10) during thin film deposition. Preferably, the screen (24) is woven from individual wires (26) having circular cross-sectional shapes. The subsequent layer (40) is applied both through perforations (18) in the screen (24) and under the screen's wires (26).

Abstract: A plunger (14) is displaceably mounted in a vacuum chamber (42) and movable on a first linear path into the plane of substrate (20), for the mounting and for the transport of the mask (15) provided with a bore (32) receiving the plunger (14). A slide (41) having a forked extremity is movable from an airlock chamber (39) transverse to the first linear path to engage an annular flange of the mask (15). In a return movement the mask is transported into the removal airlock chamber (39) from which the mask is then removable by means of a removal plunger (48).

Abstract: An improved process is disclosed for depositing a layer of metal on a semiconductor wafer wherein a shadow ring normally engages the end edge of the front surface of the wafer to inhibit deposition of the metal on the backside of the wafer and a barrier or nucleation layer is deposited on the unshielded portion of the front surface of the wafer prior to the deposition of the metal layer thereon, and wherein gases used to form the metal layer may contact and react with underlying materials on the front surface of the wafer beneath the shadow ring.

Abstract: A method for forming a three-dimensional object by applying segments of complementary material and deposition material so as to form layers of material. Selected segments of material are then shaped after one or more segment is formed. In this manner, layers of material form a block containing the object made of deposition material and surrounded by complementary material. Then, the complementary material which serves as a support structure during forming is removed. Preferably, the complementary material has a lower melting temperature than the deposition material and is removed by heating the block. The deposition material and complementary material are preferably applied by thermal spray deposition but may be applied by weld deposition, liquid slurry, gravity drop or any manual means such as a hand sifter. It is also preferred but not necessary to use masks when applying the material.

Abstract: The thickness distribution of a vapor deposited layer such as an interference filter deposited on a skirted substrate such as a glass faceplate for a projection television tube, is improved by shielding the substrate from indirect flux of vapor so as to reduce the shadowing effect of the skirt upon the thickness distribution of the deposited layer thereby improving the white field uniformity of the resultant projection image.

Abstract: A novel process for the selective deposition of solid-phase materials is disclosed, which process requires only the modulation of a single auxiliary gas within a suitable reactor assembly. According to the disclosed method, selective area deposition can be obtained on any desired microelectronic substrate by the creation of a vapor-phase chemical equilibrium system capable of deposition and etching the material to be deposited. The vapor-phase system is designed around a single reversible reaction wherein the material to be deposited equilibrates between that solid phase and its vapor-phase constituent species. By modulating an auxiliary gas flow into the reactor assembly, alternating deposition and etching processes can be obtained to yield an overall process which results in net overall selective and uniform deposition.

Abstract: Active matrix addressed liquid crystal TV sets configurated in the way described by A. G. Fischer in U.S. Pat. No. 3,840,695 can be enlarged to monolithic square-meter-sized wall TV panels. The large-area thin-film-electronic matrix circuit needed to address the superimposed liquid crystal layer can be vacuum-deposited from a multiple source evaporator onto one coherent glass pane through a number of small reticulated perforated sheet metal masks which are held successively against a chosen reticle of the large glass pane, in exact registration with each other and neighbouring reticles. The large glass pane must be precision-shifted in X-Y-reticle-steps for repeated vacuum depositions, in exact registration. The machinery required is described.

Abstract: A shadow mask for sputtering is formed from a single crystal silicon wafer which is mechanically and chemically polished to produce top and bottom surfaces which are substantially flat and parallel to one another. The wafer is provided with one or more pyramidal etch pits which are arranged in a pattern. Each pit has a substantially square cross-section on the top surface, and a smaller substantially square cross-section on the bottom surface to produce an aperture in the wafer. In use, the wafer is clamped against a flat substrate with its apertures opening toward the evaporant beam. After use, the deposited species may be cleaned from the wafer using suitable etchants which render the wafer unharmed, and therefore reusable.

Abstract: In a process for the simultaneous deposition of a protective coating, e.g. an aluminuim based coating, on internal and external surfaces of heat-resistant alloy parts, the parts are placed in a box containing a donor material, preferably in the form of granules, comprising the metal to be deposited, and an activator separate from the donor and comprising at least an anhydrous powder of chromium fluoride CrF.sub.3 to provide a source of fluorine. The box is heated to a temperature above 1000.degree. C. and a controlled flow of a carrier gas, reducing or neutral, is introduced into the box so as to establish a circulation of gases in the box whereby fluorinated vapors from thermal decomposition of the CrF.sub.3 activator contact the donor to form a volatile fluoride of the metal to be deposited, and the volatile vapor is carried into contact with the external and internal surfaces of the parts to be coated to deposit the coating thereon.

Abstract: A method and apparatus for forming a three-dimensional object by thermal spraying utilizes a plurality of masks positioned and removed over a work surface in accordance with a predetermined sequence. The masks correspond to cross sections normal to a centerline through the workpiece. One set of masks defines all cross sections through the workpiece. A second set of masks contains at least one masks which corresponds to each mask of the first set. Masks from each set are alternatively placed above a work surface and sprayed with either a deposition material from which the workpiece will be made or a complementary material. In this manner, layers of material form a block of deposition material and complementary material. Then, the complementary material which serves as a support structure during forming is removed. Preferably, the complementary material has a lower melting temperature than the deposition material and is removed by heating the block.

Abstract: A furnace for the formation of a black oxide film on the surface of a thin metal sheet is disclosed which comprises a tunnel-like furnace proper provided at one terminal side thereof with an inlet and at the other terminal side thereof with an outlet, conveying means laid inside the furnace proper from the inlet through the outlet thereof for conveying a thin metal sheet from the inlet to the outlet, openable shutter means for partitioning the interior of the furnace proper into at least first and second regions on the front and rear sides respectively in the direction of conveyance of the thin metal sheet, first gas supply means for feeding into the first region on the inlet side of the furnace proper partitioned by the shutter means a mixed gas containing carbon dioxide and carbon monoxide and containing substantially no oxygen or a mixed gas containing carbon dioxide, carbon monoxide, and steam and containing substantially no oxygen, second gas supply means for feeding into the second region on the outlet

Abstract: A process chamber 27 is provided with several successive cathode arrangements 7, 8 which have targets to be sputtered, wherein diaphragms 39, 40 are held between the respective targets 3, 4 and the path of the workpieces 1, 2. In addition to their center openings 66, 67 for the passage of the flow of coating material, further window-like apertures 68, 69 in the area of the material flow, respectively, which are disposed offset to one another and transversely to the conveying direction F of the substrates and thus produce test strips 70, 71 on the workpieces or special test substrates which are passed by the cathode arrangements 7, 8. The test strips each correspond to one single layer of a layer package 72, produced on the substrate, whereby thickness of each layer may be measured by acquiring data on the transmission, reflection, or resistance properties, or by mechanically measuring each layer.

Abstract: A scratch reducing shadow mask for providing vapor deposition patterns of bonding metals onto a surface of a die. The shadow mask comprises a top surface and a bottom surface which define a plurality of vias for permitting vaporized bonding metals to pass through the mask. Mask bottom surface comprises a plurality of recessed regions to minimize the contact area of the mask with the die during the vapor deposition process.

Abstract: Backside growth on substrates in a vapor deposition system has been a problem resulting in cracking of the material deposited on the substrate, making replication in a vapor deposition system difficult to achieve, and requiring post deposition machining to separate the substrate-deposit from the deposition fixture. A solution to the problem is the following: the substrate is mounted on a plurality of graphite pillars, with the pillars being bonded to the substrate as near the periphery thereof as possible. A hollow body open on one side but closed on the other, and fabricated from GRAFOIL with graphite cement used as a bonding agent, is mounted on the pillars with the open end facing the substrate. The open end of the body is pressed against the substrate and sealed with a bonding agent. This completely covers the backside of the substrate and thus prevents any vapor deposition thereon.

Abstract: A seal ring presses against a wafer on a CVD chuck continuously around the outer periphery of the wafer, and with sufficient force to hold the backside of the wafer against the chuck, so no CVD material may deposit on the backside of the wafer. The seal ring has one surface for contacting the frontside of the wafer and a second surface that extends close to the CVD chuck, so the edge of the wafer is also excluded from CVD coating. With use of the wafer seal ring apparatus and method, CVD coating is confined to the frontside of a wafer. In a preferred embodiment, an apparatus with a slide operated by a cam lever and a tension spring for moving the seal ring and pressing it against a wafer on a CVD chuck is used with each of multiple chucks attached to a rotatable turret within a CVD chamber.

Abstract: A reusable evaporation fixture for aligning a plurality of small individual substrates to a single contact mask is described. The fixture preferably includes a series of thin inner plates held together by a base plate and top plate. One of the inner plates includes a plurality of spring means corresponding to the plurality of individual substrates to be masked. Each spring means forces individual substrate against the contact mask to prevent haloing of the deposition pattern. Another of the inner plates has a plurality of pockets and spring means within those pockets which force the individual substrates against the alignment faces of the pockets, to align and secure the individual substrates in the X-Y plane. Once the individual substrates have been placed in the pockets provided by the inner plates, the contact mask is placed over the inner plates, and a top plate is placed over the entire assembly.

Abstract: An apparatus and method for registration or alignment of thin film structure patterns on a substrate formed with the use of an apertured mask in a vacuum deposition system. On particular the alignment apparatus is comprised of a mask holder assembly, which supports the apertured mask, and a substrate carrier which engages with the holder assembly. Upon placing the engaged alignment apparatus in a a deposition chamber, a magnet is positioned adjacent the holder assembly in order to formly hold the apertured mask against a substrate prior to vacuum to deposition. Upon depositing the pattern material, the magnet and holder assembly are disengaged, resulting in a pattern of thin film structures remaining on the substrate. The present invention is effective for remotely operating automatic masking systems where there is a need to eliminate the need for breaking vacuum in a deposition system.

Abstract: A rotatable substrate holder (6) which has a plurality of substrate pickups in a circular arrangement at equal distances apart is disposed in a vacuum chamber (1). A corresponding number of substrates are driven stepwise on a circular path from an air lock station (8, 9) through at least one coating station (10, 11) to the air lock station. To increase the throughput of substrates, the vacuum chamber (1) has two air lock stations (8, 9) and two coating stations (10, 11) one following the other.

Abstract: There is disclosed a method and apparatus for easily mounting, holding and facilitating the coating of preselected areas of very thin semiconductor samples. The apparatus includes a base adapted for placement in a coating chamber. The base includes a pair of spaced apart supporting arms onto which a plurality of stacked samples can be loaded. A cover is then slidably positioned over the stacked samples to hold the stacked samples in position during coating. The cover in conjunction with the supporting arms define an open sided cavity to enable the samples to be coated. The apparatus also can be used to hold only one sample.

Abstract: Disclosed are a method and a matrix panel masking apparatus for forming very closely spaced, parallel, elongated, narrow, and electrically separate conductors on a dielectric surface. The matrix panel masking apparatus comprises a plurality of elongated taut wires, being arrangable in a configuration so that the interstices between the wires correspond to the desired matrix panel conductor pattern. The method includes: superposing the matrix panel masking apparatus of this invention on the dielectric surface, depositing conductive material through the interstices and on the dielectric so that after the masking apparatus is removed, the conductors will remain.

Abstract: Apparatus for indexing and accurately registering a selected stabilized mask of a plurality of stabilized masks between a substrate and a source during vacuum deposition wherein the apparatus has a mask supporting frame including a mechanism for supporting at least two stabilized masks each having openings which define a pattern and wherein the at least two stabilized masks are supported in a planar spaced relationship relative to each other and have a preselected spacing between the centers thereof, guide and support rollers operatively coupled to the mask supporting frame for supporting the mask supporting frame for lateral movement along a predetermined path between a first position and a second position wherein the first position indexes one of said two of the stabilized masks between a substrate and a source at a working station and the other of the two stabilized masks at a different location along the predetermined path and wherein the second position indexes the other of the two stabilized masks at th