Abstract: An apparatus for cleaning flip chip assemblies is provided. The apparatus comprises: a chuck assembly; a motor coupled to the chuck assembly by a spindle; at least one carrier for holding flip chips; at least one spray nozzle for directing DIW, a cleaning solution, a gas or a vapor. Embodiments of the invention further provide methods for cleaning flip chip assemblies. The method comprises: loading at least one flip chip to the flip chip carriers; rotating the chuck assembly at a rotation speed; flowing DIW for rinsing the flip chips; flowing a cleaning solution for removing the contaminants; applying ultrasonic/megasonic energy to the flip chips; blowing a gas or a vapor via the spray nozzles for drying the flip chips; bringing the flip chips out of the flip chip carriers.

Abstract: A substrate processing device according to the present invention is a substrate processing device that performs substrate processing with a processing solution and includes inspection means for inspecting degradation of components constituting the substrate processing device. The inspection means includes: capturing means for acquiring image data of the components; color information acquisition means for acquiring color information of an inspection target component from the image data acquired by the capturing means; and degradation determination means for determining a degradation degree of the inspection target component based on the acquired color information.

Abstract: The invention relates to a washing machine for longitudinal profiled sections (5), comprising a drum (1, 2) that can be rotated about a horizontal rotational axis (10, 11) and comprises a plurality of receiving areas (101, 102, 103, 104, 105, 106, 107, 108, 109 or 200, 201, 202, 203, 204, 205, 206, 207, 208, 209, 210) which are arranged along the circumference of the drum, which are laterally delimited by lamellas (3, 4), which are open in the radial direction, and into which the longitudinal profiled sections (5) can be inserted along the longitudinal direction (L).

Abstract: A spray assembly for a dishwasher of the kind wherein utensils are disposed inside a dishwashing chamber and a generally L-shaped spray assembly is rotated to and fro so that a horizontal leg thereof sweeps across a lower surface of the dishwashing chamber and a vertical leg of the spray assembly sweeps across a side wall of the dishwashing chamber. The spray assembly has channels for conveying detergent and hot water and further has multiple nozzles disposed along the horizontal and vertical legs for directing detergent and hot water on to the utensils inside the dishwashing chamber from multiple different directions as the spray assembly rotates. A fluid inlet coupler at an end of the spray assembly is adapted for coupling to a rotatable hub having duct connectors projecting downwardly substantially parallel to an axis of rotation of the hub and fluidly coupled to respective channels of the spray assembly.

Abstract: A household appliance for treating at least one item according to at least one cycle of operation includes a treating chamber for receiving the at least one item for treatment according to the at least one cycle of operation, a treating chemistry dispenser receiving a unit dose container having an electrically conductive element, a physical alteration element located proximate to the treating chemistry dispenser and operable to physically alter at least a portion of the electrically conductive element and a sensor for sensing the physical alteration.

Abstract: A system and method for cleaning and inspecting ring frames is disclosed here. In one embodiment, a ring frame processing system includes: a cleaning station configured to remove a first tape on a first surface of a ring frame using a first blade, clean first adhesive residues from the first tape on the first surface of the ring frame using a first wheel brush, and remove second adhesive residues from a second tape on a second surface of the ring frame using a second blade; and an inspection station, wherein the inspection station comprises an automated optical inspection system configured to determine the cleanness of the first and second surfaces of the ring frame after cleaning.

Abstract: A wafer tray includes a tray main body and a plurality of wafer guides. The tray main body includes a major surface having a first diameter. A wafer placing region is defined on the major surface. A wafer having a second diameter smaller than the first diameter can be placed in the wafer placing region. The plurality of wafer guides is discretely disposed outside the wafer placing region and adjacent to an outline of the wafer placing region on the major surface. Each of the wafer guides includes a back surface fixed in contact with the major surface and a top portion higher than the major surface of the tray main body.

Abstract: A device and a method for machining, especially for polishing of an optical lens, are proposed, there being both a lens changing apparatus and also a separate tool changing apparatus. The lens changing apparatus is located between a working space and a conveyor apparatus for lenses and is pivotally mounted around a horizontal axis. The tool changing apparatus is located laterally next to the working space.

Abstract: A method and system reprocess soiled animal bedding material commingled with animal manure. In one aspect the soiled animal bedding material is separated in a shaker to send at least a preponderance the manure to a holding tank. In another aspect the bedding is cleaned, rinsed and color is restored. The bedding material is subsequently dried and a bedding product, fertilizer product, and/or compacted product is formed. Alternatively, the bedding material is dried (without a compacting step) to form a product. In another aspect, the steps of separation, cleaning, rinsing and/or color restoration may be omitted.

Abstract: Heights of carrier ring supports are increased at a side of a wafer that is located closer to a spindle of a plasma chamber. The heights are increased relative to a height of a carrier ring support that is located closer to side walls of the plasma chamber. The increase in the height results in an increase in thickness of a thin film deposited on the wafer to further achieve uniformity in thickness of the thin film across a top surface of the wafer.

Abstract: The present disclosure describes a chemical mechanical polishing device and a chemical mechanical polishing method. The chemical mechanical polishing device includes: a cleaning apparatus and a polishing pad conditioner disc positionally configurable relative to the cleaning apparatus, where the cleaning apparatus includes: a cleaning disc; a pre-polishing pad disposed inside the cleaning disc and configured to perform a pre-polishing operation of the polishing pad conditioner disc when positioned in contact with the polishing pad conditioner disc; a pre-polishing grinding liquid dispensing assembly disposed on a side edge of the cleaning disc and configured to supply a pre-polishing grinding liquid to the pre-polishing pad; and a rotation driver configured to drive the pre-polishing pad to rotate during the pre-polishing operation. The present disclosure beneficially reduces wafer scratches and increases evenness of distribution of a grinding liquid during polishing.

Abstract: In order to adapt a centrifugal cleaning installation (1) in a simple manner to different components (7), the centrifugal cleaning installation (1) is provided with a clamping unit (14) for clamping and retaining a component holder (4a, 4b, 5a-5d) for the component (7). The clamping unit (14) and a drive (6) are removably connected to the component holder (4a, 4b, 5a-5d) and said component holder (4a, 4b, 5a-5d) is adapted to a specific component (7) by positioning devices (25) and/or balance weights (26) provided on the holder.

Abstract: An apparatus for washing an article includes a container defining an internal chamber configured to receive the article, an inflow connector connectable to a source of pressurized fluid, a filter member disposed within the internal chamber between a base of the container and the inflow connector, and a lid sealingly engagable with an open upper end of the container and defining at least one opening. Pressurized fluid supplied to the internal chamber is urged upwardly through the internal chamber, through and around an article disposed therein, and out the at least one opening of the lid. As a result, salt retained within or on the article is expelled through the at least one opening of the lid and particulate on or within the article is collected or passed through the filter member. Systems incorporating the apparatus and methods of using the same are also provided.

Abstract: Edge grippers are disposed around an outer edge of a chuck. Each of the edge grippers includes a finger configured to pivot around a point; a contact pad configured to contact the wafer; and a flexure disposed between the contact pad and the finger. The flexure is configured to flex toward and away from the chuck. The chuck can use a matrix of vacuum and pressure nozzles designed to keep a wafer floating above the chuck. The edge grippers can hold the wafer at the edge while minimizing deformation of the wafer or without affecting z-jitter of the wafer.

Abstract: There are provided first and second cleaning members which are configured to clean a central zone in a rear surface of a wafer when the wafer held by an absorption pad is horizontally held, and configured to clean a peripheral zone in the rear surface of the wafer when the wafer is held by the spin chuck. Due to the provision of the first and second cleaning members, detergency can be improved as compared with a case in which only one cleaning member is used. The first and second cleaning members are configured to be horizontally turned by a common turning shaft. When the central zone in the rear surface of the wafer is cleaned, the turning shaft is located to be overlapped with the wafer. Since the turning shaft is located by using the moving area of the wafer, a size of an apparatus can be reduced.

Abstract: A rotary table; a drive motor M configured to rotate the rotary table; a pin base supported by the rotary table; a pin fixing member configured to move closer to or away from C1 upon the pin base revolving; first chuck pins and second chuck pins provided on the pin fixing member and configured to be into contact with an outer edge of the substrate W; a substrate gripping force generation mechanism including a spring member; a chuck pin switching mechanism including an inertia member configured to be rotated coaxially with the rotary table and a protruded member provided on an outer peripheral part of the inertia member; and a cam member provided on the pin fixing member and configured to engage with protruded member.

Abstract: Embodiments of a polishing apparatus are provided. The polishing apparatus includes a polishing pad having a polishing surface. The polishing apparatus also includes a dispensing device including a dispensing arm located over the polishing pad and a liquid nozzle disposed on the dispensing arm. The liquid nozzle is configured to dispense washing liquid onto the polishing surface along a dispensing direction. The dispensing direction has an acute angle with respect to the polishing surface.

Abstract: A laundry treating machine is provided. The laundry treating machine may include a tub to receive wash water, a drum rotatably provided in the tub, an air supply device to supply air to the tub, a lint filter to filter lint from the air circulated by the air supply device, a filter cleaning device to supply cleaning water to the lint filter to remove the lint from the lint filter, and a cooling water supply device to supply cooling water to an inner surface of the tub such that moisture contained in air is condensed at the inner surface of the tub.

Abstract: A processing assembly for a semiconductor workpiece generally includes a rotor assembly capable of spinning a workpiece, a chemistry delivery assembly for delivering chemistry to the workpiece, and a chemistry collection assembly for collecting spent chemistry from the workpiece. The chemistry collection assembly may include a weir that is configured to spin with the rotor assembly. A method of processing a semiconductor workpiece is also provided.

Abstract: A method and apparatus are disclosed for optimizing a rinsing and drying process in semiconductor manufacturing. The optimization seeks to maximize processing throughput while maintaining low defect counts and high device yields, and utilizes simulation and experimental data to set the optimal process parameters for the rinsing and drying process. Improved methods of rinse liquid and purge gas nozzle movement are also disclosed.

Abstract: This invention relates to a flexible bag for storing raw milk where the flexible bag is for use in system comprising a cassette adapted to contain the flexible bag, where the flexible bag further comprises a spout, preferably with a screw top, and two or more perforations for fixing the flexible bag inside the cassette when the former is mounted in the cassette. Additionally, the invention relates to a cassette for use in a system comprising said cassette and the flexible bag, where the cassette comprises at least two sets of small pins, and at least two sets of cavities, where said cavities are adapted to receive said pins, and wherein said pins are constructed and placed such that they penetrate said perforations of said flexible bag, when said bag is placed inside said cassette.

Abstract: A substrate treatment apparatus according to the embodiment includes: a nozzle which ejects a treatment liquid onto a treatment target surface of a substrate; a trajectory deflector including a trajectory deflecting surface, which is an annular inclined surface that deflects a traveling direction of the treatment liquid ejected from the nozzle and makes the treatment liquid incident on the treatment target surface, the trajectory deflecting surface having an inclination angle varying in a direction of annular extension of the trajectory deflecting surface; and a position changer which moves an incident position of the treatment liquid on the trajectory deflecting surface in the direction of annular extension of the trajectory deflecting surface.

Abstract: A cartridge filter cleaning device sprays water onto the outside of a cartridge filter as a nozzle array is moved with respect to the longitudinal axis of the filter as the filter is rotated. In an electric version, a DC motor drives a threaded rod to provide nozzle array movement, and a drive belt to rotate the cartridge filter. In a fluid-driven version, a pump provides fluid pressure for the cartridge filter rotation and nozzle array movement. Multiple cartridge filter embodiments use a single motor or pump to rotate the cartridge filters and move the nozzle array. The nozzle array provides a single nozzle or a plurality of spaced-apart nozzles for each filter. Filter orientation may be vertical, horizontal, or angled.

Abstract: Methods, apparatuses and systems are disclosed for chemically etching parts by generating an enclosed chemical etching chamber in contact with a part surface and directing a flow of chemical etchant solution in contact with a part region to be etched.

Abstract: A process for reprocessing soiled animal bedding material commingled with animal manure to form a compact product. The soiled animal bedding material is separated in a shaker to send at least a preponderance of the manure to a holding tank. The bedding material is subsequently dried and compacted to form a compacted product. Alternatively, the bedding material is dried (without a compacting step) to form a product.

Abstract: A method for cleaning semiconductor substrate using ultra/mega sonic device comprising holding a semiconductor substrate by using a chuck, positioning a ultra/mega sonic device adjacent to the semiconductor substrate, injecting chemical liquid on the semiconductor substrate and gap between the semiconductor substrate and the ultra/mega sonic device, changing gap between the semiconductor substrate and the ultra/mega sonic device for each rotation of the chuck during the cleaning process. The gap can be increased or reduced by 0.5?/N for each rotation of the chuck, where ? is wavelength of ultra/mega sonic wave, N is an integer number between 2 and 1000. The gap is varied in the range of 0.5?n during the cleaning process, where ? is wavelength of ultra/mega sonic wave, and n is an integer number starting from 1.

Abstract: A laundry treating appliance and a method operating a laundry treating appliance having at least one automatic cycle of operation, a plurality of components selectively operable by a controller to implement the at least one cycle of operation on a load of laundry received within a treating chamber of the appliance with the controller having a user interface for receiving input from a user and a door for closing an open face of the treating chamber, the method comprising determining a movement of the door in a closing direction and actuating the user interface when it is determined the door is moved in the closing direction.

Abstract: Disclosed is a low-cost and resource-saving cleaning method wherein high cleaning effects are obtained by high-pressure jet cleaning or two-fluid cleaning using a gas-dissolved water. In the high-pressure jet cleaning method or the two-fluid cleaning method, a cleaning liquid or a mixed fluid of the cleaning liquid and a gas is jetted from a cleaning fluid jetting nozzle toward a subject to be cleaned, and the subject is cleaned. The cleaning liquid introduced into the cleaning fluid jetting nozzle contains the dissolved gas in a quantity equal to or more than the saturation solubility at the liquid temperature of the cleaning liquid.

Abstract: Disclosed is a liquid treatment apparatus for processing a lower surface of the substrate. The apparatus includes a first nozzle disposed below a lower surface of the substrate retained by the substrate retaining unit to eject a treatment liquid towards the lower surface of the substrate, the first nozzle having a plurality of first ejection ports, which are arrayed from a position opposing a central portion of the substrate retained by the substrate retaining unit to a position opposing a peripheral portion of the substrate retained by the substrate retaining unit. An ejecting direction of the treatment liquid ejected from the first ejection port is inclined towards a rotation direction of the substrate rotated by the rotational driving unit.

Abstract: An apparatus for treating a wafer-shaped article, comprises a spin chuck for holding a wafer-shaped article in a predetermined orientation, at least one upper nozzle for dispensing a treatment fluid onto an upwardly facing surface of a wafer-shaped article when positioned on the spin chuck, and at least one lower nozzle arm comprising a series of lower nozzles extending from a central region of the spin chuck to a peripheral region of the spin chuck. The series of nozzles comprises a smaller nozzle in a central region of the spin chuck and a larger nozzle in a peripheral region of the spin chuck. In the method according to the invention, a heated liquid is supplied through the series of nozzles so as to supply more heat to peripheral regions of a wafer than to central regions.

Abstract: A liquid processing apparatus performs a liquid processing on a rotating substrate by supplying a processing liquid. Surrounding members surround a region including an upper space of a cup body surrounding the rotating substrate and provided with an opening above the substrate. An air flow forming portion forms a descending air flow from an upper side of the cup body. A bottom surface portion blocks between the cup body and the surrounding member along a circumferential direction. An exhaust port is provided above the bottom surface portion and outside the cup body to exhaust an atmosphere in a region surrounded by the surrounding members and the bottom surface portion.

Abstract: A portable apparatus for sieving, washing, and drying particle samples onsite that are generated from well drill cutting. The apparatus comprises a sievewash chamber to initially remove contaminates from the samples, and a final wash-spin-dry chamber to completely clean and dry the samples for analysis. The two chambers function under the operational control of a computerized system comprising a processor, a user display, and a database storing computer code for operating the apparatus in various cleaning cycles. The sieve-wash chamber comprises two vertically stacked baskets: a coarse basket on top to hold the drill cutting samples; and, a caged basket underneath to catch clean samples as they fall through the coarse mesh screen on the bottom of the coarse basket. The caged basket with the samples is then manually transferred to the wash-spin-dry chamber for processing by motorized rotation of the basket at high rpm's.

Abstract: A device (1) for removing a coating, particularly a photoresist, from a substrate (10) in at least one area of the substrate (10), comprises a nozzle (11) suitable for applying a jet of a solution medium to the substrate.

Abstract: The present invention provides a tool for treating microelectronic workpieces with one or more treatment materials, including liquids, gases, fluidized solids, dispersions, combinations of these, and the like.

Abstract: The present invention relates to a dishwasher which comprises: a washer main body in which a washing basin is provided to form a space in which dishes are washed; multiple fixed jet nozzles which are fixed to the inner wall of the washing basin and jet water for washing toward the dishes at a fixed position; and a horizontally arranged cylindrical rotating rack rotatably disposed in the washing bath, wherein the inner space thereof is split into multiple dish mounting portions where the dishes can be mounted and the rotating rack rotates along the periphery of the multiple fixed jet nozzles.

Abstract: A nozzle for discharging droplets of a processing liquid for processing a substrate has a main body including a supply port, a drain port, a processing liquid flow passageway connecting the supply port and the drain port, and a plurality of discharge ports from which the processing liquid is discharged. The processing liquid flow passageway includes a plurality of branch flow channels, which branch out between the supply port and the drain port and collect together between the supply port and the drain port. The plurality of discharge ports form a plurality of columns respectively corresponding to the plurality of branch flow channels; and are aligned along and connected to the corresponding branch flow channels. A piezo element applies vibration to the processing liquid flowing through the plurality of branch flow channels.

Abstract: An apparatus for guiding hydraulic hoses for use in cleaning sewer lines. The claimed hose guide locks the hydraulic hose, near the head of the hose, in a clamp, providing rigidity for an operator trying to locate the opening of a clogged pipeline. Once the hose has been placed at the pipeline opening, the operator releases the hose from the hose guide, pressurizes the hose so as to separate the hose from the hose guide, removes the hose guide from the sewer line, and cleans the pipeline with the hydraulic hose.

Abstract: A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block, a cleaning/drying processing block, and an interface block. An exposure device is arranged adjacent to the interface block in the substrate processing apparatus. The exposure device subjects a substrate to exposure processing by means of an immersion method. In the edge cleaning unit in the cleaning/drying processing block, a brush abuts against an end of the rotating substrate, so that the edge of the substrate before the exposure processing is cleaned. At this time, the position where the substrate is cleaned is corrected.

Abstract: A produce cleaning system having a housing member defining a base, a sidewall, and an open unit cavity therebetween. The sidewall may define a water compartment and a cleansing compartment. The system may include a lid configured to close the open unit cavity and one or more jet sprayers secured to an interior surface of the unit cavity. The jet sprayers may be configured to selectively disperse fluids from the water compartment and cleansing compartment toward the basket. The system may include an interface configured to receive operation commands based on user input including a rinse command and cleansing command, such that the rinse command includes instructions to direct the jet sprayers to disperse fluid from the water compartment, and the cleansing command includes instructions to direct the jet sprayers to disperse fluids from both the water compartment and the cleansing compartment.

Abstract: According to one embodiment, a film forming system includes: a stage including a placement surface on which an object to be coated is placed; a rotating mechanism rotating the stage in a rotational direction along the placement surface; an application nozzle discharging a material onto the object placed on the stage for application; a moving mechanism relatively moving the stage and the application nozzle along the placement surface in a cross direction crossing the rotational direction; a controller performing a control to rotate the stage on which the object is placed through the rotating mechanism while relatively moving the stage and application nozzle along the placement surface in the cross direction through the moving mechanism and applying the material to the object on the stage through the application nozzle; and a cleaning apparatus cleaning the application nozzle.

Abstract: A nozzle for discharging droplets of a processing liquid for processing a substrate has a main body including a supply port, a drain port, a processing liquid flow passageway connecting the supply port and the drain port, and a plurality of discharge ports from which the processing liquid is discharged. The processing liquid flow passageway includes a plurality of branch flow channels, which branch out between the supply port and the drain port and collect together between the supply port and the drain port. The plurality of discharge ports form a plurality of columns respectively corresponding to the plurality of branch flow channels; and are aligned along and connected to the corresponding branch flow channels. A piezo element applies vibration to the processing liquid flowing through the plurality of branch flow channels.

Abstract: A substrate liquid processing apparatus includes a placement table configured to hold a substrate, a rotary driving unit configured to rotate the placement table, a liquid supply unit configured to supply a liquid to the substrate placed on the placement table, and an upper liquid guide cup, a central liquid guide cup, and a lower liquid guide cup which are disposed in this order from the top and are configured to guide downward the liquid scattering from the rotating substrate being placed on the placement table. A driving mechanism is configured to move up and down the upper liquid guide cup, the central liquid guide cup, and the lower liquid guide cup. The driving mechanism is connected to the central liquid guide cup.

Abstract: Disclosed is a liquid processing apparatus and a liquid processing method that can prevent a processing liquid from being left on a lift pin after a drying-out process of a substrate, thereby preventing the processing liquid from being attached to the back surface of the substrate after the liquid processing. The liquid processing apparatus of the present disclosure includes a holding plate that supports a substrate, a lift pin plate provided above the holding plate having a lift pin that supports the wafer from a lower side, and a processing liquid supply unit that supplies the processing liquid to the back surface of the wafer. The processing liquid supply unit is provided with a head part configured to close a penetrating hole of the lift pin plate. The processing liquid supply unit and the lift pin plate are configured to be elevated with respect to the holding plate.

Abstract: A rotary table; a drive motor M configured to rotate the rotary table; a pin base supported by the rotary table; a pin fixing member configured to move closer to or away from C1 upon the pin base revolving; first chuck pins and second chuck pins provided on the pin fixing member and configured to be into contact with an outer edge of the substrate W; a substrate gripping force generation mechanism including a spring member; a chuck pin switching mechanism including an inertia member configured to be rotated coaxially with the rotary table and a protruded member provided on an outer peripheral part of the inertia member; and a cum member provided on the pin fixing member and configured to engage with protruded member.

Abstract: Disclosed is a method of cleaning components of a substrate processing apparatus The components of the substrate processing apparatus are cleaned by using a first cleaning jig including a disk-shaped lower member, and a disk-shaped upper member connected to the lower member and forming a gap between the upper member and the lower member. The lower member of the first cleaning jig is held by the substrate holding unit to rotate the first cleaning jig. The cleaning liquid is ejected toward the first cleaning jig from a bottom side of the first cleaning jig while the first cleaning jig is rotated. The cleaning liquid flows out toward outside of the first cleaning jig via the gap between the upper member and the lower member by a centrifugal force, and the components of the substrate processing apparatus are cleaned by the cleaning liquid that has flowed out.

Abstract: A coating film forming apparatus that holds a substrate upon a spin chuck and forms a coating film by supplying a chemical liquid upon a top surface of said substrate comprises: an outer cup provided detachably to surround the spin chuck; an inner cup provided detachably to surround a region underneath the substrate held upon the chuck; a cleaning nozzle configured to supply a cleaning liquid for cleaning a peripheral edge part of the substrate, such that the cleaning liquid is supplied to a peripheral part of a bottom surface of the substrate; a cutout part for nozzle mounting, the cutout part being provided to the inner cup to engage with the cleaning nozzle; and a cleaning liquid supply tube connected to the cleaning nozzle, the cleaning nozzle being detachable to the cutout part in a state in which the cleaning liquid supply tube is connected.

Abstract: In a processing block, a plurality of back surface cleaning units and a main robot are provided. The main robot is provided between the back surface cleaning units provided on one side of the processing block and the back surface cleaning units provided on the other side of the processing block. A reversing unit used to reverse a substrate and a substrate platform used to transfer and receive substrates between an indexer robot and the main robot are provided adjacent to each other in the vertical direction between the indexer robot and the processing block. The main robot transports substrates among the plurality of back surface cleaning units, the substrate platform, and the reversing unit.

Abstract: A substrate treatment apparatus includes: substrate holding unit which horizontally holds a substrate; a rotating unit which rotates the substrate held by the substrate holding unit about a vertical axis; and a first nozzle having a first opposing face to be opposed to a region of a lower surface of the substrate inward of a peripheral portion of the substrate in spaced relation to the lower surface of the substrate during rotation of the substrate by the rotating unit and a treatment liquid spout provided in the first opposing face for filling a space defined between the lower surface of the substrate and the first opposing face with a treatment liquid spouted from the treatment liquid spout to keep the space in a liquid filled state.

Abstract: When a substrate W is processed, a cover member covers a peripheral portion of the upper surface of the substrate held by the substrate holding unit, and a central portion of the substrate located at an inner position than the peripheral portion in a radial direction is exposed without being covered by the cover member. A gap is formed between the lower surface of the cover member and the peripheral portion of the upper surface of the substrate held by the substrate holding unit. When the interior space of the cup is exhausted, a gas present above the interior space of the cup is introduced from a space enclosed by the internal peripheral surface of the cover member through the gap into the interior space of the cup.

Abstract: A wafer cleaning device comprising a wafer stage for holding a wafer having a surface to be washed, a first nozzle positioned above the wafer, a second nozzle positioned above the wafer. A first height is between the first nozzle and the surface and a second height is between the second nozzle and the surface, wherein the first height is shorter than the second height.