Abstract: This cleaning apparatus includes a rotation holding unit that holds and rotates an object; a cleaning fluid spray unit that sprays a cleaning fluid onto a spot-like cleaning region on the object, which is held by the rotation holding unit; a cleaning region moving unit that moves at least one of the rotation holding unit and the cleaning fluid spray unit to relatively move the cleaning region from the rotation center of the object toward the outer peripheral side thereof; a layered air current forming unit that forms a layered air current entering the surface of the object so as to cover the periphery of the cleaning region from a backward side in the direction of movement of the cleaning region relative to the rotation center; and a layered air current moving unit that relatively moves the incoming position of the layered air current while following the relative movement of the cleaning region.

Abstract: A home appliance (2), in particular dishwasher or laundry treatment apparatus, further in particular a laundry treatment apparatus capable of washing and/or drying, includes a liquid supply channel (24) and/or a liquid reservoir (22) and a droplet spraying device (26). The droplet spraying device includes a membrane (36) arranged in fluid connection with the liquid supply channel (24) and/or the liquid reservoir (22). The membrane (36) has a plurality of openings (38), and at least one actuator (40) is provided for actuating the membrane (36).

Abstract: A combined paint roller and paint roller cleaner quickly and efficiently removes paint from the paint roller cleaner while preventing fluids from splashing outwardly and away from the paint roller cleaner. The paint roller cleaner includes a main chamber having a first slot formed at an outer surface thereof, and an auxiliary chamber statically coupled to the main chamber. Such an auxiliary chamber protrudes outwardly from the outer surface of the main chamber and preferably has an outer surface provided with a second slot formed therein. Notably, the second slot may be offset from the first slot in such a manner that an external fluid stream, after passing through the first and second slots, is caused to enter the main chamber at a non-perpendicular angle relative to the outer surface of the main chamber and thereby rotate a portion of the paint roller located within the paint roller cleaner.

Abstract: Apparatuses, and related methods, for processing a workpiece that include a particular barrier structure that can overlie and cover a workpiece. Apparatuses, and related methods, for processing a workpiece that include a particular movable member that can be positioned over and moved relative to a workpiece. Apparatuses, and related methods, for processing a workpiece that include a particular ceiling structure that can overlie a processing chamber. Nozzle devices, and related methods, that include a particular annular body. Nozzle devices, and related methods, that include a particular first, second, and third nozzle structure.

Abstract: Improved resistance to temperature-related degradation or deformation in a wafer-supporting chuck is provided by at least one shielding member that physically and/or thermally shields chuck components from effects of elevated temperature processing fluids.

Abstract: A substrate holder is defined to support a substrate. A rotating mechanism is defined to rotate the substrate holder. An applicator is defined to extend over the substrate holder to dispense a cleaning material onto a surface of the substrate when present on the substrate holder. The applicator is defined to apply a downward force to the cleaning material on the surface of the substrate. In one embodiment the cleaning material is gelatinous.

Abstract: A substrate processing system which enables a minute piece of foreign matter attached to a substrate surface to be detected and are suitable for mass production of substrates. The substrate processing system has a substrate processing apparatus that carries out predetermined processing on a substrate. The substrate processing system comprises a substrate surface processing apparatus having a fluid supply unit that supplies onto a surface of the substrate a fluid containing an altering substance that alters a substance exposed at the surface of the substrate, and a substrate surface inspecting apparatus that inspects the surface of the substrate onto which the fluid has been supplied.

Abstract: A disclosed substrate cleaning apparatus for cleaning a back surface of a substrate includes a first substrate supporting portion configured to support the substrate at a first area of a back surface of the substrate, the back surface facing down; a second substrate supporting portion configured to support the substrate at a second area of the back surface of the substrate, the second area being separated from the first area; a cleaning liquid supplying portion configured to supply cleaning liquid to the back surface of the substrate; a drying portion configured to dry the second area of the back surface of the substrate; and a cleaning portion configured to clean a third area of the back surface of the substrate when the substrate is supported by the first substrate supporting portion, the third area including the second area, and a fourth area of the back surface of the substrate when the substrate is supported by the second substrate supporting portion, the fourth area excluding the second area of the back

Abstract: A cleaning apparatus for a semiconductor wafer includes: a gas jet device including a gas nozzle which jets a first gas onto the surface of a semiconductor wafer to thin the thickness of a stagnant layer on the surface of the semiconductor wafer; and a two-fluid jet device including a two-fluid nozzle which jets droplet mist onto a region where thickness of the stagnant layer of the semiconductor wafer is thinned, the droplet mist being mixed two-fluid of a liquid and a second gas.

Abstract: A dielectric window cleaning apparatus may be used for cleaning a dielectric window of a plasma processing device. The dielectric window cleaning apparatus may comprise a window support base, a fluid containing enclosure, a window rotating mechanism, a spray arm, and multiple fluid spraying nozzles. The fluid containing enclosure may include at least one overflow containment sidewall and may be located at least partially under and at least partially around a portion of the window support base. The window rotating mechanism may be operatively connected to the window support base and may rotate the window support base. The spray arm may be in fluid communication with a fluid source and may include a fluid flow channel. The multiple fluid spraying nozzles may each expel fluid from the fluid flow channel in a window cleansing spray.

Abstract: A liquid processing apparatus includes a substrate holding unit and an elevating member provided to ascend/descend with respect to the substrate holding unit. The substrate holding unit includes a holding base, and a first engagement member and a second engagement member which are provided to be movable in the holding base, and moved between an engaging position where the member is engaged with the peripheral edge of the substrate and a releasing position where the member releases the substrate. When the first contact unit connected to the first engagement member is in contact with a first portion to be contacted, the first engagement member is located at the engaging position. When the second contact unit connected to the second engagement member is in contact with a second portion to be contacted at a lower position than the first portion, the second engagement member is located at the engaging position.

Abstract: A liquid processing apparatus according to the present disclosure includes a substrate holding unit configured to be rotated and hold a substrate from a bottom side thereof with substrate being spaced apart horizontally, a rotation driving unit configured to rotate the substrate holding unit, and an air supply unit provided above the substrate and configured to supply air toward the substrate held by the substrate holding unit. The liquid processing apparatus also includes an air supply path including a suction port that inhales the air supplied from the air supply unit and supplies the air inhaled from the suction port to a space formed between the substrate holding unit and a bottom surface of the substrate held by the substrate holding unit.

Abstract: Provided is a liquid processing apparatus in which a target substrate is horizontally held on a substrate holding unit and rotated around a vertical shaft, and the chemicals are supplied from a chemical supplying unit to the bottom surface of the target substrate that is rotating. In particular, the liquid processing apparatus performs a first step in which the chemicals are supplied to the target substrate while rotating the target substrate at a first rotation speed, a second step in which the supply of the chemicals is halted and the chemicals are thrown off by rotating the target substrate at a second rotation speed higher than the first rotation speed, and a third step in which the rinse liquid is supplied to the target substrate while rotating the target substrate at a third rotation speed equal to or lower than the first rotation speed.

Abstract: A hands-free cleaning apparatus enabling a user to clean various roller pads and/or paintbrushes using a single apparatus. The apparatus includes a main housing and a lid. The housing has a bottom drain hole and legs. An attachment mechanism is provided to receive and retain a roller pad or paintbrush in a desired position within the apparatus. A spraying mechanism is provided within the housing having one or more spray nozzles arranged to spray water (or other cleaning solution) on the pad or brush in a desired spray pattern for spinning and cleaning the pad or brush. In one configuration, each spray nozzle has a spray direction that is slightly offset from other nozzles in relation to the surface of the roller pad or brush being cleaned, helping to force rotation. The spraying mechanism receives water from a hose through a hose attachment.

Abstract: A substrate treatment apparatus is provided, which includes: a seal chamber including a chamber body having an opening, a lid member provided rotatably with respect to the chamber body and configured to close the opening, and a first liquid seal structure which liquid-seals between the lid member and the chamber body, the seal chamber having an internal space sealed from outside; a lid member rotating unit which rotates the lid member; a substrate holding/rotating unit which holds and rotates a substrate in the internal space of the seal chamber; and a treatment liquid supplying unit which supplies a treatment liquid to the substrate rotated by the substrate holding/rotating unit.

Abstract: A device and method for treating the surface of a semiconductor wafer provides a treatment fluid in the form of a dispersion of gas bubbles in a treatment liquid generated at acoustic pressures less than those required to induce cavitation in the treatment liquid. A resonator supplies ultrasonic or megasonic energy to the treatment fluid and is configured to create an interference pattern in the treatment fluid comprising regions of pressure amplitude minima and maxima at an interface of the treatment fluid and the semiconductor wafer.

Abstract: The present invention provides a tool for treating microelectronic workpieces with one or more treatment materials, including liquids, gases, fluidized solids, dispersions, combinations of these, and the like.

Abstract: A coating device includes a coating mechanism which includes nozzles for ejecting a liquid material onto front and rear surfaces of the substrate while rotating a substrate in an upright state at a predetermined coating position, a carrying mechanism which carries the substrate between a substrate loading position, the coating position, and a substrate unloading position, and a dummy substrate holding mechanism which holds a dummy substrate at a holding position which is a position different from the substrate loading position, the coating position, and the substrate unloading position, and at which the carrying mechanism is allowed to connect with the dummy substrate.

Abstract: A template cleaning method for cleaning a template for nanoimprint, according to an embodiment of the present invention includes placing a wafer on a stage provided in a chamber, cleaning the wafer placed on the stage, inspecting the wafer for particles after the cleaning of the wafer, placing the template on the stage after the inspection of the wafer, and cleaning the template placed on the stage.

Abstract: A protruding portion (13), which has a central axis coincident with a rotational axis of a table (10), is formed at a center portion of a surface of the table (10). At the time of the surface processing, the table (10) is rotated under a state in which the processing target surface of the substrate (12) is supported horizontally at each of a plurality of parts on the table (10) spaced apart from a base end of the protruding portion (13) toward an outer peripheral end portion of the table (10) by a predetermined distance and at the same distance from a top end of the protruding portion (13). Then, a processing liquid is supplied toward the top end of the protruding portion (13). The processing liquid that has reached the processing target surface of each substrate (12) is then removed outside the table (10) by centrifugal force.

Abstract: A parts washer comprises a cabinet, a platform, a liquid distributor, a coupling, and a drive system. The platform is disposed inside the cabinet and supports articles that are required to be cleaned. The distributor is disposed inside the cabinet to one side of the platform and has one or more outlets that direct the liquid in a generally radial direction toward the platform. The coupling couples the distributor to an inside of the cabinet in a manner allowing at least 2°of freedom of motion of the distributor. More particularly, the coupling allows the distributor to move in a complex motion comprising a combination of tilting, rotation and up and down motion.

Abstract: A system, apparatus and method for processing flat articles with acoustical energy. The inventive system, apparatus and method can remove particles from both sides of a wafer more efficiently and effectively. In one aspect, the invention is a system and/or method for processing flat articles wherein a liquid is applied to both major surfaces of the flat article. A first transducer assembly is positioned adjacent to a first of the major surfaces of the flat article and a second member is positioned adjacent to a second of the major surfaces. The first transducer assembly generates and transmits acoustical energy to the first major surface of the flat article while the second member either: (1) reflects the acoustical energy generated by the first transducer assembly back to the second major surface of the flat article; and/or (2) generates and transmits acoustical energy to the second major surface of the flat article.

Abstract: There is provided a coating and processing apparatus including a spin chuck horizontally holding a quadrangular substrate and rotating the substrate in a horizontal plane, a coating solution nozzle for supplying a coating solution to a front surface of the substrate horizontally held by the spin chuck, and a solvent supply mechanism provided in the spin chuck for supplying a solvent to a back surface of the substrate, in which the solvent supplied to the back surface of the substrate is allowed to reach the back surface and side surface of each of corners of the substrate by centrifugal force, thereby removing the coating solution attached.

Abstract: The present invention relates to a wafer cleaning and a wafer bonding method using the same that can improve a yield of cleaning process and bonding property in bonding the cleaned wafer by cleaning the wafer using atmospheric pressure plasma and cleaning solution. The wafer cleaning method includes the steps of providing a process chamber with a wafer whose bonding surface faces upward, cleaning and surface-treating the bonding surface of the wafer by supplying atmospheric pressure plasma and a cleaning solution to the bonding surface of the wafer, and withdrawing out the wafer from the process chamber.

Abstract: A substrate processing apparatus and a substrate processing method are capable of restraining or preventing the generation of streaky particles on a substrate surface by excellent removal of a rinsing liquid therefrom. The substrate processing apparatus has a substrate inclining mechanism for inclining a substrate held by a substrate holding mechanism. After a rinsing liquid has been supplied onto a substrate to form a liquid mass, the substrate is inclined at a small angle by the substrate inclining mechanism. Then, the liquid mass is downwardly moved without being fragmented and then falls down without leaving minute droplets on the substrate top. Thereafter, the substrate is returned to a horizontal posture and then dried.

Abstract: A liquid processing apparatus includes: a hollow holding plate configured to hold an object to be processed; a hollow outer rotational shaft fixedly connected to the holding plate; a rotary drive part configured to rotate the outer rotational shaft; and a lift pin plate disposed in a hollow space of the holding plate, and having a lift pin configured to support the object to be processed. Inside the lift pin plate, a cleaning-liquid supply part configured to supply a cleaning liquid is extended. Connected to the lift pin plate is a lifting member configured to locate the lift pin plate on an upper position and a lower position. When located on the lower position, the lift pin plate receives a force of the rotary drive part for rotating the outer rotational shaft so that the lift pin plate is rotated.

Abstract: A coating apparatus includes a liquid film forming mechanism configured to form a liquid film of a process liquid for preventing a contaminant derived from a coating liquid from being deposited or left on a back side peripheral portion of a substrate. The liquid film forming mechanism includes a counter face portion facing the back side peripheral portion of the substrate and a process liquid supply portion for supplying the process liquid onto the counter face portion. The coating apparatus further includes a posture regulating mechanism disposed around the substrate holding member and configured to damp a vertical wobble of the peripheral portion of the substrate being rotated. The posture regulating mechanism includes delivery holes arrayed in a rotational direction of the substrate and configured to deliver a gas onto a back side region of the substrate on an inner side of the peripheral portion.

Abstract: A liquid treatment apparatus includes a substrate retaining unit, a rotational driving unit configured to rotate the substrate retaining unit; and a nozzle disposed below a lower surface of the substrate, the nozzle having first ejection ports provided to eject a chemical liquid and second ejection ports provided to eject a rinsing fluid towards the lower surface of the substrate. The nozzle comprises a first portion and a second portion each extending from a position opposing to a peripheral portion of the substrate towards a position opposing to a central portion of the substrate. At least part of the first ejection ports are arranged in the first portion. At least part of the second ejection ports are arranged in the second portion. The first portion and the second portion are arranged to form a V-shaped figure.

Abstract: A substrate processing method includes covering, in advance, the surface of a substrate with water, holding the substrate generally horizontally with the surface facing upward and rotating it in a horizontal plane, and blowing to the substrate top surface drying gas flow that is thin in area in comparison with the substrate surface, in which the water is removed from the substrate top surface by the rotation in the horizontal plane while blowing the drying gas flow, a substrate processing apparatus for implementing the above method, and a control program for use with the above method and apparatus.

Abstract: A washing device of a substrate for a magnetic recording medium of the present invention includes an immersion tank; a plurality of screw conveyors that are provided in the immersion tank and that hold the substrates for a magnetic recording medium; and a rotation mechanism that causes synchronous rotation of and supports the plurality of screw conveyors, wherein both ends of main shafts of the screw conveyors are provided outside of the immersion tank, the main shafts of these screw conveyors penetrate the tank walls of the immersion tank in a non-contact manner, and the plurality of substrates for a magnetic recording medium that are held by the plurality of screw conveyors are washed by a wet process using a washing liquid that is contained in the immersion tank.

Abstract: A cleaning system for removing contaminants on a surface of a patterned substrate for defining integrated circuit devices is provided. The system includes a substrate carrier for supporting edges of the patterned substrate, and a cleaning head positioned over the patterned substrate. The cleaning head includes a plurality of dispensing holes to dispense a cleaning material on the surface the patterned substrate for defining integrated circuit devices, wherein the cleaning material includes polymers of a polymeric compound. The cleaning head is coupled to a storage of the cleaning material, which is coupled to the cleaning material preparation system. A support structure holds the cleaning head in proximity to the surface of the patterned substrate.

Abstract: When a substrate is subjected to bevel cleaning processing, a first magnet plate is arranged at a lower position, and a second magnet plate is arranged at an upper position. In this case, each of chuck pins enters a closed state in a region outside the first magnet plate, while entering an opened state in a region outside the second magnet plate. That is, a holder in each of the chuck pins is maintained in contact with an outer edge of the substrate when it passes through the region outside the first magnet plate, while being spaced apart from the outer edge of the substrate when it passes through the region outside the second magnet plate.

Abstract: An improved portable cleaning system for use in cleaning heat exchanger tube bundles, fin-fans, towers and other elongated components. The cleaning system comprises a cleaning unit having a cleaning enclosure that receives and cleans the component and a control unit that controls the operation of the system. The cleaning unit has a cleaning enclosure defining a chamber sized and configured to receive the component through a sealable lid. A roller assembly rotates the component while a spray assembly sprays cleaning fluid over and into the rotating component. The cleaning fluid is heated in the chamber using surface heating elements attached to heat transfer plates along sections of the chamber walls. A vapor recovery system captures and treats toxic vapors. In use, the cleaning system is transported to a facility to clean the components on-site using cleaning fluid supplied by the facility and discharging waste to the facility.

Abstract: A substrate holding rotating mechanism is used to hold and rotate a substrate to be processed. The substrate holding rotating mechanism according to the present invention includes at least three spindles, clamp rollers mounted respectively on the spindles for holding a periphery of a substrate, a rotating device for rotating at least one of the clamp rollers, at least one base member on which at least one of the spindles is installed, and a rotational mechanism adapted to allow the base member to be rotatable.

Abstract: A pan inverting system (10) comprises a rotating table (11) having a central longitudinal axis (13), the table being rotatably mounted within a static frame (15) for rotation about the longitudinal axis (13). Conveyors (21) are disposed on opposed pan-receiving surfaces (20) of the table (11). The conveyors (21) are independently operable to displace a pan (12) along the table (11) in a direction substantially parallel to the longitudinal axis (13). A pan engagement device (24) within the table (11) is operable to releasably fasten the pan (12) to the pan receiving surface (20) of the table (11), such that when the pan (12) is fastened to one of the pan receiving surfaces (20) by the pan engagement mechanism (24), rotation of the table (11) about the longitudinally extending axis (13) will invert the pan (12).

Abstract: A rinse method for rinsing a substrate having an exposure pattern thereon developed includes presetting conditions for a rinse process according to surface states of the substrate, measuring a surface state of the substrate, selecting a corresponding condition for the rinse process based on the measured surface state of the substrate, and performing the rinse process under the selected condition.

Abstract: A part of the opening of the nozzle insertion hole located in the liquid discharging direction relative to the nozzle inserted in the nozzle insertion hole is enlarged in the liquid discharging direction. Therefore, the droplets which have migrated to the nozzle insertion hole adheres to the internal surface in the liquid discharging direction relative to the nozzle, that is, to the slanted part via the enlarged part. Moreover, the slanted part is provided slanted from the central portion of the nozzle insertion hole toward the enlarged part and separated away from the central portion of the substrate top surface. Hence, the adhering droplets flow in the liquid discharging direction along the slanted part to be discharged from the opening of the nozzle insertion hole.

Abstract: Aspects of the invention generally provide methods and apparatus for cleaning adhesive residual on a photomask substrate. In one embodiment, the apparatus includes a processing cell, a support assembly configured to receive a photomask substrate disposed thereon disposed in the processing cell, a protection head assembly disposed above and facing the support assembly, and a head actuator configured to control the elevation of the protection head assembly relative to an upper surface of the support assembly. A cleaning device is provided and positioned to interact with the photomask substrate disposed on the support assembly.

Abstract: After the rinsing processing is completed, the rotation speed of the substrate is reduced from 600 rpm to 10 rpm to form a puddle-like DIW liquid film. After the supply of DIW is stopped, the control unit waits for a predetermined time (0.5 seconds) so that the film thickness t1 of the puddle-like liquid film becomes approximately uniform. Then, IPA is discharged to a central part of the surface of the substrate at a flow rate of 100 (mL/min) for instance. By the supply of IPA, DIW is replaced with IPA at the central part of the surface of the substrate to form a replaced region. Further, after three seconds of IPA supply, the rotation speed of the substrate is accelerated from 10 rpm to 300 rpm. This causes the replaced region to expand in a radial direction of the substrate so that the entire surface of the substrate is replaced with the low surface-tension solvent.

Abstract: A substrate holding rotating mechanism is used to hold and rotate a substrate to be processed. The substrate holding rotating mechanism according to the present invention includes at least three spindles, clamp rollers mounted respectively on the spindles for holding a periphery of a substrate, a rotating device for rotating at least one of the clamp rollers, at least one base member on which at least one of the spindles is installed, and a rotational mechanism adapted to allow the base member to be rotatable.

Abstract: A coating device includes a box-shaped processing chamber. Slits are respectively provided on four side surfaces of the processing chamber. A box-shaped housing is provided so as to surround the processing chamber. A space is formed between the processing chamber and the housing. A fan filter unit for forming downflow in the space is provided on the top of the housing. Air supplied to the fan filter unit is cleaned by the fan filter unit, and is supplied to the space. The air supplied to the space is supplied to the processing chamber through each of the slits in the processing chamber. This causes a twister-shaped air current to be generated within the processing chamber.

Abstract: The present invention provides an apparatus and a method for an ultraviolet cleaning tool. The cleaning tool includes ultraviolet source spaced apart from a surface having contaminant particles. The ultraviolet source can create ozone between the surface and the ultraviolet source which breaks the chemical bonds between particles and the surface. The apparatus includes a gas feed which introduces a gas to aid the chemical bond. Additionally, the gas feed can introduce a gas to remove the particles from the surface.

Abstract: A device and method for assisting in the removal of fluid, such as water, and related moisture from a bladder of a fluid storage device, such as a personal hydration pack or reservoir, is disclosed. The device has a three-dimensional structure or profile so that, when inserted within the bladder, the bladder is held in an open configuration or position, which allows any water or fluid to drain out and allows evaporation to the atmosphere of moisture to occur through the port of the bladder used to fill the device. In one form, the device has an insertion section having portions of elongated structure having a smaller size than the opening so that the insertion section can be fed into the bladder, and the overall insertion section has a profile larger than the opening so that the bladder is held open.

Abstract: What is contemplated is a printing cylinder washer having a removable or portable drive assembly, or a series of portable drive assemblies of different lengths to accommodate different sizes of print rollers. The drive assemblies have a drive mechanism enabled by a dynamic flow of cleaning solution within the washer reservoir. What is also contemplated is the use of an elevation system, an agitation platform, under-immersion spray bars, an ultrasonic wave cleaning system, and a hatch or door equipped with a thermal breaker in conjunction with the hydro-driven portable drive assembly. What is also contemplated is a method of washing printing rollers within the above-described printing cylinder washer by aligning a nozzle with the drive assembly.

Abstract: A substrate holder is defined to support a substrate. A rotating mechanism is defined to rotate the substrate holder. An applicator is defined to extend over the substrate holder to dispense a cleaning material onto a surface of the substrate when present on the substrate holder. The applicator is defined to apply a downward force to the cleaning material on the surface of the substrate. In one embodiment the cleaning material is gelatinous.

Abstract: The disclosure concerns a manufacturing method of a semiconductor device includes dry-etching a semiconductor substrate or a structure formed on the semiconductor substrate; supplying a solution onto the semiconductor substrate; measuring a specific resistance or a conductivity of the supplied solution; and supplying a removal solution for removing the etching residual material onto the semiconductor substrate for a predetermined period of time based on the specific resistance or the conductivity of the solution, when an etching residual material adhering to the semiconductor substrate or the structure is removed.

Abstract: An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer.

Abstract: In a substrate cleaning method and a substrate cleaning method according to the present invention, a brush 3 is brought into contact with a substrate W while rotating the same, and a cleaning position Sb of the brush 3 is moved relative to the substrate W from a center part of the substrate W toward a peripheral part thereof. A process fluid formed of liquid droplets and a gas is sprayed by a two-fluid nozzle 5 onto the substrate W, and a cleaning position Sn of the two-fluid nozzle 5 is moved relative to the substrate W from a center part of the substrate W toward a peripheral part thereof. During the movement of the cleaning position Sb of the brush 3 from the center part of the substrate W toward the peripheral part thereof, the cleaning position Sb of the two-fluid nozzle is positioned nearer to a center P0 than the cleaning position Sb of the brush 3. Since contaminations of the brush are prevented from adhering again to the wafer, it can be avoided that the wafer W is contaminated.

Abstract: A wash cylinder or chamber for an automated cleaning station to clean an object or a person's body part includes nozzles on the interior of the cylinder, the nozzles of one embodiment comprising an increasing roll angle providing a novel spray pattern. Additionally, embodiments of the invention include fluid guidance and conveyance structures, angled nozzles, sealing structures, finger guards, nozzle ribs, wash chamber seating mechanisms and drains, and nozzle inlays having a plurality of nozzles. Also disclosed are methods of washing an object or body part using a wash cylinder or chamber and methods of assembling a wash cylinder or chamber.

Abstract: A wash cylinder or chamber for an automated cleaning station to clean an object or a person's body part includes nozzles on the interior of the cylinder, the nozzles of one embodiment comprising an increasing roll angle providing a novel spray pattern. Additionally, embodiments of the invention include fluid guidance and conveyance structures, angled nozzles, sealing structures, finger guards, nozzle ribs, wash chamber seating mechanisms and drains, and nozzle inlays having a plurality of nozzles. Also disclosed are methods of washing an object or body part using a wash cylinder or chamber and methods of assembling a wash cylinder or chamber.