Abstract: A spin chuck for wafer processing includes: a rotary unit having a top surface adapted to receive and rotate a wafer; a plurality of wafer gripping units mounted on the rotary unit; a set of first gripping members; and a set of second gripping members. Each of the wafer gripping units has at least one of a first gripping member and a second gripping member that are configured to engage a wafer. The wafer gripping units are movable between first and second gripping positions, wherein in the first gripping position, the first gripping members are positioned to engage a wafer received on the rotary unit and the second gripping members are spaced apart from the wafer, and in the second gripping position, the second gripping members are positioned to engage the wafer, and the first gripping members are spaced apart from the wafer.

Abstract: A chuck assembly for holding a sample includes a shaft; a generally circular chuck member, the shaft extending from a first surface of the chuck member; and a sample holder associated with a second surface of the chuck member. The second surface is opposite the first surface. A sample receiving assembly holds the sample on the sample holder so that the sample remains fixed to the sample holder when the shaft rotates and causes the chuck member and the sample holder to rotate with the shaft. The chuck assembly may be used in a reactor assembly including a reactor chamber for receiving the chuck assembly; a spindle assembly for receiving an end of the shaft distal from the chuck member; and a motor for rotating the spindle assembly and the shaft so that fluid in the chamber flows generally along the shaft in a first direction and through the openings in the chuck member, around the sample holder, and then along a wall of the chamber in a second direction generally opposite to the first direction.

Abstract: A cleaning apparatus includes (1) a pressure tank with at least one cleaning tank arranged therein; (2) means for supplying the cleaning apparatus with a cleaning fluid; and (3) means inside the pressure tank for setting the at least one cleaning tank in motion, wherein by these means the at least one cleaning tank is movably arranged relative to the pressure tank in terms of at least one of rotational or translational movement.

Abstract: An apparatus and method for cleaning a roller cover of the type used to apply a coating material is disclosed. In one embodiment the apparatus includes a body, at least one roller cover engaging element for positioning at least partially within the interior area of a roller cover and engaging the roller cover, and a drive adaptor associated with the body for effectuating rotation of the roller cover engaging element, and thus a roller cover connected thereto, with a drive. In one embodiment, the drive adaptor comprises a shaft connected to the body of the apparatus and extending therefrom, the shaft adapted to be rotated by a drive.

Abstract: Provided is a wafer rotary holding apparatus by which a reduced pressure is created on an upper surface of a rotary disk by a simple and easy-to-make mechanism with no need of any of a vacuum source apparatus, a compressed air supply apparatus, a compressed gas supply apparatus and other apparatuses in use; a wafer can be held while rotating with no contact to a rear surface thereof; a degree of pressure reduction can be adjusted with ease and even a thin wafer (of 0.1 mm or less in thickness) can be held while rotating with no deformation; and the wafer with a bowing can be held while rotating with no correction of the bowing. A wafer rotary holding apparatus includes: a rotary disk on which a fluid flow path is formed; a through hole formed in a central section of the rotary disk; and a plurality of wafer rests provided on an upper surface of the rotary disk.

Abstract: A system for processing a workpiece includes a head attached to a head lifter. A workpiece is supported in the head between an upper rotor and a lower rotor. A base has a bowl for containing a liquid. The head is movable by the head lifter from a first position vertically above the bowl, to a second position where the workpiece is at least partially positioned in the bowl. The bowl has a contour section with a sidewall having a radius of curvature which increases adjacent to a drain outlet in the bowl, to help rapid draining of liquid from the bowl. The head has a load position, where the rotors are spaced apart by a first amount, and a process position, where the rotors are engaged and sealed against each other. For rapid evacuation of fluid, the head also has a fast drain position, where the rotors are moved apart sufficiently to create an annular drain gap.

Abstract: A Ferris wheel-like stripping or cleaning mechanism that can be used in semiconductor fabrication, such as in photoresist or other stripping, or wafer or other cleaning, is disclosed. A stripping mechanism can include a container to hold a chemical, such as a photoresist stripping chemical, a wafer cleaning chemical, or another type of chemical. The mechanism can also include a component to move semiconductor wafers through the chemical in the container in a Ferris wheel-like motion. The component may include wafer holders for the wafers that are swivably mounted about an axis of rotation. As the one or more wafer holders rotate about the axis of rotation through the chemical in the container, the wafer holders remain in a substantially constant vertical and horizontal orientation.

Abstract: An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location. The fluid flows outwardly uniformly and in all directions. A wafer support automatically lifts the wafer, so that it can be removed from the reactor by a robot, when the rotors separate from each other after processing.

Abstract: A nozzle assembly includes a connector tube having a first end and a second end. An outer surface of the connector tube is threaded. A first cap having an opening therethrough is threaded onto the first end of the connector tube. A second cap having an opening therethrough is threaded onto the second end of the connector tube. Each of the first and second caps has a top surface and a threaded inner surface. The nozzle assembly further includes a nozzle having a tubular portion defining a channel. The tubular portion is disposed in the opening of the first connector cap so that a position of the nozzle can be axially and rotationally adjusted. A spin, rinse, and dry station including the adjustable nozzle assembly and a method for spin rinsing the bottom side, i.e., the backside, of a semiconductor wafer also are described.

Abstract: A substrate processing apparatus includes a container in which a heating plate, a discharge nozzle for discharging a vapor of organic solvent, and a discharge nozzle for supplying a process gas and a cooling gas are provided. A pump in communication with an exhaust outlet of the container exhausts an atmosphere from the container to reduce pressure in the container. Therefore, the substrate processing apparatus is capable of performing (1) the process of drying a substrate in a reduced-pressure atmosphere by the use of the vapor of organic solvent, and (2) the process of drying the substrate in the reduced-pressure atmosphere by heating, to thereby efficiently dry the substrate.

Abstract: A liquid waste disposal and canister flushing system for a medical canister including a press-fit canister lid, features a cabinet with an opening and a sink with a drain positioned therein. A mounting bracket is affixed to the cabinet and includes a shaft connected to the canister bracket for rotating the canister and a shaft connected to the lid removal bracket for removing the canister lid from the canister. The canister is secured within the canister bracket and is rotated from an initial position to a drainage position. The canister lid is positioned on the removal bracket and is rotated from an initial position to a removal position. Once the canister is rotated into the drainage position, the pressurized and diluted cleaning solution source is activated to flush the contents out of the canister and into the sink and drain. After the canister is sanitized it may be removed from the system and reused.

Abstract: A method for performing the edge clean operation on a semiconductor wafer. A laser beam is used to accurately clean the edge of the wafer. The wafer is clamped concentrically to a chuck and rotated at a selectable speed, preferably in the range of 10 rpm to 1,000 rpm. A laser beam of variable power is directed onto toward the edge of the wafer at an oblique angle through a nozzle through which an inert purge gas is simultaneously passed. The laser beam removes unwanted deposits at the edge of the wafer and the gas is used to blow away the residue and prevent slag buildup on other parts of the wafer. The process is preferably carried out in an exhausted chamber.

Abstract: In a first aspect, a first apparatus is provided. The first apparatus includes (1) a tank adapted to contain fluid; (2) at least one support component mounted in the tank and adapted to support a substrate in a supported position at least partially submerged in the fluid; (3) a transducer adapted to output sonic energy into the fluid; and (4) a reflector positioned at a side of the substrate and adapted to reflect the sonic energy toward an edge of the substrate so as to provide a 100% duty cycle. The reflector is positioned such that the reflector does not obstruct a path employed to load the substrate into the supported position and to unload the substrate from the supported position. Numerous other aspects are provided.

Abstract: The present invention provides a method of cleaning a wafer. The method comprises suspending the wafer beneath a vacuum chuck. The vacuum chuck contains an acoustic wave emitter. The acoustic wave emitter is positioned within the vacuum chuck to prevent the acoustic wave emitter from contacting the surface of the wafer. The method further comprises applying acoustic waves to the wafer.

Abstract: An edge roller assembly includes first and second grip rings. The grip rings are held together in an opposing relationship such that outer surfaces thereof define a groove for receiving an edge of a substrate. The grip rings may be O-rings formed of a rubber material. In one embodiment, the grip rings are held together by lower and upper clamp plates that are adjustably fastened together so that the clamping forces exerted on the substrate can be controlled. The upper clamp plate may have a height adjustment knob for adjusting the height of the edge roller assembly mounted thereon. A method for contacting an edge of a substrate and a transport system for transporting semiconductor wafers to a wafer processing station also are described.

Abstract: A stripping solution is supplied onto the surface of a substrate and an alternating magnetic flux is applied to the substrate. The alternating magnetic flux induces a current in a conductive pattern of the substrate which heats the conductive pattern while the stripping solution is in contact with the substrate. The stripping solution, containing particles to be cleaned off the substrate, is then removed from the substrate.

Abstract: An apparatus continuously supplies an acid solution to a central portion of a surface of a substrate while the substrate is rotating, and also supplies an oxidizing agent solution continuously or intermittently to a periphery of the substrate. In addition, the apparatus supplies an oxidizing agent solution and an acid solution either simultaneously or alternately to a reverse side of the substrate.

Abstract: The spindle assembly is self-centered on the end of the cylindrically shaped cartridge filter by a three-point grip on the perimeter. A similar spindle assembly is attached to the other end of the cartridge filter such that its axis of rotation is the same as the axis of rotation for the first spindle assembly. The tip of one spindle assembly is rested on the ground while the tip of the other spindle assembly is held by a user's hand. A pressurized stream of air or water is directed at the cartridge filter with the user's other hand such that the stream causes the whole to rotate. The speed of rotation is brought high enough to fling debris from the filter and thus clean it.

Abstract: The apparatus of the invention comprises a sealable working chamber that contains an object holder, in which the object can be maintained during treatment in a moveable floating state, e.g., during a cleaning cycle for access of the cleaning fluid to both upper and lower surfaces of the object without contact of the object edges with jaws of the clamping mechanism. For this purpose, liquid vortex-generation means are formed in the object holder. According to one embodiment, the liquid vortex-generation means comprise a number of openings formed under the lower surface of the object placed into a recess formed in the object holder. Each vortex generation opening is substantially perpendicular to the plane of the object and contains one or a plurality of nozzles arranged tangentially to the wall of the opening so that a vortex is generated in each opening when the liquid is ejected through the nozzles into the opening for further delivery to the recess.

Abstract: Embodiments of the invention are directed to substrate processing apparatuses and methods for processing substrates. In one embodiment, a substrate processing apparatus includes a processing chamber, a substrate holder inside of the processing chamber for holding a substrate, and a sonic box in the processing chamber for supplying sonic waves substantially perpendicularly to the substrate. The sonic box may comprises a membrane, and a transducer coupled to the membrane.

Abstract: A cleaning apparatus for a lens defining opposed top and bottom surfaces and a peripheral edge. The cleaning apparatus comprises a rotatable base having a plurality of arms pivotally connected thereto and rotatable therewith. The arms are configured to releasably engage the peripheral edge of the lens. The cleaning apparatus further comprises a means for propelling a heated medium towards at least one of the top and bottom surfaces of the lens while the lens is being spun by the rotation of the base and the arms.

Abstract: A workpiece holder for processing a workpiece in a chamber of a liquified fluid. In one embodiment, the workpiece holder includes a cylindrically shaped rotator having an exterior wall and at least one fluid guide on the exterior wall. The rotator is adapted to rotate and provide fluid flow across a first end of the rotator, and is adapted to provide fluid flow and mixing perpendicular to a surface of the first end of the rotator. A fixture is coupled to the first end of the rotator for securing the workpiece to the first end of the rotator.

Abstract: A system and method for cleaning boxes used for handling flat media includes a rotor rotatably mounted within an enclosure, with spray nozzles in the enclosure for spraying fluid toward the rotor. The rotor has at least one box holder assembly for holding a box. At least one retainer bar is located on the rotor for engaging a front section of the box to retain the box in the box holder assembly during rotation of the rotor. The retainer bar is preferably moveable from a first position where the retainer bar restrains the box on the box holder assembly, to a second position where the retainer bar is moved away from the box. The box holder assembly may alternatively include a base with a plurality of grooved elements thereon that are adapted to engage a flange on the box for securing the box to the box holder assembly.

Abstract: An apparatus and method for cleaning surfaces of semiconductor wafers utilizes streams of gaseous material ejected from a gas nozzle structure to create depressions on or holes through a boundary layer of cleaning fluid formed on a semiconductor wafer surface to increase the amount of gaseous material that reaches the wafer surface through the boundary layer.

Abstract: An apparatus for cleaning re-usable filters, the re-usable filter having an axis, the apparatus. The apparatus includes a source of cleaning fluid; a receptacle for dirty cleaning fluid; a mount for holding the re-usable filter, the mount spinning about the filter's axis; a nozzle for directing a spray of cleaning fluid against the filter; a pump for delivering cleaning fluid from the source of cleaning fluid to the nozzle; and a cover for enclosing the apparatus.

Abstract: A method and apparatus for transferring a wet object, such as a contact lens comprising a probe having a passage for at least one vacuum source, and a tip at one end of the probe for receiving the wet object, the tip comprising at least one aperature, the aperature being in communication with the passage; and the passage having at least one relief hole to provide for gas flow into the passage when the wet object is present over the aperature on said tip. A cleaning apparatus and method for a transfer apparatus for a wet object, comprising means for directing at least one source of fluid at said transfer apparatus at a location on said transfer apparatus above the expected location of a wet object on the transfer apparatus. A transfer apparatus for a wet object comprising a probe, means for receiving on said probe said wet object from a first station, and means for aligning said transfer apparatus with said first station to prevent damage to said wet object.

Abstract: Disclosed herein are novel devices and methods for cleaning filters, preferably pool filters. The subject device and methods provide the advantages of cleaning the entire circumference of a cylindrical pool filter while minimizing the spray of water and debris onto the operator.

Abstract: A cleansing apparatus comprising: a table 3 for supporting a semiconductor substrate 30 horizontally; a high frequency solution injector 20 capable of injecting a solution to the upper surface 30a and the side surface 30c of the semiconductor substrate 30 supported by the table 3 with the application of vibration at high frequency; a cover 2 capable of tightly enclosing the semiconductor substrate 30 supported by the table 3; and pressure reducing means 18 for reducing the pressure in a space, in which the semiconductor substrate 30 is enclosed with the cover 2. The semiconductor substrate can be cleansed efficiently at a low cost and kept in clean state after the cleansing until it is dried.

Abstract: A method and apparatus for removing a first liquid from a surface of a substrate is provided. A second liquid is supplied to at least part of a surface of a substrate having a rotary movement. The rotary movement has a center of rotation and an edge of rotation. The second liquid is directed from the center of rotation to the edge of rotation using a nozzle. A dry zone is created on the substrate as the position of the spray moves from the center of rotation to the edge of rotation. As a result, the first liquid and the second liquid are removed from the surface of the substrate.

Abstract: A workpiece processing system for processing semiconductor wafers and other flat media includes a standalone processing unit having two or more modules vertically stacked on top of one another. A first module includes an ozone generator, a DI water supply, a purge gas/drying gas supply, and optionally includes an ammonium hydroxide generator. A second module is preferably stacked on top of the first module and includes a processing chamber in communication with the devices in the first module. The processing chamber preferably includes a rotor for holding and rotating workpieces, one or more spray manifolds, an ozone destructor, an anti-static generator, and/or any other suitable workpiece-processing devices. The rotor is preferably designed to hold two workpiece-carrying cassettes each capable of holding up to 25 workpieces. A third module is preferably stacked on top of the second module and includes the system electronics and controls.

Abstract: The invention concerns an apparatus for cleaning the edge of a wafer that may be relatively simply constructed with low cost, and prevent the wafer from being re-contaminated by the edge cleaning, thus resulting in increase of the yield rate of wafers. The apparatus includes a cleaning agent ejection nozzle body provided on a side part of a chuck for ejecting a particulate cleaning agent (CO2 particles) towards the side and the edge portions of the wafer held and rotated by the chuck, and a nozzle body carriage for moving the nozzle body between rest and cleaning positions.

Abstract: The present ball/roller bearing cleaning method is a method which, using cleaning liquid 24, cleans a bearing to be cleaned 1 composed of an inner ring 1b, an outer ring 1a, a rolling bodies 1c and a retainer. In the cleaning method, the cleaning liquid 24 is made to flow through the bearing to be cleaned 1 from the axial direction of the present bearing 1 into spaces in which the raceway surfaces of the inner and outer rings 1b and 1a of the bearing to be cleaned 1 surround the rolling bodies 1c and retainer. For example, a cylindrical-shaped rotary die 2 having spiral grooves 2a is interposed into a cleaning liquid supply passage, and the cleaning liquid 4 is supplied to thereby rotate the cylindrical-shaped rotary die 2, whereby the cleaning liquid having high pressure can be supplied to the bearing to be cleaned 1 from the cylindrical-shaped rotary die 2.

Abstract: A substrate treatment apparatus for removing an unnecessary substance from a surface of a substrate. The apparatus is provided with: an oxidation liquid supply mechanism for supplying an oxidation liquid having an oxidative effect to the substrate surface; a physical cleaning mechanism for physically cleaning the substrate surface; and an etching liquid supply mechanism for supplying an etching liquid having an etching effect to the substrate surface. It is preferred to physically clean the substrate surface while supplying the oxidation liquid to the substrate surface.

Abstract: A method for processing a semiconductor wafer or similar article includes the step of spinning the wafer and applying a fluid to a first side of the wafer, while it is spinning. The fluid flows radially outwardly in all directions, over the first side of the wafer, via centrifugal force. As the fluid flows off of the circumferential edge of the wafer, it is contained in an annular reservoir, so that the fluid also flows onto an outer annular area of the second side of the wafer. An opening allows fluid to flow out of the reservoir. The opening defines the location of a parting line beyond which the fluid will not travel on the second side of the wafer. An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location.

Abstract: A system and method for cleaning carriers used for handling semiconductor wafers including a box cleaner having a rotor within an enclosure. Box holder assemblies on the rotor include upper and lower hooks for securing boxes to the rotor. A box door holder assembly is also provided on the rotor. The box door holder assembly preferably has a plurality of box door holding positions. Each box door holding position advantageously has a door guide and door hooks for holding a door. The box door holder assembly allows both the boxes and their doors to be cleaned with the centrifugal cleaner, avoiding the need for separate cleaning of the doors. In one configuration, the rotor is provided with an even number of box holder assemblies symmetrically spaced about the rotor and an even number of door holder assemblies symmetrically spaced about the rotor.

Abstract: An apparatus for cleaning a wafer includes a plurality of holders for contacting and securing peripheral portions of a wafer, and for rotating the wafer, a first plate disposed to face a first surface of the wafer, the first plate having a plurality of first nozzles for spraying a first cleaning solution onto the first surface of the wafer, and a second plate disposed to face a second surface of the wafer that is opposite to the first surface, the second plate having a plurality of second nozzles for spraying a second cleaning solution onto the second surface of the wafer. In operation, the first and second plates and the wafer are rotated in opposite directions. The opposite rotation causes the cleaning solutions to flow abruptly thereby increasing a frictional force between the surfaces on the wafer and the cleaning solutions to improve the efficiency of the cleaning process.

Abstract: The present invention provides a cleaning equipment provided with a cleaning solution tank, a cleaning solution supply route for supplying the cleaning solution stored in the cleaning solution tank to a cleaning bath, a cleaning solution return route for returning the cleaning solution that has been supplied to the cleaning bath to the cleaning solution tank, a gas supply route for supplying a purge gas into the cleaning solution tank, and a gas discharge route for discharging the purge gas from the cleaning solution tank. Moreover, a cleaning solution discharge opening of the cleaning solution return route is immersed in the cleaning solution stored in the cleaning solution tank.

Abstract: A side edge of a wafer is retained by a plurality of chuck pins. A heating-and-cooling section is arranged such that a clearance is defined between a surface of the heating-and-cooling section and a surface of the wafer. The heating-and-cooling section is for heating or cooling the surface thereof. The clearance is filled with liquid by means of a liquid filling section. The surface of the wafer is heated or cooled by way of the thus-filled liquid.

Abstract: An apparatus for treating a wafer preferably includes a rotating chuck for rotating the wafer and a treating fluid supplying part for supplying the wafer with one or more treating fluids. The treating fluid(s) can be used to clean and/or dry the wafer. The treating fluid supplying part preferably includes a receiving portion for receiving a treating fluid, and a slit communicating with the receiving portion for applying the treating fluid to a surface of the wafer. An ultrasonic oscillating part can be installed in the receiving portion and can apply ultrasonic oscillation to the treating fluid. The treating fluid for applying the ultrasonic oscillation is preferably provided uniformly across the treated surface of the wafer. The effectiveness of the cleaning process can thereby be improved, and damage to patterns formed on the wafer can be reduced.

Abstract: This simple non-electric produce washer is a devise designed to dislodge and gently wash away unhealthy and often time's life threatening impurities from any number of fruits and vegetables without causing bruising or damage. The unit is designed for both residential and/or commercial use. Its unique design employs a non-electrical, three part system, which consists of a reservoir (4) for holding a continuous stream of water, a sieved basket (16), and a waste outlet.

Abstract: An apparatus and a method for cleaning a torch for a vertical furnace used in semiconductor processing are disclosed. The apparatus is constructed by two main components of a basket-shaped fixture body and a cleaning bath. The fixture body is formed of cylindrical shape with a top ring, a bottom ring and three support rods connecting the two rings together. The top ring is provided with an outwardly extending flange portion for engaging an opening in a cleaning bath for supporting and suspending the fixture body in the bath. The bottom ring is equipped with a pair of symmetrically positioned, inwardly extending arcuate-shaped flange portions adapted for supporting an edge of a bottom surface of the furnace torch in the cleaning bath.

Abstract: A plurality of substrate holding pins 13 extend upright from a holding stage 12, and a substrate W is mechanically held in a circumferential direction with a back surface Sb of the substrate W faced up. Between the substrate W and the holding stage 12, a drip-proof plate 14 whose shape is approximately the same as that of the substrate W is disposed with a distance from the substrate W in such a manner that the drip-proof plate 14 covers a front surface (pattern-bearing surface) Sf of the substrate W from below. The drip-proof plate 14 disposed so as to cover the front surface Sf of the substrate W blocks the mist from splashing upon the front surface Sf of the substrate.

Abstract: This invention relates to a cleaning device for rotationally symmetrical bodies, in particular for vehicle wheel rims with or without tires. Said device is designed for mechanical cleaning, using a moving cleaning fluid in a cleaning bath (20). The cleaning bath (20) has at least one vibrator (34 to 37) which places a cleaning fluid in a state of turbulence in the ultrasound region. A heater (38) is also provided in order to heat the cleaning fluid and is located in the cleaning unit. A holder (30) is arranged in the cleaning unit in order to accommodate a receiving device which can e swiveled inwards or swiveled outwards and which is designed to hold the rotationally symmetrical body that is to e cleaned.

Abstract: Provided is a wafer rotary holding apparatus by which a reduced pressure is created on an upper surface of a rotary disk by a simple and easy-to-make mechanism with no need of any of a vacuum source apparatus, a compressed air supply apparatus, a compressed gas supply apparatus and other apparatuses in use; a wafer can be held while rotating with no contact to a rear surface thereof; a degree of pressure reduction can be adjusted with ease and even a thin wafer (of 0.1 mm or less in thickness) can be held while rotating with no deformation; and the wafer with a bowing can be held while rotating with no correction of the bowing. A wafer rotary holding apparatus includes: a rotary disk on which a fluid flow path is formed; a through hole formed in a central section of the rotary disk; and a plurality of wafer rests provided on an upper surface of the rotary disk.

Abstract: A to-be-cleaned substrate is cleaned by use of an acid liquid agent in a cleaning cup, the remaining acid liquid agent is washed out by use of pure water, then an alkaline liquid agent is emitted to the surface of the to-be-cleaned substrate in the same cleaning cup to remove the acid liquid agent remaining on the to-be-cleaned substrate. A neutralization reaction between the acid and alkali is caused by emitting the alkaline liquid agent to the surface of the to-be-cleaned substrate so as to efficiently remove the acid liquid agent remaining on the surface of the to-be-cleaned substrate.

Abstract: A process chamber assembly for use with a substrate includes a vessel and a substrate holder. The vessel defines a chamber. The substrate holder has a rotational axis and includes front and rear opposed surfaces. The front surface is adapted to support the substrate. At least one impeller vane extends rearwardly from the rear surface and radially with respect to the rotational axis. The impeller vane is operative to generate a pressure differential tending to hold the substrate to the substrate holder when the substrate holder is rotated about the rotational axis. Preferably, the process chamber assembly includes a plurality of the impeller vanes extending rearwardly from the rear surface and radially with respect to the rotational axis.

Abstract: A wet cleaning device for chemically cleaning a plurality of wafers. The wet cleaning device includes a plurality of first chemical cleaning tanks for conducting a first cleaning procedure, a plurality of second chemical cleaning tanks for conducting a second cleaning procedure, a transferring tank including a first measuring device for measuring the wafers after the first cleaning procedure, a measuring tank including a second measuring device for measuring the wafers after the second cleaning procedure, a first transporting device, and a second transporting device.

Abstract: A workpiece holder for processing a workpiece in a chamber of a liquified fluid. In one embodiment, the workpiece holder includes a cylindrically shaped rotator having an exterior wall and at least one fluid guide on the exterior wall. The rotator is adapted to rotate and provide fluid flow across a first end of the rotator, and is adapted to provide fluid flow and mixing perpendicular to a surface of the first end of the rotator. A fixture is coupled to the first end of the rotator for securing the workpiece to the first end of the rotator.

Abstract: A liquid waste disposal and canister flushing system for a medical canister including a press-fit canister lid, features a cabinet with an opening and a sink with a drain positioned therein. A mounting bracket is affixed to the cabinet and includes a shaft connected to the canister bracket for rotating the canister and a shaft connected to the lid removal bracket for removing the canister lid from the canister. The canister is secured within the canister bracket and is rotated from an initial position to a drainage position. The canister lid is positioned on the removal bracket and is rotated from an initial position to a removal position. Once the canister is rotated into the drainage position, the pressurized and diluted cleaning solution source is activated to flush the contents out of the canister and into the sink and drain. After the canister is sanitized it may be removed from the system and reused.

Abstract: A substrate processing apparatus is provided with an IPA spouting nozzle in opposition to an objective surface of a substrate supported by a support part. A nozzle swinging mechanism swingably supports the IPA spouting nozzle through an arm. An IPA supply pipe and a nitrogen gas supply pipe are connected to the IPA spouting nozzle. IPA and nitrogen gas supplied from these supply pipes are mixed with each other in the IPA spouting nozzle for forming IPA droplets. The formed IPA droplets are spouted toward the objective surface of the substrate. Consequently, the objective surface of the substrate can be cleaned with IPA. Thus provided is the substrate processing apparatus cleaning the substrate hard to clean with deionized water.