Abstract: A cleaning device includes a rotary platform and a cleaning assembly. The rotary platform is used for rotating a workpiece. The cleaning assembly faces the rotary platform and is used for spraying cleaning fluid on the workpiece for a period of time to clean the workpiece and then spraying drying gas on the workpiece to dry the workpiece during the rotary platform rotates the workpiece.

Abstract: According to one embodiment, a cleaning apparatus includes a removing unit whose tip portion is harder than a constituent material of a surface layer on a back surface side of a semiconductor wafer (wafer) and which is configured to clean a back surface of the wafer held by a holding unit and a moving mechanism that relatively moves the removing unit and the wafer in a direction parallel to the wafer back surface. The removing unit grinds and removes a protrusion that is formed of a material same as the surface layer of the wafer back surface, by the moving mechanism relatively moving the removing unit and the wafer and causing the tip portion of the removing unit to come into contact with the protrusion.

Abstract: Methods and apparatus for removing condensed metal from the surfaces of metal processing chambers, such as, a vacuum induction metal (VIM) furnaces having, for example, condensed Mg or Ti, are disclosed. The methods and apparatus provide a robotic arm end positioned in the furnace having a nozzle operatively connected to a source of dry ice. The robotic arm end directs a stream of dry ice particles against the surface of the furnace to displace condensed metal. The displaced metal is collected for reuse or disposal. Aspects of the invention provide a safe and automated process for cleaning process chambers and recovering metal that can typically be dangerous when performed by conventional methods.

Abstract: A substrate cleaning apparatus includes a substrate holding and rotating unit for holding a center of a rear surface of a substrate and rotating the substrate; a cleaning unit including a first cleaning member, a second cleaning member provided around the first cleaning member and a base to which the first and second cleaning members are secured; an elevating unit for moving the substrate holding and rotating unit and the cleaning unit relative to each other so as to allow the first and second cleaning members to come into contact with the rear surface of the substrate held by the substrate holding and rotating unit; and a driving unit for driving the substrate and the cleaning unit relative to each other in a direction along the rear surface of the substrate so as to allow part of the second cleaning member to be exposed to the outside of the substrate.

Abstract: A substrate holding rotating mechanism is used to hold and rotate a substrate to be processed. The substrate holding rotating mechanism according to the present invention includes at least three spindles, clamp rollers mounted respectively on the spindles for holding a periphery of a substrate, a rotating device for rotating at least one of the clamp rollers, at least one base member on which at least one of the spindles is installed, and a rotational mechanism adapted to allow the base member to be rotatable.

Abstract: A liquid treatment device having a rotatable substrate holding section (2) for horizontally holding a wafer (W), an annular-shaped rotation cup (4) which surrounds the wafer (W) which rotates with the wafer (W), a rotation mechanism (3) for integrally rotating the rotation cup (4) and the substrate holding section (2), a nozzle (5) for supplying a treatment liquid for the wafer (W) at a treatment position and a cleaning liquid for the rotation cup (4) at its external surface, a liquid supply section (85) for the nozzle (5), and a nozzle movement mechanism for moving the nozzle (5) between the wafer treatment position and the external portion of the rotation cup (4).

Abstract: A device for treating a disc-like article with a fluid, includes elements for dispensing a fluid onto the article and a chuck for holding and rotating the article around an axis perpendicular thereto. The chuck includes a base body, a drive ring, and gripping members for contacting the article at its edge. The gripping members are eccentrically movable with respect to the center of the article. The eccentric movement of the gripping members is driven by a drive ring rotatably mounted to the base body, so that the drive ring is rotatable against the base body around the axis. The relative rotational movement of the drive ring against the base body is carried out by either holding the base body and rotating the drive ring or by holding the drive ring and rotating the base body, whereby the to-be-held-part (drive ring or base body) is held without touching the respective to-be-held-part by magnetic force.

Abstract: A substrate cleaning device and a substrate cleaning method reduces liquid drops remaining on a substrate to prevent the irregular heating of the substrate by a heating process due to liquid drops or water marks remaining on the substrate. A cleaning liquid is poured through a cleaning liquid pouring nozzle onto the surface of a substrate such that a region onto which the cleaning liquid is poured moves from a central part toward the circumference of the substrate. A gas is jetted radially outward at a region on the surface of the substrate behind a region onto which the cleaning liquid is poured with respect to the rotating direction of the substrate. The gas forces a liquid film of the cleaning liquid flowing on the surface of the substrate to flow in a circumferential direction and a radially outward direction.

Abstract: A substrate treatment apparatus includes a container holder which holds a container for containing multiple substrates vertically stacked in horizontal postures, a substrate treatment section which collectively applies treatment to multiple substrates horizontally stacked in vertical postures, a main conveyance mechanism which conveys multiple substrates horizontally stacked in vertical postures between a substrate delivery position and the substrate treatment section, a carrying in/out mechanism which carries in/out the multiple substrates with respect to the container and changes postures of the multiple substrates between the horizontal postures and the vertical postures, and a sub conveyance mechanism which receives and delivers multiple substrates in vertical postures from and to the carrying in/out mechanism at a transfer position, receives and delivers multiple substrates in vertical postures from and to the main conveyance mechanism at the substrate delivery position, and conveys multiple substrates i

Abstract: A substrate treatment apparatus includes: substrate holding unit which horizontally holds a substrate; a rotating unit which rotates the substrate held by the substrate holding unit about a vertical axis; and a first nozzle having a first opposing face to be opposed to a region of a lower surface of the substrate inward of a peripheral portion of the substrate in spaced relation to the lower surface of the substrate during rotation of the substrate by the rotating unit and a treatment liquid spout provided in the first opposing face for filling a space defined between the lower surface of the substrate and the first opposing face with a treatment liquid spouted from the treatment liquid spout to keep the space in a liquid filled state.

Abstract: A device has a housing with a spindle installed therein. A carrier can be rotated around this spindle while moving along it. There are two nozzles installed in the cylinder wall of the device, which nozzles comprise a connecting piece to which a water hose can be connected. For having the water jet rotate a carrier-mounted filter the nozzle openings seen in axial direction of the spindle, are directed at the filter beside the spindle.

Abstract: A fluid dispenser for use in the processing of substrates. The dispenser has a dome shaped body with a convex upper surface and has a number of conduits designed to supply fluid to the surface of a substrate at predetermined points.

Abstract: A wafer spin chuck and an etcher using the same are provided. According to an aspect of the present invention, there is provide a wafer spin chuck device comprising: a spin body which spins a wafer; and a stationary body which holds the spin body and is under the spin body with a space between the spin body and the stationary body, wherein the stationary body includes a blocking unit which blocks the space with a fluid.

Abstract: In one embodiment, a cleaning apparatus, including, supporting bodies supporting and rotating a substrate, each of a first and a second cleaning member, having a circular shape and rotating around a rotational symmetry axis, periphery portions of the cleaning members being able to contact to opposed surfaces of the substrate, each of a first brush-cleaning member and a second brush-cleaning member having a groove with a V-shape cross section being widened upwards, a brush with a cleaning function being formed on a slope plane of the groove, the cleaning members being able to shift to contact to the slope planes, respectively, first cleaning solution supply portions supplying a first cleaning solution dispersed resin particles to the surfaces, and second cleaning solution supply portions supplying a second cleaning solution to peripheries of the cleaning members and which are arranged to contact to the slope planes, respectively.

Abstract: A substrate holding rotating mechanism is used to hold and rotate a substrate to be processed. The substrate holding rotating mechanism according to the present invention includes at least three spindles, clamp rollers mounted respectively on the spindles for holding a periphery of a substrate, a rotating device for rotating at least one of the clamp rollers, at least one base member on which at least one of the spindles is installed, and a rotational mechanism adapted to allow the base member to be rotatable.

Abstract: At a vibration applying position, ultrasonic vibration is applied upon a liquid film which is on a surface of a substrate. Concurrently with this, at a drop arrival position which is different from the vibration applying position, drops of a cleaning liquid are supplied to the liquid film, whereby wave-generating vibration which is different from the ultrasonic vibration is applied upon the liquid film. This dramatically improves removal of particles adhering to the surface of the substrate as compared with mere application of ultrasonic vibration. Hence, even when the output, the frequency and the like of the ultrasonic vibration are set to such an extent not damaging the substrate, it is possible to effectively remove particles with the wave-generating vibration and favorably clean the surface of the substrate.

Abstract: An apparatus for cleaning and conditioning the surface of a semiconductor substrate such as wafer includes a rotatable chuck, a chamber, a rotatable tray for collecting cleaning solution with one or more drain outlets, multiple receptors for collecting multiple cleaning solutions, a first motor to drive chuck, and a second motor to drive the tray. The drain outlet in the tray can be positioned directly above its designated receptor located under the drain outlet. The cleaning solution collected by the tray can be guided into designated receptor. One characteristic of the apparatus is having a robust and precisely controlled cleaning solution recycle with minimum cross contamination.

Abstract: A substrate holding rotating mechanism is used to hold and rotate a substrate to be processed. The substrate holding rotating mechanism according to the present invention includes at least three spindles, clamp rollers mounted respectively on the spindles for holding a periphery of a substrate, a rotating device for rotating at least one of the clamp rollers, at least one base member on which at least one of the spindles is installed, and a rotational mechanism adapted to allow the base member to be rotatable.

Abstract: An apparatus used to supply a force onto a cleaning solution for processing a substrate for cleaning surface contaminants is disclosed. The apparatus includes a force applicator and a gate. The force applicator is configured to be adjusted to a first height off the surface of the substrate. The gate is positioned adjacent to a trailing point of the force applicator and is configured to be adjusted to a second height off of the surface of the substrate to enable planarization of the cleaning solution as the solution moves to the trailing point.

Abstract: A semiconductor wafer treating apparatus comprising a housing, holding means rotatably disposed within the housing, rotating means for rotating the holding means, and cleaning means for cleaning a semiconductor wafer held on the holding means. Irradiation means for irradiating the semiconductor wafer held on the holding means with short wavelength ultraviolet radiation is further disposed in the semiconductor wafer treating apparatus.

Abstract: A liquid processing apparatus comprises: a second housing 20; a first housing 10 capable of being brought into contact with the second housing 20; a holding part 1 configured to hold an object to be processed W; a rotation driving part 60 configured to rotate the object to be processed W held by the holding part 1; front-side process-liquid supply nozzles 51a and 52a configured to supply a process liquid onto a peripheral portion of a front surface of the object to be processed W held by the holding part 1; and a storage part 23 disposed on a side of a rear surface of the object to be processed W held by the holding part 1, the storage part 23 being configured to store the process liquid having been passed through the object to be processed W. The respective first housing 10 and the second housing 20 can be moved in one direction, so that the first housing 10 and the second housing 20 can be brought into contact with each other and separated apart from each other.

Abstract: Disclosed is a liquid processing apparatus and a liquid processing method, which can process an entire wafer at a sufficiently high temperature and can sufficiently suppress adhesion of particles on a surface of the wafer, when the peripheral portion of the wafer is processed. The liquid processing apparatus includes a holding part to hold the substrate, a rotation driving part to rotate the holding part, and a shield unit. The shield unit includes an opposed plate opposed to the substrate held by the holding part, a heating part to heat the substrate through the opposed plate, and a heated gas supplying part to supply heated gas to a surface of the substrate held by the holding part.

Abstract: An etching/cleaning apparatus is provided, which makes it possible to effectively remove an unnecessary material or materials existing on a semiconductor wafer without damaging the device area with good controllability. The apparatus comprises (a) a rotating means for holding a semiconductor wafer and for rotating the wafer in a horizontal plane; the wafer having a device area and a surface peripheral area on its surface; the surface peripheral area being located outside the device area; and (b) an edge nozzle for emitting an etching/cleaning liquid toward a surface peripheral area of the wafer. The etching/cleaning liquid emitted from the edge nozzle selectively removes an unnecessary material existing in the surface peripheral area.

Abstract: A substrate liquid cleaning process is disclosed by utilizing a substrate liquid processing apparatus having, inter alia, a rotating mechanism that rotates a substrate to be cleaned, a peripheral edge cleaning mechanism that cleans the peripheral edge of the substrate by a rotating cleaning body, and a cleaning solution supply mechanism that supplies the cleaning solution to the substrate. The substrate liquid cleaning process is performed by contacting the rotating cleaning body to a peripheral edge of a rotating substrate while supplying a cleaning solution. The rotational direction of the substrate and the cleaning body is set to be an opposite direction so that the proceeding direction of the substrate and the cleaning body becomes the same at a contacting portion where the substrate and the cleaning body are contacted. A rotational speed ratio of the substrate and the cleaning body is set to be about 1:1˜3.5:1.

Abstract: A reusable filter cartridge having a symmetrical structure, the reusable filter cartridge comprising a tubular outer pipe having perforations arranged therein. A tubular inner pipe having perforations is arranged therein, and has a smaller diameter than the diameter of the outer pipe such that an annulus is formed between the outer and inner pipes. A filtering media is disposed in the annulus between the outer and inner pipes. A first and second lid is provided, each being secured at opposite ends of the outer and inner pipes; one of the lids having a central opening therein for water to flow out of or into the inner pipe. The reusable filter cartridge further comprises a coupling arrangement for coupling the filter cartridge with a rotating element of a cleaning device so that the filter media can be cleaned by rotation of the filter cartridge around its axis inside the cleaning device.

Abstract: A pad washing system is provided. This system includes a filter device that further includes: a filter component having a textured top surface and at least one baffle formed on the underside thereof; a filter support apparatus adapted to receive the filter device, wherein the filter support apparatus further includes: a base, a plurality of vertical support columns formed integrally with the base, a plurality of caps mounted on top of the vertical columns, and a plurality of biasing members disposed between the caps and the tops of the vertical columns; a bucket for receiving both the filter device and the filter support apparatus; a threaded rim attached to or formed integrally with the top edge the bucket; and a splash guard mountable within the threaded rim.

Abstract: A roller cover cleaning system comprises a handle and a roller cover frame. The handle comprises a gripping portion, an attachment member, a connecting member, and an axle extending from the attachment member. The roller cover frame engages the axle such that the roller cover frame is able to rotate freely about the axle. An alternate roller cover cleaning system comprises a frame, a first roller, a second roller, and a driving feature. The first roller is positioned between a first end plate and a second end plate of the frame and is configured to freely rotate about its longitudinal central axis. The second roller is positioned between the first end plate and the second end plate and is configured to freely rotate about its longitudinal central axis. The driving feature is configured to be in mechanical communication with at least one of the first roller or the second roller.

Abstract: A wash cylinder or chamber for an automated cleaning station to clean an object or a person's body part includes nozzles on the interior of the cylinder, the nozzles of one embodiment comprising an increasing roll angle providing a novel spray pattern. Additionally, embodiments of the invention include fluid guidance and conveyance structures, angled nozzles, sealing structures, finger guards, nozzle ribs, wash chamber seating mechanisms and drains, and nozzle inlays having a plurality of nozzles. Also disclosed are methods of washing an object or body part using a wash cylinder or chamber and methods of assembling a wash cylinder or chamber.

Abstract: Disclosed is an apparatus for wet treatment of a disc-like article, which comprises: a spin chuck for holding and rotating the disc-like article, and an inner edge nozzle dispensing treatment liquid directed towards a first peripheral region of the first surface of the disc-like article, wherein the first surface is facing the spin chuck and the first peripheral region is defined as being a region of the first surface with an inner radius (ri), which is greater than 1 cm less than the disc-like article's radius (ra), wherein the inner edge nozzle is positioned in a stationary manner between the disc-like article (when placed on the spin chuck) and the spin chuck, wherein the inner edge nozzle is feed through a central pipe, which is disposed in a stationary manner and penetrates centrally through the spin chuck, for supplying a treatment liquid against a first surface of the disc-like article.

Abstract: A substrate treatment apparatus, which treats a substrate with a treatment liquid that is ultrasonically vibrated, includes an oscillator body which is rectangular-parallelepiped and has a treatment liquid supply path having an opening on a lower surface thereof in a first end portion in a longitudinal direction thereof and inclining to a second end portion in the longitudinal direction thereof, a vibrator which is provided on an upper surface of the oscillator body and ultrasonically vibrates the oscillator, and a heat exchanger which cools the treatment liquid supplied to the treatment liquid supply path.

Abstract: A painting apparatus comprising a paint module, an applicator assembly having an applicator surface, and a pump, the paint module having a container receiving section, the applicator assembly being fluidly connectable to the container receiving section such that the pump can supply liquid contained in the container receiving section to the applicator assembly, in which the apparatus can operate in a painting cycle where the container receiving section receives a paint container with a supply of paint such that the paint can be supplied to the applicator assembly, and in a cleaning cycle where the container receiving section receives a liquid in the form of a cleaning fluid, such that the cleaning fluid can be supplied to the applicator assembly (FIG. 1).

Abstract: A wash cylinder or chamber for an automated cleaning station to clean an object or a person's body part includes nozzles on the interior of the cylinder, the nozzles of one embodiment comprising an increasing roll angle providing a novel spray pattern. Additionally, embodiments of the invention include fluid guidance and conveyance structures, angled nozzles, sealing structures, finger guards, nozzle ribs, wash chamber seating mechanisms and drains, and nozzle inlays having a plurality of nozzles. Also disclosed are methods of washing an object or body part using a wash cylinder or chamber and methods of assembling a wash cylinder or chamber.

Abstract: A liquid processing apparatus includes: a hollow holding plate to hold an object to be processed; a hollow outer rotary shaft fixedly joined to the holding plate; a lift pin plate having a lift pin to support the object; an inner rotary shaft fixedly joined to the lift pin plate; and a lifting member to raise and lower the lift pin plate to locate the lift pin plate on an upper position and a lower position. Inside the inner rotary shaft, there is disposed a cleaning-liquid supply part to supply a cleaning liquid to the object to be processed. An outer rotary drive part is joined to the outer rotary shaft, the outer rotary drive part being configured to rotate the outer rotary shaft. An inner rotary drive part is joined to the inner rotary shaft, the inner rotary drive part being configured to rotate the inner rotary shaft.

Abstract: A device for liquid treatment of a defined area of a wafer-shaped article, especially of a wafer, near the edge, in which the liquid is applied to a first surface, flows essentially radially to the outside to the peripheral-side edge of the wafer-shaped article and around this edge onto the second surface, the liquid wetting a defined section near the edge on the second surface and thereupon being removed from the wafer-shaped article.

Abstract: Provided is a spin head supporting a substrate and rotating the substrate. The spin head includes a body, chuck pins installed on the body and moving between supporting positions where a substrate is supported and waiting positions providing space for loading/unloading of the substrate, and a chuck pin moving unit configured to move the chuck pins. The chuck pin moving unit includes a rotation rod coupled with each of the chuck pins, a pivot pin fixing the rotation rod to the body, and a driving member rotating the rotation rod about the pivot pin as a rotation shaft to move the chuck pin from the supporting position to the waiting position. When the body rotates, the rotation rod uses reverse centrifugal force to apply force to the chuck pin from the waiting position to the supporting position. The chuck pins include first pins and second pins that alternately chuck a substrate during a process.

Abstract: A component recovery system, configured to refurbish components, includes a fluid feed tank, a refurbishment compartment having a fluid delivery element, a waste tank, fluid lines connecting the fluid feed tank to the fluid delivery element and the refurbishment compartment to the waste tank, and pumps for delivering fluid through the fluid lines. The component recovery system removes field contaminants, coatings and bonding compounds from components.

Abstract: A liquid processing apparatus includes: a hollow holding plate configured to hold an object to be processed; a hollow outer rotational shaft fixedly connected to the holding plate; a rotary drive part configured to rotate the outer rotational shaft; and a lift pin plate disposed in a hollow space of the holding plate, and having a lift pin configured to support the object to be processed. Inside the lift pin plate, a cleaning-liquid supply part configured to supply a cleaning liquid is extended. Connected to the lift pin plate is a lifting member configured to locate the lift pin plate on an upper position and a lower position. When located on the lower position, the lift pin plate receives a force of the rotary drive part for rotating the outer rotational shaft so that the lift pin plate is rotated.

Abstract: The substrate processing apparatus according to the present invention includes: a substrate rotating mechanism holding a substrate in a horizontal attitude and rotating the substrate around an axis passing through the center of the substrate; a processing liquid supply mechanism supplying a processing liquid to a central portion of the upper surface of the substrate rotated by the substrate rotating mechanism; a counter member arranged to be opposed to the upper surface of the substrate rotated by the substrate rotating mechanism; and a liquid film extending mechanism moving the counter member from a position opposed to the central portion of the substrate to a position opposed to a peripheral edge portion of the substrate in parallel with the supply of the processing liquid by the processing liquid supply mechanism and extending a liquid film of the processing liquid covering the central portion of the substrate toward the peripheral edge of the substrate due to the movement.

Abstract: A wash cylinder or chamber for an automated cleaning station to clean an object or a person's body part includes nozzles on the interior of the cylinder, the nozzles of one embodiment comprising an increasing roll angle providing a novel spray pattern. Additionally, embodiments of the invention include fluid guidance and conveyance structures, angled nozzles, sealing structures, finger guards, nozzle ribs, wash chamber seating mechanisms and drains, and nozzle inlays having a plurality of nozzles. Also disclosed are methods of washing an object or body part using a wash cylinder or chamber and methods of assembling a wash cylinder or chamber.

Abstract: A substrate cleaning apparatus includes a supporting plate supporting a substrate and a shielding unit that is disposed above the substrate to protect the substrate. A portion of the shielding unit, which is adjacent to a focal point where light for generating shock waves is focused, is switched. Therefore, the substrate cleaning apparatus prevents the concentration of plumes and residence beams, which are generated together with the shock waves, on a specific region of the shielding unit and further prevents the recontamination of the substrate by the damage of the shielding unit.

Abstract: A processing method of a semiconductor wafer is provided. The method comprising the steps of: removing at least part of oxide film from a surface of the semiconductor wafer; removing liquid from the surface; and providing at least partial oxide film on the surface by applying an oxidizing gas wherein a gas flow of the oxidizing gas and/or an ambient gas involved by the oxidizing gas is characterized by an unsaturated vapor pressure of the liquid such that the liquid on the surface vaporizes. The above-described steps are conducted in this order.

Abstract: A wash cylinder or chamber for an automated cleaning station to clean an object or a person's body part includes nozzles on the interior of the cylinder, the nozzles of one embodiment comprising an increasing roll angle providing a novel spray pattern. Additionally, embodiments of the invention include fluid guidance and conveyance structures, angled nozzles, sealing structures, finger guards, nozzle ribs, wash chamber seating mechanisms and drains, and nozzle inlays having a plurality of nozzles. Also disclosed are methods of washing an object or body part using a wash cylinder or chamber and methods of assembling a wash cylinder or chamber.

Abstract: A wash cylinder or chamber for an automated cleaning station to clean an object or a person's body part includes nozzles on the interior of the cylinder, the nozzles of one embodiment comprising an increasing roll angle providing a novel spray pattern. Additionally, embodiments of the invention include fluid guidance and conveyance structures, angled nozzles, sealing structures, finger guards, nozzle ribs, wash chamber seating mechanisms and drains, and nozzle inlays having a plurality of nozzles. Also disclosed are methods of washing an object or body part using a wash cylinder or chamber and methods of assembling a wash cylinder or chamber.

Abstract: An endoscope cleaner includes a cleaning chamber for containing an endoscope. A vibration plate is disposed in a lower portion of the cleaning chamber. A basket portion is disposed substantially at a center of the vibration plate, for containing small parts removed from the endoscope. A nozzle opening supplies cleaning fluid into the cleaning chamber through the basket portion. Plural ultrasonic vibrators include at least one disposed under the basket portion, for vibrating the vibration plate. Furthermore, a drain port drains the cleaning fluid. A circulation line circulates the cleaning fluid from the cleaning chamber by use of the nozzle opening and the drain port. A disinfectant nozzle ejects disinfectant to disinfect the endoscope and the small parts. The basket portion has an upwards open shape, and prevents the small parts from scattering in vibration. The small parts are plural button parts or cap parts.

Abstract: An apparatus and method are disclosed in which a semiconductor substrate having a surface containing contaminants is cleaned or otherwise subjected to chemical treatment using a foam. The semiconductor wafer is supported either on a stiff support (or a layer of foam) and foam is provided on the opposite surface of the semiconductor wafer while the semiconductor wafer is supported. The foam contacting the semiconductor wafer is pressurized using a form to produce a jammed foam. Relative movement between the form and the semiconductor wafer, such as oscillation parallel and/or perpendicular to the top surface of the semiconductor wafer, is then induced while the jammed foam is in contact with the semiconductor wafer to remove the undesired contaminants and/or otherwise chemically treat the surface of the semiconductor wafer using the foam.

Abstract: A system for megasonic processing of an article. In one aspect, the system for megasonic processing comprises a rotary support for supporting an article, a dispenser for applying a fluid to a surface of an article positioned on the rotary support; and a transducer assembly. The transducer assembly comprises (i) a transmitter positioned adjacent to the article on the rotary support so that when the fluid is applied to the surface of the article via the dispenser, a meniscus of the fluid is formed between a portion of the transmitter and the surface of the article and (ii) not more than one transducer coupled to the transmitter, the transducer adapted to oscillate at a frequency for propagating megasonic energy through the transmitter and into the meniscus of the fluid.

Abstract: When a substrate is subjected to bevel cleaning processing, a first magnet plate is arranged at a lower position, and a second magnet plate is arranged at an upper position. In this case, each of chuck pins enters a closed state in a region outside the first magnet plate, while entering an opened state in a region outside the second magnet plate. That is, a holder in each of the chuck pins is maintained in contact with an outer edge of the substrate when it passes through the region outside the first magnet plate, while being spaced apart from the outer edge of the substrate when it passes through the region outside the second magnet plate.

Abstract: An apparatus for processing a peripheral portion of a substrate includes a housing and a spin chuck mounted within the housing and configured to support the substrate in a substantially horizontal orientation. The apparatus also includes a fluid dispense nozzle coupled to the housing and proximate to the peripheral portion of the substrate. The fluid dispense nozzle is in fluid communication with a source of a chemical and configured to direct a flow of the chemical to the peripheral portion of the substrate located at a first radial distance from a center of the substrate. The apparatus further includes a light guide optically coupled to a laser source. The light guide is configured to direct radiation to the peripheral portion of the substrate located at a second radial distance from the center of the substrate greater than the first radial distance.

Abstract: In an embodiment, a spinning apparatus includes a spin table on which an object to be etched is placed, a rotation unit rotating the spin table, and a nozzle unit including a center nozzle, disposed on the central portion of the spin table, and at least one side nozzle, disposed on an edge of the spin table. Etching uniformity is improved over the conventional art because an etching chemical is distributed more evenly by the nozzle unit as the object to be etched is rotated. An embodiment may also include an exhaust to remove excess etching chemical.

Abstract: Provided is a spin head for supporting a substrate. The spin head includes a rotatable body, and chuck pins protruding upward from the body and configured to support an edge of a substrate placed at the body when the body is rotated. Each of the chuck pins includes a vertical rod vertically disposed at the body, and a support rod extending from a side of the vertical rod and configured to make contact with the edge of the substrate placed at the body when the body is rotated. When the substrate is rotated, the vertical rod is spaced apart from the edge of the substrate. The contact portion includes a streamlined side surface. The support rod includes a contact portion. The contact portion tapers toward the end of the support rod when viewed from the top of the support rod.