Abstract: The hydrophobicizing apparatus includes a vaporizing surface forming member of which surface is located in a vaporizing room; a vaporizing surface heating unit that heats the vaporizing surface forming member; a liquid chemical supply port that supplies a liquid chemical for a hydrophobicizing process on the surface of the vaporizing surface forming member; a gas inlet port that introduces a carrier gas into the vaporizing room; an outlet port that supplies a hydrophobicizing gas vaporized in the vaporizing room; and a processing chamber that performs the hydrophobicizing process on a substrate accommodated therein by the hydrophobicizing gas supplied through the outlet port. With this configuration, the hydrophobicizing gas of a high concentration can be supplied onto the substrate. Further, since the stored liquid chemical is not in contact with the carrier gas when a process is not being performed, degradation of the liquid chemical is suppressed.

Abstract: An electron beam vapor deposition apparatus includes a coating chamber including a coating zone for depositing a coating on a work piece. A coating device includes at least one crucible for presenting at least one source coating material. The coating device includes a first deposition mode of depositing the at least one source coating material and a second deposition mode of depositing the at least one source coating material. At least one electron beam source evaporates the at least one source coating material for deposit onto the work piece. A controller is configured to control a speed of movement of the work piece in the coating zone during the coating operation in response to the first deposition mode and the second deposition mode.

Abstract: An apparatus for coating substrates with a coating material is disclosed. The apparatus includes a frame, a crucible arrangement including a first crucible and a second crucible disposed offset from one another in a horizontal plane, where the crucible arrangement is disposed on the frame. At least one first shaft is associated with the first crucible and at least one second shaft is associated with the second crucible, where the at least one first and second shafts are disposed in the frame beneath the first and second crucibles, respectively. A first lifting device is associated with the at least one first shaft and a second lifting device is associated with the at least one second shaft, where the first and second lifting devices are disposed in the frame. The frame is linearly displaceable in the horizontal plane.

Abstract: Apparatus for a deposition system includes a sealing apparatus that seals the drive shaft from the deposition material to prevent the deposition material from adhering to the drive shaft, a moving apparatus to reduce the weight of a shelf on the drive shaft, and a collision-preventing apparatus that measures the distance between a shelf and an adjacent article.

Abstract: The present invention relates to an evaporation source used in a vacuum deposition apparatus for forming an organic film or a metal film. The present invention provides an evaporation source including: a crucible accommodating a deposition material and having an opening portion through which the deposition material passes; a mesh member installed in the opening portion of the crucible and having a plurality of holes; and thermally conductive balls coated on the mesh member. Here, the thermally conductive balls are provided to cover the deposition material having a predetermined interval with the deposition material, not being mixed with the deposition material filling the crucible.

Abstract: An organic thin film deposition system is disclosed. The organic thin film deposition system includes: a plurality of crucibles each having an inlet capable of selectively being opened and closed; an organic composite material made up of two or more organic materials and having an initial composition ratio, the organic composite material for placing in the plurality of crucibles; and a transferring unit for controlling a position of the plurality of crucibles.

Abstract: A point source assembly for a thin film deposition device having a chamber for holding a substrate, includes a crucible configured for holding and vaporizing a deposition material therein, where the crucible is configured for operative engagement to the chamber, an opening in the crucible configured for directing therefrom a vaporized form of the deposition material, where the opening includes a longitudinal line extending through the center of the crucible opening, and means operatively engaged to the crucible for facilitating rotational movement of the crucible for varying the orientation of the longitudinal line relative to the position of the substrate in the chamber.

Abstract: An apparatus and method improves heating of a solid precursor inside a sublimation vessel. In one embodiment, inert, thermally conductive elements are interspersed among units of solid precursor. For example the thermally conductive elements can comprise a powder, beads, rods, fibers, etc. In one arrangement, microwave energy can directly heat the thermally conductive elements.

Abstract: A vapor deposition apparatus is provided, which does not cause changes in composition, decomposition and quality change of an organic vapor deposition material. The organic vapor deposition material is placed on a conveying unit by an amount for a single substrate, and conveyed into a vapor deposition vessel preliminarily heated. Since a small amount of the organic vapor deposition material is heated and exhausted through generation of an organic material vapor under heating condition for each substrate, neither decomposition nor quality change with moisture occurs because heating time is short. Even though different organic compounds are mixed, no change in composition occurs so that an organic vapor deposition material in which a base material is mixed with a coloring substance can be pooled in a pooling tank and then placed in the conveying unit.

Abstract: An apparatus includes a workpiece support, a source for emitting a plume of coating material that flows toward the workpiece support, and plume influencing structure between the source and the workpiece support. The plume influencing structure includes a shield with plural openings extending therethrough approximately parallel to a general direction of flow of the plume away from the source. According to a different aspect, a method includes emitting from a source a plume of coating material that flows toward a workpiece support, and adjusting the flow of the plume with a shield between the source and the workpiece support, the shield having plural openings extending therethrough approximately parallel to a general direction of flow of the plume.

Abstract: An exemplary device for film coating, is provided. The device has an evaporating unit, wherein the evaporating unit includes a driving member and a carrier. The driving member has an extending rotatable shaft. The carrier includes a main body, a plurality of branches and a plurality of crucibles. The branches each extend from the main body. The crucibles each are supported by a respective one of the branches and configured for receiving a film material therein. The rotatable shaft is engaged in the main body and thereby rotating the carrier.

Abstract: The invention provides an evaporation apparatus, which is able to improve an efficiency of evaporation materials, uniformity of deposited films, and throughput of the evaporation process. Disclosed is an evaporation source holder, which is installed in an evaporation chamber and configured to hold an evaporation material, and a moving mechanism, which is configured to move the evaporation source holder during evaporation of the evaporation material. The evaporation apparatus is further characterized by a shutter over the evaporation source holder, a filter over the shutter, and a heater surrounding the filter.

Abstract: A feed system and related process are configured to continuously feed measured doses of source material to a vapor deposition apparatus wherein the source material is sublimated and deposited as a thin film on a substrate. The system includes a bulk material hopper, and an upper dose cup disposed to receive source material from the hopper. A lower dose cup is disposed in a vacuum lock chamber to receive a measured dose of source material from the upper dose cup. A transfer mechanism is disposed below the vacuum lock chamber to receive the measured dose of source material from the lower dose cup and to transfer the source material to a downstream deposition head while isolating the deposition conditions and sublimated source material within the deposition head.

Abstract: A workpiece support member can rotate about an axis relative to a source, and the source can emit a plume of coating material that flows toward the workpiece support member approximately parallel to the axis. A plume-influencing shield can rotate with the workpiece support member, and has a plurality of openings extending therethrough approximately parallel to the general direction of flow of the plume. According to a different aspect, a method involves: rotating a workpiece support member about an axis relative to a source; emitting from the source a plume of coating material that flows toward the workpiece support member approximately parallel to the axis; and influencing the plume with structure that includes a shield rotating with the workpiece support member, the shield having a plurality of openings extending therethrough approximately parallel to the general direction of flow of the plume.

Abstract: In a method for coating substrates with materials to be vaporized in a vacuum coating system, the vaporization material is deposited on the substrate by double vaporization using an intermediate carrier. The intermediate carrier is continuously moved and.

Abstract: A method of forming a plurality of multi-layer organic films in a single process includes preparing a first evaporating source that evaporates a first evaporating source material onto a first deposition region and a second evaporating source that evaporates a second evaporating source material onto a second deposition region, wherein the first evaporating source material and the second evaporating source material are different from each other, adjusting the first evaporating source and the second evaporating source in order to obtain a first overlapping region in which the first deposition region and the second deposition region overlap each other, driving the first evaporating source and the second evaporating source to deposit the first evaporating source material and the second evaporating source material onto a portion of an object to be processed, and moving the first evaporating source and the second evaporating source from a first end of the object to a second end of the object to form a multilayer fil

Abstract: The invention provides an evaporation apparatus, which is able to improve an efficiency of evaporation materials, uniformity of deposited films, and throughput of the evaporation process. Disclosed is an evaporation source holder, which is installed in an evaporation chamber and configured to hold an evaporation material, and a moving mechanism, which is configured to move the evaporation source holder during evaporation of the evaporation material. The evaporation apparatus is further characterized by a shutter over the evaporation source holder, a filter over the shutter, and a heater surrounding the filter.

Abstract: Improved methods and apparatus for forming thin-film layers of semiconductor material absorber layers on a substrate web. According to the present teachings, a semiconductor layer may be formed in a multi-zone process whereby various layers are deposited sequentially onto a moving substrate web.

Abstract: The present invention provides a thin film manufacturing method which realizes stable, highly-efficient film formation using a nozzle-type evaporation source while avoiding unnecessary scattering and deposition of a film formation material after the termination of the film formation. Used is a film forming apparatus including: an evaporation chamber 16; a film forming chamber 17 in which a substrate 21 is provided; an evaporation source 19 holding a film formation material 15 and including an opening surface 14; a moving mechanism 35 configured to cause the evaporation source 19 to move; and a conductance variable structure 34.

Abstract: A vaporizer (300) is formed by connecting block-shaped vaporization modules (310). Each vaporization module has a discharge opening for a liquid source material; a vaporization chamber (370) for vaporizing the liquid source material, which is discharged from the discharge opening, to create a source gas; a liquid material flow path (320) formed so as to penetrate through joint surfaces connected to other vaporization modules; and a spray nozzle communicating with a portion in the middle of the liquid material flow path and leading the liquid source material, which flows in the flow path, to the discharge opening. Each vaporization module is connected at its joint surface to each of the other vaporization modules to cause the liquid material flow paths of all the vaporization modules to communicate with one another. When various flow rates ranging from low to high levels is required, the structure of the evaporator can be easily changed according to such rates without a reduction in evaporation efficiency.

Abstract: The present invention provides a thin film manufacturing method which realizes stable, highly-efficient film formation using a nozzle-type evaporation source while avoiding unnecessary scattering and deposition of a film formation material before the start of the film formation. Used is a film forming apparatus including: an evaporation chamber 16; a film forming chamber 17 in which a substrate 21 is provided; an evaporation source 19 holding a film formation material 15 and including an opening surface 14; a moving mechanism 35 configured to cause the evaporation source 19 to move; and a conductance variable structure 34. The film forming chamber 17 and the evaporation chamber 16 are evacuated. In a state where the differential pressure between these chambers can be secured by the conductance variable structure 34, the nonreactive gas is introduced to the evaporation chamber 16 to adjust the pressure in the evaporation chamber 16 to predetermined pressure or more.

Abstract: A deposition system is provided which is adapted for depositing a thin film onto a substrate. The deposition system includes a substrate carrier adapted for carrying the substrate and at least one tilted evaporator crucible. The at least one tilted evaporator crucible is adapted for directing evaporated deposition material towards the substrate in a main emission direction. The main direction emission of the tilted evaporator crucible is different from a direction normal to the substrate.

Abstract: The invention relates to a vacuum treatment plant comprising an evaporator (1) for vacuum coating facilities. The evaporator (1) according to the invention comprises a device for guiding a supply line (4) movable in a gripping direction (A) and intended for gripping and positioning an evaporation boat (3) having a base (22) and further comprises two spacers (18, 19) which the movable supply line (4) flexibly connects to the base (22), with the spacers (18, 19) being disposed on one side each with the movable supply line (4) and with the other side on the base (22), thus enabling the first supply line (4) to be forcibly guided, and with the spacers (18, 19) having such a length and configuration between the first supply line (4) and the base (22) that the guidance direction (B) is essentially parallel to the gripping direction (A) at least across a small deflection range of the spacers (18, 19).

Abstract: This invention provides apparatus, protocols, and methods that permit wafers to be loaded and unloaded in a gas-phase epitaxial growth chamber at high temperatures. Specifically, this invention provides a device for moving wafers or substrates that can bath a substrate being moved in active gases that are optionally temperature controlled. The active gases can act to limit or prevent sublimation or decomposition of the wafer surface, and can be temperature controlled to limit or prevent thermal damage. Thereby, previously-necessary temperature ramping of growth chambers can be reduced or eliminated leading to improvement in wafer throughput and system efficiency.

Abstract: A crucible assembly for deposition and an inner plate used in the crucible assembly. The crucible assembly includes a main body having an inner space accommodating a deposition material and an opening arranged at an upper portion of the inner space, a cap having an aperture arranged at a top of the main body and combined with the main body and an inner plate arranged between the main body and the cap, the inner plate covering the opening of the main body, the crucible assembly including inner channels arranged to allow vapor of the deposition material from the inner space of the main body to be expelled to an outside of the aperture in the cap via a space arranged between an outer side surface of the inner plate and an inner side surface of the cap.

Abstract: An object of the present invention is to carry out stable film deposition for a long stretch of time without an evaporation material being stuck in a manufacturing apparatus that carries out evaporation. A driving portion that can move a crucible up and down is provided for an evaporation source of an evaporation apparatus. When the opening of the crucible is clogged with the evaporation material, the crucible is moved down and sealed in the evaporation source. The heater of the evaporation source can heat the opening efficiently; therefore, the evaporation material with which the opening is filled is evaporated; therefore, the blockage can be dissolved. Thereafter, the crucible is moved above and heated to carry out evaporation. It is possible to carry out film deposition without exposure to the atmosphere for a long stretch of time, which can improve the productivity of an organic EL element.

Abstract: An evaporation apparatus is capable of preventing a sag phenomenon in a substrate. The evaporation apparatus includes a substrate supporting unit. The substrate supporting unit includes a substrate supporter for supporting side walls of a substrate in a chamber toward the same direction as an intake direction of the substrate entering the chamber; and a substrate-aiding supporter for supporting other side walls of the substrate that are not supported by the substrate supporter.

Abstract: A crucible heating apparatus and a deposition apparatus including the same. The crucible heating apparatus includes: a crucible including a main body to house a deposition material, and a cover disposed on the main body, having a nozzle; a band coupled to the crucible, through contact parts; a thermocouple coupled to the band; a housing to house the crucible and the band; and a heater disposed inside the housing, to heat the deposition material.

Abstract: One aspect of the invention comprises a thermal evaporation source comprising an evaporant chamber, a heater for providing heat to the evaporation chamber; and a crucible in thermal communication with the evaporation chamber for containing a volume of evaporant. The evaporant chamber comprises a first material of construction, and the crucible comprises a second material of construction different from the first material of construction and having a lesser porosity with respect to the evaporant than the first material of construction. For example, for a copper evaporant, the evaporant chamber may comprise a sintered material, such as sintered graphite, and the crucible may comprise a pyrolytic material, such as pyrolytic graphite or pyrolytic boron nitride.

Abstract: A multiple vacuum evaporation coating device and a method for controlling the same. The vacuum evaporation coating device includes a plurality of evaporation sources, a rotating part adapted to rotate the plurality of evaporation sources and a coating block plate adapted to block all but one of said plurality of evaporation sources at any time, each of the plurality of evaporation sources comprise a case, a melting pot arranged within said case, an evaporation material arranged within the melting pot, a heating device arranged outside the melting pot and adapted to heat and evaporate the evaporation material, and a cooling device adapted to block heat generated by the heating device from transferring to an outside.

Abstract: The present invention provides a carbon film coated member comprising: a base material; and a coated film formed on at least part of a surface of the base material, the coated film comprising: a matrix composed of amorphous carbon; and at least one of metal and metal carbide contained in the matrix, wherein an atomic ratio (M/C) of the metal (M) to carbon (C) constituting the coated film is 0.01 to 0.7. According to the above structure, there can be provided a carbon film coated member excellent in low-friction property, wear resistance and durability, and capable of suppressing a dust generation, peeling-off and deterioration of the coated film even if the carbon film coated member is used as semiconductor equipment members such as wafer cassette, dummy wafer, probe pin or the like under severe operating conditions, so that the carbon film coated member would not exert a bad influence onto the resultant semiconductor products.

Abstract: An apparatus and method improves heating of a solid precursor inside a sublimation vessel. In one embodiment, inert, thermally conductive elements are interspersed among units of solid precursor. For example the thermally conductive elements can comprise a powder, beads, rods, fibers, etc. In one arrangement, microwave energy can directly heat the thermally conductive elements.

Abstract: The present invention provides an evaporation apparatus, which is one type of film formation apparatus and provides superior uniformity in EL layer film thickness, superior throughput, and improved utilization efficiency of EL materials and an evaporation method. The present invention is characterized in that an evaporation source holder, in which a container that encloses an evaporation material is disposed, is moved at a certain pitch with respect to a substrate during evaporation. Further, a film thickness monitor is integrated with the evaporation source holder for the movement. Furthermore, film thickness can be made uniform by adjusting the moving speed of the evaporation source holder in accordance with values measured by the film thickness monitor.

Abstract: A deposition method and apparatus provide a uniform deposition rate and good reproducibility in a process used to deposit a material onto a substrate. The deposition method includes preparing a substrate on which a thin film is deposited, preparing a line source that includes a plurality of heating crucibles are disposed in line, and rotating the line source while depositing the deposition material on the substrate.

Abstract: A method for forming a thin film includes the steps of: supplying a deposition material in the form of a liquid onto a heated surface; heating and vaporizing the deposition material on the heated surface while the deposition material is undergoing movement; and depositing the deposition material onto a deposition surface. The deposition material is supplied onto a position of the heated surface where the vaporized deposition material does not reach the deposition surface.

Abstract: An evaporator cell for evaporating a high-melting material to be evaporated, comprises a crucible for receiving the material to be evaporated, and a heating device with a heating resistor for the resistance heating of the crucible, the heating resistor being provided as an electron emitter for the electron beam heating of the crucible.

Abstract: An exemplary device for film coating, is provided. The device has an evaporating unit, wherein the evaporating unit includes a driving member and a carrier. The driving member has an extending rotatable shaft. The carrier includes a main body, a plurality of branches and a plurality of crucibles. The branches each extend from the main body. The crucibles each are supported by a respective one of the branches and configured for receiving a film material therein. The rotatable shaft is engaged in the main body and thereby rotating the carrier.

Abstract: A method of forming a plurality of multi-layer organic films in a single process includes preparing a first evaporating source that evaporates a first evaporating source material onto a first deposition region and a second evaporating source that evaporates a second evaporating source material onto a second deposition region, wherein the first evaporating source material and the second evaporating source material are different from each other, adjusting the first evaporating source and the second evaporating source in order to obtain a first overlapping region in which the first deposition region and the second deposition region overlap each other, driving the first evaporating source and the second evaporating source to deposit the first evaporating source material and the second evaporating source material onto a portion of an object to be processed, and moving the first evaporating source and the second evaporating source from a first end of the object to a second end of the object to form a multilayer fil

Abstract: A deposition apparatus comprises a first cavity which comprises an evaporation source entrance and a gas discharge port; a second cavity operable to communicate with the first cavity through the evaporation source entrance; an opening/closing part which controllably opens and closes the evaporation source entrance; and a driver for moving the evaporation source between the first cavity and the second cavity through the evaporation source entrance.

Abstract: The present invention provides a system and method for uniform coating of a substrate at high deposition rates by evaporating a coating material in a vacuum chamber. The system includes an evaporator having a heating crucible for containing a coating material to be evaporated and a generally planar heat source disposed so as to heat a surface of a coating material contained in the heating crucible. Preferably, the heat source is manufactured from a ceramic or intermetallic material and includes a first layer defining a first set of openings and a second layer defining a second set of openings wherein the second layer overlies the first layer and is spaced apart therefrom. The first and second sets of openings allow the evaporated coating material to pass therethrough for dispersion of the coating material in a deposition zone defined by a containment shield disposed above the heat source.

Abstract: A laser monitoring and controlling apparatus is disclosed that includes a laser, a data server and a laser Graphical User Interface (GUI). In an embodiment, the apparatus further includes, an imaging means and means for displaying images from the imaging means on the GUI.

Abstract: In an evaporation source, a separable heater is used when an organic thin film is formed on a substrate in order to realize full-colors so that it is possible to correspond to crucibles of various capacities. The evaporation source comprises a crucible in which an organic material which is an organic thin film material is accommodated, and the crucible includes a heating unit and at least one spray nozzle for spraying the organic material onto a substrate. In the heating unit, a heater divided into at least two parts is provided on the external surface of the crucible at uniform intervals, and the heaters are separately disposed with respect to each other, but are connected to each other by connecting members. Therefore, it is not necessary to perform an additional design whenever the capacity of the crucible is changed, it is not necessary to exchange the evaporation source, and it is possible to reduce cost and to improve repairing ability.

Abstract: CVD, ALD, and other vapor processes used in processing semiconductor workpieces often require volatilizing a liquid or solid precursor. Certain embodiments of the invention provide improved and/or more consistent volatilization rates by moving a reaction vessel. In one exemplary embodiment, a reaction vessel is rotated about a rotation axis which is disposed at an angle with respect to vertical. This deposits a quantity of the reaction precursor on an interior surface of the vessel's sidewall which is exposed to the headspace as the vessel rotates. Other embodiments employ drivers adapted to move the reaction vessel in other manners, such as a pendulum arm to oscillate the vessel along an arcuate path or a mechanical linkage which moves the vessel along an elliptical path.

Abstract: A deposition source is provided which is installed in a chamber, heated by applied electric power to transfer heat to a vapor deposition material received therein and applying a vaporized deposition material generated therein to a substrate to form deposition organic electroluminescent layers onto the substrate. The deposition source includes a vessel formed of a top plate on which a vapor efflux aperture is formed, a side wall, and a bottom wall; a heating device that supplies heat to the deposition material received in the vessel, the heating device being capable of moving vertically; and a moving device that moves the heating device (or the bottom wall), the moving device (or the bottom wall) being operated in response to the signal of a sensing device on varied distances between the heating device and the surface of said deposition material.

Abstract: An exemplary configurable vacuum system is provided for use in coating or plating that provides the capability and versatility to handle substrates of significantly different shapes and sizes. The configurable vacuum system includes a vacuum table assembly, a mechanical drive, an electrical feed through, a filament, and a vacuum chamber. The vacuum table assembly may include a support frame, a sliding means, such as a roller or rollers, an insulated surface, and a platform operable to rotate and support the substrate. The mechanical drive is operable to rotate the platform, the electrical feed through provides an electrical signal to the substrate, and the filament is positioned relative the substrate. The vacuum chamber includes a main opening, an internal volume, and a receiving means, such as a railing or member, operable to receive and support the vacuum table assembly within the internal volume of the vacuum chamber and through the sliding means of the vacuum table assembly.

Abstract: An improved crucible cover for multiple pocket electron beam sources has been invented. The invention provides selection between one of the multiple pockets for evaporative heating and a noncontacting, line-of-sight blocking baffle between heated and unheated pockets. In one embodiment, the baffle is formed by the cooperation of a crucible surface groove with a cover feature that extends into the groove. In a second embodiment, the baffle is formed by a barrier extending upwards from the crucible surface between pockets that cooperates with a cover to form the line-of-sight baffle. The crucible and cover in these embodiments accommodate deposits without hindering the ability of the baffle to reduce contamination or interfere with the operation of the source. Additionally, the cover and crucible may be operated separately, with a cover lifting mechanism that lowers the cover to form a baffle and raises the cover to allow the separately controlled rotation of the crucible.

Abstract: One or more of three different measures are taken to preheat a wafer before it is loaded into direct contact with a wafer holder, in order to provide optimal throughput while reducing the risk of thermal shock to the wafer. The first measure is to move the wafer holder to a raised position prior to inserting the wafer into the reaction chamber and holding the wafer above the wafer holder. The second measure is to provide an increased flow rate of a heat-conductive gas (such as Hs purge gas) through the chamber prior to inserting the wafer therein. The third measure is to provide a power bias to radiative heat elements (e.g., heat lamps) above the reaction chamber.

Abstract: One embodiment relates to an apparatus for sputtering material onto a workpiece, the apparatus including a vacuum chamber and a target disposed in the vacuum chamber, the target comprising a material to be deposited onto said workpiece. The apparatus also includes a holder for the workpiece and at least one recyclable process kit component positioned to accumulate material sputtered from the target. The process kit component includes a base metal layer including titanium and an outer layer of titanium nitride. The titanium nitride layer acts as an etch stop during recycling of the process kit component. The process kit component may include a part selected from the group of a shield, pedestal, shutter, coil, collimator, deposition ring, cover ring, and clamp ring.

Abstract: A deposition apparatus includes a vacuum chamber and a heating crucible. A substrate, on which deposition films are formed, is installed in the vacuum chamber. The heating crucible is installed opposite to the substrate so as to vaporize an organic compound. The heating crucible includes a main body and an inner plate. The main body includes a space which contains the organic compound and a nozzle through which the organic compound that is vaporized is discharged. The inner plate is installed within the main body and includes at least one opening formed around an edge of an area facing the nozzle, so as to transmit the vaporized organic compound.

Abstract: The invention provides an evaporation system which is one of deposition devices promoting an efficiency of utilizing an EL material and excellent in uniformity and throughput of forming an EL layer and an evaporation method therefor. Further, the invention provides a method of efficiently vapor-depositing an EL material to a large area substrate. Further, the invention provides a system capable of avoiding an impurity from mixing to the EL material.