Abstract: A gutter cleaning robot can traverse rain gutters to agitate and remove debris. The gutter cleaning robot is equipped with a debris auger at a front end that contacts and ejects the debris, and has a drive system for propelling the gutter cleaning robot along the rain gutter. The debris auger can include a spiral screw or various other forms of auger, and may be interchangeable by the user so as to enhance the effectiveness of the gutter cleaning robot in various environments or modes of operation.

Abstract: A method for activating the surface of a base material and an apparatus thereof, which is suited to be utilized for pretreatment in electrochemical treatment such as, for example, electroplating or the like, in which the surface of a base material such as metal can be subjected to degreasing treatment and oxide film removing treatment simultaneously, efficiently and rationally, in which productivity can be enhanced and the equipment cost can be reduced, and in which a waste solution can be rationalized so that the solution can be reutilized and the environmental pollution can be prevented. A method for activating the surface of a base material in which the surface of a member to be treated is subjected to degreasing treatment or oxide film removing treatment. Pressurized carbon dioxide is dissolved in a predetermined quantity of water, thereby preparing an oxide film removing solution having a predetermined acidic concentration.

Abstract: A processing apparatus configured to process a substrate under a vacuum environment includes a holding unit configured to hold the substrate, a dust collection part having a surface opposite to the substrate held by the holding unit, a vacuum chamber configured to accommodate the holding unit and to have an internal space that can be decompressed, a temperature controlling unit configured to control a temperature of the surface of the dust collection part opposite to the substrate to a temperature lower than a temperature of the substrate, and a driving unit configured to bring one of the holding unit and the dust collection part close to the other after the temperature controlling unit controls the temperature of the surface of the dust collection part opposite to the substrate.

Abstract: A plasma processing apparatus includes a vacuum chamber, a processing chamber housed in the vacuum chamber, and a sample stage located in the processing chamber, for supporting on its upper surface a disk-like sample to be processed, wherein plural disk-like samples are continuously processed with plasma generated in the processing chamber and wherein during the idling time between the successive processes the temperature of the sample stage is adjusted to a predetermined value higher than the temperature at which the samples are processed.

Abstract: An apparatus and method for commissioning steam turbine generator power plants to advance the cleanliness of the complete steam cycle by the conditioned discharge of steam to the plant surface condenser.

Abstract: A method for controlling a dish washing machine having a steam generator is disclosed. The control method includes initially supplying water into a steam generator to supply stream to dishes and deciding a water replenishment pattern during the steam operation of the steam generator, based on the initial amount of the water in the steam generator, before the steam operation of the steam generator.

Abstract: In a laundry washing/drying machine involving drying by a heat pump cycle, in an initial stage of the drying operation the heat within an air circulation path is deficient and therefore it is impossible to effect quick heating of air on a drum inlet side up to a sufficiently high temperature. According to the present invention there is provided a drying unit capable of raising the drum inlet air temperature quickly up to a sufficiently high temperature in an initial stage of the drying operation and thereby shortening the drying time.

Abstract: A steam mop having a main body with a boiler, a water container, a mechanical water pump between the boiler and container and at least one side arm connecting the boiler steam outlet to a fabric steam pocket frame. The water pump is actuated by movement of the mop when cleaning to send water to the boiler. The steam pocket frame is substantially rectangular with a plurality of baffles to distribute steam disposed substantially perpendicular to a steam channel having openings to distribute steam between the baffles. A replaceable fabric pocket fits snugly over the frame to distribute cleaning steam to the surface to be cleaned.

Abstract: The invention relates to an apparatus for cleaning diverse types of surface, such as public highways, pavements, squares and so on. The invention also relates to a vehicle for cleaning such surfaces. The invention further relates to a method for cleaning such surfaces.

Abstract: An aqueous washing system and method of operation for washing of articles such as engineering components, including curing of resin impregnated porous metal components, comprising placing the articles into a process chamber (10) and supplying from a supply tank (11) an aqueous washing fluid at a temperature at or above 100° C. A head of pressure is established above the fluid in tank (11) whereby the fluid may be transferred by a pump (P1) to the process chamber (10). After a washing cycle the articles are rinsed by clean water and then vacuum dried before removal from the process chamber (10).

Abstract: A substrate processing apparatus includes: a support member supporting a substrate in a process chamber; a first temperature adjusting member in thermal contact with the support member; and a second temperature adjusting member capable of thermally coming into contact with and separating from the support member, wherein the first temperature adjusting member and the second temperature adjusting member are temperature-adjusted to different temperatures respectively.

Abstract: The method and apparatus are for safely cleaning live equipment. The method comprises the steps of heating a water-based solution by means of an apparatus to produce superheated steam; grounding this apparatus; conducting the superheated steam through an insulated conduit; and concentrating this superheated steam into a pressurized jet at an output of the insulated conduit. After the step of grounding the apparatus, the method further comprises the step of applying the pressurized jet through the insulated conduit output, onto the live equipment to be cleaned.

Abstract: A shroud-type dishwashing machine for commercial use has a lower frame, a dishwashing chamber and a shroud which can be opened and at least partially surrounds the dishwashing chamber. A condensation precipitation device is connected to the dishwashing chamber when the shroud is closed. This condensation precipitation device is equipped with at least one fan for sucking vapor and/or air out of the closed dishwashing chamber, and also has at least one condensation surface for condensation of vapor.

Abstract: Unwanted films can be eliminated by directing a stream of reactive gas(es) at reactive zone in an edge region of the wafer. The action of the reactive gas can be enhanced by heating the gas in a nozzle, immediately prior to the gas impinging on the wafer. The action of the reactive gas can also be enhanced by ultraviolet (UV) or infrared (IR) radiation directed at the reactive zone. The wafer is rotates so that the reactive zone traverses the entire edge region. Multiple gas/light delivery systems can cause gas and light to impinge on multiple reactive zones, both on the front side and on the back side of the wafer.

Abstract: A substrate processing apparatus includes a container in which a heating plate, a discharge nozzle for discharging a vapor of organic solvent, and a discharge nozzle for supplying a process gas and a cooling gas are provided. A pump in communication with an exhaust outlet of the container exhausts an atmosphere from the container to reduce pressure in the container. Therefore, the substrate processing apparatus is capable of performing (1) the process of drying a substrate in a reduced-pressure atmosphere by the use of the vapor of organic solvent, and (2) the process of drying the substrate in the reduced-pressure atmosphere by heating, to thereby efficiently dry the substrate.

Abstract: There is disclosed a substrate processing apparatus including a processing chamber housing a substrate, pipes for supplying gas into the processing chamber, and heaters provided in the middle of the pipes, and heating the gas. In the substrate processing apparatus, the heaters heat the gas to a temperature lower than a temperature at which exhaust gas is generated from the pipes to dry the substrate in the heated gas.

Abstract: A cleaning probe capable of providing uniform cleaning to an entire wafer while not damaging the edge portion of the wafer, and a megasonic cleaning apparatus having the cleaning probe are provided. The cleaning probe comprises a front portion located near the center of the wafer, a rear portion connected to a piezoelectric transducer, and a protrusion located between the rear portion and the front portion, located on an edge portion of the wafer, and having a larger cross section width than the front portion.

Abstract: A high pressure cleaning system for removing deposits from glass furnaces.

Abstract: A substrate processing apparatus that can reduce the number of parts. A first gas introduction hole through which the hydrogen fluoride gas is introduced into a GDP is formed in an upper lid. A second gas introduction hole through which hydrogen fluoride gas is introduced from a hydrogen fluoride gas source is formed in a processing vessel. When the upper lid engages the upper portion of the processing vessel, one end of the first gas introduction hole is joined with one end of the second gas introduction hole to form an introduction path through which the hydrogen fluoride gas is introduced into a chamber.

Abstract: A process is provided for removing polymer from a backside of a workpiece. The process includes supporting the workpiece on the backside in a vacuum chamber while leaving at least a peripheral annular portion of the backside exposed. The process further includes confining gas flow at the edge of the workpiece within a gap at the edge of the workpiece on the order of about 1% of the diameter of the chamber, the gap defining a boundary between an upper process zone containing the wafer front side and a lower process zone containing the wafer backside. The process also includes providing a polymer etch precursor gas underneath the backside edge of the workpiece and applying RF power to a region underlying the backside edge of the workpiece to generate a first plasma of polymer etch species concentrated in an annular ring concentric with and underneath the backside edge of the workpiece.

Abstract: A substrate cleaning apparatus (1) of the present invention is the substrate cleaning apparatus (1) for cleaning a substrate (wafer 7) with the use of a cleaning agent (e.g., Caro's acid) that is generated by reacting plural kinds of chemical liquids (e.g., sulfuric acid and hydrogen peroxide solution). The substrate cleaning apparatus (1) comprises: a mixing unit (31) for mixing plural kinds of chemical liquids, a supplying unit (32) for supplying the chemical liquids that have been mixed by the mixing unit, onto a surface of a substrate to be cleaned; and a heating unit (14) for heating the chemical liquids that have been supplied onto the surface of the substrate by the supplying unit, on the surface of the substrate. In particular, the mixing unit (31) includes a reaction restraining mechanism (33) for restraining a reaction of the mixed chemical liquids, and the reaction restraining mechanism (33) is on a cooling mechanism for cooling the mixed chemical liquids.

Abstract: A cleaning device for the shaving head of a dry shaving apparatus includes a receptacle formed in a housing of the cleaning device. The receptacle adapted to receive the shaving head for cleaning with a cleaning fluid. During the cleaning cycle, the dry shaving apparatus is lockable in the cleaning device by means of an interlock. The shaving head is exposed to heat from a heater for drying subsequent to cleaning. Following a drying cycle, release of the interlock is controlled by a control element provided in the cleaning device to prevent an operator's skin from being burned by an excessively hot shaving head in an immediately succeeding shaving operation.

Abstract: A sump assembly of a dishwasher includes a sump housing having a washing water storing portion, a water supply connector formed on a first portion of the washing water storing portion, and a heater insertion hole formed on a second portion of the washing waster storing portion, which is opposite to the first portion, a water infiltration preventing rib extending from an outer bottom surface of the sump housing, a heater inserted into the washing water storing portion, and a washing motor mounted under the sump housing.

Abstract: An apparatus for removing haze in a photo mask includes sealed chamber having a bake module disposed therein to support a photo mask, a reactant gas feed line to feed a reactant gas into the chamber, and a discharge device to discharge impurities in the chamber to the outside.

Abstract: Methods and apparatus are provided for using various megasonic apparatus including megasonic tanks, scanning megasonic plates, megasonic jets, and megasonic sweeping beams etc., in combination with selective chemistries to remove sub-micron particulate contaminants from the surfaces of the processing equipment used in semiconductor, medical, or any other processing environments.

Abstract: Methods, apparatus, and systems are provided for efficiently reclaiming solvents used to clean surfaces of semiconductor wafers, etc. More particularly, embodiments of the present invention provide an in-situ reclaim approach that utilizes condensing mechanisms to reclaim evaporated solvent components. In these embodiments, the condensing can occur within a proximity head itself and/or along a vacuum line running from the proximity head to a vacuum tank. Other embodiments of the present invention provide an in-situ reclaim approach that prevents the evaporation of solvents at the onset by maintaining appropriate equilibrium gas phase concentrations between the liquid chemistries and gases used to process wafer surfaces.

Abstract: A method an apparatus for drying a wafer, and an apparatus for cleaning and drying a wafer are provided. In the apparatus for cleaning and drying a wafer, the wafer is dipped into a cleaning solution in a cleaning tank. The wafer is then dried using a drying gas in a drying chamber disposed over the cleaning tank. A shutter separates the cleaning tank from the drying tank. A wafer boat moves the wafer vertically between the cleaning tank and the drying tank. Nozzles for providing the cleaning solution onto the wafer are disposed at both inner sides of the drying tank. The nozzles are connected to a drying gas supply unit to alternately and periodically provide the drying gas onto the wafer.

Abstract: In a cleaning step of a substrate-processing device, vacuum drawing is made for the space between an inner chamber and an outer chamber that receives the inner chamber. Temperature of the inner chamber is set higher than the temperature of the inner chamber during substrate processing and set lower than the temperature of a substrate support member. After that, a cleaning gas containing hexafluoroacetylaceton (Hhfac) is supplied in the inner chamber, and substances to be cleaned off adhering inside the inner chamber are removed.

Abstract: An emission control device, such as a filter, is regenerated by exposure to plasma. Plasma breaks down carbon-based residues, such as soot, to enable the filter to be easily cleaned and regenerated without subjecting the filter to heat-related stress associated with thermal regeneration methods. Secondary plasma generation is used to overcome impediments caused by the presence of a metallic housing and/or metal-containing materials such as a washcoat or mesh in the filter.

Abstract: DIW is supplied toward a surface of a substrate to form a lower layer liquid film, which is then frozen to form a lower layer frozen film. Further, DIW cooled down to a temperature at which the lower layer frozen film will not melt is supplied toward a surface of the lower layer frozen film to form an upper layer liquid film, which is then frozen to form an upper layer frozen film in a layered structure. DIW which is at room temperature is thereafter supplied, thereby melting the entirety of the lower layer frozen film and the upper layer frozen film to remove these films together with particles off from the surface of the substrate.

Abstract: A rinsing liquid supplier includes a temperature adjuster. The temperature adjuster cools DIW to a temperature lower than room temperature. This temperature adjuster cools down DIW to a temperature not more than 10 degrees centigrade for instance, and cooling down to an even lower temperature of 5 degrees centigrade or below is more preferable. Meanwhile, the temperature adjuster maintains DIW at not less than 0 degrees centigrade, which prevents freezing of the DIW. The cooled DIW supplied to a rinsing liquid pipe is discharged from the rinsing liquid discharge nozzle toward the top surface of the substrate, to thereby form a liquid film. Further, the cooled DIW is discharged toward the rear surface of the substrate from the liquid discharge nozzle via the liquid supply pipe, to thereby form the liquid film on the rear surface. Since the liquid films are already cooled, they are frozen in a short time when the cooling gas is discharged toward the top surface and the rear surface of the substrate.

Abstract: An surface treatment apparatus of a substrate can clean a substrate surface in the air without employing a vacuum apparatus, and can remove a natural oxide film or an organic material, such as BTA, from the substrate surface without resorting to plasma cleaning. The surface treatment apparatus includes: an inert gas supply section for supplying an inert gas to the whole or part of a substrate surface to form an oxygen-blocking zone; a heating section for keeping the substrate surface at a predetermined temperature; and a cleaning gas supply section for supplying a cleaning gas to the oxygen-blocking zone to clean the substrate surface.

Abstract: Plasma etch-cleaning of substrates is performed by means of a plasma discharge arrangement comprising an electron source cathode (5) and an anode arrangement (7). The anode arrangement (7) comprises on one hand an anode electrode (9) and on the other hand and electrically isolated therefrom a confinement (11). The confinement (11) has an opening (13) directed towards an area (S) of a substrate (21) to be cleaned. The electron source cathode (5) and the anode electrode (9) are electrically supplied by a supply circuit with a supply source (19). The circuit is operated electrically floating.

Abstract: A process of washing plastics contaminated with polychlorinated biphenyls (PCBs) is provided to reduce the concentration of the PCBs. A two-step process includes a first washing step using a selected washing solution or solvent, such as, a non-flammable solvent, and followed by a second step using thermal desorption. The two-step process enables reducing the concentration of PCBs in polymers, such as recovered from shredder residue, for example, to as low as 0.253 PPM. One of the preferred solvents is Perchloroethylene.

Abstract: The portable, compact, silverware-only washing apparatus is disclosed. The apparatus is manufactured so as to easily mount on top of a kitchen countertop or to be easily portable to other locales. The appliance is designed so as to not be connected to a water supply within a home or apartment, but rather rely upon the user to pour in water in a manner similar to a home coffee maker. The device includes a motor and pump assembly to spray pressurized water and detergent against the silverware loaded therein and automatically drain the water and waste after completion of the washing cycle The appliance is configured with a specialized basket for holding the silverware in individualized compartments.

Abstract: A portable domestic steam cleaner has a housing accommodating a releasable water tank. A pump transfers water from the tank to a boiler for generating steam. In use, steam exits a nozzle for cleaning etc. A pump suitable for use in the steamer is also disclosed.

Abstract: A cleaning apparatus for a semiconductor wafer comprising: a double container including an inner container with an upper opening for accommodating a substrate to be cleaned and an outer container having an airtight space accommodating the inner container therein, the inner container being communicated to the outer container through the upper opening; a cleaning liquid supply conduit for supplying a cleaning liquid into the inner container; an inner container drain conduit for draining the cleaning liquid from the inner container; a solvent-containing gas supply conduit for supplying a solvent-containing gas into the inner container for drying the substrate; a solvent-resolving gas supply conduit for supplying a solvent-resolving gas into the inner container for resolving a solvent component attached on the substrate; an exhaust pipe for exhausting the gases from the double container, and an outer container drain conduit for draining the liquid spilled from the inner container to the outer container.

Abstract: A chamber cleaner includes a cleaner, which is sealed, a connector passing through a side of the cleaner, lamp assembly connected to the connector and uniformly arranged in an inside surface of the cleaner, a heat-source assembled in the lamp assembly and an exhausting unit having an entrance passing through a portion of the outside of the connector exposed to the cleaner, and an exit passing through a portion of the inside of the connector, which is extended to the outside of the exposed portion or a predetermined length.

Abstract: A cooling gas is discharged from a cooling gas discharge nozzle toward a local section of a front surface of a substrate on which a liquid film is formed. And then the cooling gas discharge nozzle moves from a rotational center position of the substrate toward an edge position of the substrate along a moving trajectory while the substrate is rotated. As a result, of the surface region of the front surface of the substrate, an area where the liquid film has been frozen (frozen area) expands toward the periphery edge from the center of the front surface of the substrate. It is therefore possible to form a frozen film all over the front surface of the substrate while suppressing deterioration of the durability of the substrate peripheral members since a section receiving supply of the cooling gas is limited to a local area on the front surface of the substrate.

Abstract: A substrate treating apparatus includes a treating unit including a treating bath which a treating solution is supplied into and stored in and treating solution supply means for supplying the treating solution into the treating bath; and a drying unit including a drying bath into which fluid is supplied and injected and fluid supply means for supplying the fluid into the drying bath, wherein the fluid supply means includes a filter configured to filter the fluid before the fluid is supplied into the drying bath and a first heater configured to heat the filter. According to the substrate treating apparatus, the generation of particles caused by supplying solidified drying fluid into a drying bath is suppressed to treat a substrate without error. As a result, a production or yield increases.

Abstract: A washing apparatus for an electric shaver for flushing the shaver head unit of an electric shaver with a washing liquid to wash the shaver head unit, including a washer main body for holding the shaver head unit, a washing liquid tank mounted in the washer main body and storing the washing liquid therein, a pipe provided in the washer main body and conducting the washing liquid from the washing liquid tank to the shaver head unit, a heater for heating the washing liquid passing through the pipe, and a liquid discharger for discharging the used (dirty) washing liquid that has washed the shaver head unit.

Abstract: Drill cuttings associated with drilling fluid are thermally cleaned. The wet cuttings are fed into a vessel chamber having mechanical mixers, such as ribbon blenders, extending lengthwise of the chamber. Direct heating is applied to the chamber contents by introducing hot combustion gas from a heater. A combination of direct heating and mechanical back mixing of wet colder cuttings with drier hotter cuttings results in conditioning and conduction heating of the wet cuttings. The drilling fluid is evaporated and removed as gas. Dried cuttings are separately recovered. Caking and agglomeration of the solids is reduced.

Abstract: A device to prevent the exsiccation of fluid products in a delivery head of a dispensing machine for said fluid products. The device comprises a first element able to generate a flow of air mixed with steam or with at least a solvent, and a second element able to convey the flow towards a zone underneath the delivery nozzles of the delivery head and to create in said zone a determinate atmosphere, different from the atmosphere in the environment where the dispensing machine is to be found during use. The device also comprises detection elements arranged in proximity with the delivery head and able to detect one or more significant parameters of said determinate atmosphere, and a regulation circuit able to regulate one or more characteristics of said flow according to the values detected by the detection elements in order to maintain the significant parameters of the determinate atmosphere within a set of pre-determined values.

Abstract: A dishwasher that fits within the conventional U.S. residential dishwasher counter space and uses the conventional U.S. residential power supply to achieve within a convenient cycle time the same standard of sanitation as set forth for commercial and residential hot water sanitizing dishwashers.

Abstract: Disclosed is an induction heating type pure water heating apparatus capable of heating pure water with efficiency and without contaminating pure water. The apparatus is characterized by including a susceptor formed of glassy carbon with a water absorption coefficient of 0.5 mass % or less, and capable of contacting with pure water, a container made of a magnetic flux transmissive material, and formed so as to accommodate the susceptor and so as to allow pure water to pass therethrough, and an induction coil disposed in such a state as to surround the container or as to be adjacent to the container.

Abstract: A dish washing machine capable of smoothly discharging dirt contained in wash water out of a sump so as to prevent the emission of bad smells from the dirt and prevent the propagation of bacteria. The dish washing machine includes a sump to receive and pump wash water, a sump housing forming an external appearance of the sump, a drainage pump coupled with the sump housing to discharge wash water and dirt, and a drainage channel disposed in the sump housing to guide wash water and dirt to the drainage pump.

Abstract: A dish washing machine capable of improving spatial utilization of a washing tub through the enlargement of the washing tub. The dish washing machine includes a washing tub, a sump mounted in the washing tub to receive and pump wash water, a sump housing forming an external appearance of the sump, a washing impeller to pump wash water from the sump housing, a drainage channel disposed at an inner edge of the sump housing, a pump motor surrounded by the drainage pump to drive the washing impeller, and a pump motor receiving part to receive the pump motor. The pump motor receiving part protrudes above the drainage channel.

Abstract: A substrate treating apparatus includes a spin chuck for supporting a substrate to be rotatable in a plane including a principal surface of the substrate, a motor for rotating the spin chuck, a circulating pump for circulating a removal liquid and transmitting the removal liquid to a first nozzle, and a heater for heating the removal liquid in circulation. When removing a reaction product, the spin chuck is rotated at a rotational frequency of at least 100 rpm and not exceeding 3,000 rpm, and the first nozzle supplies the removal liquid at a rate of at least 50 ml per minute to the surface of the substrate supported and rotated by the spin chuck.

Abstract: An ultrasonic cleaner is provided with a user interface, display, and a solution timer unit that tracks the amount of time cleaning solution has been in use. The solution life is displayed in hours and minutes that can be adjusted or reset by an operator. The ultrasonic cleaner includes a solution reset key conspicuously located on a control panel that is mounted on a housing of the ultrasonic cleaner. An operator may periodically check how long the solution has been in use by simply looking at a screen displaying the time elapsed since the beginning of the period. The display may also indicate cleaning cycle times and status, such as the completion of a cleaning cycle; and the user interface may allow the operator to set cleaning cycle parameters, such as cleaning cycle time.

Abstract: A method and apparatus for removing minute particles from a surface of a sample are provided that prevent redeposition of the particles onto the surface. By combining thermophoresis with laser assisted particle removal (LAPR), the methods and apparatus remove minute particles (for example, micrometer and nanometer sizes) and assure that they will not redeposit.