Abstract: A process and apparatus for drying semiconductor wafers, includes the controlled-rate extraction of a wafer immersed in rinsing liquid, irradiation of the wafer using high intensity lights or filaments along the wafer-liquid interface, and delivery of gas streams against the wafer along the wafer-liquid interface using a gas delivery system. Heating is controlled to create a temperature gradient without evaporating rinsing fluid adhering to surfaces of the wafer. Heating by the radiation sources creates a temperature gradient in the wafer in the irradiated region that simultaneously generates a surface tension gradient in the water adhering to the wafer. The gas delivery system removes the bulk of the water adhering to the wafer surface, and also suppresses the height of the rinsing liquid adhering to the wafer, providing faster extraction of dry and highly clean wafers from the rinsing liquid. A solvent vapor is optionally injected at the wafer-liquid interface, to reduce adhesion of the liquid to the vapor.

Abstract: Apparatus for stripping ceramic coatings from the surfaces of articles. The apparatus includes a dedicated pressure vessel, such as an autoclave, which is maintained at an elevated temperature. Caustic solution is preheated to a first elevated temperature before injecting it into the autoclave, and the caustic solution is filtered and cooled after use in the autoclave. The articles are stripped of coating by maintaining the articles at an elevated temperature and pressure for a predetermined time. Various options include the use of analytical equipment to maintain the chemistry of the caustic solution and use of a volatile organic solution to prepressurize the autoclave and shorten cycle time. The autoclave is maintained in a nitrogen chamber to minimize the risks associated with volatile components.

Abstract: A system and method are provided for using an organic solvent to clean chamber parts used in semiconductor manufacturing. The chamber parts are exposed to the solvent using a dipping system or a vapor contact system in order to soften or dissolve the organic polymers. The solvent may be heated up to a temperature of 100° C. The organic cleaning solvent may be a pyrrole-based, amine-based, fluoro/ether-based or ether-based solvent. Additionally, a system and method are provided for establishing criteria to verify that the chamber parts are clean with respect to organic, metallic and particulate impurities and establishing criteria to verify that the physical surface morphology remains intact.

Abstract: In a method for cleaning a surface of a substrate an amount of a solution is applied on a surface of the substrate. After the solution is applied on the surface, crystallization of the solution is initiated to form a liquid-crystal mixture. Once the liquid-crystal mixture is formed, relative motion between the liquid-crystal mixture and the substrate is created to dislodge contaminants adhered to the substrate. In one alternative method, the solution is applied on a pad. In another alternative method, the substrate is place in a bath of the solution. A wafer cleaning module also is described.

Abstract: Apparatus and methods are described for removing contaminants from an article using a supercritical or near supercritical solvent fluid held at substantially constant pressure in a pressure vessel. The article to be cleaned is first contacted with a solvent fluid in which the contaminant is soluble at a first supercritical or near-supercritical temperature. The contaminant-containing fluid is then cooled or heated to a second supercritical or near supercritical temperature to lower the solubility of the contaminant in the supercritical fluid and thereby precipitate or phase separate the contaminant. The contaminant is then recovered. Movement of the solvent fluid within the pressure vessel is preferably by convection induced by heating and cooling means in the vessel.

Abstract: A compact reflow oven and cleaning apparatus combines in a unitary housing for both the reflow and cleaning function. This results in the saving of valuable floor space in the printed circuit board assembly areas. The unitary housing and control of temperatures in the reflow and cleaning areas facilitate the removal of contaminants before solidification of such contaminants.

Abstract: Apparatus for stripping ceramic coatings from the surfaces of articles. The apparatus includes a dedicated pressure vessel, such as an autoclave, which is maintained at an elevated temperature. Caustic solution is preheated to a first elevated temperature before injecting it into the autoclave, and the caustic solution is filtered and cooled after use in the autoclave. The articles are stripped of coating by maintaining the articles at an elevated temperature and pressure for a predetermined time. Various options include the use of analytical equipment to maintain the chemistry of the caustic solution and use of a volatile organic solution to prepressurize the autoclave and shorten cycle time. The autoclave is maintained in a nitrogen chamber to minimize the risks associated with volatile components.

Abstract: Apparatus including an elongate pipe (1) for use in the transfer of fluids susceptible to form deposits on cooling such as wax deposits in oil, and a container (12) having a reusable heat source including a supercooled solution, e.g., of aqueous sodium acetate. The container (12) is in heat conducting contact with a surface of the pipe (1), preferably on at least one surface of the container. The deposit may be removed from inside the pipe (1) by locating in heat conducting relation to the pipe a reusable heat source including a supercooled solution, and activating crystallization in the solution liberating heat which causes at least some of the deposit to melt and/or dissolve.

Abstract: A cleaning apparatus and a cleaning method for cleaning an object are provided. In the cleaning apparatus, a drying chamber 42 and a cleaning bath 41 are separated from each other up and down, respectively. Thus, a space in the drying chamber 42 can be insulated from a space of the cleaning bath 41 through rotary doors 59a and a slide door 72. In the cleaning method, a cleaning process in the cleaning bath 41 is carried out while sealing it by the rotary doors 59a. On the other hand, a drying process in the drying chamber 42 is accomplished while sealing and closing it by the slide door 72. Consequently, there is no possibility that, during the drying process, the object is subjected to a bad influence from a chemical treatment.

Abstract: Where a substrate such as a semiconductor wafer held in a process space in a process chamber consisting of an outside chamber and an inside chamber is subjected to a cleaning processing, a chemical agent such as IPA or a solvent having a surfactant added thereto is supplied in the form of a mist or a vapor toward the substrate under the sate that the substrate is stopped or rotated at a low speed after processing with a chemical agent and a subsequent rinsing processing with a pure water. After the supply of the chemical agent is stopped, the substrate is rotated at a rotating speed higher than said low speed so as to centrifugally remove the chemical agent attached to the substrate.

Abstract: The present invention 10 discloses a portable device for cleaning eyeglasses 16. A transparent enclosure 14 is provided having an upper chamber 18 for cleaning the eyeglasses, a lower left chamber 30 which may be removable for containing the cleaning solution 31 and a lower right chamber housing a pump 36 which is powered by batteries 56 and controlled by a microprocessor 58. The pump 36 circulates cleaning solution 31 through a plurality of apertures 60 in the floor 62 of the upper chamber which creates a spray 64 on the eyeglasses 16. A fan 72 with heating coil 74 then circulates warm air over the eyeglasses 16 in order to dry them.

Abstract: A method of removing organic impurities from a surface of a substrate that is used for feeding or processing web material, wherein a jet of an atmospheric plasma is directed onto the surface of the substrate.

Abstract: This invention relates to a cleaning device for rotationally symmetrical bodies, in particular for vehicle wheel rims with or without tires. Said device is designed for mechanical cleaning, using a moving cleaning fluid in a cleaning bath (20). The cleaning bath (20) has at least one vibrator (34 to 37) which places a cleaning fluid in a state of turbulence in the ultrasound region. A heater (38) is also provided in order to heat the cleaning fluid and is located in the cleaning unit. A holder (30) is arranged in the cleaning unit in order to accommodate a receiving device which can e swiveled inwards or swiveled outwards and which is designed to hold the rotationally symmetrical body that is to e cleaned.

Abstract: An apparatus for cleaning a substrate includes a source of pressurized carrier gas and a body of cleaning agent in liquid form. A first conduit directs the pressurized carrier gas from the carrier gas source to the body of cleaning agent. A second conduit carries a flow of the carrier gas away from the body of the cleaning agent. The carrier gas flow carried by the second conduit includes cleaning agent in vapor form acquired from the body of cleaning agent. A nozzle is coupled to the second conduit to cause droplets of the cleaning agent to impinge upon a first face of the substrate to be cleaned.

Abstract: In a state where a wafer is held by a wafer holding section and a temperature controlled liquid is discharged to a rim area on a rear face of the wafer from flow channels, a developing solution is heaped on a front face of the wafer. Thereafter, the wafer is rotated for a predetermined period of time in a state where the temperature controlled liquid is discharged to the rim area on the rear face of the wafer from the flow channels, whereby developing is performed. The wafer is heated by the wafer holding section with a large heat capacity in an area close to a center of the wafer, and a liquid film of the temperature controlled liquid is formed in the rim area of the wafer, whereby the wafer is heated. At this time, the wafer is rotated, so that the developing solution is stirred.

Abstract: In a method for treating substrates, the substrates are lowered for treatment into a treatment fluid contained in a treatment device. The substrates are then lifted by a first receiving device at least partially out of the treatment fluid and transferred to a second receiving device for completely lifting the substrates out of the treatment fluid. The second receiving device is completely dry at the time of transfer. The drops forming at the lowest point of the substrates are drained during lifting by a drop draining element. The device for performing the method has a lifting device with a first and second receiving device and a drop draining device for draining the drops forming at the lowest point of the substrates during lifting of the substrates from the treatment fluid.

Abstract: A portable domestic steam cleaning appliance comprises a generally accurate housing having a forward facing barrel portion and a handle portion. A water reservoir is releasably attached to the handle portion. A tube extends into the water reservoir to supply water via a pump to a flash boiler. Steam exits an outlet in use. Power to an embedded heating element is controlled by a thermostat to prevent excessive heating of the boiler. The components are incorporated in the housing that is readily carried in one hand to enable sweeping of attachments that fit to the outlet over surfaces for cleaning and sterilising those surfaces as required. There is no need to carry around or have closely available a significant quantity of water at high temperature or pressurised steam, to provide an adequate supply of steam, being a significant disadvantage over otherwise similar prior art appliances.

Abstract: An inverted pressure vessel system for conducting automated industrial processes requiring elevated pressure and temperatures has a vertically movable pedestal for opening and closing the underside loading port, with pedestal drive system and locking mechanism located below the pedestal top and isolated from the chamber opening. The chamber is connectible to a pressure control and process fluid supply system, and has heat exchangers connected to an external source for temperature control. Process fluids are distributed across a central process cavity through divergent inflow and convergent outflow process fluid channels.

Abstract: A large tumbling device into which broken pieces of labeled glass such as beverage bottles, or cullet, are fed. After entering the interior chamber of the tumbler, the cullet is carried by a plurality of interior fins along the inside circumference of the tumbler to a point where the glass falls back to the low point of the tumbler. During this fall, the cullet passes through a flame generated in the interior cavity of said tumbler. The glass is heated to a temperature well below 600 degrees Fahrenheit (the temperature at which the molecular structure of glass begins to change) therefore ensuring that the processed glass retains its original properties. This process is repeated numerous times, ensuring that all of the foreign material is removed, before the cullet passes through the entirety of the chamber and is cooled to be processed into the desired grades.

Abstract: A system for at least partially decontaminating personnel in response to detection of an agent harmful to human life such as a chemical or biological agent. The system can provide a sprinkler head above a walkway such as a hallway through which personnel are expected to walk. The sprinkler can provide a spray of decontamination fluid such as gas or liquid over personnel passing underneath, removing or neutralizing at least some of the harmful agent and reducing the transport of the agent from one area to another. Preferably, the system includes a sprinkler or shower head coupled to an existing fire isle control sprinkler supply pipe, wherein the sprinkler head may include a valve that is remotely controlled and can be opened in response to detection of a chemical or biological agent.

Abstract: An apparatus for removing photo-resist. The apparatus comprises carriers for carrying a wafer, hot plates to remove residue solvent on the wafer, a cooling plate to decrease the wafer temperature, an reverse unit to turn over the wafer, a development unit to develop and remove photo-resist on the wafer, a top scrubbing unit to clean a top side of the wafer, and a back scrubbing unit to clean a back side of the wafer.

Abstract: A process and apparatus for drying semiconductor wafers, includes the controlled-rate extraction of a wafer immersed in rinsing liquid, irradiation of the wafer using high intensity lights or filaments along the wafer-liquid interface, and delivery of gas streams against the wafer along the wafer-liquid interface using a gas delivery system. Heating is controlled to create a temperature gradient without evaporating rinsing fluid adhering to surfaces of the wafer. Heating by the radiation sources creates a temperature gradient in the wafer in the irradiated region that simultaneously generates a surface tension gradient in the water adhering to the wafer. The gas delivery system removes the bulk of the water adhering to the wafer surface, and also suppresses the height of the rinsing liquid adhering to the wafer, providing faster extraction of dry and highly clean wafers from the rinsing liquid. A solvent vapor is optionally injected at the wafer-liquid interface, to reduce adhesion of the liquid to the vapor.

Abstract: An apparatus for washing glasses and other articles, includes a washing compartment and a plurality of fluid outlets. A tray for retaining the glasses and other articles is positionable in the washing compartment. The tray has at least one fluid directing nozzle which is alignable with the fluid outlets in the washing compartment to permit fluid to flow from the nozzles through the tray and to direct the fluid into contact with the glasses and other articles. In a preferred embodiment, at least a portion of the fluid contacts the glasses substantially tangentially. A method for washing glasses and other articles is also disclosed.

Abstract: An apparatus for supplying a mixture of a treatment liquid and ozone for treatment of a surface of a workpiece, and a corresponding method are set forth. The preferred embodiment of the apparatus comprises a liquid supply line that is used to provide fluid communication between a reservoir containing the treatment liquid and a treatment chamber housing the workpiece. A heater is disposed to heat the workpiece, either directly or indirectly. Preferably, the workpiece is heated by heating the treatment liquid that is supplied to the workpiece. One or more nozzles accept the treatment liquid from the liquid supply line and spray it onto the surface of the workpiece while an ozone generator provides ozone into an environment containing the workpiece.

Abstract: A high pressure pump (14) supplies cleaning fluid from a reservoir (12) to spray nozzles (20) inside a washing chamber (10). The spray nozzles (20) spray the cleaning fluid over a load to be cleaned. Used cleaning fluid is collected in a sump (30). A sump pump (32) drains the sump. The combination of the high pressure pump and sump pump provides more efficient cleaning of the load and eliminates the requirement for a deep sump beneath the washer. A vertical traveler (22), having a pair of counterbalanced spray arms (24), raises and lowers the spray nozzles counter cyclically; a detergent injection system (50) accurately meters a correct amount of detergent is added to the cleaning fluid; and a filtration device (34) filters suspended material from the used cleaning fluid and uses a portion of the cleaning fluid to clean itself.

Abstract: To provide an ultrasonic processing device that is capable of effectively carrying out a cleaning operation, a resist-stripping operation, etc. by projecting ultrasonic uniformly over an entirety of the ultrasonic processing target region by means of ultrasonic oscillation elements each having a width smaller than an ultrasonic processing target region of a processing object, as well as to provide an electronic parts fabrication method using the foregoing device, a plurality of ultrasonic oscillation elements are arranged so as to planarly extend in a glass substrate transport direction and in a glass substrate width direction, and projected figures obtained by projecting said ultrasonic oscillation elements to a plane perpendicular to the glass substrate transport direction form a single belt-like region of a width exceeding a width of the ultrasonic processing target region.

Abstract: A cleaning apparatus has a processing tank (21) for containing a processing liquid in which semiconductor wafers (W) are immersed, and a tubular vessel(22a) having a processing chamber (23) containing the processing tank (21). A side wall (26) of the vessel (22a), and a first partition wall (28) having an upright wall (27) standing on a bottom plate (23a) defining the bottom of the processing chamber (23) form a side ventilating duct (24). The bottom wall (30) of the vessel (22a), and a second partition wall (29) substantially horizontally extending from the lower end of the first partition wall (28) form a bottom ventilating duct (25). The side ventilating duct (24) and the bottom ventilating duct (25) can compactly arrange devices and pipes for supplying and discharging the cleaning liquid for cleaning semiconductor wafers (W), easily maintain the devices and pipes, easily arrange a ventilating system to the cleaning apparatus, and improve ventilation efficiency.

Abstract: A phosphatizing system for phosphatizing an object including a closed-loop phosphatizing assembly is provided configured to pass a phosphatizing reagent solution over an object during a phosphatizing procedure. The phosphatizing assembly includes a collection compartment in fluid communication with a run-off portion of a subfloor assembly supporting the object for receipt of substantially all the reagent run-off fluids from the subfloor assembly. A storage assembly is configured to pass a rinsing solution over the object to wash the reagent solution therefrom during a finishing rinse procedure performed after the phosphatizing procedure. This storage assembly includes a storage compartment in fluid communication with the run-off portion for receipt of substantially all the rinsing/reagent run-off fluids from the subfloor assembly.

Abstract: A chamber having selectable and controllable access through which a process part is placed within and removed from a processing system. The chamber is designed to selectively isolate the external and internal environments of the process system during delivery and removal of the process part.

Abstract: A system and method for containment and recovery of vapors in a general parts washer apparatus, wherein a solvent is delivered to a wash area for washing articles therein; the system including a unit supported in air flow communication with the wash area and having a fan for drawing solvent vapors in a flow of air from within the wash area and through the unit. Activated carbon filters within the unit separate moisture from the air flow to trap solvent within a separation chamber. During a distillation cycle, a vacuum activated valve assembly closes the separation chamber and a heater raises the temperature within the separation chamber, under negative pressure, causing liquid solvent in the chamber to vaporize. The solvent vapors are removed from the separation chamber and converted to pure liquid solvent in a condenser. The pure liquid solvent is thereafter directed to a clean solvent holding tank in the parts washer apparatus.

Abstract: The invention relates to a method for disposing of the washing liquid in a machine for washing items and the washing machine that implements the method. The machine comprises a chamber for washing the items, means for supporting at least one item in the washing chamber, means for storing the washing liquid, means for bringing the washing liquid into contact with the item to be washed, and means for eliminating the washing liquid from the machine. According to the method, to eliminate the washing liquid from the machine, the washing liquid is evaporated, thus reducing the volume of liquid to be eliminated.

Abstract: A method and an apparatus for preventing silicon hole defect formation on a silicon wafer after a wet cleaning process are disclosed. In the method, a supply tank and a cleaning tank are provided which are connected together in fluid communication by a conduit. The conduit is cooled by a wrapped around cooling tube and a cooling water flowing through the tube at a temperature of less than 20° C. The apparatus of the wet cleaning station may further include a pump for transporting an aqueous solution of ammonia from the supply tank to the cleaning tank, a safety overflow conduit for protecting the supply tank that holds the aqueous solution of ammonia, and a flow control valve in the conduit between the supply tank and the cleaning tank. The present invention novel method and apparatus effectively prevents the formation of ammonia vapor in the mini-environment that surrounds the cleaning tank and the rinse tank.

Abstract: A fluid delivery system for delivering a process fluid to a vacuum processing system includes a secondary containment line surrounding a process fluid line. A purge gas flows through the secondary containment line and around the process fluid line in order to flow away any leaked process fluid. Alternatively, a heated fluid flows through the secondary containment line forming a heat trace around the process fluid line to heat the process fluid line and the process fluid by means of convection, which provides for precise uniformity of temperature throughout the length of the secondary containment line. The heated fluid loses heat to the ambient environment creating a temperature gradient through which the process fluid flows. The secondary containment line may have a heating element along its length for adding heat to the heated fluid to change the temperature gradient.

Abstract: In the case of a cleaning device (1) a washer jet (9) is arranged on a piston rod (6) which can be moved by means of an electromotive drive unit (3). A heating element (10), which is connected to a hollow cylinder (2) which is in a fixed location, is situated, in its illustrated position of rest, in the direct vicinity of the washer jet (9) and in this manner makes it possible for the washer jet (9) to be heated thereby preventing it from freezing up when ambient temperatures are critical. No electrical contacts are required on the moveable part of the cleaning device (1) because of the connection of the heating element (10) in a fixed location.

Abstract: A semiconductor substrate surface analysis pre-processing apparatus has a substrate section which holds a decomposition/collecting liquid that is caused to come into contact with the entire surface of a substrate to be surface-analyzed, a substrate transport section which holds the substrate to be surface-analyzed, and which moves the substrate between a substrate carrier and the substrate processing section, a supply and ejection means for the decomposition/collecting liquid, and a processing operation means that performs either ultrasonic or heat processing with respect to the substrate processing section.

Abstract: An alcohol vapor dryer system includes a vapor generating chamber, a heater, a process chamber, a gas supplier, a drain vessel, and a suction device. The vapor generating chamber of cylindrical shape contains liquid alcohol supplied from an outer source and includes a fan installed above the surface of the liquid alcohol. The heater installed below the vapor generating chamber heats the liquid alcohol contained in the vapor generating chamber at a temperature lower than the boiling point of the liquid alcohol. The process chamber communicates with the vapor generating chamber through a plurality of fluid ducts and includes a body and a cover plate for covering the body. The gas supplier generates heated nitrogen gas and supplies the gas in order to transfer the heated nitrogen gas and the alcohol vapors to the fluid ducts which are connected to the process chamber. The drain vessel communicates with the bottom of the body of the process chamber and also with the bottom of the vapor generating chamber.

Abstract: There is provided a substrate cleaning/drying equipment for removing residual moisture from a substrate by exposing the substrate to an IPA steam after the substrate has been cleaned by a ultra pure water. The substrate cleaning/drying equipment comprises a cleaning/drying chamber for cleaning/drying the substrate, a cleaning tub which is provided below the cleaning/drying chamber and to which at least a ultra pure water is supplied, an IPA steam supplying pipe for supplying the IPA steam to an upper area of the cleaning/drying chamber such that the upper area of the cleaning/drying chamber is filled with the IPA steam, a steam supplying pipe for supplying a steam between the ultra pure water in the cleaning tub and the IPA steam, and a carrying unit for carrying the substrate, which has been cleaned by the ultra pure water, from the ultra pure water into the IPA steam via the steam.

Abstract: A system for the controlled addition of detergent formulations and the like to a carbon dioxide cleaning apparatus comprises: (a) a high pressure wash vessel; (b) an auxiliary vessel; (c) a drain line connecting the auxiliary vessel to the wash vessel; (d) optionally but preferably, a separate vent line connecting the auxiliary vessel to the wash vessel; (e) a detergent reservoir; and (f) a detergent supply line connecting the detergent reservoir to the auxiliary vessel. An advantage of this apparatus is that, because the detergent formulation can be pumped into the auxiliary vessel in a predetermined aliquot or amount, which predetermined aliquot or amount can then be transferred into the wash vessel where it combines with the liquid carbon dioxide cleaning solution, the detergent formulation can be added to the cleaning solution in a more controlled or accurate manner.

Abstract: A system and method for removing a coating from an elongated metal part or a bundle of such parts is described. The disclosed system includes a soaking vessel that contains a solution suitable for degreasing the metal part and softening the coating thereon. An ultrasonic cleaning vessel containing an aqueous cleaning solution cleans the coating off of the metal part by ultrasonic agitation. The system further includes at least one rinsing vessel for rinsing the cleaning solution of the cleaned part, and a drying vessel for rapidly and thoroughly drying the part after it has been rinsed. In the disclosed process, the elongated metal part, or a bundle of such parts, is/are soaked in a solution that is maintained at an elevated temperature for a time sufficient to soften the coating. The elongated metal part is then subjected to ultrasonic agitation in an aqueous cleaning solution bath at an elevated temperature for a time sufficient to loosen and dislodge the coating from the elongated metal part.

Abstract: A cleaning mechanism for mold devices includes one or more rails for slidably supporting a slide. An actuator is coupled to the slide for moving the slide along the rails. The slide may be releasably coupled to the actuator by a latch. A heating device is disposed on the slide for supporting and for heating the mold devices. One or more nozzles are disposed in the housing for supplying water or cleaning agent or pressurized air into the housing and for cleaning the mold devices. A rotating device may further be used for rotating the nozzles.

Abstract: The purpose of the present invention is to provide a cleaning apparatus and a cleaning method which can prevent the object to be processed being subjected to a bad influence caused by a chemical treatment, have a high degree of freedom in designing the apparatus, make the cleaning process rapid and be designed in smaller size. In this cleaning apparatus, a drying chamber 42 and a cleaning bath 41 are separated from each other up and down, respectively. Thus, a space in the drying chamber 42 can be insulated from a space of the cleaning bath 41 by a nitrogen-gas curtain 59c and a slide door 72. In the cleaning method, a cleaning process in the cleaning bath 41 is carried out while screening it by the nitrogen-gas curtain 59c. On the other hand, a drying process in the drying chamber 42 is accomplished while sealing and closing it by the slide door 72.

Abstract: A system for cleaning oil containing vehicular components with heated cleaning liquid comprising a washing unit having at least one spray nozzle for directing the cleaning liquid to the vehicular component. The system of the present invention also includes a reservoir for the cleaning liquid as well as a pump for supplying cleaning fluid to the liquid spray nozzle or nozzles. A heater in the form of a oil fired burner is utilized to pass heated exhaust gases through a heat exchange conduit which extends into the reservoir to impart heat to the cleaning liquid in the reservoir. The cooled exhaust gases are then exhausted through a stack. Oil is gathered from the vehicular component placed in a container which empties into a conduit to feed the oil fired burner to produce the hot exhaust gases.

Abstract: Inflammable cleaning fluid heating apparatus are disclosed. The disclosed apparatus safely heat a cleaning fluid such as an inflammable solvent to a predetermined temperature. One of the disclosed inflammable cleaning fluid heating apparatus includes a main body for storing a heat transfer oil; a heater mounted inside the main body for heating the heat transfer oil; a cleaning fluid path mounted inside the main body having an inlet and an outlet; a temperature sensor for sensing a temperature of the heat transfer oil; and a controller for selectively switching the heater between anon state and an off state.

Abstract: Cleaning apparatus provide for the cleaning of a workpiece by first immersing the workpiece in a cleaning tank having a cleaning liquid therein for a predetermined period of time, removing the workpiece from the cleaning tank, moving the workpiece through air for a pre-selected period of time, and supplying the workpiece to a drying device which then dries the workpiece. As the workpiece is moved through the air, the workpiece may be vibrated, moved at an incline then a decline, and/or have air blasted at it, so that any liquid, e.g. rinsing solution, remaining thereon is caused to fall off, such occurring prior to the drying of the workpiece by the drying device.

Abstract: A degreasing and cleaning apparatus for cleaning circuit boards and the like has a first, wash sump containing a boiling, environmentally friendly wash material and a second, rinse, sump containing an environmentally friendly rinse material, separated by a weir. An anti-splash and surge control fence is mounted on top of the weir to control splashing and spill-over between the sumps. The wash sump contains a plurality of spray wands and a programmed hoist pans the carrier of the boards past the spray wands in incremental steps. After the wash cycle, the carrier is introduced into the second, rinse, sump and then given a final vapor rinse. The temperature ranges in which the apparatus is operated yield optimum cleaning.

Abstract: A glass substrate processing apparatus, part of which comprises a composite material, the composite material being formed of a matrix and a ceramic layer formed on a surface of the matrix by a thermal spraying method, the matrix being formed of a ceramic member and an aluminum-containing material filled in a texture of the ceramic member.

Abstract: An apparatus for processing a semiconductor wafer is set forth. The apparatus comprises a processing bowl that defines a processing chamber. The bowl has an opening through which wafers may be placed in the apparatus. A wafer support structure adapted to support at least one wafer is mounted for rotation within the processing chamber. A motor drive assembly is connected to rotate the wafer support structure. At least one fluid nozzle accepts processing fluid and sprays the processing fluid on the one or more wafers carried by the wafer support structure. A door is used to seal the opening of the processing bowl. The door has an opening that is open to ambient atmosphere to facilitate passage of ambient gas into the processing chamber. An ambient gas intake assembly is disposed in the door.

Abstract: An apparatus for cleaning parts includes a tank having an liquid inlet opening and a liquid outlet opening therein to allow a liquid, such as water to enter and drain from the tank. The tank also includes an air inlet window and an air outlet duct for allowing a flow of air to pass therethrough. An air duct having an air pump connected thereto extends across the outside of the tank between the air outlet duct and the air inlet window to provide a flow of air through the tank. A heater is in the air duct to heat the flow of air. A first overflow wall extends across and spaced from the air inlet window to provide an overflow passage for carrying away any liquid which may overflow the wall and prevent the liquid from entering the air inlet window. A second overflow wall extends across and is spaced from the air outlet duct to form an overflow passage for carrying away any liquid which may overflow the second overflow wall and prevent such liquid from entering the air outlet duct.

Abstract: A portable hot sink system comprising a frame having two parallel upper elongated tubes with a first end and a second end. The system also comprises a first inverted U-shaped support with two intermediate cross braces and an upper cross handle. A second inverted U-shaped support is provided with three substantially similarly sized and shaped tubs. Each tub has closed rectangular lower ends and four upwardly extending generally rectangular vertical walls and with upper open ends. The central tub shares a common wall with the adjacent tubs. Drains are located within each of the tubs. Lastly, a heating element is located within a vertical wall of each tub with electrical lines coupling the heating elements to a common control element with a common light at the control element to illuminate until the preselected temperature of about 180 degrees Fahrenheit is reached.

Abstract: Apparatuses for cleaning wafers used in integrated circuit devices comprise: (1) a dry cleaning section comprising inert gas storage bath, a hydrogen fluoride gas storage bath, and a vapor storage bath containing a component selected from the group consisting of water vapor, alcohol vapor, and mixtures thereof and a gas mixer, wherein the inert gas storage bath, the hydrogen fluoride gas storage bath, and the vapor storage bath are in communication with the gas mixer; (2) a wet cleaning section comprising a first bath for storing a fluoride; a second bath for storing a liquid alcohol; and a cleaning solution storage bath in communication with the first bath and second bath, wherein the fluoride and the liquid alcohol form a cleaning solution which is stored in the cleaning solution storage bath; and (3) a common cleaning bath positioned between and in communication with the dry cleaning section and the wet cleaning section.