Abstract: A cutting disc core for a circular shaped saw blade which has a circular shaped body which has a center hole and a circular peripheral edge upon which is to be mounted a plurality of spaced apart cutting segments that is to perform the cutting of the saw blade. Surrounding the center hole and formed within the body are a plurality of slits with there being a solid tab that is integrally connected to the body located between each directly adjacent pair of slits. The tab constitutes a frangible seal with the circular ring or bushing which is formed about the center hole to be removable by being forcibly physically separated from the body.

Abstract: The present invention provides for an apparatus for forming a V groove in a sheet of natural, synthetic or engineered stone material. The apparatus comprises a table for supporting a work piece of natural, synthetic or engineered stone material to be cut, two or more cutting heads aligned to cut along the same line of the work piece of natural, synthetic or engineered stone material and a mechanism for moving the work piece or the cutting heads relative to one another to cut the V groove in the natural, synthetic or engineered stone work piece. Each of the cutting heads removes material from the natural, synthetic or engineered stone work piece with the final cutting head forming the shape of the desired V groove. Each of the cutting heads is provided with a means for air cooling the cutting surfaces.

Abstract: The present invention is a steering guide for surface cutting machines. The steering guide is made up of two sighting means that are connected to a surface cutting machine by a guide arm and are configured to align with the cutting edge portion of the saw blade. The first and second sighting means are visible by the sawyer while operating the device. Since the first and second sighting means are configured to align with the saw blade along a straight line, aligning the first and second sighting means with the guide line also aligns the cutting portion of the saw blade with the guideline. This enables the saw blade to be kept in alignment with the guideline while moving along a surface to be cut.

Abstract: A dry and wet cutting tile saw includes a base seat in which is a disk saw blade actuated by a motor and protected by a lateral and an upper blade guards, a water sink integrated with the base seat positioned under the disk saw blade and a working station made of metallic material pivotally and adjustably secured to the top of the base seat. The working station has a pair of sliding grooves of stepped section in upper surface for selectively and slidably disposing a circle. An inverse U-shaped ruler is also disposed on the top of the working station. It is characterized that a vacuum cleaner connects to the lateral blade guard able to suck all the dirts and chips from a working piece. So that this tile saw can either conduct a dry cutting or a wet cutting of a tile without dirt contaminating the fresh air.

Abstract: A cutting device for breaking fragile materials is constructed to include a lifting mechanism adapted to move the cutter vertically, a rotary table adapted to control the cutting angle of the cutter on the workpiece, a feed mechanism adapted to control the federate of the cutter, and a rotary mechanism adapted to rotate the cutter for enabling the cutter to cut the workpiece with one of multiple cutting points thereof selectively.

Abstract: A portable saw has a depth or blade lowering control and an adjustable stop for selecting the maximum depth of the blade to which the blade can be lowered.

Abstract: A cutting machine comprising a chuck table for holding a workpiece, a spindle unit having a rotary spindle for mounting a cutting blade which cuts the workpiece held on the chuck table, and a spindle unit support mechanism for supporting the spindle unit in such a manner that it can move in a cutting direction, wherein the spindle unit support mechanism comprises a movable base, a guide rail which is provided on the movable base and has a predetermined curvature radius, a spindle unit support member which is movably disposed along the guide rail and mounts the spindle unit, and an angle adjustment mechanism for moving the spindle unit support member along the guide rail to adjust the angle.

Abstract: A tuck pointing blade includes at least two saw blades, each having multiple slots positioned radially around a perimeter, and a gap between a perimeter cutting surface of each adjacent saw blade. Each saw blade is arranged so that the multiple slots are offset relative to the multiple slots in each adjacent saw blade. In addition, the tuck pointing blade can be configured with three or more saw blades including adjacent blades having different physical properties and/or materials.

Abstract: A method and mechanism for slicing a thin film wafer. A closure is bonded to a section of a thin film wafer. A blade is used to slice a row from the section of the wafer by cutting through the closure and thin film wafer such that opposite sides of the blade engage an equal surface area of the closure.

Abstract: An apparatus A for cutting off an unnecessary object deposited on a casting includes a motor having a rotary shaft 3 adapted to be rotated at a high speed, and a disk-shaped diamond tip saw 2 mounted at a tip end 4 of the rotary shaft 3 and adapted to be rotated by the rotation of the rotary shaft 3 to cut off the unnecessary object 9 on the casting 8, so that the tip saw 2 is rotated at a rotational speed in a range of 6,000 rpm to 8,000 rpm. Thus, the rigidity of the diamond tip saw 2 rotated at the high speed is increased by a centrifugal force provided by the diamond tip saw 2 itself and a gyroscopic moment effect to reduce the thickness of the diamond tip saw 2 can be reduced by a value corresponding to an increment in rigidity of the tip saw 2, whereby the amount of diamond tips (diamond blades) used can be decreased; an energy-saving for a cutting power can be achieved, and the amount of chips produced upon the cutting of the unnecessary object can be reduced.

Abstract: Abrading and cutting devices such as saws include waste containment systems and methods to improve removal of slurry or other contaminants from a work area during operations, and separation of slurry from a carrying medium such as air. A blade guard includes fluid channels, and may be removable from a blade guard carriage. The carriage may be used to minimize any need to readjust the blade guard position when the blade guard is returned to the carriage for further use. A vacuum bar may be included on the carriage. A vacuum pickup assembly may be used with a blade guard, and the vacuum assembly may include separate and/or different vacuum pickup configurations.

Abstract: A cutting-tool mounting structure includes a cutting-tool base that supports a cutting-tool blade and permits one to pivot the blade about an axis parallel to the cutting direction of the blade and through a range of positions. The range of positions includes a first position where the blade is perpendicular or approximately perpendicular to the cutting surface, a second position where the blade is canted to one side of the first position, and a third position where the blade is canted to the other side of the first position. The tool base includes a motor mount that supports a cutting-tool motor and a blade mount that supports the blade and is rotatably attachable to the motor mount. By rotating the blade mount, the vertical cutting angle of the blade can be made substantially perpendicular to a cutting surface so that the blade can be positioned perfectly plumb for cutting.

Abstract: In the cutting solution supplying and controlling apparatus for a dicing machine, a flow rate adjusting device is provided in addition to a regulator as the pressure adjusting device. The flow rate adjusting device has a flow rate controller, which controls a proportional solenoid valve according to a signal applied from a flow rate sensor as a feedback signal. Thus, even if the pressure of the water supplied from the water supply equipment of the factory changes, the flow rates of the cutting solution and the coolant are maintained. Moreover, the flow rates can be easily adjusted according to the type of work to be processed.

Abstract: A horizontal frame saw is equipped with a plurality of generally parallel, spaced-apart blades for cutting granite. Each of the blades has a cutting edge with diamond cutting segments mounted thereon for engaging the granite with a swinging motion for cutting of the granite, wherein the segments have optimized/controlled segment variables for uniform wearing of the segments along each blade during cutting of granite. Segment variables include one or more of: spacing of segments along the length of the blade; diamond concentration in each segment; diamond grade (as measured by compressive fracture strength) in each segment; segment composition (bond, secondary abrasives); or segment dimensions.

Abstract: The flange cover covering the blade is divided into two. The second cover is turnably connected to the first cover through a shaft parallel with the spindle of the blade, and the second cover is opened and closed in connection with vertical movement of the spindle. When the spindle is moved upward for replacing the blade, the second cover is automatically turned to the opening position, and L-shaped coolant jetting nozzles are moved away from positions below the blade to positions beside the blade. Thus, the blade can be easily replaced, and an automatic blade replacing system can be applied.

Abstract: A sawing machine has a casing, a moveable cover and a saw blade both pivotally mounted inside the casing. Two block rings are respectively mounted at two lateral sides of a pivoted portion of the moveable cover for preventing sawing chips generated by the saw blade sawing a workpiece in a sawing procedure from entering the pivoted portion of the moveable cover.

Abstract: A glide plate assembly for a cutting saw having a cutting blade, including a glide plate bracket attachable to a cutting saw and having a substantially planar portion with a longitudinal aperture located therein. A glide plate overlay made of a material penetrable by the cutting blade is configured for attachment over the aperture in the glide plate bracket, such that upon attaching the glide plate bracket to the cutting saw with the glide plate overlay attached over the aperture and operating the cutting saw, a slot is formed in the glide plate overlay by the cutting blade. A glide plate overlay for attachment to the underside of a cutting saw having a cutting blade is also provided that includes a substantially planar portion disposed between two mounting portions, the mounting portions being configured to secure and position the glide plate overlay over a cutting slot located on the underside of the cutting saw.

Abstract: The dicing machine has a shielding plate movably arranged between a processing part and a microscope so as to check mist and spray produced from the processing part. The shielding plate can be moved back and forth between a shielding position and a retreated position, so that the shielding plate is positioned at the shielding position during processing of the work and at the retreated position when the operator replaces the old blade with a new one. Thus, even if the dicing machine has two spindles facing to each other, the shielding plate does not interfere with replacement of blades on the spindles.

Abstract: In the dicing machine, a parallel adjustment process between a cut-line of a blade and cut-line images displayed on a monitor can be easily performed. In the dicing machine, at least one of the first and second cut-line images displayed on the monitor is electronically moved by an image moving device so as to arrange the first and second cut-line images in the same straight line on the monitor. Thus, in the dicing machine of the present invention, the parallel adjustment can be easily performed as compared with the conventional dicing machine in which the parallel adjustment is mechanically performed by moving an imaging device.

Abstract: A cutting machine includes two cutting means. In a front half of a housing, a chucking zone is located in a widthwise center. A cassette placing zone is located on one side of the chucking zone, and a cleaning zone is located on the other side of the chucking zone. In a latter half of the housing, a cutting zone is disposed in a widthwise center. Rotating shafts of the two cutting means extend straightly in a width direction in the rear half of the housing.

Abstract: An apparatus and method to cut irregularly shaped dice from a wafer using a fluid jet cutting system. One embodiment of the invention involves a method to cut irregularly shaped dice from a wafer, such as planar light-wave circuit device. The method includes placing a wafer on a fixture; aligning the wafer in the fixture to expose the dice to a fluid jet cutting nozzle; supplying an abrasive to the fluid jet cutting nozzle; supplying a pressurized fluid to the fluid jet cutting nozzle expelling the abrasive in combination with the fluid from the fluid jet cutting nozzle at a velocity sufficient to cut through the wafer, while the fluid jet cutting nozzle moves in relation to the wafer in the fixture; and removing the dice from the fixture after the dice have been cut from the wafer. A second embodiment of the invention is directed to an apparatus to provide a wafer die cutting system to cut a wafer.

Abstract: A device is provided to assist in the cutting, mitrering, chamfering, and similar operations of ceramic and other tiles. The device can be readily attached to, and subsequently removed from, a cutting implement, such as an angle grinder or a circular saw or jig saw. The device includes an elongate L-shaped member (1). Approximately mid-length of the member (1), there is a slot (2). A first shaped, rigid arm (3) is fixed at one of its ends (4) to one end (5) of the elongate member (1) by rivets (6). Near the other end (7) of the arm (3), there is a hole (8). A second shaped, rigid arm (9) is fixed at one of its ends (10) to the other end (11) of the elongate member (1) by rivets (12). Near the other end (13) of the arm (9) there is a hole (14).

Abstract: The present invention provides a fixture for mounting a substrate to mounting tape on a film frame so as to retain the substrate to the film frame for dicing. A plurality of grooves for receiving a cutting saw extend longitudinally and transversely across the fixture to define die regions. The fixture also includes a plurality of apertures that align with the substrate and with dies to be cut from the substrate. The aligned apertures supply vacuum to the substrate to retain the substrate and cut dies in the fixture. When the dicing is completed, the vacuum is turned off and the individual dies can be readily removed from the fixture.

Abstract: The present invention provides a fixture for mounting a substrate to mounting tape on a film frame so as to retain the substrate to the film frame for dicing. A plurality of grooves for receiving a cutting saw extend longitudinally and transversely across the fixture to define die regions. The fixture also includes a plurality of apertures that align with the substrate and with dies to be cut from the substrate. The aligned apertures supply vacuum to the substrate to retain the substrate and cut dies in the fixture. When the dicing is completed, the vacuum is turned off and the individual dies can be readily removed from the fixture.

Abstract: Cutting tools and machining tools are provided having PCBN tips and/or coatings bonded to their cutting or machining surfaces for cutting or machining cement and/or mineral based hard building materials such as Hardiplank®.

Abstract: An internal diameter blade includes an inner diameter having an inner cutting edge, an outer diameter having an outer mounting edge, a blade surface defined between the inner edge and the outer edge, and a plurality of cuts in the blade surface. In various embodiments, the cuts reduce a vacuum between the blade and a material being cut by the blade. In various embodiments, the plurality of cuts comprises a plurality of holes through the blade. In various embodiments, the plurality of cuts comprises at least one groove extending in a direction away from the inner edge. A cutting method uses an internal diameter blade to reduce a vacuum between the blade and a material being cut by the blade.

Abstract: A portable concrete saw has a rotating concrete cutting blade that is rotated about a rotational axis by rotating drive shaft mounted to the saw and driven by a motor on the saw. A threaded recess in a distal end of the drive shaft is aligned parallel to the rotational axis but offset from that axis. An arbor sleeve is mounted to rotates with the distal end of the drive shaft. The sleeve has a non-symmetric blade mounting portion thereon to orientate the cutting blade in only one orientation. The sleeve has a hole therethrough parallel to the rotational axis through which the distal end of the shaft extends. A clamping plate has a recess aligned with and configured to receive at least one portion of the blade mounting portion in order to align the plate to rotate about the rotational axis. The plate has a geometric center with a hole through the plate parallel to the rotational axis but offset from the geometric center.

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers are disclosed comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: A semiconductor wafer saw for dicing semiconductor wafers comprises variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: The present invention provides a method and apparatus for cutting a stone workpiece to make a pair of stone veneer products which are capable of being handled without breaking, and which are advantageously used as a decorative product on all types of outside and inside wall surfaces in the construction industry.

Abstract: A structurally improved stone cutter including a rectangular frame supported by a foldable stand, a rectangular sink in the frame, a rectangular platform having sliding devices on two end slidably engaged with a pair of guide rods of the frame, a brace secured to a corner of the frame for supporting a positioning plate on the top, a motor positioned on a top having a first wheel on one end, a tubular shaft releasably secured to an underside of the positioning plate opposite to the motor and having a spindle therein supported by bearings, a second wheel secured to one end of spindle, a fan cap and a saw blade secured to the other end of the spindle, a belt tensely wrapped on the first and second wheels, a blade guard positioned on the top of the saw blade and secured on one end to an outer lateral surface of the positioning plate and a working station having a L-shaped edge releasably engaged into the gap of the frame.

Abstract: A movable machine, for example a saw, has a light construction using composite materials such as fiber reinforced resins and a closed cell foam. The saw may have a housing formed from multiple skins of the composite materials in which in the closed cell foam. Metallic inserts may be used to bond to either or both of the foam and the composite skin to accept working components. A saw is also described which uses gears sharing the same support element.

Abstract: A masonry cutter comprising a tripod having legs for straddling the masonry to be cut and a cutting assembly mounted between the legs. The cutting assembly comprises a cutting element, preferably a circular saw, and a means for operating the cutting element. The legs may be vertically adjustable. Adjustment of the legs permits changing the angle between a plane parallel to the cutting element and a plane parallel with the masonry to be cut. The tripod may be mounted to a frame by means of a pivot with a vertical pivot axis passing through the pivot. This allows the tripod legs to be positioned and the cutting assembly to be oriented so that the first and second axes are in a desired direction with reference to the masonry to be cut. In one embodiment, the masonry to be cut is a sidewalk slab and the apparatus is used to remove trip hazards from the sidewalk slab. The masonry cutter may be removably mounted to a vehicle.

Abstract: A semiconductor wafer dividing method for dividing a semiconductor wafer, in which a plurality of rectangular regions are demarcated by streets arranged in a lattice pattern on the face of the semiconductor wafer, and a semiconductor circuit is disposed in each of the rectangular regions, into the individual rectangular regions. This method includes a groove cutting step of cutting the face of the semiconductor wafer along the streets to form grooves along the streets on the face of the semiconductor wafer, and a back grinding step of grinding the back of the semiconductor wafer to reduce the thickness of the semiconductor wafer to not more than the depth of the grooves, thereby dividing the semiconductor wafer along the streets. This method further includes, before the back grinding step, a groove depth measuring step of measuring the depth of the grooves.

Abstract: Centering elements for effectively reducing the clearance between a shaft and a rotatable element, such as a blade-fixing flange of a dicing saw for semiconductor substrates or carrier substrates, installable thereon are disclosed. In addition, the centering elements may be used to substantially align a center of mass of a rotatable element installed onto the shaft with the axis of rotation of the shaft. The centering element may position the center of mass of a rotatable element at a position that is in substantial alignment with the axis of rotation. Methods for assembling rotatable elements onto shafts and methods for balancing such rotatable elements are also disclosed. Multiple fixtures as well as multiple centering elements may be employed. In addition, one centering element may position more than one fixture.

Abstract: A frame structure for a power saw machine that includes a main frame, supporting frame, and collecting tray. The main frame includes first and second main arms in a parallel manner, a main post vertically supported by the first main arm, and a supporting shaft horizontally extending from a top portion of the main post for rigidly supporting a power saw assembly. The supporting frame includes a supportive column downwardly extending from the main post, a pair of support pillars extending from a bottom end of the supportive column to the first main arm at a predetermined angle, and a support arm extending from the bottom end of the supportive column to the second main arm. The collecting tray includes a receiving cavity for supporting the supporting frame so as to substantially support the main frame.

Abstract: A concrete stone texturing machine, method and a stone having an irregular rough surface resembling a real stone face is described. The machine conveys concrete stones having opposed flat surfaces to a pitching station having at least one pair of opposed pitching blade assembles aligned in a common plane on a respective side of the pitching station. The pitching blade assemblies are displaced towards and away from one another a predetermined distance. Each assembly has a plurality of pitching blades secured in side-by-side aligned relationship. Each of the pitching blades has a forward projecting cutting edge and a securing body portion. A first group of the pitching blades has their cutting edges aligned along a first straight cutting axis which is offset from the cutting edges of the second group of pitching blades aligned along a second straight cutting axis. The cutting axes are parallel to one another.

Abstract: A vertical wafer sawing apparatus for separating semiconductor devices formed on a semiconductor wafer includes a chuck table disposed vertically to a supporting surface of the chuck table and a scribing member moving perpendicular to the wafer surface to dice the wafer. The chuck table or a scribing member moves in one specific direction at least among the directions of the x, y and z-axis. The direction of the x-axis runs perpendicular to a wafer stage, on which a wafer is loaded, and parallel to the ground or the support surface for the chuck table. As a result, the set-up dimensions of the apparatus can be decreased even as wafer size increases. Further, contaminants such as silicon scraps and dust on the wafer can be efficiently removed during the wafer sawing process.

Abstract: A method is disclosed for constructing non-seamed stone corners for use on outside edges formed by joining thin stone walls at right angles. Thin stone is used to lay the field of the walls. Then first and second cuts are made in a building stone, removing a residual piece and leaving a corner stone with sides ½ inch to 3 inch thick to match the thickness of the thin stone on the field of the walls. These corner stones are laid on the corner formed by the right angle joint between the walls, giving the illusion of a thick building stone wall with nearly the low cost and easy laying of thin stone. Where the residual piece is large enough, it is used to cut a second corner stone in the same manner.

Abstract: A programmable dicing saw is operable with movement of its spindle and work surface for aligning a dicing blade juxtaposed between flanges on the spindle and dicing a substrate along a predetermined blade path. By locating the center of the substrate, an efficient movement of the blade relative to the substrate center rather than the work surface center saves time. Locating the center of the blade includes aligning opposing substrate edges and edge location data entry into a processor for calculation of the substrate center and control based on the substrate center.

Abstract: A cutting apparatus comprising a rotary shaft which is detachably fitted with a rotary tool including a cutting blade. The rotary tool itself or a storage case storing the rotary tool has an indicator which may be a bar code and shows the characteristic properties of the cutting blade. A reading means such as a bar code reader for reading the above indicator showing the characteristic properties of the cutting blade is installed on the cutting apparatus.

Abstract: An apparatus for cutting a chamfer on an upper edge of a concrete slab includes a hub designed for installation on the threaded output spindle of an angle grinder, and a specially-modified diamond-grit-edged rotary blade which mounts on the hub. For a preferred embodiment of the hub, an attachment collar is unitary and concentric with both a blade mounting flange and a blade centering shoulder on the flange. The attachment collar has at least one pair of flattened parallel sides for receiving a wrench used to tighten the hub on the output spindle. The side of the blade mounting flange opposite the collar is equipped with multiple countersunk threaded holes, by means of which the blade may be attached with countersinking screws. The rotary blade is equipped with a central positioning aperture sized to fit closely over the blade centering shoulder. The blade is equipped with countersunk holes which align with those on the blade mounting flange.

Abstract: A dust collection system for use in connection with a portable power tool is provided. The dust collection system generally includes a dust collection port having an intake that is interconnected to an air impeller by an intake duct. The impeller is driven by a motor, to create a vacuum at the intake port of the dust collection port. The outlet of the air impeller is in communication with a dust collection volume. In operation, the dust collection system is fixed to a portable power tool. Dust created during sawing or other operations is collected by the dust collection port, and is drawn away from the location at which the dust is created by a vacuum established by the air impeller at the intake port. The dust thus collected is deposited in the dust collection volume, which may include a filter bag.

Abstract: A rotating blade for a cutting machine having a new arbor mounting hole. The arbor mounting hole has five sides arranged in a cut gem configuration. The arbor mounting hole is symmetrical on either side of a mid-line. However, the mid-line of the arbor mounting hole need not pass through the geometric center of the blade. Inserts are provided. The inserts fit into the arbor mounting hole. Each of the inserts defines an aperture for receiving a drive arbor of a different configuration. The apertures are off-set in the inserts, to compensate for the off-set arbor mounting hole, so that the apertures are disposed at the geometric center of the blade when any insert is placed in the arbor mounting hole.

Abstract: For a power cut-off saw, a debris-collection device pivotably mountable to the cut-off saw. The device has a collection chamber with a top slot and a front slot in communication with the top slot. Both slots are adapted to receive the cut-off saw blade; the front slot is adapted to capture dust from the cut. A debris-control component may, but need not, cover the top slot and permits entry of the saw blade but prevents dust from escaping. A discharge arm on the top of the collection chamber has a hollow channel which communicates with the collection chamber and facilitates the discharge of dust from the collection chamber by an externally connected vacuum source which suctions out the collected dust.

Abstract: A method for cutting thin film filter work pieces has two embodiments. In a first embodiment, an intermediate layer (13) binds an augmenting substrate (14) to a glass substrate (12) of the work piece (16) prior to cutting of the work piece. In a second embodiment, the work piece (23) comprises a glass substrate (22) which is thicker than a final desired thickness. After the work piece is cut, a surplus portion (222) of the glass substrate is removed. Both embodiments of the method increase the effective thickness of the work piece, which reduces the residual stress in the final thin film filter product, and reduces the risk of a film stack (11, 21) of the work piece peeling from the glass substrate during the cutting process.

Abstract: The present invention provides a multi-layered diamond dicing blade. More particularly, the blade is a multi-layered dicing blade comprising an inner layer with a first set of diamond particles and an outer layer overlying the inner layer. The inner layer extends to the outermost periphery of the dicing blade. The outer layer comprises a second set of diamond particles having a size smaller than the first set of diamond particles.

Abstract: The invention relates to a cutting device that is provided with a traveling mechanism and a cutting disc that can be rotatably driven by a drive unit. The drive unit and the cutting disc are arranged on a support frame. An undercarriage is movably fixed to the support frame. A relative position can be adjusted between the undercarriage and the support frame by means of an adjustment device. The adjustment device is provided with a coarse adjustment device for adjusting at least two discrete relative positions and a fine adjustment device, which overlaps the effect of the coarse adjustment device in at least one of the discrete relative positions. The fine adjustment device is used for adjusting any relative position in a determined area.

Abstract: The invention relates to a diamond saw blade which is made by attaching improved undercut preventing tips, produced by diffusing and joining cobalt-based powder onto ultra hard tips at a high temperature, to respective shank slot walls formed on the circumference of a diamond saw blade by means of laser welding in order to remove drawbacks of high cost or insecurity with the conventional art.

Abstract: A saw for cutting concrete includes a readily movable base, a motor connected to the base and includes a cutting blade and drive mechanism operably connected thereto. A handle is provided and is connected to the base and can extend rearwardly and upwardly therefrom so that an operator may stand behind the saw to push it during operation. A telescopic guide is provided on the base and includes a pivot connection to allow folding to a storage or travel position. In a broad sense, the invention is directed to a telescoping guide for a saw, which includes an arm having an end serving as a guiding pointer and a mounting end, and a mechanism connectable to the saw for slidably receiving the mounting end.