Abstract: A processor for cleaning, rinsing, and drying workpieces includes a process vessel, an ozone injection system for introducing ozone gas into the process vessel, a liquid injection system for introducing a processing fluid into the process vessel, and a drying system for delivering a drying fluid to the process vessel. The processing fluid is introduced into the process vessel such that the processing fluid lies beneath a workpiece. Ozone gas is introduced into the process vessel. The workpiece is then bathed in the processing fluid. A drying fluid is introduced into the process vessel while the processing fluid is evacuated from the process vessel. Microelectronic workpieces can be cleaned and dried in a single vessel, reducing the equipment and space used in manufacturing.

Abstract: The present invention relates to a wrap around booster (10), and more specifically, the present invention relates to a wrap around booster (10) for use with a high temperature dishwashing machine (40). The wrap around booster (10) heats the water of the dishwashing machine (40) from approximately 110-140° F. to at least 150° F. in the wash tank (11) and at least 180° F. in the rinse tank (26). This is accomplished by keeping a relatively constant volume of water in the rinse tank (26) containing the wrap around booster (10), which maintains the rinse tank water at least 180° F. The rinse tank water surrounds the wash tank (11). The warmer water in the rinse tank (26) surrounding the wash tank (11) therefore heats the water contained in the wash tank (11) through convection. Therefore, one heating system does the work of two heating systems.

Abstract: A steam mop. A housing contains a water reservoir for storing water and a heating plate outside the water reservoir. The reservoir dispenses water to the heating element which heats the dispensed water to produce steam substantially instantaneously. The reservoir preferably includes a mechanism for dispensing additional water to the heating element on demand to produce a “burst of steam.” Preferably an absorbent cloth to which is attached a relatively stiff perimeter frame adapted to fit around the bottom of the housing is provided, the cloth assembly being easily removable for cleaning.

Abstract: A method of washing a container,including charging a material to be contained into a container body having a mouth-and-neck portion; mounting a container closure on the mouth-and-neck portion of the container body, the container closure having a top panel wall, a cylindrical skirt wall extending downwardly from a peripheral edge of the top panel wall, and a washing liquid passage formed in at least one of an upper portion of the skirt wall and a peripheral edge portion of the top panel wall; and jetting a washing liquid at the container closure so that the washing liquid passes through the washing liquid passage and enters a space between the mouth-and-neck portion of the container body and the skirt wall of the container closure, thereby washing an outer peripheral surface of the mouth-and-neck portion of the container body and an inner peripheral surface of the skirt wall of the container closure. The washing liquid is at a temperature of 65° C. to 70° C.

Abstract: A system for heating solvents in processing semiconductor wafers has a coiled solvent tube, a coiled cooling water tube, and electric heater elements, cast in place within an aluminum casting. The solvent flows through the solvent tube and is heated by conduction of heat through the casting. The solvent is safely isolated from the heating elements. Water is pumped through the cooling water tube, to cool the casting if solvent flow is interrupted, or if the measured casting temperature exceeds a predetermined set point temperature. Solvent temperature is maintained by controlling power to the heating elements based on the measured solvent temperature at the processing chamber.

Abstract: A method and apparatus for washing articles includes a washing compartment and a plurality of fluid outlets. A tray for retaining the articles is positionable in the washing compartment. The tray has at least one fluid directing nozzle which is alignable with the fluid outlets in the washing compartment to permit fluid to flow from the nozzles through the tray and to direct the fluid into contact with the articles.

Abstract: A process for removing residues from the microstructure of an object is provided, which comprises steps of preparing a remover including CO2, an additive for removing the residues and a co-solvent dissolving the additive in said CO2 at a pressurized fluid condition; and bringing the object into contact with the remover so as to remove the residues from the object. An apparatus for implementing the process is also provided.

Abstract: An enclosure 23A that defines a drying chamber 23 is configured of a pair of enclosing elements 23c and 23d and a base element 23b. When wafers enter or leave the drying chamber 23, the enclosing elements 23c and 23d are lifted upward by vertical air cylinders 42 to separate them from the base element 23b. The enclosing elements 23c and 23d are then moved in directions that mutually separate them. To dry wafers within the drying chamber 23, the enclosing elements and the base element 23b are mutually engaged to form a hermetic seal, in the opposite sequence. The present invention reduces the dimensions of the drying chamber without impeding the work of moving wafers into and out of the drying chamber. This makes it possible to reduce the internal volume of the drying chamber, achieving a reduction is the consumption of drying gas, an improvement in the drying efficiency, and a reduction in overall size of the apparatus.

Abstract: There are provided a lower sensor and an upper sensor mounted respectively on top and bottom surfaces of a sensor unit, an operation unit calculating respective measurements indicating the degree of adhesion of dirt to respective surfaces of a lower mold and an upper mold based on respective detection signals from the lower sensor and the upper sensor, and a comparator unit comparing each measurement from the operation unit with a predetermined reference value to transmit a predetermined warning signal if the measurement is equal to or smaller than the reference value. The warning signal is thus transmitted if reflected radiation that is radiation reflected from the mold surface has its intensity equal to or smaller than the reference value.

Abstract: A process and system for eliminating oxygen in the internal atmosphere of dry cleaning machines by catalytically burning it with the solvent vapors including the process and the relative circuit, which makes the atmosphere within the dry cleaning machine inert, controlling the process by measuring the oxygen in the gaseous mass, obtained using one or a number of Lambda probes.

Abstract: A cleaning method for CVD apparatus wherein by-products such as SiO2 and Si3N4 adhered to and deposited on surfaces of the inner wall, electrodes and other parts of a reaction chamber at the stage of film formation can be removed efficiently. Furthermore, the amount of cleaning gas discharged is so small that the influence on environment such as global warming is little and cost reduction can be also attained. After the film formation on a base material surface by the use of CVD apparatus, a fluorinated cleaning gas containing a fluorcompound is converted to plasma by means of a remote plasma generator, and the cleaning gas having been converted to plasma is introduced into a reaction chamber so that any by-products adhered to inner parts of the reaction chamber is removed.

Abstract: An extraction cleaning machine comprising dispensing and recovery systems, the dispensing system including a system for generating heat with an exothermic reaction upon activation for heating the cleaning solution prior to dispensing of the cleaning solution onto a surface. The cleaning solution dispensing system comprises a cleaning solution reservoir to which the heat of the exothermic reaction can be added and a dispenser. The heat of the exothermic reaction can also be added in line to the cleaning solution between the cleaning solution reservoir and the dispenser. The recovery system includes a suction nozzle, a recovery tank and a vacuum source for drawing recovered liquid from the suction nozzle into the recovery tank. A method of cleaning a surface comprises the steps of heating a cleaning solution by an exothermic chemical reaction, applying the cleaning solution to the surface and recovering the cleaning solution from the surface.

Abstract: A method for recycling a fluid in a wet bench tank recycling device, comprising the following steps. An outer recycle tank is provided having sides and a bottom. The outer recycle tank holding outer recycle tank fluid. An inner process tank is provided having sides and a sieved bottom housed within the outer recycle tank. The inner process tank sides being spaced apart from the sides of the outer recycle tank sides and the inner process tank bottom being spaced apart from the outer recycle tank bottom. The inner process tank holding inner process tank fluid. A wide area filter fitted within the inner process tank proximate the inner process tank sieved bottom is provided. A vertically moveable top cover is provided at an uppermost position and fitted between the inner process tank sides and the outer recycle tank sides. The top cover having one-way valves therein that permit flow of fluid only downward through the one-way valves. The vertically moveable top cover having a top and a bottom.

Abstract: A method of cleaning a hard floor surface with a surface maintenance vehicle including the steps of generating a foam-like aerated cleaning liquid, selectively conveying the foam-like aerated cleaning liquid to the hard floor surface and a scrubbing medium operatively coupled to the surface maintenance vehicle, scrubbing the hard floor surface with said rotating scrubbing medium and said foam-like aerated cleaning liquid so as to loosen soil from the hard floor surface leaving behind a soiled solution of cleaning liquid and soil, and removing at least a portion of the soiled solution from the hard floor surface through a fluid recovery device. Additional aspects of the present invention include devices for performing the cleaning method.

Abstract: The present invention provides an apparatus for cleaning a workpiece with a cleaning medium that is maintained at a single fluid phase. The apparatus comprises means for providing the cleaning medium; a pressurizable cleaning vessel for receiving the cleaning medium and the workpiece; and means for maintaining a single fluid phase of the cleaning medium in the cleaning vessel. The present invention further provides a process for cleaning the workpiece with cleaning medium under conditions such that the workpiece is exposed to a single fluid phase of the cleaning medium. The present invention further includes a process for a storage media that includes instructions for controlling a processor for the process of the present invention. The storage media comprises means for controlling the processor to control contacting conditions of the workpiece and the cleaning medium such that the workpiece is exposed to a single fluid phase of the cleaning medium.

Abstract: A method and system for reducing acidic contamination on a process wafer following a plasma etching process including; providing an ambient controlled heating chamber for accepting transfer of a process wafer under controlled ambient conditions; transferring the process wafer to the heating chamber under controlled ambient conditions following plasma etching of the process wafer; providing a heat exchange surface within the heating chamber for mounting the process wafer in heat exchange relationship thereto; mounting the process wafer on a heat exchange surface contained within the heating chamber; and, heating the process wafer to a temperature sufficient to vaporize an acidic residue thereon to form acidic vapors; and, removing the acidic vapors from the heating chamber.

Abstract: There is provided a process for treating a substrate by removing organic pollutant on the surface of the substrate using mixed gas of wet ozone-containing gas and basic gas, wherein the introduction amount of basic gas is controlled, thereby achieving complete prevention of corrosion of metal wiring previously formed on the substrate, and an apparatus therefor.

Abstract: In accordance with the invention, the polymeric coating is removed from a coated optical fiber by disposing the fiber within a low pressure environment and applying sufficient heat to volatilize at least a portion of the polymeric coating. The result is that the coating material bursts from the fiber, yielding a clean glass surface virtually free of surface flaws. In a preferred embodiment the heat is provided by a resistive filament heater within a vacuum chamber.

Abstract: A process and system for conditioning a bulk container for ultra-high purity liquefied gas. Vapor is generated in the container from a conditioning quantity of the ultra-high purity liquefied gas by imposing a temperature difference on the container so that the vapor condenses when a temperature difference is achieved. The resulting liquid reflux, e.g., the condensed liquid drips or flows back to the conditioning quantity of the liquified gas, washes or removes contaminants, e.g., particles, metal and moisture, from the interior surface of the container. A portion of the vapor is vented from the container for reclamation. The used conditioning liquid may also be reclaimed.

Abstract: This invention provides an apparatus and method for washing a biological chip cartridge. A washing station comprises a cartridge holder that includes at least two cartridge mounting tubes that are structured to retain the biological chip cartridge on the washing station without doors. At least one fluid source communicates with one of the mounting tubes and a waste dump communicates with another mounting tube. A fluid controller controls delivery of a fluid from the fluid source to the mounting tube.

Abstract: In a method for drying substrates, in particular, semiconductor wafers, an especially residue-free drying of the substrates results when, during removal of the substrates from a liquid, a meniscus of the liquid forming at the transition between the substrate surface and the liquid surface is heated. A device for performing the method is disclosed.

Abstract: A system for heating solvents in processing semiconductor wafers has a coiled solvent tube, a coiled cooling water tube, and electric heater elements, cast in place within an aluminum casting. The solvent flows through the solvent tube and is heated by conduction of heat through the casting. The solvent is safely isolated from the heating elements. Water is pumped through the cooling water tube, to cool the casting if solvent flow is interrupted, or if the measured casting temperature exceeds a predetermined set point temperature. Solvent temperature is maintained by controlling power to the heating elements based on the measured solvent temperature at the processing chamber.

Abstract: An apparatus for cleaning molds for making optical lenses includes seven stations arranged in a circular array with a rotatably mounted central hub in the middle of them. Seven radial arms extend from the central hub, one for each station, and a workpiece holder depends from the radially outermost end of each arm and holds the molds as they travel from station to station. A drive motor lifts and lowers the central hub and hence the molds, an index motor rotates the molds from station to station, and an oscillation motor oscillates the workpiece holders when the molds are immersed in a cleaning solution or rinse water. The rinse water is filtered and circulated continuously. After a final rinse, the rinse water is drained slowly so that the surface tension of the water removes all water spots and the cleaned molds are delivered to a discharge station. The entire process is microprocessor controlled.

Abstract: The present invention relates to a method for removing agricultural chemicals that remain on the surface of agricultural products, comprising the steps treating agricultural products having residue of the agricultural chemicals with a aqueous solution for oxidizing, and thereafter or at the same time forming OH radical as a result of irradiating ultraviolet rays to agricultural treating oxidizer aqueous solution.

Abstract: A pressure vessel for use in production processes requiring elevating and ranging of temperatures and pressures during the process cycle, readily adaptable to production line operation, suitable for wafer processing in the semiconductor industry and for other industries and processes. The pressure vessel is configured within an open support frame with a stationary, preferably inverted, orientation. The cover or closing plate is vertically movable towards the mouth of the pressure vessel and functions as the platform by which the object under process is transferred into the vessel. The moving and locking mechanism for the cover is isolated and shielded from the process environment.

Abstract: An inverted pressure vessel system for conducting automated industrial processes requiring elevated pressure and temperatures has a vertically movable pedestal for opening and closing the underside loading port, with pedestal drive system and locking mechanism located below the pedestal top and isolated from the chamber opening. The chamber is connectible to a pressure control and process fluid supply system, and has heat exchangers connected to an external source for temperature control. Process fluids are distributed across a central process cavity through divergent inflow and convergent outflow process fluid channels.

Abstract: The present invention provides a substrate transfer controlling apparatus which can easily maximize the throughput of a substrate processing apparatus such as a semiconductor fabrication apparatus, and can satisfy a demand for immediacy of actions of a transfer device. The substrate transfer controlling apparatus comprises an input device (12) for inputting times required for actions of transfer devices (1a through 1c) and times required to process substrates in processing devices (3a through 9d), and a schedule calculator (21) for calculating execution times of actions of the transfer devices (1a through 1c) for allowing the time when a final one of the substrates to be processed is fully processed and returned from the substrate processing apparatus to be earliest, based on a predetermined conditional formula including, as parameters, the inputted times.

Abstract: The present invention provides a method and an apparatus for cleaning substrates. The cleaning chamber defines a processing cavity adapted to accommodate a substrate therein. In one embodiment, the cleaning chamber includes a chamber body having a processing cavity defined therein. A substrate is disposed in the processing cavity without contacting other chamber components by a Bernoulli effect and/or by a fluid cushion above and/or below the substrate. Fluid is flowed into the processing cavity at an angle relative to a radial line of the substrate to induce and/or control rotation of the substrate during a cleaning and drying process.

Abstract: A method for cleaning an object to be processed in which the atmosphere in a drying chamber is replaced by an inert gas prior to placing an object to be cleaned from an external environment into the chamber. The object is then transported by an elongated retaining member from the drying chamber through a lower opening in the chamber into a processing bath disposed below the chamber. The object is then cleaned in the processing bath. The object is then transported from the processing bath to the drying chamber where it is dried by filling the atmosphere of the drying chamber with organic solvent. The cleaning process in the cleaning bath is carried out while the bath is screened by a nitrogen-gas curtain. The method also includes opening a lid of the chamber prior to insertion of the object into the chamber and closing the lid after insertion of the object, as well as the opening and closing of the lower opening in the chamber.

Abstract: An enhanced gradient dragout system conserves plating chemicals, including precious metals by providing a series of tanks with cascading rinse solutions having a flow rate controlled by heating the first tank to increase the evaporation rate. A portion of the concentrated solution in the heated tank is returned to the process tank. The system minimizes the requirements for clean rinse water, and the need for emptying contaminated rinse tanks with associated recovery and disposal environmental and cost issues. The low cost system is flexible and the process is adapted to the material and process requirements of the plating line.

Abstract: A wet stripping apparatus for removing unwanted film layers, such as a thick photoresist layer from a wafer surface after a solder bumping process and a method for using the apparatus are disclosed. The apparatus includes a tank body, a wafer holder, and a means for reciprocally moving the wafer holder in an up-and-down motion with at least one wafer mounted in the holder immersed in a stripper solution to a frequency of not higher than 100 cycle/min. The stripper solution utilized, which is suitably kept at a temperature of at least 50° C., contains dimethyl sulfoxide, tetramethyl-ammonium-hydroxide and water. After the stripping process, the wafer is rinsed in a quick dump rinse step and then spin dried for conducting subsequent fabrication processes on the wafer.

Abstract: Various embodiments of an apparatus and methods capable of cleaning the end surface of an optical fiber connector, particularly a jet of cleaning liquids with vacuum removal system, clean fluid pressure and/or vacuum, plasma discharge, steam jet, and ultrasound field.

Abstract: In this substrate transport apparatus, portions connecting a transport chamber (101) with a first load-lock chamber (109) and a second load-lock chamber (110) are provided to linearly align with each other. A processing station (120, 121) for processing a substrate (400) is provided on a position not interfering with rotational motion and telescopic motion of a robot arm (106). A substrate transport apparatus capable of improving the degree of integration of the apparatus while suppressing enlargement of a foot print and implementing common load-lock chambers can be provided by employing this structure.

Abstract: The present invention concerns a process of treating an energizing electrode for use in a metal halide lamp. Lamp energizing electrodes are placed into a support container and the support container is then placed within an oven that bakes the electrodes at an elevated temperature. Hydrogen is caused to flow through the support container at a rate of from 5 to 60 liters per minute while the temperature is maintained within the oven between 2000 and 3200 degrees C. In accordance with an exemplary embodiment of the invention, the temperature is maintained within the oven at 2400 and 2600 degrees C., the dew point of the hydrogen is less than minus 40 degrees C. and the electrodes are baked for a period of 10 to 240 minutes. This process treats the electrodes in the support container and results in lamps having superior maintenance of lamp output as measured in lumens of output.

Abstract: A high-pressure processing apparatus for removing unnecessary matters on objects to be processed by bringing a high-pressure fluid and a chemical liquid other than the high-pressure fluid into contact with the objects to be processed in a pressurized state is provided with a plurality of high-pressure processing chambers, a common high-pressure fluid supply unit for supplying the high-pressure fluid to each one of the high-pressure processing chambers, a common chemical liquid supply unit for supplying the chemical liquid to the each high-pressure processing chambers, and a separating unit for separating gaseous components from a mixture of the high-pressure fluid and the chemical liquid discharged from the high-pressure processing chambers after the objects are processed.

Abstract: A method and an apparatus for removing a liquid, i.e. a wet processing liquid, from at least one surface of at least one substrate is disclosed. A liquid is supplied on a surface of substrate. Simultaneously or thereafter the liquid or the substrate is locally heated to thereby reduce the surface tension of said liquid. By doing so, at least locally a sharply defined liquid-ambient boundary is created. According to the invention, the substrate is subjected to a rotary movement at a speed to guide said liquid-ambient boundary over the surface of the substrate thereby removing said liquid from said surface.

Abstract: A portable, diver-operated cryogenic freezing unit cleans surfaces underwater. A housing has a first chamber that contains cryogenic liquid, such as liquid nitrogen, and a second chamber is disposed adjacent to an end portion that fits about contaminating matter on a surface underwater. A valve vents cryogenic liquid from the first chamber to expand as gas in the second chamber. The vented cryogenic liquid and gas freeze a slug of water and the contaminating matter on the surface within the end portion. The housing is bent, twisted or otherwise displaced to break or pry-away and remove the frozen slug of water and contaminating matter from the surface to thereby clean it. A method of cleaning a surface underwater using the cryogenic freezing unit is described.

Abstract: Semiconductor wafers are cleaned using megasonic energy to agitate cleaning fluid applied to the wafer. A source of energy vibrates an elongated probe which transmits the acoustic energy into the fluid. The probe has a solid cleaning rod and a flared or stepped rear base. In one form, the probe is made of one piece, and in another, the rod fits into a socket in the base. This enables a rod to be made of material which is compatible with the cleaning solution, while the base may be of a different material. A heat transfer member acoustically coupled to the probe base and to a transducer conducts heat away from the transducer. A housing for the heat transfer member and the transducer supports those components and provides means for conducting coolant through the housing to control the temperature of the transducer. In another arrangement, an end of the housing is coupled between the transducer and the probe.

Abstract: A semiconductor deposition system in accordance with the present invention includes a CMP apparatus operative to planarize an active surface of a semiconductor wafer, and a wafer cleaner for cleaning wafer after the CMP process. The wafer cleaner preferably includes a wafer rotating mechanism, a steam inlet for applying steam to the active surface of the wafer as it is rotated and a liquid inlet for simultaneously applying a liquid to the back side surface of the wafer. A method for manufacturing an integrated circuit in accordance with the present invention includes subjecting an active surface of the wafer to a plurality of processes selected from a group including deposition, patterning, doping, planarization, ashing and etching, and steam cleaning the active surface at least once before, during, and after the plurality of processes. Preferably, an aqueous vapor phase is applied to the first surface of the wafer as an aqueous liquid phase is applied to the other surface of the wafer.

Abstract: A processor for processing microelectronic workpieces includes a process vessel adapted to hold one or more microelectronic workpieces vertically within a rotatable fixture. A drive motor is coupled to the rotatable fixture to spin the rotatable fixture during processing. A processing fluid is introduced into the process vessel for processing of the microelectronic workpieces. The rotatable fixture is raised out of the processor for loading/unloading. The processor can be used to clean, plate, etch, strip, rinse, or dry microelectronic workpieces.

Abstract: A compact reflow oven and cleaning apparatus combines in a unitary housing for both the reflow and cleaning function. This results in the saving of valuable floor space in the printed circuit board assembly areas. The unitary housing and control of temperatures in the reflow and cleaning areas facilitate the removal of contaminants before solidification of such contaminants.

Abstract: An enhanced gradient dragout system conserves plating chemicals, including precious metals by providing a series of tanks with cascading rinse solutions having a flow rate controlled by heating the first tank to increase the evaporation rate. A portion of the concentrated solution in the heated tank is returned to the process tank. The system minimizes the requirements for clean rinse water, and the need for emptying contaminated rinse tanks with associated recovery and disposal environmental and cost issues. The low cost system is flexible and the process is adapted to the material and process requirements of the plating line.

Abstract: The fluid treatment apparatus, as disclosed, comprises upper and lower Bernoulli-plates 12 and 14, each of which includes a metal plate 25 provided on overall outer surface thereof. On each of the metal plates 25, there is arranged a spiral-shaped circulating pipe 24 through which a heating medium or a cooling medium are circulated so as to rapidly heat or cool the upper and lower Bernoulli-plates. During the treatment of a wafer 16 by the apparatus, the upper and lower Bernoulli-plates are disposed in parallel with each other to define a narrow gap therebetween while a clearance between the wafer 16 and the upper Bernoulli-plate and a clearance between the wafer 16 and the lower Bernoulli-plate are kept to be equal to each other. Thus, the present invention can achieve various purpose such as a time saving for the cleaning, reduction of consumption of the cleaning liquid and inhibition of cleaning irregularity.

Abstract: An automated kitchenware washing tank has a pump system with a pump and fluid conduits to couple the pump between an intake opening through one of the walls and discharge openings in the wall of the tank. At least some of the discharge openings are preferably formed in at least one angled portion of the tank wall that faces downwardly into the tank, and, more preferably, on two opposed angled portions that face downwardly into the tank. A control system may be coupled to the pump for controlling the speed with which the pump supplies cleaning fluid to the discharge openings. The control system comprises a speed selector that is adapted to allow a user to activate the speed selector to select between at least two different speeds for pumping the cleaning fluid to the discharge openings. In operation, the automated washing tank pumps cleaning fluid from within the tank through the intake outlet through the fluid conduits and out of the discharge openings into the tank to create turbulence within the tank.

Abstract: A material recovery process for used oil filters and oil contaminated materials. In a preferred embodiment, the process includes the steps of loading wire mesh baskets or racks with a plurality of used oil filters containing oil. The baskets are thereafter loaded into a sealable furnace. The furnace is a sealed vessel with air regulated through a series of burners. The oil filters are heated in the furnace in a first stage to a first temperature range for a first given time period. Oil released from the oil filters is drained from the furnace. The oil filters are heated to a second temperature range for a second given time period. The oil filters are thereafter heated to a third temperature range for a third given time period. Finally, the furnace is cooled through use of a plurality of air manifolds.

Abstract: A substrate processing apparatus 8 for feeding a processing liquid and processing a substrate W with the processing liquid comprises holding member 22 for holding the substrate W, and a lower side member 42 which is moved relatively with respect to the back surface of the substrate W held by the holding member 22 between a processing position A near the substrate undersurface and a retreat position B remote from the substrate undersurface. The processing liquid is fed between a gap between the lower side member 42 moved to the processing position A and the back surface of the substrate held by the holding member 22, and the substrate undersurface is processed.

Abstract: An apparatus for cleaning a semiconductor wafer and method for cleaning a wafer using the same wherein, the apparatus includes a chamber on which a wafer is mounted, a revolving chuck mounted in the chamber for supporting and fixing the wafer, a nozzle for spraying cleaning solution onto the wafer, a cover for covering an upper part of the chamber, a heating lamp fixed on an upper part of the cover for heating the wafer or the cleaning solution, a cooling water conduit surrounding the cover, and an antipollution plate mounted on a lower part of the heating lamp in the cover for preventing the heating lamp from being polluted by the cleaning solution. According to an embodiment of the present invention, the cleaning solution, preferably of ozone water, hydrogen water, or electrolytic-ionized water, is heated for a short time and used to clean the wafer.

Abstract: A portable, diver-operated cryogenic freezing unit cleans surfaces underwater. A housing has a first chamber that contains cryogenic liquid, such as liquid nitrogen, and a second chamber is disposed adjacent to an end portion that fits about contaminating matter on a surface underwater. A valve vents cryogenic liquid from the first chamber to expand as gas in the second chamber. The vented cryogenic liquid and gas freeze a slug of water and the contaminating matter on the surface within the end portion. The housing is bent, twisted or otherwise displaced to break or pry-away and remove the frozen slug of water and contaminating matter from the surface to thereby clean it. A method of cleaning a surface underwater using the cryogenic freezing unit is described.

Abstract: To clean a semiconductor wafer without using a harmful liquid chemical solution such as piranha and organic solvent

Abstract: A machine for vapor degreasing with a atmosphere tight container for the process to take place, an inert gas purge to reduce the oxygen in the container, and a heat source to vaporize the decreasing fluid.