Abstract: Disclosed is a substrate treating apparatus for performing a predetermined treatment on a substrate. The apparatus includes: a holding mechanism including a plurality of support pins configured to rotate between a holding position and a delivery position, a first magnetic part configured to rotate the support pins individually between the holding position and the delivery position by switching surrounding magnetic poles, and a second magnetic part configured to rotate the support pins individually to the holding position by constantly applying a magnetic field to the first magnetic part; and a switching mechanism configured to apply no magnetic field of a third magnetic part to the first magnetic part normally and apply a magnetic field of the third magnetic part to the first magnetic part to rotate the support pins individually to the delivery position only when the substrate is delivered.

Abstract: A method of processing a semiconductor substrate is provided. The semiconductor substrate may be placed on a spin chuck with a plurality of holding members, each holding member including a pin having a sloped portion to provide a gap between an upper edge of the substrate and the pin. Thereafter, one or more treatment fluids may be dispensed over the substrate.

Abstract: A method and an apparatus which can efficiently polish an entirety of a back surface, including an outermost area thereof, of a substrate while the back surface of the substrate faces downward are disclosed. The method includes rotating a substrate by rotating a plurality of rollers about their respective own axes while the rollers contact a periphery of the substrate with a back surface of the substrate facing downward; and polishing an entirety of the back surface of the substrate by moving a polishing tool relative to the substrate while supplying a liquid onto the back surface of the substrate and while placing the polishing tool in contact with the back surface of the substrate, the polishing tool being located at a lower side of the substrate.

Abstract: An improved disc feeder/conveyor (2) with optical sensor (200) and return chute (10) for multiple industrial, commercial or agricultural applications. The conveyor (2) comprises a pair of co-rotating (or counter-rotating) roller shafts (11A, 11B) driven by a belt (104) drive. The rollers (11A, 11B) are non-parallel, slightly angled, and the rotation of the shafts frictionally engages, the sample caps or other elements being advanced away from the production line causing the items seated thereon advance. Sensors (200, 202) detect the presence/absence of items on the rollers for gating. Another pair of co- or counter-rotating roller shafts (15A, 15B) may act as a return chute (10).

Abstract: A reprocessing system includes a decontamination basin, a lid, a cleaning assembly, an exterior body, and an actuating panel assembly. The lid is configured to enclose the interior surface of the decontamination basin in a closed configuration. The lid and an interior surface of the decontamination basin are configured to cooperate to house a medical device when in the lid is in the closed configuration. The cleaning assembly is operable to clean a medical device housed in the decontamination basin. The actuating panel assembly is configured to transition between a withdrawn position and an extended position. The actuating panel assembly is configured to be enclosed by the lid and the interior surface of the decontamination basin in the withdrawn position. The actuating panel assembly is configured to extend above a portion of the exterior body while the actuating panel assembly is in the extended position.

Abstract: A flow production system, in particular an assembly and/or production line includes a conveyor for conveying a workpiece along a conveying direction of the flow production system. A platform for use in flow production includes a guiding device and a processing device, wherein the platform is designed to be moved into and out of the flow production substantially as a whole. A method for operating a flow production system or a platform includes guiding a workpiece along the platform with the guiding device and processing the workpiece with the processing device during guiding.

Abstract: A dispenser and procedure for disinfecting and cleaning air conditioner condensation drainage lines and other condensation drainage lines. The dispenser can be installed at any convenient location on any floor of a home or other building, regardless of whether the location is below, above, or at the same elevation as the inlet of the condensation drainage line. The dispenser includes a liquid pump for delivering an amount of treatment fluid into a treatment delivery line and an air pump for pushing the dose of treatment fluid through the treatment delivery line and into the condensation drainage line.

Abstract: This substrate processing method includes: a substrate rotating step of rotating a substrate around a predetermined vertical axis line at a first rotation speed; a liquid-tight step performed along with the substrate rotating step, and where a first opposed surface is opposed at a first distance to a rotated lower surface of the substrate, and at the same time, a processing liquid is discharged from a processing liquid dispense port of a lower surface nozzle opposed to the lower surface of the substrate to cause a space between the lower surface and the first opposed surface to be in a liquid-tight state by the processing liquid; and a liquid-tight state releasing step of releasing the liquid-tight state in the space between the lower surface and the first opposed surface by separating the lower surface and the first opposed surface after the liquid-tight step.

Abstract: This substrate holding/rotating device includes an opening magnet forming a predetermined magnetic field generation region through which each movable pin rotating in response to rotation of the rotary table is capable of passing, the magnetic field generation region disposed so as to be eccentric with respect to a rotation direction of the rotary table and so as to allow only driving magnets corresponding to part of the plurality of movable pins to pass through the magnetic field generation region, the opening magnet giving a repulsive force or an attractive force to the driving magnet of the movable pin passing through the magnetic field generation region, the opening magnet generating a force that enables the support portion of the movable pin urged to the hold position by the urging unit to move toward the open position against an urging force of the urging unit.

Abstract: The paint roller drill attachment is a device that enables a paint roller to be secured thereon. Moreover, the paint roller drill attachment includes a hexagonal drill bit that is adapted to be secured to a drill chuck of a drill in order to rotate both the paint roller drill attachment as well as the paint roller. Moreover, high-speed rotation of the paint roller drill attachment via the drill enables wet paint to be spun off of the paint roller. The paint roller drill attachment includes a paint roller portion that is affixed to the hexagonal drill bit. The paint roller portion includes a plurality of rib members that span between a first member and a second member.

Abstract: A dielectric window cleaning apparatus may be used for cleaning a dielectric window of a plasma processing device. The dielectric window cleaning apparatus may comprise a window support base, a fluid containing enclosure, a window rotating mechanism, a spray arm, and multiple fluid spraying nozzles. The fluid containing enclosure may include at least one overflow containment sidewall and may be located at least partially under and at least partially around a portion of the window support base. The window rotating mechanism may be operatively connected to the window support base and may rotate the window support base. The spray arm may be in fluid communication with a fluid source and may include a fluid flow channel. The multiple fluid spraying nozzles may each expel fluid from the fluid flow channel in a window cleansing spray.

Abstract: A method and device for treating a wafer-shaped article utilizes a novel clamping mechanism, which permits wafer shift to be performed with reduced wear to the chuck pins. A wafer is rotated on a spin chuck that has a plurality of pins positioned at a periphery of the wafer shaped article. The pins each have a head portion which, in a service position, extends radially inwardly of and above the wafer. Gas is supplied onto a surface of the wafer facing the spin chuck at a flow rate sufficient to displace the wafer upwardly into contact with the head portions of the pins. This serves to clamp the wafer against the head portions of the pins. However, the pins contact the wafer only on upwardly oriented wafer surfaces and the wafer is supported from below solely by the gas flow.

Abstract: An improved portable cleaning system for use in cleaning heat exchanger tube bundles, fin-fans, towers and other elongated components. The cleaning system comprises a cleaning unit having a cleaning enclosure that receives and cleans the component and a control unit that controls the operation of the system. The cleaning unit has a cleaning enclosure defining a chamber sized and configured to receive the component through a sealable lid. A roller assembly rotates the component while a spray assembly sprays cleaning fluid over and into the rotating component. The cleaning fluid is heated in the chamber using surface heating elements attached to heat transfer plates along sections of the chamber walls. A vapor recovery system captures and treats toxic vapors. In use, the cleaning system is transported to a facility to clean the components on-site using cleaning fluid supplied by the facility and discharging waste to the facility.

Abstract: A rotisserie skewer, basket and parts cleaning assembly is provided. The assembly is located within a wash tank that includes a jet nozzle to expel a stream of fluid into said wash tank. The assembly is rotatably mounted within the wash tank and is capable of holding parts for cleaning.

Abstract: An apparatus for treating a wafer-shaped article, comprises a spin chuck for holding a wafer-shaped article in a predetermined orientation, at least one upper nozzle for dispensing a treatment fluid onto an upwardly facing surface of a wafer-shaped article when positioned on the spin chuck, and at least one lower nozzle arm comprising a series of lower nozzles extending from a central region of the spin chuck to a peripheral region of the spin chuck. The series of nozzles comprises a smaller nozzle in a central region of the spin chuck and a larger nozzle in a peripheral region of the spin chuck. In the method according to the invention, a heated liquid is supplied through the series of nozzles so as to supply more heat to peripheral regions of a wafer than to central regions.

Abstract: A liquid processing apparatus performs a liquid processing on a rotating substrate by supplying a processing liquid. Surrounding members surround a region including an upper space of a cup body surrounding the rotating substrate and provided with an opening above the substrate. An air flow forming portion forms a descending air flow from an upper side of the cup body. A bottom surface portion blocks between the cup body and the surrounding member along a circumferential direction. An exhaust port is provided above the bottom surface portion and outside the cup body to exhaust an atmosphere in a region surrounded by the surrounding members and the bottom surface portion.

Abstract: A method for treating at least one substrate (15), particularly wafers, in a liquid medium (3). In a first step, the substrate (15) is lifted in the liquid medium (3) until the substrate (15) is at least partially lifted out of the liquid medium (3) and, in a second step, is passed on at least one point protruding out of the liquid medium (3).

Abstract: A substrate processing apparatus includes a substrate holding means that holds a substrate horizontally, a substrate rotating means that rotates a substrate held by the substrate holding means about a vertical rotation axis passing through the substrate, a discharging member that discharges a processing liquid toward the substrate, and a high-temperature processing liquid pipe that supplies a processing liquid of a temperature higher than that of the discharging member to the flow passage. The discharging member includes a plurality of discharge ports respectively disposed at a plurality of positions different in distance from the rotation axis and a flow passage connected sequentially to the plurality of discharge ports in order from outside to inside. The discharging member discharges a processing liquid supplied from the flow passage to the plurality of discharge ports from the plurality of discharge ports toward the substrate.

Abstract: An open top tank assembly for performing forced immersion oscillatory cleaning of products, parts, assemblies or other materials with or without non-line of sight (NLOS) features, wherein the apparatus repeats a process during application of pressure gradients to the fluid in the tank to develop a consistent rhythmic oscillation that creates movement of product in a center cavity of the tank to repeatedly transfer the fluid through the product to clean the product.

Abstract: [Problem] To provide a liquid processing method with which, while alleviating a watermark occurring in the surface of a substrate, it is possible to hydrophobize the surface using a hydrophobing gas. [Solution] A substrate (W), retained in substrate retaining parts (21, 22, 23), is rotated and has a liquid compound supplied to the surface thereof, whereby a liquid process is carried out. Next, a rinse liquid is supplied to the surface of the substrate (W) while the substrate (W) is rotated, and the liquid compound is replaced with the rinse liquid. Next, supplying a hydrophobing gas for hydrophobizing the surface of the substrate (W) and supplying the rinse liquid to the surface of the substrate (W) after supplying the hydrophobing gas are repeated alternately, thus hydrophobizing the substrate (W). Next, the rinse liquid is removed by rotating the substrate (W), drying the substrate (W).

Abstract: A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block, a cleaning/drying processing block, and an interface block. An exposure device is arranged adjacent to the interface block in the substrate processing apparatus. The exposure device subjects a substrate to exposure processing by means of an immersion method. In the edge cleaning unit in the cleaning/drying processing block, a brush abuts against an end of the rotating substrate, so that the edge of the substrate before the exposure processing is cleaned. At this time, the position where the substrate is cleaned is corrected.

Abstract: A wafer scrubber is disclosed, including a chamber, and a holder connecting to a spindle disposed in the chamber, wherein the holder supports a wafer, and the wafer spins to remove water on the wafer, and a meshed inner cup comprising a plurality of through holes disposed between the holder and a wall of the chamber, wherein the meshed inner cup receives water from a surface of the wafer and rotates around the spindle to release the water through the through holes.

Abstract: A liquid dispenser for a wafer processing system includes a supply tube with an inlet at one end and an outlet at the other end. Attached to the supply tube at the outlet end is a liquid reservoir. The liquid reservoir has a dispensing plate that has an outlet for dispensing liquid onto a wafer. There is also a dispensing valve for controlling the dispensing of the liquid.

Abstract: A cleaning apparatus for a power driven buffing pad includes a wash plate mounted in a cleaning solution reservoir that provides agitating and cleaning contact with the pad mounted on an operating driver. The wash plate can be reciprocated vertically by the operator against a biasing arrangement to operate a pump to deliver cleaning solution from the reservoir to the face of the pad in contact with the wash plate.

Abstract: A nozzle for discharging droplets of a processing liquid for processing a substrate has a main body including a supply port, a drain port, a processing liquid flow passageway connecting the supply port and the drain port, and a plurality of discharge ports from which the processing liquid is discharged. The processing liquid flow passageway includes a plurality of branch flow channels, which branch out between the supply port and the drain port and collect together between the supply port and the drain port. The plurality of discharge ports form a plurality of columns respectively corresponding to the plurality of branch flow channels; and are aligned along and connected to the corresponding branch flow channels. A piezo element applies vibration to the processing liquid flowing through the plurality of branch flow channels.

Abstract: A device and method for treatment of a substrate treatment surface of a substrate with a fluid by immersion of the substrate treatment surface into the fluid, The device includes: receiving means for receiving the fluid with an immersion opening and immersion means for immersion of the substrate treatment surfaces through the immersion opening into the receiving means, Rotation means are provided for rotation of the receiving means for at least predominant discharge of the fluid from the receiving means.

Abstract: A display device and a control method thereof are discussed. A display device and a control method thereof according to an embodiment of the present invention comprise a display unit displaying an object; a receiver receiving a wireless signal from a three dimensional (3D) pointing device recognizing a three dimensional motion; and a controller calculating a trajectory of the 3D pointing device corresponding to at least one of an absolute coordinate area and a relative coordinate area based on the received wireless signal and determining a position of the displayed object according to a property of an area to which the trajectory belongs and displaying the determined position.

Abstract: A substrate treatment apparatus is used for treating a major surface of a substrate with a chemical liquid. The substrate treatment apparatus includes: a substrate holding unit which holds the substrate; a chemical liquid supplying unit having a chemical liquid nozzle which supplies the chemical liquid onto the major surface of the substrate held by the substrate holding unit; a heater having an infrared lamp to be located in opposed relation to the major surface of the substrate held by the substrate holding unit to heat the chemical liquid supplied onto the major surface of the substrate by irradiation with infrared radiation emitted from the infrared lamp, the heater having a smaller diameter than the substrate; and a heater moving unit which moves the heater along the major surface of the substrate held by the substrate holding unit.

Abstract: A sealing mask has a pair of principal surfaces opposed to each other and a plurality of through-holes opening in the pair of principal surfaces and is used for sealing predetermined cells out of a plurality of cells in a honeycomb structure. A cleaning device for the sealing mask is provided with: a rotator configured to support the sealing mask and rotate the sealing mask around a central axis L1 intersecting with the pair of principal surfaces; and a sprayer having a nozzle for spraying a cleaning liquid on one of the principal surfaces.

Abstract: A substrate processing apparatus has a substrate rotating device 10, 20 for holding and rotating a substrate W, a cleaning device 41 configured to clean a substrate W which is rotated by the substrate rotating device 10, 20 at predetermined rotating speed, a movement device 42 configured to move the cleaning device 41 between a cleaning position P3 and a separate position P2, and a control unit 64. The control unit 64 controls the movement device 42 so that the cleaning device 41 located at the separate position P2 starts moving toward the cleaning position P3 before a rotating speed of the substrate W held by the substrate rotating device 10, 20 reaches the predetermined rotating speed and the cleaning device 41 reaches the cleaning position P3 after a rotating speed of the substrate W reaches the predetermined rotating speed. Therefore, it is possible to improve the throughput in the substrate cleaning step.

Abstract: A spray device for cleaning residue from a filter member. In one embodiment, the spray device includes a tubular stem telescopically slideable in a sleeve. A coil spring surrounds the stem and resists movement of the stem out of the sleeve. A tubular halo with nozzles is fastened to the end of the tubular stem so that when a pressurized fluid is applied to the stem, the stem is forced out of the sleeve against the spring force, thereby causing the halo to travel along a cylindrical filter surface. The pressurized fluid is also jetted from the nozzles and cleans the cylindrical surface. When the pressurized fluid is removed from the spray device, the spring retracts the stem and the halo back to a rest position. In another embodiment, the halo is replaced with a nozzle head that moves within a cylindrical filter surface to be cleaned.

Abstract: A substrate processing apparatus includes a substrate supporting part for supporting a substrate in a horizontal state, an upper nozzle for discharging deionized water as a cleaning solution toward a center portion of an upper surface of the substrate, and a substrate rotating mechanism for rotating the substrate supporting part together with the substrate around a central axis directed in a vertical direction. In the substrate processing apparatus, the plurality of discharge ports are provided in the upper nozzle, and the flow rate of the deionized water to be supplied onto the center portion of the substrate from the upper nozzle can be ensured, with the flow rate of the deionized water from each discharge port reduced. It is thereby possible to perform appropriate cleaning of the upper surface of the substrate while suppressing electrification at the center portion of the substrate.

Abstract: A substrate processing apparatus includes: a storage tank configured to store a liquid; a substrate support unit 10 configured to rotatably, horizontally support a substrate W; and a plate driving unit 30a configured to move the substrate support unit 10 between an immersion position at which the substrate W is immersed into the liquid stored in the storage tank, and a separation position located above the immersion position, at which the substrate W is separated from the liquid stored in the storage tank. The substrate processing apparatus also includes a rotary drive unit 30M configured to rotate the substrate W supported by the substrate support unit 10, and liquid supply units 10n, 20m and 20n configured to supply a liquid to the substrate W that is being rotated by the rotary drive unit in the separation position.

Abstract: The inventive substrate treatment apparatus includes a change controlling unit which changes at least one of a protection liquid application position relative to a liquid droplet nozzle and a protection liquid incident angle relative to the liquid droplet nozzle, the protection liquid application position being a position at which the protection liquid is applied on an upper surface of the substrate, the protection liquid incident angle being an angle at which the protection liquid is incident on the liquid application position; wherein the change controlling unit controls the liquid application position and the incident angle in a first condition when the spraying region is located on an upper surface center portion of the substrate, and controls the liquid application position and the incident angle in a second condition when the spraying region is located on an upper surface peripheral portion of the substrate.

Abstract: A device for treating a disc-like article with a fluid, including elements for dispensing a fluid onto the article and a chuck for holding and rotating the article around an axis perpendicular thereto, the chuck including a base body, a drive ring, and gripping members for contacting the article at its edge. The gripping members are eccentrically movable with respect to the center of the article and driven by a drive ring rotatably mounted to the base body so that the drive ring is rotatable against the base body around the axis. The relative rotational movement of the drive ring against the base body is carried out by either holding the base body and rotating the drive ring or by holding the drive ring and rotating the base body, whereby the to-be-held-part (drive ring or base body) is held without touching the respective to-be-held-part by magnetic force.

Abstract: A knife edge ring apparatus is provided for use during semiconductor manufacturing which includes a ring-shaped body having an inner side wall, an outer side wall and a top surface having a predetermined width. A multi-staged inclined portion is formed in the outer side wall and a plurality of discharge holes penetrate the body. Each of the discharge holes have an inlet associated therewith positioned at the inclined portion. The knife edge ring allows developer and cleaning solution to be discharged away from the wafer. A method of cleaning the bottom surface of a semiconductor wafer is also provided which employs the use of the knife edge ring. Developer is supplied onto the top surface of a wafer. Spraying solution is sprayed onto the bottom surface of the wafer.

Abstract: The present disclosure provides one embodiment of a method of fabricating an integrated circuit. The method includes forming a patterned hard mask on a substrate; performing a fabrication process to the substrate through openings of the patterned hard mask; performing a first etch process to remove the patterned hard mask; and applying an NHD solution to the substrate, wherein the NHD solution includes ammonium hydroxide, hydrogen peroxide and deionized water with ratios tuned such that the NHD solution is weak basic.

Abstract: Disclosed is an apparatus for wet treatment of a disc-like article, which comprises: a spin chuck for holding and rotating the disc-like article, and an inner edge nozzle dispensing treatment liquid directed towards a first peripheral region of the first surface of the disc-like article, wherein the first surface is facing the spin chuck and the first peripheral region is defined as being a region of the first surface with an inner radius (ri), which is greater than 1 cm less than the disc-like article's radius (ra), wherein the inner edge nozzle is positioned in a stationary manner between the disc-like article (when placed on the spin chuck) and the spin chuck, wherein the inner edge nozzle is feed through a central pipe, which is disposed in a stationary manner and penetrates centrally through the spin chuck, for supplying a treatment liquid against a first surface of the disc-like article.

Abstract: A method of manufacturing a semiconductor device includes: holding a semiconductor substrate with a surface inclined with respect to the vertical direction and the horizontal direction; and immersing the semiconductor substrate in a cleaning solution including an acid.

Abstract: A system for cleaning a substrate includes a carrier and a cleaning station. The carrier is capable of holding the substrate and is movably coupled to a pair of guide tracks extending a length of the system. The cleaning station includes a force applicator, a gate and a dispenser. The force applicator has an applicator length and is coupled to the cleaning station, is rotatable and is adjustable to a first height off the surface of the carrier during cleaning. The gate is a hollow structure disposed at a trailing edge of the force applicator. The gate is set to a height off the carrier surface that is less than or equal to the first height. The gate includes a gate length that at least spans the applicator length. The dispenser is disposed at a leading edge of the force applicator and is configured to supply cleaning solution during cleaning.

Abstract: In a processing block, a plurality of back surface cleaning units and a main robot are provided. The main robot is provided between the back surface cleaning units provided on one side of the processing block and the back surface cleaning units provided on the other side of the processing block. A reversing unit used to reverse a substrate and a substrate platform used to transfer and receive substrates between an indexer robot and the main robot are provided adjacent to each other in the vertical direction between the indexer robot and the processing block. The main robot transports substrates among the plurality of back surface cleaning units, the substrate platform, and the reversing unit.

Abstract: A coating film forming apparatus that holds a substrate upon a spin chuck and forms a coating film by supplying a chemical liquid upon a top surface of said substrate comprises: an outer cup provided detachably to surround the spin chuck; an inner cup provided detachably to surround a region underneath the substrate held upon the chuck; a cleaning nozzle configured to supply a cleaning liquid for cleaning a peripheral edge part of the substrate, such that the cleaning liquid is supplied to a peripheral part of a bottom surface of the substrate; a cutout part for nozzle mounting, the cutout part being provided to the inner cup to engage with the cleaning nozzle; and a cleaning liquid supply tube connected to the cleaning nozzle, the cleaning nozzle being detachable to the cutout part in a state in which the cleaning liquid supply tube is connected.

Abstract: An apparatus for cleaning wafers includes a chamber, a rotatable substrate holder inside the chamber, a nozzle above the rotatable substrate holder, a cover facing downward and fluidly coupled with the nozzle. The rotatable substrate holder is configured to mount one or more semiconductor wafers on the rotatable substrate holder. The nozzle is configured to spray a cleaning medium onto the one or more semiconductor wafers. The cover is of a shape having a top edge with a top cross-sectional area and a bottom edge with a bottom cross-sectional area.

Abstract: A substrate treatment apparatus includes: substrate holding unit which horizontally holds a substrate; a rotating unit which rotates the substrate held by the substrate holding unit about a vertical axis; and a first nozzle having a first opposing face to be opposed to a region of a lower surface of the substrate inward of a peripheral portion of the substrate in spaced relation to the lower surface of the substrate during rotation of the substrate by the rotating unit and a treatment liquid spout provided in the first opposing face for filling a space defined between the lower surface of the substrate and the first opposing face with a treatment liquid spouted from the treatment liquid spout to keep the space in a liquid filled state.

Abstract: A holding device including a first sucking section for sucking a wafer (substrate) from a side on which a dicing tape (supporting film) is adhered; a structure that supports a dicing frame (frame part) and covers a first region which (i) is on a surface of the dicing tape to which surface the wafer is not adhered and (ii) is between the wafer and the dicing frame; and a second sucking section for sealing a boundary between the structure and at least one of the dicing frame and the first region.

Abstract: Disclosed is a liquid processing apparatus and a liquid processing method, which can process an entire wafer at a sufficiently high temperature and can sufficiently suppress adhesion of particles on a surface of the wafer, when the peripheral portion of the wafer is processed. The liquid processing apparatus includes a holding part to hold the substrate, a rotation driving part to rotate the holding part, and a shield unit. The shield unit includes an opposed plate opposed to the substrate held by the holding part, a heating part to heat the substrate through the opposed plate, and a heated gas supplying part to supply heated gas to a surface of the substrate held by the holding part.

Abstract: An apparatus for cleaning and conditioning the surface of a semiconductor substrate such as wafer includes a rotatable chuck, a chamber, a rotatable tray for collecting cleaning solution with one or more drain outlets, multiple receptors for collecting multiple cleaning solutions, a first motor to drive chuck, and a second motor to drive the tray. The drain outlet in the tray can be positioned directly above its designated receptor located under the drain outlet. The cleaning solution collected by the tray can be guided into designated receptor. One characteristic of the apparatus is having a robust and precisely controlled cleaning solution recycle with minimum cross contamination.

Abstract: A liquid processing apparatus including: a second housing; a first housing capable of being brought into contact with the second housing; a holding part configured to hold an object to be processed; a rotation driving part configured to rotate the object to be processed held by the holding part; front-side process-liquid supply nozzle configured to supply a process liquid onto a peripheral portion of a front surface of the object to be processed held by the holding part; and a storage part disposed on a side of a rear surface of the object to be processed held by the holding part, the storage part being configured to store the process liquid having been passed through the object to be processed. The respective first housing and the second housing can be moved in one direction, so that the first housing and the second housing can be brought into contact and separated from each other.

Abstract: Apparatuses, and related methods, for processing a workpiece that include a particular barrier structure that can overlie and cover a workpiece. Apparatuses, and related methods, for processing a workpiece that include a particular movable member that can be positioned over and moved relative to a workpiece. Apparatuses, and related methods, for processing a workpiece that include a particular ceiling structure that can overlie a processing chamber. Nozzle devices, and related methods, that include a particular annular body. Nozzle devices, and related methods, that include a particular first, second, and third nozzle structure.

Abstract: A liquid processing apparatus including: a second housing; a first housing capable of being brought into contact with the second housing; a holding part configured to hold an object to be processed; a rotation driving part configured to rotate the object to be processed held by the holding part; front-side process-liquid supply nozzle configured to supply a process liquid onto a peripheral portion of a front surface of the object to be processed held by the holding part; and a storage part disposed on a side of a rear surface of the object to be processed held by the holding part, the storage part being configured to store the process liquid having been passed through the object to be processed. The respective first housing and the second housing can be moved in one direction, so that the first housing and the second housing can be brought into contact and separated from each other.