Abstract: A gas-heated dishwasher includes a gas burner for heating the rinsing liquid and drying dishes, which is suitable for drying dishes and heating the rinsing liquid in an efficient way, while, at the same time, making it possible for a worktop to be placed on top of the dishwasher, the gas burner is embodied and disposed in the motor chamber so that it heats at least one closed tubular heating body filled with a fluid during a sub-program dry section and heats the rinsing fluid during the sub-program sections when the rinsing fluid is used.

Abstract: A substrate drying system having an IPA concentration interlock detector for detecting the concentration of substrate-drying IPA vapor in a processing or cleaning tank of a Marongoni-type substrate drying system, for example, as substrates are dried in the cleaning tank after washing typically using deionized water. In the event that inadequate concentrations of the IPA vapor are delivered to the cleaning tank, the IPA concentration interlock detector transmits an alarm signal to the tool controller to alert facility personnel to the inadequate IPA concentrations in the cleaning tank and prevent the formation of water marks on the substrates.

Abstract: A supercritical fluid cleaning system uses process fluid for operating rotary motors in the chamber with fluid bearings and fluid load levitation for rotating workpieces and impellers. Rotating speed and direction sensors and a home position locator facilitate motor control. Impellers add further agitation of the fluid in the chamber, faster processing, and greater uniformity of supercritical fluid components and increase mass transfer of fluid to the processed surface. Centrifugal operated clips and cassettes hold wafers and impellers. Non-contact, fluid operated rotating mechanisms reduce contamination. Physical, rotational, and shear affects are enhanced through centrifugal forces which can induce the separation of films localized deposits or molecular products of the reaction from the surface. There is a concomitant agitation of fluid, and continuous angular acceleration imparted to the processed surface features.

Abstract: An apparatus comprising multiple heating, cooling, and/or cleaning zones. The apparatus produces a jet flow of solvent/cleaning fluid onto an article to be cleaned without the need for a pump or compressor. The jet flow provides more effective contaminant removal. The multiple zones result in increased residence time for increased efficiency in separating the solubilized contaminant from the solvent/cleaning fluid.

Abstract: A dishwasher mainly includes a washing cabinet and a steam generator havingwater-feeding and steam-feeding holes provided at two ends thereof. Water fed into the steam generator via the water-feeding hole is quickly heated to produce high-temperature steam that is sent via the steam-feeding hole into a steam pipeline distributed over inner surfaces of the washing cabinet, so that the steam is sprayed via apertures and/or spray holes on the steam-feeding pipeline into the washing cabinet to sterilize and soften hardened food residues on the dishware positioned in the washing cabinet for washing, making the dishware effectively cleaned and sterilized.

Abstract: An apparatus for cleaning a microelectronic substrate includes a pressure chamber, a supply of a process liquid including dense phase CO2 fluidly connected to the chamber and a distilling system. Distilling system includes a still fluidly connected to the chamber and operative to separate CO2 from the process fluid. The distilling system is operative to re-introduce the separated CO2 into the chamber or a further chamber.

Abstract: A substrate processing apparatus includes a container in which a heating plate, a discharge nozzle for discharging a vapor of organic solvent, and a discharge nozzle for supplying a process gas and a cooling gas are provided. A pump in communication with an exhaust outlet of the container exhausts an atmosphere from the container to reduce pressure in the container. Therefore, the substrate processing apparatus is capable of performing (1) the process of drying a substrate in a reduced-pressure atmosphere by the use of the vapor of organic solvent, and (2) the process of drying the substrate in the reduced-pressure atmosphere by heating, to thereby efficiently dry the substrate.

Abstract: Methods for cleaning a microelectronic substrate in a cluster tool are described that include placing the substrate in a pressure chamber of a module in a cluster tool; pressurizing the pressure chamber; introducing liquid CO2 into the pressure chamber; cleaning the substrate in the pressure chamber; removing the liquid CO2 from the pressure chamber, depressurizing the pressure chamber, and removing the substrate from the pressure chamber. Apparatus for processing a microelectronic substrate are also disclosed that that include a transfer module, a first processing module that employs liquid carbon dioxide as a cleaning fluid coupled to the transfer module, a second processing module coupled to the transfer module, and a transfer mechanism coupled to the transfer module. The transfer mechanism is configured to move the substrate between the first processing module and the second processing module.

Abstract: A method of controlling a dishwasher, which heats air in a washing chamber while supplying water into the washing chamber to generate hot water through a heat exchange between the heated air and the supplied water. Further, a second method of controlling a dishwasher operates an air generator while starting of the supplying of water into a washing chamber to heat the supplied water and air in the washing chamber. If a temperature of the water in the washing chamber exceeds a first reference value, the supplying of water is stopped and the air generator is operated. If a temperature of the air in the washing chamber exceeds a second reference value, the supplying of water is started.

Abstract: Apparatus for pressure processing components is disclosed which includes an improved closure system that minimizes dust-generating parts and allows easy access to the chamber. Ports are provided for introducing and releasing pressurized gases and fluids to and from the processing space. The heating system of the apparatus heats both the cover and the stage inside the pressurized chamber such that cycle time to equilibrate heated, pressurized fluids such as supercritical carbon dioxide inside the chamber are decreased. The apparatus includes a mechanism that raises the stage inside the chamber, pressing it against the fixed cover and sealing the inside of the pressure vessel. In one embodiment a screw-type jack is used to move the component-loaded stage fitted with a deformable o-ring seal a short travel distance to seat against the lid and seal the pressure chamber. In a related embodiment a computer and an electronic stepper motor are used to drive the pressing means in an automated fashion.

Abstract: A surface cleaning apparatus comprising a chamber, and a thermal transfer device. The chamber is capable of holding a semiconductor structure therein. The thermal transfer device is connected to the chamber. The thermal transfer device has a surface disposed inside the chamber for contacting the semiconducting structure and controlling a temperature of the semiconductor structure in contact with the surface. The thermal transfer device has a thermal control module connected to the surface for heating and cooling the surface to thermally cycle the surface. The thermal control module effects a substantially immediate thermal response of the surface when thermally recycling the surface.

Abstract: A stripping solution is supplied onto the surface of a substrate and an alternating magnetic flux is applied to the substrate. The alternating magnetic flux induces a current in a conductive pattern of the substrate which heats the conductive pattern while the stripping solution is in contact with the substrate. The stripping solution, containing particles to be cleaned off the substrate, is then removed from the substrate.

Abstract: A cleaning apparatus and a cleaning method for cleaning a object are provided. In the cleaning apparatus, a drying chamber 42 and a cleaning bath 41 are separated from each other up and down, respectively. Thus, a space in the drying chamber 42 can be insulated from a space of the cleaning bath 41 through rotary doors 59a and a slide door 72. In the cleaning method, a cleaning process in the cleaning bath 41 is carried out while sealing it by the rotary doors 59a. On the other hand, a drying process in the drying chamber 42 is accomplished while sealing and closing it by the slide door 72. Consequently, there is no possibility that, during the drying process, the object is subjected to a bad influence from a chemical treatment.

Abstract: A wash apparatus includes a tank for holding clean solvent, a first distillation chamber, a second distillation chamber and a washbasin surrounded by a closeable hood structure for cleaning paint spray guns and associated parts placed therein. The washbasin is selectively positionable in fluid circulating communication with either of the first and second distillation chambers during washing operations, wherein solvent discharged in the washbasin returns to the selected distillation chamber. When either of the distillation chambers becomes filled with contaminated solvent, the washbasin is operatively positioned in fluid circulating communication with the other distillation chamber for continued washing operations, thereby allowing the contaminated solvent in the filled distillation chamber to be purified during a distillation cycle. The purified solvent from the distillation cycle returns to the clean solvent holding tank.

Abstract: In a system for cleaning a workpiece or wafer, a boundary layer of heated liquid is formed on the workpiece surface. Ozone is provided around the workpiece. The ozone diffuses through the boundary layer and chemically reacts with contaminants on the workpiece surface. Preferably, the liquid includes water, and may also include a chemical. Steam may also be used with the steam also physically removing contaminants, and also heating the workpiece to speed up chemical cleaning. Sonic or electromagnetic energy may also be introduced to the workpiece.

Abstract: A process of cleaning of objects that relate to semiconductor fabrication processes, such as, for example, conductive paste screening in the production of multilayer ceramic substrates and composite solder paste by stencil printing in electronic circuit assembly. Specifically, the process removes a metal/polymer composite paste from screening masks and associated paste making and processing equipment used in printing conductive metal pattern onto ceramic green sheet in the fabrication of semiconductor packaging substrates. The process also cleans solder paste residue from stencil printing equipment used in electronic module assembly surface mount technology for SMT discretes, solder column attachment, and BGA (Ball Grid Array) attachment on ceramic chip carrier or for screening solder paste onto printed circuit board.

Abstract: A process and apparatus for cleaning filters prior to recycling or disposal. In this process and apparatus liquid or supercritical carbon dioxide contacts the plugged pores of a filter under conditions in which carbon dioxide remains in the liquid or supercritical state.

Abstract: The removal of ceramic material from the interior of cast metallic components is accomplished in a closed system. A vessel within the system is filled with a chemical leaching fluid that immerses the cast component having the ceramic material and/or ceramic cores therein. The leaching fluid is superheated and boiling is controlled by varying the pressure within the closed system without changing the molecules in the vessel.

Abstract: A cleaning apparatus for a lens defining opposed top and bottom surfaces and a peripheral edge. The cleaning apparatus comprises a rotatable base having a plurality of arms pivotally connected thereto and rotatable therewith. The arms are configured to releasably engage the peripheral edge of the lens. The cleaning apparatus further comprises a means for propelling a heated medium towards at least one of the top and bottom surfaces of the lens while the lens is being spun by the rotation of the base and the arms.

Abstract: A system for heating solvents in processing semiconductor wafers has a coiled solvent tube, a coiled cooling water tube, and electric heater elements, cast in place within an aluminum casting. The solvent flows through the solvent tube and is heated by conduction of heat through the casting. The solvent is safely isolated from the heating elements. Water is pumped through the cooling water tube, to cool the casting if solvent flow is interrupted, or if the measured casting temperature exceeds a predetermined set point temperature. Solvent temperature is maintained by controlling power to the heating elements based on the measured solvent temperature at the processing chamber.

Abstract: A system and method of selectively extending a wash cycle duration of a warewasher beyond a set minimum duration provides suitable cleaning of wares while at the same time seeking to increase the number of wash cycles per unit time. A system and method for detecting water level in a wash chamber or other tank provides the ability to identify a progressively fouling electrode. A system and method of automatically priming one or more chemical feed lines of a warewasher is also described.

Abstract: A supercritical process vessel with an interior for holding a supercritical fluid is provided. A wafer support for supporting a wafer within the interior of a supercritical process vessel to expose the wafer to the supercritical fluid is provided. A lamp, which is able to operate at supercritical fluid pressures within the interior of the supercritical process vessel is provided.

Abstract: An apparatus for cleaning a semiconductor wafer and method for cleaning a wafer using the same wherein, the apparatus includes a chamber on which a wafer is mounted, a revolving chuck mounted in the chamber for supporting and fixing the wafer, a nozzle for spraying cleaning solution onto the wafer, a cover for covering an upper part of the chamber, a heating lamp fixed on an upper part of the cover for heating the wafer or the cleaning solution, a cooling water conduit surrounding the cover, and an antipollution plate mounted on a lower part of the heating lamp in the cover for preventing the heating lamp from being polluted by the cleaning solution. According to an embodiment of the present invention, the cleaning solution, preferably of ozone water, hydrogen water, or electrolytic-ionized water, is heated for a short time and used to clean the wafer.

Abstract: A flushing system for flushing away any coking material which may have built up in the bearing of a gas turbine. Three fluid tanks respectively contain a solvent for dissolving the coked material, a cleaner and a lubricant. By means of a three-way valve, one of the fluids is provided to a supply pump for delivery to the bearing housing via a quick disconnect coupling. Fluid is returned to the appropriate tank by means of a return pump, via a quick disconnect coupling and another three-way valve between the return pump and the tanks. The system includes respective filters for filtering the return fluids and the entire system may be carried on a wheeled cart for servicing the gas turbine.

Abstract: A pressure processing device including a vessel having a body and an opening/closing member. A seal member is provided on a joining surface between the body and the opening/closing member, and a non-sliding joining surface is provided which is not slidably moved when the member is opened and closed. A device is provided including a diaphragm for housing an object to be processed, and a fluid introducing passage to the vessel provided so that a greater part of a fluid flowing into the vessel flows into the diaphragm. The diaphragm can be formed of heat insulating material, and a filter can be provided for removing particles installed on the side of the diaphragm into which a fluid flows. A plate having a labyrinth construction can be provided for trapping particles by parts on a surface thereof. A pressure processing device in which an object may be washed is also provided.

Abstract: Apparatus (20) for cleaning a window (24) of a vehicle (22), including a vessel (28), having an inlet (32) through which a washing fluid is received from a reservoir and an outlet (34) through which the fluid is discharged for cleaning the window. There is a heating element (50) for heating the fluid in the vessel, which element preheats the vessel before the washing fluid is received therein, whereby at least an initial quantity of the fluid is rapidly heated and discharged from the vessel.

Abstract: A process and system for conditioning a bulk container for ultra-high purity liquefied gas. Vapor is generated in the container from a conditioning quantity of the ultra-high purity liquefied gas by imposing a temperature difference on the container so that the vapor condenses when a temperature difference is achieved. The resulting liquid reflux, e.g., the condensed liquid drips or flows back to the conditioning quantity of the liquified gas, washes or removes contaminants, e.g., particles, metal and moisture, from the interior surface of the container. A portion of the vapor is vented from the container for reclamation. The used conditioning liquid may also be reclaimed.

Abstract: A cleaning apparatus for removing contaminants from the surface of a substrate includes two parts: one which produces an aerosol including frozen particles and directs the aerosol onto the surface of the substrate to remove contaminants from the surface by physical force, and another part in which a fluid including a gaseous reactant is directed onto the surface of the substrate while the surface is irradiated to cause a chemical reaction between the reactant and organic contaminants on the surface, to chemically removing the organic contaminants. In the method of cleaning the substrate, the physical and chemical cleaning processes are carried out in a separate manner from one another so that the frozen particles of the aerosol are not exposed to the effects of the light used in irradiating the surface of the substrate. Therefore, the effectiveness of the aerosol in cleaning the substrate is maximized.

Abstract: A workpiece processing system for processing semiconductor wafers and other flat media includes a standalone processing unit having two or more modules vertically stacked on top of one another. A first module includes an ozone generator, a DI water supply, a purge gas/drying gas supply, and optionally includes an ammonium hydroxide generator. A second module is preferably stacked on top of the first module and includes a processing chamber in communication with the devices in the first module. The processing chamber preferably includes a rotor for holding and rotating workpieces, one or more spray manifolds, an ozone destructor, an anti-static generator, and/or any other suitable workpiece-processing devices. The rotor is preferably designed to hold two workpiece-carrying cassettes each capable of holding up to 25 workpieces. A third module is preferably stacked on top of the second module and includes the system electronics and controls.

Abstract: A method of treating semiconductor wafers in a sealed container is provided and includes transferring and vertically placing a plurality of wafers in the container and sealing the container. An inert gas is fed into the sealed container and a quantity of warm pure water is fed into the sealed container sufficient to completely submerge the plurality of wafers and establish a level of the warm pure water in the sealed container. A vapor or fog of an organic solvent is fed into at least a space in the sealed container above the level of the warm pure water and is then terminated at a prescribed time. The plurality of wafers is dried by aspirating the warm pure water through an outlet in the bottom of the container wherein the pressure in the container is reduced during the aspiration. The inert gas is fed into the sealed container until at least the termination of the drying of the plurality of wafers.

Abstract: An apparatus and method for operating a dishwasher in a variable dry cycle mode is provided. The dishwasher includes a wash chamber, a heater element located within the wash chamber, a rinse aid product dispenser, and a fan unit for circulating air. The method comprises determining a temperature of the wash chamber, determining an amount of rinse aid product in the dispenser, and, based upon the determined temperature and the amount of rinse aid product, determining an optimized heater element cycle and an optimized fan unit cycle.

Abstract: This invention discloses an apparatus and method for hydrating or washing ophthalmic devices, comprising the step of directing to an ophthalmic device having a higher concentration of impurities fluid which has previously been directed to ophthalmic device having a lower concentration of impurities. Further, this invention provides a preferred device supporting member.

Abstract: A retaining device for a steam swab includes a first primary clamp, a second primary clamp and an auxiliary clamp. Each of the first primary clamp, the second primary clamp and the auxiliary clamp are respectively pivotal relative to the upper casing and are provided with bosses so that a fabric of the steam swab is able to be securely clamped by the first primary clamp, the second primary clamp and the auxiliary clamp.

Abstract: Cleaning according to an evaporating dish cleaning mode or heating chamber cleaning mode is implemented based on a signal inputted by the control part. In the heating chamber cleaning mode, condensation is generated on the inner surface of the heating chamber 11 by steam, and the soil adhered to the inner surface of the heating chamber 11 is allowed to float to be in a state of removing it easily. In the evaporating dish cleaning mode, a cleaning liquid made of citric acid solution is pumped into an evaporating dish 35, it is heated to a predetermined temperature, and it is left therein. Therefore, calcium and magnesium deposited on the evaporating dish 35 are allowed in a state of removing them easily.

Abstract: The invention refers to a method and an arrangement for cleaning of porous materials, in particular textiles, in liquid carbon dioxide which by rapid, intermittent pressure drops is brought into boiling. Various ways of lowering and then again increasing the pressure in the chamber in which the cleaning takes place are described. The arrangement for carrying out the method comprises a pressure chamber (1) in which the goods (2) to be washed is treated, an adjacent container (13, 14) for the control of the carbon dioxide pressure in the pressure chamber (1), suitably a storage tank (7) for liquid carbon dioxide, a compressor (20) for supplying high-pressure gas into the pressure chamber, when necessary, a pump (10) for the transport of liquid carbon dioxide and the required connecting conduits between the volume vessels mentioned and, stop valves in these conduits.

Abstract: A side edge of a wafer is retained by a plurality of chuck pins. A heating-and-cooling section is arranged such that a clearance is defined between a surface of the heating-and-cooling section and a surface of the wafer. The heating-and-cooling section is for heating or cooling the surface thereof. The clearance is filled with liquid by means of a liquid filling section. The surface of the wafer is heated or cooled by way of the thus-filled liquid.

Abstract: In an apparatus for etching a glass substrate according to the present invention, impurities that are attached to the surface of a glass substrate, which are formed by assembling a color filter substrate and a TFT substrate provided in the etching bath filled with etchant, are removed by using ultrasonic oscillation generated from an ultrasonic oscillator, by which a glass substrate having uniform thickness and surface is obtained.

Abstract: A washing container for a dishwasher having several parts joined together, including a frame with walls, a base, and/or a cover attached thereto. The container can easily be adapted to varying predefined requirements according to the design of the dishwasher.

Abstract: This invention relates to a cleaning device for rotationally symmetrical bodies, in particular for vehicle wheel rims with or without tires. Said device is designed for mechanical cleaning, using a moving cleaning fluid in a cleaning bath (20). The cleaning bath (20) has at least one vibrator (34 to 37) which places a cleaning fluid in a state of turbulence in the ultrasound region. A heater (38) is also provided in order to heat the cleaning fluid and is located in the cleaning unit. A holder (30) is arranged in the cleaning unit in order to accommodate a receiving device which can e swiveled inwards or swiveled outwards and which is designed to hold the rotationally symmetrical body that is to e cleaned.

Abstract: A to-be-cleaned substrate is cleaned by use of an acid liquid agent in a cleaning cup, the remaining acid liquid agent is washed out by use of pure water, then an alkaline liquid agent is emitted to the surface of the to-be-cleaned substrate in the same cleaning cup to remove the acid liquid agent remaining on the to-be-cleaned substrate. A neutralization reaction between the acid and alkali is caused by emitting the alkaline liquid agent to the surface of the to-be-cleaned substrate so as to efficiently remove the acid liquid agent remaining on the surface of the to-be-cleaned substrate.

Abstract: A liquid processing apparatus is provided to improve its processing efficiency, together with a liquid processing method. The apparatus is capable of both reduction in temperature-variation of a processing liquid at processing and shortening for temperature-recovery of the processing liquid. Further, the liquid processing apparatus can facilitate the establishment of respective designated temperatures for different processes and carry out different processes continuously and effectively. The apparatus includes an inner cylinder 25 to accommodate semiconductor wafers W and a chemical supply unit 50 to supply the semiconductor wafers W in an inner cylindrical chamber 23 with a chemical liquid. The apparatus further includes a case heat exchanger 90 arranged in an outer peripheral position of the inner cylinder 25 and allowing a temperature-adjustment medium to flow and a medium supplier 100 to supply the regulator 90 with the temperature-adjustment medium.

Abstract: A dishwasher includes a casing arranged within the dishwasher, an odor eliminating material installed within the casing, a shutter which selectively opens a part of the casing to expose the odor eliminating material, and a shutter driving device which operates the shutter. A control unit of the dish washer counts an actual drying time in a drying operation of the dishwasher, and opens the shutter by operating the shutter driving device in response to the counted drying time being equal to or greater than a preset drying time. The odor eliminating material eliminates odors in the dishwasher.

Abstract: A refrigerated automatic fruit and vegetable washer that washes fruits and/or vegetables and stores them in a cool environment after they have been washed. A portable self-contained embodiment has a cabinet that sits on a countertop and contains a water spray system and a thermoelectric cooling system and sits on a kitchen countertop and has water inlet and drain hoses releasably connected to the sink faucet. Another self-contained embodiment fits into a lower storage compartment of a refrigerator and can be removed and placed on the countertop for the washing operation. A built-in cabinet embodiment is permanently installed in the kitchen. A wash-only embodiment is slidably received in the lower portion of a refrigerator in place of the existing vegetable crisper to be cooled by the refrigerator cooling system and is removed therefrom and placed on a countertop for the washing operation. The fruit and vegetable washer may also be built into a refrigerator as an integral component of the refrigerator.

Abstract: A substrate processing unit 10 capable of restraining contaminants such as particles, watermarks and the like from being adhered to a substrate such as a semiconductor wafer and the like, wherein the substrate processing unit 10 comprises a processing bath 11 for accommodating the substrates (e.g., wafer W) to be processed, a processing fluid introduction pipe 21 for supplying processing fluid (e.g., purified water J) to the processing bath 11, a vapor generating bath 61 for accommodating an organic solvent S (e.g., IPA fluid), a processing fluid discharge section 30 for discharging processing fluid from the processing bath 11, and a solvent heating unit 62 for heating the organic solvent S inside the vapor generating bath 61, wherein the vapor generating bath 61 introduces vapor generated from the organic solvent S to the inside of the processing bath 11, and the solvent heating unit 62 heats the organic solvent S inside the vapor generating bath 61 at a temperature in the range of 50° C.

Abstract: By a simple apparatus construction and process, it is made possible to “clean precisely” a surface at the molecular/atomic level, and the purification degree of the surface processed minutely is made into 1012 molecules/cm2 or less. A steam-spraying nozzle is disposed such that a line slit nozzle is in a diameter direction, and mist-containing steam is sprayed onto the surface of a substrate. Thereby, particles in the steam-spraying surface (the particles were made to adhere by dipping the substrate in a solution containing polystyrene (particle diameter of 0.6 &mgr;m) or alumina (particle diameter of 0.3 &mgr;m to 0.5 &mgr;m) particles at 105 particles/ml.) are removed by about 90% to 95% after ten-seconds spraying, and by 99% or more, that is, to less than the detection limit of a wafer inspection device, after twenty-seconds spraying.

Abstract: Contaminant removal from a substrate can be performed using a supercritical fluid. An apparatus can be configured to operate at conditions that take advantage of higher solubility of a contaminant in its supercritical state compared to its liquid state. The substrate can be exposed to a supercritical fluid in a chamber to remove at least some of the contaminant. Outside the chamber, the supercritical fluid can be cooled to its corresponding liquid state, in which lower solubility of the contaminant may allow the contaminant to separate into a different phase from the liquid phase of the supercritical fluid. Such contaminant removal can be highly advantageous to substrates that withstand only limited amounts of physical or mechanical stress or heat. The contaminant removal can also be used where geometries virtually prevent removal by physical or mechanical means.

Abstract: A cleaning agent or a rinsing agent having no flash point which comprises a chlorine-free fluorine-containing compound having a vapor pressure at 20° C. of 1.33×103 Pa or more and one or more components having a vapor pressure at 20° C. less than 1.33×103 Pa and optionally an additive such as an antioxidant; a method for cleaning which comprises cleaning with the cleaning agent and rinsing and/or vapor cleaning utilizing a vapor being generated by boiling the cleaning agent or a condensate thereof; a method for separating a soil which comprises contacting a cleaning agent in a cleaning tank with a condensate of the vapor of the cleaning agent in a soil separating tank, to thereby continuously separate and remove a soil contained in the cleaning agent; and a cleaning apparatus.

Abstract: A process and system for conditioning a bulk container for ultra-high purity liquefied gas. Vapor is generated in the container from a conditioning quantity of the ultra-high purity liquefied gas by imposing a temperature difference on the container so that the vapor condenses when a temperature difference is achieved. The resulting liquid reflux, e.g., the condensed liquid drips or flows back to the conditioning quantity of the liquified gas, washes or removes contaminants, e.g., particles, metal and moisture, from the interior surface of the container. A portion of the vapor is vented from the container for reclamation. The used conditioning liquid may also be reclaimed.

Abstract: A method for servicing firefighter's turnout gear includes the step of transporting a mobile servicing facility in proximity to a fire department facility. The mobile servicing facility carries cleaning equipment for cleaning firefighter's turnout gear. For example, the cleaning equipment may include a cleaning machine for use with a carbon dioxide-based cleaning agent, a solvent, or laundry equipment. The method also includes the steps of operating the cleaning equipment to clean turnout gear of the fire department facility, and transporting the mobile servicing facility away from the fire department facility. Optionally, the mobile servicing facility also carries repairing equipment, supplies for repairing the turnout gear, power generation equipment, and/or a tracking system for preparing a report of services performed on the turnout gear.

Abstract: A method and apparatus are provided for eliminating contaminants including metallic and/or hydrocarbon-containing contaminants on a surface of a semiconductor substrate by heating a semiconductor substrate which may have contaminates on the surface thereof to an elevated temperature within an integrated closed system while simultaneously purging the integrated closed system with a chlorine-containing gas. At the elevated temperatures the chlorine dissociates from the chlorine-containing gas and reacts with the contaminates on the substrate surface to form volatile chloride byproducts with such contaminants which are removed from the integrated closed system while the substrate is continuously heated and purged with the chlorine-containing gas. Subsequently, the substrate is moved to a cooling chamber within the integrated closed system and cooled to provide a semiconductor substrate having a clean surface.