Abstract: A method and apparatus for removing minute particles from a surface of a sample are provided that prevent redeposition of the particles onto the surface. By combining thermophoresis with laser assisted particle removal (LAPR), the methods and apparatus remove minute particles (for example, micrometer and nanometer sizes) and assure that they will not redeposit.

Abstract: A cleaning device having a cleaning solution that can be heated is disclosed. The cleaning device has a fluid reservoir connected to a handle wherein the fluid reservoir contains a volume of cleaning fluid. The device also contains a heating unit disposed within the cavity in the fluid reservoir and has a first reactant chamber with a first reactant and a second reactant chamber with a second reactant. When the reactants are mixed, heat is generated to heat the cleaning fluid.

Abstract: Disclosed herein is a device for cleaning a photomask, which prevents haze from being generated on a surface of the photomask during a photolithography process. The photomask is heat treated to remove residual ions on a surface thereof and to induce curing and oxidation of Cr and MoSiON layers, thereby preventing diffusion of the ions. Etching of Cr and MoSiON layers due to a cleaning process is suppressed in order to significantly reduce a change in phase and transmissivity of optical properties of Cr and MoSiON.

Abstract: A cleaning apparatus is provided for cleaning an inner surface of a container. A spray head is arranged for operable fluid communication with a fluid pump and has a nozzle configured to disperse liquid in a mist. A mount carries the spray head and is removably supportable on a container having an inner surface to be cleaned. When removably supported on a container, the mount supports the spray head in a position within the container where the spray head can coat the inner surface of the container with mist.

Abstract: An ion sampling method for wafer provides a wafer in a sampling chamber, wherein the wafer surface that is going to be sampled faces upward; spraying an extraction liquid continuously on the wafer surface to form a liquid film thereon; keeping the thickness of the film constant for dissolving the ion contaminants in the extraction liquid; and collecting the extract solution at the bottom of the sampling chamber.

Abstract: There are provided an apparatus having a heating portion in a chemical bath for substrate wet treatment and a method of heating a chemical for substrate wet treatment using the apparatus. The apparatus includes a chemical bath containing a chemical for substrate wet treatment. A heating portion is installed in the chemical bath, and the heating portion includes a heating element and a housing accommodating the heating element. An inert gas is filled in the housing.

Abstract: A cleaning apparatus in which a cleaning process is simplified, a time required for the cleaning process is reduced and which has an excellent cleaning effect, and a high pressure cleaner for use therein are provided.

Abstract: An apparatus for cleaning a semiconductor wafer and method for cleaning a wafer using the same wherein, the apparatus includes a chamber on which a wafer is mounted, a revolving chuck mounted in the chamber for supporting and fixing the wafer, a nozzle for spraying cleaning solution onto the wafer, a cover for covering an upper part of the chamber, and a light source. The cleaning solution, preferably one of ozone water, hydrogen water, or electrolytic-ionized water, may be heated for a short time and used to clean the wafer.

Abstract: Cleaning according to an evaporating dish cleaning mode or heating chamber cleaning mode is implemented based on a signal inputted by the control part. In the heating chamber cleaning mode, condensation is generated on the inner surface of the heating chamber 11 by steam, and the soil adhered to the inner surface of the heating chamber 11 is allowed to float to be in a state of removing it easily. In the evaporating dish cleaning mode, a cleaning liquid made of citric acid solution is pumped into an evaporating dish 35, it is heated to a predetermined temperature, and it is left therein. Therefore, calcium and magnesium deposited on the evaporating dish 35 are allowed in a state of removing them easily.

Abstract: A cleaning device for the shaving head of a dry shaving apparatus includes a receptacle having a reservoir adapted to receive the a shaving head and a pump to transfer a cleaning fluid from the reservoir and into the receptacle. A controllable drain disposed between a lower region of the receptacle and the reservoir redirects cleaning fluid away from the reservoir until needed thereby prolonging the time for which the cleaning fluid is in contact with the shaving head to be cleaned.

Abstract: A dishwasher having a dishwasher is provided in which an intake port cover for closing a steam intake port is mechanically operated. The dishwasher has a cavity enclosed in part by a door, and a fan motor which drives a fan installed at an upper portion of the door. During a drying operation, the fan generates a suction force to draw steam from the cavity through an intake port of the fan housing and out through an exhaust port. An intake port cover is movably installed with respect to the intake port so as to open and close the steam intake port based on an operation mode of the fan. The intake port cover has a central shaft coupled to a rotational shaft of the fan such that a driving force generated by the fan as it rotates is transferred to the intake port cover so as to selectively open and close the steam intake port. The steam intake port is open during a drying operation, and is closed during a washing and rinsing operations.

Abstract: A dishwasher that fits within the conventional U.S. residential dishwasher counter space and uses the conventional U.S. residential power supply to achieve within a convenient cycle time the same standard of sanitation as set forth for commercial and residential hot water sanitizing dishwashers.

Abstract: An apparatus and a method is provided for using high-frequency acoustic energy with a supercritical fluid to perform a semiconductor wafer (“wafer”) cleaning process. High-frequency acoustic energy is applied to the supercritical fluid to impart energy to particulate contamination present on the wafer surface. Energy imparted to particulate contamination via the high-frequency acoustic energy and supercritical fluid is used to dislodge and remove the particulate contamination from the wafer. Additionally, the wafer cleaning process benefits from the supercritical fluid properties of near zero surface tension, high diffusivity, high density, and chemical mixing capability.

Abstract: Semiconductor wafers are cleaned by placing the semiconductor wafers in a processing vessel, forming a pure water film on the surfaces of the wafers, forming an ozonic water film by dissolving ozone gas in the pure water film, and removing resist films formed on the wafers by the agency of the ozonic water film. The pure water film is formed by condensing steam on the surfaces of the wafers. The resist films formed on the surfaces of the wafers can be removed by also using hydroxyl radicals produced by interaction between steam and ozone gas supplied into the processing vessel. Thus, the resist films can be removed highly effectively.

Abstract: This invention provides a thermal energy system comprising a heat exchanger for transferring thermal energy between a source and a load, the heat exchanger having a primary side associated with the source, and a secondary side for conducting a fluid associated with the load, wherein the secondary side of the heat exchanger is passively back-flushed upon consumption of a portion of the fluid. Passive back-flushing prevents fouling of the heat exchanger due to sediments, scale,and mineral deposits which may be present in the circulating fluid.

Abstract: A washing container for a dishwasher having several parts joined together, including a frame with walls, a base, and/or a cover attached thereto. The container can easily be adapted to varying predefined requirements according to the design of the dishwasher.

Abstract: A bracket is provided for mounting an object to a tub of a dishwasher. The bracket is mounted on the annulus edge of the pump opening in the bottom of the tub adjacent the pump seal ring. No other fasteners are used to secure the bracket to the tub. The bracket is mounted on the tub before the pump is installed. In one embodiment a thermostat is pivotally mounted on the bracket so as to maintain substantially flush engagement with the tub. In a second embodiment, a wire harness extends through a loop of the bracket for support adjacent the tub.

Abstract: An apparatus for washing parts includes a cleaning chamber including a spray portion and a reservoir portion. The spray portion includes a support for the parts and a spray bar having at least one orifice for distributing a cleaning solution. The reservoir portion stores and collects the cleaning fluid. A thermal energy source adjusts and maintains the operating temperature of the cleaning solution in the reservoir portion. The thermal energy source retains a transfer fluid and includes a heater for adjusting a temperature of the transfer fluid. A conduit extends through the thermal energy source and defines a passageway for the cleaning fluid. A pump draws the cleaning fluid through the passageway and discharges the cleaning solution through the spray bar, such that the operating temperature of the cleaning solution is increased.

Abstract: A dishwasher that fits within the conventional U.S. residential dishwasher counter space and uses the conventional U.S. residential power supply not only achieves within a convenient cycle time the same standard of sanitation as set forth for commercial hot water sanitizing dishwashers, but substantially surpasses the same.

Abstract: Microelectronic substrate processing systems include a microelectronic substrate processing chamber that is configured to contain therein at least one microelectronic substrate. A carbon dioxide supply system is configured to supply densified carbon dioxide to the microelectronic substrate processing chamber. A detergent supply system is configured to supply detergent to the microelectronic substrate processing chamber.

Abstract: Apparatus for pressure processing components is disclosed which includes an improved closure system that minimizes dust-generating parts and allows easy access to the chamber. Ports are provided for introducing and releasing pressurized gases and fluids to and from the processing space. The heating system of the apparatus heats both the cover and the stage inside the pressurized chamber such that cycle time to equilibrate heated, pressurized fluids such as supercritical carbon dioxide inside the chamber are decreased. The apparatus includes a mechanism that raises the stage inside the chamber, pressing it against the fixed cover and sealing the inside of the pressure vessel. In one embodiment a screw-type jack is used to move the component-loaded stage fitted with a deformable o-ring seal a short travel distance to seat against the lid and seal the pressure chamber. In a related embodiment a computer and an electronic stepper motor are used to drive the pressing means in an automated fashion.

Abstract: An automated kitchenware washing tank has a pump system with a pump and fluid conduits to couple the pump between an intake opening through one of the walls and discharge openings in the wall of the tank. At least some of the discharge openings are preferably formed in at least one angled portion of the tank wall that faces downwardly into the tank, and, more preferably, on two opposed angled portions that face downwardly into the tank. A control system may be coupled to the pump for controlling the speed with which the pump supplies cleaning fluid to the discharge openings. The control system comprises a speed selector that is adapted to allow a user to activate the speed selector to select between at least two different speeds for pumping the cleaning fluid to the discharge openings. In operation, the automated washing tank pumps cleaning fluid from within the tank through the intake outlet through the fluid conduits and out of the discharge openings into the tank to create turbulence within the tank.

Abstract: Thermal cleaning and separation of metal parts is performed by a stator from an electric motor. Windings embedded in an organic, insulating material are placed and heated to 250°–500° C. under controlled conditions in a heating chamber, evaporating organic material and loosened windings. Flue gas is evaporated organic substances conducted through a closed pipe system to a condensator, where organic gases condense. The pipe system is designed so that condensate is conducted-on in the closed pipe system to a partly liquid filled vessel. Contents of this vessel are air and water that flow concurrently with the condensed flue gas as condensate, increasing content of organic material in the vessel and separating condensate from air. Air may be conducted to the oven for renewed absorption of organic material. All organic material evaporated from the heating chamber is collected in the vessel for later disposal in an environmentally correct and secure way.

Abstract: A dishwasher includes a washing receptacle for items to be cleaned, a pump for liquid, a flow heater for liquid, a device for spraying items to be cleaned, a control device for wash cycles of the spraying device, and a device for providing steam having a separate steam dispenser and unit for producing a jet of steam supplied by the steam dispenser. The steam dispenser and the steam jet unit are disposed in the dishwasher in such a way that the steam jet unit always supplies steam to the same predetermined location in the washing receptacle specifically identified and configured for receiving particular items to be cleaned, e.g. particularly dirty items. An uncontrolled escape of steam from any section of the entire washing receptacle is prevented, thus improving the cleaning result with maximum usage of the steam and without also being dependent on activation of a separate steam washing cycle.

Abstract: A substrate treatment apparatus includes a substrate heating device for maintaining a substrate at a temperature higher than room temperature, a wetting device for producing a wet ozone-containing gas by wetting an ozone-containing gas with a treatment solution, and a supply device for supplying the wet ozone-containing gas from the wetting device to a work object on a surface of the substrate. The supply device includes a gas disperser including apertures aligned in rows in a width direction of the work object. The apertures in adjacent rows are not aligned with each other in a direction perpendicular to the rows. At least one of the gas disperser and the substrate is movable in a direction perpendicular to the rows. A gas conduit connects the wetting device to the supply device. A wet ozone-containing gas heating device heats the wet ozone-containing gas to a temperature at least equal to the temperature of the substrate.

Abstract: A substrate cleaning apparatus is provided that includes a cleaning cup for receiving a to-be-cleaned substrate, a table in the cleaning cup, a first, second, and third nozzles, a pure water heating mechanism configured to supply hot pure water, a branch line, a control mechanism, and an open/close valve, provided between the branch line and the pipe, wherein the open/close valve is configured to interrupt emission of hot water from the third nozzle by opening the open/close valve to lower the pressure in the pipe.

Abstract: A substrate treating method for treating substrates with a treating solution includes a step of heating a treating solution containing sulfuric acid, and treating, with the treating solution, the substrates coated with a film material including a high dielectric-constant material. The substrates with the high dielectric-constant material are treated appropriately by heating, before use, the treating solution containing sulfuric acid.

Abstract: An apparatus and method for eliminating dross in a solder pot of a soldering machine by converting the dross into usable solder. The conversion apparatus is comprised of an impeller, a shroud, an electric motor for driving the impeller, a vacuum source operatively connected to the shroud, an arrangement of guides immersed in the solder pot for recirculating liquid solder and a chemical de-oxidizing agent. The impeller and shroud are adjacent to a free surface of the dross which forms at the top portion of the liquid solder. The method includes the steps of adding a measured amount of de-oxidizing agent to the solder pot, agitating and recirculating the liquid solder/de-oxidizer mixture with the impeller to break-up the dross into smaller particles and separate the solder from the dross, and removing a residue of the dross by suction as the recirculating mixture passes beneath the shroud.

Abstract: The present invention provides an apparatus for cleaning a workpiece with a cleaning medium that is maintained at a single fluid phase. The apparatus comprises means for providing the cleaning medium; a pressurizable cleaning vessel for receiving the cleaning medium and the workpiece; and means for maintaining a single fluid phase of the cleaning medium in the cleaning vessel. The present invention further provides a process for cleaning the workpiece with cleaning medium under conditions such that the workpiece is exposed to a single fluid phase of the cleaning medium. The present invention further includes a process for a storage media that includes instructions for controlling a processor for the process of the present invention. The storage media comprises means for controlling the processor to control contacting conditions of the workpiece and the cleaning medium such that the workpiece is exposed to a single fluid phase of the cleaning medium.

Abstract: A parts washer including a receptacle positioned on a reservoir for cleaning liquid having a drain opening and a module which engages a portion of the reservoir in the cleaning liquid for adjusting the temperature of the cleaning liquid and circulating the cleaning liquid into the receptacle. The module includes a heating element, a sensor and pump. An enclosure houses a temperature controller which displays the temperature of the cleaning liquid and a low liquid level condition. A bridge thermally links the heating element to the sensor so that the sensor normally generates a signal representative of the temperature of the cleaning fluid unless the level of the cleaning fluid is disposed below the sensor.

Abstract: Initially, process parameters for dense phase fluid cleaning are determined. Thereafter, a cleaning chamber containing a substrate is pressurized with a dense phase fluid, based on these process parameters. The substrate is then cleaned with the dense phase fluid, again based on these process parameters. Exhaust fluid is subsequently expelled from the cleaning chamber, and thereafter analyzed. The process parameters are then adjusted to adjusted process parameters based on the analysis of the exhaust fluid. Thereafter, the cleaning chamber is again pressurized and cleaning repeated. This pressurization and cleaning is based on the adjusted process parameters. Also, this pressurization and cleaning is repeated until the substrate is sufficiently clean.

Abstract: This invention relates to a metal part and other surface modification method suitable for the machining industry in which shot peening is typically used to refine the surface of a metal part (to introduce compressive residual stresses, to enhance fatigue strength, to harden the workpiece) and for fields in which parts need be cleaned. According to the present invention, workpiece W is placed within a first vessel which is filled with a fluid. The first vessel is pressurized by controlling the flow rate of the fluid flowing in the first vessel from nozzle 4 distant from said workpiece on the surface and of the fluid flowing from first vessel. Thus, the collapsing impact force of cavitation bubbles is increased so that the machined part will have its surface strengthened and cleaned by applying a peening effect to the surface of the part with said impact force.

Abstract: A composition and apparatus and method for aqueous spray conditioning of scale on metal surfaces. An aqueous solution having a base composition of an alkali metal hydroxide is used. The aqueous solution may contain additives to improve the performance of the salt. In one embodiment, the solution is used to condition the scale on a strip of stainless steel. The strip of steel is at a temperature between the melting point of the alkali metal hydroxide in anhydrous form and a temperature at which the Leidenfrost effect appears. One or more nozzles is provided to spray the solution, and the heated strip is passed by the nozzle or nozzles where the solution is sprayed on the surface or surfaces of the strip that have the scale or oxide. The invention also includes the apparatus and control thereof for the spraying of the solution.

Abstract: The present invention pertains to a system for cleaning wafers that includes specialized pressurization, process vessel, recirculation, chemical addition, depressurization, and recapture-recycle subsystems, as well as methods for implementing wafer cleaning using such a system. A solvent delivery mechanism converts a liquid-state sub-critical solution to a supercritical cleaning solution and introduces it into a process vessel that contains a wafer or wafers. The supercritical cleaning solution is recirculated through the process vessel by a recirculation system. An additive delivery system introduces chemical additives to the supercritical cleaning solution via the solvent delivery mechanism, the process vessel, or the recirculation system. Addition of chemical additives to the sub-critical solution may also be performed. The recirculation system provides efficient mixing of chemical additives, efficient cleaning, and process uniformity.

Abstract: In a method for processing a workpiece to remove material from a first surface of the workpiece, steam is introduced onto the first surface under conditions so that at least some of the steam condenses and forms a liquid boundary layer on the first surface. The condensing steam helps to maintain the first surface of the workpiece at an elevated temperature. Ozone is provided around the workpiece under conditions where the ozone diffuses through the boundary layer and reacts with the material on the first surface. The temperature of the first surface is controlled to maintain condensation of the steam.

Abstract: A dishwasher includes a washing receptacle for items to be cleaned, a pump for liquid, a flow heater for liquid, a device for spraying items to be cleaned, a control device for wash cycles of the spraying device, and a device for providing steam having a separate steam dispenser and unit for producing a jet of steam supplied by the steam dispenser. The steam dispenser and the steam jet unit are disposed in the dishwasher in such a way that the steam jet unit always supplies steam to the same predetermined location in the washing receptacle specifically identified and configured for receiving particular items to be cleaned, e.g. particularly dirty items. An uncontrolled escape of steam from any section of the entire washing receptacle is prevented, thus improving the cleaning result with maximum usage of the steam and without also being dependent on activation of a separate steam washing cycle.

Abstract: The invention relates to a cleaning apparatus with a filter device. The filter device contains a ceramic filter equipped with a heating device. The heating device serves for thermal sterilisation of the ceramic filter, by which allergenic substances are destroyed.

Abstract: Initially, process parameters for dense phase fluid cleaning are determined. Thereafter, a cleaning chamber containing a substrate is pressurized with a dense phase fluid, based on these process parameters. The substrate is then cleaned with the dense phase fluid, again based on these process parameters. Exhaust fluid is subsequently expelled from the cleaning chamber, and thereafter analyzed. The process parameters are then adjusted to adjusted process parameters based on the analysis of the exhaust fluid. Thereafter, the cleaning chamber is again pressurized and cleaning repeated. This pressurization and cleaning is based on the adjusted process parameters. Also, this pressurization and cleaning is repeated until the substrate is sufficiently clean.

Abstract: A dishwasher includes a water inlet connectable to a water source. A dishwasher element is operable on water received through the inlet. A flow sensor is in fluid communication with the inlet and is operable to generate a control signal indicative of water flow through the inlet. A control apparatus is connected between the dishwasher element and the flow sensor and is operable to inhibit operation of the dishwasher element in response to the control signal.

Abstract: A cleaning machine for cleaning supporting trays includes a cleaning cistern (100), a drying cabinet (200) and a control device (300). A water-supply pipe (112) and a drainpipe (120) are connected to the cleaning cistern. A microwave oven (118) is positioned in the cleaning cistern and a shelf (116) is located above the microwave oven for supporting the supporting trays. A cover (130) is pivotally attached to the cleaning cistern, under which a sensor is installed for sensing a level of water. The drying cabinet includes a shield (210) with a plurality of vents defined therein, and an intake fan (220) is provided in the shield. A plurality of heaters (232) is arranged in the drying cabinet below. One or more shelves (236) are mounted in the drying cabinet. An exhaust device (237) is connected to a back panel of the drying cabinet.

Abstract: A thermal energy system including a heat exchanger for transferring thermal energy between a source and a load, the heat exchanger having a primary side associated with the source, and a secondary side for conducting a fluid associated with the load, wherein the secondary side of the heat exchanger is passively back-flushed upon consumption of a portion of the fluid. Passive back-flushing prevents fouling of the heat exchanger due to sediments, scale, and mineral deposits which may be present in the circulating fluid.

Abstract: A cryostat (1), having a container (2) for receiving a microtome, is described. Provided in the cryostat (1) is a cleaning and/or disinfection device that comprises at least one spray nozzle and a pump (5) for spraying a cleaning and/or disinfection liquid in the container (2). The cryostat (1) is equipped with a control circuit (6) for activating the pump (5), at least one of the spray nozzles being embodied as a swirl nozzle (4) having a spray angle of 360°.

Abstract: An apparatus for supplying a mixture of a treatment liquid and ozone for treatment of a surface of a workpiece, and a corresponding method are set forth. The preferred embodiment of the apparatus comprises a liquid supply line that is used to provide fluid communication between a reservoir containing the treatment liquid and a treatment chamber housing the workpiece. A heater is disposed to heat the workpiece, either directly or indirectly. Preferably, the workpiece is heated by heating the treatment liquid that is supplied to the workpiece. One or more nozzles accept the treatment liquid from the liquid supply line and spray it onto the surface of the workpiece while an ozone generator provides ozone into an environment containing the workpiece.

Abstract: The inventive device for cleaning substrates, especially semiconductor wafers, comprises a treatment basin for receiving at least one substrate, a cover for sealing said treatment basin, a first feeding device for controllably feeding in a reactive gas, a second feeding device for controllably feeding in at least one moist fluid for promoting a reaction between the reactive gas and a deposit to be removed from the substrate and a control device for controlling the concentration of moisture in the treatment basin.

Abstract: A substrate treating apparatus for performing a predetermined treatment of substrates. The apparatus includes a holder for holding a plurality of substrates in erected posture, a treating tank for storing hot sulfuric acid at at least 140° C. for treating the substrates immersed therein, and a bubble supply device including a plurality of bubble generating members formed by sintering quartz particles and arranged in the treating tank for generating bubbles of ozone gas such that the bubbles of ozone gas partially overlap one another in a direction parallel to surfaces of the substrates.

Abstract: A process and system for conditioning a bulk container for ultra-high purity liquefied gas. Vapor is generated in the container from a conditioning quantity of the ultra-high purity liquefied gas by imposing a temperature difference on the container so that the vapor condenses when a temperature difference is achieved. The resulting liquid reflux, e.g., the condensed liquid drips or flows back to the conditioning quantity of the liquified gas, washes or removes contaminants, e.g., particles, metal and moisture, from the interior surface of the container. A portion of the vapor is vented from the container for reclamation. The used conditioning liquid may also be reclaimed.

Abstract: System and method for reducing damage to a semiconductor substrate when using cleaning fluids at elevated pressures to clean the semiconductor substrates. A preferred embodiment comprises applying the cleaning fluid at a first pressure for a first time period, wherein the first pressure is relatively low, and then increasing the pressure of the cleaning fluid to a pressure level that can effectively clean the semiconductor substrate and maintaining the pressure level for a second time period. The application of the cleaning fluid at the relatively low initial pressure acts as a temporary filler and creates a buffer of the cleaning fluid on the semiconductor substrate and helps to dampen the impact of the subsequent high pressure application of the cleaning fluid on the semiconductor substrate.

Abstract: A semiconductor device production method that is used to uniformly and efficiently reduce metal oxides produced on metal (copper, for example) which forms electrodes or wirings on a semiconductor device. An object to be treated on which copper oxides are produced is put into a process chamber and is heated by a heater to a predetermined temperature. Then carboxylic acid stored in a storage tank is vaporized by a carburetor. The vaporized carboxylic acid, together with carrier gas, is introduced into the process chamber via a treating gas feed pipe to reduce the copper oxides produced on the object to be treated to metal copper. As a result, metal oxides can be reduced uniformly without making the surfaces of electrodes or wirings irregular. Moreover, in this case, carbon dioxide and water are both produced in a gaseous state. This prevents impurities from remaining on the surface of copper.

Abstract: A dishwasher having an air generator is provided. In an operation of the dishwasher, air of a washing chamber is heated by a heater and, at a same time, water is fed into the washing chamber. Therefore, kitchen utensils and the water contained in the washing chamber are heated by heat exchanged from the heated air. Since the dishwasher primarily heats the air having a relatively lower specific heat and, thereafter, heats the water having a relatively higher specific heat by the heat of the heated air to produce hot water, the dishwasher reduces time consumption and improves an energy efficiency of the dishwasher during a dishwashing operation, and lengthens a life span of the heater.

Abstract: The present invention provides a process for the removal of hydrogen peroxide from spent pickle liquor used in a steel strip pickling process. The process utilizes an enclosed decomposition tank which includes a pickle liquor inlet pipe, an outlet pipe, at least one vent pipe, an internal baffle, and a heat source.