Abstract: Ampoules for a semiconductor manufacturing precursors and methods of use are described. The ampoules include a container with an inlet port and an outlet port. The inlet port has a showerhead that the end within the container. The showerhead has at least two angled nozzles to direct the flow of gas within the cavity so that the gas flow is not perpendicular to the surface of a liquid within the ampoule.

Abstract: The invention relates to various embodiments of a solid particle-source (100a, 100a) that can comprise: a container (104) which comprises an area for receiving solid particles; at least one electron source (106) for introducing electrons into the solid particles such that an electrostatic charge of the solid particles produced by the electrons separates them from each other and accelerates them in a direction out from the container (104); a vibration source (110) which is designed to introduce a vibration in the region in order to loosen the solid particles, the electronic source comprising an emission surface for emitting electrons into a vacuum emission region.

Abstract: A heating device for evaporation, an evaporation device and an evaporation method are provided. The heating device includes: a crucible for holding an evaporation raw material; a movable heating unit which is disposed outside the crucible and can move in the direction perpendicular to a bottom surface of the crucible; and a controller configured to control the height from the movable heating unit to the bottom surface of the crucible.

Abstract: An evaporation apparatus comprises an evaporation chamber (2) and a moving device (3); the evaporation chamber (2) is provided with an evaporation source (21) therein and is provided with two regulating plates (22) on a side wall thereof; the moving device (3) is disposed on the bottom of the evaporation chamber (2). An evaporation method by use of the evaporation apparatus is also disclosed.

Abstract: The present disclosure provides an evaporation device and an evaporation method using the evaporation device. The evaporation device includes a main chamber with an internal space and an evaporation mechanism under the main chamber. The evaporation mechanism includes at least two crucible accumulation chambers. The evaporation mechanism is configured to be operated in a first state where a first crucible accumulation chamber is at an evaporation position and in communication with the main chamber to form a vacuum space, and evaporation of a material in the crucible in the first crucible accumulation chamber is performed, and in a second state where, in a vacuum environment, the first crucible accumulation chamber is moved away from the evaporation position and a second crucible accumulation chamber is moved to the evaporation position and in communication with the main chamber.

Abstract: A thin film forming apparatus according to the embodiment includes a plurality of vapor deposition sources respectively separated from each other, a plurality of nozzle bodies connected to upper portions of the respective vapor deposition sources, and a plurality of nozzles connected to upper portions of the respective nozzle bodies. A nozzle hole of each of the nozzles is formed on a same vapor deposition line. Thus, according to the embodiment, the first organic material and the second organic material respectively sprayed through a first nozzle hole and a second nozzle hole can be uniformly mixed by disposing the first nozzle hole and the second nozzle on the same vapor deposition line.

Abstract: A thermal evaporation source includes: a crucible configured to contain a volume of evaporant and a vapor space above the evaporant; a manifold body having within it a hollow expansion chamber that is flowably connected to the vapor space via one or more restriction orifices; one or more effusion nozzles flowably connected to the expansion chamber and exiting an outer surface of the thermal evaporation source, the nozzle(s) oriented to direct an evaporant vapor flow out of the source vertically downward, in one or more horizontal directions, or in one or more directions intermediate between horizontal and vertically downward; and a heater capable of heating some or all of the thermal evaporation source to a temperature sufficient to produce the one or more evaporant vapor flows when a vacuum is applied to the thermal evaporation source.

Abstract: Provided is an evaporating apparatus that deposits a deposition material onto a treatment object. The evaporating apparatus includes a base, a deposition source, and first and second correction units. The deposition source deposits the deposition material onto the treatment object. The base is disposed separately from the treatment object. The deposition source is placed on a surface of the base. The first and second correction units located between the deposition source and the treatment object. The first and second correction units are disposed on outer regions of the deposition source and face each other. Each of the first and second correction units rotates to control the thickness of a layer formed by the deposition material deposited on the treatment object.

Abstract: The plant is suitable to produce a semiconductor film (8) having a desired thickness and consisting substantially of a compound including at least one element for each of the groups 11, 13, and 16 of the periodic classification of elements. The plant comprises an outer case (1) embedding a chamber (2) divided into one deposition zone (2a) and one evaporation zone (2b), which are separated by a screen (3) interrupted by at least one cylindrical transfer member provided with actuation means rotating about its axis (5). To the deposition zone (2a) a magnetron device (7) is associated, for the deposition by sputtering of at least one element for each of the groups 11 and 13 on the side surface (?) of the cylindrical member that is in the deposition zone (2a). To the evaporation zone (2b) a cell (10) for the evaporation of at least one element of the group 16 is associated, and such an evaporation zone (2b) houses a substrate (8a) on which the film (8) is produced.

Abstract: An apparatus deposits a coating on a part. The apparatus comprises a chamber and a sting assembly for carrying the part. The sting assembly is shiftable between: an inserted condition where the sting assembly holds the part within the chamber for coating; and a retracted condition where the sting assembly holds the part outside of the chamber. The apparatus comprises a source of the coating material positioned to communicate the coating material to the part in the inserted condition. The apparatus comprises a thermal hood comprising a first member and a second member. The second member is between the first member and the part when the part is in the inserted condition. The second member is carried by the sting assembly so as to retract with the sting assembly as the sting assembly is retracted from the inserted condition to the retracted condition.

Abstract: It is an object of the present invention to provide a deposition device that can selectively form a thin film without using a shadow mask with respect to a substrate having a large size. In the deposition device, an evaporation source is provided with a cylinder cell, a heater for heating a lower part of the cylinder cell, and a heater for heating an upper part of the cylinder cell. A hot plate can control a temperature by a heater provided inside thereof. The hot plate heats an evaporation material supplied into the cylinder cell from a material supply portion that is connected to the cylinder cell, and vaporizes the evaporation material by evaporation or sublimation. A rotating mechanism for rotating the hot plate in the cylinder cell may be provided to achieve uniformity of a temperature. A heater for heating the material supply potion may be provided to raise a temperature of the evaporation material supplied into the cylinder cell.

Abstract: A pressure lock system passes a wire along a wire path from a wire source at a high pressure first region to a destination at a low pressure second region. The pressure lock system includes a pressure lock chamber. A first conduit has an interior positioned to pass the wire along the path and is mounted for rotation. A second conduit has an interior positioned to pass the wire from the pressure lock chamber and is also mounted for rotation. A motor may drive rotation of the first conduit and the second conduit. Pumps may maintain a pressure of the pressure lock chamber lower than a pressure of the first region.

Abstract: In a method for coating substrates with materials to be vaporized in a vacuum coating system, the vaporization material is deposited on the substrate by double vaporization using an intermediate carrier. The intermediate carrier is continuously moved and cylindrical.

Abstract: An evaporator includes a vaporization chamber having a monomer inlet and a vapor outlet. There is a vapor nozzle in the vapor outlet. The evaporator also includes a collar positioned between the vaporization chamber and the vapor nozzle which increases the pressure in the evaporation chamber while the conductance through the nozzle is substantially unchanged.

Abstract: A vapor deposition device has a plurality of moving plates between the cooling plate and moving vapor deposition source is controlled by the blowout panel. Moreover, when the vapor deposition materials absorbed by the blowout panel are up to the predetermined value, the moving plates are rotated around their axis simultaneously by the linkage to form a new blowout panel for performing the subsequent vapor deposition process. Consequently, the adsorption ability of the blowout board is greatly improved, and the crack and peeling off of the blowout panel caused by absorbing too many vapor deposition materials are avoided. Hence, the volume production of the evaporative coating equipment is improved.

Abstract: An apparatus for collecting condensed vapor during physical vapor deposition includes an enclosure configured to be placed adjacent to one or more vapor sources in a vacuum chamber. The enclosure includes an internal surface of the enclosure partially enclosing a volume of space configured to receive an object wherein the enclosure is maintained at a cooler temperature than the one or more vapor sources. The internal surface of the enclosure is coupled to one or more drainage gutters drainage drainage gutters.

Abstract: A boat according to this disclosure includes side walls and a base that are arranged to define a container with an interior. A bottom of the boat may have a convex configuration. In a specific embodiment, the base may have a convex configuration, such as the shape of a portion of the curved surface of a cylinder, with end walls located at opposite ends of the base. Such a boat may have a crescent configuration. Each boat may be configured to be positioned against another boat, enabling the assembly of groups of boats. Multi-celled structures that receive and effectively increase the surface area of precursor material are also disclosed. A multi-celled structure may be configured for use within the interior of a boat, or individually, without a separate boat.

Abstract: A thin film deposition apparatus to form a fine pattern on a large substrate. The thin film deposition apparatus includes a deposition source, a first nozzle that is disposed at a side of the deposition source and includes a plurality of first slits, a second nozzle that is disposed opposite to the deposition source and includes a plurality of second slits, and a second nozzle reinforcement unit that is disposed on the second nozzle and crosses the second nozzle.

Abstract: An organic layer deposition apparatus capable of reducing or minimizing shifting of a pattern, caused when a patterning slit sheet sags.

Abstract: A thin film deposition apparatus capable of forming a precise deposition pattern on a large substrate includes a deposition source; a first nozzle disposed at a side of the deposition source having a plurality of first slits; a second nozzle disposed opposite to the first nozzle having a plurality of second slits; and a second nozzle frame bound to the second nozzle so as to support the second nozzle. The second nozzle frame includes two first frame portions spaced apart from each other and disposed in a direction in which the plurality of second slits are arranged, and two second frame portions each connecting the two first frame portions to each other, wherein the second frame portions are curved in the direction in which the plurality of second slits are arranged, so as to form arches.

Abstract: The present invention provides a thin film manufacturing method which realizes stable, highly-efficient film formation using a nozzle-type evaporation source while avoiding unnecessary scattering and deposition of a film formation material before the start of the film formation. Used is a film forming apparatus including: an evaporation chamber 16; a film forming chamber 17 in which a substrate 21 is provided; an evaporation source 19 holding a film formation material 15 and including an opening surface 14; a moving mechanism 35 configured to cause the evaporation source 19 to move; and a conductance variable structure 34. The film forming chamber 17 and the evaporation chamber 16 are evacuated. In a state where the differential pressure between these chambers can be secured by the conductance variable structure 34, the nonreactive gas is introduced to the evaporation chamber 16 to adjust the pressure in the evaporation chamber 16 to predetermined pressure or more.

Abstract: The present invention provides electrical contact assemblies can be used with vacuum deposition sources. In one exemplary application, the electrical contact assemblies of the present invention provide electrical contact to an arcuate or otherwise curved surface of a heating device used with a vacuum deposition source.

Abstract: An injector for a vacuum evaporation source includes an injection duct (1) having a longitudinal axis (11) and an inlet port (2) able to be connected to a vacuum evaporation source, and at least one nozzle (3) for diffusing a vaporized material, the nozzle (3) having a lateral face (4), and an upper face (5). The nozzle (3) includes a main channel (6) emerging outside the injection duct (1) and at least a lateral feeding channel (7) connecting the interior of the injection duct (1) to the main channel (6). The lateral feeding channel (7) has a lateral orifice (8) emerging inside the injection duct (1) through the lateral face (4) of the nozzle (3) for avoiding the clogging of the nozzle (3) by oxidized materials.

Abstract: A vapor deposition device (50) in accordance with the present invention is a vapor deposition device for forming a film on a film formation substrate (60), the vapor deposition device including a vapor deposition source (80) that has an injection hole (81) from which vapor deposition particles are injected, a vapor deposition particle crucible (82) for supplying the vapor deposition particles to the vapor deposition source (80), and a rotation motor (86) for changing a distribution of the injection amount of the vapor deposition particles by rotating the vapor deposition source (80).

Abstract: A linear evaporation source and a deposition apparatus having the same are disclosed. In one embodiment, the linear evaporation source includes i) a crucible being open on one side thereof and configured to store a deposition material and ii) a plurality of partitions dividing an internal space of the crucible, wherein each of the partitions has at least one opening in a lower portion thereof. The source further includes i) a nozzle section located on the open side of the crucible and comprising a plurality of nozzles, ii) a heater configured to heat the crucible and iii) a housing configured to accommodate to the crucible, the nozzle section, and the heater.

Abstract: A thin film deposition apparatus that is suitable for manufacturing large-sized display devices on a mass scale and that can be used for high-definition patterning, a method of manufacturing an organic light-emitting display device by using the thin film deposition apparatus, and an organic light-emitting display device manufactured by using the method.

Abstract: An organic thin film deposition system is disclosed. The organic thin film deposition system includes: a plurality of crucibles each having an inlet capable of selectively being opened and closed; an organic composite material made up of two or more organic materials and having an initial composition ratio, the organic composite material for placing in the plurality of crucibles; and a transferring unit for controlling a position of the plurality of crucibles.

Abstract: The purpose of the invention is increasing the efficiency of utilizing an EL material and providing a deposition method and a vapor deposition apparatus which is one of the film formation systems which are excellent in throughput and uniformity in film thickness in forming an EL layer. According to the invention, evaporation is performed by moving or reciprocating an evaporation source holder in which a plurality of containers (crucible) each encapsulating an evaporation material are set only in an X direction while moving a substrate at regular intervals. Further, in the plurality of evaporation source holders, film thickness meters of adjacent evaporation sources are disposed alternately so as to sandwich the movement pathway of the substrate.

Abstract: A point source assembly for a thin film deposition device having a chamber for holding a substrate, includes a crucible configured for holding and vaporizing a deposition material therein, where the crucible is configured for operative engagement to the chamber, an opening in the crucible configured for directing therefrom a vaporized form of the deposition material, where the opening includes a longitudinal line extending through the center of the crucible opening, and means operatively engaged to the crucible for facilitating rotational movement of the crucible for varying the orientation of the longitudinal line relative to the position of the substrate in the chamber.

Abstract: The purpose of the invention is increasing the efficiency of utilizing an EL material and providing a deposition method and a vapor deposition apparatus which is one of the film formation systems which are excellent in throughput and uniformity in film thickness in forming an EL layer. According to the invention, evaporation is performed by moving or reciprocating an evaporation source holder in which a plurality of containers (crucible) each encapsulating an evaporation material are set only in an X direction while moving a substrate at regular intervals. Further, in the plurality of evaporation source holders, film thickness meters of adjacent evaporation sources are disposed alternately so as to sandwich the movement pathway of the substrate.

Abstract: A thin film deposition apparatus and a method of manufacturing an organic light-emitting display device using the thin film deposition apparatus. The thin film deposition apparatus includes a plurality of thin film deposition assemblies, each of which includes: a deposition source that discharges a deposition material; a deposition source nozzle unit that is disposed at a side of the deposition source and includes a plurality of deposition source nozzles; a patterning slit sheet that is disposed opposite to the deposition source nozzle unit and includes a plurality of patterning slits arranged in a first direction; and a barrier plate assembly that is disposed between the deposition source nozzle unit and the patterning slit sheet, in the first direction. The barrier plate assembly includes a plurality of barrier plates that partition a space between the deposition source nozzle unit and the patterning slit sheet into a plurality of sub-deposition spaces.

Abstract: A thin film deposition apparatus that forms a thin film on a substrate includes: a deposition source that discharges a deposition material; a deposition source nozzle unit that is disposed at a side of the deposition source and includes a plurality of deposition source nozzles; a patterning slit sheet that is disposed opposite to the deposition source nozzle unit and includes a plurality of patterning slits; and a blocking member that is disposed between the substrate and the deposition source, wherein the thin film deposition apparatus is separated from the substrate by a predetermined distance, the substrate is moved relative to the thin film deposition apparatus, and the blocking member is moved along with the substrate to screen at least one portion of the substrate.

Abstract: A metering mechanism is configured for transferring measured doses of a granular material from a first location to a second location, and is particularly suited for metering source material in a vapor deposition apparatus. A receiver is disposed to receive the granular material from the first location. A discharge port is axially offset from an outlet of the receiver. A reciprocating delivery member having a passage defined therethrough is moved in a reciprocating path by a controllable drive device between a load position wherein the passage is aligned with the receiver outlet and a discharge position wherein the passage is aligned with the discharge port. The amount of granular material transferred from the first location to the second location is a function of the volume of the passage and the reciprocating rate of the delivery member.

Abstract: A crucible (50) of the present invention includes: an opening (55a) from which vapor deposition particles are injected toward a film formation substrate on which a film is to be formed; a focal point member (54a), provided so as to face the opening (55a), which reflects vapor deposition particles injected from the opening (55a); and a revolution paraboloid (55b) which reflects, toward the film formation substrate, vapor deposition particles which have been reflected by the focal point member (54a).

Abstract: A vapor deposition particle injection device (30) includes a vapor deposition particle generating section (41), at least one nozzle stage made of an intermediate nozzle section (51), a vapor deposition particle emitting nozzle section (61), and heat exchangers (43, 63, 53). The vapor deposition particle emitting nozzle section (61) is controlled so as to be at a temperature lower than a temperature at which a vapor deposition material turns into gas. Meanwhile, the intermediate nozzle section (51) is controlled by the heat exchanger (53) so as to be at a temperature between a temperature of the vapor deposition particle generating section (41) and a temperature of the vapor deposition particle emitting nozzle section (61).

Abstract: An evaporation device for a vacuum deposition apparatus includes a crucible to contain a material to be evaporated and a bottom, a body and an opening, and a heating element surrounding at least partially the crucible body, the evaporation device being placed inside a chamber with pressure <10?3 mbar. The device also includes at least one thermal shield between the crucible body and the heating element, the thermal shield including at least one element movable with respect to the crucible and designed so the heat received by the body of the crucible at a considered point of this body conforms, at a given instant of time, to a non-constant function of the distance between the considered point and the bottom of the crucible, this function being adjustable as regards at least one degree of movability of the first element of the thermal shield with respect to the crucible.

Abstract: A multiple vacuum evaporation coating device and a method for controlling the same. The vacuum evaporation coating device includes a plurality of evaporation sources, a rotating part adapted to rotate the plurality of evaporation sources and a coating block plate adapted to block all but one of said plurality of evaporation sources at any time, each of the plurality of evaporation sources comprise a case, a melting pot arranged within said case, an evaporation material arranged within the melting pot, a heating device arranged outside the melting pot and adapted to heat and evaporate the evaporation material, and a cooling device adapted to block heat generated by the heating device from transferring to an outside.

Abstract: A vapor deposition apparatus includes a deposition chamber, an umbrella-shaped supporting member, a plurality of coating precursor sources. The umbrella-shaped supporting member is received in the deposition chamber. The supporting member is configured for supporting a number of workpieces. The coating precursor sources oppose the supporting member. Each coating precursor source includes a stationary sleeve and a moveable member moveably received in the stationary sleeve. The moveable member defines a recess for receiving a coating material in a top end of the moveable member opposing the supporting member. The moveable members are moveable relative to the respective stationary sleeve such that a distance between the supporting member and the coating material in each recess can be adjusted.

Abstract: The present invention provides an evaporation device for which maintenance is readily conducted, and further, provides an electrode cover which can prevent an evaporation material from being adhered to electrodes. Moreover, the present invention provides an evaporation device including an evaporation chamber; a holding portion for holding an object to be treated; an evaporation source; an electrode; an electrode cover; and a power supply, in which the evaporation chamber includes the holding portion in an upper portion, and includes the evaporation source, the electrode, and the electrode cover in a lower portion; the electrode cover covers at least a part of an exposed surface of the electrode; the electrode and the power supply are electrically connected.

Abstract: A vapor deposition device includes a base, a hollow rod, a bracket, four bearing seats, and an ion source. The base defines a through hole and four grooves in one surface thereof. The hollow rod is inserted in the through hole and defines four vents in the circumferential direction thereof. The vents point to the upper space of the grooves correspondingly. The hollow rod includes a closed end and an opposite opened end. The bracket is connected to the closed end. The bearing seats are fixed to the bracket so that the bearing seats face the grooves respectively. The ion source is coupled to the opened end. Ions emitted by the ion source are guided by the hollow rod to the vents and the upper spaces of the grooves respectively.

Abstract: An evaporator includes a vaporization chamber having a monomer inlet and a vapor outlet. There is a vapor nozzle in the vapor outlet. The evaporator also includes a collar positioned between the vaporization chamber and the vapor nozzle which increases the pressure in the evaporation chamber while the conductance through the nozzle is substantially unchanged.

Abstract: In an evaporation source, a separable heater is used when an organic thin film is formed on a substrate in order to realize full-colors so that it is possible to correspond to crucibles of various capacities. The evaporation source comprises a crucible in which an organic material which is an organic thin film material is accommodated, and the crucible includes a heating unit and at least one spray nozzle for spraying the organic material onto a substrate. In the heating unit, a heater divided into at least two parts is provided on the external surface of the crucible at uniform intervals, and the heaters are separately disposed with respect to each other, but are connected to each other by connecting members. Therefore, it is not necessary to perform an additional design whenever the capacity of the crucible is changed, it is not necessary to exchange the evaporation source, and it is possible to reduce cost and to improve repairing ability.

Abstract: A deposition source capable of uniformly producing a deposition film. The deposition source includes a furnace, a first heating unit surrounding the furnace to heat the furnace and a second heating unit spaced-apart from the first heating unit by an interval and surrounding the furnace to heat the furnace, wherein the second heating unit comprises a plurality of separate sub-heating units that surround the furnace.

Abstract: An apparatus for coating substrates with a coating material is disclosed. The apparatus includes a frame and a crucible arrangement including a first crucible and a second crucible disposed on the frame. Only one first shaft is associated with the first crucible and only one second shaft is associated with the second crucible, where the only one first and second shafts are disposed in the frame beneath the first and second crucibles, respectively. Only one first lifting device is associated with the only one first shaft and only one second lifting device is associated with the only one second shaft, where the only one first and second lifting devices are disposed in the frame. The only one first and second shafts and the only one first and second lifting devices are laterally displaceable with the frame.

Abstract: A coating deposition apparatus includes a plurality of mounts that are adapted to mount work pieces at respective work piece locations. A crucible is located adjacent the plurality of mounts for emitting a source coating material. A plurality of gas nozzles are respectively directed at the work piece locations to scatter the emitted source coating material at surfaces of the work pieces that are otherwise difficult to coat.

Abstract: An apparatus for processing coating material includes a crucible having a cylindrical receptacle for receiving coating material, a drive member having a drive shaft, and a cover coupled to the drive shaft. The cover has a flat surface. The drive shaft is configured to drive the cover to rotate thereabout between a closed position where the cover covers the receptacle and the flat surface presses against the coating material to flatten the coating material, and an open position where the cover is moved away from the receptacle.

Abstract: A thin film deposition apparatus includes a substrate supporting unit supporting a substrate, a deposition source evaporating a deposition material to supply a steam of the deposition material to the substrate, and a deposition source shifting unit moving the deposition source so that the deposition source is relatively shifted with respect to the substrate supporting unit.

Abstract: Method and equipment to produce nanopowders of materials based on pure metals, their alloys and chemical compounds of these metals with elements taken from the row of B, C, O and Si, encapsulated into a salt shell selected from the group of NaCl, NaF, LiCl, and LiF or their mixtures, includes independent evaporation by means of electron beam and/or laser radiation sources of the material and alkali metal(s) halogenide and simultaneous deposition of a mixture of their vapor phases on a substrate in a closed pumped-down volume. To achieve the required ratio of vapor flows, a screen with variable cross-section diaphragms is placed between the substrate movable in parallel to the evaporators, and the evaporators, thus allowing an independent regulation of the intensity of the vapor flow coming to the substrate from each of the evaporators.

Abstract: A sputter source is provided. The sputter source includes a shaft extending through a central region of the sputter source. A first end of the shaft is coupled to a drive and a second end of the shaft is coupled to a bottom plate. A first plate having a ramped surface is included where the first plate is stationary. A second plate having a ramped surface is provided where the second plate is disposed above the first plate such that portions of the ramped surfaces contact each other. The second plate is coupled to the shaft, wherein the second plate is operable to rotate and move axially as the shaft rotates in a first direction and wherein the second plate is operable to remain stationary as the shaft rotates in a second direction.

Abstract: This invention provides methods that permit wafers to be loaded and unloaded in a gas-phase epitaxial growth chamber at high temperatures. Specifically, this invention provides a method for moving wafers or substrates that can bathe a substrate being moved in active gases that are optionally temperature controlled. The active gases can act to limit or prevent sublimation or decomposition of the wafer surface, and can be temperature controlled to limit or prevent thermal damage. Thereby, previously-necessary temperature ramping of growth chambers can be reduced or eliminated leading to improvement in wafer throughput and system efficiency.